Lecture3 MOS Transistor
Lecture3 MOS Transistor
MOS Transistor
Polysilicon
n+
Drain
n+
p-substrate
Bulk Contact
Field-Oxyde
(SiO2)
p+ stopper
G
S
G
S
PMOS Enhancement
B
S
NMOS with
Bulk Contact
Channe
l
Mobile electrons
Depletion Region
With drain and source grounded, and VGS = 0, both back-toback (sub-source, sub-drain) junctions have 0V bias and are
OFF
EE415 VLSI Design
n+
n+
n-channel
Depletion
Region
p-substrate
Inversion
As the VGS increases, the surface under the gate undergoes
inversion to n-type material. This is the beginning of a
phenomenon called strong inversion.
VT VFB VB Vox
EE415 VLSI Design
VT (V)
0.7
0.65
0.6
0.55
0.5
0.45
0.4
-2.5
-2
-1.5
VBS (V)
-1
-0.5
Current-Voltage Relations
Assume VGS > VT
DS
G
n+
V(x)
ID
D
n+
+
L
p-substrate
B
Saturation Region
When VGS - VDS VT , the channel is pinched of
Electrons are injected into depletion region and
accelerated towards drain by electric field
Transistor behaves like voltage-controlled current
source
Pinch-off
Current-Voltage Relations
Long-Channel Device
Current-Voltage Relations
Long Channel transistor
6
x 10
-4
VGS= 2.5 V
VDS = VGS - VT
Resistive
4
ID (A)
VGS= 2.0 V
VGS= 1.5 V
Quadratic
Relationship
VDS = VGS - VT
cut-off
Saturation
VGS= 1.0 V
0
0.5
VDS (V)
1.5
2.5