LM2674

SNVS007I – SEPTEMBER 1998 – REVISED JUNE 2025

LM2674 SIMPLE SWITCHER® Power Converter, High-Efficiency,

500mA, Step-Down Voltage Regulator
1 Features 3 Description
• New product available: The LM2674 series of regulators are monolithic
– LMR36506 3 to 65V, 0.6A, 200kHz to 2.2MHz integrated circuits built with a LMDMOS process.
synchronous converter These regulators provide all the active functions for
• For faster time to market: a step-down (buck) switching regulator, capable of
– TPSM365R6 3 to 65V, 0.6A, 200kHz to 2.2MHz driving a 500mA load current with excellent line and
power module load regulation. These devices are available in fixed
• Efficiency up to 96% output voltages of 3.3V, 5V, 12V, and an adjustable
• Available in 8-pin SOIC, PDIP, and 16-pin WSON output version.
packages Requiring a minimum number of external
• Simple and easy to design with components, these regulators are simple to use and
• Requires only five external components include patented internal frequency compensation and
• Uses readily available standard inductors a fixed frequency oscillator.
• 3V, 5V, 12V, and adjustable output versions
• 1.21V to 37V adjustable version output voltage The LM2674 series operates at a switching
range frequency of 260kHz, thus allowing smaller sized
• ±1.5% maximum output voltage tolerance over line filter components than what is required with lower
and load conditions frequency switching regulators. Because of very high
• Specified 500mA output load current efficiency (> 90%), the copper traces on the printed-
• 0.25Ω DMOS output switch circuit board are the only heat sinking required.
• 8V to 40V wide input voltage range A family of standard inductors for use with
• 260kHz fixed frequency internal oscillator the LM2674 are available from several different
• TTL shutdown capability, low power standby mode manufacturers. This feature greatly simplifies the
• Thermal shutdown and current limit protection design of switch-mode power supplies using these
• Create a custom design using the LM2674 with the advanced ICs. Also included in the data sheet are
WEBENCH® Power Designer selector guides for diodes and capacitors designed to
2 Applications work in switch-mode power supplies.
Package Information
• Simple high efficiency (> 90%) step-down (buck)
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
regulators
• Efficient preregulator for linear regulators D (SOIC, 8) 4.9mm × 6mm
• Positive-to-negative converters LM2674 P (PDIP, 8) 9.81mm × 9.43mm
NHN (WSON, 16) 5mm × 5mm

(1) For more information, see Section 10.

(2) The package size (length × width) is a nominal value and
includes pins, where applicable.

Typical Application

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Other features include a specified ±1.5% tolerance on output voltage within specified input voltages and output
load conditions, and ±10% on the oscillator frequency. External shutdown is included, featuring typically 50μA
standby current. The output switch includes current limiting, as well as thermal shutdown for full protection under
fault conditions.

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Table of Contents
1 Features............................................................................1 6.2 Functional Block Diagram......................................... 11
2 Applications..................................................................... 1 6.3 Feature Description...................................................11
3 Description.......................................................................1 6.4 Device Functional Modes..........................................12
4 Pin Configuration and Functions...................................4 7 Application and Implementation.................................. 13
5 Specifications.................................................................. 5 7.1 Application Information............................................. 13
5.1 Absolute Maximum Ratings........................................ 5 7.2 Typical Applications.................................................. 14
5.2 ESD Ratings............................................................... 5 7.3 Power Supply Recommendations.............................27
5.3 Recommended Operating Conditions.........................5 7.4 Layout....................................................................... 27
5.4 Thermal Information....................................................5 8 Device and Documentation Support............................29
5.5 Electrical Characteristics – 3.3-V Version................... 6 8.1 Device Support......................................................... 29
5.6 Electrical Characteristics – 5-V Version...................... 6 8.2 Documentation Support............................................ 29
5.7 Electrical Characteristics – 12-V Version.................... 6 8.3 Receiving Notification of Documentation Updates....29
5.8 Electrical Characteristics – Adjustable Voltage 8.4 Support Resources................................................... 29
Version.......................................................................... 7 8.5 Trademarks............................................................... 29
5.9 Electrical Characteristics – All Output Voltage 8.6 Electrostatic Discharge Caution................................29
Versions.........................................................................7 8.7 Glossary....................................................................30
5.10 Typical Characteristics.............................................. 8 9 Revision History............................................................ 30
6 Detailed Description...................................................... 11 10 Mechanical, Packaging, and Orderable
6.1 Overview................................................................... 11 Information.................................................................... 31

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4 Pin Configuration and Functions

CB 1 16 VSW
CB 1 8 VSW NC 2 15 VSW
NC 2 7 VIN NC 3 14 VIN
NC 4 13 NC
DAP
NC 3 6 GND NC 5 12 GND
FB 4 5 ON/OFF NC 6 11 GND
NC 7 10 NC
FB 8 9 ON/OFF

Not to scale
Not to scale
Figure 4-1. D or P Package, 8-Pin SOIC or PDIP
Connect DAP to pin 11 and 12.
(Top View)
Figure 4-2. NHN Package, 16-Pin WSON (Top View)

Table 4-1. Pin Functions

PIN
TYPE(1) DESCRIPTION
NAME SOIC, PDIP WSON
Bootstrap capacitor connection for high-side driver. Connect a high-quality, 10-nF
CB 1 1 I
capacitor from CB to VSW Pin.
Feedback sense input pin. Connect to the midpoint of feedback divider to set
FB 4 8 I VOUT for ADJ version or connect this pin directly to the output capacitor for a
fixed output version.
Enable input to the voltage regulator. High = ON and low = OFF. Pull this pin high
ON/ OFF 5 9 I
or float to enable the regulator
Source pin of the internal high-side FET. This is a switching node. Attached this
VSW 8 15, 16 O
pin to an inductor and the cathode of the external diode
Power ground pins. Connect to system ground. Ground pins of CIN and COUT.
GND 6 11, 12 —
Path to CIN must be as short as possible.
Supply input pin to collector pin of high-side FET. Connect to power supply and
VIN 7 14 I input bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and
GND must be as short as possible.
2, 3, 4, 5, 6, 7,
NC 2, 3 — No connect pins
10, 13
DAP — — — All DAP, tab, and paddle connections are at ground potential and must
be connected to system ground to allow for correct thermal and electrical
performance.

(1) I = input, O = output

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5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN MAX UNIT
Supply voltage 45 V
ON/ OFF pin voltage, VSH –0.1 6 V
Switch voltage to ground –1 V
Boost pin voltage VSW + 8 V
Feedback pin voltage, VFB –0.3 14 V
Power dissipation Internally Limited
Vapor phase (60 s) 215
D package
Infrared (15 s) 220 °C
Lead temperature
P package (soldering, 10 s) 260
WSON package See AN-1187
Maximum junction temperature 150 °C
Storage temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) (2) ±2000 V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human-body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.

5.3 Recommended Operating Conditions

MIN MAX UNIT
Supply voltage 6.5 40 V
Junction temperature, TJ –40 125 °C

5.4 Thermal Information

LM2674
THERMAL METRIC(1) D (SOIC) P (PDIP) NHN (WSON) UNIT
8 PINS 8 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance(2) 105 95 — °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
note.
(2) Junction to ambient thermal resistance with approximately 1 square inch of printed-circuit board copper surrounding the leads.
Additional copper area lowers thermal resistance further. The value RθJA for the WSON (NHN) package is specifically dependent on
PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for
the WSON package, see AN-1187 Leadless Leadframe Package (LLP) application note.

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5.5 Electrical Characteristics – 3.3-V Version

TJ = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(3) TYP(2) MAX(3) UNIT
SYSTEM PARAMETERS (see Figure 7-1)(1)
TJ = 25°C 3.251 3.3 3.35
VIN = 8 V to 40 V, ILOAD = 20 mA to 500 mA
TJ = –40°C to 125°C 3.201 3.399
VOUT Output voltage V
TJ = 25°C 3.251 3.3 3.35
VIN = 6.5 V to 40 V, ILOAD = 20 mA to 250 mA
TJ = –40°C to 125°C 3.201 3.399
η Efficiency VIN = 12 V, ILOAD = 500 mA 86%

(1) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator performance. When the LM2674 is used as shown in Figure 7-1 and Figure 7-5, system performance is as
specified by the system parameters section of the Electrical Characteristics.
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) All limits are used to calculate Average Outgoing Quality Level (AOQL).

5.6 Electrical Characteristics – 5-V Version

TJ = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(3) TYP(2) MAX(3) UNIT
SYSTEM PARAMETERS (see Figure 7-1)(1)
TJ = 25°C 4.925 5 5.075
VIN = 8 V to 40 V, ILOAD = 20 mA to 500 mA
TJ = –40°C to 125°C 4.85 5.15
VOUT Output voltage V
TJ = 25°C 4.925 5 5.075
VIN = 6.5 V to 40 V, ILOAD = 20 mA to 250 mA
TJ = –40°C to 125°C 4.85 5.15
η Efficiency VIN = 12 V, ILOAD = 500 mA 90%

(1) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator performance. When the LM2674 is used as shown in Figure 7-1 and Figure 7-5, system performance is as
specified by the system parameters section of the Electrical Characteristics.
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) All limits are used to calculate Average Outgoing Quality Level (AOQL).

5.7 Electrical Characteristics – 12-V Version

TJ = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(3) TYP(2) MAX(3) UNIT
SYSTEM PARAMETERS (see Figure 7-1)(1)
TJ = 25°C 11.82 12 12.18
VOUT Output voltage VIN = 15 V to 40 V, ILOAD = 20 mA to 500 mA V
TJ = –40°C to 125°C 11.64 12.36
η Efficiency VIN = 24 V, ILOAD = 500 mA 94%

(1) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator performance. When the LM2674 is used as shown in Figure 7-1 and Figure 7-5, system performance is as
specified by the system parameters section of the Electrical Characteristics.
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) All limits are used to calculate Average Outgoing Quality Level (AOQL).

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5.8 Electrical Characteristics – Adjustable Voltage Version

TJ = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(3) TYP(2) MAX(3) UNIT
SYSTEM PARAMETERS (see Figure 7-5)(1)

VIN = 8 V to 40 V, ILOAD = 20 mA to 500 mA, TJ = 25°C 1.192 1.21 1.228

VOUT programmed for 5 V (see Figure 7-5) TJ = –40°C to 125°C 1.174 1.246
VFB Feedback voltage V
VIN = 6.5 V to 40 V, ILOAD = 20 mA to 250 mA, TJ = 25°C 1.192 1.21 1.228
VOUT programmed for 5 V (see Figure 7-5) TJ = –40°C to 125°C 1.174 1.246
η Efficiency VIN = 12 V, ILOAD = 500 mA 90%

(1) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator performance. When the LM2674 is used as shown in Figure 7-1 and Figure 7-5, system performance is as
specified by the system parameters section of the Electrical Characteristics.
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) All limits are used to calculate Average Outgoing Quality Level (AOQL).

5.9 Electrical Characteristics – All Output Voltage Versions

TJ = 25°C, VIN = 12 V for the 3.3-V, 5-V, and adjustable versions and VIN = 24 V for the 12-V version, and ILOAD = 100 mA
(unless otherwise noted)
PARAMETERS TEST CONDITIONS MIN TYP MAX UNIT
DEVICE PARAMETERS
VFEEDBACK = 8 V for 3.3-V, 5-V, and adjustable voltage
2.5 3.6 mA
IQ Quiescent current versions
VFEEDBACK = 15 V for 12-V versions 2.5 mA
TJ = 25°C 50 100
ISTBY Standby quiescent current ON/ OFF pin = 0 V μA
TJ = –40°C to 125°C 150
TJ = 25°C 0.62 0.8 1.2 A
ICL Current limit
TJ = –40°C to 125°C 0.575 1.25
VIN = 40 V, ON/ OFF pin = 0 V, VSWITCH = 0 V 1 25 μA
IL Output leakage current
VSWITCH = −1 V, ON/ OFF pin = 0 V 6 15 mA
TJ = 25°C 0.25 0.4 Ω
RDS(ON) Switch ON-resistance ISWITCH = 500 mA
TJ = –40°C to 125°C 0.6
TJ = 25°C 260 kHz
fO Oscillator frequency Measured at switch pin
TJ = –40°C to 125°C 225 275
Maximum duty cycle 95%
D
Minimum duty cycle 0%
IBIAS Feedback bias current VFEEDBACK = 1.3 V (adjustable version only) 85 nA
TJ = 25°C 1.4
VS/D ON/ OFF pin voltage threshold Turnon threshold, rising(1) V
TJ = –40°C to 125°C 0.8 2
TJ = 25°C 20
IS/D ON/ OFF pin current ON/ OFF pin = 0 V μA
TJ = –40°C to 125°C 7 37

(1) The ON/ OFF pin is internally pulled up to 7 V and can be left floating for always-on operation.

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5.10 Typical Characteristics

Figure 5-1. Normalized Output Voltage Figure 5-2. Line Regulation

Figure 5-3. Efficiency Figure 5-4. Drain-to-Source Resistance

Figure 5-5. Switch Current Limit Figure 5-6. Operating Quiescent Current

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5.10 Typical Characteristics (continued)

Figure 5-7. Standby Quiescent Current Figure 5-8. ON/ OFF Threshold Voltage

Figure 5-9. ON/ OFF Pin Current (Sourcing) Figure 5-10. Switching Frequency

Figure 5-11. Feedback Pin Bias Current Figure 5-12. Peak Switch Current

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5.10 Typical Characteristics (continued)

Figure 5-13. Dropout Voltage, 3.3-V Version Figure 5-14. Dropout Voltage, 5-V Version

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6 Detailed Description
6.1 Overview
The LM2674 SIMPLE SWITCHER® power converter regulator is an easy-to-use non-synchronous step-down
DC-DC converter with a wide input voltage range up to 40 V. The LM2674 is capable of delivering up to 0.5-A
DC load current with excellent line and load regulation. These devices are available in fixed output voltages of
3.3 V, 5 V, 12 V, and an adjustable output version. The family requires few external components and the pin
arrangement was designed for simple, optimum PCB layout.
6.2 Functional Block Diagram

6.3 Feature Description

6.3.1 Adjustable Output Voltage
The voltage regulation loop in the LM2674 regulates output voltage by maintaining the voltage on FB pin (VFB)
to be the same as the internal REF voltage (VREF). A resistor divider pair is required to program the ratio
from output voltage VOUT to VFB. The resistor is connected from the VOUT of the LM2674 to ground with
the mid-point connecting to the FB pin. The voltage reference system produces a precise voltage reference
over temperature. The internal REF voltage is 1.21 V typically. To program the output voltage of the LM2674
to be a certain value VOUT, R1 can be calculated with a selected R2 (see Adjustable Output Voltage Typical
Application). R2 is in the range from 10 kΩ to 100 kΩ is recommended for most applications. If the resistor
divider is not connected properly, output voltage cannot be regulated because the feedback loop is broken. If
the FB pin is shorted to ground, the output voltage is driven close to VIN, because the regulator sees very low
voltage on the FB pin and tries to regulator it up. The load connected to the output can be damaged under such
a condition. Do not short FB pin to ground when the LM2674 is enabled. It is important to route the feedback
trace away from the noisy area of the PCB. For more layout recommendations, see Layout.

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6.4 Device Functional Modes

6.4.1 Shutdown Mode
The ON/ OFF pin provides electrical ON and OFF control for the LM2674. When the voltage of this pin is lower
than 1.4 V, the device is in shutdown mode. The typical standby current in this mode is 50 μA.
6.4.2 Active Mode
When the voltage of the ON/OFF pin is higher than 1.4 V, the device starts switching and the output voltage rises
until it reaches a normal regulation voltage.

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7 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.

7.1 Application Information

The LM2674 is a step-down DC-DC regulator. The LM2674 is typically used to convert a higher DC voltage to
a lower DC voltage with a maximum output current of 0.5 A. The following design procedure can be used to
select components for the LM2674. Alternately, the WEBENCH® software can be used to generate complete
designs. When generating a design, the WEBENCH software uses iterative design procedure and accesses
comprehensive databases of components. See [Link] for more details.
When the output voltage is greater than approximately 6 V, and the duty cycle at minimum input voltage is
greater than approximately 50%, the designer must exercise caution in selection of the output filter components.
When an application designed to these specific operating conditions is subjected to a current limit fault condition,
observing a large hysteresis in the current limit is possible. This can affect the output voltage of the device until
the load current is reduced sufficiently to allow the current limit protection circuit to reset itself.
Under current limiting conditions, the LM267x is designed to respond in the following manner:
1. At the moment when the inductor current reaches the current limit threshold, the ON-pulse is immediately
terminated. This happens for any application condition.
2. However, the current limit block is also designed to momentarily reduce the duty cycle to below 50% to avoid
subharmonic oscillations, which can cause the inductor to saturate.
3. Thereafter, after the inductor current falls below the current limit threshold, there is a small relaxation time
during which the duty cycle progressively rises back above 50% to the value required to achieve regulation.

If the output capacitance is sufficiently large, as the output tries to recover, the output capacitor charging current
can be large enough to repeatedly re-trigger the current limit circuit before the output has fully settled. This
condition is exacerbated with higher output voltage settings because the energy requirement of the output
capacitor varies as the square of the output voltage (½ CV2), thus requiring an increased charging current. A
simple test to determine if this condition can exist for a suspect application is to apply a short circuit across the
output of the converter, and then remove the shorted output condition. In an application with properly selected
external components, the output recovers smoothly. Practical values of external components that have been
experimentally found to work well under these specific operating conditions are COUT = 47 µF, L = 22 µH.

Note
Even with these components, for a device current limit of ICLIM, the maximum load current under
which the possibility of the large current limit hysteresis can be minimized is ICLIM/2.

For example, if the input is 24 V and the set output voltage is 18 V, then for a desired maximum current of 1.5
A, the current limit of the chosen switcher must be confirmed to be at least 3 A. Under extreme overcurrent
or short-circuit conditions, the LM267X employs frequency foldback in addition to the current limit. If the cycle-by-
cycle inductor current increases above the current limit threshold (due to short circuit or inductor saturation for
example) the switching frequency is automatically reduced to protect the IC. Frequency below 100 kHz is typical
for an extreme short-circuit condition.

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7.2 Typical Applications

7.2.1 Fixed Output Voltage Typical Application

CIN = 22-μF, 50-V Tantalum, Sprague 199D Series

COUT = 47-μF, 25-V Tantalum, Sprague 595D Series
D1 = 3.3-A, 50-V Schottky Rectifier, IR 30WQ05F
L1 = 68-μH Sumida #RCR110D-680L
CB = 0.01-μF, 50-V Ceramic

Figure 7-1. Fixed Output Voltage Version

[Link] Design Requirements

Table 7-1 lists the design parameters of this example.
Table 7-1. Design Parameters
PARAMETER VALUE
Regulated output voltage (3.3 V, 5 V, or 12 V), VOUT 5V
Maximum DC input voltage, VIN(max) 12 V
Maximum load current, ILOAD(max) 500 mA

[Link] Detailed Design Procedure

[Link].1 Custom Design with WEBENCH® Tools
Click here to create a custom design using the LM2674 devices with the WEBENCH Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.

The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at [Link]/WEBENCH.

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[Link].2 Inductor Selection (L1)

1. Select the correct inductor value selection guide from Figure 7-10, Figure 7-11, or Figure 7-12 (output
voltages of 3.3 V, 5 V, or 12 V respectively). For all other voltages, see the design procedure for the
adjustable version. Use the inductor selection guide for the 5-V version shown in Figure 7-11.
2. From the inductor value selection guide, identify the inductance region intersected by the maximum input
voltage line and the maximum load current line. Each region is identified by an inductance value and an
inductor code (LXX). From the inductor value selection guide shown in Figure 7-11, the inductance region
intersected by the 12-V horizontal line and the 500-mA vertical line is 47 μH, and the inductor code is L13.
3. Select an appropriate inductor from the four manufacturer's part numbers listed in Table 7-7. Each
manufacturer makes a different style of inductor to allow flexibility in meeting various design requirements.
Listed below are some of the differentiating characteristics of each manufacturer's inductors:
• Schott: ferrite EP core inductors; these have very low leakage magnetic fields to reduce electro-magnetic
interference (EMI) and are the lowest power loss inductors
• Renco: ferrite stick core inductors; benefits are typically lowest cost inductors and can withstand E•T and
transient peak currents above rated value. Be aware that these inductors have an external magnetic field
which can generate more EMI than other types of inductors.
• Pulse: powered iron toroid core inductors; these can also be low cost and can withstand larger than
normal E•T and transient peak currents. Toroid inductors have low EMI.
• Coilcraft: ferrite drum core inductors; these are the smallest physical size inductors, available only as
SMT components. Be aware that these inductors also generate EMI—but less than stick inductors.

Complete specifications for these inductors are available from the respective manufacturers. The inductance
value required is 47 μH. From Table 7-7, go to the L13 line and choose an inductor part number from any of the
four manufacturers shown. (In most instances, both through hole and surface mount inductors are available).
[Link].3 Output Capacitor Selection (COUT)
Select an output capacitor from the output capacitor Table 7-2. Using the output voltage and the inductance
value found in the inductor selection guide, step 1, locate the appropriate capacitor value and voltage rating. Use
the
5-V section in the output capacitor Table 7-2. Choose a capacitor value and voltage rating from the line that
contains the inductance value of 47 μH. The capacitance and voltage rating values corresponding to the 47-μH
inductor are the following:
• Surface mount
– 68-μF, 10-V Sprague 594D series
– 100-μF, 10-V AVX TPS series
• Through hole
– 68-μF, 10-V Sanyo OS-CON SA series
– 150-μF, 35-V Sanyo MV-GX series
– 150-μF, 35-V Nichicon PL series
– 150-μF, 35-V Panasonic HFQ series
The capacitor list contains through-hole electrolytic capacitors from four different capacitor manufacturers and
surface-mount tantalum capacitors from two different capacitor manufacturers. TI recommends that both the
manufacturers and the manufacturer's series that are listed in the table be used.

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Table 7-2. Output Capacitor Table

OUTPUT CAPACITOR
OUTPUT SURFACE MOUNT THROUGH HOLE
INDUCTANCE
VOLTAGE
(μH) AVX TPS NICHICON PANASONIC
(V) SPRAGUE 594D SANYO OS-CON SANYO MV-GX
SERIES PL SERIES HFQ SERIES
SERIES (μF/V) SA SERIES (μF/V) SERIES (μF/V)
(μF/V) (μF/V) (μF/V)
22 120/6.3 100/10 100/10 330/35 330/35 330/35
33 120/6.3 100/10 68/10 220/35 220/35 220/35
47 68/10 100/10 68/10 150/35 150/35 150/35
3.3
68 120/6.3 100/10 100/10 120/35 120/35 120/35
100 120/6.3 100/10 100/10 120/35 120/35 120/35
150 120/6.3 100/10 100/10 120/35 120/35 120/35
22 100/16 100/10 100/10 330/35 330/35 330/35
33 68/10 10010 68/10 220/35 220/35 220/35
47 68/10 100/10 68/10 150/35 150/35 150/35
5
68 100/16 100/10 100/10 120/35 120/35 120/35
100 100/16 100/10 100/10 120/35 120/35 120/35
150 100/16 100/10 100/10 120/35 120/35 120/35
22 120/20 (2×) 68/20 68/20 330/35 330/35 330/35
33 68/25 68/20 68/20 220/35 220/35 220/35
47 47/20 68/20 47/20 150/35 150/35 150/35
12 68 47/20 68/20 47/20 120/35 120/35 120/35
100 47/20 68/20 47/20 120/35 120/35 120/35
150 47/20 68/20 47/20 120/35 120/35 120/35
220 47/20 68/20 47/20 120/35 120/35 120/35

[Link].4 Catch Diode Selection (D1)

1. In normal operation, the average current of the catch diode is the load current times the catch diode duty
cycle, 1-D (D is the switch duty cycle, which is approximately the output voltage divided by the input voltage).
The largest value of the catch diode average current occurs at the maximum load current and maximum
input voltage (minimum D). For normal operation, the catch diode current rating must be at least 1.3 times
greater than its maximum average current. However, if the power supply design must withstand a continuous
output short, the diode must have a current rating equal to the maximum current limit of the LM2674. The
most stressful condition for this diode is a shorted output condition. Refer to Table 7-3. In this example, a
1-A, 20-V Schottky diode provides the best performance. If the circuit must withstand a continuous shorted
output, TI recommends a higher current Schottky diode.
Table 7-3. Schottky Diode Selection Table
500-mA DIODES 3-A DIODES
VR SURFACE THROUGH- SURFACE THROUGH-
MOUNT HOLE MOUNT HOLE

20V SK12 1N5817 SK32 1N5820

B120 SR102 SR302

30V SK13 1N5818 SK33 1N5821

B130 11DQ03 30WQ03F 31DQ03

MBRS130 SR103

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Table 7-3. Schottky Diode Selection Table

(continued)
500-mA DIODES 3-A DIODES
VR SURFACE THROUGH- SURFACE THROUGH-
MOUNT HOLE MOUNT HOLE

40V SK14 1N5819 SK34 1N5822

B140 11DQ04 30BQ040 MBR340

MBRS140 SR104 30WQ04F 31DQ04

10BQ040 MBRS340 SR304

10MQ040 MBRD340

15MQ040

50V SK15 MBR150 SK35 MBR350

B150 11DQ05 30WQ05F 31DQ05

10BQ050 SR105 SR305

2. The reverse voltage rating of the diode must be at least 1.25 times the maximum input voltage.
3. Because of the fast switching speed and low forward voltage drop, Schottky diodes provide the best
performance and efficiency. This Schottky diode must be placed close to the LM2674 using short leads
and short printed-circuit traces.

[Link].5 Input Capacitor (CIN)

A low ESR aluminum or tantalum bypass capacitor is required between the input pin and ground to prevent large
voltage transients from appearing at the input. This capacitor must be placed close to the IC using short leads.
In addition, the RMS current rating of the input capacitor must be selected to be at least ½ the DC load current.
The capacitor manufacturer data sheet must be checked to assure that this current rating is not exceeded. The
curves shown in Figure 7-2 show typical RMS current ratings for several different aluminum electrolytic capacitor
values. A parallel connection of two or more capacitors can be required to increase the total minimum RMS
current rating to suit the application requirements.

Figure 7-2. RMS Current Ratings for Low ESR Electrolytic Capacitors (Typical)

For an aluminum electrolytic capacitor, the voltage rating must be at least 1.25 times the maximum input voltage.
Caution must be exercised if solid tantalum capacitors are used. The tantalum capacitor voltage rating must
be twice the maximum input voltage. Table 7-4 and Table 7-5 show the recommended application voltage for
AVX TPS and Sprague 594D tantalum capacitors. TI recommends that they be surge current tested by the
manufacturer. The TPS series available from AVX, and the 593D and 594D series from Sprague are all surge
current tested. Another approach to minimize the surge current stresses on the input capacitor is to add a small
inductor in series with the input supply line.

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Table 7-4. AVX TPS

RECOMMENDED APPLICATION
VOLTAGE RATING
VOLTAGE(1)
85°C RATING
3.3 6.3
5 10
10 20
12 25
15 35

Table 7-5. Sprague 594D

RECOMMENDED APPLICATION
VOLTAGE RATING
VOLTAGE(1)
85°C RATING
2.5 4
3.3 6.3
5 10
8 16
12 20
18 25
24 35
29 50

(1) Recommended Application Voltage for AVX TPS and Sprague

594D Tantalum Chip Capacitors Derated for 85°C

Use caution when using only ceramic capacitors for input bypassing, because it can cause severe ringing at the
VIN pin. The important parameters for the input capacitor are the input voltage rating and the RMS current rating.
With a maximum input voltage of 12 V, an aluminum electrolytic capacitor with a voltage rating greater than 15 V
(1.25 × VIN) is required. The next higher capacitor voltage rating is 16 V.
The RMS current rating requirement for the input capacitor in a buck regulator is approximately ½ the DC load
current. In this example, with a 500-mA load, a capacitor with an RMS current rating of at least 250 mA is
required. The curves shown in Figure 7-2 can be used to select an appropriate input capacitor. From the curves,
locate the 16-V line and note which capacitor values have RMS current ratings greater than 250 mA.
For a through-hole design, a 100-μF, 16-V electrolytic capacitor (Panasonic HFQ series, Nichicon PL, Sanyo
MV-GX series or equivalent) is adequate. Other types or other manufacturers' capacitors can be used provided
the RMS ripple current ratings are adequate. Additionally, for a complete surface mount design, electrolytic
capacitors such as the Sanyo CV-C or CV-BS and the Nichicon WF or UR and the NIC Components NACZ
series can be considered.
For surface mount designs, solid tantalum capacitors can be used, but caution must be exercised with regard to
the capacitor surge current rating and voltage rating. In this example, checking Table 7-4, and the Sprague 594D
series data sheet, a Sprague 594D 15-μF, 25-V capacitor is adequate.
[Link].6 Boost Capacitor (CB)
This capacitor develops the necessary voltage to turn the switch gate on fully. All applications must use a
0.01-μF, 50-V ceramic capacitor. For this application, and all applications, use a 0.01-μF, 50-V ceramic capacitor.

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[Link] Application Curves

Continuous mode switching waveforms VIN = 20 V, VOUT = 5 Load transient response for continuous mode VIN = 20 V,
V, ILOAD = 500 mA L = 100 μH, COUT = 100 μF, COUTESR = VOUT = 5 V, L = 100 μH, COUT = 100 μF, COUTESR = 0.1
0.1 Ω Ω
A: VSW pin voltage = 10 V/div A: Output voltage = 100 mV/div, ac-coupled
B: Inductor current = 0.2 A/div B: Load current = 100-mA to 500-mA load pulse
C: Output ripple voltage = 50 mV/div ac-coupled
Figure 7-4. Horizontal Time Base: 50 μs/div
Figure 7-3. Horizontal Time Base: 1 μs/div

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7.2.2 Adjustable Output Voltage Typical Application

CIN = 22-μF, 50-V Tantalum, Sprague 199D Series

COUT = 47-μF, 25-V Tantalum, Sprague 595D Series
D1 = 3.3-A, 50-V Schottky Rectifier, IR 30WQ05F
L1 = 68-μH Sumida #RCR110D-680L
R1 = 1.5 kΩ, 1%
CB = 0.01-μF, 50-V Ceramic
For a 5-V output, select R2 to be 4.75 kΩ, 1%

where VREF = 1.21 V

Use a 1% resistor for best stability.

Figure 7-5. Adjustable Output Voltage Version

[Link] Design Requirements

Table 7-6 lists the design parameters of this example.
Table 7-6. Design Parameters
PARAMETER VALUE
Regulated output voltage, VOUT 20
Maximum input voltage, VIN(max) 28
Maximum load current, ILOAD(max) 500
Switching frequency, F Fixed at a nominal 260 kHz

[Link] Detailed Design Procedure

[Link].1 Programming Output Voltage
Select R1 and R2, as shown in Figure 7-5.
Use the following formula to select the appropriate resistor values.

(1)

where

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• VREF = 1.21 V
Select a value for R1 between 240 Ω and 1.5 kΩ. The lower resistor values minimize noise pickup in the
sensitive feedback pin. (For the lowest temperature coefficient and the best stability with time, use 1% metal film
resistors.)

(2)

Select R1 to be 1 kΩ, 1%. Solve for R2.

(3)

where
• R2 = 1k (16.53 − 1) = 15.53 kΩ, closest 1% value is 15.4 kΩ
R2 = 15.4 kΩ
[Link].2 Inductor Selection (L1)
1. Calculate the inductor Volt • microsecond constant E • T (V • μs) from Equation 4.

(4)

where
• VSAT = internal switch saturation voltage = 0.25 V
• VD = diode forward voltage drop = 0.5 V
Calculate the inductor Volt • microsecond constant (E • T) with Equation 5.

(5)
2. Use the E • T value from the previous formula and match it with the E • T number on the vertical axis of the
inductor value selection guide shown in Figure 7-13.
E • T = 21.6 (V • μs)
3. On the horizontal axis, select the maximum load current.
ILOAD(max) = 500 mA
4. Identify the inductance region intersected by the E • T value and the maximum load current value. Each
region is identified by an inductance value and an inductor code (LXX).
From the inductor value selection guide shown in Figure 7-13, the inductance region intersected by the 21.6
(V • μs) horizontal line and the 500-mA vertical line is 100 μH, and the inductor code is L20.
5. Select an appropriate inductor from the four manufacturer's part numbers listed in Table 7-7. For information
on the different types of inductors, see the inductor selection in the fixed output voltage design procedure.
From Table 7-7, locate line L20, and select an inductor part number from the list of manufacturers' part
numbers.

Table 7-7. Inductor Manufacturers' Part Numbers

IND. SCHOTT RENCO PULSE ENGINEERING COILCRAFT
INDUCTANCE CURRENT
REF. THROUGH SURFACE THROUGH SURFACE THROUGH SURFACE SURFACE
(μH) (A)
DESG. HOLE MOUNT HOLE MOUNT HOLE MOUNT MOUNT
L2 150 0.21 67143920 67144290 RL-5470-4 RL1500-150 PE-53802 PE-53802-S DO1608-154
L3 100 0.26 67143930 67144300 RL-5470-5 RL1500-100 PE-53803 PE-53803-S DO1608-104

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Table 7-7. Inductor Manufacturers' Part Numbers (continued)

IND. SCHOTT RENCO PULSE ENGINEERING COILCRAFT
INDUCTANCE CURRENT
REF. THROUGH SURFACE THROUGH SURFACE THROUGH SURFACE SURFACE
(μH) (A)
DESG. HOLE MOUNT HOLE MOUNT HOLE MOUNT MOUNT
L4 68 0.32 67143940 67144310 RL-1284-68-43 RL1500-68 PE-53804 PE-53804-S DO1608-683
L5 47 0.37 67148310 67148420 RL-1284-47-43 RL1500-47 PE-53805 PE-53805-S DO1608-473
L6 33 0.44 67148320 67148430 RL-1284-33-43 RL1500-33 PE-53806 PE-53806-S DO1608-333
L7 22 0.52 67148330 67148440 RL-1284-22-43 RL1500-22 PE-53807 PE-53807-S DO1608-223
L9 220 0.32 67143960 67144330 RL-5470-3 RL1500-220 PE-53809 PE-53809-S DO3308-224
L10 150 0.39 67143970 67144340 RL-5470-4 RL1500-150 PE-53810 PE-53810-S DO3308-154
L11 100 0.48 67143980 67144350 RL-5470-5 RL1500-100 PE-53811 PE-53811-S DO3308-104
L12 68 0.58 67143990 67144360 RL-5470-6 RL1500-68 PE-53812 PE-53812-S DO3308-683
L13 47 0.7 67144000 67144380 RL-5470-7 RL1500-47 PE-53813 PE-53813-S DO3308-473
L14 33 0.83 67148340 67148450 RL-1284-33-43 RL1500-33 PE-53814 PE-53814-S DO3308-333
L15 22 0.99 67148350 67148460 RL-1284-22-43 RL1500-22 PE-53815 PE-53815-S DO3308-223
L18 220 0.55 67144040 67144420 RL-5471-2 RL1500-220 PE-53818 PE-53818-S DO3316-224
L19 150 0.66 67144050 67144430 RL-5471-3 RL1500-150 PE-53819 PE-53819-S DO3316-154
L20 100 0.82 67144060 67144440 RL-5471-4 RL1500-100 PE-53820 PE-53820-S DO3316-104
L21 68 0.99 67144070 67144450 RL-5471-5 RL1500-68 PE-53821 PE-53821-S DO3316-683

[Link].3 Output Capacitor Selection (COUT)

1. Select an output capacitor from the capacitor code selection guide in Table 7-8. Using the inductance value
found in the inductor selection guide, step 1, locate the appropriate capacitor code corresponding to the
desired output voltage. Use the appropriate row of the capacitor code selection guide, in Table 7-8. For this
example, use the 15-V to 20-V row. The capacitor code corresponding to an inductance of 100 μH is C20.
2. Select an appropriate capacitor value and voltage rating, using the capacitor code, from the output
capacitor selection in Table 7-9. There are two solid tantalum (surface-mount) capacitor manufacturers
and four electrolytic (through-hole) capacitor manufacturers to choose from. TI recommends that both the
manufacturers and the manufacturer's series that are listed in the table be used. From the output capacitor
selection in Table 7-9, choose a capacitor value (and voltage rating) that intersects the capacitor code(s)
selected in section A, C20.
The capacitance and voltage rating values corresponding to the capacitor code C20 are the following:
• Surface mount
– 33-μF, 25-V Sprague 594D series
– 33-μF, 25-V AVX TPS series
• Through hole
– 33-μF, 25-V Sanyo OS-CON SC series
– 120-μF, 35-V Sanyo MV-GX series
– 120-μF, 35-V Nichicon PL series
– 20-μF, 35-V Panasonic HFQ series

Other manufacturers or other types of capacitors can also be used, provided the capacitor specifications
(especially the 100-kHz ESR) closely match the characteristics of the capacitors listed in the output capacitor
table. Refer to the capacitor manufacturers' data sheet for this information.
Table 7-8. Capacitor Code Selection Guide
CASE OUTPUT INDUCTANCE (μH)
STYLE(1) VOLTAGE (V) 22 33 47 68 100 150 220
SM and TH 1.21–2.5 — — — — C1 C2 C3
SM and TH 2.5–3.75 — — — C1 C2 C3 C3
SM and TH 3.75–5 — — C4 C5 C6 C6 C6
SM and TH 5–6.25 — C4 C7 C6 C6 C6 C6

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Table 7-8. Capacitor Code Selection Guide (continued)

CASE OUTPUT INDUCTANCE (μH)
STYLE(1) VOLTAGE (V) 22 33 47 68 100 150 220
SM and TH 6.25–7.5 C8 C4 C7 C6 C6 C6 C6
SM and TH 7.5–10 C9 C10 C11 C12 C13 C13 C13
SM and TH 10–12.5 C14 C11 C12 C12 C13 C13 C13
SM and TH 12.5–15 C15 C16 C17 C17 C17 C17 C17
SM and TH 15–20 C18 C19 C20 C20 C20 C20 C20
SM and TH 20–30 C21 C22 C22 C22 C22 C22 C22
TH 30–37 C23 C24 C24 C25 C25 C25 C25

(1) SM = Surface mount and TH = Through hole

Table 7-9. Output Capacitor Selection Table

OUTPUT CAPACITOR

CAP. SURFACE MOUNT THROUGH HOLE

REF. SPRAGUE AVX TPS SANYO OS-CON SANYO MV-GX NICHICON PANASONIC
DESG. 594D SERIES SERIES SA SERIES SERIES PL SERIES HFQ SERIES
# (μF/V) (μF/V) (μF/V) (μF/V) (μF/V) (μF/V)
C1 120/6.3 100/10 100/10 220/35 220/35 220/35
C2 120/6.3 100/10 100/10 150/35 150/35 150/35
C3 120/6.3 100/10 100/35 120/35 120/35 120/35
C4 68/10 100/10 68/10 220/35 220/35 220/35
C5 100/16 100/10 100/10 150/35 150/35 150/35
C6 100/16 100/10 100/10 120/35 120/35 120/35
C7 68/10 100/10 68/10 150/35 150/35 150/35
C8 100/16 100/10 100/10 330/35 330/35 330/35
C9 100/16 100/16 100/16 330/35 330/35 330/35
C10 100/16 100/16 68/16 220/35 220/35 220/35
C11 100/16 100/16 68/16 150/35 150/35 150/35
C12 100/16 100/16 68/16 120/35 120/35 120/35
C13 100/16 100/16 100/16 120/35 120/35 120/35
C14 100/16 100/16 100/16 220/35 220/35 220/35
C15 47/20 68/20 47/20 220/35 220/35 220/35
C16 47/20 68/20 47/20 150/35 150/35 150/35
C17 47/20 68/20 47/20 120/35 120/35 120/35
C18 68/25 (2×) 33/25 47/(1) 220/35 220/35 220/35
C19 33/25 33/25 33/25(1) 150/35 150/35 150/35
C20 33/25 33/25 33/25(1) 120/35 120/35 120/35
C21 33/35 (2×) 22/25 See(2) 150/35 150/35 150/35
C22 33/35 22/35 See(2) 120/35 120/35 120/35
C23 See(2) See(2) See(2) 220/50 100/50 120/50
C24 See(2) See(2) See(2) 150/50 100/50 120/50
C25 See(2) See(2) See(2) 150/50 82/50 82/50

(1) The SC series of Os-Con capacitors (others are SA series)

(2) The voltage ratings of the surface mount tantalum chip and Os-Con capacitors are too low to work at these voltages.

[Link].4 Catch Diode Selection (D1)

1. In normal operation, the average current of the catch diode is the load current times the catch diode duty
cycle, 1-D (D is the switch duty cycle, which is approximately VOUT/VIN). The largest value of the catch diode
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average current occurs at the maximum input voltage (minimum D). For normal operation, the catch diode
current rating must be at least 1.3 times greater than its maximum average current. However, if the power
supply design must withstand a continuous output short, the diode must have a current rating greater than
the maximum current limit of the LM2674. The most stressful condition for this diode is a shorted output
condition. Schottky diodes provide the best performance, and in this example a 500-mA, 40-V Schottky
diode is a good choice. If the circuit must withstand a continuous shorted output, TI recommends a higher
current (at least 1.2 A) Schottky diode.
2. The reverse voltage rating of the diode must be at least 1.25 times the maximum input voltage.
3. Because of the fast switching speed and low forward voltage drop, Schottky diodes provide the best
performance and efficiency. The Schottky diode must be placed close to the LM2674 using short leads
and short printed-circuit traces.

[Link].5 Input Capacitor (CIN)

A low ESR aluminum or tantalum bypass capacitor is required between the input pin and ground to prevent large
voltage transients from appearing at the input. This capacitor must be placed close to the IC using short leads.
In addition, the RMS current rating of the input capacitor must be selected to be at least ½ the DC load current.
The capacitor manufacturer data sheet must be checked to assure that this current rating is not exceeded. The
curves shown in Figure 7-2 show typical RMS current ratings for several different aluminum electrolytic capacitor
values. A parallel connection of two or more capacitors can be required to increase the total minimum RMS
current rating to suit the application requirements.

Figure 7-6. RMS Current Ratings for Low ESR Electrolytic Capacitors (Typical)

For an aluminum electrolytic capacitor, the voltage rating must be at least 1.25 times the maximum input voltage.
Caution must be exercised if solid tantalum capacitors are used. The tantalum capacitor voltage rating must
be twice the maximum input voltage. Table 7-10 and Table 7-5 show the recommended application voltage for
AVX TPS and Sprague 594D tantalum capacitors. TI also recommends that they be surge current tested by the
manufacturer. The TPS series available from AVX, and the 593D and 594D series from Sprague are all surge
current tested. Another approach to minimize the surge current stresses on the input capacitor is to add a small
inductor in series with the input supply line.
Table 7-10. AVX TPS
RECOMMENDED
VOLTAGE RATING
APPLICATION VOLTAGE(1)
85°C RATING
3.3 6.3
5 10
10 20
12 25
15 35

(1) Recommended Application Voltage for AVX TPS and Sprague

594D Tantalum Chip Capacitors Derated for 85°C

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Table 7-11. Sprague 594D

RECOMMENDED
VOLTAGE RATING
APPLICATION VOLTAGE(1)
85°C RATING
2.5 4
3.3 6.3
5 10
8 16
12 20
18 25
24 35
29 50

(1) Recommended Application Voltage for AVX TPS and Sprague

594D Tantalum Chip Capacitors Derated for 85°C

Use caution when using only ceramic capacitors for input bypassing, because it can cause severe ringing at the
VIN pin. The important parameters for the input capacitor are the input voltage rating and the RMS current rating.
With a maximum input voltage of 28 V, an aluminum electrolytic capacitor with a voltage rating of at least 35 V
(1.25 × VIN) is required.
The RMS current rating requirement for the input capacitor in a buck regulator is approximately ½ the DC load
current. In this example, with a 500-mA load, a capacitor with an RMS current rating of at least 250 mA is
required. The curves shown in Figure 7-2 can be used to select an appropriate input capacitor. From the curves,
locate the 35-V line and note which capacitor values have RMS current ratings greater than 250 mA.
For a through-hole design, a 68-μF, 35-V electrolytic capacitor (Panasonic HFQ series, Nichicon PL, Sanyo
MV-GX series or equivalent) is adequate. Other types or other manufacturers' capacitors can be used provided
the RMS ripple current ratings are adequate. Additionally, for a complete surface mount design, electrolytic
capacitors such as the Sanyo CV-C or CV-BS, and the Nichicon WF or UR and the NIC Components NACZ
series can be considered.
For surface mount designs, solid tantalum capacitors can be used, but caution must be exercised with regard
to the capacitor surge current rating and voltage rating. In this example, checking note 1 of Table 7-5, and the
Sprague 594D series data sheet, a Sprague 594D 15-μF, 50-V capacitor is adequate.
[Link].6 Boost Capacitor (CB)
This capacitor develops the necessary voltage to turn the switch gate on fully. All applications must use a
0.01-μF, 50-V ceramic capacitor. For this application, and all applications, use a 0.01-μF, 50-V ceramic capacitor.

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[Link] Application Curves

Discontinuous mode switching waveforms VIN = 20 V, VOUT =

5 V, ILOAD = 300 mA, L = 15 μH, COUT = 68 μF (2×), COUTESR
Load transient response for discontinuous mode VIN = 20 V,
= 25 mΩ
VOUT = 5 V, L = 47 μH, COUT = 68 μF, COUTESR = 50 mΩ
A: VSW pin voltage = 10 V/div
A: Output voltage = 100 mV/div, ac-coupled
B: Inductor current = 0.5 A/div
B: Load current = 100-mA to 400-mA load pulse
C: Output ripple voltage = 20 mV/div ac-coupled
Figure 7-8. Horizontal Time Base: 200 μs/div
Figure 7-7. Horizontal Time Base: 1 μs/div

7.2.3 Typical Application for All Output Voltage Versions

Figure 7-9. Typical Application

[Link] Application Curves

for continuous mode operation

Figure 7-10. LM2674, 3.3-V Version Figure 7-11. LM2674, 5-V Version

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Figure 7-12. LM2674, 12-V Version Figure 7-13. LM2674, Adjustable Version

7.3 Power Supply Recommendations

The LM2674 is designed to operate from an input voltage supply up to 40 V. This input supply must be well
regulated and able to withstand maximum input current and maintain a stable voltage.
7.4 Layout
7.4.1 Layout Guidelines
Layout is very important in switching regulator designs. Rapidly switching currents associated with wiring
inductance can generate voltage transients which can cause problems. For minimal inductance and ground
loops, the wires indicated by heavy lines (in Figure 7-1 and Figure 7-5) must be wide printed-circuit traces and
must be kept as short as possible. For best results, external components must be placed as close to the switcher
IC as possible using ground plane construction or single point grounding.
If open core inductors are used, take special care as to the location and positioning of this type of inductor.
Allowing the inductor flux to intersect sensitive feedback, IC ground path, and COUT wiring can cause problems.
When using the adjustable version, take special care as to the location of the feedback resistors and the
associated wiring. Physically place both resistors near the IC, and route the wiring away from the inductor,
especially an open core type of inductor.
[Link] WSON Package Devices
The LM2674 is offered in the 16-pin WSON surface mount package to allow for increased power dissipation
compared to the 8-pin SOIC and PDIP.
The die attach pad (DAP) must be connected to PCB ground plane. For CAD and assembly guidelines refer to
AN-1187 Leadless Leadframe Package (LLP) application report.
7.4.2 Layout Examples

CIN = 15-μF, 25-V, Solid Tantalum Sprague 594D series

COUT = 68-μF, 10-V, Solid Tantalum Sprague 594D series

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Product Folder Links: LM2674
LM2674
SNVS007I – SEPTEMBER 1998 – REVISED JUNE 2025 [Link]

D1 = 1-A, 40-V Schottky Rectifier, Surface Mount

L1 = 47-μH, L13, Coilcraft DO3308
CB = 0.01-μF, 50-V Ceramic

Figure 7-14. Typical Surface-Mount PCB Layout, Fixed Output (4x Size)

CIN = 15-μF, 50-V, Solid Tantalum Sprague 594D series

COUT = 33-μF, 25-V, Solid Tantalum Sprague 594D series
D1 = 1-A, 40-V Schottky Rectifier, Surface Mount
L1 = 100-μH, L20, Coilcraft DO3316
CB = 0.01-μF, 50-V Ceramic
R1 = 1k, 1%
R2 = Use formula in Detailed Design Procedure

Figure 7-15. Typical Surface-Mount PCB Layout, Adjustable Output (4x Size)

28 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated

Product Folder Links: LM2674

 LM2674
[Link] SNVS007I – SEPTEMBER 1998 – REVISED JUNE 2025

8 Device and Documentation Support

8.1 Device Support
8.1.1 Development Support
For development support see the following:
• For TI's WEBENCH Design Environment, visit the WEBENCH Design Center
[Link] Custom Design with WEBENCH® Tools
Click here to create a custom design using the LM2674 devices with the WEBENCH Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.

The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at [Link]/WEBENCH.
8.2 Documentation Support
8.2.1 Related Documentation
For related documentation see the following:
Texas Instruments, AN-1187 Leadless Leadframe Package (LLP) application note
8.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on [Link]. Click on
Notifications to register and receive a weekly digest of any product information that has changed. For change
details, review the revision history included in any revised document.
8.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
8.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
SIMPLE SWITCHER® and WEBENCH® are registered trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
8.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 29

Product Folder Links: LM2674
LM2674
SNVS007I – SEPTEMBER 1998 – REVISED JUNE 2025 [Link]

8.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

9 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (June 2023) to Revision I (June 2025) Page
• Added DAP connection recommendation...........................................................................................................4

Changes from Revision G (June 2016) to Revision H (June 2023) Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1
• Added information relating to WEBENCH.......................................................................................................... 1
• Added link to LMR36506 and TPSM365R6 product folders...............................................................................1
• Updated to Package Information table............................................................................................................... 1
• Updated bootstrap capacitor recommendation from 470-nF to 10-nF................................................................4
• Updated trademark information........................................................................................................................ 11

30 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated

Product Folder Links: LM2674

 LM2674
[Link] SNVS007I – SEPTEMBER 1998 – REVISED JUNE 2025

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 31

Product Folder Links: LM2674
 PACKAGE OPTION ADDENDUM

[Link] 4-Jun-2025

PACKAGING INFORMATION

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

LM2674LD-ADJ/NOPB Active Production WSON (NHN) | 16 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 125 S000CB
LM2674LD-ADJ/NOPB.B Active Production WSON (NHN) | 16 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 125 S000CB
LM2674LDX-5.0/NOPB Active Production WSON (NHN) | 16 4500 | LARGE T&R Yes SN Level-3-260C-168 HR -40 to 125 S000BB
LM2674LDX-5.0/NOPB.B Active Production WSON (NHN) | 16 4500 | LARGE T&R Yes SN Level-3-260C-168 HR -40 to 125 S000BB
LM2674M-12/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2674
M-12
LM2674M-12/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2674
M-12
LM2674M-3.3/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2674
M3.3
LM2674M-3.3/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2674
M3.3
LM2674M-5.0/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2674
M5.0
LM2674M-5.0/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2674
M5.0
LM2674M-ADJ/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2674
MADJ
LM2674M-ADJ/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2674
MADJ
LM2674MX-12/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2674
M-12
LM2674MX-12/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2674
M-12
LM2674MX-3.3/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2674
M3.3
LM2674MX-3.3/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2674
M3.3
LM2674MX-5.0/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2674
M5.0
LM2674MX-5.0/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2674
M5.0

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

[Link] 4-Jun-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

LM2674MX-ADJ/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 2674
MADJ
LM2674MX-ADJ/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2674
MADJ
LM2674N-3.3/NOPB Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 125 LM2674
N-3.3
LM2674N-3.3/NOPB.B Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 125 LM2674
N-3.3
LM2674N-5.0/NOPB Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 125 LM2674
N-5.0
LM2674N-5.0/NOPB.B Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 125 LM2674
N-5.0
LM2674N-ADJ/NOPB Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 125 LM2674
N-ADJ
LM2674N-ADJ/NOPB.B Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 125 LM2674
N-ADJ

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

[Link] 4-Jun-2025

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3
 PACKAGE MATERIALS INFORMATION

[Link] 30-May-2025

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2674LD-ADJ/NOPB WSON NHN 16 1000 178.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1
LM2674LDX-5.0/NOPB WSON NHN 16 4500 330.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1
LM2674MX-12/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2674MX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2674MX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2674MX-ADJ/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

[Link] 30-May-2025

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2674LD-ADJ/NOPB WSON NHN 16 1000 208.0 191.0 35.0
LM2674LDX-5.0/NOPB WSON NHN 16 4500 356.0 356.0 36.0
LM2674MX-12/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2674MX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2674MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2674MX-ADJ/NOPB SOIC D 8 2500 367.0 367.0 35.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

[Link] 30-May-2025

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM2674M-12/NOPB D SOIC 8 95 495 8 4064 3.05
LM2674M-12/NOPB.B D SOIC 8 95 495 8 4064 3.05
LM2674M-3.3/NOPB D SOIC 8 95 495 8 4064 3.05
LM2674M-3.3/NOPB.B D SOIC 8 95 495 8 4064 3.05
LM2674M-5.0/NOPB D SOIC 8 95 495 8 4064 3.05
LM2674M-5.0/NOPB.B D SOIC 8 95 495 8 4064 3.05
LM2674M-ADJ/NOPB D SOIC 8 95 495 8 4064 3.05
LM2674M-ADJ/NOPB.B D SOIC 8 95 495 8 4064 3.05
LM2674N-3.3/NOPB P PDIP 8 40 502 14 11938 4.32
LM2674N-3.3/NOPB.B P PDIP 8 40 502 14 11938 4.32
LM2674N-5.0/NOPB P PDIP 8 40 502 14 11938 4.32
LM2674N-5.0/NOPB.B P PDIP 8 40 502 14 11938 4.32
LM2674N-ADJ/NOPB P PDIP 8 40 502 14 11938 4.32
LM2674N-ADJ/NOPB.B P PDIP 8 40 502 14 11938 4.32

Pack Materials-Page 3
 PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1

.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]

4X (0 -15 )

4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4

.005-.010 TYP
[0.13-0.25]

4X (0 -15 )

SEE DETAIL A
.010
[0.25]

.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.

[Link]
 EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X

SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK

EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

[Link]
 EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55] SYMM

1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

[Link]
 MECHANICAL DATA
NHN0016A

LDA16A (REV A)

[Link]
 IMPORTANT NOTICE AND DISCLAIMER
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