Inspired by natural porous architectures, numerous attempts have been made to generate porous structures. Owing to the smooth surfaces, highly interconnected porous architectures, and mathematical controllable geometry features, triply periodic minimal surface (TPMS) is emerging as an outstanding solution to constructing porous structures in recent years. However, many advantages of TPMS are not fully utilized in current research. Critical problems of the process from design, manufacturing to applications need further systematic and integrated discussions. In this work, a comprehensive overview of TPMS porous structures is provided. In order to generate the digital models of TPMS, the geometry design algorithms and performance control strategies are introduced according to diverse requirements. Based on that, precise additive manufacturing methods are summarized for fabricating physical TPMS products. Furthermore, actual multidisciplinary applications are presented to clarify the advantages and further potential of TPMS porous structures. Eventually, the existing problems and further research outlooks are discussed.
ISSN: 2631-7990
The International Journal of Extreme Manufacturing is a multidisciplinary journal uniquely covering the areas related to extreme manufacturing. The journal is devoted to publishing articles of the highest quality and significance to pushing the limits of scales, precision, performance and environments in manufacturing.
- The following article is Open accessTriply periodic minimal surface (TPMS) porous structures: from multi-scale design, precise additive manufacturing to multidisciplinary applications
Jiawei Feng et al 2022 Int. J. Extrem. Manuf. 4 022001
View article, Triply periodic minimal surface (TPMS) porous structures: from multi-scale design, precise additive manufacturing to multidisciplinary applicationsPDF, Triply periodic minimal surface (TPMS) porous structures: from multi-scale design, precise additive manufacturing to multidisciplinary applications - The following article is Open accessA comprehensive review on microchannel heat sinks for electronics cooling
Zhi-Qiang Yu et al 2024 Int. J. Extrem. Manuf. 6 022005
View article, A comprehensive review on microchannel heat sinks for electronics coolingPDF, A comprehensive review on microchannel heat sinks for electronics coolingThe heat generation of electronic devices is increasing dramatically, which causes a serious bottleneck in the thermal management of electronics, and overheating will result in performance deterioration and even device damage. With the development of micro-machining technologies, the microchannel heat sink (MCHS) has become one of the best ways to remove the considerable amount of heat generated by high-power electronics. It has the advantages of large specific surface area, small size, coolant saving and high heat transfer coefficient. This paper comprehensively takes an overview of the research progress in MCHSs and generalizes the hotspots and bottlenecks of this area. The heat transfer mechanisms and performances of different channel structures, coolants, channel materials and some other influencing factors are reviewed. Additionally, this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer. The comprehensive review is expected to provide a theoretical reference and technical guidance for further research and application of MCHSs in the future.
Highlights
The studies on microchannel heat sinks for electronics cooling are reviewed comprehensively.
The main research areas of interest for microchannel heat sinks are classified.
The studies on both single-phase and phase-change flow cooling are reviewed.
The characteristics, application conditions and shortcomings of microchannel heat sinks with different structures, working fluids, materials and some other influencing factors are introduced.
The prospects for and development trends of microchannel heat sinks are revealed based on the overall review and analysis.
- The following article is Open accessOptical wafer defect inspection at the 10 nm technology node and beyond
Jinlong Zhu et al 2022 Int. J. Extrem. Manuf. 4 032001
View article, Optical wafer defect inspection at the 10 nm technology node and beyondPDF, Optical wafer defect inspection at the 10 nm technology node and beyondThe growing demand for electronic devices, smart devices, and the Internet of Things constitutes the primary driving force for marching down the path of decreased critical dimension and increased circuit intricacy of integrated circuits. However, as sub-10 nm high-volume manufacturing is becoming the mainstream, there is greater awareness that defects introduced by original equipment manufacturer components impact yield and manufacturing costs. The identification, positioning, and classification of these defects, including random particles and systematic defects, are becoming more and more challenging at the 10 nm node and beyond. Very recently, the combination of conventional optical defect inspection with emerging techniques such as nanophotonics, optical vortices, computational imaging, quantitative phase imaging, and deep learning is giving the field a new possibility. Hence, it is extremely necessary to make a thorough review for disclosing new perspectives and exciting trends, on the foundation of former great reviews in the field of defect inspection methods. In this article, we give a comprehensive review of the emerging topics in the past decade with a focus on three specific areas: (a) the defect detectability evaluation, (b) the diverse optical inspection systems, and (c) the post-processing algorithms. We hope, this work can be of importance to both new entrants in the field and people who are seeking to use it in interdisciplinary work.
- The following article is Open accessHeterogeneous material 3D printing: from multi-material integration to spatiotemporal functionality programming
Xueli Zhou et al 2026 Int. J. Extrem. Manuf. 8 062001
View article, Heterogeneous material 3D printing: from multi-material integration to spatiotemporal functionality programmingPDF, Heterogeneous material 3D printing: from multi-material integration to spatiotemporal functionality programmingHeterogeneous material 3D printing (HM3DP) represents a transformative approach in additive manufacturing, enabling precise spatial control over material composition, microstructure, and functionality. This technology transcends the limitations of homogeneous fabrication by integrating multi-material systems, dynamic process programming, and external field modulation, offering innovative solutions for biomimetic structures, flexible electronics, and smart devices. This review systematically examines the chemical foundations, process innovations, and applications of HM3DP and proposes a three-tier classification system—composition, structure, and functional–temporal heterogeneity—to standardize evaluation metrics. Key challenges, including dynamic interface compatibility, cross-scale heterogeneous mechanical integrity and fracture control, and functional–temporal synergy, are critically analyzed. Future directions emphasize multi-physics collaboration and intelligent optimization to achieve adaptive, high-performance heterogeneous systems. HM3DP is poised to bridge the gap between static manufacturing and dynamic, intelligent design, unlocking new frontiers in materials science and engineering.
Highlights
Heterogeneous 3D printing enables precise control of material composition and functionality.
Dynamic interface chemistry enhances material adaptability and long-term stability.
Cross-scale regulation bridges nanoscale fillers to macroscale structures.
Functional-temporal synergy supports smart devices and 4D printing applications.
- The following article is Open accessAdvances in personalised wearable heating and cooling technologies
Hongxu Guo et al 2026 Int. J. Extrem. Manuf. 8 042010
View article, Advances in personalised wearable heating and cooling technologiesPDF, Advances in personalised wearable heating and cooling technologiesMaintaining thermal comfort is vital for human health, productivity and overall well-being. Conventional heating, ventilation and air-conditioning (HVAC) systems, while effective, are energy-intensive and poorly tailored to individual physiology. Wearable personalized heating and cooling technologies offer a complementary route by providing targeted, skin-level thermal regulation that can reduce the load on ambient HVAC and enable local comfort control. This review presents a mechanistic and quantitative overview of wearable thermal management (WTM) technologies, organized into active, passive and hybrid systems. Representative active devices based on Joule heating and thermoelectric (TE) modules deliver local skin cooling of approximately 5–11 °C (and up to ∼16 °C in clinical fever scenarios) and heating increases of 10–40 °C above ambient temperature, typically at sub-watt to few-watt power levels. Passive approaches employing bio-based phase change materials (PCMs, latent heat on the order of 100–200 J·g−1), insulative aerogels and radiative cooling (RC) textiles achieve 3–10 °C cooling relative to conventional fabrics without external power. Hybrid strategies combine these elements to extend comfort duration and broaden the operating envelope while moderating energy consumption. Furthermore, this review highlights advances in smart materials for WTM, including bio-based and encapsulated PCMs, positive temperature coefficient (PTC) composites for self-regulating heating, high-conductivity graphene and MXene-based films, flexible TE modules and bio-inspired textiles. A particular emphasis is placed on emerging intelligent control paradigms, where physiological sensing, artificial intelligence (AI)-driven comfort models and neuromorphic thermal circuits enable predictive, low-power and user-specific regulation. Applications span medical thermotherapy and fever management, protection in extreme occupational environments, athletic performance and recovery, immersive virtual/augmented reality (VR/AR) and everyday comfort. Finally, the review outlines key commercialization pathways and current challenges, including textile-compatible manufacturing (weaving, coating and printing), requirements for breathability, washability and long-term durability, and the need for standardized testing and regulatory frameworks. These perspectives define concrete milestones for translating laboratory prototypes into safe, sustainable and scalable WTM products.
Highlights
Comprehensively reviews active, passive, and hybrid strategies for wearable personalized thermal management.
Highlights self-regulating positive temperature coefficient materials and bio-based phase change systems for safe, sustainable heating and cooling.
Examines integration of thermoelectric, radiative, and adaptive textile technologies for multifunctional comfort control.
Identifies challenges in durability, scalability, and energy efficiency, and outlines future directions toward neuromorphic, intelligent thermal wearables.
- The following article is Open accessLiquid metal printing for atomically thin metal-based materials and devices: toward atomic-level manufacturing
Jiaqi He et al 2026 Int. J. Extrem. Manuf. 8 062002
View article, Liquid metal printing for atomically thin metal-based materials and devices: toward atomic-level manufacturingPDF, Liquid metal printing for atomically thin metal-based materials and devices: toward atomic-level manufacturingAtomic-level manufacturing represents the ultimate frontier in materials science, promising unprecedented control over the composition and structure of matter. However, conventional fabrication techniques often face limitations in terms of scalability, energy efficiency, and applicability to non-layered materials. Liquid metal (LM) printing has recently emerged as a disruptive alternative, leveraging the unique physicochemical properties of liquid metals, including high fluidity, self-limiting surface oxidation, and compositional tunability, to synthesize and transfer atomically thin films under ambient conditions. This review provides a comprehensive overview of LM printing for the fabrication of two-dimensional (2D) metal-based materials and devices. We begin by elucidating the fundamental principles of atomic-level manufacturing and the distinctive advantages of liquid metals. We then systematically detail a diverse toolkit of LM printing techniques, including gas injection, laser-assisted, spin-coating, scraping, roller-based, squeeze-printing, and direct touch methods. The synthesis of a broad library of atomically thin materials, encompassing oxides, sulfides, nitrides, and phosphates derived from Ga, In, Sn, Bi, Zn, and their multi-component alloys, is thoroughly reviewed. Furthermore, we explore the integration of these 2D materials into high-performance devices such as transistors, photodetectors, sensors, memristors, and neuromorphic electronics. Finally, we discuss the existing challenges and future outlooks for this burgeoning field, highlighting pathways toward autonomous, scalable, and truly atomic-level manufacturing paradigms.
Highlights
Liquid metal printing enables ambient synthesis of atomically thin films, bypassing the high-temperature and high-vacuum demands of conventional atomic-level manufacturing techniques.
Film composition, thickness, and defect density are precisely controlled through alloy engineering and tailored interfacial chemistry.
A versatile suite of printing strategies is employed to produce a broad range of oxides, sulfides, and nitrides.
The resulting 2D materials are integrated into high-performance transistors, sensors, neuromorphic devices, and more.
- The following article is Open accessAtomic layer deposition of thin films: from a chemistry perspective
Jinxiong Li et al 2023 Int. J. Extrem. Manuf. 5 032003
View article, Atomic layer deposition of thin films: from a chemistry perspectivePDF, Atomic layer deposition of thin films: from a chemistry perspectiveAtomic layer deposition (ALD) has become an indispensable thin-film technology in the contemporary microelectronics industry. The unique self-limited layer-by-layer growth feature of ALD has outstood this technology to deposit highly uniform conformal pinhole-free thin films with angstrom-level thickness control, particularly on 3D topologies. Over the years, the ALD technology has enabled not only the successful downscaling of the microelectronic devices but also numerous novel 3D device structures. As ALD is essentially a variant of chemical vapor deposition, a comprehensive understanding of the involved chemistry is of crucial importance to further develop and utilize this technology. To this end, we, in this review, focus on the surface chemistry and precursor chemistry aspects of ALD. We first review the surface chemistry of the gas–solid ALD reactions and elaborately discuss the associated mechanisms for the film growth; then, we review the ALD precursor chemistry by comparatively discussing the precursors that have been commonly used in the ALD processes; and finally, we selectively present a few newly-emerged applications of ALD in microelectronics, followed by our perspective on the future of the ALD technology.
Highlights
The surface chemistry of the gas–solid ALD reactions is reviewed, and the associated mechanisms are elaborately discussed.
The ALD precursor chemistry is reviewed by comparatively discussing the precursors that have been commonly used.
Newly-emerged applications of ALD in microelectronics are presented.
Future perspectives of the ALD technology are outlined.
- The following article is Open accessPolishing of metallic internal surfaces: technologies, applications, and prospects
Zhen Ma et al 2026 Int. J. Extrem. Manuf. 8 042006
View article, Polishing of metallic internal surfaces: technologies, applications, and prospectsPDF, Polishing of metallic internal surfaces: technologies, applications, and prospectsThe surface quality of metallic internal structures is critical to the performance and reliability of high-end components in fields such as aerospace and biomedical engineering. However, the inherent geometric complexity and limited accessibility of these surfaces pose persistent challenges to polishing. Although recent advances have enriched available techniques, their application remains fragmented, lacking a coherent framework that links surface characteristics, forming processes, and industrial requirements. This review proposes a classification system for internal surfaces and matches appropriate polishing methods to each type, emphasizing their industrial application status. It concludes by outlining future directions aimed at bridging the gap between laboratory innovations and practical deployment.
Highlights
Abrasive and non-abrasive polishing techniques are summarised and quantitatively compared.
Polishing techniques suitable for various shapes and forming processes are recommended.
Engineering applications and industrial development of metallic internal surface polishing are emphasised.
Challenges and possible solutions for polishing internal surfaces are indicated.
- The following article is Open accessMachine learning-assisted process-structure-property correlation in laser metal additive manufacturing: a critical review
Miao Yu et al 2026 Int. J. Extrem. Manuf. 8 042005
View article, Machine learning-assisted process-structure-property correlation in laser metal additive manufacturing: a critical reviewPDF, Machine learning-assisted process-structure-property correlation in laser metal additive manufacturing: a critical reviewArtificial intelligence provides novel perspectives for laser metal additive manufacturing (LMAM), enhancing precision, efficiency, and structural and process optimization. Machine learning-assisted process–structure–property correlation in additive manufacturing (ML-PSP-AM) presents an effective pathway for structural innovation and performance optimization, leveraging automation and intelligence to address the growing processing demands across industries. This review differs from the existing literature by presenting a multi-scale, PSP-centered analysis of ML applications in LMAM, integrating discussions that span from processing-driven macro-scale formation to meso/micro-scale defect prediction and microstructure–property relationships. By evaluating state-of-the-art ML applications across various AM stages, we identify current limitations, propose targeted strategies, and outline opportunities to improve accuracy, minimize defects, and enhance mechanical properties such as strength and fatigue life. The advancement of ML-assisted AM should focus on breakthroughs from “0 to 1” in application and innovations from “1 to ∞” in algorithms. The realization of ML-PSP-AM represents a transformative yet disruptive integration of manufacturing engineering, artificial intelligence, and materials science, driving significant progress in modern manufacturing technologies.
Highlights
A novel framework links machine learning with process-structure-property in additive manufacturing
A multi-scale review of machine learning applications in additive manufacturing is presented.
Various data from monitoring, simulation, and experiments support machine learning model development.
Future research will focus on the breakthroughs in application and the innovation of algorithms.
- The following article is Open accessAssembly and integration of micro-led displays: a review of transfer methods targeting near-perfect yield
Seong Woo Hong et al 2026 Int. J. Extrem. Manuf. 8 022008
View article, Assembly and integration of micro-led displays: a review of transfer methods targeting near-perfect yieldPDF, Assembly and integration of micro-led displays: a review of transfer methods targeting near-perfect yieldMicro-light-emitting diodes (micro-LEDs) are widely recognized for their superior brightness, efficiency, and durability, offering transformative potential for next-generation displays and emerging applications. However, the path to commercialization remains hindered by a critical barrier: achieving an extremely high production yield. Unlike conventional displays, micro-LED displays require the precise transfer of millions of individual micro-LED chips, even the slightest defects can significantly affect the overall yield. This review focuses on the technological challenges of pushing micro-LED assembly yield to extremely high thresholds of 99.999 99%. We explore six key transfer methods—elastomeric transfer, roll-to-roll printing, electrostatic and electromagnetic assembly, laser transfer, microvacuum assembly, and fluidic self-assembly—and analyze their respective impacts on yield. Recent advancements in each method are discussed, with an emphasis on strategies to overcome yield challenges. By framing yield as the central metric and not as a side concern, this review aims to provide a roadmap for overcoming bottlenecks in micro-LED assembly and enabling industrial-scale deployment.
Highlights
Discussion of the critical role of yield in integration of micro-LED displays.
Review of the latest advancemnets in six key transfer methods for micro-LED.
Analysis of their respective impacts on improving yield in micro-LED assembly.
Outlook on future directions for achieving extremely high manufacturing yield.
- The following article is Open accessMonolithic security primitive integration in self-rectifying memristors for extreme-temperature internet-of-things
Guobin Zhang et al 2026 Int. J. Extrem. Manuf. 8 065508
View article, Monolithic security primitive integration in self-rectifying memristors for extreme-temperature internet-of-thingsPDF, Monolithic security primitive integration in self-rectifying memristors for extreme-temperature internet-of-thingsReliable hardware security primitives that withstand harsh temperatures are essential for the next-generation Internet of Things (IoT) deployed in industrial, automotive, and remote environments, where thermal stress undermines data integrity and device authentication. Conventional silicon-based true random number generators (TRNGs) and physical unclonable functions (PUFs) suffer from catastrophic performance degradation above 85 °C. Here, we address this critical gap with a unified, temperature-agnostic security primitive based on a Pt/HfO2−y/WO3−x/TiN self-rectifying memristor (SRM). The device exhibits exceptional performance across an unprecedented thermal range (from −50 to 150 °C), featuring ultrahigh rectification (>106), nonlinearity (>105), and stable non-volatility with >10-year data retention. By harnessing intrinsic random telegraph noise (RTN) and stochastic conductance decay dynamics, we monolithically integrate TRNG and PUF functionalities on a single 32 × 32 crossbar array. The TRNG demonstrates resilience against machine learning attacks, maintaining near-ideal prediction accuracy at both 150 °C and −50 °C. Simultaneously, the PUF achieves a record-low bit error rate of 1.859 × 10−2% across this 200 °C temperature swing, outperforming all existing silicon-based solutions by a margin greater than 85 °C.Validation against generative adversarial network attacks and tripartite authentication protocols confirms this selector-free, memristor-based approach as a pivotal advancement for secure, scalable hardware security in extreme-temperature IoT systems.
- The following article is Open accessSmart weave revolution: monolithic fiber-integrated circuits for next-generation intelligence
Yao Xiong et al 2026 Int. J. Extrem. Manuf. 8 061506
- The following article is Open accessThree-dimensional hydrogel semiconductors for advanced bioelectronics
Jaebeom Lee et al 2026 Int. J. Extrem. Manuf. 8 061505
- The following article is Open accessResearch progress on specialized processing technologies enhancing triboelectric nanogenerators: mechanisms, performance and applications
Hongwei Li et al 2026 Int. J. Extrem. Manuf. 8 062005
View article, Research progress on specialized processing technologies enhancing triboelectric nanogenerators: mechanisms, performance and applicationsPDF, Research progress on specialized processing technologies enhancing triboelectric nanogenerators: mechanisms, performance and applicationsThe development of highly efficient, stable, and reliable triboelectric nanogenerators (TENGs) is crucial for overcoming bottlenecks in energy conversion efficiency and environmental adaptability. Owing to their high precision, noncontact nature, and cross-scale manufacturing capabilities, specialized processing techniques offer revolutionary approaches for material design, interface engineering, and structural optimization in TENGs. This review systematically analyzes the core mechanisms and performance enhancement pathways of six specialized processing techniques (laser processing, 3D printing, deposition techniques, plasma technology, electrospinning, and nanoimprinting) within TENGs. This highlights how these techniques synergistically address the inherent theoretical limitations of TENGs by precisely modulating surface topography (enhancing charge density), optimizing interfacial structures (facilitating charge migration), constructing functional layers (prolonging charge retention), and reinforcing encapsulation (mitigating environmental interference). Furthermore, we explore the applications of high-performance TENGs in energy harvesting, self-powered system integration, and sensing across natural, biomechanical, industrial, and medical domains, emphasizing their potential for creating sustainable, self-driven energy networks. The paper concludes by discussing current challenges and future development directions for TENG technology, offering insights for technological breakthroughs and practical implementation.
Highlights
Systematically reviews six specialized processing techniques for enhancing TENG performance.
Establishes a material–structure–performance synergy framework for multiscale design.
Demonstrates breakthroughs in advanced processing in TENG energy harvesting and sensing.
Identifies sustainable directions including AI-assisted fabrication and green materials.
Provides cross-scale strategies and theoretical guidance for TENG industrialization.
- The following article is Open accessAdvances in piezoelectric ceramic-polymer composites for vat photopolymerization-based additive manufacturing
Sang-Mi Chang et al 2026 Int. J. Extrem. Manuf. 8 062004
View article, Advances in piezoelectric ceramic-polymer composites for vat photopolymerization-based additive manufacturingPDF, Advances in piezoelectric ceramic-polymer composites for vat photopolymerization-based additive manufacturingVat photopolymerization-based 3D printing is an emerging platform for fabricating high-performance piezoelectric ceramic–polymer composites with precise structural control. 3D printing processing of piezoelectric composites critically depends on the optimization of the interfacial chemistry and compatibility between ceramic fillers and polymer matrices. Specifically, the use of materials with excellent piezoelectric properties, an optimal formulation combined with dispersants and silane coupling agents that enhance uniform particle dispersion and strong interfacial adhesion, enables high ceramic loading at low viscosity critical for defect-free printing and facilitates the fabrication of high-performance piezoelectric composites. Structurally, architectural designs such as lattices and metamaterials enable localized stress concentration and anisotropic strain distribution, amplifying piezoelectric responses. Simulation-based materials and structural designs can also predict piezoelectric properties and bridge the gap between experiments and performance. Moreover, controlling the rheological properties and curing behavior is critical for achieving high-resolution, defect-free prints. This review highlights the synergistic roles of material design, structural architecture, and processing control in enhancing the electromechanical coupling of 3D-printed piezoelectric composites, thereby offering new pathways for advanced piezoelectric composite additive manufacturing applications.
Highlights
The comprehensive integration of materials, processing, and structural design is presented for vat photopolymerization-based 3D printing of piezoelectric ceramic–polymer composites.
A new chemical and electromechanical interpretation, supported by finite element simulations, clarifies mechanisms governing performance in piezoelectric ceramic–polymer system.
Synergistic chemical mechanisms between dispersants and silane coupling agents are systematically analyzed in piezoelectric ceramic–polymer composites.
Compatibility-driven rheological behavior is systematically analyzed to guide stable dispersion and high-quality additive manufacturing of piezoelectric ceramic–polymer composites.
- The following article is Open accessResearch progress on specialized processing technologies enhancing triboelectric nanogenerators: mechanisms, performance and applications
Hongwei Li et al 2026 Int. J. Extrem. Manuf. 8 062005
View article, Research progress on specialized processing technologies enhancing triboelectric nanogenerators: mechanisms, performance and applicationsPDF, Research progress on specialized processing technologies enhancing triboelectric nanogenerators: mechanisms, performance and applicationsThe development of highly efficient, stable, and reliable triboelectric nanogenerators (TENGs) is crucial for overcoming bottlenecks in energy conversion efficiency and environmental adaptability. Owing to their high precision, noncontact nature, and cross-scale manufacturing capabilities, specialized processing techniques offer revolutionary approaches for material design, interface engineering, and structural optimization in TENGs. This review systematically analyzes the core mechanisms and performance enhancement pathways of six specialized processing techniques (laser processing, 3D printing, deposition techniques, plasma technology, electrospinning, and nanoimprinting) within TENGs. This highlights how these techniques synergistically address the inherent theoretical limitations of TENGs by precisely modulating surface topography (enhancing charge density), optimizing interfacial structures (facilitating charge migration), constructing functional layers (prolonging charge retention), and reinforcing encapsulation (mitigating environmental interference). Furthermore, we explore the applications of high-performance TENGs in energy harvesting, self-powered system integration, and sensing across natural, biomechanical, industrial, and medical domains, emphasizing their potential for creating sustainable, self-driven energy networks. The paper concludes by discussing current challenges and future development directions for TENG technology, offering insights for technological breakthroughs and practical implementation.
Highlights
Systematically reviews six specialized processing techniques for enhancing TENG performance.
Establishes a material–structure–performance synergy framework for multiscale design.
Demonstrates breakthroughs in advanced processing in TENG energy harvesting and sensing.
Identifies sustainable directions including AI-assisted fabrication and green materials.
Provides cross-scale strategies and theoretical guidance for TENG industrialization.
- The following article is Open accessAdvances in piezoelectric ceramic-polymer composites for vat photopolymerization-based additive manufacturing
Sang-Mi Chang et al 2026 Int. J. Extrem. Manuf. 8 062004
View article, Advances in piezoelectric ceramic-polymer composites for vat photopolymerization-based additive manufacturingPDF, Advances in piezoelectric ceramic-polymer composites for vat photopolymerization-based additive manufacturingVat photopolymerization-based 3D printing is an emerging platform for fabricating high-performance piezoelectric ceramic–polymer composites with precise structural control. 3D printing processing of piezoelectric composites critically depends on the optimization of the interfacial chemistry and compatibility between ceramic fillers and polymer matrices. Specifically, the use of materials with excellent piezoelectric properties, an optimal formulation combined with dispersants and silane coupling agents that enhance uniform particle dispersion and strong interfacial adhesion, enables high ceramic loading at low viscosity critical for defect-free printing and facilitates the fabrication of high-performance piezoelectric composites. Structurally, architectural designs such as lattices and metamaterials enable localized stress concentration and anisotropic strain distribution, amplifying piezoelectric responses. Simulation-based materials and structural designs can also predict piezoelectric properties and bridge the gap between experiments and performance. Moreover, controlling the rheological properties and curing behavior is critical for achieving high-resolution, defect-free prints. This review highlights the synergistic roles of material design, structural architecture, and processing control in enhancing the electromechanical coupling of 3D-printed piezoelectric composites, thereby offering new pathways for advanced piezoelectric composite additive manufacturing applications.
Highlights
The comprehensive integration of materials, processing, and structural design is presented for vat photopolymerization-based 3D printing of piezoelectric ceramic–polymer composites.
A new chemical and electromechanical interpretation, supported by finite element simulations, clarifies mechanisms governing performance in piezoelectric ceramic–polymer system.
Synergistic chemical mechanisms between dispersants and silane coupling agents are systematically analyzed in piezoelectric ceramic–polymer composites.
Compatibility-driven rheological behavior is systematically analyzed to guide stable dispersion and high-quality additive manufacturing of piezoelectric ceramic–polymer composites.
- The following article is Open accessFrontiers in atomic-level manufacturing: atomic-scale friction
Chenyang Quan et al 2026 Int. J. Extrem. Manuf. 8 062003
View article, Frontiers in atomic-level manufacturing: atomic-scale frictionPDF, Frontiers in atomic-level manufacturing: atomic-scale frictionAs micro/nanoelectromechanical systems (MEMS/NEMS) advance toward higher integration, device fabrication is entering the era of atomic and close-to-atomic scale manufacturing (ACSM). Interface friction has emerged as a critical factor affecting device performance and reliability. Atomic-scale friction is jointly determined by the atomic structure, surface chemistry, and quantum effects, exhibiting behavior markedly different from macroscopic friction. This paper reviews recent advances in atomic-scale friction research, systematically summarizing major friction models and the influence of interatomic interactions, van der Waals forces, interfacial charge transfer, and energy dissipation mechanisms (phonon friction and electronic friction) on friction behavior. It also summarizes the primary physical mechanisms enabling ultra-low friction in two-dimensional (2D) materials, carbon materials, and semiconductor materials while introducing relevant experimental methods, simulation techniques, and the application of artificial intelligence (AI) in friction research. This paper aims to provide a clear framework for understanding and controlling friction mechanisms at the atomic scale, offering theoretical and methodological references for designing highly reliable micro/nano devices and novel quantum devices.
Highlights
Multi-scale models explain atomic stick-slip and friction transition rules.
Quantum and phonon effects control atomic friction energy dissipation.
2D and carbon materials achieve stable atomic super-lubricity.
Advanced tools measure and simulate atomic friction accurately.
AI improves atomic friction prediction and material design speed.
- The following article is Open accessLiquid metal printing for atomically thin metal-based materials and devices: toward atomic-level manufacturing
Jiaqi He et al 2026 Int. J. Extrem. Manuf. 8 062002
View article, Liquid metal printing for atomically thin metal-based materials and devices: toward atomic-level manufacturingPDF, Liquid metal printing for atomically thin metal-based materials and devices: toward atomic-level manufacturingAtomic-level manufacturing represents the ultimate frontier in materials science, promising unprecedented control over the composition and structure of matter. However, conventional fabrication techniques often face limitations in terms of scalability, energy efficiency, and applicability to non-layered materials. Liquid metal (LM) printing has recently emerged as a disruptive alternative, leveraging the unique physicochemical properties of liquid metals, including high fluidity, self-limiting surface oxidation, and compositional tunability, to synthesize and transfer atomically thin films under ambient conditions. This review provides a comprehensive overview of LM printing for the fabrication of two-dimensional (2D) metal-based materials and devices. We begin by elucidating the fundamental principles of atomic-level manufacturing and the distinctive advantages of liquid metals. We then systematically detail a diverse toolkit of LM printing techniques, including gas injection, laser-assisted, spin-coating, scraping, roller-based, squeeze-printing, and direct touch methods. The synthesis of a broad library of atomically thin materials, encompassing oxides, sulfides, nitrides, and phosphates derived from Ga, In, Sn, Bi, Zn, and their multi-component alloys, is thoroughly reviewed. Furthermore, we explore the integration of these 2D materials into high-performance devices such as transistors, photodetectors, sensors, memristors, and neuromorphic electronics. Finally, we discuss the existing challenges and future outlooks for this burgeoning field, highlighting pathways toward autonomous, scalable, and truly atomic-level manufacturing paradigms.
Highlights
Liquid metal printing enables ambient synthesis of atomically thin films, bypassing the high-temperature and high-vacuum demands of conventional atomic-level manufacturing techniques.
Film composition, thickness, and defect density are precisely controlled through alloy engineering and tailored interfacial chemistry.
A versatile suite of printing strategies is employed to produce a broad range of oxides, sulfides, and nitrides.
The resulting 2D materials are integrated into high-performance transistors, sensors, neuromorphic devices, and more.
- The following article is Open accessHeterogeneous material 3D printing: from multi-material integration to spatiotemporal functionality programming
Xueli Zhou et al 2026 Int. J. Extrem. Manuf. 8 062001
View article, Heterogeneous material 3D printing: from multi-material integration to spatiotemporal functionality programmingPDF, Heterogeneous material 3D printing: from multi-material integration to spatiotemporal functionality programmingHeterogeneous material 3D printing (HM3DP) represents a transformative approach in additive manufacturing, enabling precise spatial control over material composition, microstructure, and functionality. This technology transcends the limitations of homogeneous fabrication by integrating multi-material systems, dynamic process programming, and external field modulation, offering innovative solutions for biomimetic structures, flexible electronics, and smart devices. This review systematically examines the chemical foundations, process innovations, and applications of HM3DP and proposes a three-tier classification system—composition, structure, and functional–temporal heterogeneity—to standardize evaluation metrics. Key challenges, including dynamic interface compatibility, cross-scale heterogeneous mechanical integrity and fracture control, and functional–temporal synergy, are critically analyzed. Future directions emphasize multi-physics collaboration and intelligent optimization to achieve adaptive, high-performance heterogeneous systems. HM3DP is poised to bridge the gap between static manufacturing and dynamic, intelligent design, unlocking new frontiers in materials science and engineering.
Highlights
Heterogeneous 3D printing enables precise control of material composition and functionality.
Dynamic interface chemistry enhances material adaptability and long-term stability.
Cross-scale regulation bridges nanoscale fillers to macroscale structures.
Functional-temporal synergy supports smart devices and 4D printing applications.
- The following article is Open accessSuperior strength-ductility synergy in heterostructured zinc alloy implants fabricated via laser powder bed fusion
Yang et al
View accepted manuscript, Superior strength-ductility synergy in heterostructured zinc alloy implants fabricated via laser powder bed fusionPDF, Superior strength-ductility synergy in heterostructured zinc alloy implants fabricated via laser powder bed fusionZinc and its alloys are promising biodegradable materials for orthopedic implants, but simultaneously enhancing strength and ductility remains challenging. In this study, laser powder bed fusion technology was employed to fabricate zinc-copper (Zn-Cu) alloy implants. Within the optimized processing window, increasing the laser energy density elevated the melt pool temperature and provided sufficient thermodynamic conditions for grain growth, whereas decreasing the energy density accelerated cooling and suppressed grain coarsening. By grouping multiple layers and alternately applying high and low energy densities between groups, a heterostructure with alternating coarse- and fine-grained layers was constructed. This heterostructured Zn-Cu alloys exhibited an ultimate tensile strength of 245.6±8.7 MPa and a ductility of 12.7±0.9%, demonstrating a remarkable strength-ductility synergy among LPBF-processed Zn-based alloys. Mechanical analysis revealed that hetero-deformation induced stress, interlayer dislocations, and the inhibition of strain localization collectively contributed to the superior mechanical performance. Additionally, the heterostructured Zn-Cu alloys exhibited typical gradient degradation characteristics and outstanding osteogenic activity, highlighting their potential for load-bearing biodegradable orthopedic applications. This work establishes a process- microstructure-property paradigm for LPBF of Zn alloys and offers a generalizable strategy for designing high-performance biodegradable metal implants.
- The following article is Open accessUltra-precision Machining of Functional Micro/nanostructure Arrays
Du et al
View accepted manuscript, Ultra-precision Machining of Functional Micro/nanostructure ArraysPDF, Ultra-precision Machining of Functional Micro/nanostructure ArraysMicro/nanostructure arrays are extensively employed in optics, aerospace, energy, and biomedical applications due to their superior functional properties. Ultra-precision machining technologies have emerged as key enablers for the efficient, accurate, and flexible fabrication of these structures, facilitating their industrial-scale production. This paper provides a comprehensive overview of ultra-precision machining technologies for generating functional micro/nanostructure arrays. Firstly, a metrological analysis of the literature of micro/nanostructure arrays and traditional ultra-precision machining is introduced. Subsequently, various ultra-precision machining technologies, including single-point diamond turning, slow/fast tool servo diamond turning, fly cutting, diamond milling, and ultra-precision grinding/polishing, are systematically reviewed. In addition, field-assisted ultra-precision machining methods, such as ultrasonic vibration-assisted machining, laser-assisted machining, ion implantation-assisted machining, magnetic field-assisted machining, and multi-field assisted machining, are summarized for creating micro/nanostructure arrays on difficult-to-machine material surfaces. Then, the functional applications of micro/nanostructure arrays in numerous fields are discussed in detail, including optical regulation, friction reduction, wettability modification, thermal cooling, and anti-icing. And relationships between structural characteristics and functional performance are elucidated. Finally, the current challenges in ultra-precision machining technology for micro/nanostructure arrays are summarized, as well as the outlooks and continuously expanding application fields are also outlined.
- WITHDRAWN: Microstructure characterization and mechanical properties of Al6061 alloy fabricated by laser powder bed fusion
Hosseini et al
View accepted manuscript, WITHDRAWN: Microstructure characterization and mechanical properties of Al6061 alloy fabricated by laser powder bed fusionPDF, WITHDRAWN: Microstructure characterization and mechanical properties of Al6061 alloy fabricated by laser powder bed fusionThis paper was withdrawn by IOP Publishing on 4 November 2025. This paper was published due to an error. The authors are free to publish this work elsewhere. IOP Publishing apologise for this error.
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- The following article is Open accessTriply periodic minimal surface (TPMS) porous structures: from multi-scale design, precise additive manufacturing to multidisciplinary applications
Jiawei Feng et al 2022 Int. J. Extrem. Manuf. 4 022001
View article, Triply periodic minimal surface (TPMS) porous structures: from multi-scale design, precise additive manufacturing to multidisciplinary applicationsPDF, Triply periodic minimal surface (TPMS) porous structures: from multi-scale design, precise additive manufacturing to multidisciplinary applicationsInspired by natural porous architectures, numerous attempts have been made to generate porous structures. Owing to the smooth surfaces, highly interconnected porous architectures, and mathematical controllable geometry features, triply periodic minimal surface (TPMS) is emerging as an outstanding solution to constructing porous structures in recent years. However, many advantages of TPMS are not fully utilized in current research. Critical problems of the process from design, manufacturing to applications need further systematic and integrated discussions. In this work, a comprehensive overview of TPMS porous structures is provided. In order to generate the digital models of TPMS, the geometry design algorithms and performance control strategies are introduced according to diverse requirements. Based on that, precise additive manufacturing methods are summarized for fabricating physical TPMS products. Furthermore, actual multidisciplinary applications are presented to clarify the advantages and further potential of TPMS porous structures. Eventually, the existing problems and further research outlooks are discussed.
- The following article is Open accessA comprehensive review on microchannel heat sinks for electronics cooling
Zhi-Qiang Yu et al 2024 Int. J. Extrem. Manuf. 6 022005
View article, A comprehensive review on microchannel heat sinks for electronics coolingPDF, A comprehensive review on microchannel heat sinks for electronics coolingThe heat generation of electronic devices is increasing dramatically, which causes a serious bottleneck in the thermal management of electronics, and overheating will result in performance deterioration and even device damage. With the development of micro-machining technologies, the microchannel heat sink (MCHS) has become one of the best ways to remove the considerable amount of heat generated by high-power electronics. It has the advantages of large specific surface area, small size, coolant saving and high heat transfer coefficient. This paper comprehensively takes an overview of the research progress in MCHSs and generalizes the hotspots and bottlenecks of this area. The heat transfer mechanisms and performances of different channel structures, coolants, channel materials and some other influencing factors are reviewed. Additionally, this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer. The comprehensive review is expected to provide a theoretical reference and technical guidance for further research and application of MCHSs in the future.
Highlights
The studies on microchannel heat sinks for electronics cooling are reviewed comprehensively.
The main research areas of interest for microchannel heat sinks are classified.
The studies on both single-phase and phase-change flow cooling are reviewed.
The characteristics, application conditions and shortcomings of microchannel heat sinks with different structures, working fluids, materials and some other influencing factors are introduced.
The prospects for and development trends of microchannel heat sinks are revealed based on the overall review and analysis.
- The following article is Open accessNontraditional energy-assisted mechanical machining of difficult-to-cut materials and components in aerospace community: a comparative analysis
Guolong Zhao et al 2024 Int. J. Extrem. Manuf. 6 022007
View article, Nontraditional energy-assisted mechanical machining of difficult-to-cut materials and components in aerospace community: a comparative analysisPDF, Nontraditional energy-assisted mechanical machining of difficult-to-cut materials and components in aerospace community: a comparative analysisThe aerospace community widely uses difficult-to-cut materials, such as titanium alloys, high-temperature alloys, metal/ceramic/polymer matrix composites, hard and brittle materials, and geometrically complex components, such as thin-walled structures, microchannels, and complex surfaces. Mechanical machining is the main material removal process for the vast majority of aerospace components. However, many problems exist, including severe and rapid tool wear, low machining efficiency, and poor surface integrity. Nontraditional energy-assisted mechanical machining is a hybrid process that uses nontraditional energies (vibration, laser, electricity, etc) to improve the machinability of local materials and decrease the burden of mechanical machining. This provides a feasible and promising method to improve the material removal rate and surface quality, reduce process forces, and prolong tool life. However, systematic reviews of this technology are lacking with respect to the current research status and development direction. This paper reviews the recent progress in the nontraditional energy-assisted mechanical machining of difficult-to-cut materials and components in the aerospace community. In addition, this paper focuses on the processing principles, material responses under nontraditional energy, resultant forces and temperatures, material removal mechanisms, and applications of these processes, including vibration-, laser-, electric-, magnetic-, chemical-, advanced coolant-, and hybrid nontraditional energy-assisted mechanical machining. Finally, a comprehensive summary of the principles, advantages, and limitations of each hybrid process is provided, and future perspectives on forward design, device development, and sustainability of nontraditional energy-assisted mechanical machining processes are discussed.
Highlights
A topical review of nontraditional energy-assisted mechanical machining is introduced.
The advantages and limitations of each hybrid machining process are addressed.
Perspectives on forward design, device development, and sustainability are discussed.
- The following article is Open accessAn overview of additively manufactured metal matrix composites: preparation, performance, and challenge
Liang-Yu Chen et al 2024 Int. J. Extrem. Manuf. 6 052006
View article, An overview of additively manufactured metal matrix composites: preparation, performance, and challengePDF, An overview of additively manufactured metal matrix composites: preparation, performance, and challengeMetal matrix composites (MMCs) are frequently employed in various advanced industries due to their high modulus and strength, favorable wear and corrosion resistance, and other good properties at elevated temperatures. In recent decades, additive manufacturing (AM) technology has garnered attention as a potential way for fabricating MMCs. This article provides a comprehensive review of recent endeavors and progress in AM of MMCs, encompassing available AM technologies, types of reinforcements, feedstock preparation, synthesis principles during the AM process, typical AM-produced MMCs, strengthening mechanisms, challenges, and future interests. Compared to conventionally manufactured MMCs, AM-produced MMCs exhibit more uniformly distributed reinforcements and refined microstructure, resulting in comparable or even better mechanical properties. In addition, AM technology can produce bulk MMCs with significantly low porosity and fabricate geometrically complex MMC components and MMC lattice structures. As reviewed, many AM-produced MMCs, such as Al matrix composites, Ti matrix composites, nickel matrix composites, Fe matrix composites, etc, have been successfully produced. The types and contents of reinforcements strongly influence the properties of AM-produced MMCs, the choice of AM technology, and the applied processing parameters. In these MMCs, four primary strengthening mechanisms have been identified: Hall–Petch strengthening, dislocation strengthening, load transfer strengthening, and Orowan strengthening. AM technologies offer advantages that enhance the properties of MMCs when compared with traditional fabrication methods. Despite the advantages above, further challenges of AM-produced MMCs are still faced, such as new methods and new technologies for investigating AM-produced MMCs, the intrinsic nature of MMCs coupled with AM technologies, and challenges in the AM processes. Therefore, the article concludes by discussing the challenges and future interests of AM of MMCs.
Highlight
Recent progresses in additive manufacturing on metal matrix composites are reviewed.
Additive manufacturing technologies for metal matrix composites are summarized.
The characteristics of feedstocks and reinforcements are introduced.
Mechanical property of additively manufactured metal matrix composites is reviewed.
Challenges of additively manufactured metal matrix composites are discussed.
- The following article is Open accessDamage evolution mechanism and low-damage grinding technology of silicon carbide ceramics
Chen Li et al 2025 Int. J. Extrem. Manuf. 7 022015
View article, Damage evolution mechanism and low-damage grinding technology of silicon carbide ceramicsPDF, Damage evolution mechanism and low-damage grinding technology of silicon carbide ceramicsSilicon carbide (SiC) ceramics are extensively utilized in aerospace, national defense, and petrochemical industries due to their superior physical and chemical properties. The processing of bulk SiC ceramics necessitates precise and efficient grinding techniques to produce components with satisfactory functionality. However, the inherent high hardness and brittleness of SiC ceramics present significant challenges during grinding, leading to severe brittle fracture and tool wear that compromise both surface integrity and production efficiency. Although ductile-regime grinding of SiC ceramics can be achieved by enhancing machine tool accuracy and stiffness while optimizing wheel performance alongside appropriate selection of process parameters, a comprehensive summary of the mechanisms underlying damage evolution during grinding is lacking, and a mature grinding process for SiC ceramics has yet to be developed. To bridge this gap, the sintering technologies, mechanical properties, and microstructures of SiC ceramics were briefly covered. The grinding-induced damage mechanism and low-damage grinding technologies of SiC ceramics were summarized. The fundamental science underlying the ductile deformation and removal mechanisms of brittle solids was emphasized. Additionally, attention was directed towards the critical role of hybrid energy field grinding in minimizing brittle damages and promoting removal efficiency. This review not only elucidates the intrinsic interactions between the work material and abrasives, but also offers valuable insights for optimizing the grinding processes of brittle solids.
Highlights:
Damage evolution mechanism induced by grinding of SiC ceramics is summarized.
Low-damage grinding technologies of SiC ceramics are discussed.
Future directions for low-damage grinding of SiC ceramics are proposed.
Sintering technologies, mechanical properties, and microstructures of SiC ceramics are covered.
- The following article is Open accessLaser powder bed fusion additive manufacturing of NiTi shape memory alloys: a review
Shuaishuai Wei et al 2023 Int. J. Extrem. Manuf. 5 032001
View article, Laser powder bed fusion additive manufacturing of NiTi shape memory alloys: a reviewPDF, Laser powder bed fusion additive manufacturing of NiTi shape memory alloys: a reviewThe printability, microstructural characteristics, phase transformation behaviors, and mechanical properties of LPBF-fabricated NiTi alloys are reviewed.
Several common structures for LPBF-fabricated NiTi alloys are considered and their various fields of application are illustrated.
The technical challenges, limitations, and development tendencies of LPBF-fabricated NiTi alloys are put forward.
Abstract
NiTi alloys have drawn significant attentions in biomedical and aerospace fields due to their unique shape memory effect (SME), superelasticity (SE), damping characteristics, high corrosion resistance, and good biocompatibility. Because of the unsatisfying processabilities and manufacturing requirements of complex NiTi components, additive manufacturing technology, especially laser powder bed fusion (LPBF), is appropriate for fabricating NiTi products. This paper comprehensively summarizes recent research on the NiTi alloys fabricated by LPBF, including printability, microstructural characteristics, phase transformation behaviors, lattice structures, and applications. Process parameters and microstructural features mainly influence the printability of LPBF-processed NiTi alloys. The phase transformation behaviors between austenite and martensite phases, phase transformation temperatures, and an overview of the influencing factors are summarized in this paper. This paper provides a comprehensive review of the mechanical properties with unique strain-stress responses, which comprise tensile mechanical properties, thermomechanical properties (e.g. critical stress to induce martensitic transformation, thermo-recoverable strain, and SE strain), damping properties and hardness. Moreover, several common structures (e.g. a negative Poisson’s ratio structure and a diamond-like structure) are considered, and the corresponding studies are summarized. It illustrates the various fields of application, including biological scaffolds, shock absorbers, and driving devices. In the end, the paper concludes with the main achievements from the recent studies and puts forward the limitations and development tendencies in the future.
- The following article is Open accessRecent innovations in laser additive manufacturing of titanium alloys
Jinlong Su et al 2024 Int. J. Extrem. Manuf. 6 032001
View article, Recent innovations in laser additive manufacturing of titanium alloysPDF, Recent innovations in laser additive manufacturing of titanium alloysTitanium (Ti) alloys are widely used in high-tech fields like aerospace and biomedical engineering. Laser additive manufacturing (LAM), as an innovative technology, is the key driver for the development of Ti alloys. Despite the significant advancements in LAM of Ti alloys, there remain challenges that need further research and development efforts. To recap the potential of LAM high-performance Ti alloy, this article systematically reviews LAM Ti alloys with up-to-date information on process, materials, and properties. Several feasible solutions to advance LAM Ti alloys are reviewed, including intelligent process parameters optimization, LAM process innovation with auxiliary fields and novel Ti alloys customization for LAM. The auxiliary energy fields (e.g. thermal, acoustic, mechanical deformation and magnetic fields) can affect the melt pool dynamics and solidification behaviour during LAM of Ti alloys, altering microstructures and mechanical performances. Different kinds of novel Ti alloys customized for LAM, like peritectic α-Ti, eutectoid (α + β)-Ti, hybrid (α + β)-Ti, isomorphous β-Ti and eutectic β-Ti alloys are reviewed in detail. Furthermore, machine learning in accelerating the LAM process optimization and new materials development is also outlooked. This review summarizes the material properties and performance envelops and benchmarks the research achievements in LAM of Ti alloys. In addition, the perspectives and further trends in LAM of Ti alloys are also highlighted.
Highlights
Substantive review of innovations in methodology, process and materials of AM Ti alloys.
Novel titanium alloys designed for laser additive manufacturing.
Machine learning assisted alloy design and process optimization.
Field-assisted additive manufacturing for titanium alloys fabrications.
- The following article is Open accessAdvances in selective laser sintering of polymers
Wei Han et al 2022 Int. J. Extrem. Manuf. 4 042002
View article, Advances in selective laser sintering of polymersPDF, Advances in selective laser sintering of polymersPolymers are widely used materials in aerospace, automotive, construction, medical devices and pharmaceuticals. Polymers are being promoted rapidly due to their ease of manufacturing and improved material properties. Research on polymer processing technology should be paid more attention to due to the increasing demand for polymer applications. Selective laser sintering (SLS) uses a laser to sinter powdered materials (typical polyamide), and it is one of the critical additive manufacturing (AM) techniques of polymer. It irradiates the laser beam on the defined areas by a computer-aided design three-dimensional (3D) model to bind the material together to create a designed 3D solid structure. SLS has many advantages, such as no support structures and excellent mechanical properties resembling injection moulded parts compared with other AM methods. However, the ability of SLS to process polymers is still affected by some defects, such as the porous structure and limited available types of SLS polymers. Therefore, this article reviews the current state-of-the-art SLS of polymers, including the fundamental principles in this technique, the SLS developments of typical polymers, and the essential process parameters in SLS. Furthermore, the applications of SLS are focused, and the conclusions and perspectives are discussed.
Highlights
The fundamental principles in selective laser sintering polymers are reviewed.
The effect of process parameters on the selective laser sintering polymers and the popular polymer materials are discussed.
The recent applications of selective laser sintering polymers and the future works are explored.
- The following article is Open accessOvercoming challenges: advancements in cutting techniques for high strength-toughness alloys in aero-engines
Biao Zhao et al 2024 Int. J. Extrem. Manuf. 6 062012
View article, Overcoming challenges: advancements in cutting techniques for high strength-toughness alloys in aero-enginesPDF, Overcoming challenges: advancements in cutting techniques for high strength-toughness alloys in aero-enginesAero-engines, the core of air travel, rely on advanced high strength-toughness alloys (THSAs) such as titanium alloys, nickel-based superalloys, intermetallics, and ultra-high strength steel. The precision of cutting techniques is crucial for the manufacture of key components, including blades, discs, shafts, and gears. However, machining THSAs pose significant challenges, including high cutting forces and temperatures, which lead to rapid tool wear, reduced efficiency, and compromised surface integrity. This review thoroughly explores the current landscape and future directions of cutting techniques for THSAs in aero-engines. It examines the principles, mechanisms, and benefits of energy-assisted cutting technologies like laser-assisted machining and cryogenic cooling. The review assesses various tool preparation methods, their effects on tool performance, and strategies for precise shape and surface integrity control. It also outlines intelligent monitoring technologies for machining process status, covering aspects such as tool wear, surface roughness, and chatter, contributing to intelligent manufacturing. Additionally, it highlights emerging trends and potential future developments, including multi-energy assisted cutting mechanisms, advanced cutting tools, and collaborative control of structure shape and surface integrity, alongside intelligent monitoring software and hardware. This review serves as a reference for achieving efficient and high-quality manufacturing of THSAs in aero-engines.
Highlights
The energy field assisted mechanical processing technology methods and development status are introduced.
The development of tool preparation technology for high-strength and toughness materials is elaborated.
The development of collaborative technologies of structure shape and surface integrity is summarized.
The development of intelligent monitoring technology is summarized.
The development and sustainability of advanced cutting technologies for high strength-toughness alloys in aero-engines are prospected.
- The following article is Open accessDigital light processing based multimaterial 3D printing: challenges, solutions and perspectives
Jianxiang Cheng et al 2024 Int. J. Extrem. Manuf. 6 042006
View article, Digital light processing based multimaterial 3D printing: challenges, solutions and perspectivesPDF, Digital light processing based multimaterial 3D printing: challenges, solutions and perspectivesMultimaterial (MM) 3D printing shows great potential for application in metamaterials, flexible electronics, biomedical devices and robots, since it can seamlessly integrate distinctive materials into one printed structure. Among numerous MM 3D printing technologies, digital light processing (DLP) MM 3D printing is compatible with a wide range of materials from hydrogels to ceramics, and can print MM 3D structures with high resolution, high complexity and fast speed. This paper introduces the fundamental mechanisms of DLP 3D printing, and reviews the recent advances of DLP MM 3D printing technologies with emphasis on material switching methods and material contamination issues. It also summarizes a number of typical examples of DLP MM 3D printing systems developed in the past decade, and introduces their system structures, working principles, material switching methods, residual resin removal methods, printing steps, as well as the representative structures and applications. Finally, we provide perspectives on the directions of the further development of DLP MM 3D printing technology.
Highlights
Review the recent advances of digital light processing multimaterial 3D printing.
Summarize critical challenges in digital light processing multimaterial 3D printing.
Provide perspectives on directions of further development of multimaterial 3D printing.
Journal resources
Journal information
- 2019-present
International Journal of Extreme Manufacturing
doi: 10.1088/issn.2631-7990
Online ISSN: 2631-7990
Print ISSN: 2631-8644