MEMORY CHIPS & MODULES

A memory chip is a small semiconductor device that stores data that is made up of millions (or
billions) of memory cells, where each cell stores a bit (0 or 1). A memory module is a circuit board
that holds multiple memory chips.

Early Days Standardization

Individual chips in ceramic packages JEDEC specifications ensure compatibility

1 2 3 4

Integration Modern Modules

Multiple chips combined into modules High-density, high-speed memory solutions
Why from Chips to Modules?
Instead of placing individual chips directly on the motherboard, modules make installation,
replacement, and upgrading easier.

Increased Density & Capacity Enhanced Performance Simplified Installation & Upgradability

Modules combine multiple chips on Shorter pathways reduce latency, Users replace or upgrade memory by
one PCB to increase storage in less enabling higher data transfer rates. swapping a single module instead of
space. many chips.
DIPP: Dual Inline Pin Package
In early computers, memory was added one chip at a time using
Dual Inline Pin Packages—ceramic chips with downward-extending
pins.

Key points about DIPPs:

• A single byte of data required eight chips, and a system with parity
needed nine.
• Each package could only hold one DRAM chip.
• They were used in computers before the 80386 microprocessor.
• Due to space limitations on motherboards, DIPP memory eventually
gave way to more compact solutions

DIPPs were phased out for memory after the

Tip: When replacing a DIPP on a motherboard, a special chip
386 era but are still used in BIOS ROMs and
extractor and inserter are used to prevent damage to the pins. firmware chips.
SIPP: Single Inline Pin Package
The Single Inline Pin Package (SIPP) represented the first
attempt to combine multiple DRAM chips into a single module.
This design was created to address the space limitations of
individual DIPP chips.

Design Advantage Major Flaw

DRAM chips were mounted Occupied less board space Installation was difficult -
on circuit boards with pins than individual DRAM chips. pins were easily bent or
extruding from one edge broken

The SIPP format was short-lived due to installation issues, but it marked a key transition between
individual chips and later edge-connector modules.
SIMM: Single Inline Memory Module
The SIPP was replaced by the Single Inline Memory Module (SIMM). These memory modules were a
significant improvement, with chips mounted on a small circuit board instead of having fragile pins. They are
commonly referred to by their pin count, with the first versions being 30-pin SIMMs.

Variants of SIMMs: Physical Design:

• 30-pin SIMMs transfer 8 bits of data at a time.
SIMMs featured a single notch cut into the bottom edge of
• 72-pin SIMMs transfer 32 bits of data at a time.
the module, whereas the later version DIMM had 2 notches

Memory Types Used in SIMMs:

Installation Method:
• Fast Page Mode (FPM)
• Extended Data Out (EDO), and Installed by angling into the socket, then snapping upright
• Error Correction Code (ECC). into place with spring clips.

All 30-pin SIMMs are 8-bit memory All 72-pin SIMMs are 32-bit memory
JEDEC Standardization

JEDEC (Joint Electron Device Engineering Council) is a standards body that defines memory
specifications, including:
• Packaging, pin layouts, and electrical specifications.
• Ensuring compatibility so that memory modules from one manufacturer work on
motherboards from another. Standardizing memory formats such as SIMM, DIMM, and
various generations of DDR.
• Setting the default, baseline speeds and timings for memory.
In short, JEDEC is the organization that creates the rules to ensure memory modules are
compatible and work across different systems.
DIMM: Dual Inline Memory Module
• With Pentium-class CPUs, SIMMs became a bottleneck, leading to the development of DIMMs.
• A DIMM is a RAM module with memory chips on a small circuit board. Its dual inline design provides
separate contacts on both sides, enabling a 64-bit data path which is more efficient and faster than SIMM.
• It provides the CPU with a large RAM to store and quickly retrieve data. This is essential for multitasking
and more RAM allows a computer to handle more tasks at once without slowing down.
• Form Factor: DIMMs are the standard, full-size memory modules used primarily in desktop computers,
workstations, and servers. They are typically around 5.25 inches long.

Key Differences from SIMMs: • 168-pin-DIMMs, used for SDRAM

• 184-pin-DIMMs, used for DDR SDRAM
• 240-pin-DIMMs, used for DDR2
Mounting Mechanism Notch Configuration
SDRAM

Uses handles that clip Features two notches on its bottom edge,
into notches on the with positions varying by memory
side edges rather than generation (DDR2, DDR3, DDR4). These
spring clips notches ensure the module fits only into
compatible motherboard slots, preventing
incorrect installation.
SO-DIMM: Small Outline Dual Inline Memory Module
• The compact size of notebook computers necessitated a smaller memory solution than full-size DIMMs.
• A SO-DIMM is a smaller, more compact version of a DIMM. It is designed for devices where space is a
premium.
• Form Factor: SO-DIMMs are roughly half the size of a standard DIMM. They are commonly used in
devices that require a smaller physical footprint, such as laptops, notebooks, mini-PCs etc

Key Characteristics:
• Significantly smaller package than standard DIMMs
• Lower power consumption
• 144-pin modules have a 64-bit data path, the older 72-pin version had a 32-bit data path.
• Despite their smaller size, they offer similar performance, speeds, and capacities.

Installation: Why Not Use in Desktops?

They are installed by snapping them into a socket at an angle Although smaller and more power-efficient, SO-
and pressing down until they click. This allows them to lie
DIMMs remain uncommon in desktops due to their
flat, which is essential for compact devices like laptops. They
also have keyed notches to prevent incorrect installation. higher cost—about 2.5 times that of standard DIMMs.
RIMM: Rambus Inline Memory Module
• It was developed in the late 1990s by Rambus Inc. as a high-speed alternative to DIMMs.
• RIMMs used RDRAM (Rambus DRAM) chips and featured a narrow but very fast data bus.
• RIMM connectors have a form factor similar to DIMMs and fit within the same board area as the footprint for
a DIMM connector. They have 184 pins compared to DIMM’s 168, but use same socket specification as DIMM.

Key Characteristics:
• Developed for high-bandwidth needs (used in Pentium 4 systems).
• Operated at higher clock speeds than SDRAM at the time.
• More expensive and generated more heat.
• Eventually replaced by DDR SDRAM due to cost and efficiency.

Unique Requirement:
The requirement for continuity modules adds
Unlike SIMM or DIMM systems, all RIMM sockets
an additional cost factor in RIMM. The system will
must be filled. Empty sockets require a "continuity
not boot with only a single RIMM installed
module" to enable the system to function with a
without these modules.
single RIMM installed.
Advanced Memory Technologies
As CPUs outpace memory, technologies like Intel’s 400 MHz bus highlight the need for SDRAM to
evolve or give way to new memory solutions. Several companies are actively researching new
alternatives.

RDRAM
• RDRAM, developed by Rambus with Intel, uses a 400 MHz direct bus
to CPU and transfers data on both rising & falling clock edges,
effectively doubling throughput without increasing speed.

• However, it is incompatible with SDRAM because SDRAM uses a 64-bit bus while RDRAM uses a
16-bit bus, requiring a translation mechanism in the chipset.
• Intel’s i820 chipset used a Memory Translator Hub (MTH), but severe noise-related errors caused
frequent crashes, leading Intel to compensate customers. The later i840 chipset, with an SDRAM
Memory Repeater Hub (MRH-S), proved much more stable and reliable.
DDRAM: Double Data Rate SDRAM
Double data rate SDRAM (DDRAM or DDR) was developed as an alternative to RDRAM. It combines
features from both RDRAM and SDRAM to improve performance without the same issues.

Development Partnership
AMD and VIA developed DDRAM as an
alternative to RDRAM.

Technical Advantages Variants

DDRAM moves data on both rising and DDR SDRAM (DDR1) was
falling edges, like RDRAM, but at the first introduced in 1990s. It
standard 133MHz bus speed. has been succeeded by
DDR2, DDR3, DDR4 and
Implementation Benefits DDR5 SDRAM, each offering
DDRAM is 64-bit like SDRAM, avoiding further improvements in
the need for a translator. It also requires speed, capacity, and
no retooling for manufacturers. efficiency.
PPRAM (Parallel Processing Random Access Memory)

• Parallel Processing RAM (PPRAM) is an experimental technology that aims to merge the CPU
and RAM onto a single chip, reducing the need for extra support circuitry and improving
performance.
• A proposed design suggests one IC with 256MB of DRAM and four microprocessors, each
managing 8MB of local memory plus shared memory.
• A key feature of PPRAM is its ability to read an entire row of 1,024 bits at once, unlike conventional
memory that searches for data row by row and then column by column, dramatically speeding up
access while benefiting from CPU–RAM integration.