Electronic Circuit Design 2A

(ECDS201)
Bachelor of Engineering Technology
Department of Electronic & Computer Engineering

Compiled by
Mr MM Molefe
 PCB Design & Simulation
(Multisim schematic design, Ultiboard Layout Design)
Introduction to CAE for PCB design
• Computer Aided Engineering (CAE) is been used widely by several applications for
simulation during design and development processes.
• CAE can be referred to as a tool that covers all aspects of engineering design, from
drawings to analysis to manufacturing; or a tool used to analyze the robustness and
performance of components and assemblies.
• CAD is a category of CAE, though people use the terms interchangeably
• CAD is a general term that applies to both inside and outside of the electronics area, as
related to the physical layout and drawing development of a system design. This includes
architectural and mechanical design tools.
• CAD programs for electronics industry are known as ECAD or EDA electronic design
automation, which referred to physical-design tools, such as IC- and PCB-layout
programs.
• CAD is often used to refer to conceptual-design tools, such as schematic editors, circuit
simulators and HDL compilers.
• EDA tools reduce the time development & the cost, for it allow the designs to be
simulated and analyzed prior to purchasing and manufacturing hardware.
• Once design has been proven through drawings, simulations and analysis, the system can
be manufactured
• CAM tools is the application used in manufacturing
• It uses software programs and design data generated by the CAE tools to control
automated manufacturing machinery to turn a design concept into reality
CAE methods used by (Digital) Designers
• Descriptive languages
• Schematic capture: process of creating schematic on a
computer. Schematic can be prepared using schematic
editors, which typically provides fields for each
information type. Typical fields include component type,
component value, component location etc.
• Timing drawings and specifications
• Circuit analysis and simulation: simulation is used to
predict the overall circuit behaviour for any given
sequence of inputs
• PCB layout (PCB – Printed Circuit Board)
PCB is a thick board circuit that allows electrical components to rest on it with electrical connections and other components

• PCB design is one of the most important design elements within the design of
an electronics product. In most cases, an electronics hardware designers/
engineers will design the circuit and then give a PCB layout specialist to
undertake the PCB layout and design from a schematic provided using PCB CAD
system.
• The PCB layout design is a specialist skill requiring a knowledge of not only of
the PCB design software and PCB CAD system, but also a variety of standards
and techniques used to ensure that the basic circuit design is successfully
transferred to an overall PCB that can be manufactured in an electronics circuit
manufacturing environment.
PCB requirements specification: this is the expectation to be met when
contemplating about PCB design for a particular project, in order to meet the
customers requirements. Either formally specified or not.
Requirements cover:
• Electrical/electronic performance: power output, frequency response,
sensitivity, signal to noise ratio etc.
• Mechanical: volume, area or height constraints; weight constraints; special
packaging; special shapes to fit in with exiting mechanical components, etc.
• Environmental: ambient temperature ranges, humidity, shock and vibration,
altitude, etc.
Structure of PCB
• A PCB consists of several layers of material, including a substrate, conductive traces, and vias.
• The substrate is typically made of fiberglass or plastic and provides the base for the
circuit board and a structure that physically holds the circuit components and
printed wires in place and provides electrical insulation between conductive parts.
• The conductive traces are thin strips of copper that are etched onto the substrate
and used to connect the components on the board.
• Vias are small holes drilled into the substrate that allow the conductive traces to
pass from one layer to another.
Fabrication of PCB process is basically removing unwanted copper and foil selectively.

The following steps are required in manufacturing (not limited to the following):
• Design and output: circuit boards must be compatible with PCB layout
• Form file to film: this is printing of output after schematic file has been checked
• Printing the inner layers
• Selectively removing the unwanted copper and the foil.
• Layer alignment and optical inspection
• Drilling etc.
Components of a PCB
PCBs are made up of several components, including the following:
• Substrate: The substrate is the base material on which the electronic
components are mounted. It is usually made of fiberglass, epoxy, or
phenolic resin.
• Copper Traces: Copper traces are thin lines of copper that connect the
electronic components on the substrate. These traces are created by
etching a copper layer on the substrate using a chemical process.
• Electronic Components: Electronic components such as transistors,
capacitors, resistors, and microchips are mounted on the substrate using
solder.
• Solder Mask: The solder mask is a protective layer that covers the copper
traces and electronic components. It is usually made of a polymer material
and is applied to the surface of the PCB using a screen-printing process.
• Silkscreen: The silkscreen is a layer of ink that is printed on the surface of
the PCB. It is used to label the electronic components and to provide other
information about the board, such as its manufacturer, part number, and
date of production.
Manufacturing PCBs
There are several manufacturing techniques used to produce PCBs,
including the following:
• Chemical etching: In this process, the copper layer is coated with a layer
of photoresist, which is then exposed to light through a mask. The
unexposed portions of the photoresist are then washed away, leaving
behind a pattern that corresponds to the desired conductive pathways.
The exposed copper is then etched away using a chemical solution,
leaving behind the conductive pathways.
• Mechanical routing: In this process, a router is used to cut away the
copper layer to create the desired conductive pathways. This technique is
typically used for PCBs with complex shapes or high-density components.
• PCB milling: In this process, a milling machine is used to remove the
copper layer to create the desired conductive pathways. This technique is
typically used for small-scale production or for prototyping.
• PCB printing: In this process, conductive ink is printed onto the substrate
using a printer. The ink is then cured using heat or ultraviolet light,
creating the conductive pathways.
Methods of removing unwanted copper: wet acid etching and mechanical
milling
• Wet acid etching is common in manufacturing of large quantities of boards,
because many board can be made simultaneously.
• Mechanical milling can be used for smaller quantity and prototype boards.
The purpose of CAD software such as Ultiboard layout is to generate the
digital maps.
Photolithography and chemical etching
• Etching processes (selectively removing he copper) requires removing
unwanted copper while protecting the wanted copper from the etchant. The
protection of wanted copper is provided by polymer coating (called
photoresist) i.e. is deposited onto the surface of the copper cladding.
• Photolithography is a process by which the photoresist is patterned into the
shape of the desired printed circuit. The patterned resist protects selected
areas of the copper from the etchant and exposes the copper to be etched.
• Photolithography consists of two steps: (1) patterning the photoresist, that
is, exposing the resist to light (ultraviolet (UV) light) and (2) developing it
(selective removal in a chemical bath).
Types of photoresist: positive and negative resist
• Positive resist is the breaking down of polymer by UV light exposure in order to
remove the copper
• Negative resist is the removal of the shielded part from UV light.
In order to expose the desired part of the photoresist, a mask is used.
A mask is a black and white photographic film or glass photoplate on which a
picture of the traces and pads is printed with a laser photoplotter. There are two
types of mask: (a) positive mask and (b) negative mask.

• Mask that will be used repeatedly are sometimes produced on glass photoplates
instead of film
• The other way of exposing photoresist is by using programmable
laser to draw the pattern directly on the photoresist, this
technique is called laser direct imaging (LDI). The advantage of
this process is that it does not required masks, it only uses same
data as the photoplotter.
Mechanical milling process is where the digital map of the board is
programmed using a computer numerical control CNC and grinds
away the unwanted copper.
• The removal of unwanted copper completely is shown in (a),
while removal of enough copper to isolate the pads and traces
from the bulk copper is in (b). (b) can affect the impedance of the
traces.
(a) (b)
Design Considerations
When designing a PCB, there are several factors that need to be taken
into consideration to ensure the success of the circuit. These include:
• Component Placement: The placement of components on the PCB
should be optimized to minimize the length of the traces and reduce
the risk of interference between components.
• Trace Width and Spacing: The width and spacing of the traces should
be designed to accommodate the current flow and voltage
requirements of the circuit.
• Ground Plane: The use of a ground plane on the PCB can help to
reduce interference between components and improve the
performance of the circuit.
• Power Supply: The power supply for the circuit should be designed
to provide a stable, clean source of power to the components.
• Environmental Factors: The PCB should be designed to withstand
the environmental factors that it will be exposed to, such as
temperature, humidity, and vibration.
Copper patterning
• Silk screen printing: uses etch-resistant ink to create
protective mask
• Photoengraving: uses a photomask and a developer
to selectively remove a UV-sensitive photoresist
coating and then create a photoresist mask
• PCB milling uses a two or three-axis mechanical
milling system to mill away the copper foil from the
substrate.
• Laser resist ablation
• Laser etching: the copper may be removed directly by
a CNC laser
Some Types of PCBs
• Single-sided
• Double sided
• Double-sided with layer interconnections (through
hole or plated)
• Multi-layer
• Rigid
• Flexible
• Rigid-flex
• High-frequency
• Aluminum backed
CAD PCB Design Procedure
Assuming that the electronic circuit design has already been carried out – that is, the component types and values
have been selected. Steps using PCB design software are as follows:
• Schematic entry: process of creating schematic on a computer. Schematic can be
prepared using schematic editors because it typically provides fields for each
information type. Typical fields include component type, component value,
component location etc.
• Error checking: (a) Transcription errors: this is very important part of the process at
the initial circuit entry stage for any human error arises, any error made in the
transcribing design will be present in all future stages, so check, re-check and check
again! (b) circuit errors: some software tools has facility of an electrical rule check to
detect shorts, unconnected pins or other common errors.
• Component placement: this is most critical part of the design process. Basic outline
shape for the PCB need to be first selected and place those component manually.
• Wiring connections (Routing): next step is to position (or route) the conducting tracks
between the component pins.
• Design rule checks: this is done once the layout and interconnections have been
completed
• Plotting: final task to produce plotted artwork from which the PCB can be
manufactured
General PCB design principles
• Determine Your Design Standards
• Artwork Viewing Convention
• Component Outlines
• Component Placement: Schematic, Peripheral, Central
Placement, or Fixed array
• Wiring and Component Orientation

Why the use of PCB

• Compact in size & save wiring
• Easy to repair and diagnosis
• Firm connections
• Less electric noise
• Reliable
• You can work on PCB for years
In order to design PCB satisfactorily, it often helps to
have some guidelines that can be followed, although
there is no substitute for experience.
Guidelines are splits to this sections (main areas of
consideration for PCB design):
• Board constraint design guidelines (initial constraints
on the board)
• Overall layout design guidelines
• Guidelines associated with the planes or layers
• Track design guidelines
• Thermal issues
• Signal integrity and RF considerations
Some Key steps in PCB Design Process
• Schematic capture or designing: preparing the
schematic for layout (attaching package symbols
that has footprints only and creating a netlist)
• Setting up the PCB design environment
• Layout Designing where u take copper traces to
another,
• Prepare for manufacture
• Generating artwork (Gerber files) & drill files
• Generating documentation
• Submitting PCB files for fabrication check
The advantages of adding a power plane to your PCB design
• Improved decoupling between circuits. The surface of a
power plane can create a parallel plate decoupling
capacitor between itself the insulating layer and the
following ground plane that prevents noise from
propagating through the power supply from one circuit to
another.
• Shorter return paths. The convenience of following a via
down from a signal layer to the power plane to power a
circuit. Shorter return paths lead to better EMC
performance.
• Larger current carrying capacity. Power planes can handle
more current than traces or tracks, lowering the operating
temperature of your board.
On any electronics project, electronics engineers must know how
electrical circuit should be laid out and work, because without PCBs,
the job called electronic engineers would be impossible.
Several CAD systems/ software: PCB Artist, Ultiboard, Altium Designer
17, Solidworks PCB, DipTrace, PCBWeb, XCircuit etc.
Electronic engineers choose National Instruments Ultiboard due to its
advantage over others that is it provide rapid PCB prototyping
environment for several applications.
The features are:
• Seamless integration with Multisim
• Saves electronics engineers hours of development time
• Complete circuit schematics, SPICE simulation and PCB layout in the
same environment
• Accelerates PCB design with automated functionality while
maintaining precision with manual control
• Compliments Multisim’s powerful SPICE simulation environment
with PCB layout and routing capabilities.
 Some PCB Design Guidelines to adhere to when designing a PCB layout
1. Do not use AutoRoute.
2. Use a single connector for all your input(s) and output(s). This should be close to the
imaginary border.
3. Every design must have an outline border (dimensions), which must be exactly equal to the
size of the board required. The outline becomes your cut line.
4. 4mm inside that border line must appear an imaginary border i.e., a border that you
cannot see. No components or tracks may appear inside this border. This border is used for
mounting (holes @ bottom) and must have in it your surname, initials, and student
number.
5. All like components must be grouped together and face the same direction.
6. The maximum distance between the bodies of like components must not exceed 3mm.
7. The distance from the body of the component to the bend in the lead may not exceed
3mm.
8. The connection of through-hole components must be at the bottom, while surface mount
components must be connected on top.
9. All connecting tracks can run at any angles.
10.All 90o angles must be avoided.
11.Tracks CAN go underneath a component only for TH components.
12.The track width must be 0.8 mm, except for a place where it must pass through a small or
error is detected, where the minimum of 0.7 mm must be used and then returned to 0.8
mm.
13. Power tracks should be at least 1 mm depending on the current specifications of the
circuit.
14.Track clearance must be 0.6 mm.
15.The minimum distance between pads and tracks is 0.6 mm.
16.The minimum pad diameter is 2.1 mm for TH components only.
17.All tracks must enter a pad in the centre.
18.Not more than three tracks may be connected to one pad.
19.Use at least 2 vias on your circuit design, you are limited to 6 vias. (Vias requirement
may differ for different circuits).
20.For complicated circuits keep the signal ground separate from DC ground to avoid
additional noise in the circuit.
21.Always include strategic test points in the layout for voltages or outputs. These should
be close to the imaginary border.
22.Take careful consideration of the size of components and check whether an additional
heat sinking is necessary so that you can accommodate it in your design.
23.Label your PCB design i.e.,
i. for double sided: components, input(s) and output(s) on the PCB by inserting text on the copper
top (Height 2mm). Also, surname, initials, and student number by inserting text at the copper
bottom (Height 3 mm). All labelling at the bottom must be mirrored.
ii. for single sided: components, input(s) and output(s), surname, initials, and student number by
inserting text at the copper bottom (Height 3 mm). All labelling at the bottom must be mirrored.
 Some of the errors to be avoided or observed in your layout designs
 Angles between the tracks that are less than 90o
 Small pad size of vias
 Incorrect use of vias, too many vias, small via diameter, and missing vias
 The vias should not be placed under components
 The incorrect footprint of the components
 Loose connection of tracks or incomplete (or missing) electrical connections
 The 0.7 mm should only be used in tight spaces
 Small track widths and the small clearance between the tracks should be
checked
 The tracks should be connected to the centre of the pads
 Wrong board outline dimensions (the dimensions given should be the max
to be used)
 Incorrect placement of the components
 Avoid connection of TH components on the top layer or SM components at
the bottom
 Using a single connector for your inputs and output(s)
 Try to improve your design by labeling it appropriately.
Introduction to CAD for simulation of circuits
• Professional engineering simulation software
packages have been developed to assist engineers and
scientists in solving design problems using a computer.
• These software packages rely on mathematical
models of circuits (PSpice developed by Microsim,
purchased by ORCAD, which in turn was purchased by
Cadence Design Systems, and Multisim created by a
company named Electronics Workbench, which is now
a division of National Instruments).
• The two packages that you will use in ECDS modules
are Multisim and Ultiboard.
PSpice is a PC version of the SPICE program (Simulated
Program with Integrated Circuit Emphasis). It is used to
simulate an electrical system and obtain values or
graphical plots of some of the responses (entities that may
be interested in such as currents or voltages through time,
or frequency domain characteristics).

Multisim
The Multisim program (also based on the SPICE engine) is
installed on the computers used in this lab.
The student version is powerful enough to handle all your
requirements in all courses related to circuitry or
electronics.
Designing an active Low Pass Filter in Multisim and design
the PCB layout in Ultiboard.
C1

0.022µF

U2

1
R1 R2
Vi 3

1kΩ 1kΩ 6 Vo
C2 2

1Vpk
0.022µF LM741EN
1kHz

4
0° R3 1
586Ω 1
0
R4
1kΩ

Major Steps required:

• Schematic capture or designing by preparing the schematic for
layout (attach package symbols that has footprints only)
• Layout Designing .
Some basic broad process or steps:
• Collect data sheets for all components that will be used
• Decide which footprints need to be used. Footprint is a packaging view of
the component that includes the holes through your board or pads for
surface mount devices. You will find SMT and Through-hole footprint for
components. Select the footprint to meet the mechanical requirements for
the component chosen.
• Attach the name of the selected footprint to the component symbol by
editing the properties for each component.
• Use “place wire” tool to create an electrical connection between the
components on the board.
• On completion of the schematic, generate the net list and import it to PCB
Layout, in order to complete the board layout. Layout will automatically
insert the footprints into the board based on the information given earlier.
• Place the components, define power and ground planes, route physical
wires and mounting holes.
• Verify the design for errors at all stages
The Multisim Environment

Parts/Components
Probes Tools