SWI 3.

2
TECHNOLOGY

Senior Welding Inspection

NDT & Visual Inspection
Course Reference WIS 10
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 SWI
SWI3.2
3.2
TECHNOLOGY

Basically a revision area

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 SWI 3.2
TECHNOLOGY

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 SWI 3.2

Would you accept or reject this weld?

TECHNOLOGY

Incomplete filled groove

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TECHNOLOGY

Arc strikes

Possible incomplete filled groove

Poor cap profile

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 SWI 3.2

Porosity
TECHNOLOGY

Root piping (hollow bead)

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TECHNOLOGY

Lack of root
penetration Toe Overlap
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TECHNOLOGY

Lack of root fusion Lack of root Penetration

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TECHNOLOGY

Poor stop/starts

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TECHNOLOGY

Cap undercut
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TECHNOLOGY

Concave Root

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TECHNOLOGY

Burn Through

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TECHNOLOGY

Crater pipe

Crater cracks

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 SWI 3.2
TECHNOLOGY

Linear Misalignment
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 SWI 3.2

WHAT WOULD A VISUAL

TECHNOLOGY

INSPECTION OF THIS WELD

REVEAL?

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 SWI 3.2

SO:
TECHNOLOGY

HOW USEFUL IS VISUAL

INSPECTION OF WELDS?

There are 4 main things limiting its

effectiveness:

What are they?

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 SWI 3.2

THE EFFECTIVENESS OF VISUAL

TECHNOLOGY

WELD EXAMINATION
1. Different codes IS LIMITED BY: 3.Problems
and standards with
interpretation
(people see
BS
things
5289
differently)

2. The nature of weld

defects themselves:
(they are not all on the
surface)
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What’s No. 4 Clue
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 SWI 3.2

CLUE
TECHNOLOGY

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 SWI 3.2
TECHNOLOGY

4. VISUAL INSPECTION DOES

NOT ALWAYS REVEAL ALL SURFACE
DEFECTS

IT’S NOT AS SENSITIVE AS NDT

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 SWI 3.2
TECHNOLOGY

The four basic methods

 Magnetic particle inspection (MT)

 Dye penetrant inspection (PT)

 Radiographic inspection (RT)

 Ultrasonic inspection (UT)

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3.2
TECHNOLOGY

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 SWI 3.2

 Surface and sub-surface detection

TECHNOLOGY

 This detection method uses high frequency sound waves,

typically above 2MHz to pass through a material
 A probe is used which contains a piezo electric crystal to
transmit and receive ultrasonic pulses and display the
signals on a cathode ray tube or digital display
 The actual display relates to the time taken for the ultrasoni
c pulses to travel the distance to the interface and back
 An interface could be the back of a plate material or a defec
t
 For ultrasound to enter a material a couplant must be introd
uced between the probe and specimen

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 SWI 3.2

Pulse echo UT Set, Digital

TECHNOLOGY

signals
A scan Display

Compression probe Thickness checking the material

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 SWI 3.2

Ultrasonic testing is a good technique for the

TECHNOLOGY

detection of plate laminations and thickness surveys

Initial pulse 1st Back wall

echo

Material Thk
Lamination Defect

0 10 20 30 40 50

CRT Display

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 SWI 3.2

Ultrasonic testing is a good technique for the

TECHNOLOGY

detection of plate laminations and thickness surveys

1st defect 2nd defect
Initial pulse echo echo

Lamination Defect

0 10 20 30 40 50

CRT Display

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Lamination detected using a compression probe
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 SWI 3.2
TECHNOLOGY

UT Set
A Scan
Display

Angle Probe
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TECHNOLOGY

initial pulse

defect echo
defect 0 10 20 30 40 50

½ Skip CRT Display

initial pulse

defect echo
defect 0 10 20 30 40 50

Full Skip CRT Display

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 SWI 3.2
TECHNOLOGY

V1/A2 Block

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 SWI 3.2
TECHNOLOGY

60 o
50 o
40 o

50 R
0 25 100

25
70o

R
V2 (A4) Block Thickness 12 or 20mm

10
0
R

0 100 200

V1 (A2) Block Thickness 25mm

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 SWI 3.2

Advantages Disadvantages
TECHNOLOGY

Rapid results Trained and skilled

Both surface and sub- operator required
surface detection Requires high operator skill
Safe Good surface finish
Capable of measuring the required
depth of defects Defect identification
May be battery powered Couplant may contaminate
Portable No permanent record
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TECHNOLOGY

Remember in the CSWIP 3.2 Senior Welding Inspectors

examination your are required to comment on three NDT
reports

 Time allowed 1 hour for three reports

 1 UT, 1 RT and 1 MT or PT reports

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 SWI 3.2

Instructions
TECHNOLOGY

1. Check each report number against the numbers on the report given.
2. You are required to scrutinise the attached report and submit written
comments on the technical accuracy of each report.

3. For the purpose of this test the standards/codes/specifications have

been deliberately omitted, therefore you are NOT required to accept
or reject the weld, this is not part of the test.

4. The section headed ACTION, for the purpose of these reports,

should contain any instructions that may be necessary to correct a
faulty application of a NDT technique

NOTE YOU MUST CLARIFY ALL STATEMENTS

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Client/location
TECHNOLOGY

Item number
Weld identification
Specifications/procedures
Operators name/signature/position
Date of test
Equipment used including serial numbers
Inspection sensitivities dB etc
Surface conditions
Attenuation checks/calibrations
Weld geometry as welded etc
Test limitations
Details of any flaws/sizes/sizing methods
Report numbers
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SWI3.2
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TECHNOLOGY

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 Surface and slight sub-surface detection

TECHNOLOGY

 Relies on magnetization of component being tested

 Ferro-magnetic materials only can be tested
 A magnetic field is introduced into a specimen being tested
 Methods of applying a magnetic field, yoke, permanent
magnet, prods and flexible cables.
 Fine particles of iron powder are applied to the test area
 Any defect which interrupts the magnetic field, will create a
leakage field, which attracts the particles
 Any defect will show up as either a dark indication or in the
case of fluorescent particles under UV-A light a green/yellow
indication
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TECHNOLOGY

Collection of ink particles

due to leakage field

Electro-magnet (yoke) DC or AC

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TECHNOLOGY

A crack like
indication

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TECHNOLOGY

Alternatively to contrast
inks, fluorescent inks
may be used for greater
sensitivity. These inks
require a UV-A light
source and a darkened
viewing area to inspect
the component

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 SWI 3.2

Typical sequence of operations to inspect a weld

TECHNOLOGY

Clean area to be tested

Apply contrast paint
Apply magnetisism to the component
Apply ferro-magnetic ink to the component
during magnatising
Iterpret the test area
Post clean and de-magnatise if required
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 SWI 3.2

Advantages Disadvantages
TECHNOLOGY

Simple to use Surface or slight sub-

Inexpensive surface detection only
Magnetic materials only
Rapid results
No indication of defects
Little surface preparation
depths
required Only suitable for linear
More sensitive than visual defects
inspection Detection is required in
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two directions
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 SWI 3.2

Client/location
Item number
TECHNOLOGY

Weld identification
Specifications/procedures
Operators name/signature
Date of test
Equipment used including serial numbers
Current used and type e.g AC or DC
Inspection sensitivities pentameters etc
Surface conditions
Consumables, ink, contrast paints etc.
Weld geometry as welded etc
Test limitations
Viewing conditions, details of any flaws present.
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Report numbers
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 SWI
SWI3.2
3.2
TECHNOLOGY

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 SWI 3.2

 The principles of radiography

TECHNOLOGY

 X or Gamma radiation is imposed upon a test object

 Radiation is transmitted to varying degrees dependant
upon the density of the material through which it is
travelling
 Thinner areas and materials of a less density show as
darker areas on the radiograph
 Thicker areas and materials of a greater density show
as lighter areas on a radiograph
 Applicable to metals,non-metals and composites

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TECHNOLOGY

X - Rays Gamma Rays

Electrically generated Generated by the
decay of unstable
atoms
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 SWI 3.2
TECHNOLOGY

Source

Radiation beam Image quality indicator

10fe16

Radiographic film Test specimen

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TECHNOLOGY

Source

Radiation beam Image quality indicator

10fe16
10fe16

Test specimen

Radiographic film with latent image after exposure

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 SWI 3.2
TECHNOLOGY

Density - relates to the

degree of darkness

Contrast - relates to the degree of difference

Definition - relates to the degree of sharpness

Sensitivity - relates to the overall quality of the

radiograph

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TECHNOLOGY

1.23 1.88 2.13 2.44 2.63 2.93 3.03 3.53 4.23

Density Strip
 Density is measured by a
densitometer

 A densitometer should be Densitometer

calibrated using a density strip
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TECHNOLOGY

 IQI’s / Penetrameters are used to measure

radiographic sensitivity and the quality of
the radiographic technique used They are
not used to measure the size of defects
detected
 Standards for IQI’s include:
BS 3971
BS EN 462
DIN 62
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TECHNOLOGY

7FE12

Step / Hole type IQI Wire type IQI

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TECHNOLOGY
4T dia
T dia
Penetrmeter Design
2T dia
Minimum Penetrmeter Thickness 0.12mm
Minimum Diameter for 1T Hole 0.25mm

17
12mm
Minimum Diameter for 2T Hole 0.50mm
Minimum Diameter for 4T Hole 1.00mm
38mm
T

IQI Sensitivity
1 Hole visible = 4T
2 Holes visible = 3T
3 Holes visible = 2T
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Duplex type IQI Wire type IQI

TECHNOLOGY

Step/Hole type IQI

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TECHNOLOGY

Step/Hole Type IQI

Wire Type IQI

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 SWI 3.2


TECHNOLOGY

Ideally IQI should be placed on the source side

 IQI sensitivity is calculated from the following
formula

Sensitivity % = Thickness of thinnest step/wire visible x 100

Object Thickness

As a rough guide sensitivity = 2.0% or better.

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 Image Quality Indicators SWI 3.2

Thickness BS 3971 DIN 54 109 BS EN 462-2 BS EN 462-1

(mm) STEP WIRE WIRE (DIN 62) STEP/HOLE WIRE
1-6 7-12 13-18 4-10 9-15 15-21 1-7 6-12 10-16 H1 H5 H9 H 13 W1 W6 W 10 W 13
0.050 7
0.063 7 6
TECHNOLOGY
0.08 6 5
0.10 5 7 7 4
0.125 6 4 6 6 6 3
0.15
0.16 5 3 5 5 5 2
0.20 4 2 7 4 4 4 1
0.25 3 1 6 7 3 3 7 3
0.30
0.32 2 5 6 2 2 6 6 2
0.35
0.40 1 4 5 1 1 5 5 1
0.50 6 3 4 4 4
0.60
0.63 5 2 3 3 3
0.75
0.80 4 1 7 7 2 2 6 7 2
0.90
1.00 3 6 6 1 1 5 6 1
1.20
1.25 2 5 5 4 5
1.50 1 4
1.60 4 3 4
1.80 3
2.00 6 2 3 2 6 3
2.50 5 1 2 1 5 2
3.00
3.20 4 1 4 1
4.00 3 3
5.00 2 2
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 SWI 3.2

A Radiograph of a 16mm thick butt weld is viewed

TECHNOLOGY

under the correct conditions, 5 wires visible on the

radiograph IQI pack 6-12 Din 62, what is the IQI
sensitivity?

Sensitivity = Thickness of thinnest wire visible X 100

Total weld thickness
Sensitivity = 0.4 X 100
16
Sensitivity = 2.5 %

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 SWI 3.2

Using the same IQI pack 6-12 Din 62, How many IQI
TECHNOLOGY

wires must be visible to give an IQI sensitivity of 2 %

Thickness of thinnest wire visible =

Sensitivity X Total weld thickness
100

= 2.0 X 16
100

= 0.32 6 wires visible

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 SWI 3.2
TECHNOLOGY

 Single Wall Single Image (SWSI)

- film inside, source outside
 Single Wall Single Image (SWSI) panoramic
- film outside, source inside (internal exposure)
 Double Wall Single Image (DWSI)
- film outside, source outside (external exposure)
 Double Wall Double Image (DWDI)
- film outside, source outside (elliptical exposure)
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TECHNOLOGY

Film

Film

IQI’s should be placed source side

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TECHNOLOGY

Film

 IQI’s are placed on the film side

 Source inside film outside (single exposure)
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TECHNOLOGY

Film
 IQI’s are placed on the film side
 Source outside film outside (multiple exposure)
 This technique is intended for pipe diameters
19
over 100mm
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 SWI 3.2
TECHNOLOGY

Identification
 Unique identification
EN W10

 IQI placing
 Pitch marks A B
indicating readable ID
film length MR11
Radiograph
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TECHNOLOGY

Film
 IQI’s are placed on the source or film side
 Source outside film outside (multiple exposure)
 A minimum of two exposures
 This technique is intended for pipe diameters
19
less than 100mm
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 SWI 3.2
TECHNOLOGY

Identification 4 EN W10

3
 Unique identification
 IQI placing
 Pitch marks 1 2
indicating readable ID
film length MR12
Shot A Radiograph

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 SWI 3.2
TECHNOLOGY

Elliptical
exposure

When calculating the IQI sensitivity, take two

wall thickness
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 SWI 3.2

Advantages Disadvantages
TECHNOLOGY


Permanent record 
Expensive consumables

Little surface preparation 
Bulky equipment

Defect identification

Harmful radiation

No material type limitation

Defect require significant
depth in relation to the

Not so reliant upon operator
radiation beam
skill

Slow results

Thin materials

Very little indication of

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depths
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 SWI 3.2

Client/location
TECHNOLOGY

Item number
Weld identification
Specifications/procedures
Operators name/signature
Date of test
Details of equipment used manual external,
battery internal crawler) including manufactures
name and serial numbers
Tube current and voltage used if applicable
Source type/strength if applicable
Exposure times
Inspection sensitivities IQI and density
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 SWI 3.2

Surface conditions
TECHNOLOGY

Geometry set-up FFD, OFD, Source/focal spot size

Technique used
Weld geometry as welded etc
Test limitations
Details of any flaws present.
Film and screen types.
Processing details, manual or automatic
Report numbers

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SWI3.2
3.2
TECHNOLOGY

Basically a revision area

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 SWI 3.2
TECHNOLOGY

Lack of root
penetration

What’s the defect?

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TECHNOLOGY

Lack of root
Fusion

What’s the defect?

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TECHNOLOGY

Lack of root
fusion with
misalignment

What’s the defect?

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TECHNOLOGY

Excessive root
penetration

What’s the defect?

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TECHNOLOGY

Concave root

What’s the defect?

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TECHNOLOGY

Burn through

What’s the defects?

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TECHNOLOGY

Cap undercut

What’s the defect?

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 SWI 3.2
TECHNOLOGY

Root undercut

What’s the defect?

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 SWI 3.2
TECHNOLOGY

Incomplete
filled groove

What’s the defect?

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 SWI 3.2
TECHNOLOGY

Longitudinal
crack

What’s the defect?

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 SWI 3.2
TECHNOLOGY

Elongated slag
lines

What’s the defect?

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TECHNOLOGY

Lack of sidewall
fusion + slag

What’s the defect?

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TECHNOLOGY

Cluster porosity

What’s the defect?

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TECHNOLOGY

Cap undercut

Arc strike

What’s the defects?

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TECHNOLOGY

Tungsten
inclusions

What’s the defects?

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TECHNOLOGY

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 SWI 3.2

 Surface breaking defects only detected

TECHNOLOGY

 This test method uses the forces of capillary action to

detect surface breaking defects
 The only limitation on the material type is the material can
not be porous
 Penetrants are available in many different types
 Water washable contrast
 Solvent removable contrast
 Water washable fluorescent
 Solvent removable fluorescent
 Post-emulsifiable fluorescent
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 SWI 3.2
TECHNOLOGY
Step 1. Pre-Cleaning
Ensure surface is very Clean normally with the use of a
solvent

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 SWI 3.2

Step 2. Apply penetrant

TECHNOLOGY

After the application of the penetrant the penetrant is normally

left on the components surface for approximately 15 minutes
(dwell time). The penetrant enters any defects that may be
present by capillary action

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 SWI 3.2
TECHNOLOGY
Step 3. Clean off penetrant
After sufficient penetration time (dwell time) has be given the
penetrant is removed, care must be taken not to wash any
penetrant out off any defects present

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 SWI 3.2
TECHNOLOGY
Step 3. Apply developer
After the penetrant has be cleaned sufficiently a thin even
layer of developer is applied. The developer acts as a
contrast against the penetrant and allows for reverse capillary
action to take place

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 SWI 3.2

Step 4. Inspection / development time

TECHNOLOGY

Inspection should take place immediately after the developer

has been applied any defects present will show as a bleed out
during development time.

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 SWI 3.2

Fluorescent Penetrant Bleed out viewed

TECHNOLOGY

under a UV-A light

source

Bleed out viewed

under white light
Colour contrast Penetrant
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 SWI 3.2

Advantages Disadvantages
TECHNOLOGY

Simple to use Surface breaking defects

Inexpensive only
Quick results Little indication of defects
Can be used on any non- depths
porous material Penetrant may
More sensitive than visual contaminate components
inspection Surface preparation critical
Low operator skill required Post cleaning may be
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required M.S.Rogers
 SWI 3.2

Client/location
Item number
TECHNOLOGY

Weld identification
Specifications/procedures
Operators name/signature
Date of test
Lighting conditions
Method of pre-cleaning
Surface conditions
Consumables, penetrant, developer and removers
Both dwell and development times
Weld geometry as welded etc
Test limitations
Details of any flaws present.
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Report numbers
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 SWI 3.2

QU 1. Name four NDT methods

TECHNOLOGY

QU 2. State the two radiation types used in industrial radiography

and state advantages of each.

QU 3. Give the advantages and disadvantages of radiography

and conventional ultrasonic inspection.

QU 4. Give the main disadvantages of magnetic particle

inspection and give at least three methods of applying
magnetisium to a component.

QU 5 State the main limitations of dye penetrant inspection.

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