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Surface Mount Technology

SMT is a process for populating circuit boards. Components are mounted directly to the surface of the substrate. A layer of solder paste is screen printed onto the pads. The components are attached by pushing their leads into the paste.

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Thiyaga Rajan
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2K views19 pages

Surface Mount Technology

SMT is a process for populating circuit boards. Components are mounted directly to the surface of the substrate. A layer of solder paste is screen printed onto the pads. The components are attached by pushing their leads into the paste.

Uploaded by

Thiyaga Rajan
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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Automation/Programmable Processes in

Surface Mount
Technology
Research and Presentation:

Amy Hopp
Sept. 4, 2003
CIM ~ Period 2

Table of Contents
What is SMT?
Screen Printing
Affects of Automation
Through Hole Technology
Soldering
Components
Surface Mount Components
Other Main Issues
Limitations
Equipment
The Future
Citations

What is SMT?
SMT is a process for populating circuit boards.
This is done by mounting components directly to the
surface of the substrate.
Then a layer of solder paste is screen printed onto the
pads and the components are attached by pushing their
leads into the paste.
When all of the components have been attached, the
solder paste is melted using either reflow soldering or
vapor-phase soldering.

Screen Printing
Polyester or stainless steel
woven wire mesh is
stretched over an
aluminum frame with a
glued-on photosensitive
emulsion.
Stencils have etched
openings to match the land
patterns on the substrate
(PCB).

Affects of Automation
Screens are used mainly because of its lower
cost, faster delivery and reusability.
Usually the stencil design is a programmed
process for better efficiency and time.
Hand printing is almost impossible with screens.

it is very difficult to align the screen on the work area


which is due to the poor visibility due to the presence
of the screen mesh in the openings.

Through Hole Technology


Electronic components are inserted through
holes in the PCB prior to soldering.
The insertion may be done manually or by
machine.

Soldering
Wave soldering was a drag-and-dip process.
Reflow soldering is usually done by reheating
the solder (1 method: infra-red soldering).
Benefits

Cleaner
Much better quality
Less waste of materials

Components
In THT, size of the component is limited
by the packaging requirement.
Leads must rugged enough to survive the
insertion process without damage.
Lead diameters, drilling and imaging
tolerances puts a limit on how closely
leads are spaced, which in turn limits the
size of component packages.

Surface Mount Components


The solder joint is all the more important as it
imparts both electrical and mechanical
connections unlike the through hole
components.
Also see much higher temperatures during
soldering.
Because of their smaller size, it is sometimes
not possible to provide part markings
on them.

Other Main Issues


Frequency response

Surface mount packages has reduced component


related parasitic reactants because of shorter
component leads.
Parasitic reactants affect the performance of high
frequency circuits.

Package Propagation Delay


(time required for an electrical signal to propagate from the
input to the output of the IC)

In surface mount packages there are fewer parasitic


reactants (primary cause of propagation delay) and
they are smaller and more uniform.

Other Main Issues


Electromagnetic interference

Through hole component leads serve as tiny


antennas that radiate and receive undesirable
signals.
SMC leads do not penetrate the board and
thus reduce this problem. Hence sensitive
circuits can often be combined onto a single
board, simplifying shield design.

Other Main Issues


Cost

Though assembly costs for an automated


SMT line are not appreciably different
from that for an automatic through hole
line, significant cost reduction occurs at
the overall system level.

Quality

The higher level of automation in SMT


results in improved quality and more
consistent output.

Limitations
Mechanical Strength

The solder joints of surface mount


components become both the electrical and
mechanical contacts to the board.
The amount of solder available is generally
much less than at a through hole joint; so its
mechanical strength is less.
Since leads do not penetrate the board, they
cannot reinforce the joint.

Limitations
CTE Mismatch

The coefficient of thermal expansion for


ceramic component body is less than that of
the organic printed wiring board.
The difference in expansion over temperature
must be entirely absorbed within the solder
joints.
For leadless components, over the full product
temperature range, large stresses can be built
in the joints, causing eventual failure.

Equipment
Vitronics XPM Series Reflow Ovens

Maximum Operating Temp. 350 C


Windows 98 Operating System
Data Logging
Cell Fan Speed Control
Nitrogen Reduction Apertures
Individual Zone and Controlled Exhaust
Closed Loop Conveyor Speed
Over-temperature Switches
Swing Arm for Computer
Pentium Computer w/ VGA Monitor
Auto Start/Stop
2000 (+) Recipe Storage
Light Tower Four Color
Electromechanical Power Hood Lifts
Closed Loop Temperature Control

Equipment
DEK 265 Horizon Screen Printer

Windows NT operating system with touch


screen monitor
Programmable telecentric single-camera
vision alignment system
Motorized stencil alignment
Automatic rail width adjust with
programmable board stop
Magnetic board support tooling pins: 19mm
& 4mm diameter
Software controlled closed loop squeegee
pressure
On board event logging
SPC data collection capability
SMEMA machine interface
Operator/maintenance documentation on
CD-Rom with on-board help
1 year machine warranty (parts and labor)

The Future
Most aims towards the future in SMT is
geared towards:

To evolve solder, to create a newer, better


alloy composition to improve performance.
the capability to create PCBs smaller and
lighter (eventually to the nano scale).

Citations
http://www.tutorialsweb.com/smt/smt.htm
http://
www.engr.iupui.edu/~solaiyap/smt/radhika/smtint
ro.html
http://smt.pennnet.com/Articles/Article_Displa
y.cfm?Section=Articles&Subsection=Display&ARTI
CLE_ID=183179
http://www.uic.com/
http://smtinfo.net/

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