OIF on 400G for Next Gen Optical Networks Conference
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The OIF represents over 100 member companies working to accelerate the adoption of new optical networking technologies. It develops implementation agreements (IAs) for electrical, protocol, and optical interfaces to address current industry needs. Recent work includes the CEI IA for electrical chip-to-chip interfaces up to 56Gbps and new CFP8-ACO and flexible coherent transmission frameworks. Interoperability demonstrations have validated OIF solutions work across member products. The OIF aims to fill gaps in optical networking standards through open collaboration.
![Coherent Transport
Optical components still dominate coherent modem
system costs and this cost is very volume sensitive.
Complexity and system level flexibility at the coherent DSP
engine level actually enables a substantial cost savings for
the industry since it enables the consolidation of the
industry EO component volumes into only three functions.
• This is the strength of the coherent solution for transport.
• It has enabled coherent to move into markets not originally
expected [dominates Metro now]
10](https://image.slidesharecdn.com/400gforngon-160707225219/85/OIF-on-400G-for-Next-Gen-Optical-Networks-Conference-10-320.jpg)
OIF on 400G for Next Gen Optical Networks Conference
- 1. Defining Requirements and Specifications for 400G & all Modulations – 200G, 300G, 500G+ NGON 2016 July 30, 2016 Karl Gass OIF Physical and Link Layer Committee Vice-Chair for Optics
- 2. About the OIF The Optical Internetworking Forum: • Represents an end-to-end ecosystem membership base of 100+ members • Accelerating market adoption and ROI for new technologies • OIF 100G DWDM work united the industry around a 100G framework and IAs for photonics, FEC and module MSA • Electrical work defines critical backplane, chip and module interfaces for 100-400G • Open and agile workplan • Find gaps obstructing deployment and fill them internally or working with other SDOs • Distributed Control, Centralized Control – whatever best fits operator needs! www.oiforum.com Network Operators System Suppliers Transceiver Suppliers Component Suppliers
- 3. PLL Electrical, Protocol and Optical working groups Looking for opportunities to serve the industry by development of interoperable solutions that are not being addressed by other industry bodies • Electrical interfaces (Common Electrical Interface) • Protocol interfaces (MLG, Flex E) • Optical interfaces Publically available, freely shared, Implementation Agreements Broadly defined so applicable to multiple market segments Addressing current industry needs of speed (data rate), density, power efficiency, flexibility (re-use)
- 4. Electrical Implementation Agreements CEI IA is a clause-based format supporting publication of new clauses over time: • CEI-1.0: included CEI-6G-SR, CEI-6G-LR, and CEI-11G-SR clauses. • CEI-2.0: added CEI-11G-LR clause • CEI-3.0: added work from CEI-25G-LR, CEI-28G-SR • CEI-3.1: added work from CEI-28G-MR and CEI-28G-VSR CEI-11G and -28G specifications have been used as a basis for specifications developed in IEEE 802.3, ANSI/INCITS T11, and IBTA. CEI 56G projects are in progress: • LR: backplane • MR: chip to chip • VSR: chip to module • XSR: chip to optics engine (separate chips) • USR: chip to optics engine (2.5D or 3D package) CEI 112G – under discussion! 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 SxI-5 CEI-1.0 CEI-2.0 CEI-3.0 CEI-3.1 3G 6G 11G 25G & 28G 56G 112G
- 5. CEI 56G Applications Host IC Module Connector AC Coupling Cap Module Retimer IC USR LR MR VSR XSR Different reaches, number of connectors, channel materials mean we can optimize the application specifications for best efficiency Different modulations provide advantage in certain cases
- 6. CEI-56G Application Space 6 USR: 2.5D/3D applications 1 cm, no connectors, no packages XSR: Chip to nearby optics engine 5 cm, no connectors 5-10 dB loss @28 GHz VSR: Chip-to-module 10 cm, 1 connector 10-20 dB loss @28 GHz MR: Interfaces for chip to chip and midrange backplane 50 cm, 1 connector 15-25 dB loss @14 GHz 20-50 dB loss @28 GHz LR: Interface for chip to chip over a backplane 100cm, 2 connectors 35dB at 14Ghz Chip-to-Chip & Midplane Applications Chip-to-Module Chip Pluggable Optics CEI-56G-USR Chip Chip Backplane or Passive Copper Cable Chip Chip 3D Stack CEI-56G-XSR CEI-56G-VSR 2.5D Chip-to-OE Optics Chip Chip to Nearby OE CEI-56G-MR CEI-56G-LR NRZ IA NRZ & PAM4 IAs NRZ & PAM4 IAs NRZ & PAM4 IAs PAM4 & ENRZ IAs CEI-56G is leading the drive to higher bandwidths for both networking and data center applications. Projects underway in five link reaches with multiple modulations
- 7. PLL – How OIF Accelerated 100G Router Router OTN Switch 100GbE OTH, OTU4 100GbE IEEE 802.3ba ITU-T OIF 40G development highly fragmented Collaboration much improved on 100G • Clear business case • Stronger ecosystem • Consistent standards and IAs Framer Photonic TX Photonic RX 100G ULH MSA FEC OTN Switch OIF work on 100G DWDM transport united the industry around • An overall framework including a modulation format • Detailed IAs including photonics Tx/Rx modules, FEC, MSA
- 8. 400G ? How do we build on our successful deployment of coherent 100G systems? 400G Technology Options White Paper http://www.oiforum.com/documents/download-technology- options-for-400g-implementation/ Carrier/User requirements Survey of modulation formats/options from White Paper
- 9. 400G Systems Theoretical system parameters in terms of OSNR@BER=10-2 (SD-FEC) /OSNR@BER=10-3 (HD-FEC) for all reported modulation formats 9
- 10. Coherent Transport Optical components still dominate coherent modem system costs and this cost is very volume sensitive. Complexity and system level flexibility at the coherent DSP engine level actually enables a substantial cost savings for the industry since it enables the consolidation of the industry EO component volumes into only three functions. • This is the strength of the coherent solution for transport. • It has enabled coherent to move into markets not originally expected [dominates Metro now] 10
- 11. Flexible transceiver 11 What can be flexible？ • Baud rate • Modulation format • FEC algorithms and overhead • Sampling rate • Grid Different combinations suitable for different scenarios Interfaces to support SDN which brings end to end reconfiguration and performance optimization Steven Gringeri, Nabil Bitar, and Tiejun J. Xia. "Extending Software Defined Network Principles to Include Optical Transport." IEEE Communications Magazine March 2013: 32-40.
- 12. Flexible Coherent DWDM Transmission Framework Description: • There are different technical approaches for beyond 100G, but lack of consensus on implementation. • Different from 100G, new features like flex data rate (single chip) have been incorporated into beyond 100G technology. • Business perspective to improve the investment on the beyond 100G technology elements for both system vendors and component suppliers. Goal/Scope: This project will develop a Framework: • Technical solution(s) for Flex Coherent Transmission implementation for different application scenarios: long haul, metro, and data center inter-connection. • To provide guidance on the hardware implementation, which is given fundamentally by two parameters: the modulated spectrum width and the number of optical carriers.
- 13. CFP8-ACO Description: • A new analog coherent optics (ACO) project that supports higher baud rate and higher wavelength/carrier-count applications at higher density per wavelength/carrier than the existing CFP2-ACO. • Up to 4 wavelengths/carriers. • Up to 64 Gbaud per wavelength/carrier. Utilizes existing CFP8 definition from the CFP-MSA group: • 20W power profile. • The 9.5 mm module height allows for a double stack line card design or belly to belly. • The 40 mm module width enables a 2 x 8 configuration for a 16 module line card.
- 14. Validation of PLL Work: Interop Demos! Interoperability demos have taken place at OFC and ECOC over the past 4 years demonstrating CEI-25G, CEI-56G and CFP2-ACO These are interops of OIF member hardware
- 15. Summary OIF has an established history of meeting industry needs for interoperable electrical channels, protocols and optical hardware. Applications for Backplanes, chip to chip for various reaches, VSR for chip to module, are evolving to meet new requirements and data rates. Optical solutions are being developed that enable flexibility of deployment in terms of reach and bandwidth The complete industry benefits when we work together to build an ecosystem.
- 16. Thank You!