Interactive MLCC User Guide 2024
Interactive MLCC User Guide 2024
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MULTILAYER CERAMIC
CAPACITORS
MULTILAYER CERAMIC
CAPACITORS
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C O N T E N T S
06 Part Numbering
10 Normal Capacitors_Standard
141 Caution/Notice
Nomal Capacitors
Normal Capacitors
LSC
High-bending
Strength
Low Acoustic
Noise
Low ESL
Part Numbering
CL 10 A 106 M Q 8 N N N C
1 2 3 4 5 6 7 8 9 10 11
1 SERIES CODE
CL = Multilayer Ceramic Capacitors
2 SIZE CODE
Code inch/mm Code inch/mm Code inch/mm Code inch/mm
R1 008004/0201 10 0603/1608 42 1808/4520 L6 0304/0610
02 01005/0402 21 0805/2012 43 1812/4532 01 0306/0816
03 0201/0603 31 1206/3216 55 2220/5750 19 0503/1209
05 0402/1005 32 1210/3225 L5 0204/0510
3 DIELECTRIC CODE
Class Ⅰ (Temperature Compensation)
Symbol EIA Code Operation Temperature Range (℃) Temperature Coefficient Range (ppm/℃)
C C0G -55 ~ +125 0 ± 30
G X8G -55 ~ +150 0 ± 30
4 CAPACITANCE CODE
Capacitance expressed in ㎊. 2 significant digits plus number of zeros. For Values <10㎊, Letter R denotes decimal point
example) 106=10×106=10,000,000㎊ example) 1R5 =1.5㎊
Part Numbering
Series Nominal Capcitance
E-3 1.0 2.2 4.7
E-6 1.0 1.5 2.2 3.3 4.7 6.8
E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
E-24
1.1 1.3 1.6 2.0 2.4 3.0 3.6 4.3 5.1 6.2 7.5 9.1
7 THICKNESS CODE
Size Code Size Code
Code Thickness Tolerance Code Thickness Tolerance
(inch/mm) (inch/mm)
01005/0402 2 0.20 ±0.02 C 0.85 ±0.10*
0201/0603 3 0.30 ±0.03 9 0.90 ±0.10*
3 0.30 ±0.03* F 1.25 ±0.20
0402/1005
5 0.50 ±0.05 S 1.35 ±0.15*
5 0.50 +0.0/-0.1* 1210/3225 H 1.60 ±0.20
0603/1608
8 0.80 ±0.10 U 1.80 ±0.20*
A 0.65 ±0.10 I 2.00 ±0.20
C 0.85 ±0.10* J 2.50 ±0.20
C 0.85 ±0.10 V 2.50 ±0.30
0805/2012 M 1.15 ±0.10 F 1.25 ±0.20
F 1.25 ±0.10 1808/4520 G 1.40 ±0.20
Q 1.25 ±0.15 I 2.00 ±0.20
Y 1.25 ±0.20 F 1.25 ±0.20
C 0.85 ±0.15 H 1.60 ±0.20
C 0.85 ±0.10* 1812/4532 I 2.00 ±0.20
E 1.10 ±0.15 J 2.50 ±0.20
E 1.10 ±0.10* L 3.20 ±0.30
1206/3216
P 1.15 ±0.10* H 1.60 ±0.20
M 1.15 ±0.15 I 2.00 ±0.20
2220/5750
F 1.25 ±0.15 J 2.50 ±0.20
H 1.6 ±0.20 L 3.20 ±0.30
* Mark is only applicable to “L”,”Y”,”F”, 12th code in part number.
Part Numbering
8 INNER ELECTRODE/TERMINATION/PLATING CODE
Code Thickness division Inner electrode Termination Plating material
N Normal Ni Cu Ni / Sn _100%
G Normal Cu Cu Ni / Sn _100%
S Normal Ni Metal Epoxy Ni / Sn _100%
C Normal Ni Control Code Ni / Sn _100%
L Low profile Ni Cu Ni / Sn _100%
Y Low profile Ni Metal Epoxy Ni / Sn _100%
Z Normal Ni Metal Epoxy Ni / Sn _100%
F Low profile Ni Metal Epoxy Ni / Sn _100%
10 CONTROL CODE
N= Reserved for future use
11 PACKAGING CODE
Cardboard Tape (paper) Embossed Tape (plastic)
High Temp Load Max. Temp, Max. Temp, Max. Temp, Max. Temp,
Test 1.0Vr, 1000h 1.5Vr, 1000h 1.5Vr, 1000h 2Vr, 1000h
* 1. The part marked ‘derating’ is less than 150% of rated voltage in the durability and operational life test.
* 2. perform 2mm bending outgoing test.
* 3. Some of the parts are applicable in rated voltage × 150% or × 120%. Please refer to individual specifications.
* 4. Some of parts are 3mm bending guaranteed. Please refer to individual specifications.
Features
A Normal MLCC temporarily charges and reduces noise in electronic circuits, and is the most broadly available chip-type capacitor.
The product line allows realization of various sizes and a wide range of capacitance.
It also has the structural capacity to mount chips on a PCB at a high speed.
❶ Ceramic Body
❷ Electrode (Ni/Cu*)
Wide Selection of Size & Wide Capacitance Range
❸ Plating (Ni) Products offered with various sizes and a wide range of capacities
❹ Termination
(Cu or Cu+Metal Epoxy) Excellent DC Bias Characteristics
⑤ Plating (Sn) Capacitor with Excellent DC Bias Characteristics
Application
Smart Phone, PC, HDD/SSD Board, Tablet, Display, Game Machine, DC-DC Converter
W
L
Dimension (mm)
Size Code EIA (inch)
L W T BW
02 0.40±0.02 0.20±0.02 0.20±0.02 0.1±0.03 01005
05025 0.50±0.025 0.25±0.025 0.25±0.025 0.13±0.04 015008
0.60±0.03 0.30±0.03 0.30±0.03
0.60±0.05 0.30±0.05 0.30±0.05
03 0.15±0.05 0201
0.60±0.09 0.30±0.09 0.50±0.05
0.60±0.09 0.30±0.09 0.30±0.09
1.00±0.05 0.50±0.05 0.50±0.05
1.00±0.05 0.50±0.05 0.30±0.03
1.00±0.05 0.50±0.05 0.20±0.02
1.00±0.07 0.50±0.07 0.50±0.07
1.00±0.10 0.50±0.10 0.50±0.10
1.00±0.10 0.50±0.10 0.30±0.03
05 1.00±0.15 0.50±0.15 0.50±0.15 0.25±0.10 0402
1.00±0.15 0.50±0.15 0.30±0.03
1.00±0.20 0.50±0.20 0.50±0.20
1.00±0.20 0.50±0.25 0.70±0.10
1.00±0.20 0.50±0.20 0.60±0.20
1.00±0.20 0.50±0.20 0.50±0.05
1.15±0.05 0.70±0.05 0.70±0.05
Normal Capacitors_Standard
Dimension (mm)
Size Code EIA (inch)
L W T BW
1.60±0.10 0.80±0.10 0.80±0.10
1.60±0.10 0.80±0.10 0.50+0.00/-0.10
1.60±0.15 0.80±0.15 0.80±0.15
1.60±0.20 0.80±0.20 0.80±0.20
1.60±0.20 0.80±0.20 0.80±0.20
1.60±0.20 0.80±0.20 0.70±0.20
10 0.30±0.20 0603
1.60±0.25 0.80±0.25 0.70±0.10
1.60±0.25 0.80±0.25 0.80±0.25
1.60±0.30 0.80±0.30 0.70±0.10
1.60±0.30 0.80±0.30 0.80±0.30
1.60±0.30 0.80±0.30 0.50±0.30
1.80±0.10 1.00±0.10 0.70±0.10
2.00±0.10 1.25±0.10 0.65±0.10
2.00±0.10 1.25±0.10 0.85±0.10
2.00±0.10 1.25±0.10 0.90±0.10
2.00±0.10 1.25±0.10 1.25±0.10
2.00±0.15 1.25±0.15 0.85±0.10
2.00±0.15 1.25±0.15 1.25±0.15
21 0.5+0.2/-0.3 0805
2.00±0.20 1.25±0.20 0.70±0.10
2.00±0.20 1.25±0.20 0.80±0.10
2.00±0.20 1.25±0.20 0.85±0.10
2.00±0.20 1.25±0.20 0.90±0.10
2.00±0.20 1.25±0.20 1.10±0.10
2.00±0.20 1.25±0.20 1.25±0.20
3.20±0.15 1.60±0.15 0.85±0.15
3.20±0.15 1.60±0.15 1.25±0.15
3.20±0.20 1.60±0.20 0.85±0.10
31 3.20±0.20 1.60±0.20 0.90±0.10 0.50±0.30 1206
3.20±0.20 1.60±0.20 1.15±0.10
3.20±0.20 1.60±0.20 1.15±0.15
3.20±0.20 1.60±0.20 1.60±0.20
3.20±0.30 2.50±0.20 0.85±0.10
3.20±0.30 2.50±0.20 1.25±0.20
3.20±0.30 2.50±0.20 1.35±0.15
3.20±0.30 2.50±0.20 1.40±0.20
3.20±0.30 2.50±0.20 1.60±0.10
32 3.20±0.30 2.50±0.20 1.60±0.20 0.60±0.30 1210
3.20±0.30 2.50±0.20 1.80±0.20
3.20±0.30 2.50±0.20 2.50±0.20
3.20±0.30 2.50±0.20 2.00±0.20
3.20±0.40 2.50±0.30 2.50±0.20
3.20±0.40 2.50±0.30 2.50±0.30
43 4.50±0.40 3.20±0.30 1.60±0.20 0.80±0.30 1812
Normal Capacitors_Standard
Capacitance Table (C0G)
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
16 0.2pF - 56pF
008004/0201
25 0.2pF - 56pF
6.3 100pF - 100pF
10 150pF - 150pF
01005/0402 16 8.2pF - 150pF
25 1pF - 220pF
50 100pF - 100pF
25 0.2pF - 100pF
0201/0603 50 1pF - 100pF
100 100pF - 100pF
16 100pF - 1nF
25 20pF - 1nF
0402/1005
50 1pF - 4.7nF
100 12pF - 1nF
16 1nF - 2.2nF
25 560pF - 4.7nF
50 4.7pF - 5.6nF
0603/1608
100 10pF - 3.9nF
200 220pF - 220pF
250 470pF - 470pF
C0G
Normal 25 3.3nF - 10nF
(125℃)
50 10pF - 15nF
0805/2012 100 12pF - 3.9nF
200 18pF - 1nF
250 1nF - 10nF
16 15nF - 120nF
25 10nF - 100nF
50 10pF - 47nF
100 20pF - 22nF
200 220pF - 1nF
1206/3216
250 2.2nF - 22nF
500 10pF - 2.2nF
630 10pF - 10nF
1000 10pF - 1nF
2000 15pF - 100pF
25 10nF - 10nF
50 1.8nF - 22nF
100 33nF - 47nF
1210/3225
500 680pF - 1.8nF
630 1.8nF - 33nF
2000 100pF - 100pF
Normal Capacitors_Standard
Capacitance Table (X5R)
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
Normal Capacitors_Standard
Capacitance Table (X6S)
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
4 100nF - 470nF
01005/0402
6.3 10nF - 10nF
2.5 2.2uF - 2.2uF
4 1uF - 2.2uF
0201/0603 6.3 100nF - 470nF
10 100nF - 220nF
25 100nF - 100nF
2.5 2.2uF - 2.2uF
4 2.2uF - 22uF
6.3 1uF - 10uF
0402/1005
10 1uF - 2.2uF
16 1uF - 1uF
25 1uF - 2.2uF
4 10uF - 22uF
6.3 4.7uF - 22uF
10 2.2uF - 10uF
X6S 0603/1608 16 1uF - 10uF
Normal
(105℃) 25 4.7uF - 4.7uF
35 2.2uF - 2.2uF
50 1uF - 1uF
2.5 22uF - 22uF
4 10uF - 47uF
6.3 10uF - 22uF
0805/2012
10 10uF - 10uF
16 2.2uF - 10uF
25 4.7uF - 22uF
4 47uF - 47uF
6.3 22uF - 47uF
1206/3216 10 22uF - 22uF
16 22uF - 22uF
25 10uF - 22uF
6.3 100uF - 100uF
1210/3225 10 47uF - 47uF
16 47uF - 47uF
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
Normal Capacitors_Standard
Capacitance Table (X7R)
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
10 100pF - 1nF
01005/0402
16 330pF - 330pF
6.3 2.2nF - 10nF
10 1nF - 100nF
0201/0603
16 150pF - 10nF
25 120pF - 1.8nF
6.3 100nF - 1uF
10 22nF - 470nF
16 820pF - 220nF
0402/1005
25 560pF - 220nF
50 150pF - 100nF
100 220pF - 220pF
6.3 470nF - 10uF
10 220nF - 2.2uF
16 10nF - 1uF
0603/1608
25 4.7nF - 1uF
50 100pF - 1uF
100 1nF - 100nF
6.3 10uF - 10uF
10 680nF - 10uF
16 100nF - 10uF
25 1nF - 4.7uF
0805/2012
50 100pF - 1uF
100 220pF - 220nF
X7R
200 220pF - 10nF
(125℃)
Normal 250 1nF - 10nF
6.3 10uF - 22uF
10 1.2uF - 22uF
16 330nF - 10uF
25 220nF - 10uF
35 10uF - 10uF
50 220pF - 10uF
100 2.2nF - 2.2uF
1206/3216
200 470pF - 100nF
250 33nF - 100nF
350 33nF - 33nF
500 220pF - 33nF
630 330pF - 33nF
1000 680pF - 2.2nF
2000 1nF - 1nF
6.3 47uF - 47uF
10 10uF - 47uF
16 10uF - 22uF
25 1uF - 22uF
1210/3225 35 10uF - 10uF
50 150nF - 10uF
100 1uF - 2.2uF
250 100nF - 100nF
500 10nF - 10nF
*
X7R(S) 0603/1608 16 10uF - 10uF
(125℃) 0805/2012 25 10uF - 10uF
* X7R(S) = X7R (DC Bias 0.5Vr TCC)
Normal Capacitors_Standard
Capacitance Table (X7S)
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
10 100nF - 100nF
0201/0603
X7S 16 100nF - 100nF
Normal
(125℃) 0603/1608 6.3 10uF - 10uF
0805/2012 25 4.7uF - 4.7uF
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
Normal Capacitors_Standard
Capacitance Table (*X7R(S))
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
*
Normal X7R(S)
0201/0603 25 10uF - 10uF
(Epoxy) (125℃)
* X7R(S) = X7R (DC Bias 0.5Vr TCC)
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
Normal X7S
1206/3216 100 4.7uF - 4.7uF
(Epoxy) (125℃)
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 008004/0201
Normal Capacitors_Standard
Size Code (inch/mm) : 01005/0402
Normal Capacitors_Standard
Size Code (inch/mm) : 01005/0402
Normal Capacitors_Standard
Size Code (inch/mm) : 0201/0603
Normal Capacitors_Standard
Size Code (inch/mm) : 0402/1005
Normal Capacitors_Standard
Size Code (inch/mm) : 0402/1005
Normal Capacitors_Standard
Size Code (inch/mm) : 0402/1005
Normal Capacitors_Standard
Size Code (inch/mm) : 0603/1608
Normal Capacitors_Standard
Size Code (inch/mm) : 0603/1608
Normal Capacitors_Standard
Size Code (inch/mm) : 0603/1608
Normal Capacitors_Standard
Size Code (inch/mm) : 0805/2012
Normal Capacitors_Standard
Size Code (inch/mm) : 0805/2012
Normal Capacitors_Standard
Size Code (inch/mm) : 0805/2012
Normal Capacitors_Standard
Size Code (inch/mm) : 1206/3216
Normal Capacitors_Standard
Size Code (inch/mm) : 1206/3216
Normal Capacitors_Standard
Size Code (inch/mm) : 1206/3216
Normal Capacitors_Standard
Size Code (inch/mm) : 1206/3216
Normal Capacitors_Standard
Size Code (inch/mm) : 1210/3225
Normal Capacitors_Standard
Size Code (inch/mm) : 015008/0502
Normal Capacitors_Standard
Size Code (inch/mm) : 0201/0603
Normal Capacitors_Standard
Size Code (inch/mm) : 0402/1005
Normal Capacitors_Standard
Size Code (inch/mm) : 0402/1005
Normal Capacitors_Standard
Size Code (inch/mm) : 0603/1608
Normal Capacitors_Standard
Size Code (inch/mm) : 0603/1608
Normal Capacitors_Standard
Size Code (inch/mm) : 0805/2012
Normal Capacitors_Standard
Size Code (inch/mm) : 1206/3216
Normal Capacitors_Standard
Size Code (inch/mm) : 1210/3225
Normal Capacitors_Standard
Product Lineup (X6S)
Size Code (inch/mm) : 01005/0402
Normal Capacitors_Standard
Size Code (inch/mm) : 0603/1608
Normal Capacitors_Standard
Size Code (inch/mm) : 1206/3216
Normal Capacitors_Standard
Product Lineup (Y5V)
Size Code (inch/mm) : 0402/1005
Normal Capacitors_Standard
Size Code (inch/mm) : 0805/2012
Normal Capacitors_Standard
Size Code (inch/mm) : 1210/3225
Normal Capacitors_Standard
Size Code (inch/mm) : 0402/1005
Normal Capacitors_Standard
Size Code (inch/mm) : 0402/1005
Normal Capacitors_Standard
Size Code (inch/mm) : 0603/1608
Normal Capacitors_Standard
Size Code (inch/mm) : 0603/1608
Normal Capacitors_Standard
Size Code (inch/mm) : 0603/1608
Normal Capacitors_Standard
Size Code (inch/mm) : 0603/1608
Normal Capacitors_Standard
Size Code (inch/mm) : 0805/2012
Normal Capacitors_Standard
Size Code (inch/mm) : 0805/2012
Normal Capacitors_Standard
Size Code (inch/mm) : 0805/2012
Normal Capacitors_Standard
Size Code (inch/mm) : 0805/2012
Normal Capacitors_Standard
Size Code (inch/mm) : 1206/3216
Normal Capacitors_Standard
Size Code (inch/mm) : 1206/3216
Normal Capacitors_Standard
Size Code (inch/mm) : 1206/3216
Normal Capacitors_Standard
Size Code (inch/mm) : 1206/3216
Normal Capacitors_Standard
Size Code (inch/mm) : 1210/3225
Normal Capacitors_Standard
Product Lineup (X7S)
Size Code (inch/mm) : 0201/0603
Normal Capacitors_Standard
Product Lineup (X7R(S) (DC Bias 0.5vr TCC))
Size Code (inch/mm) : 0603/1608
Features
A High level Ⅰ MLCC is a chip-type capacitor suitable for industrial applicatons, with greater reliability than a general MLCC
In the outgoing inspection, proceed with the bending strength evaluation strengthen.
❶ Ceramic Body
High Level Ⅰ
Improved Reliability
❷ Electrode (Ni/Cu*)
(65℃, 90%RH, 1Vr, 500H)
❸ Plating (Ni)
❹ Termination
High Level Ⅱ
Reinforced Reliability
(Cu or Cu+Metal Epoxy) (85℃, 85%RH, 1Vr, 1000H)
⑤ Plating (Sn)
Application
Server, Network, Base station, Solar Inverter, DC-DC Converter
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
16 0.2pF - 10pF
008004/0201
25 0.2pF - 10pF
6.3 100pF - 100pF
16 10pF - 100pF
01005/0402
25 10pF - 100pF
50 100pF - 100pF
25 0.2pF - 100pF
0201/0603
50 0.5pF - 47pF
16 27pF - 1nF
25 0.1pF - 1nF
0402/1005
50 0.1pF - 1nF
100 12pF - 220pF
16 1nF - 2.2nF
25 560pF - 10nF
50 1pF - 5.6nF
0603/1608
100 1.2pF - 4.7nF
200 220pF - 220pF
250 470pF - 470pF
25 3.3nF - 10nF
50 10pF - 15nF
High C0G
LevelⅠ
100 12pF - 3.9nF
(125℃) 0805/2012
200 18pF - 1nF
250 10pF - 2.2nF
630 10pF - 470pF
16 15nF - 120nF
25 10nF - 100nF
50 10pF - 100nF
100 20pF - 33nF
200 68pF - 1nF
1206/3216
250 2.2nF - 8.2nF
500 10pF - 2.2nF
630 10pF - 10nF
1000 10pF - 1nF
2000 15pF - 100pF
25 10nF - 10nF
50 1.8nF - 22nF
100 33nF - 47nF
1210/3225 500 680pF - 1.8nF
630 8.2nF - 33nF
1000 10nF - 22nF
2000 100pF - 100pF
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
008004/0201 6.3 10nF - 10nF
4 100nF - 100nF
6.3 1nF - 100nF
01005/0402
10 1nF - 10nF
25 10nF - 10nF
4 220nF - 220nF
6.3 2.2nF - 2.2uF
10 1.5nF - 220nF
0201/0603
16 1.2nF - 100nF
25 100pF - 100nF
35 100nF - 100nF
2.5 4.7uF - 4.7uF
4 680nF - 22uF
6.3 1nF - 10uF
10 1nF - 10uF
0402/1005
16 1nF - 2.2uF
25 1nF - 2.2uF
35 1uF - 1uF
50 1nF - 100nF
4 4.7uF - 47uF
6.3 330nF - 22uF
10 150nF - 22uF
0603/1608 16 220nF - 10uF
High X5R 25 100nF - 10uF
LevelⅠ (85℃) 35 1uF - 4.7uF
50 220nF - 2.2uF
2.5 100uF - 100uF
4 22uF - 100uF
6.3 1.5uF - 100uF
10 330nF - 47uF
0805/2012 16 330nF - 22uF
25 470nF - 22uF
35 4.7uF - 4.7uF
50 1uF - 4.7uF
100 18nF - 18nF
4 100uF - 100uF
6.3 4.7uF - 100uF
10 1uF - 100uF
1206/3216 16 680nF - 22uF
25 1uF - 22uF
35 4.7uF - 4.7uF
50 1uF - 10uF
6.3 22uF - 220uF
10 10uF - 100uF
16 4.7uF - 47uF
1210/3225
25 4.7uF - 22uF
35 4.7uF - 10uF
50 1uF - 10uF
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
10 100pF - 1nF
01005/0402
16 330pF - 330pF
6 1.5nF - 10nF
10 330pF - 100nF
0201/0603
16 100pF - 10nF
25 100pF - 10nF
4 1uF - 1uF
6 1nF - 1uF
10 10nF - 470nF
0402/1005
16 820pF - 220nF
25 220pF - 220nF
50 150pF - 100nF
6 220nF - 4.7uF
10 5.6nF - 2.2uF
16 5.6nF - 1uF
0603/1608 25 4.7nF - 1uF
35 470nF - 470nF
50 100pF - 1uF
100 220pF - 100nF
6 2.2uF - 10uF
High X7R
LevelⅠ
10 220nF - 10uF
(125℃)
16 100nF - 10uF
25 1nF - 4.7uF
0805/2012
50 100pF - 2.2uF
100 220pF - 470nF
200 150pF - 10nF
250 1nF - 10nF
6 22uF - 22uF
10 1uF - 22uF
16 220nF - 10uF
25 220nF - 10uF
35 10uF - 10uF
50 220pF - 10uF
100 220pF - 2.2uF
1206/3216
200 470pF - 100nF
250 33nF - 100nF
350 33nF - 33nF
500 220pF - 33nF
630 330pF - 33nF
1000 680pF - 10nF
2000 1nF - 1nF
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
6 47uF - 47uF
10 10uF - 47uF
16 2.2uF - 22uF
25 1uF - 22uF
35 10uF - 10uF
50 150nF - 10uF
X7R
1210/3225 100 220nF - 4.7uF
(125℃)
200 22nF - 22nF
250 100nF - 100nF
500 10nF - 22nF
630 22nF - 47nF
1000 22nF - 22nF
2000 1nF - 1nF
6 100nF - 100nF
0201/0603 10 100nF - 100nF
16 100nF - 100nF
6 1uF - 1uF
0402/1005 10 1uF - 1uF
50 33nF - 100nF
6 1uF - 1uF
10 1uF - 1uF
0603/1608
16 680nF - 4.7uF
High X7S 25 2.2uF - 2.2uF
LevelⅠ (125℃) 16 4.7uF - 10uF
0805/2012 25 2.2uF - 10uF
100 1uF - 1uF
4 47uF - 47uF
1206/3216
25 10uF - 10uF
4 100uF - 100uF
6 100uF - 100uF
1210/3225 25 22uF - 22uF
50 10uF - 10uF
100 4.7uF - 10uF
01005/0402 2 470nF - 470nF
6 220nF - 220nF
0201/0603
10 10nF - 10nF
2 100nF - 220nF
4 10uF - 10uF
0402/1005
10 2.2uF - 2.2uF
X7T
16 2.2uF - 2.2uF
(125℃)
6 4.7uF - 10uF
0603/1608
10 1uF - 10uF
6 22uF - 22uF
0805/2012
10 22uF - 22uF
1206/3216 35 10uF - 10uF
1210/3225 6 22uF - 47uF
Features
A High Level Ⅱ MLCC is a chip-type capacitor designed to be suitable for outdoor industrial applications.
Reliability for moisture resistance and temperature change has been strengthened, and the bending strength characteristic is excellent.
❶ Ceramic Body
High Level Ⅰ
Improved Reliability
❷ Electrode (Ni/Cu*)
(65℃, 90%RH, 1Vr, 500H)
❸ Plating (Ni)
❹ Termination
High Level Ⅱ
Reinforced Reliability
(Cu or Cu+Metal Epoxy) (85℃, 85%RH, 1Vr, 1000H)
⑤ Plating (Sn)
Application
Base station, Solar Inverter, DC-DC Converter
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
0402/1005 50 3.3pF - 1nF
25 1nF - 6.8nF
0603/1608 50 22pF - 3.3nF
100 100pF - 4.7nF
High C0G
LevelⅡ
50 47nF - 100nF
(125℃)
1206/3216 630 10nF - 10nF
1000 680pF - 1nF
630 22nF - 33nF
1210/3225
1000 10nF - 22nF
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
6.3 4.7uF - 4.7uF
10 1uF - 10uF
High X5R 0603/1608
LevelⅡ
16 1uF - 1uF
(85℃)
25 1uF - 1uF
0805/2012 6.3 22uF - 22uF
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
4 47uF - 47uF
0805/2012
High X6S 25 4.7uF - 4.7uF
LevelⅡ (105℃) 1206/3216 6.3 100uF - 100uF
1210/3225 2.5 330uF - 330uF
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
0201/0603 10 100nF - 100nF
25 100nF - 100nF
0402/1005
50 4.7nF - 100nF
10 1uF - 2.2uF
16 1uF - 1uF
High X7R 0603/1608 25 8.2nF - 1uF
LevelⅡ (125℃) 50 270pF - 47nF
100 100nF - 100nF
0805/2012 16 10uF - 10uF
25 10uF - 10uF
1206/3216
50 1uF - 1uF
1210/3225 10 47uF - 47uF
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
T
Lead Frame
Application
Power, DC-DC Converter where bending stress is high and high reliability is necessary.
Specifications
Dimension (mm)
Samsung P/N
L W T E
CL32B225KCDMNWF 3.80±0.10 2.80±0.10 3.35±0.10 0.80±0.15
CL32Y225KCDMNWF 3.80±0.10 2.80±0.10 3.35±0.10 0.80±0.15
Product LineUp
Size Code (inch/mm) : 1210/3225
Features
This can be mounted between the solder balls to deal with thin devices or modules.
In addition it helps remove high-frequency noise, suffering less from external environmental stress.
IC
BW BW
T T
W W
L L
Application
Smart Phone, Wearable Devices, IC Package, Module Products
BW BW
T T
W W
L L
Features
The mechanical stress on the chip can be absorbed by the characteristic of Soft Termination.
① Ni/Sn
❷ Metal/Epoxy Termination
❸ Cu-Term
Application
All Application (Smart Phone, PC, HDD/SSD Board, Tablet, Display, Etc), Power (SMPS, DC-DC Converter), Industrial Application
W
L
X6S
1210/3225 16 47uF - 47uF
(105℃)
16 10uF - 10uF
0805/2012
100 220nF / 1uF
X7S 16 22uF - 22uF
(125℃) 1206/3216 25 22uF - 22uF
100 2.2uF - 4.7uF
1210/3225 100 4.7uF - 10uF
10 220nF - 470nF
0402/1005 16 22nF - 100nF
50 1nF - 15nF
25 100nF - 1uF
0603/1608 50 1nF - 1uF
100 1nF - 1nF
25 1uF - 2.2uF
0805/2012 100 10nF - 220nF
250 1nF / 22nF
6.3 22uF - 22uF
X7R
10 10uF - 22uF
(125℃)
25 4.7uF - 10uF
35 10uF - 10uF
1206/3216
100 1uF - 2.2uF
250 100nF - 100nF
630 1nF - 22nF
1000 1nF - 10nF
50 4.7uF - 10uF
100 2.2uF - 4.7uF
1210/3225
250 220nF - 220nF
1000 22nF - 22nF
X8L
1210/3225 100 4.7uF - 4.7uF
(150℃)
Features
MLCC tremors can occur due to piezoelectric phenomena in electronic devices.
These tremors are transmitted to the substrate, causing the substrate to tremble, causing audible noise (20Hz~20kHz).
Low Acoustic Noise products are a solution that can effectively reduce this noise.
Bottom Cover
Inner Electrode
Substrate
40 40
0402i Chip Capacitor 0805i Chip Capacitor
30 0402i THMC 30 0805i ANSC
20 20
Sound Pressure Level(dBA)
10 10
0 0
-10 -10
-20 -20
-30 -30
0 5 10 15 20 0 5 10 15 20
Frequency(㎑) Frequency(㎑)
Measurement Condition
Height : 3mm
DAQ
System
[Measurement System]
Application
All Application (Smart Phone, PC, HDD/SSD Board, Tablet, Display, Etc), Power (SMPS, DC-DC Converter), Industrial Application
BW
W
L
Features
MLCCs with low equivalent series inductance (ESL) can be used in circuits with limited mounting area,
as a small quantity of such MLCCs can sufficiently replace high-speed IC MLCCs.
High High
Saved
MLCC MLCC MLCC Speed IC Speed IC
Space
(AP) (AP)
1 2
1.E+01
S21
1.E+00 MLCC
Impedance(Ω)
1.E-01
1.E-02 LICC
1.E-03
1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09
Plane
*ESL : Equivalent Series Inductance Frequency(㎒) Connection 3T Cap
Application
All Application (Smart Phone, Wearable Devices, IC Package, PC)
BW
BW
C
W
A B A
L
Dimension (mm)
Size EIA
BW
Code L W T Thkckness Code (inch)
A B C
1.05±0.05 0.65±0.05 0.45±0.05 5 0.17±0.10 0.35±0.10 0.15±0.10
05 1.10±0.15 0.60±0.05 0.60±0.05 6 0.20±0.10 0.35±0.10 0.15±0.10 0402
1.00±0.15 0.50±0.15 0.30±0.09 B 0.20±0.10 0.35±0.10 0.15±0.10
1.20±0.05 0.90±0.05 0.75±0.05 7 0.15±0.10 0.50±0.10 0.20±0.10
19 0503
1.20±0.05 0.90±0.05 0.60±0.05 A 0.15±0.10 0.50±0.10 0.20±0.10
BW
W
SW
Capacitance Table_8T
Capacitance
Size Code Rated Voltage Capacitance
TCC pF nF uF
(inch/mm) (Vdc) Range
0.1 1 10 100 1 10 100 1 10 100
X7S
0603/1608 4 2.2uF - 2.2uF
(125℃)
Capacitance Table_Reverse
Capacitance
Size Code Rated Voltage Capacitance
TCC pF nF uF
(inch/mm) (Vdc) Range
0.1 1 10 100 1 10 100 1 10 100
Application Guide
Smartphone / Tablet
As smartphone has high-performance hardware functions to provide enhanced user experience, various voltage regulators are
required for each IC. Power management system includes several PMICs as well as charging system with external passive components.
4
Proximity Sensor
Application Processor
Finger Print Sensor
1
Core mmWave 5
Display, Touch
Memory 3
(DRAM, NAND) Audio Amp
2
5 Battery Charger
Noise Filtering,
High Bending Middle & High High Freq. Noise,
Stable Power Audible Noise
Strength Freq. Noise Limited Space
Delivery
2 3 10V ↑
4 Low Profile
Application Guide
Laptop
Laptop consist of various form factors and functions by models in consideration of the needs of various customers. In order to
implement those functions, many of such function blocks as Memory, Storage, Wi-Fi, are organically connected around the CPU
module, and require various power sources. In accordance with the recent trend of high performance, miniaturization and sliming of
the sets, passive components are being developed with a focus on high temperature and high capacitance.
Camera
I2C
module
CPU Module
(Core, PCH, GPU)
DDR Memory Wi-Fi
PCIe
module
External
Device
CLK PLL
VDDQ
(USB, HDMI)
VDDSPD
Storage
AUX
iVR
PCIe
VDD
VPP
VTT
(M.2 SSD)
1 2 1 1 1
Voltage Regulator
Charger Battery
4 5
AC-DC Adapter
Noise Filtering,
High Bending Middle & High
Stable Power Audible Noise
Strength Freq. Noise
Delivery
3 4 10V ↑
Application Guide
Server
In recent years, many technologies with upgraded performance, such as high-performance CPU, PCIe 5.0, and DDR5 are being
applied to servers. Since such a high-performance server consumes a large amount of current during operation and generates a lot
of heat to deteriorate the operation environment, high reliability of the components is required. CPU power line consuming a large
amount of currents requires many small-sized and high-capacitance MLCCs to lower the impedance, and the components for high-
temperature in the high-temperature environment around CPU.
Socket
Devices OCP OCP Devices
FPGA
(SSD, GPU) Interface Interface (SSD, GPU)
PCIe
PCIe
PCIe
PCIe
3 3
DIMM (Bank1)
DIMM (Bank2)
DIMM (Bank1)
DIMM (Bank2)
CPU#0 CPU#1
1 2 4 1 2 4
Voltage Regulator
Noise Filtering,
High Bending Middle & High
Stable Power
Strength Freq. Noise
Delivery
1 High C 3 3㎜ ↑ 2 3T, 8T
3 16V ↑
4 High Temp.
(High Level Ⅰ)
Application Guide
Network (Base Station)
RUs are required to be small, light-weight and highly reliable because most of them are exposed to the sunlight being installed on
towers or building roofs. With the introduction of 5G, high-integrated and high-performance FPGA/DSP are being used for network
equipment to cope with the demand of faster data processing speed and to process the data traffic surge. Accordingly, the demand
for high-capacitance MLCCs for stable power supply to high-performance ICs is increasing.
1 2 1 2 3
VSource
VSource
DDR
Hot Swap DSP Hot Swap
4 & Flash 4
DAC PA
RF
Trans
- ceiver
Power I/O Power ADC LNA
FPGA
Converter Switch Converter
to Backhaul
Noise Filtering,
High Bending
Stable Power
Strength
Delivery
1 3 High Volt. 4 3㎜ ↑
1 2 3 High C
3 High Temp.
(High Level Ⅰ)
ClassⅠ
ClassⅠ
Within the specified tolerance
Capaci-
4
ClassⅡ
tance
Within the specified tolerance Capacitance Frequency Voltage
≤1,000㎊ 1㎒±10%
Capacitance ≥30㎊ : Q ≥ 1,000 0.5~5Vrms
Q ClassⅠ < 30㎊ : Q ≥ 400+20×C >1,000㎊ 1㎑±10%
( C : Capacitance )
ClassⅡ
1. Characteristic : A (X5R) Capacitance Frequency Voltage
05J105KP5N3*
[Link] : F (Y5V) 05J105KQ5N3*
03A105MO3NR*
Rated Voltage Spec
10B225KP8*
0.05 max / 0.07 max*
50V / 35V / 25V 21A475KQQ*
/ 0.09 max*
21A106KQQ*
0.07 max / 0.09 max* 21A625KPQ*
16V
/ 0.125 max* 21X106MRC*
10V 0.125 max / 0.16 max* 21X106KQQ*
≤6.3V 0.16 max 21B106KOQ*
You can check the specification at the web site or contact sales people for each product with mark*
C1 : Capacitance at 3
C2 : Capacitance at 125℃
ΔT : 125℃-25℃=100℃
(1) ClassⅡ
Capacitance change shall be calculated from the formula as below
C2-C1
ΔC = × 100(%)
C1
C1 : Capacitance at step 3
C2 : Capacitance at step 2 & step 4
45±1 45±1
Insulation
Within the specified initial value
resistance
Withstand-
No breakdown of dielectric
ing voltage
Appearance No mechanical damage shall occur. The capacitor shall be subjected to a harmonic motion having a total
amplitude of 1.5mm changing frequency from 10Hz to 55Hz and
back to 10Hz in about 1 min.
Capacitance change Capacitance change
ClassⅠ
±2.5% or ±0.25㎊ Repeat this for 2hours each in 3mutually perpendicular
whichever is larger directions.
A(X5R)
Within ±5%
Capacitance B(X7R)
ClassⅡ
X(X6S)
Vibration Y(X7S) Within ±10%
11
test Z(X7T)
F(Y5V) Within ±20%
Insulation
Within the specified initial value
resistance
Temperature : 40±2℃
Capacitance change Capacitance change Humidity : 90~95%RH
ClassⅠ
±7.5% or ±0.75㎊ Duration time : 500+12/-0Hr.
whichever is larger Charge/Discharge current : 50㎃ max.
A(X5R)
Capacitance B(X7R) Perform the initial measurement according to Note1.
Perform the final measurement according to Note2.
ClassⅡ
X(X6S) Within ±12.5%
Y(X7S)
Z(X7T) This test is only applied to Vr≤500V products.
F(Y5V) ±30% You can check the specification at the web site or contact
sales people for each product with mark*
1. Capacitance : A (X5R)
Moisture 0.05 max / 0.075 max* (35V / 50V)
12 resis- 0.05 max / 0.075 max* / 0.125
tance max*(16V / 25V)
0.075 max / 0.125 max* (≤10V)
3. Capacitance : F (Y5V)
0.09 max (50V)
0.09 max / 0.125 max* (25V / 35V)
0.09 max / 0.125 max* / 0.16 max*
(16V)
0.16 max / 0.195 max* (10V)
0.195 max (4V / 6.3V)
3. Capacitance : F (Y5V)
0.09 max (50V)
0.09 max / 0.125 max* (25V / 35V)
0.09 max / 0.125 max* / 0.16 max*
(16V)
0.16 max / 0.195 max* (10V)
0.195 max (4V / 6.3V)
1,000㏁min. or 50㏁·㎌min.
Insulation
product whichever is smaller /
resistance
25㏁·㎌or over*
ClassⅠ
±2.5% or ±0.25㎊ 1 [Link] temp.+0/-3 30
whichever is larger 2 25 2~3
Within 3 [Link] temp.+3/-0 30
A(X5R)
±7.5%/±10%/±15%*
4 25 2~3
Capacitance B(X7R) Within ±7.5%
Tempera- ClassⅡ X(X6S)
14 ture Y(X7S) Within ±15%
Leave the capacitor in ambient condition for specified time
cycle before measurement.
* 24±2 Hours (ClassⅠ)
Z(X7T)
Insulation
Within the specified initial value
resistance
1. CLASSⅠ
Leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement.
2. CLASSⅡ
Perform the heat treatment at 150℃ +0/-10℃ for 1 hour. Then Leave the capacitor in ambient condition for 24±2 hours before measurement.
Then perform the measurement.
Note 4. Camera Strobe Circuit Capacitors Should be Following a Special Reliability Test Condition.
Please check with our sales representatives or product engineers.
Packaging Specifications
Packaging
This specification applies to taping of MLCC.
When customers require, the specification may be changed under the agreement.
1 Figure
Carrier tape
Reel
Empty section
Empty section 200mm Chip mounting section Minimum 280mm Leading section 240mm
End Start
Unreeling
* The chip is only use for identifying the label and packaged products. Please don't use the chip.
2 Quantity
(Unit : pcs)
Packaging Specifications
3 Tape Size
I. Cardboard(Paper) tape : 4mm pitch
Feeding Hole
Chip inserting Hole
D
A
F
W
B
t P0 P2 P1
(Unit : mm)
Size
A B W F E P1 P2 P0 D t
(inch/mm)
0603/ 1.00 1.90
1608 ±0.10 ±0.10
0805/ 1.55 2.30 8.00 3.50 1.75 4.00 2.00 4.00 φ1.50 1.1
2012 ±0.10 ±0.10 ±0.30 ±0.05 ±0.10 ±0.10 ±0.05 ±0.10 +0.10/-0 Below
1206/ 2.05 3.60
3216 ±0.10 ±0.10
※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances.
A
F
W
B
t P0 P2 P1
(Unit : mm)
Size
A B W F E P1 P2 P0 D t
(inch/mm)
01005/ 0.25 0.46 0.25
0402 ±0.02 ±0.02 ±0.02
0201/ 0.38 0.68 0.35
0603 ±0.03 ±0.03 2.00 2.00 ±0.03
8.00 3.50 1.75 ±0.05 ±0.05 4.00 φ1.50
0402/ 0.62 1.12 ±0.30 ±0.05 ±0.10 (1.0± (1.0± ±0.10 +0.1/-0.03 0.60
1005 ±0.05 ±0.05 0.05) 0.05) ±0.05
0.62 1.12
0204/ 0.37
0.05 0.05
0510 ±0.03
/-0.10 /-0.10
※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances.
※ ( ) is based on 1mm pitch paper tape
Packaging Specifications
Ⅲ. Embossed (Plastic) tape
(1) Embossed (Plastic) tape (P1: 4mm pitch ) (2) Embossed (Plastic) tape (P1: 1mm/ 2mm pitch )
Feeding Hole Chip inserting Hole Feeding Hole Chip inserting Hole
D D
E E
A A
F F
t1 W t1 B W
B
t0 P0 P2 P1 t0 P0 P2 P1
(Unit : mm)
Size
A B W F E P1 P2 P0 D t1 t0
(inch/mm)
01005/ 0.23 0.45 4.00 1.80 0.90 1.00 1.00 2.00 φ0.80
0402 ±0.02 ±0.02 ±0.05 ±0.02 ±0.05 ±0.02 ±0.02 ±0.03 ±0.04
0.35 0.50
Below Below
015008/ 0.32 0.58 2.00 φ1.50
05025 ±0.03 ±0.03 ±0.05 0.1/-0.03
0.62 1.12
0204/
0.05 0.05
0510
/-0.10 /-0.10 8.00 3.50 4.00 2.50
±0.30 ±0.05 ±0.10 Below
※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances.
Packaging Specifications
Ⅳ.
Reel Size
E
C
C B
D
t
A W
(Unit : mm)
Ⅱ. Measurement Method
300mm/min
Cover tape
165~180°
Carrier tape
Bottom tape
Unreeling direction
Packaging Specifications
5 BOX package
I. P
ackaging Label
1) Chip size
1) 2) 3) 2) Temperature Characteristics
3) Nominal Capacitance
4) 4) Model Name
5) LOT Number & Reel Number
5) 6) 6) Q’ty
Ⅱ. Box Packaging
1) Double packaging with the paper type of inner box and outer box.
2) Avoid any damages during transportation by car, airplane and ship.
3) Remark information of contents on inner box and outer box
※ If special packaging is required, please contact us.
30±1.0 30±1.0
185±1.0 185±1.0
66±1.0 122±1.0
182±1.0 183±1.0
195±5.0 192±5.0
187±5.0 376±5.0
285±5.0 376±5.0
Packaging Specifications
Ⅳ. 13” Box packaging
30±1.0
336±1.0
340±5.0
336±5.0
66±1.0
330±1.0
339±5.0
6 Chip Weight
Size (L/W) Size (T) Weight
Temp
(inch/mm) (mm) (mg/pc)
0.20 C0G 0.082
※ The weight of product is typical value per size, for more details, please contact us.
Caution/Notice
Product Characteristic data
1 Capacitance
The capacitance is the ratio of the change in an electric charge according to voltage change. Due to the fact that the capacitance
may be subject to change with the measured voltage and frequency, it is highly recommended to measure the capacitance based
on the following conditions.
The following table shows the voltage and frequency condition according to the capacitance range.
[The voltage and frequency condition according to MLCC the capacitance range]
ClassⅠ ClassⅡ
Ⅱ. It is recommended to use measurement equipment with the ALC (Auto Level Control) option.
The reason is that when capacitance or measurement frequency is high, the output voltage of measurement equipment can
be lower than the setting voltage due to the equipment limitation. Note that when capacitance or measurement frequency
is excessively high, the measurement equipment may show ALC off warning and provide a lower output voltage than the
setting voltage even with ALC option selected. It is necessary to ensure the output voltage of measurement equipment is the
same as the setting voltage before measuring capacitance.
Ⅲ. Capacitance value of high dielectric constant (ClassⅡ) MLCC changes with applied AC and DC voltage. Therefore, it is
necessary to take into account MLCC’s AC voltage characteristics and DC-bias voltage characteristics when applying MLCC to
the actual circuit.
2 Tan δ (DF)
I. An ideal MLCC’s energy loss is zero, but real MLCC has dielectric loss and resistance loss of electrode. DF (Dissipation Factor)
is defined as the ratio of loss energy to stored energy and typically being calculated as percentage.
Ⅱ. Quality factor (Q factor) is defined as the ratio of stored energy to loss energy. The equation can be described as 1/
DF. Normally the loss characteristic of ClassⅠ MLCC is presented in Q, since the DF value is so small whereas the loss
characteristic of ClassⅡ MLCC is presented in DF.
Ⅲ. It is recommended to use ClassⅠ MLCC for applications to require good linearity and low loss such as coupling circuit, filter
circuit and time constant circuit.
Caution/Notice
3 Insulation Resistance
Ceramic dielectric has a low leakage current with DC voltage due to the high insulating properties.
Insulation resistance is defined as the ratio of a leakage current to DC voltage.
hen applying DC voltage to MLCC, a charging current and a leakage current flow together at the initial stage of
I. W
measurement.
While the charging current decreases, and insulation resistance (IR) in MLCC is saturated by time.
Therefore, insulation resistance shall be measured 1 minute after applying the rated voltage.
4 Capacitance Aging
The aging characteristic is that the high dielectric (ClassⅡ) MLCC decreases capacitance value over time. It is also necessary to
consider the aging characteristic with voltage and temperature characteristics when ClassⅡ MLCC is used in circuitry.
I. In general, aging causes capacitance to decrease linearly with the log of time as shown in the following graph. Please check
with SEMCO for more details, since the value may vary between different models.
fter heat treatment (150 °C, 1hour), the capacitance decreased by aging is recovered, so aging should be considered again
Ⅱ. A
from the time of heat treatment.
C0G
X7R
X5R
Capacitance Change(%)
Time(h)
* Sample : C0G, X7R, X5R
Caution/Notice
5 Temperature Characteristics of Capacitance (TCC)
Please consider temperature characteristics of capacitance since the electrical characteristics such as capacitance changes which
is caused by a change in ceramic dielectric constant by temperature.
I. It is necessary to check the values specified in section “C. Reliability test Condition–Temperature Characteristics” for the
temperature and capacitance change range of MLCC.
20 20
0 0
-20 -20
ΔC(%)
ΔC(%)
-40 -40
-60 -60
-100 -100
-55 -35 -15 5 25 45 65 85 -55 -35 -15 5 25 45 65 85
Temperature(℃) Temperature(℃)
* Sample : 10uF, Rated voltage 6.3V * Sample : 10uF, Rated voltage 6.3V
Ⅱ. When selecting MLCC, it is necessary to consider the heat characteristics of a system, room temperature and TCC of MLCC,
since the applied temperature may change the capacitance of MLCC.
Ⅲ. In addition, Bias TCC of MLCC should be taken into account when DC voltage is applied to MLCC.
6 Self-heating Temperature
It is necessary to design the system, with considering self-heating generated by the ESR (Equivalent Series Resistance) of MLCC
when AC voltage or pulse voltage is applied to MLCC.
Ⅱ. T
he reliability of MLCC may be affected by MLCC being used 10
in an AC voltage or pulse voltage circuit, even the AC voltage
10㎑
or the pulse voltage is within the range of rated voltage. 100㎑
Therefore, make sure to check the following conditions. 500㎑
1) The surface temperature of MLCC must stay within 1000㎑
the maximum operating temperature after AC or 1
Pulse voltage is applied. 0 1 2 3 4 5
2) The rise in increase by self-heating of MLCC must not Ripple Current(Arms)
exceed 20℃
* Sample : X7R 1uF, Rated voltage 50V
Caution/Notice
7 DC & AC Voltage Characteristics
It is required to consider voltage characteristics in the circuit since the capacitance value of high dielectric constant MLCC (ClassⅡ)
is changed by applied DC & AC voltage.
I. Please ensure the capacitance change is within the allowed operating range of a system. In particular, when high dielectric
constant type MLCC (ClassⅡ) is used in circuit with narrow allowed capacitance tolerance, a system should be designed with
considering DC voltage, temperature characteristics and aging characteristics of MLCC.
Ⅱ. It is necessary to consider the AC voltage characteristics of MLCC and the AC voltage of a system, since the capacitance value
of high dielectric constant type MLCC (ClassⅡ) varies with the applied AC voltage.
20 40
30
0
20
-20
10
ΔC(%)
ΔC(%)
-40 0
-10
-60
-20
-80
-30
-100 -40
0 1 2 3 4 5 6 0.0 0.5 1.0 1.5 2.0
DC Voltage(V) AC Voltage(Vrms)
* Sample : X5R 10uF, Rated voltage 6.3V * Sample : X5R 10uF, Rated voltage 6.3V
Caution/Notice
8 Impedance Characteristic
Electrical impedance (Z) of MLCC is the measurement of the opposition that MLCC presents to a current (I) when a voltage (V) is
applied. It is defined as the ratio of the voltage to the current (Z=V/I).
Impedance extends the concept of resistance to AC circuits and is a complex number consisting of the real part of resistance (R)
and the imaginary part of reactance (X) as Z=R+jX.
Therefore, it is required to design circuit with consideration of the impedance characteristics of MLCC based on the frequency
(Z=R+jX)
I. MLCC operates as a capacitor in the low frequency and its reactance (XC) decreases as frequency increases ( X_C=1/j2πfC )
where f is frequency and C is capacitance.
The resistance (ESR; Equivalent Series Resistance) of MLCC in the low frequency mainly comes from the loss of its dielectric
material.
Caution/Notice
Electrical & Mechanical Caution
1 Derating
MLCC with the test voltage at 100% of the rated voltage in the high temperature resistance test are labeled as “derated MLCC.”
For this type of MLCC, the voltage and temperature should be derated as shown in the following graph for the equivalent life
time of a normal MLCC with the test voltage at 150% of the rated voltage in the high temperature resistance test.
Temperature of MLCC(℃)
2 Applied Voltage
The actual applied voltage on MLCC should not exceed the rated voltage set in the specifications.
For DC voltage or DC+AC voltage, DC voltage or the maximum value of DC + AC voltage should not exceed the rated
voltage of MLCC.
For AC voltage or pulse voltage, the peak-to-peak value of AC voltage or pulse voltage should not exceed the rated voltage
of MLCC.
Abnormal voltage such as surge voltage, static electricity should not exceed the rated voltage of MLCC.
Voltage
Voltage
Voltage
Voltage
VMax
VMax 0 VMax
Time VMax VMax
Caution/Notice
Ⅱ.
Effect of EOS (Electrical Overstress)
Electrical Overstress such as a surge voltage or EOS can cause damages to MLCC, resulting in the electrical short failure
caused by the dielectric breakdown in MLCC.
Down time of MLCC is varied with the applied voltage and the room temperature and a dielectric shock caused by EOS can
accelerate heating on the dielectric. Therefore, it can bring about a failure of MLCC in a market at the early stage.
Please use caution not to apply excessive electrical overstress including spike voltage MLCC when preparing MLCC for
testing or evaluating.
(1) Surge
When the overcurrent caused by surge is applied to MLCC, the influx of current into MLCC can induce the overshooting
phenomenon of voltage as shown in the graph below and result in the electrical short failure in MLCC. Therefore, it is
necessary to be careful to prevent the influx of surge current into MLCC.
1000
Voltage of Surge(21 Vmax)
High Stress
for low cap. MLCC
Measured Voltage of MLCC 100
Voltage of MLCC(V)
(53 Vmax)
10
(ESD 8kV)
Voltage
1 Voltage
Voltage of MLCC is higher than by ESD
Surge voltage by overshooting 0.1
0.01
0.001 0.01 0.1 1 10 100
Time Capacitance(㎌)
3 Vibration
Please check the types of vibration and shock, and the status of resonance. Manage. MLCC not to generate resonance and avoid
any kind of impact to terminals. When MLCC is used in a vibration environment, please make sure to contact us for the situation
and consider special MLCC such as Soft-term, etc.
4 Shock
Mechanical stress caused by a drop may cause damages to a dielectric or a crack in MLCC. Do not use a dropped MLCC to avoid
any quality and reliability deterioration. When piling up or handling printed circuit boards, do not hit MLCC with the corners of a
PCB to prevent cracks or any other damages to the MLCC.
5 Piezo-electric Phenomenon
MLCC may generate a noise due to vibration at specific frequency when using the high dielectric constant MLCC (ClassⅡ) at AC
or Pulse circuits. MLCC may cause a noise if MLCC is affected by any mechanical vibrations or shocks.
Caution/Notice
Process of Mounting and Soldering
1 Mounting
MLCC with the test voltage at 100% of the rated voltage in the high temperature resistance test are labeled as “derated MLCC.”
For this type of MLCC, the voltage and temperature should be derated as shown in the following graph for the equivalent life
time of a normal MLCC with the test voltage at 150% of the rated voltage in the high temperature resistance test.
I. M
ounting position
It is recommended to locate the major axis of MLCC in parallel to the direction in which the stress is applied.
Ⅱ. C
autions during mounting near the cutout
Please take the following measures to effectively reduce the stress generated from the cutting of PCB. Select the mounting
location shown below, since the mechanical stress is affected by a location and a direction of MLCC mounted near the cutting
line.
Cutting line
Ⅲ. C
autions during mounting near screw
If MLCC is mounted near a screw hole, the board deflection may be occurred by screw torque. Mount MLCC as far from the
screw holes as possible.
Caution/Notice
2 Caution before Mounting
I. It is recommended to store and use MLCC in a reel. Do not re-use MLCC that was isolated from the reel.
Ⅱ. C
heck the capacitance characteristics under actual applied voltage.
Ⅲ. C
heck the mechanical stress when actual process and equipment is in use.
Ⅳ. Check the rated capacitance, rated voltage and other electrical characteristics before assembly. Heat treatment must be done
prior to measurement of capacitance.
Ⅴ. Check the solderability of MLCC that has passed shelf life before use.
Ⅵ. The use of Sn-Zn based solder may deteriorate the reliability of MLCC.
Excessive pressure may cause cracks in MLCC. It is recommended to adjust the nozzle pressure within the maximum value of
300g.f. Additional conditions must be set for both thin film and special purpose MLCC.
Ⅱ. Bending Stress
When using a two-sided substrate, it is required to mount MLCC on one side first before mounting on the other side due to
the bending of the substrate caused by the mounting head.
Support the substrate as shown in the picture below when MLCC is mounted on the other side.
If the substrate is not supported, bending of the substrate may cause cracks in MLCC.
Nozzle
Force
Support Pin
Ⅲ. S
uction nozzle
Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of the nozzle.
This may cause cracks in MLCC due to the excessive force during mounting.
If the mounting claw is worn out, it may cause cracks in MLCC due to the uneven force during positioning.
A regular inspection such as maintenance, monitor and replacement for the suction nozzle and mounting claw should be
conducted.
Caution/Notice
4 Reflow soldering
MLCC is in a direct contact with the dissolved solder during soldering, which may be exposed to potential mechanical stress
caused by the sudden temperature change.
Therefore, MLCC may be contaminated by the location movement and flux.
For the reason, the mounting process must be closely monitored.
Method Classification
Infrared rays
Overall heating Hot plate
VPS(Vapor phase)
Reflow soldering
Air heater
Local heating Laser
Light beam
I. Reflow Profile
Temp.(℃)
260+0/-5°C
within 30 sec.
Soldering Temp.
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Liquidus Temp.217
Preheat Area
Use caution not to exceed the peak temperature (260℃) and time (30sec) as shown.
Pre-heating is necessary for all constituents including the PCB to prevent the mechanical damages on MLCC. The temperature
difference between the PCB and the component surface must be kept to the minimum.
As for reflow soldering, it is recommended to keep the number of reflow soldering to less than three times. Please check with
us when the number of reflow soldering needs to exceed three times. Care must be exercised especially for the ultra-small
size, thin film and high capacitance MLCC as they can be affected by thermal stress more easily.
Caution/Notice
Ⅱ.
Reflow temperature
The following quality problem may occur when MLCC is mounted with a lower temperature than the reflow temperature
recommended by a solder manufacturer. The specified peak temperature must be maintained after taking into consideration
the factors such as the placement of peripheral constituent and the reflow temperature.
Solder voids
Ⅲ.
Cooling
Overly the thick application of solder pastes results in an excessive solder fillet height.
This makes MLCC more vulnerable to the mechanical and thermal stress from the board, which may cause cracks in MLCC.
Too little solder paste results in a lack of the adhesive strength, which may cause MLCC to isolate from PCB
It is required to design a PCB with consideration of a solder land pattern and its size to apply an appropriate amount of
solder to MLCC. The amount of the solder at the edge may impact directly on cracks in MLCC.
The design of a suitable solder land is necessary since the more the solder amount is, the larger the force MLCC experiences
and the higher the chance MLCC cracks.
Caution/Notice
5 Flow soldering
I. Flow profile
Temp.(°C)
Soldering Temp.
Preheat Area
ΔT≤150°C
Gradual cooling
in the air
Preheat [Link].120
Take caution not to exceed peak temperature (260℃) and time (5sec) as shown.
Please contact us before use the type of high capacitance and thin film MLCC for some exceptions that may be caused.
Ⅱ.
Caution before Flow soldering
When a sudden heat is applied to MLCC, the mechanical rigidity of MLCC is deteriorated by the internal deformation
of MLCC. Preheating all the constituents including PCB is required to prevent the mechanical damages on MLCC. The
temperature difference between the solder and the surface of MLCC must be kept to the minimum.
If the flow time is too long or the flow temperature is too high, the adhesive strength with PCB may be deteriorated by the
leaching phenomenon of the outer termination, or the capacitance value may be dropped by weak adhesion between the
internal termination and the outer termination.
Caution/Notice
6 Soldering Iron
Manual soldering can pose a great risk on creating thermal cracks in MLCC. The high temperature soldering iron tip may come
into a direct contact with the ceramic body of MLCC due to the carelessness of an operator. Therefore, the soldering iron must
be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the
tip.
In order to minimize damages on MLCC, preheating MLCC and PCB is necessary.
A hot plate and a hot air type preheater should be used for preheating
Do not cool down MLCC and PCB rapidly after soldering.
Keep the contact time between the outer termination of MLCC and the soldering iron as short as possible. Long soldering
time may cause problems such as adhesion deterioration by the leaching phenomenon of the outer termination.
Variation of Temp. Soldering Temp.(℃) Pre-heating Time(sec) Soldering Time(sec) Cooling Time(sec)
ΔT≤130 300±10℃ max ≥60 ≤4 -
* Control Δ T in the solder iron and preheating temperature.
Ⅱ.
How to use a spot heater
Compared to local heating using a solder iron, heat by a spot heater heats the overall MLCC and the PCB, which is likely to
lessen the thermal shocks.
For a high density PCB, a spot heater can prevent the problem to connect between a solder iron and MLCC directly.
If the distance from the air nozzle outlet to MLCC is too close, MLCC may be cracked due to the thermal stress. Follow the
conditions set in the table below to prevent this problem.
The spot heater application angle as shown in the figure is recommended to create a suitable solder fillet shape.
In case that heat of higher than 350℃ is applied to MLCC containing epoxy material, the epoxy material in MLCC may be
damaged by heat.
Distance ≥ 5㎜
e
45°
Application Time ≤ 10s
Caution/Notice
Ⅲ.
Cautions for re-work
7 Cleaning
I. In general, cleaning is unnecessary if rosin flux is used.
When acidic flux is used strongly, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the
performance of MLCC.
This means that the cleansing solution must be carefully selected and should always be new.
Ⅱ.
Cautions for cleaning
MLCC or solder joint may be cracked with the vibration of PCB, if ultrasonic vibration is too strong during cleaning. When
high pressure cleaning equipment is used, test should be done for the cleaning equipment and its process before the cleaning
in order to avoid damages on MLCC.
Watch for PCB bending caused by the pressure of a test-probe or other equipment.
If the PCB is bent by the force from the test probe, MLCC may be cracked or the solder joint may be damaged.
Avoid PCB flexing by using the support pin on the back side of the PCB.
Place equipment with the support pin as close to the test-probe as possible.
Prevent shock vibrations of the board when the test-probe contacts a PCB.
Test Pin
Test Pin Test Pin
Caution/Notice
9 Printed Circuit Board Cropping
Do not apply any stress to MLCC such as bending or twisting the board after mounting MLCC on the PCB.
The stress as shown may cause cracks in MLCC when cutting the board.
Cracked MLCC may cause degradation to the insulation resistance, thereby causing short circuit.
[Bending] [Twisting]
The high density board is separated into many individual boards after the completion of soldering.
If the board is bent or deformed during separation, MLCC may be cracked.
Carefully select a separation method that minimizes the deformation of the PCB.
10 Assembly Handling
I. Cautions for PCB handling
Hold the edges of the board mounted with MLCC with both hands since holding with one hand may bend the board.
Do not use dropped boards, which may degrade the quality of MLCC.
Ⅱ.
Mounting other components
Pay attention to the following conditions when mounting other components on the back side of The board after MLCC has
been mounted on the front side.
When the suction nozzle is placed too close to the board, board deflection stress may be applied to MLCC on the back side,
resulting in cracks in MLCC.
Check if proper value is set on each chip mounter for a suction location, a mounting gap and a suction gap by the thickness
of components.
Nozzle
Force
Caution/Notice
Ⅲ.
Board mounting components with leads
If the board is bent when inserting components (transformer, IC, etc.) into it, MLCC or solder joint may be cracked.
Pay attention to the following:
Reduce the stress on the board during insertion by increasing the size of the lead insertion hole.
Insert components with leads into the board after fixing the board with support pins or a dedicated jig.
Support the bottom side of the board to avoid bending the board.
Check the status of the height of each support pin regularly when the support pins are used.
Ⅳ.
Socket and / or connector attach / detach
Since the insertion or removal from sockets and connectors may cause the board to bent, make sure that MLCC mounted on
the board should not be damaged in this process.
Force
When attaching a shield on a board, the board may be bent during a screw tightening work.
Caution/Notice
11 Adhesive selection
Pay attention to the following if an adhesive is used to position MLCC on the board before soldering.
They must have enough adhesive strength to prevent MLCC from slipping or moving during the handling the board.
They must maintain their adhesive strength when exposed to soldering temperatures.
They should be an insulator type that does not affect the characteristic of MLCC.
They should be non-toxic, not harmful, and particularly safe when workers touch the adhesives.
Ⅱ.
Caution before Applying Adhesive
Check the correct application conditions before attaching MLCC to the board with an adhesive.
If the dimension of land, the type of adhesives, the amount of coating, the contact surface areas, the curing temperature, or
other conditions are not appropriate, it may degrade the MLCC performance.
Ⅲ.
Cautions for selecting Adhesive
Depending on the type of the chosen adhesive, MLCC insulation resistance may be degraded.
In addition, MLCC may be cracked by the difference in contractile stress caused by the different contraction rate between
MLCC and the adhesive.
Ⅳ.
Cautions for the amount of applied adhesive and curing temperature
The inappropriate amount of the adhesive cause the weak adhesive strength, resulting in the mounting defect in MLCC.
Excessive use of the adhesive may cause a soldering defect, loss of electrical connection, incorrect curing, or slippage of a
mounting position, thereby an inflow of the adhesive onto the land section should be avoided.
If the curing temperature is too high or the curing time is too long, the adhesive strength will be degraded. In addition,
oxidation both on the outer termination (Sn) of MLCC and the surface of the board may deteriorate the solderability.
12 Flux
I. The excessive amount of flux generates excessive flux gases which may deteriorate solderability. Therefore, apply the flux thin
and evenly as a whole.
Ⅱ. Flux with a high ratio of halogen may oxidize the outer termination of MLCC, if cleaning is not done properly. Therefore, use
flux with a halogen content of 0.1% max.
Ⅲ. S
trong acidic flux can degrade the MLCC performance.
Ⅳ. C
heck the solder quality of MLCC and the amount of remaining flux surrounding MLCC after the mounting process.
Caution/Notice
13 Coating
I. C
rack caused by Coating
A crack may be caused in the MLCC due to amount of the resin and stress of thermal contraction of the resin during coating
process.
During the coating process, the amount of resin and the stress of thermal contraction of the resin may cause cracks in MLCC.
The difference of thermal expansion coefficient between the coating, or a molding resin may cause destruction, deterioration
of insulation resistance or dielectric breakdown of MLCC such as cracks or detachment, etc.
Ⅱ.
Recommended Coating material
The insulation resistance of MLCC can be deteriorated if a high hygroscopic property resin is used in a high humidity
condition.
Do not use strong acid substances due to the fact that coating materials inducing a family of halogen substances and
organic acid may corrode MLCC.
Design
1 Circuit design
When the board is dropped or bent, MLCC mounted on the board may be short-circuited by the drop in insulation resistance.
Therefore, it is required to install safety equipment such as a fuse to prevent additional accidents when MLCC is short-circuited,
otherwise, electric short and fire may occur. This product is not a safety guaranteed product..
2 PCB Design
I. Unlike lead type components, SMD type components that are designed to be mounted directly on the board are fragile to the
stress. In addition, they are more sensitive to mechanical and thermal stress than lead type components.
Ⅱ.
MLCC crack by PCB material type
A great difference of the thermal expansion coefficient between PCB and MLCC causes thermal expansion and contraction,
resulting in cracks in MLCC. Even though MLCC is mounted on a board with a fluorine resin or on a single-layered glass epoxy,
cracks in MLCC may occur.
Ⅱ. Please
note that the capacitance may differ based on the operating condition of the actual system since Class 2 MLCC
capacitance varies with applied voltage and temperature.
Ⅲ. Surge
resistance must be evaluated since the excessive surge caused by the inductance of the actual system may apply to
MLCC.
Caution/Notice
4 Land dimension
The recommended land dimension is
BW
determined by evaluating the actual SET
and a board. T
a b
Reflow Footprint
Caution/Notice
Flow Footprint
Others
1 Storage environment
I. Recommendation for temperature/humidity
Even taping and packaging materials are designed to endure a long-term storage, they should be stored with a temperature of
0~40°C and an RH of 0~70% otherwise, too high temperatures or humidity may deteriorate the quality of the product rapidly.
As oxidization is accelerated when relative humidity is above 70%RH, the lower the humidity is, the better the solderability is.
As the temperature difference may cause dew condensation during the storage of the product, it is a must to maintain a
temperature control environment.
Ⅱ. Shelf Life
An allowable storage period should be within 6 months from the outgoing date of delivery in consideration of solderability.
As for products in storage over 6 months, please check solderability before use.
Caution/Notice
3 Equipment in operation
I. Do not touch MLCC directly with bare hands to prevent an electric shock or damage.
Ⅱ. The termination of MLCC shall not be contacted with a conductive object (short –circuit). Do not expose MLCC to conductive
liquid containing acidic or alkaline material.
Ⅲ. D
o not use the equipment in the following conditions.
Ⅳ. If the equipment starts generating any smoke, fire or smell, immediately switch it off or unplug from the power source.
If the equipment is not switched off or unplugged, serious damage may occur due to the continuous power supply. Please be
careful with the high temperature in this condition.
4 Waste treatment
In case of scrapping MLCC, it is incinerated or buried by a licensed industrial waste company. When scrapping MLCC, it is
recommended to incinerate or bury the scrappage by a licensed industrial waste company.
5 Operating temperature
The operating temperature limit is determined by the specification of each models.
Ⅱ. T
he surface temperature of MLCC cannot exceed the maximum operating temperature including self-heating effects.
6 Transportation
The performance of MLCC may be affected by transportation conditions.
I. MLCC shall be protected from excessive temperature, humidity and a mechanical force during transportation.
During transportation, the cartons shall not be deformed and the inner packaging shall be protected from excessive external
forces.
Ⅱ. D
o not apply excessive vibrations, shocks or excessive forces to MLCC.
If excessive mechanical shock or stress are applied, MLCC’s ceramic body may crack.
When the surface of MLCC is hit with the sharp edge of an air driver, a soldering iron, or a tweezer, etc, MLCC may crack or
become short-circuited.
Ⅲ. M
LCC may crack and become non-functional due to the excessive shocks or dropping during transportation.
7 Notice
Some special products are excluded from this document.
Please be advised that this is a standard product specification for a reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications, please contact our sales personnel or application engineers.
2 Limitation
Please contact us with usage environment information such as voltage, current, temperature, or other special conditions before
using our products for the applications listed below. The below application conditions require especially high reliability products
to prevent defects that may directly cause damages or loss to third party's life, body or property.
If you have any questions regarding this 'Limitation',you should first contact our sales personnel or application engineers.
① Aerospace/Aviation equipment
② 1wheeler, 2wheeler and 3wheeler vehicle
③ Automotive of Transportation equipment
④ Military equipment
⑤ Atomic energy-related equipment
⑥ Undersea equipment
⑦ Medical equipment
⑧ Disaster prevention/crime prevention equipment
⑨ Power plant control equipment
⑩ Traffic signal equipment
⑪ Data-processing equipment
⑫ Electric heating apparatus,burning equipment
⑬ Safety equipment
⑭ Any other applications with the same as or similar complexity or reliability to the applications
America Asia
San Jose Shenzhen
Samsung Electro Mechanics America Inc. (HQ) Samsung Electro-Mechanics (ShenZhen) Co.,Ltd.(HQ)
3655 N 1st street, San Jose CA 95134, U.S.A. 14F, Tower A, SCC Building, Junction of Houhai Blvd. and Haide 1st Rd., Nanshan
Tel +1-408-544-5454 Dist., Shenzhen City, China.
Tel +86-755-8608-5589
San Diego
Samsung Electro Mechanics America Inc.(San Diego office) Shanghai
5405 Morehouse Drive, Suite #220 San Diego CA 92121 USA Samsung Electro-Mechanics Co.,Ltd. (Shanghai Branch)
Tel +1-858-766-9863 13F Room 1301-1302, Tower B, SOHO Zhongshan Building, No.1065 Zhongshan
West Rd., Changning Dist., Shanghai City, China.
Phoenix Tel +86-21-2501-5803
Samsung Electro Mechanics America Inc.(Phoenix Office)
4505 E Chandler Blvd suite #105, Phoenix, AZ, 85048, U.S.A. Beijing
Tel +1-480-592-0184 Samsung Electro-Mechanics Co.,Ltd. (Beijing Branch)
21F 2101-3, Samsung Tower, Building 1,Yard31, Jinghui Street,Chaoyang Dist,
Detroit Beijing City, China.
Samsung Electro Mechanics America Inc.(Detroit Office) Tel +86-10-5092-8701
27777 Franklin Road Suite 1040 Southfield, MI 48034 USA
Tel +1-248-499-8830 Taipei
Samsung Electro-Mechanics Co.,Ltd. (Taipei Branch)
Austin 9F-1, No.399 Rueykuang Rd., Neihu Dist., Taipei City, Taiwan.
Samsung Electro Mechanics America Inc.(Austin Office) Tel +886-2-2656-8351
710 Hesters Crossing Road Suite 180 Round Rock, TX 78681 USA
Tel +1-480-216-4432 Singapore
Samsung Electro-Mechanics Private Limited(HQ)
3 Church Street Samsung Hub #23-01 Singapore.
Europe Tel +65-6933-2600
Frankfurt Penang
Samsung Electro-Mechanics GmbH. (HQ) Samsung Electro-Mechanics Private Limited(Penang Office)
Koelner Str. 12, 65760 Eschborn, Germany. Unit 9-06, Menara Boustead, 39 Jalan Sultan Ahmad Shah, 10050, Georgetown,
Tel +49-6196-66-3300 Penang, Malaysia.
Tel +60-12-803-7001
Munich
Samsung Electro-Mechanics GmbH. (Munich Office)
New Delhi
Reichenbachstrasse 2, 85737 Ismaning, Germany. Samsung Electro-Mechanics Private Limited(New Delhi Office)
Tel +49-6196-66-7237 Unit No. 606, DLF Tower A, District Center Jasola, New Delhi-110025, India
Tel +91-956-005-0310
Stuttgart
Samsung Electro-Mechanics GmbH. (Stuttgart Office)
Tokyo
Leitzstrasse 45, 70469 Stuttgart, Germany. Samsung Electro-Mechanics Japan Co., Ltd(HQ)
Tel +49-7114-906-6281 Shinagawa Grand Central Tower 9F, 2-16-4, Kounan, Minato-ku, Tokyo, Japan.
Tel +81-3-6369-6461
Helsinki
Samsung Electro-Mechanics GmbH. (Helsinki Office)
Keilaranta 1, 02150 Espoo, Finland.
Tel +35-898-53-1132
Manufacturing Sites
* Suwon (R&D)