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Lecture3 MOS Transistor

The document describes the MOS transistor, including its structure, symbols, and operating behavior. It discusses how applying a positive voltage to the gate forms a depletion region and induces an inversion layer in the channel for current to flow. It also summarizes the threshold voltage equation and how substrate bias affects threshold voltage. Finally, it presents the current-voltage characteristics of a long-channel MOSFET in the linear and saturation regions.

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Suhas Shirol
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© © All Rights Reserved
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
108 views

Lecture3 MOS Transistor

The document describes the MOS transistor, including its structure, symbols, and operating behavior. It discusses how applying a positive voltage to the gate forms a depletion region and induces an inversion layer in the channel for current to flow. It also summarizes the threshold voltage equation and how substrate bias affects threshold voltage. Finally, it presents the current-voltage characteristics of a long-channel MOSFET in the linear and saturation regions.

Uploaded by

Suhas Shirol
Copyright
© © All Rights Reserved
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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The Devices:

MOS Transistor

[Adapted from Rabaeys Digital Integrated Circuits, 2002, J. Rabaey et al.]


EE415 VLSI Design

The MOS Transistor


Gate Oxyde
Gate
Source

Polysilicon

n+

Drain
n+

p-substrate

Bulk Contact

CROSS-SECTION of NMOS Transistor

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Field-Oxyde
(SiO2)

p+ stopper

MOS transistors Symbols


D

G
S

NMOS Enhancement NMOS Depletion


D

G
S

PMOS Enhancement

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B
S

NMOS with
Bulk Contact

Channe
l

MOSFET Static Behavior


VGS
=0

Mobile electrons

Depletion Region

With drain and source grounded, and VGS = 0, both back-toback (sub-source, sub-drain) junctions have 0V bias and are
OFF
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MOSFET Static Behavior


Positive voltage applied to the gate (VGS > 0)
The gate and substrate form the plates of a capacitor.
Negative charges accumulate on the substrate side (repels
mobile holes)
A depletion region is formed under the gate (like pn junction
+
diode)
S
D
VGS
-

n+

n+

n-channel

Depletion
Region
p-substrate

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Inversion
As the VGS increases, the surface under the gate undergoes
inversion to n-type material. This is the beginning of a
phenomenon called strong inversion.

Further increases in VGS do not change the width of the depletion


layer, but result in more electrons in the thin inversion layer,
producing a continuous channel from source to drain
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The Threshold Voltage


The value of VGS where strong inversion occurs is called the
Threshold Voltage, VT , and has several components:
The flat-band voltage, VFB , is the built-in voltage offset across
the MOS structure and depends on fixed charge and implanted
impurities charge on the oxide-silicon interface
VB represents the voltage drop across the depletion layer at
inversion and equals to minus twice the Fermi potential ~(0.6V)
Vox represents the potential drop
across the gate oxide

VT VFB VB Vox
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The Threshold Voltage


Where:
F is the Fermi potential ( ~
-0.3V for p-type substrates
Cox is the gate oxide
capacitance
VSB is the substrate bias voltage
VT0 is VT at VSB = 0
Note:
VT is positive for NMOS
transistors and negative for
PMOS
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The Body Effect


0.9
0.85
0.8
0.75

VT (V)

0.7
0.65
0.6
0.55
0.5
0.45
0.4
-2.5

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-2

-1.5

VBS (V)

-1

-0.5

Current-Voltage Relations
Assume VGS > VT

A voltage difference VDS will cause ID to flow from drain to source


At a point x along the channel, the voltage is V(x), and the gate-tochannel voltage is VGS - V(x)
For channel to be present from drain to source, VGS - V(x) > VT,
i.e. VGS - VDS > VT forS channel
toV exist from drain to source
V
GS

DS

G
n+

V(x)

ID

D
n+

+
L

p-substrate
B

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MOS transistor and its bias conditions

Linear (triode) Region


When VGS - VDS > VT , the channel exists from drain to
source
Transistor behaves like voltage controlled resistor

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Saturation Region
When VGS - VDS VT , the channel is pinched of
Electrons are injected into depletion region and
accelerated towards drain by electric field
Transistor behaves like voltage-controlled current
source

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Pinch-off

Current-Voltage Relations
Long-Channel Device

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Current-Voltage Relations
Long Channel transistor
6

x 10

-4

VGS= 2.5 V

VDS = VGS - VT

Resistive

4
ID (A)

VGS= 2.0 V

VGS= 1.5 V

Quadratic
Relationship

VDS = VGS - VT

cut-off

Saturation

VGS= 1.0 V
0

0.5

VDS (V)

1.5

2.5

NMOS transistor, 0.25um, Ld = 10um, W/L = 1.5, VDD = 2.5V, VT = 0.4V


EE415 VLSI Design

A model for manual


analysis

EE415 VLSI Design

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