Chapter 3
Chapter 3
STEADY-STATE
CONDUCTION
1
Temperature gradient exists along only a single
coordinate direction, and heat transfer occurs
exclusively in that direction.
T=T(x,t)
Steady-state implies that at any given location, the
temperature does not change with time.
T ( x, t )
0
t
The two conditions above will make T=T(x). Initially
heat generation will not be considered.
2
3.1 The Plane Wall
3.1.1 Temperature Distribution
The two surfaces of the plane wall are at temperatures
Ts,1 and Ts,2, where due to the existing temperature
gradient conduction heat transfer will occur as
shown in fig-chp3\fig.3.1.pptx. At the surfaces
convective heat transfer will also occur.
The appropriate equation to be used for one-
dimensional steady-state conduction with no heat
generation will be
d dT
k 0
dx dx
3
For constant k, the general solution is
T(x) = C1x +C2
Two boundary conditions will be required to
determine the two constants.
T(0) = Ts,1, and T(L) = Ts,2
The above will give
Ts, 2 Ts,1
C1 and C2 Ts,1
L
Substitution will give
x
T ( x ) Ts,1 (Ts, 2 Ts,1 )
L
4
The above shows T varying linearly with x.
Heat transfer rate or flux can be determined as:
dT kA
q x kA (Ts,1 Ts,2 )
dx L
'' qx k
q x (Ts,1 Ts,2 )
A L
3.1.2 Thermal Resistance
Thermal Ohm’s law can be formed as
Ts,1 Ts, 2 L L
qx Rt ; Re
( L / kA) kA A
5
ρ = σ-1 = resistivity of material (Ω.m)
For convection heat transfer
q = hA(Ts - T∞)
Corresponding thermal resistance
Ts T 1
R t ,conv
q hA
Since qx is constant, the thermal circuit diagram will
fig-chp3\fig.3.1.pptx give
Ts Tsur 1
R t ,rad
q rad hrA
7
3.1.3 The Composite Wall
Composite walls can be analyzed as series and parallel
thermal network. The schematic is seen in
fig-chp3\fig.3.2.pptx where the series thermal
circuit is also shown for both conduction and
convection heat transfer.
T,1 T, 4
qx
Ri
T,1 T, 4
qx
1 LA LB LC 1
h1A k A A k BA k C A h 4 A
8
For constant qx
T,1 Ts,1 Ts,1 T2 T2 T3 T3 Ts, 4 Ts, 4 T, 4
qx
(1 / h1A ) ( L A / k A A ) ( L B / k BA ) ( LC / k C A ) (1 / h 4 A )
1 LA LB LC 1 1
R tot
h1A k A A k B A k C A h 4 A UA
9
In general
Toverall 1
R tot R i
q UA
10
3.1.4 Contact Resistance
At the interface of composite materials, due to surface
roughness, there is what is called thermal contact
resistance. This results in a temperature drop across
the interface as shown in fig-chp3\fig.3.4.pptx.
This thermal contact resistance is designated by R t,c
and'' expressed
TA TBby
R t ,c
q 'x'
13
Solution
The thermal circuit showing conduction through the
skin fat and insulation, and convection and radiation
from the insulation surface
14
The total thermal resistance will be
Toverall (35 10)
R tot 0.25 K / W
q 100
From the thermal circuit diagram
1
Lsf Lins 1 1 1 Lsf Lins 1
R tot
k sf A k insA 1 / hA 1 / h r A A k sf k ins h h r
Air
To determine hr, iteration will be required. Assume of
To=291K (Tins) and use
h r (To Tsur )( T T ) 2
o
2
sur 15
Substitution of the values will give
hr = 0.95 x 5.67 x 10-8 (291 +283)(2912+2832) = 5.09
To check on the heat transfer from the outer surface,
we will use
To Tsur To Tsur 291 283
q 102W
1
1
1
A(h h r ) 1
1.8{2 5.09}
1
1 / hA 1 / h r A
19
beams that are wsn=3 μm wide and tsn=0.5 μm thick.
A platinum line of width wpt=1 μm and thickness
tpt=0.2 μm is deposited within each silicon nitride
beam to power the heated island. The entire
experiment is performed in a vacuum at a steady-
state temperature of Ts=308.4 K. Estimate the
thermal conductivity of the carbon nanotube.
kpt=71.6 W/m.K ksn=15.5 W/m.K
20
21
Solution
The thermal circuit diagram is shown below.
22
The cross-sectional areas of the materials in the
support beams are
Apt=wpt tpt = (1x10-6) x (0.2x10-6) =2 x 10-13m2
Asn=wsn tsn – Apt = (3x10-6) x (0.5x10-6)- 2 x 10-13=
= 1.3 x 10-12 m2
Cross-sectional area of the carbon nanotube is
Acn = πD2/4 = π(14x10-9)2/4=1.54 x 10-16 m2
The thermal resistance 1of each support is
1
k pt A pt k sn Asn 71.6x 2x10 13
15.5x1.3x10 12
R t ,sup 6
L pt Lsn 250 x10 250x10 6
= 7.25 x 106 K/W
23
The combined heat loss through both sensing island
supports is
qs = 2 (Ts-T∞)/Rt,sup = 2 x (308.4 – 300) / (7.25 x
106)
= 2.32 x 10-6 W = 2.32 μW
qh = q – qs = 11.3 – 2.32 = 8.98 μW
And from
q h Th T 1 8.98x10 6 x 7.25x106
Th T q h R t ,sup 300
2 R t ,sup 2 2
Th = 332.6 K 24
Using the circuit connecting Th and Ts
Th Ts
qs
s /( k cn A cn )
q ss 2.32 x10 6 x5x10 6
k cn 16
3113 W / m.K
A cn (Th Ts ) 1.54 x10 x (332.6 308.4)
25
3.2 ALTERNATIVE CONDUCTION ANALYSIS
For steady-state, no heat generation and no heat loss
from the sides ( fig-chp3\fig.3.5.pptx) qx is constant
and independent of x while A(x),dT/dx, and k(T)
may vary.
T may be T(x,y), but the y-coordinate effect may be
neglected. This makes it a one dimensional
analysis.
Starting with Fourier’s law
dT dx
q x kA or q x k(T )dT
dx A( x )
x dx T
qx k(T )dT
x o A( x ) To 26
For A(x) and k(T) known, the integration results in a
functional form of T(x).
3.3 RADIAL SYSTEMS
Cylindrical and spherical systems can be analyzed by
using the standard method and alternative method.
For the one dimensional case T=T(r)
3.3.1 The cylinder (standard method)
The appropriate equation for steady-state with no
generation is
1 d dT dT
kr 0 or kr cons tan t
r dr dr dr
27
Also
dT dT dT
q r kA k( 2rL ) ( 2L) kr
dr dr dr
which shows qr to be constant (independent of r).
The cylindrical configuration is shown in
fig-chp3\fig.3.6.pptx
Integrating for constant k gives
T(r) = C1 ln r + C2
Two boundary conditions
T(r1)=Ts,1 and T(r2) = Ts,2
28
The final solution becomes
Ts,1 Ts, 2 r
T( r ) ln
r1 r2
ln
r2
dT Ts,1 Ts, 2 1 2Lk(Ts,1 Ts, 2 )
q r kA k( 2rL )
dr r1 r r2
ln ln
r2 r1
This gives
ln ( r2 / r1 )
Rt
2Lk
The thermal circuit is also shown in the figure.
For composite cylinders shown in
fig-chp3\fig.3.7.pptx 29
Using the thermal circuits
T,1 T, 4
qr
1 ln( r2 / r1 ) ln( r3 / r2 ) ln( r4 / r3 ) 1
2r1Lh1 2k A L 2k B L 2k C L 2r4 Lh4
Example 3.3
A thin-walled copper tube of radius r i is used to
transport a low-temperature refrigerant and is at a
temperature Ti that is less than that of the ambient
air at T∞ around the tube. Is there an optimum
thickness associated with application of insulation to
the tube? Use graph for justification. 31
Solution
The arrangement is shown in the figure below. Use
cellular glass for insulation k=0.055 W/m.K and h=
5 W/m2.K and ri=5 mm.
32
Thermal circuit for example 3.3
33
Using the thermal circuit per unit length of the tube
' ln( r / ri ) 1 ' T Ti
R tot and q '
2k 2rh R tot
The above equation shows that with increase in r the
conduction resistance increases while that of
convection decreases. This indicates that there may
be an optimum thickness of insulation that will
minimize the heat transfer. This can be achieved by
using
'
dR 1 1
0 which gives
tot
0
dr 2kr 2r h
2 34
The above gives
k
r
h
Checking the second derivative gives
2 '
d R 1
tot
0 at r k / h
dr 2
2k / h
3 2
dT 2 dT
q r kA k( 4r )
dr dr
q r r2 dr Ts , 2
4 r1 r 2
k(T )dT
Ts ,1
For constant k
38
4k(Ts,1 Ts, 2 )
qr
1 1
r1 r2
1 1 1
R th
4k r1 r2
39
Example 3.4
A spherical, thin-walled metallic container is used to
store liquid nitrogen at 77 K. The container has a
diameter of 0.5 m and is covered with an evacuated,
reflective insulation composed of silica powder.
The insulation is 25 mm thick, and its outer surface
is exposed to ambient air at 300 K. The convection
coefficient is known to be 20 W/m 2.K. The latent
heat of vaporization and the density of liquid
nitrogen are 2 x 105 J/kg and 804 kg/m3,
respectively. (1) What is the rate of heat transfer to
the liquid nitrogen? (b) What is the rate of liquid
boil-off?
40
Figure for example
41
Solution
(1) The thermal circuit is shown below
1 1 1 1
R t ,cond R t ,conv
4k r1 r2 h( 4r2 )
2
Hence
T, 2 T,1
q
(1 / 4k )[(1 / r1 ) (1 / r2 )] [1 / h( 4r2 )]
2
300 77
1 1 1 1
4 (0.0017) 0.25 0.275 [20( 4 )( 0.275) 2 ]
42
Thermal circuit for example 3.4
43
which gives
223
q 13.06 W
17.02 0.05
(2)Energy balance on the control volume (liquid N 2)
E in E out 0 h fg 0
q m
is
and the boil off m
q 13.06
m 5
6. 53x10 5
kg / s 5.64 kg / day
h fg 2x10
m
5.64
V 0.007 m 3 / day ( 10.8% of container )
804 44
3.4 CONDUCTION WITH THERMAL ENERGY
GENERATION
Internal energy generation could be from current,
nuclear, or exothermic chemical reaction where the
generation will be assumed to be uniform. Typical
for electric current is
E g I 2 R and the energy generation per unit
volume will be
E g I2R
q ' ' '
V V
45
3.4.1 The Plane Wall
The applicable equation for constant k is
2
dT q ' ''
2
0
dx k
And the surfaces are maintained at T s,1 and Ts,2 as
shown in fig-chp3\fig.3.9.pptx
The general solution is
q 2
'' '
T x C1x C2
2k
The boundary conditions to determine C 1 and C2 are
T(-L)=Ts,1 and T(L)=Ts,2
46
Applying the boundary conditions will give
Ts, 2 Ts,1 q 2 Ts, 2 Ts,1
' ''
C1 and C2 L
2L 2k 2
Substitution will give the temperature distribution as
2
q L x (Ts, 2 Ts,1 ) x (Ts, 2 Ts,1 )
'' ' 2
T( x ) 1
2 k L 2 L 2
Unlike the previous equations, heat transfer is no more
independent of x as the derivative dT/dx shows.
For symmetric boundary conditions T s,1=Ts,2=Ts
q ''' L2 2
x
T( x ) 1 2 Ts
2k L 47
Maximum temperature exists at the midplane (x=0)
with a magnitude of
q ''' L2 q ''' L2
T (0) To Ts To Ts
2k 2k
This will give the dimensionless temperature
distribution as
2 2
T ( x ) Ts x T ( x ) To x
1
To Ts L Ts To L
53
2. At the outer surface, x=LA +LB
''
q h (T2 - T∞)
'''
q L A q
''
Also Equating the two gives
q ''' L A 6
1.5x10 x 0.05
T2 T 30 105o C
h 1000
Since To is given in terms of T1, using the circuit
diagram shown below
''
q
54
Using
'' T1 T '' '' ''
q '' ''
; T1 T ( R cond, B R conv, B ) q
R cond,B R conv
'' LB '' 1
R cond, B R conv
kB h
0.02 1 6 o
T1 30 x1. 5x10 x 0 . 05 30 85 115 C
150 1000
Substituti on gives
1.5x106 x 0.05
To 115 25 115 140o C
2x 75
55
Thermal circuit for example 3.4
Temperature distribution for h = 200 W/m 2.K
56
Thermal circuit for example 3.4
Temperatur distribution for h = 1000 W/m 2.K
57
3.4.2 Radial Systems
For the cylinder shown in fig-chp3\fig.3.10.pptx , the
heat generated is convected from the surface of the
cylinder.
The appropriate equation for analysis is (constant k)
1 d dT q '''
r 0
r dr dr k
Integrating twice gives
q ''' 2
T ( r ) r C1 ln r C2
4k
58
Boundary conditions are
dT (0)
0 and T ( ro ) Ts
dr
The first gives C1 = 0 and the second gives
q ''' 2 This gives the temperature
C2 Ts ro
4k distribution as
q ''' ro2 r
2
T( r ) 1 2 Ts
4k ro
Using the centerline temperature T(0) = T o
2
T ( r ) Ts r
1
To Ts ro 59
To relate Ts to T∞, use is made of the equality of heat
generated and heat convected from surface
q ''' (ro2 L) h( 2ro L)( Ts T )
q ''' ro
Ts T
2h
One needs to make a note that the thermal resistance
approach has not been used as the heat transfer rate
with heat generation is not constant.
60
Example 3.6
Consider a long solid tube, insulated at the outer
radius r2 ( adiabatic surface with a prescribed
temperature Ts,2)and cooled at the inner radius r1,
with uniform heat generation within the solid.
1. Obtain the general and particular solution for the
temperature distribution in the tube.
2. Determine the heat removal rate per unit length of
tube.
3. If the coolant is available at a temperature T ∞,
obtain an expression for the convection coefficient
that would have to be maintained at the inner
61
surface to allow for operation at prescribed
T
values of s, 2 and
q '' '
.
62
Solution
(1) The general solution is
q 2
'''
T ( r ) r C1 ln r C2
2k
Boundary conditions dT ( r )
2
0
T(r2) = Ts,2 and dr
These give
q ''' 2 q ''' 2 q ''' 2 r2
C1 r2 and C2 Ts, 2 r2 r2 ln
2k 4k 2k r
And the temperature distribution after substitution
q ''' 2 2 q ''' 2 r2
T( r ) Ts, 2 ( r2 r ) r2 ln 63
4k 2k r
(2) Heat removal rate is the conduction heat rate at r=r 1
dT ( r1 ) q '''
q r
''' 2
q ( r1 ) k ( 2r1 )
'
r k 2r1 r1 2
dr 2k 2k r1
qr (r1 ) q (r2 r1 )
' '' ' 2 2
' '
q cond q convsurfaceor
(3) At the inner
q ( r2 r1 ) h 2r1 (Ts,1 T )
'' ' 2 2
64
Hence
q ''' ( r22 r12 )
h
2r1 (Ts,1 T )
3.5 HEAT TRANSFER FROM EXTENDED
SURFACES
The characteristics of an extended surface is shown in
fig-chp3\fig.3.11.pptx . For T1>T2, heat transfer by
conduction occurs in the strut. For T1>T2>T∞, in
addition to heat conduction there will be convection
heat transfer from the surfaces of the strut thus
dT
decreasing qx continuously and hence . When
dx
compared with pure conduction the slope at the base
65
is increased thus increasing the conduction rate.
Thus extended surfaces are used to enhance the heat
transfer rate by increasing the surface area. The
term fin is used for extended surfaces.
Consider the heat transfer from surface given in
fig-chp3\fig.3.12.pptx (a). For fixed Ts, T∞ and A,
heat transfer can be maximized by increasing h,
which will require a higher velocity of fluid (need of
blower or pump)-becomes costly. The other option
is to increase the surface area for convection as
shown (b) where fins or extended surfaces are used.
• k has pronounced effect on the heat transfer effect
Infinite k-no temperature gradient, max q
fig-chp3\fig.3.13.pptx and fig-chp3\fig.3.14.pptx 66
Selection depends on space, weight, manufacturing
and cost reduction as well as the reduction of h and
increase of ∆P.
3.5.1 A General Conduction Analysis
Temperature distribution along the fin is to be
obtained. This will allow the heat transfer rate to be
determined from the surface and tip of fin shown in
fig-chp3\fig.3.15.pptx.
The heat transfer originates from the base and finally
transferred through the surface and tip of the fin.
Since the fins involved are very thin it can safely be
assumed the heat transfer is one-dimensional.
67
Energy balance on the differential CV gives
qx = qx+dx + dq conv
dT dq x
q x kAc q x dx q x dx
dx dx
dT d dT
q x dx kAc k Ac dx
dx dx dx
qconv h dAs (T T )
Substitution in the energy balance equation gives
d dT h dAs
Ac (T T ) 0
dx dx k dx 68
After performing the differentiation, the final general
fin equation becomes
d T 1 dAc dT 1 h dAs
2
2
(T T ) 0
dx Ac dx dx Ac k dx
This equation will be used on specific fin geometries
to get the particular fin equations.
3.5.2 Fins of Uniform Cross-Sectional Area
The rectangular and the pin fin are shown in
fig-chp3\fig.3.16.pptx .
Ac=constant, dAc/dx =0 As=Px dAs/dx=P
69
Substitution in the general equation gives
d 2T hP
2
(T T ) 0
dx kAc
The above equation can be further simplified if we
define θ(x) = T(x) – T∞
dθ/dx=dT/dx θ is also called excess temperature
This will give
d2
hp
2
m 0
2
where m 2
dx kAc
The above is a linear, homogeneous, second order
differential equation with constant coefficients
70
General solution
mx d mx
( x ) C1e C2 e
mx mx
C1me C2 me
dx
Boundary Conditions
(1)Common θ(0) = Tb – T∞ = θb
(2) There are four possible cases
I. Convection heat transfer from the tip (TL=T(L))
fig-chp3\fig.3.17.pptx
dT
hAc [T ( L ) T ) kAc or
dx @ x L
d
h ( L ) k
dx @ x L 71
0
74
IV. The fin is very long such that as
L→∞, T→T∞ or θL→0
The solution
mx
e q f M
b
table3.1.docx summarizes the solutions for different
BC.
Example 3.7
A very long rod 5 mm in diameter has one end
maintained at 100oC. The surface of the rod is
exposed to ambient air at 25oC with a convection
heat transfer coefficient of 100 W/m 2.K. 75
1. Determine the temperature distributions along rods
constructed from Cu, Al and SS with k=398, 180,
14 W/m.K, respectively. What are the
corresponding heat losses from the rods?
2. Estimate how long the rods must be for the
assumption of infinite length to yield an accurate
estimate of the heat loss.
76
Solution
1. θ/θb=e-mx or T=T∞+(Tb – T∞)e-mx
where m=(hP/kAc)1/2 = (4h/kD)1/2= 14.2, 21.2,
75.6 m-1. T(x) shown below
77
qf = (hPkAc)1/2θb =(100π x 0.005 x 398 x (π/4) x
0.0052)1/2 (75)= 8.3W
For Al and SS qf = 5.6 W and 1.6 W respectively.
2. Since no heat transfer at the tip, comparing cases II
and IV one can approximate with
tanh mL 0.99 or mL 2.65
Hence a rod may be assumed to be infinitely long if
1/ 2
2.65 kAc
L L 2.65
m hP
For copper
398( / 4)( 0.005) 2
L 0.19 m
100( x 0.005) 78
Corresponding values for Al and SS are 0.13 and 0.04
m respectively.
If the approximation is to accurately predict the
temperature distribution one may use
θ(L)/θb = exp(-mL)<0.01
This gives mL>4.6 in which case L∞ ≈ 0.33, 0.23, and
0.07 for the copper, aluminum, and stainless steel.
This is consistent with the graphical representation
79
3.5.3 Fin Performance
As the fin itself does have conduction resistance, there
may be no assurance that the heat transfer will be
increased by using fins. The evaluation uses fin
effectiveness, εf defined by
qf
εf
hA c, b θ b
ηf: 1 → 0 as L: 0 → ∞
For a fin with an active tip, the length can be slightly
increased (corrected) so that we have an adiabatic
tip, and use the simplified relation of case II. The
corrected lengths are given as
Lc = L + (t/2) - rectangular fin
Lc = L + (D/4) - pin fin
Errors associated with these approximations are
negligible if ht hD
or 0.0625
k 2k 84
For w >> t which is usually the case P ≈ 2w
And (P/Ac) = (2w/wt) = 2/t
1/ 2 1/ 2
hP 2h
mLc Lc Lc
kAc kt
Multiplying numerator and denominator by (L c)1/2 and
introducing a corrected fin profile area A p=Lct, it
follows that
1/ 2
2h
mL c 3/ 2
Lc
kA 1/ 2
p
2h
ηf is plotted as a function of L3/ 2
in
c
kAp
85
fig-chp3\fig.3.18.pptx for rectangular, triangular, and
parabolic profiles.
3.5.4 Fins of Nonuniform Cross-Sectional Area
Consider the annular fin shown in
fig-chp3\fig.3.19.pptx . While the thickness is
constant, the cross-sectional area A c varies with r.
Ac = 2πrt and As = 2π(r2 - r12)
Substituting in the general fin equation will give
2
d T 1 dT 2h
2
(T T ) 0
dr r dr kT
With m2 = (2h/kt) and θ =T - T∞
86
The equation becomes
d 1 d
2
2 d
2
d
2
- m 2
0 r 2
r - m r 0
2 2
dr r dr dr dr
This is a modified Bessel equation of order zero
whose general solution is given by (
Hyperbolic Functions
Error Function.docx
90
3.5.5 Overall Surface Efficiency
Unlike ηf which considers a single fin, the overall
surface efficiency, ηo considers the array of fins and
the base surface. fig-chp3\fig.3.21.pptx shows
typical arrays of fins.
In each case the overall efficiency is defined as
qt qt
o
q max hA t b
qt = total heat transfer rate = qf + qb
At = total surface area = NAf + Ab
91
The total heat transfer rate from fins and bare surface
by convection is given by and then substitution of
Ab =At - NAf
q t = N η f h A f θb + h A b θb
NAf
q t h[ Nf A f ( A t NAf )] b hA t 1 (1 f ) b
At
Substitution in the expression for ηo gives
NAf
o 1 (1 f )
At
92
Using thermal fin resistance, the overall thermal resistance
can be expressed as
b 1
R t ,o
q t o hA t
For fins machined as an integral part of the wall, the total
resistance can be seen to be one of parallel circuit shown
in fig-chp3\fig.3.22(a).pptx . This circuit will give the
same overall efficiency as determined earlier.
But if the fins are manufactured separately and are
attached (metallurgical, adhesive joint) or press fit to the
wall, ( fig-chp3\fig.3.22(b).pptx ) there will be a
thermal resistance, Rt,c, to be considered.
93
Fig.3.22(b) Fin array and thermal circuit-fins
attached to base 94
The effective circuit resistance will be
qt qt b 1
o ( c ) R t.o( c )
q max hA t b q t o ( c ) hA t
Using the parallel/series circuit shown the effective
overall efficiency can be determined as
NAf f
o ( c ) 1 1
At C1
where
C1 1 f hA f ( R 't',c / A c,b )
While manufacturing make sure Rtc<<Rtf
95
Example 3.8
The engine cylinder of a motor cycle is constructed of
2024-T6 aluminum alloy and is of height H = 0.15
m and outside diameter D = 50 mm. Under typical
operating conditions the outer surface of the
cylinder is at a temperature of 500 K and is exposed
to ambient air at 300 K, with a convection
coefficient of 50 W/m2.K. Annular fins are
integrally cast with the cylinder to increase heat
transfer to the surroundings. Consider five such
fins, which are of thickness t = 6 mm. length L = 20
mm, and equally spaced. What is the increase in
heat transfer due to use of the fins?
96
Solution
At NAf 2r1 ( H Nt )
5 x0.0105 2 (0.025)[0.15 5 x0.006] 0.0716m 2
r2 c
1.92, Lc 0.023m, Ap 1.380 x10 4 m 2 gives
r1
h 3/ 2
Lc 0.15
kA
p
105
Solution
1. Volumetric flow rate air for cooling
V VA and A W( H t )
c c c
Substitution gives
V[ W( H t ) 9.4[0.05(0.026 0.006)]
V c
3 3
9.4x10 m / s
This enables us to use the formula for power
consumption by the fan
3
Pfan CV 1000x 9.4x10 9.4W
Pnet Pfc Pfan 9 9.4 0.4W
106
As the fan consumes more power than is generated,
the system cannot produce net power.
2. To reduce the fan power by 50%, the volumetric
flow rate of air must be reduced to V 4.7x10 3 m 3 / s
If we consider half of the fins the thermal
resistances can be written as follows:
Contact resistance of the fin base:-
R t ,c R 't',c / Lc Wc 10 3 /( 0.05x 0.05) 0.4 K / W
Fin base resistance:-
R t ,base t b / kLc Wc 0.002 /( 200x 0.05x 0.05) 0.004 K / W
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Thermal circuit for example 3.9
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Bare surface of the base:-
R t ,b 1 /[ h( Wc Nt f ) Lc 1 /[ h(0.05 Nx0.001)0.05]
The above cannot be evaluated until N and h are
determined
Fin resistance:-
For a single fin (insulated tip)
q f hPkAc b tanh mL R t ,f b / q f 1 / hPkAc tanh mL f
P = 2(Lc +tf) =2(0.05+0.001)=0.102 m
Ac = Lctf = 0.05x0.001=0.00005 m2
m hP / kAc hx 0.102 /( 200x 0.00005)
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Substitution will give
( hx 0.102 x 200x 0.000005) 1 / 2
R t ,f
tanh( mx 0.008)
And for N fins, qf(N) =Nqf this will give
Rt,f(N) = θb/Nqf = Rt,f/N
a = (Wc – Ntf)/N = (0.05 – Nx0.001)/N
1 1 1
R tot R t ,c R t ,base R equiv and R equiv [ R t ,b R t ,f ( N )]
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