Scribd
Upload
151 views

Soldering 101

The document provides instructions on basic hand soldering, including details on multicore solder and its composition, tips for preventing dry joints and properly tinning soldering tips, guidelines for correctly bending and mounting electronic components, and step-by-step procedures for constructing good solder joints and performing basic soldering.

Uploaded by

Bong
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
151 views

Soldering 101

The document provides instructions on basic hand soldering, including details on multicore solder and its composition, tips for preventing dry joints and properly tinning soldering tips, guidelines for correctly bending and mounting electronic components, and step-by-step procedures for constructing good solder joints and performing basic soldering.

Uploaded by

Bong
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
You are on page 1/ 12

Electronics and Computer Systems Engineering

BASIC HAND SOLDERING

MULTICORE SOLDER
 most common type for hand
soldering has a composition of
Tin (Sn60) and Lead (Pb40),
with a diameter of 0.71 mm
 contains internal core of non-
corrosive Rosin Mildly
Activated (RMA) flux
 has a ‘plastic’ stage between
the melting and solidifying
stages
Electronics and Computer Systems Engineering

BASIC HAND SOLDERING

 ‘Dry joints’ are caused through:


 movement of joint during
‘plastic’ stage
 thermal stress
 PCB contamination
 oxidisation
BASIC HAND SOLDERING Electronics and Computer Systems Engineering

TIPS
 appropriate size and width is
determined by the size of the
connection to be made
 ideally 2/3 to equal the
diameter of the pad
 tips should be correctly 'tinned’
at all times, by adding a small
amount of solder to the hot tip
BASIC HAND SOLDERING Electronics and Computer Systems Engineering

LEAD FORMING
 minimum distance from the
end of the component body to
the start of the lead bend is
usually 2 lead diameters or
1.5mm for hand bending
methods

 without undue pressure hold


the component lead with the
pliers and bend the lead
protruding beyond the pliers
with a finger until a 90 degree
angle is formed.

 if damaged discard component


BASIC HAND SOLDERING Electronics and Computer Systems Engineering

COMPONENT MOUNTING
 Radial leaded loaded slightly
off the PCB (0.3 - 3.0mm)
 Axial-leaded loaded with the
body of the component very
close to the PCB (0.3 - 3.0mm)
Electronics and Computer Systems Engineering
BASIC HAND SOLDERING

BENDING AND MOUNTING OF


COMPONENTS
 mounted centrally between
the holes

 resistors mounted so colour


code orientated in the same
direction

 polarised components
should be orientated so that
polarity symbols (+ or - ) and
component value are visible
BASIC HAND SOLDERING Electronics and Computer Systems Engineering

LEAD TERMINATIONS
TYPE 1 FULLY CLINCHED –
 bend the lead flat against the pad
 trim the lead to a length of between 1-
2 lead diameters
 Used in High Quality/High Reliability
military or life support applications
 difficult to rework

TYPE 2 SEMI-CLINCHED –
 bend the lead to an angle of approx.
45
 Cut to a minimum of 0.5mm and a
max. of 1.5mm, or between 1-2 lead
diameters
 Used for commercial applications
 ease of de-soldering

TYPE 3 RIGID LEAD TERMINATION –


 straight through termination
 Cut to a length of min. 0.5mm and
max. of 1.5mm, or between 1-2 lead
diameters
BASIC HAND SOLDERING Electronics and Computer Systems Engineering

CONSTRUCTING A GOOD
SOLDER JOINT
 Figure a) the amount of solder
applied is minimal and may
result in a poor electrical
connection over time.

 Figure b) shows the optimal


solder joint that has good
wetting between component
lead and PCB pad.

 Figure c) indicates an
excessive amount of solder
has been applied to the
connection.
Electronics and Computer Systems Engineering
BASIC HAND SOLDERING

CLEANING
 a process of removing
contaminates before and after
soldering
 ensures good
mechanical/electrical
connection
 Three different methods:
 Mechanical - scourer or bristle
brush
 Chemical - solvents eg.
Isopropyl Alcohol
 Thermal - solder pot
Electronics and Computer Systems Engineering
BASIC HAND SOLDERING

BASIC SOLDERING
PROCEDURE

 iron temperature is set at approx.


350

 soldering iron tip size is suitable

 solder sponge is damp

 tip is clean and shiny (wipe & tin)

 Apply flux (RMA) to help ‘wetting’


if necessary

 soldering iron at a 45 angle


BASIC HAND SOLDERING Electronics and Computer Systems Engineering

BASIC SOLDERING PROCEDURE

 heat the lead and the pad


simultaneously

 flowing solder around the joint


forms a heat bridge

 remove soldering iron and solder


simultaneously (prevents ‘spiking’)

 clean the PCB with Isopropyl


Alcohol and a bristle brush

 wipe or pat dry with a lint free


tissue to remove traces of residue.
Electronics and Computer Systems Engineering
BASIC HAND SOLDERING

Use appropriate safety


equipment
 fume extractors
 hand cleaners
 goggles

READY TO SOLDER

You might also like