Kenneth R. Laker, University of Pennsylvania
Kenneth R. Laker, University of Pennsylvania
EE 560 INTRODUCTION
ORDERING OF TOPICS
Course Progress
System-Related Issues Reliability Manufacturability Testability Ps, Custom Logic VLSI Sub-systems Regular Structures ROMs, RAMs, PLAs Logic Circuits, Gates, Latches Two Transistor Locic Circuits (Inverters) static behavior dynamic behavior
Design
Implement
CMOS Fabrication
INFORMATION SERVICE INDUSTRY TRENDS Video on Demand Speech Processing/Recognition Wireless/Cellular Data Communication Data Communication Consumer Electronics Mainframe Computers 1970 Personal Computers 1980 1990 Multimedia Applications Portable Computers Network Computers 2000
Less die area, compactness Less power consumption Less testing requirements at the system level Higher reliability, due to high quality on chip interconnect Higher speed, due to reduced interconnect length Significant cost savings
MIMIMUM FEATURE SIZE (m) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 1975 1980 1985 1990 1995 0.1 m 2000 YEAR Complexity - #transistors double every two years. 400M traistors and 64 Gbit memories by 2005. Operating speed- double every two years. 5Gbits/sec 2002/03 and 10Gbits/sec 2003/04. Design - each transistor hand crafted to design automation and reuse of cells.
STATIC CIRCUITS
DYNAMIC CIRCUITS
CLASSICAL CMOS
CVSL CIRCUITS
MOS TRANSISTORS
G G
S B G S B
B S p+ n-well p -substrate G D p+
S B G
S B
G
D n+
S n+
S B G S B D
S B G S B
S p+
D p+
D n+
S n+
p-well n -substrate
a s=0
0 a
b Srong 0
b Weak 1
a s
Input a s=0 b 0 a
s=0
Output b Weak 0
a b s=1
1 a
b Strong 1
s=0
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11
12
OUTPUT 1 0
input VDD output
G S
output
input
G
P
D D
N
S
input
G
D D
output
0 (VSS )
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F 0 s2 1 off 0 off
s1 1 off on
a s1 s2 P P b
F 0 s2 1 off 0 on
s1 1 off off
b
Kenneth R. Laker, University of Pennsylvania
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F 0 s2 1 on 0 off
s1 1 on on
s1
s2
b
a
b s1 = 0 s2 = 0 a
P s2
b s1 = 0 s2 = 1 a
b s1 = 1 s2 = 0 a
b s1 = 1 s2 = 1 a
F 0 s2 1 on 0 on
s1 1 on off
s1
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A out 0 B 1 1 0 0 1 1 1 OR
output A N B N 0
(A.B) (AB) (A.B)
A-INPUT 1 0
U 1U
ZDZD
1U1U
Z ZD
U ZZU
D
1 1U
ZD ZD
0D 0D
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P
OUT
1 P B A P output
(A+B) (A+B) = (A.B) (AB)
N
0
A out 0 B 1 (A + B) (A+B) 0 0 0 1 1 0 OR
COMPOUND GATES
F = ((AB) + (CD))
N - Half
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F = ((AB) + (CD))
A B N N N N C D A B N N N N C D
P - Half
F = ((A+B) (C+D))
A P P B C P P D A P P B
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F = ((AB) + (CD))
1 A P P B
D F
A B
N N 0
N N
C D
2-INPUT MULTIPLEXER
-s s
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C s output
A s B -s s
A x x 0 1 B 0 1 x x s 0 0 1 1 -s s 1 1 0 0 output 0 (B) 1 (B) 0 (A) 1 (A) output = A.s + B .s
B
output
0 1s
C -s s
output
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1. Behavioral: what does the system do? 2. Structural: how are the elements connected together? 3. Physical: how is the structure to be built?
Each DESIGN DOMAIN can be specified at a variety of LEVELS of ABSTRACTION - Architectural - Algorithmic - Module or Functional Block - Logical - Switch - Circuit
Kenneth R. Laker, University of Pennsylvania
Higher Level
Lower Level
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SYSTEM
B A
0 1s
output
MODULE
VDD
S
CIRCUIT DEVICE
G D D
Vin
G S
Vout
1 m
G S n+
VSS
0.5 m
D n+
0.2 m
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Structural Domain
PC RISC Procesor Adder, gates, registers
Cells
Arcitectural Level
Modules Chips, Boards, Boxes
Kenneth R. Laker, University of Pennsylvania
Physical Domain
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BEHAVIORAL REPRESNTATION
Behavior may be specified by: 1. Boolean expressions 2. Tables of input/output values 3. Algoritythms written in high level computer languages 4. Algoritythms written in Harware Description Languages (HDLs) e.g. VHDL, Verilog highest level Algorithym -> lowest level Registers and communications -> ..... -> Boolean expressions
GOAL OF MODERN DESIGN SYSTEMS: Convert spec at HIGHEST LEVEL possible into a system design in MINIMUM TIME and with MAXIMUM LIKLIHOOD that the design will PERFORM AS DESIRED.
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FIXED COST: engineering cost, research and development, indirect costs. VARIABLE COST: die cost, test cost, package cost
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Architecture Definition and Logic Design Logic Diagram/Description FAIL Design Verification VLSI Design and Layout Verilog Technology Design Rules Device Models Design Rule Check Circuit Sim (SPICE)
FAIL
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START: Boolean description of binary adder circuit: A B C FULL ADDER sum_out carry_out A B C sum_out carry_out 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 1 0 1 0 0 1 0 0 0 1 0 1 1 1
DEFINE: Input Variables: addends: A, B carry-in: C Output Variables: sum_out, carry_out BOOLEAN FUNCTION:
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LOGIC DIAGRAM
A B C sum_out
SUM_OUT= ABC + (A + B + C) CARRY_OUT (use of carry_out to realize sum_out reduces circuit complexity and chip area)
A B C A B C
carry_out
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sum_out A A B C A C B C VDD
A carry_out
A B C VDD
A A B B
A
sum _out
B C
Kenneth R. Laker, University of Pennsylvania
A A B C A B
A carry_out
VDD A B C A VDD
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C A B
A
sum_out
B C
C_O A B C
GND
GND
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C_O A B C
GND
GND
SPECIFICATIONS: 1. Propogation Delay Times of SUM & CARRY_OUT signals: 1.2 ns 2. Transition Delay Times of SUM & CARRY_OUT signals: 1.2 ns 3. Circuit Die Area: 1500 m2 4. Dynamic Power Dissipation (@ VDD = 5 V and fmax = 20 MHz): 1 mW
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System Requirements Architecture Definition and Logic Design Design Verification VLSI Design and Layout Verilog Technology Design Rules Device Models Design Rule Check Circuit Sim (SPICE)
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FAIL
FAIL