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Buffer Clock Tree

The document discusses power dissipation in clock distribution. It provides an example where a chip with a 3250pF capacitive load operating at 200MHz and 3.3V dissipates 7.08W of power. In general, clock power is proportional to frequency, voltage, and total load capacitance. Various techniques are discussed to reduce clock power, such as reducing load capacitance through different clock tree structures, adjusting wire lengths/widths to reduce skew, and using distributed buffers.

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Mike Potter
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0% found this document useful (0 votes)
194 views

Buffer Clock Tree

The document discusses power dissipation in clock distribution. It provides an example where a chip with a 3250pF capacitive load operating at 200MHz and 3.3V dissipates 7.08W of power. In general, clock power is proportional to frequency, voltage, and total load capacitance. Various techniques are discussed to reduce clock power, such as reducing load capacitance through different clock tree structures, adjusting wire lengths/widths to reduce skew, and using distributed buffers.

Uploaded by

Mike Potter
Copyright
© © All Rights Reserved
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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Power dissipation in clock distribution

 The synchronization of a digital system requires one or


more signal to coordinate and insure correct sequence of
operations.
 Clock is a signal that synchronize all the blocks in the
design.
 A clock tree is constructed to distribute the clock signal to
all the modules through the system.
 The clock is a major source of power dissipation because
it carries large load and switching that with high
frequency.
 Example : A chip uses a clock driver that drives 3250pF
capacitive load, operating at 3.3V supply, 200MHz
frequency. Then the dynamic power dissipation due to
clock signal itself Pdynamic= 3250pF(3.3)2 200MHz =
7.08Watts.
 In general Pclk = f v2 (CL+Cd)

Where CL is the total load on the clock


Cd is the clock driver capacitance
 CL= Ncg+1.5(2h-1)Dcw+(N4h)cw
 N= total number of clock terminals
 Cg = Nominal input capacitance at each terminal
 Cw= Wire capacitance
 D = Chip dimension
 h = H tree clock routing of h levels
 = estimation factor depending on the algorithm used.
 From the equation the dynamic power dissipation increases as
dimension and number of clocked devices increase

 To reduce the Pclk :


 Reduce the clock terminal load, routing capacitance and driver
capacitance
Different clock distribution structure
Clock Skew and Phase Delay
 Clock Skew: Variation between clock source to clock
terminals.
To achieve the desired performance, clock skews have to
be controlled within very small or tolerable values.
 Phase Delay: Longest delay from source to sinks
( terminals), has to be controlled in order to maximize the
throughput
 To reduce power dissipation, clock tree construction
methods are importance.
 Adjusting wire lengths or widths to reduce clock skew
 Reducing the interconnect capacitance.
 Note: While minimizing the clock power, constraints of
the clock skew & phase delay has to be considered.
Single driver and Distributed Buffers
 Clock driving scheme:
 To ensure fast clock transition, buffers have to be used to drive
the large load capacitance on a clock. There are two clock
driving schemes.
To reduce Delay
 Consider a equal path length tree
and its delay model. The skew between s1
and s2 can be

The skew variation in


terms of wire width
variations
Assuming the maximum width
variations w= +/- 15%, the
worst case additional skew is

 Buffer Insertion in Clock Tree


 Let ts is the tolerable skew of a buffered clock tree : ts =
ts w + ts b
ts b : tolerable skew for buffer delays
ts w : skew due to asymmetric loads & wire width variations is
less than.
Formulation 1: Determine the minimum number of Buffer
Insertion Points (BIPs) in clock tree T, such that the skew due
to asymmetric loads & wire width variations is less than ts b
 To meet skew constraint, the buffer insertion scheme should try to
balance the buffer delays on source – to sink paths independent of
clock tree topology.
 In balanced buffer insertion scheme partitions the clock tree into
subtrees such that every subtree is of equaul path length and all source
to sink paths have equal number of levels.
 The clock tree is
partitioned into
multiple levels &BIPs
are determined at cut-
lines.
 This buffer insertion scheme has following properties :
 1. Each source to sink path has the same number of
buffers (levels)
 2 All subtrees rooted at a given level are equal path
length trees.
 3 Select the cut lines so as to form iso radius levels.
 Let L be the path length, selecting a radius  of the first
level cut line as = L/+1 where …  is the designated
number of levels of buffers.
  - first iso radius level
 2  I second iso radius level,
 …….  for  level
Buffer insertion in an equal path length tree:

a) Using the balanced buffer insertion method


b) Using the level-by-level method
Comparison of buffer insertion
Zero skew Vs Tolerable skew
Tolerable skew: Negative & Positive TS
Double clocking & Zero clocking
 To avoide double clocking :
 d01+dFF+mindlogic >= d02+dHold
 To avoide zero clocking :
 d01+dFF+maxd(logic)+d setup <= d02+T
Clock Distribution including Tree, H-Tree, Mesh
Clock roots from center and routed with equal path
length from Source.
Good Practices in clock design
 Try to achieve the lowest Latency (Super Buffer/H-tree)
 Control transition times (keep edge rates sharp)
 Use clock buffer for good matching
 Have min/max line lengths for good matching
 Determine whether spacing or shielding provides better
tradeoff
 Use integral decoupling in buffers to reduce IR and Ldi/dt
Clock design Objectives
 Minimize the clock skew (in presence of IR drop)
 Minimize the clock delay (latency)
 Minimize the clock power (and area)
 Maximize noise immunity (due to coupling effects)
 Maximize the clock reliability
 Problems that have to deal with
 Routing the clock to all flip-flops on the chip
 Driving unbalanced loading, which will not be known until the chip is
nearly completed
 On-chip process/temperature variations

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