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PVT Corners

The document discusses process, voltage, and temperature (PVT) corners which are used to simulate a chip under different manufacturing and operating conditions to ensure it works properly. It explains that process variations, voltage fluctuations, and temperature changes can impact delays. Worst PVT considers a combination of worst process, minimum voltage and maximum temperature, while best PVT uses best process, maximum voltage and minimum temperature.

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subha mounika
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317 views

PVT Corners

The document discusses process, voltage, and temperature (PVT) corners which are used to simulate a chip under different manufacturing and operating conditions to ensure it works properly. It explains that process variations, voltage fluctuations, and temperature changes can impact delays. Worst PVT considers a combination of worst process, minimum voltage and maximum temperature, while best PVT uses best process, maximum voltage and minimum temperature.

Uploaded by

subha mounika
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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While beyond the input range, your design would be operated

but you may not get the output in the specified output range. This is
called Functional mode. So this input range would be wider than the test
mode range.

Corners : Corners means different operating conditions, like best and


worst corners. They are meant to capture variations in the manufacturing
process, along with expected variations in the voltage and temperature
of the environment in which the chip will operate.
PVT CORNERS:
• PVT is the Process, Voltage, and Temperature. In order to make
our chip to work after fabrication in all the possible conditions,
we simulate it at different corners of process, voltage, and
temperature.
• These conditions are called corners. All these three parameters
directly affect the delay of the cell.
Process:
• There are millions of transistors on the single-chip as we
are going to lower nodes and all the transistors in a chip
cannot have the same properties. Process variation is the
deviation in parameters of the transistor during the
fabrication.
 During manufacturing of a die ,the area at the center and at
the boundary will have different process variations. This
happens because layers that will be getting fabricated
cannot be uniform all over the die.
SOME OF THE FACTORS CAusING PROCESS VARIATION:

 Doping concentration
 Metal thicknes

 If any of these parameters change, it will change the current


and change in current will affect the delay of the circuit
because The delay depends upon the R and C values (Time
constant RC) of the circuit. The relation between process
and delay shown in Figure. From the figure, we conclude
that delay is more for slow process MOSFETs and it is less
for fast process MOSFETs.
If the process becomes
slower, delay increases
VOLTAGE:
• As we are going to the lower nodes the supply voltage for a chip is
also going to less. Let’s say the chip is operating at 1.2V. So, there
are chances that at certain instances of time this voltage may
vary. It can go to 1.5V or 0.8V. To take care of this scenario, we
consider voltage variation.
• There are multiple reasons for voltage variation.
Reasons for voltage variation:
• IR Drop is caused by the current flow over the powergrid network

• From the below graph, it can e seen that if voltage is more,current is


more then the delay decreases
If voltage increases,then delay of cell decreases
TEMPERATURE:
• The transistor density is not uniform throughout the chip. Some
regions of the chip have higher density and higher switching, resulting
in higher power dissipation and Some regions of the chip have lower
density and lower switching, resulting in lower power dissipation.
Because of the variation in temperature across the chip, it introduces
different delays across all the transistors.
Higher is the temperature, there will be a more collision rate of
electrons within the device. The increased collision rate will leads the
other electrons to move from the periphery. Since electron movement is
responsible for the current flow,Current will decrease with increase in
temperature. Therefore delays are usually more at higher temperatures.
If temeperature increases,
then delay increases
• WORST PVT : Process – worst, Voltage _ minimum,
Temperature -Maximum
• BEST PVT : Process – Best, Voltage – Max, Temperature-
Minimum

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