M950x0-W M950x0-R M950x0-DF

4 Kbit, 2 Kbit and 1 Kbit serial SPI bus EEPROM

with high-speed clock
Datasheet - production data

Features
• Compatible with SPI bus serial interface
(Positive clock SPI modes)
• Single supply voltage:
– 2.5 V to 5.5 V for M950x0-W
– 1.8 V to 5.5 V for M950x0-R
– 1.7 V to 5.5 V for M95040-DF
SO8 (MN)
150 mil width • High-speed 20 MHz clock rate, 5 ms write time
• Memory array:
– 1/2/4 Kbit (128/256/512 bytes) of EEPROM
– Page size: 16 bytes
– Write protection by block: 1/4, 1/2 or whole
memory
– Additional Write lockable Page
TSSOP8 (DW) (Identification page)
169 mil width • Enhanced ESD protection
• More than 4 million write cycles
• More than 200-year data retention
• Packages RoHS-compliant and Halogen-free
(ECOPACK®)

UFDFPN8 (MC) Table 1. Device summary

2 x 3 mm Reference Part number

M95040-W
M950x0-W M95020-W
M95010-W
M95040-R
M950x0-R M95020-R
M95010-R
M950x0-DF M95040-DF

August 2014 DocID6512 Rev 13 1/46

This is information on a product in full production. [Link]
Contents M950x0-W M950x0-R M950x0-DF

Contents

1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2 Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Serial Data Output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5 Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.6 Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7 VSS ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.8 Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.8.1 Operating supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.8.2 Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.8.3 Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8.4 Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3 Connecting to the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1 SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4 Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1 Hold condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.2 Status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.3 Data protection and protocol control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5 Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6 Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.1 Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.2 Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.3 Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.3.1 WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.3.2 WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.3.3 BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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6.4 Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

6.5 Read from Memory Array (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.6 Write to Memory Array (WRITE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.7 Read Identification Page (available only in M95040-D device) . . . . . . . . 25
6.8 Write Identification Page (available only in M95040-D device) . . . . . . . . 26
6.9 Read Lock Status (available only in M95040-D device) . . . . . . . . . . . . . . 27
6.10 Lock Identification Page (available only in M95040-D device) . . . . . . . . . 28

7 Power-up and delivery states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

7.1 Power-up state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.2 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

8 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

9 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

10 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

11 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

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List of tables M950x0-W M950x0-R M950x0-DF

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3. Write-protected block size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 4. Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 5. Significant bits within the address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 6. Status register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 7. Address range bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 8. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 9. Operating conditions (M950x0-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 10. Operating conditions (M950x0-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 11. Operating conditions (M95040-DF, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 12. AC test measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 13. Cycling performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 14. Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 15. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 16. DC characteristics (M950x0-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 17. DC characteristics (M950x0-R or M95040-DF, device grade 6) . . . . . . . . . . . . . . . . . . . . . 34
Table 18. AC characteristics (M950x0-W, device grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 19. AC characteristics (M950x0-R or M95040-DF, device grade 6) . . . . . . . . . . . . . . . . . . . . . 36
Table 20. AC characteristics (M950x0-W, device grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 21. AC characteristics (M950x0-R, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 22. SO8N 8-lead plastic small outline, 150 mils body width, package
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 23. TSSOP8 8-lead thin shrink small outline, package mechanical data . . . . . . . . . . . . . . . . . 41
Table 24. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 25. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 26. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

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List of figures

Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 2. 8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Bus master and memory devices on the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 4. SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5. Hold condition activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 7. Write Enable (WREN) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 8. Write Disable (WRDI) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 9. Read Status Register (RDSR) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 10. Write Status Register (WRSR) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 11. Read from Memory Array (READ) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 12. Byte Write (WRITE) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 13. Page Write (WRITE) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 14. Read Identification Page sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 15. Write Identification Page sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 16. Read Lock Status sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 17. Lock ID sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 18. AC test measurement I/O waveform(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 19. Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 20. Hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 21. Serial output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 22. SO8N 8-lead plastic small outline 150 mils body width, package outline . . . . . . . . . . . . . . 40
Figure 23. TSSOP8 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 24. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

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Description M950x0-W M950x0-R M950x0-DF

1 Description

The M95010/ M95020/M95040 devices (M950x0) are electrically erasable programmable

memories (EEPROMs) organized as 128/256/512 x 8 bits respectively, accessed through
the SPI bus.
The M950x0-W can operate with a supply voltage from 2.5 V to 5.5 V, the M950x0-R can
operate with a supply voltage from 1.8 V to 5.5 V, and the M950x0-DF can operate with a
supply voltage from 1.7 V to 5.5 V, over an ambient temperature range of -40 °C / +85 °C.
The M950x0-DF offers an additional page, named the Identification Page (16 bytes). The
Identification Page can be used to store sensitive application parameters which can be
(later) permanently locked in Read-only mode.

Figure 1. Logic diagram

6##

$ 1

3 -XXX

(/,$

633
!)#

Figure 2. 8-pin package connections

-XXX

3   6##
1   (/,$
7   #
633   $
!)$

1. See Section 10: Package mechanical data for package dimensions, and how to identify pin-1.

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Table 2. Signal names

Signal name Function

C Serial Clock
D Serial Data input
Q Serial Data output
S Chip Select
W Write Protect
HOLD Hold
VCC Supply voltage
VSS Ground

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Signal description M950x0-W M950x0-R M950x0-DF

2 Signal description

During all operations, VCC must be held stable and within the specified valid range:
VCC(min) to VCC(max).
All of the input and output signals can be held high or low (according to voltages of VIH, VOH,
VIL or VOL, as specified in Table 16: DC characteristics (M950x0-W, device grade 6) and
Table 17: DC characteristics (M950x0-R or M95040-DF, device grade 6). These signals are
described next.

2.1 Serial Data Output (Q)

This output signal transfers data serially out of the device. Data is shifted out on the falling
edge of Serial Clock (C).

2.2 Serial Data Input (D)

This input signal transfers data serially into the device. It receives instructions, addresses,
and the data to be written. Values are latched on the rising edge of Serial Clock (C).

2.3 Serial Clock (C)

This input signal provides the timing of the serial interface. Instructions, addresses, or data
present at Serial Data Input (D) are latched on the rising edge of Serial Clock (C). Data on
Serial Data Output (Q) changes after the falling edge of Serial Clock (C).

2.4 Chip Select (S)

When this input signal is high, the device is deselected and Serial Data Output (Q) is at high
impedance. Unless an internal Write cycle is in progress, the device will be in the Standby
Power mode. Driving Chip Select (S) low selects the device, placing it in the Active Power
mode.
After Power-up, a falling edge on Chip Select (S) is required prior to the start of any
instruction.

2.5 Hold (HOLD)

The Hold (HOLD) signal is used to pause any serial communications with the device without
deselecting the device.
During the Hold condition, the Serial Data Output (Q) is high impedance, and Serial Data
Input (D) and Serial Clock (C) are Don’t Care.
To start the Hold condition, the device must be selected, with Chip Select (S) driven low.

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2.6 Write Protect (W)

This input signal controls whether the memory is write protected. When Write Protect (W) is
held low, writes to the memory are disabled, but other operations remain enabled.
Write Protect (W) must either be driven high or low, but must not be left floating.

2.7 VSS ground

VSS is the reference for the VCC supply voltage.

2.8 Supply voltage (VCC)

2.8.1 Operating supply voltage (VCC)

Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage
within the specified [VCC(min), VCC(max)] range must be applied (see Table 9: Operating
conditions (M950x0-W), Table 10: Operating conditions (M950x0-R) and Table 11:
Operating conditions (M95040-DF, device grade 6)). This voltage must remain stable and
valid until the end of the transmission of the instruction and, for a Write instruction, until the
completion of the internal write cycle (tW).
In order to secure a stable DC supply voltage, it is recommended to decouple the VCC line
with a suitable capacitor (usually of the order of 10 nF to 100 nF) close to the VCC/VSS
package pins.

2.8.2 Device reset

In order to prevent inadvertent write operations during power-up, a power-on-reset (POR)
circuit is included. At power-up, the device does not respond to any instruction until VCC
reaches the internal reset threshold voltage (this threshold is defined in Table 9: Operating
conditions (M950x0-W), Table 10: Operating conditions (M950x0-R) and Table 11:
Operating conditions (M95040-DF, device grade 6) as VRES).
When VCC passes over the POR threshold, the device is reset and is in the following state:
• Standby Power mode
• Deselected (note that, to be executed, an instruction must be preceded by a falling
edge on Chip Select (S))
• Status register value:
– Write Enable Latch (WEL) is reset to 0
– Write In Progress (WIP) is reset to 0
– SRWD, BP1 and BP0 bits remain unchanged (non-volatile bits)
When the device is in the above state, it must not be accessed until VCC reaches a valid and
stable VCC voltage within the specified [VCC(min), VCC(max)] range defined in Table 9:
Operating conditions (M950x0-W), Table 10: Operating conditions (M950x0-R) and
Table 11: Operating conditions (M95040-DF, device grade 6).

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2.8.3 Power-up conditions

When the power supply is turned on, VCC rises continuously from VSS to VCC. During this
time, the Chip Select (S) line is not allowed to float but should follow the VCC voltage. It is
therefore recommended to connect the S line to VCC via a suitable pull-up resistor (see
Figure 3: Bus master and memory devices on the SPI bus).
In addition, the Chip Select (S) input offers a built-in safety feature, as the S input is edge
sensitive as well as level sensitive: after power-up, the device does not become selected
until a falling edge has first been detected on Chip Select (S). This ensures that Chip Select
(S) must have been high, prior to going low to start the first operation.
The VCC voltage has to rise continuously from 0 V up to the minimum VCC operating voltage
defined in Table 9: Operating conditions (M950x0-W), Table 10: Operating conditions
(M950x0-R) and Table 11: Operating conditions (M95040-DF, device grade 6) and the rise
time must not vary faster than 1 V/µs.

2.8.4 Power-down
During power-down (continuous decrease in the VCC supply voltage below the minimum
VCC operating voltage defined in Table 9: Operating conditions (M950x0-W), Table 10:
Operating conditions (M950x0-R) and Table 11: Operating conditions (M95040-DF, device
grade 6)), the device must be:
• Deselected (Chip Select S should be allowed to follow the voltage applied on VCC)
• In Standby Power mode (there should not be any internal write cycle in progress).

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M950x0-W M950x0-R M950x0-DF Connecting to the SPI bus

3 Connecting to the SPI bus

The device is fully compatible with the SPI protocol.

All instructions, addresses and input data bytes are shifted in to the device, most significant
bit first. The Serial Data Input (D) is sampled on the first rising edge of the Serial Clock (C)
after Chip Select (S) goes low.
All output data bytes are shifted out of the device, most significant bit first. The Serial Data
Output (Q) is latched on the first falling edge of the Serial Clock (C) after the instruction
(such as the Read from Memory Array and Read Status Register instructions) have been
clocked into the device.
Figure 3: Bus master and memory devices on the SPI bus shows an example of three
memory devices connected to an MCU, on an SPI bus. Only one memory device is selected
at a time, so only one memory device drives the Serial Data output (Q) line at a time, the
other memory devices are high impedance.
The pull-up resistor R (represented in Figure 3: Bus master and memory devices on the SPI
bus) ensures that a device is not selected if the bus master leaves the S line in the high
impedance state.
In applications where the bus master might enter a state where all SPI bus inputs/outputs
would be in high impedance at the same time (for example, if the bus master is reset during
the transmission of an Instruction), the clock line (C) must be connected to an external pull-
down resistor so that, if all inputs/outputs become high impedance, the C line is pulled low
(while the S line is pulled high): this ensures that S and C do not become high at the same
time, and so, that the tSHCH requirement is met. The typical value of R is 100 kΩ..

Figure 3. Bus master and memory devices on the SPI bus

VSS

VCC

SDO
SPI Interface with
SDI
(CPOL, CPHA) =
(0, 0) or (1, 1) SCK

C Q D VCC C Q D VCC C Q D VCC

Bus master VSS VSS VSS

R SPI mmory R SPI memory R SPI memory

device device device
CS3 CS2 CS1

S W HOLD S W HOLD S W HOLD

AI12304b

1. The Write Protect (W) and Hold (HOLD) signals should be driven, high or low as appropriate.

DocID6512 Rev 13 11/46

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Connecting to the SPI bus M950x0-W M950x0-R M950x0-DF

3.1 SPI modes

The device can be driven by a microcontroller with its SPI peripheral running in either of the
following modes:
• CPOL=0, CPHA=0
• CPOL=1, CPHA=1
For these two modes, input data is latched in on the rising edge of Serial Clock (C), and
output data is available from the falling edge of Serial Clock (C).
The difference between the two modes, as shown in Figure 4: SPI modes supported, is the
clock polarity when the bus master is in Stand-by mode and not transferring data:
• C remains at 0 for (CPOL=0, CPHA=0)
• C remains at 1 for (CPOL=1, CPHA=1)

Figure 4. SPI modes supported

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M950x0-W M950x0-R M950x0-DF Operating features

4 Operating features

4.1 Hold condition

The Hold (HOLD) signal is used to pause any serial communications with the device without
resetting the clocking sequence.
During the Hold condition, the Serial Data Output (Q) is high impedance, and Serial Data
Input (D) and Serial Clock (C) are Don’t Care.
To enter the Hold condition, the device must be selected, with Chip Select (S) low.
Normally, the device is kept selected, for the whole duration of the Hold condition.
Deselecting the device while it is in the Hold condition has the effect of resetting the state of
the device, and this mechanism can be used if it is required to reset any processes that had
been in progress.
The Hold condition starts when the Hold (HOLD) signal is driven low at the same time as
Serial Clock (C) already being low (as shown in Figure 5: Hold condition activation).
The Hold condition ends when the Hold (HOLD) signal is driven high at the same time as
Serial Clock (C) already being low.
Figure 5: Hold condition activation also shows what happens if the rising and falling edges
are not timed to coincide with Serial Clock (C) being low.

Figure 5. Hold condition activation

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4.2 Status register

Figure 6 shows the position of the Status register in the control logic of the device. This
register contains a number of control bits and status bits, as shown in Table 6: Status
register format and as detailed in Section 6.3: Read Status Register (RDSR).

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Operating features M950x0-W M950x0-R M950x0-DF

4.3 Data protection and protocol control

To help protect the device from data corruption in noisy or poorly controlled environments, a
number of safety features have been built in to the device. The main security measures can
be summarized as follows:
• WEL bit is reset at power-up.
• Chip Select (S) must rise after the eighth clock count (or multiple thereof) in order to
start a non-volatile Write cycle (in the memory array or in the Status register).
• Accesses to the memory array are ignored during the non-volatile programming cycle,
and the programming cycle continues unaffected.
• Invalid Chip Select (S) and Hold (HOLD) transitions are ignored.
For any instruction to be accepted and executed, Chip Select (S) must be driven high after
the rising edge of Serial Clock (C) that latches the last bit of the instruction, and before the
next rising edge of Serial Clock (C).
For this, “the last bit of the instruction” can be the eighth bit of the instruction code, or the
eighth bit of a data byte, depending on the instruction (except in the case of RDSR and
READ instructions). Moreover, the “next rising edge of CLOCK” might (or might not) be the
next bus transaction for some other device on the bus.
When a Write cycle is in progress, the device protects it against external interruption by
ignoring any subsequent READ, WRITE or WRSR instruction until the present cycle is
complete.

Table 3. Write-protected block size

Status register bits Protected array addresses
Protected block
BP1 BP0 M95040 M95020 M95010

0 0 none none none none

0 1 Upper quarter 180h - 1FFh C0h - FFh 60h - 7Fh
1 0 Upper half 100h - 1FFh 80h - FFh 40h - 7Fh
1 1 Whole memory 000h - 1FFh 00h - FFh 00h - 7Fh

14/46 DocID6512 Rev 13

M950x0-W M950x0-R M950x0-DF Memory organization

5 Memory organization

The memory is organized as shown in Figure 6.

Figure 6. Block diagram

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DocID6512 Rev 13 15/46

45
Instructions M950x0-W M950x0-R M950x0-DF

6 Instructions

Each command is composed of bytes (MSBit transmitted first), initiated with the instruction
byte, as summarized in Table 4.
If an invalid instruction is sent (one not contained in Table 4), the device automatically enters
a Wait state until deselected.

Table 4. Instruction set

Instruction
Instruction Description
format

WREN Write Enable 0000 X110(1)

WRDI Write Disable 0000 X100(1)
RDSR Read Status Register 0000 X101(1)
WRSR Write Status Register 0000 X001(1)
READ Read from Memory Array 0000 A8011(2)
WRITE Write to Memory Array 0000 A8010(2)
RDID(3) Read Identification Page 1000 0011
(3)
WRID Write Identification Page 1000 0010
RDLS(3) Reads the Identification Page lock status. 1000 0011
LID(3) Locks the Identification page in read-only mode. 1000 0010
1. X = Don’t Care.
2. For M95040, A8 = 1 for the upper half of the memory array and 0 for the lower half, while for M95010 and
M95020, A8 is Don’t Care.
3. Available only for the M95040-DF device.

Table 5. Significant bits within the address byte(1)(2)

Address byte
Bit b3 of the
Instructions
instruction byte
b7 b6 b5 b4 b3 b2 b1 b0

READ or WRITE A8/x(3) A7 A6 A5 A4 A3 A2 A1 A0

RDID or WRID 0 0 0 0 0 A3 A2 A1 A0
RDLS or LID 0 1 0 0 0 0 0 0 0
1. A: Significant address bit.
2. x: bit is Don’t Care.
3. For M95040, A8 = 1 for the upper half of the memory array and 0 for the lower half, while for M95010 and
M95020, A8 is Don’t Care.

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M950x0-W M950x0-R M950x0-DF Instructions

6.1 Write Enable (WREN)

The Write Enable Latch (WEL) bit must be set prior to each WRITE and WRSR instruction.
The only way to do this is to send a Write Enable instruction to the device.
As shown in Figure 7: Write Enable (WREN) sequence, to send this instruction to the
device, Chip Select (S) is driven low, and the bits of the instruction byte are shifted in, on
Serial Data Input (D). The device then enters a wait state. It waits for a the device to be
deselected, by Chip Select (S) being driven high.

Figure 7. Write Enable (WREN) sequence

       

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DocID6512 Rev 13 17/46

45
Instructions M950x0-W M950x0-R M950x0-DF

6.2 Write Disable (WRDI)

One way of resetting the Write Enable Latch (WEL) bit is to send a Write Disable instruction
to the device. As shown in Figure 8: Write Disable (WRDI) sequence, to send this instruction
to the device, Chip Select (S) is driven low, and the bits of the instruction byte are shifted in,
on Serial Data Input (D). The device then enters a wait state. It waits for a the device to be
deselected, by Chip Select (S) being driven high.
The Write Enable Latch (WEL) bit is reset by any of the following events:
• Power-up
• WRDI instruction execution
• WRSR instruction completion
• WRITE instruction completion
• Write Protect (W) line being held low.

Figure 8. Write Disable (WRDI) sequence

       

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18/46 DocID6512 Rev 13

M950x0-W M950x0-R M950x0-DF Instructions

6.3 Read Status Register (RDSR)

The Read Status Register instruction is used to read the Status Register.
As shown in Figure 9, to send this instruction to the device, Chip Select (S) is first driven
low. The bits of the instruction byte are then shifted in, on Serial Data Input (D). The current
state of the bits in the Status register is shifted out, on Serial Data Out (Q). The Read Cycle
is terminated by driving Chip Select (S) high.
The Status Register is always readable, even if a Write or Write Status Register cycle is in
progress. During a Write Status Register cycle, the values of the non-volatile bits (BP0,
BP1) become available when a new RDSR instruction is executed, after completion of the
Write cycle. On the other hand, the two read-only bits (Write Enable Latch (WEL), Write In
Progress (WIP)) are dynamically updated during the ongoing Write cycle.
It is possible to read the Status Register contents continuously, as described in Figure 9.
Bits b7, b6, b5 and b4 are always read as 1. The status and control bits of the Status register
are as follows:

Table 6. Status register format

b7 b0
1 1 1 1 BP1 BP0 WEL WIP

Block Protect bits

Write Enable Latch bit
Write In Progress bit

6.3.1 WIP bit

The Write In Progress (WIP) bit indicates whether the memory is busy with a Write or Write
Status register cycle. When set to 1, such a cycle is in progress, when reset to 0 no such
cycle is in progress.

6.3.2 WEL bit

The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
When set to 1 the internal Write Enable Latch is set, when set to 0 the internal Write Enable
Latch is reset and no Write or Write Status Register instruction is accepted.

DocID6512 Rev 13 19/46

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Instructions M950x0-W M950x0-R M950x0-DF

6.3.3 BP1, BP0 bits

The Block Protect (BP1, BP0) bits are non-volatile. They define the size of the area to be
software protected against Write instructions. These bits are written with the Write Status
Register (WRSR) instruction. When one or both of the Block Protect (BP1, BP0) bits is set to
1, the relevant memory area (as defined in Table 3: Write-protected block size) becomes
protected against Write (WRITE) instructions. The Block Protect (BP1, BP0) bits can be
written provided that the Hardware Protected mode has not been set.

Figure 9. Read Status Register (RDSR) sequence

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Instruction

Status Register Out Status Register Out

High Impedance
Q 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7

MSB MSB

AI01444D

20/46 DocID6512 Rev 13

M950x0-W M950x0-R M950x0-DF Instructions

6.4 Write Status Register (WRSR)

A Write Status Register (WRSR) instruction allows new values to be written to the Status
register. Before it can be accepted, a Write Enable (WREN) instruction must previously have
been executed.
The WRSR instruction is entered by driving Chip Select (S) low, sending the instruction
code followed by the data byte on Serial Data input (D), and driving the Chip Select (S)
signal high. Chip Select (S) must be driven high after the rising edge of Serial Clock (C) that
latches in the eighth bit of the data byte, and before the next rising edge of Serial Clock (C).
Otherwise, the WRSR instruction is not executed.
Driving the Chip Select (S) signal high at a byte boundary of the input data triggers the self-
timed write cycle that takes tW to complete (as specified in Table 16: DC characteristics
(M950x0-W, device grade 6) to Table 19: AC characteristics (M950x0-R or M95040-DF,
device grade 6)). The instruction sequence is shown in Figure 10: Write Status Register
(WRSR) sequence.
While the Write Status Register cycle is in progress, the Status register may still be read to
check the value of the Write in progress (WIP) bit: the WIP bit is 1 during the self-timed write
cycle tW, and, 0 when the write cycle is complete. The WEL bit (Write enable latch) is also
reset at the end of the write cycle tW.
The WRSR instruction allows the user to change the values of the BP1, BP0 bits which
define the size of the area that is to be treated as read only, as defined in Table 3: Write-
protected block size. The contents of the BP1, BP0 bits are updated after the completion of
the WRSR instruction, including the tW write cycle.
The WRSR instruction has no effect on the b7, b6, b5, b4, b1 and b0 bits in the Status
register which are always read as 0.

Figure 10. Write Status Register (WRSR) sequence

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Instruction Status
Register In

D 7 6 5 4 3 2 1 0

High Impedance MSB

Q
AI01445B

The WRSR instruction is not accepted, and is not executed, under the following conditions:
• if the Write Enable Latch (WEL) bit has not been set to 1 (by executing a Write Enable
instruction just before)
• if a write cycle is already in progress
• if the device has not been deselected, by Chip Select (S) being driven high, after the
eighth bit, b0, of the data byte has been latched in
• if Write Protect (W) is low during the WRSR command (instruction, address and data)

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Instructions M950x0-W M950x0-R M950x0-DF

6.5 Read from Memory Array (READ)

As shown in Figure 11: Read from Memory Array (READ) sequence, to send this instruction
to the device, Chip Select (S) is first driven low. The bits of the instruction byte and address
byte are then shifted in, on Serial Data Input (D). For the M95040, the most significant
address bit, A8, is incorporated as bit b3 of the instruction byte, as shown in Table 4:
Instruction set. The address is loaded into an internal address register, and the byte of data
at that address is shifted out, on Serial Data Output (Q).
If Chip Select (S) continues to be driven low, an internal bit-pointer is automatically
incremented at each clock cycle, and the corresponding data bit is shifted out.
When the highest address is reached, the address counter rolls over to zero, allowing the
Read cycle to be continued indefinitely. The whole memory can, therefore, be read with a
single READ instruction.
The Read cycle is terminated by driving Chip Select (S) high. The rising edge of the Chip
Select (S) signal can occur at any time during the cycle.
The first byte addressed can be any byte within any page.
The instruction is not accepted, and is not executed, if a Write cycle is currently in progress.

Table 7. Address range bits

Device M95040 M95020 M95010

Address Bits A8-A0 A7-A0 A6-A0

Figure 11. Read from Memory Array (READ) sequence

                      

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1. Depending on the memory size, as shown in Table 7: Address range bits, the most significant address bits
are Don’t Care.

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M950x0-W M950x0-R M950x0-DF Instructions

6.6 Write to Memory Array (WRITE)

As shown in Figure 12: Byte Write (WRITE) sequence, to send this instruction to the device,
Chip Select (S) is first driven low. The bits of the instruction byte, address byte, and at least
one data byte are then shifted in, on Serial Data input (D). The instruction is terminated by
driving Chip Select (S) high at a byte boundary of the input data. The self-timed Write cycle,
triggered by the rising edge of Chip Select (S), continues for a period tW (as specified in
Table 16: DC characteristics (M950x0-W, device grade 6) to Table 19: AC characteristics
(M950x0-R or M95040-DF, device grade 6)). After this time, the Write in Progress (WIP) bit
is reset to 0.
In the case of Figure 12: Byte Write (WRITE) sequence, Chip Select (S) is driven high after
the eighth bit of the data byte has been latched in, indicating that the instruction is being
used to write a single byte. If, though, Chip Select (S) continues to be driven low, as shown
in Figure 13: Page Write (WRITE) sequence, the next byte of input data is shifted in, so that
more than a single byte, starting from the given address towards the end of the same page,
can be written in a single internal Write cycle. If Chip Select (S) still continues to be driven
low, the next byte of input data is shifted in, and used to overwrite the byte at the start of the
current page.
The instruction is not accepted, and is not executed, under the following conditions:
• if the Write Enable Latch (WEL) bit has not been set to 1 (by executing a Write Enable
instruction just before)
• if a Write cycle is already in progress
• if the device has not been deselected, by Chip Select (S) being driven high, at a byte
boundary (after the rising edge of Serial Clock (C) that latches the last data bit, and
before the next rising edge of Serial Clock (C) occurs anywhere on the bus)
• if Write Protect (W) is low or if the addressed page is in the area protected by the Block
Protect (BP1 and BP0) bits
Note: The self-timed write cycle tW is internally executed as a sequence of two consecutive
events: [Erase addressed byte(s)], followed by [Program addressed byte(s)]. An erased bit
is read as “0” and a programmed bit is read as “1”.

Figure 12. Byte Write (WRITE) sequence

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are Don’t Care.

DocID6512 Rev 13 23/46

45
Instructions M950x0-W M950x0-R M950x0-DF

Figure 13. Page Write (WRITE) sequence

                       

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24/46 DocID6512 Rev 13

M950x0-W M950x0-R M950x0-DF Instructions

6.7 Read Identification Page (available only in M95040-D device)

The Read Identification Page (RDID) instruction is used to read the Identification Page
(additional page of 16 bytes which can be written and later permanently locked in Read-only
mode).
The Chip Select (S) signal is first driven low, the bits of the instruction byte and address
bytes are then shifted in (MSB first) on Serial Data input (D). Address bit A7 must be 0 and
the other address bits are Don't Care except the lower address bits [A3:A0] (it might be
easier to define these bits as 0, as shown in Table 5). Data is then shifted/clocked out (MSB
first) on Serial Data output (Q).
The first byte addressed can be any byte within the identification page.
If Chip Select (S) continues to be driven low, the internal address register is automatically
incremented and the byte of data at the new address is shifted out.
Note that there is no roll over feature in the Identification Page. The address of bytes to read
must not exceed the page boundary.
The read cycle is terminated by driving Chip Select (S) high. The rising edge of the Chip
Select (S) signal can occur at any time when the data bits are shifted out.
The instruction is not accepted, and is not executed, if a Write cycle is currently in progress.

Figure 14. Read Identification Page sequence

                      

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DocID6512 Rev 13 25/46

45
Instructions M950x0-W M950x0-R M950x0-DF

6.8 Write Identification Page (available only in M95040-D device)

The Write Identification Page (WRID) instruction is used to write the Identification Page
(additional page of 16 bytes which can also be permanently locked in Read-only mode).
The Chip Select signal (S) is first driven low, and then the bits of the instruction byte,
address bytes, and at least one data byte are shifted in (MSB first) on Serial Data input (D).
Address bit A7 must be 0 and the other address bits are Don't Care except the lower
address bits [A3:A0] (it might be easier to define these bits as 0, as shown in Table 5).
The self-timed Write cycle starts from the rising edge of Chip Select (S), and continues for a
period tW (as specified in Chapter 9: DC and AC parameters).

Figure 15. Write Identification Page sequence

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The instruction is discarded, and is not executed if the Block Protect bits (BP1,BP0) = (1,1)
or one of the conditions defined in Section 4.3: Data protection and protocol control is not
satisfied.

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M950x0-W M950x0-R M950x0-DF Instructions

6.9 Read Lock Status (available only in M95040-D device)

The Read Lock Status (RDLS) instruction is used to read the lock status.
To send this instruction to the device, Chip Select (S) first has to be driven low. The bits of
the instruction byte and address bytes are then shifted in (MSB first) on Serial Data input
(D). Address bit A7 must be 1; all other address bits are Don't Care (it might be easier to
define these bits as 0, as shown in Table 5). The Lock bit is the LSB (Least Significant Bit) of
the byte read on Serial Data output (Q). It is at ‘1’ when the lock is active and at ‘0’ when the
lock is not active. If Chip Select (S) continues to be driven low, the same data byte is shifted
out.
The read cycle is terminated by driving Chip Select (S) high. The instruction sequence is
shown in Figure 16.
The Read Lock Status instruction is not accepted and not executed if a Write cycle is
currently in progress.

Figure 16. Read Lock Status sequence

                      

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Instructions M950x0-W M950x0-R M950x0-DF

6.10 Lock Identification Page (available only in M95040-D device)

The Lock Identification Page (LID) command is used to permanently lock the Identification
Page in Read-only mode.
The LID instruction is issued by driving Chip Select (S) low, sending (MSB first) the
instruction code, the address and a data byte on Serial Data input (D), and driving Chip
Select (S) high. In the address sent, A7 must be equal to 1. All other address bits are Don't
Care (it might be easier to define these bits as 0, as shown in Table 5). The data byte sent
must be equal to the binary value xxxx xx1x, where x = Don't Care. The LID instruction is
terminated by driving Chip Select (S) high at a data byte boundary, otherwise, the instruction
is not executed.

Figure 17. Lock ID sequence

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Driving Chip Select (S) high at a byte boundary of the input data triggers the self-timed Write
cycle which duration is tW (specified in Section 9: DC and AC parameters). The instruction
sequence is shown in Figure 17.
The instruction is discarded, and is not executed if the Block Protect bits (BP1,BP0) = (1,1)
or one of the conditions defined in Section 4.3: Data protection and protocol control is not
satisfied.

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M950x0-W M950x0-R M950x0-DF Power-up and delivery states

7 Power-up and delivery states

7.1 Power-up state

After Power-up, the device is in the following state:
• Low power Standby Power mode
• Deselected (after Power-up, a falling edge is required on Chip Select (S) before any
instructions can be started)
• Not in Hold Condition
• Write Enable Latch (WEL) is reset to 0
• Write In Progress (WIP) is reset to 0
The BP1 and BP0 bits of the Status register are unchanged from the previous power-down
(they are non-volatile bits).

7.2 Initial delivery state

The device is delivered with:
• the memory array set to all 1s (each byte = FFh)
• Status register: bit SRWD =0, BP1 =0 and BP0 =0
• M95040-D only: the identification page bytes values are Don’t Care.

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Maximum rating M950x0-W M950x0-R M950x0-DF

8 Maximum rating

Stressing the device outside the ratings listed in Table 8: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only, and operation of the
device at these, or any other conditions outside those indicated in the operating sections of
this specification, is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.

Table 8. Absolute maximum ratings

Symbol Parameter Min. Max. Unit

TAMR Ambient operating temperature –40 130 °C

TSTG Storage temperature –65 150 °C
TLEAD (1)
Lead temperature during soldering see note °C
VO Output voltage –0.50 VCC+0.6 V
VI Input voltage –0.50 VCC+1.0 V
IOL DC output current (Q = 0) - 5 mA
IIH DC output current (Q = 1) - 5 mA
VCC Supply voltage –0.50 6.5 V
VESD Electrostatic pulse (Human Body Model) voltage(2) - 4000 V
1. Compliant with JEDEC standard J-STD-020D (for small-body, Sn-Pb or Pb assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS
directive 2011/65/EU of July 2011).
2. Positive and negative pulses applied on pin pairs, according to the AEC-Q100-002 (compliant with JEDEC
Std JESD22-A114, C1=100pF, R1=1500 Ω, R2=500 Ω).

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M950x0-W M950x0-R M950x0-DF DC and AC parameters

9 DC and AC parameters

This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device.

Table 9. Operating conditions (M950x0-W)

Symbol Parameter Min. Max. Unit

VCC Supply voltage 2.5 5.5 V

TA Ambient operating temperature (device grade 6) –40 85 °C

Table 10. Operating conditions (M950x0-R)

Symbol Parameter Min. Max. Unit

VCC Supply voltage 1.8 5.5 V

TA Ambient operating temperature –40 85 °C

Table 11. Operating conditions (M95040-DF, device grade 6)

Symbol Parameter Min. Max. Unit

VCC Supply voltage 1.7 5.5 V

TA Ambient operating temperature –40 85 °C

Table 12. AC test measurement conditions

Symbol Parameter Min. Max. Unit

CL Load capacitance 30 pF
- Input rise and fall times - 50 ns
- Input pulse voltages 0.2VCC to 0.8VCC V
- Input and output timing reference voltages 0.3VCC to 0.7VCC V

Figure 18. AC test measurement I/O waveform(1)

,QSXW/HYHOV ,QSXWDQG2XWSXW7LPLQJ
5HIHUHQFH/HYHOV

9&&
9&&

9&&
9&&

DLG

1. Output Hi-Z is defined as the point where data out is no longer driven.

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DC and AC parameters M950x0-W M950x0-R M950x0-DF

Table 13. Cycling performance(1)

Symbol Parameter Test conditions Min. Max. Unit

TA ≤ 25 °C,
- 4,000,000
VCC(min) < VCC < VCC(max)
Ncycle Write cycle endurance Write cycle
TA = 85 °C,
- 1,200,000
VCC(min) < VCC < VCC(max)
1. Cycling performance for products identified by process letter K (previous products were specified with 1
million cycles at 25 °C).

Table 14. Memory cell data retention(1)

Parameter Test conditions Min. Unit

Data retention TA = 55 °C 200 Year

1. For products identified by process letter K (previous products were specified with a data retention of 40
years at 55°C). The data retention behavior is checked in production, while the 200-year limit is defined
from characterization and qualification results.

Table 15. Capacitance (1)

Symbol Parameter Test condition Min. Max. Unit

COUT Output capacitance (Q) VOUT = 0 V - 8 pF

Input capacitance (D) VIN = 0 V - 8 pF
CIN
Input capacitance (other pins) VIN = 0 V - 6 pF
1. Sampled only, not 100% tested, at TA=25 °C and a frequency of 5 MHz.

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Table 16. DC characteristics (M950x0-W, device grade 6)

Test conditions in addition to those
Symbol Parameter Min. Max. Unit
defined in Table 9

Input leakage
ILI VIN = VSS or VCC - ±2 µA
current
Output leakage
ILO S = VCC, VOUT = VSS or VCC - ±2 µA
current
VCC = 2.5 V, fC = 5 MHz,
- 2
C = 0.1 VCC/0.9 VCC, Q = open
Supply current VCC = 2.5 V, fC = 10 MHz,
ICC - 2 mA
(Read) C = 0.1 VCC/0.9 VCC, Q = open
VCC = 5.5 V, fC = 20 MHz,
- 5 (1)
C = 0.1 VCC/0.9 VCC, Q = open
Supply current
ICC0(2) During tW, S = VCC, 2.5 V < VCC < 5.5 V - 5 mA
(Write)
S = VCC, VCC = 5.5 V,
- 3(3)
Supply current VIN = VSS or VCC,
ICC1 µA
(Standby) S = VCC, VCC = 2.5 V,
- 2 (4)
VIN = VSS or VCC,
VIL Input low voltage - –0.45 0.3 VCC V
VIH Input high voltage - 0.7 VCC VCC+1 V
VOL Output low voltage IOL = 1.5 mA, VCC = 2.5 V - 0.4 V
VCC = 2.5 V and IOH = 0.4 mA or
VOH Output high voltage 0.8 VCC - V
VCC = 5 V and IOH = 2 mA
Internal reset
VRES(2) - 1.0(5) 1.65(6) V
threshold voltage
1. Only for the devices identified by process letter K.
2. Characterized only, not tested in production.
3. 2 µA for the devices identified by process letter G or S.
4. 1 µA for the devices identified by process letter G or S.
5. 0.5 V with the device identified by process letter K.
6. 1.5 V with the device identified by process letter K.

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Table 17. DC characteristics (M950x0-R or M95040-DF, device grade 6)

Test conditions in addition to those defined
Symbol Parameter Min. Max. Unit
in Table 10 or Table 11 and Table 12(1)

ILI Input leakage current VIN = VSS or VCC - ±2 µA

ILO Output leakage current S = VCC, voltage applied on Q = VSS or VCC - ±2 µA
VCC = 1.8 V or 1.7 V, fC = 5 MHz,
ICC Supply current (Read) - 2 mA
C = 0.1 VCC/0.9 VCC, Q = open
ICC0(2) Supply current (Write) VCC = 1.8 V or 1.7 V, during tW, S = VCC - 5 mA
VCC = 1.8 V or 1.7 V, S = VCC, VIN = VSS or
ICC1 Supply current (Standby) - 1 µA
VCC
VIL Input low voltage VCC < 2.5 V –0.45 0.25 VCC V
VIH Input high voltage VCC < 2.5 V 0.75 VCC VCC+1 V
VOL Output low voltage IOL = 0.15 mA, VCC = 1.8 V or 1.7 V - 0.3 V
VOH Output high voltage IOH = –0.1 mA, VCC = 1.8 V or 1.7 V 0.8 VCC - V
Internal reset threshold
VRES(2) - 1.0(3) 1.65(4) V
voltage
1. If the application uses the M950x0-R or M95040-DF devices with 2.5 V ≤VCC ≤5.5 V and -40 °C ≤TA ≤+85 °C, please refer to
Table 16: DC characteristics (M950x0-W, device grade 6), rather than to the above table.
2. Characterized only, not tested in production.
3. 0.5 V with the device identified by process letter K.
4. 1.5 V with the device identified by process letter K.

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Table 18. AC characteristics (M950x0-W, device grade 6)(1)

Test conditions specified in Table 9 and Table 12
(2)

VCC = 2.5 to 5.5 V VCC = 4.5 to 5.5 V

Symbol Alt. Parameter Unit
Min. Max. Min. Max.

fC fSCK Clock frequency D.C. 10 D.C. 20 MHz

tSLCH tCSS1 S active setup time 30 - 15 - ns
tSHCH tCSS2 S not active setup time 30 - 15 - ns
tSHSL tCS S deselect time 40 - 20 - ns
tCHSH tCSH S active hold time 30 - 15 - ns
tCHSL - S not active hold time 30 - 15 - ns
(3)
tCH tCLH Clock high time 40 - 20 - ns
tCL(3) tCLL Clock low time 40 - 20 - ns
tCLCH(4) tRC Clock rise time - 2 - 2 µs
tCHCL(4) tFC Clock fall time - 2 - 2 µs
tDVCH tDSU Data in setup time 10 - 5 - ns
tCHDX tDH Data in hold time 10 - 10 - ns
tHHCH - Clock low hold time after HOLD not active 30 - 15 - ns
tHLCH - Clock low hold time after HOLD active 30 - 15 - ns
tCLHL - Clock low set-up time before HOLD active 0 - 0 - ns
tCLHH - Clock low set-up time before HOLD not active 0 - 0 ns
tSHQZ (4) tDIS Output disable time - 40 - 20 ns
(5)
tCLQV tV Clock low to output valid - 40 - 20 ns
tCLQX tHO Output hold time 0 - 0 - ns
tQLQH(4) tRO Output rise time - 40 - 20 ns
tQHQL(4) tFO Output fall time - 40 - 20 ns
tHHQV tLZ HOLD high to output valid - 40 - 20 ns
tHLQZ(4) tHZ HOLD low to output high-Z - 40 - 20 ns
tW tWC Write time - 5 - 5 ms
1. The timing values described in this table are recommended for new designs.
2. Only for devices identified by process letter K.
3. tCH + tCL must never be lower than the shortest possible clock period, 1/fC(max).
4. Characterized only, not tested in production.
5. tCLQV must be compatible with tCL (clock low time): if the SPI bus master offers a Read setup time tSU = 0 ns, tCL can be
equal to (or greater than) tCLQV; in all other cases, tCL must be equal to (or greater than) tCLQV+tSU.

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DC and AC parameters M950x0-W M950x0-R M950x0-DF

Table 19. AC characteristics (M950x0-R or M95040-DF, device grade 6)(1)

Test conditions specified in Table 10 or Table 11 and Table 12(2)

Symbol Alt. Parameter Min. Max. Unit

fC fSCK Clock frequency D.C. 5 MHz

tSLCH tCSS1 S active setup time 60 - ns
tSHCH tCSS2 S not active setup time 60 - ns
tSHSL tCS S deselect time 90 - ns
tCHSH tCSH S active hold time 60 - ns
tCHSL - S not active hold time 60 - ns
tCH(3) tCLH Clock high time 80 - ns
(3)
tCL tCLL Clock low time 80 - ns
(4)
tCLCH tRC Clock rise time - 2 µs
tCHCL (4) tFC Clock fall time - 2 µs
tDVCH tDSU Data in setup time 20 - ns
tCHDX tDH Data in hold time 20 - ns
tHHCH - Clock low hold time after HOLD not active 60 - ns
tHLCH - Clock low hold time after HOLD active 60 - ns
tCLHL - Clock low set-up time before HOLD active 0 - ns
tCLHH - Clock low set-up time before HOLD not active 0 - ns
(4)
tSHQZ tDIS Output disable time - 80 ns
tCLQV tV Clock low to output valid - 80 ns
tCLQX tHO Output hold time 0 - ns
tQLQH(4) tRO Output rise time - 80 ns
tQHQL(4) tFO Output fall time - 80 ns
tHHQV tLZ HOLD high to output valid - 80 ns
tHLQZ(4) tHZ HOLD low to output high-Z - 80 ns
tW tWC Write time - 5 ms
1. The timing values described in this table are recommended for new designs.
2. If the application uses the M950x0-R or M95040-DF devices at 2.5 V ≤VCC ≤5.5 V and -40 °C ≤TA ≤+85 °C,
please refer to Table 18: AC characteristics (M950x0-W, device grade 6), rather than to the above table.
3. tCH + tCL must never be lower than the shortest possible clock period, 1/fC(max).
4. Characterized only, not tested in production.

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Table 20. AC characteristics (M950x0-W, device grade 6)(1)

Test conditions specified in Table 9 and Table 12

Symbol Alt. Parameter Min. Max. Unit

fC fSCK Clock frequency D.C. 10 MHz

tSLCH tCSS1 S active setup time 15 - ns
tSHCH tCSS2 S not active setup time 15 - ns
tSHSL tCS S deselect time 40 - ns
tCHSH tCSH S active hold time 25 - ns
tCHSL - S not active hold time 15 - ns
tCH(2) tCLH Clock high time 40 - ns
(2)
tCL tCLL Clock low time 40 - ns
tCLCH(3) tRC Clock rise time - 1 µs
tCHCL(3) tFC Clock fall time - 1 µs
tDVCH tDSU Data in setup time 15 - ns
tCHDX tDH Data in hold time 15 - ns
tHHCH - Clock low hold time after HOLD not active 15 - ns
tHLCH - Clock low hold time after HOLD active 20 - ns
tCLHL - Clock low setup time before HOLD active 0 - ns
tCLHH - Clock low setup time before HOLD not active 0 - ns
(3)
tSHQZ tDIS Output disable time - 25 ns
tCLQV tV Clock low to output valid - 35 ns
tCLQX tHO Output hold time 0 - ns
tQLQH(3) tRO Output rise time - 20 ns
tQHQL (3) tFO Output fall time - 20 ns
tHHQV tLZ HOLD high to output valid - 25 ns
tHLQZ(3) tHZ HOLD low to output high-Z - 35 ns
tW tWC Write time - 5 ms
1. Not recommended for new designs, for new designs refer to Table 18: AC characteristics (M950x0-W,
device grade 6)
2. tCH + tCL must never be less than the shortest possible clock period, 1 / fC(max)
3. Value guaranteed by characterization, not 100% tested in production.

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DC and AC parameters M950x0-W M950x0-R M950x0-DF

Table 21. AC characteristics (M950x0-R, device grade 6) (1)

Test conditions specified in Table 10 and Table 12 (2)

Symbol Alt. Parameter Min. Max. Unit

fC fSCK Clock frequency D.C. 5 MHz

tSLCH tCSS1 S active setup time 90 - ns
tSHCH tCSS2 S not active setup time 90 - ns
tSHSL tCS S deselect time 100 - ns
tCHSH tCSH S active hold time 90 - ns
tCHSL - S not active hold time 90 - ns
tCH(3) tCLH Clock high time 90 - ns
(2)
tCL tCLL Clock low time 90 - ns
tCLCH(4) tRC Clock rise time - 1 µs
tCHCL(3) tFC Clock fall time - 1 µs
tDVCH tDSU Data in setup time 20 - ns
tCHDX tDH Data in hold time 30 - ns
tHHCH - Clock low hold time after HOLD not active 70 - ns
tHLCH - Clock low hold time after HOLD active 40 - ns
tCLHL - Clock low setup time before HOLD active 0 - ns
tCLHH - Clock low setup time before HOLD not active 0 - ns
(3)
tSHQZ tDIS Output disable time - 100 ns
tCLQV tV Clock low to output valid - 80 ns
tCLQX tHO Output hold time 0 - ns
tQLQH(3) tRO Output rise time - 50 ns
tQHQL (3) tFO Output fall time - 50 ns
tHHQV tLZ HOLD high to output valid - 50 ns
tHLQZ(3) tHZ HOLD low to output high-Z - 100 ns
tW tWC Write time - 5 ms
1. Not recommended for new designs, for new designs refer to Table 19: AC characteristics (M950x0-R or
M95040-DF, device grade 6)
2. The test flow guarantees the AC parameter values defined in this table (when VCC = 1.8 V) and the AC
parameter values defined in Table 20: AC characteristics (M950x0-W, device grade 6) (when VCC = 2.5 or
when VCC = 5.0 V).
3. tCH + tCL must never be less than the shortest possible clock period, 1 / fC(max)
4. Value guaranteed by characterization, not 100% tested in production.

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Figure 19. Serial input timing

T3(3,

T#(3, T3,#( T#( T#(3( T3(#(

T$6#( T#(#, T#, T#,#(

T#($8

$ -3" ). ,3" ).

(IGH IMPEDANCE
1

!)D

Figure 20. Hold timing

3
T(,#(
T#,(, T((#(

#
T#,((
T(,1: T((16

!)C

Figure 21. Serial output timing

T#( T3(3,

T#,16 T#,#( T#(#, T#, T3(1:

T#,18

T1,1(
T1(1,

!$$2
$ ,3" ).

!)F

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Package mechanical data M950x0-W M950x0-R M950x0-DF

10 Package mechanical data

In order to meet environmental requirements, ST offers the device in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: [Link].
ECOPACK® is an ST trademark.

Figure 22. SO8N 8-lead plastic small outline 150 mils body width, package outline
K[ƒ

$ $
F
FFF
E
H

PP
' *$8*(3/$1(

N

( (
 /
$
/

62$

1. Drawing is not to scale.

Table 22. SO8N 8-lead plastic small outline, 150 mils body width, package
mechanical data
Millimeters Inches(1)
Symbol
Typ. Min. Max. Typ. Min. Max.

A - - 1.75 - - 0.0689
A1 - 0.1 0.25 - 0.0039 0.0098
A2 - 1.25 - - 0.0492 -
b - 0.28 0.48 - 0.011 0.0189
c - 0.17 0.23 - 0.0067 0.0091
ccc - - 0.1 - - 0.0039
D 4.9 4.8 5 0.1929 0.189 0.1969
E 6 5.8 6.2 0.2362 0.2283 0.2441
E1 3.9 3.8 4 0.1535 0.1496 0.1575
e 1.27 - - 0.05 - -
h - 0.25 0.5 - 0.0098 0.0197
k - 0° 8° - 0° 8°
L - 0.4 1.27 - 0.0157 0.05
L1 1.04 - - 0.0409 - -
1. Values in inches are converted from mm and rounded to 4 decimal digits.

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M950x0-W M950x0-R M950x0-DF Package mechanical data

Figure 23. TSSOP8 8-lead thin shrink small outline, package outline
'

 
F

( (

 
D

$ /
$ $
&3 /

E H 76623$0

1. Drawing is not to scale.

Table 23. TSSOP8 8-lead thin shrink small outline, package mechanical data
Millimeters Inches(1)
Symbol
Typ. Min. Max. Typ. Min. Max.

A - - 1.2 - - 0.0472
A1 - 0.05 0.15 - 0.002 0.0059
A2 1 0.8 1.05 0.0394 0.0315 0.0413
b - 0.19 0.3 - 0.0075 0.0118
c - 0.09 0.2 - 0.0035 0.0079
CP - - 0.1 - - 0.0039
D 3 2.9 3.1 0.1181 0.1142 0.122
e 0.65 - - 0.0256 - -
E 6.4 6.2 6.6 0.252 0.2441 0.2598
E1 4.4 4.3 4.5 0.1732 0.1693 0.1772
L 0.6 0.45 0.75 0.0236 0.0177 0.0295
L1 1 - - 0.0394 - -
α - 0° 8° - 0° 8°
N (number of leads) 8 8
1. Values in inches are converted from mm and rounded to 4 decimal digits.

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Package mechanical data M950x0-W M950x0-R M950x0-DF

Figure 24. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, outline

$ E B

,
,

0IN 
% %

+
,
!

$
EEE
! :7?-%E6

1. Drawing is not to scale.

2. The central pad (area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be allowed
to be connected to any other voltage or signal line on the PCB, for example during the soldering process.
3. The circle in the top view of the package indicates the position of pin 1.

Table 24. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, data
Millimeters Inches(1)
Symbol
Typ. Min. Max. Typ. Min. Max.

A 0.550 0.450 0.600 0.0217 0.0177 0.0236

A1 0.020 0.000 0.050 0.0008 0.0000 0.0020
b 0.250 0.200 0.300 0.0098 0.0079 0.0118
D 2.000 1.900 2.100 0.0787 0.0748 0.0827
D2 (rev MC) - 1.200 1.600 - 0.0472 0.0630
E 3.000 2.900 3.100 0.1181 0.1142 0.1220
E2 (rev MC) - 1.200 1.600 - 0.0472 0.0630
e 0.500 - - 0.0197 - -
K (rev MC) - 0.300 - - 0.0118 -
L - 0.300 0.500 - 0.0118 0.0197
L1 - - 0.150 - - 0.0059
L3 - 0.300 - - 0.0118 -
(2)
eee - 0.080 - - 0.0031 -
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.

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M950x0-W M950x0-R M950x0-DF Part numbering

11 Part numbering

Table 25. Ordering information scheme

Example: M95040-D – W MN 6 T P

Device type
M95 = SPI serial access EEPROM

Device function
040 = 4 Kbit (512 x 8)
040-D = 4 Kbit (512 x 8) plus identification page
020 = 2 Kbit (256 x 8)
010 = 1 Kbit (128 x 8)

Operating voltage
W = VCC = 2.5 to 5.5 V
R = VCC = 1.8 to 5.5 V
F = VCC = 1.7 to 5.5 V

Package
MN = SO8 (150 mil width)
DW = TSSOP8 (169 mil width)
MC = UFDFPN8 (MLP8) 2 × 3mm

Device grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow

Option
T = Tape and reel packing
blank = tube packing

Plating technology
P or G = ECOPACK® (RoHS compliant)

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Revision history M950x0-W M950x0-R M950x0-DF

12 Revision history

Table 26. Document revision history

Date Version Changes

Document renamed from “M95040 M95020 M95010” to “M950x0

M950x0-W M950x0-R”
Silhouette of UDFPN8 (MB or MC) on the cover page updated.
Section 6.3: Read Status Register (RDSR) updated.
Text modified in Section 6.3.1: WIP bit.
02-Feb-2012 10 Table 8: Absolute maximum ratings updated.
Figure 24: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package
no lead 2 × 3mm, outline modified.
Table 24: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package
no lead 2 × 3mm, data updated.
Removed tables of available products from Section 11: Part numbering.
Document renamed from “M95040 M95020 M95010” to “M950x0-W
M950x0-R”.
Silhouette of UDFPN8 (MB or MC) on the cover page updated.
Section 6.3: Read Status Register (RDSR) updated.
24-May-2013 11 Text modified in Section 6.3.1: WIP bit.
Table 8 and Table 24 updated.
Tables 8, 13, 15, 17, 19 removed.
Figure 24 modified.
Removed tables of available products from Section 11: Part numbering.

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M950x0-W M950x0-R M950x0-DF Revision history

Table 26. Document revision history (continued)

Date Version Changes

Added “M95040-DF” part number.

Updated:
– Features: Single supply voltage, high-speed clock frequency, memory
array, write cycles and data retention
– Section 1: Description
– Figure 6: Block diagram
– Section 6: Instructions: updated introduction and added Section 6.7 to
Section 6.10
17-Oct-2013 12 – Section 7.2: Initial delivery state
– Note (1) under Table 8: Absolute maximum ratings.
– Table 16: DC characteristics (M950x0-W, device grade 6), Table 18: AC
characteristics (M950x0-W, device grade 6) and Table 25: Ordering
information scheme
Added Table 13: Cycling performance, Table 14: Memory cell data
retention, Table 17: DC characteristics (M950x0-R or M95040-DF, device
grade 6) and Table 19: AC characteristics (M950x0-R or M95040-DF,
device grade 6).
Renamed Table 20 and Table 21.
Updated footnotes:
– 1 in Table 13: Cycling performance;
– 1 in Table 14: Memory cell data retention;
– 2 in Table 19: AC characteristics (M950x0-R or M95040-DF, device
grade 6);
28-Aug-2014 13 – 2 in Table 21: AC characteristics (M950x0-R, device grade 6).
Updated Table 20 with new title AC characteristics (M950x0-W, device
grade 6) and addition of footnote 1.
Updated Table 21 with new title AC characteristics (M950x0-R, device
grade 6) and addition of footnote 1.
Updated Table 25: Ordering information scheme.

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 M950x0-W M950x0-R M950x0-DF

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© 2014 STMicroelectronics – All rights reserved

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