DeviceTools
DeviceTools
ADS Momentum
HFSS
CST Microstripes
FDTD Overview – Cells
A three-dimensional problem space is composed of cells
5/60
FDTD Overview – Material grid
A three-dimensional problem space is composed of cells
6/60
Transformation from Time-Domain to Frequency-Domain
Results can be obtained for frequency domain using Fourier Transform
S21
Incident plane wave
8/60
Scattering Problems
H inc H scat Einc Escat H inc 0 Einc
t t
A dielectric sphere
9/60
Scattering from a Dielectric Sphere
10/60
Wireless Personal Communications Devices
Source: Allen Taflove, “A Perspective on the 40-Year History of FDTD Computational Electrodynamics,”
Applied Computational Electromagnetics Society (ACES) Conference, Miami, Florida, March 15, 2006. 11/60
Can be found at http://www.ece.northwestern.edu/ecefaculty/Allen1.html
Also for optics: Focusing Plasmonic Lens
Source: Allen Taflove, “A Perspective on the 40-Year History of FDTD Computational Electrodynamics,”
Applied Computational Electromagnetics Society (ACES) Conference, Miami, Florida, March 15, 2006.
Can be found at http://www.ece.northwestern.edu/ecefaculty/Allen1.html
Different Methods of
Electromagnetic Analysis
MO
M
13
Example of Adaptive meshing
Post
Post
14
Some Typical High-Frequency Electromagnetic
Applications
Antenna
Waveguide Components
15
EM Summary
• Lots of choices – you will use Maxwell-2D
• Lots of data
– Fields
– Terminal currents/voltages
– S parameters
• Typically slow
• Often hard to learn
Multi-physics - Comsol
equations*
* Feynman “Famous Lectures”
COMSOL’s Methodology for Modeling Multiphysics
Phenomena
• Development goals:
– To create a software where
scientists and engineers can
formulate any system of partial
differential equations (PDEs)
based on the laws of physics
Microwave-thermal-structural
– To formulate user interfaces, multiphysics couplings in a
waveguide circulator
based on the above methods, for
the most common areas in
applied physics and engineering
COMSOL’s Methodology for Modeling Multiphysics Phenomena
Example: Fully Coupled Physics with Joule Heating and CFD
• Definition in the
graphical user interface Fluid dynamics Thermal analysis Electromagentic
and heat transfer in solids fields
• Automatic assembly
using equation interpretation
Assembling of equations
and then discretization and discretization
using FEM
Outlet
Inlet
Automatic meshing with
tetrahedral elements.
Quadrilateral and prism
elements are also available as
well as manual settings and
adaptive meshing.
The slice plot shows
temperature.
– Radiation hardness
+ve +ve
n-type
electrode
electrons
Planar
n-type
electrode 3D
300
µm
electrons
Lightly
doped
p-type holes
holes
silicon p-type
electrode
p-type
electrode
Around
Particle
30µm
Particle
-ve
Sentaurus Device Editor
• New feature of Sentaurus TCAD
• Start with sde
• Can work in 2D and 3D modes
• Has functions for complicated
shapes like circles, spheres etc.
– In command files or MDraw, these
must be built up point-by-point,
which is very inconvenient
• Has a built-in command line, and
can be controlled with scripts
– In 3D, easier than using mouse!
– Possible to insert parameters
using
Workbench
Sentaurus Device Editor
Mesh tool
• noffset3d can be run
using command files or
through Structure Editor,
just like mesh
• Other mesh tool produce
axis aligned meshes
• This tool produces
unstructured meshes
– More effective for creating
curved structures
• Input command files
more complicated – see
“Mesh Generation Tools
User Guide”
Sentaurus Device
• Takes mesh, applies semiconductor equations and boundary
conditions (in discrete form) and solves
• Physics models: Works by modelling electrostatic potential
(Poisson’s equation) and carrier continuity
Poisson s .E s q( p n N )
2
Electron n 1
.J n (G R ) where J p q n E qD p p
continuity t q
Hole p 1 J n q n E qDnn
.J p (G R ) where
continuity t q
See Fichtner, Rose, Bank, “Semiconductor Device Simulation”, IEEE Trans. Electron Devices 30 (9), pp1018, 1983
Z (um)
300um thick, 0
30
doping 7*10 11cm-3
p+ column
250um length
10um diameter 40
0
20 0 0
50
p+ 130000
On back side:
Oxide layer covered with metal 60
55um pitch
All p+ columns connected together 0 10 20 30 40
30 00 0 D (um)
40 00
40 0
00
Semiconductor Device Summary
• A few choices
• Lots of Data
– n, p and V
– Currents, charges
– Heat generation
– Etc.
• Typically slow
• Hard to Use
• Lots of physical insight if are smart enough
• Remember all “models are wrong”