18f14k22 Programming
18f14k22 Programming
2.0
PROGRAMMING OVERVIEW
The PIC18F1XK22/LF1XK22 devices can be programmed using either the high-voltage In-Circuit Serial Programming (ICSP) method or the lowvoltage ICSP method. Both methods can be done with the device in the users system. The low-voltage ICSP method is slightly different than the high-voltage method and these differences are noted where applicable. The PIC18F1XK22 devices operate from 1.8 to 5.5 volts and the PIC18LF1XK22 devices operate from 1.8 to 3.6 volts. All other aspects of the PIC18F1XK22 with regards to the PIC18LF1XK22 devices are identical.
2.1
Hardware Requirements
In High-Voltage ICSP mode, the PIC18F1XK22/ LF1XK22 devices require two programmable power supplies: one for VDD and one for MCLR/VPP/RA3. Both supplies should have a minimum resolution of 0.25V. Refer to Section 8.0 AC/DC Characteristics Timing Requirements for Program/Verify Test Mode for additional hardware parameters.
2.1.1
In Low-Voltage ICSP mode, the PIC18F1XK22/ LF1XK22 devices can be programmed using a single VDD source in the operating range. The MCLR/VPP/ RA3 does not have to be brought to a different voltage, but can instead be left at the normal operating voltage. Refer to Section 8.0 AC/DC Characteristics Timing Requirements for Program/Verify Test Mode for additional hardware parameters.
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PIC18F1XK22/LF1XK22
2.2 Pin Diagrams
The pin diagrams for the PIC18F1XK22/LF1XK22 family are shown in Figure 2-1.
TABLE 2-1:
Pin Name
Legend: I = Input, O = Output, P = Power Note 1: See Figure 6-1 for more information. 2: All power supply (VDD) and ground (VSS) pins must be connected.
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FIGURE 2-1: 20-PIN PDIP, SSOP AND SOIC PIN DIAGRAM FOR PIC18F1XK22/LF1XK22
20-pin PDIP, SSOP, SOIC (300 MIL)
VDD RA5/OSC1/CLKIN/T13CKI RA4/AN3/OSC2/CLKOUT RA3/MCLR/VPP RC5/CCP1/P1A RC4/C2OUT/P1B/SRQ RC3/AN7/C12IN3-/P1C/PGM RC6/AN8/SS RC7/AN9/SDO RB7/TX/CK
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
PIC18F1XK22/LF1XK22
PIC18F1XK22/ LF1XK22
6 7 8 9 10
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PIC18F1XK22/LF1XK22
3.0 MEMORY MAPS
For the PIC18F14K22/LF14K22 device, the program Flash space extends from 0000h to 03FFFh (16 Kbytes) in two 8-Kbyte blocks. For the PIC18F13K22/LF13K22 device, the program Flash space extends from 0000h to 01FFFh (8 Kbytes) in two 4-Kbyte blocks. For the PIC18F14K22/LF14K22 addresses 0000h through 0FFFh, however, define a Boot Block region that is treated separately from Block 0. For the PIC18F13K22/LF13K22 addresses 0000h through 07FFh, define the Boot Block region. All of these blocks define code protection boundaries within the program Flash space. The size of the Boot Block in the PIC18F14K22/LF14K22 devices can be configured as 2K, or 4 Kbyte (see Figure 3-1). The size of the Boot Block in the PIC18F13K22/LF13K22 devices can be configured as 1K, or 2 Kbytes (see Figure 3-1). This is done through the BBSIZ bit in the Configuration register, CONFIG4L. It is important to note that increasing the size of the Boot Block decreases the size of the Block 0.
TABLE 3-1:
Device
FIGURE 3-1:
MEMORY MAP AND THE PROGRAM FLASH SPACE FOR PIC18F14K22/LF14K22 DEVICES(1)
000000h Program Flash 01FFFFh MEMORY SIZE/DEVICE 16 Kbytes (PIC18F14K22) BBSIZ = 1 Unimplemented Read as 0 Boot Block(2) BBSIZ = 0 Boot Block(2) 000000h 0007FFh 000800h 000FFFh Block 0 Block 0 001FFFh 200000h 002000h 001000h Address Range
Block 1
003FFFh 004000h
Unimplemented Read 0s
Unimplemented Read 0s
3FFFFFh Note 1: 2: Sizes of memory areas are not to scale. Boot Block size is determined by the BBSIZ bit in the CONFIG4L register.
01FFFFh
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FIGURE 3-2: MEMORY MAP AND THE PROGRAM FLASH SPACE FOR PIC18F13K22/LF13K22 DEVICES(1)
000000h Program Flash 01FFFFh MEMORY SIZE/DEVICE 8 Kbytes (PIC18F13K22) BBSIZ = 1 Unimplemented Read as 0 Boot Block(2) BBSIZ = 0 Boot Block(2) 000000h 0003FFh 000400h 0007FFh Block 0 Block 0 000FFFh 200000h 001000h 000800h Address Range
Block 1
001FFFh 002000h
Unimplemented Read 0s
Unimplemented Read 0s
3FFFFFh Note 1: 2: Sizes of memory areas are not to scale. Boot Block size is determined by the BBSIZ bit in the CONFIG4L register.
01FFFFh
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PIC18F1XK22/LF1XK22
In addition to the program Flash space, there are three blocks in the Configuration and ID space that are accessible to the user through table reads and table writes. Their locations in the memory map are shown in Figure 3-3. Users may store identification information (ID) in eight ID registers. These ID registers are mapped in addresses 200000h through 200007h. The ID locations read out normally, even after code protection is applied. Locations 300001h through 30000Dh are reserved for the Configuration bits. These bits select various device options and are described in Section 6.0 Configuration Word. These Configuration bits read out normally, even after code protection. Locations 3FFFFEh and 3FFFFFh are reserved for the device ID bits. These bits may be used by the programmer to identify what device type is being programmed and are described in Section 6.0 Configuration Word. These device ID bits read out normally, even after code protection.
3.0.1
Memory in the address space, 0000000h to 3FFFFFh, is addressed via the Table Pointer register, which is comprised of three Pointer registers: TBLPTRU, at RAM address 0FF8h TBLPTRH, at RAM address 0FF7h TBLPTRL, at RAM address 0FF6h TBLPTRU Addr[21:16] TBLPTRH Addr[15:8] TBLPTRL Addr[7:0]
The 4-bit command, 0000 (core instruction), is used to load the Table Pointer prior to using any read or write operations.
FIGURE 3-3:
000000h
01FFFFh
ID Location 1 ID Location 2 ID Location 3 ID Location 4 ID Location 5 Unimplemented Read as 0 ID Location 6 ID Location 7 ID Location 8
CONFIG1H CONFIG2L 1FFFFFh CONFIG2H CONFIG3H Configuration and ID Space CONFIG4L CONFIG5L CONFIG5H CONFIG6L 2FFFFFh CONFIG6H CONFIG7L CONFIG7H
300001h 300002h 300003h 300004h 300005h 300006h 300007h 300008h 300009h 30000Ah 30000Bh 30000Ch 30000Dh
3FFFFEh 3FFFFFh
Note:
DS41357B-page 6
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3.1 High-Level Overview of the Programming Process 3.2 Entering and Exiting High-Voltage ICSP Program/Verify Mode
Figure 3-4 shows the high-level overview of the programming process. First, a Bulk Erase is performed. Next, the program Flash, ID locations and data EEPROM are programmed. These memories are then verified to ensure that programming was successful. If no errors are detected, the Configuration bits are then programmed and verified.
As shown in Figure 3-6, the High-Voltage ICSP Program/Verify mode is entered by holding PGC and PGD low and then raising MCLR/VPP/RA3 to VIHH (high voltage). Once in this mode, the program Flash, data EEPROM, ID locations and Configuration bits can be accessed and programmed in serial fashion. Figure 3-7 shows the exit sequence. The sequence that enters the device into the Program/ Verify mode places all unused I/Os in the high-impedance state.
FIGURE 3-4:
FIGURE 3-5:
Program Memory
D110 MCLR/VPP/RA3
Program IDs
VDD PGD
Note:
Verify IDs
Verify Data
FIGURE 3-6:
PGD = Input
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PIC18F1XK22/LF1XK22
FIGURE 3-7: EXITING HIGH-VOLTAGE PROGRAM/VERIFY MODE
P16 MCLR/VPP/RA3 D110 VDD PGM PGD PGD PGC PGC PGD = Input PGD = Input VIH P1 VDD P17 MCLR/VPP/RA3
FIGURE 3-9:
3.3
When the LVP Configuration bit is 1 (see Section 2.1.1.1 Single-Supply ICSP Programming), the Low-Voltage ICSP mode is enabled. As shown in Figure 3-8, Low-Voltage ICSP Program/Verify mode is entered by holding PGC and PGD low, placing a logic high on PGM and then raising MCLR/VPP/RA3 to VIH. In this mode, the RC3/PGM pin is dedicated to the programming function and ceases to be a general purpose I/O pin. Figure 3-9 shows the exit sequence. The sequence that enters the device into the Program/ Verify mode places all unused I/Os in the high-impedance state.
FIGURE 3-8:
MCLR/VPP/RA3
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3.4 Serial Program/Verify Operation
The PGC pin is used as a clock input pin and the PGD pin is used for entering command bits and data input/ output during serial operation. Commands and data are transmitted on the rising edge of PGC, latched on the falling edge of PGC and are Least Significant bit (LSb) first.
3.4.1
4-BIT COMMANDS
All instructions are 20 bits, consisting of a leading 4-bit command followed by a 16-bit operand, which depends on the type of command being executed. To input a command, PGC is cycled four times. The commands needed for programming and verification are shown in Table 3-2. Depending on the 4-bit command, the 16-bit operand represents 16 bits of input data or 8 bits of input data and 8 bits of output data. Throughout this specification, commands and data are presented as illustrated in Table 3-3. The 4-bit command, Most Significant bit (MSb), is shown first. The command operand, or Data Payload, is shown <MSB><LSB>. Figure 3-10 demonstrates how to serially present a 20-bit command/operand to the device.
3.4.2
CORE INSTRUCTION
The core instruction passes a 16-bit instruction to the CPU core for execution. This is needed to set up registers as appropriate for use with other commands.
TABLE 3-2:
Core Instruction (Shift in16-bit instruction) Shift out TABLAT register Table Read Table Read, post-increment Table Read, post-decrement Table Read, pre-increment Table Write Table Write, post-increment by 2 Table Write, start programming, post-increment by 2 Table Write, start programming
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PIC18F1XK22/LF1XK22
TABLE 3-3:
4-Bit Command 1101
FIGURE 3-10:
P2 1 2
10
11
12
13
14
15
16 P5A
PGC
P3
PGD
0 0
1 3
4-bit Command
PGD = Input
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4.0 DEVICE PROGRAMMING
The code sequence to erase the entire device is shown in Table 4-2 and the flowchart is shown in Figure 4-1. Note: A Bulk Erase is the only way to reprogram code-protect bits from an on state to an off state. Programming includes the ability to erase or write the various memory regions within the device. In all cases, except high-voltage ICSP Bulk Erase, the EECON1 register must be configured in order to operate on a particular memory region. When using the EECON1 register to act on program Flash, the EEPGD bit must be set (EECON1<7> = 1) and the CFGS bit must be cleared (EECON1<6> = 0). The WREN bit must be set (EECON1<2> = 1) to enable writes of any sort (e.g., erases) and this must be done prior to initiating a write sequence. The FREE bit must be set (EECON1<4> = 1) in order to erase the program space being pointed to by the Table Pointer. The erase or write sequence is initiated by setting the WR bit (EECON1<1> = 1). It is strongly recommended that the WREN bit only be set immediately prior to a program or erase.
TABLE 4-2:
4-Bit Command 0000 0000 0000 0000 0000 0000
4.1
4.1.1
ICSP Erase
HIGH-VOLTAGE ICSP BULK ERASE
1100 0000 0000 0000 0000 0000 0000 1100 0000 0000
Erasing program Flash or data EEPROM is accomplished by configuring two Bulk Erase Control registers located at 3C0004h and 3C0005h. Program Flash may be erased portions at a time, or the user may erase the entire device in one action. Bulk Erase operations will also clear any code-protect settings associated with the memory block erased. Erase options are detailed in Table 4-1. If data EEPROM is code-protected (CPD = 0), the user must request an erase of data EEPROM (e.g., 0084h as shown in Table 4-1).
TABLE 4-1:
Description Chip Erase Erase User IDs Erase Data EEPROM Erase Boot Block Erase Config Bits Erase Program Flash Block 0 Erase Program Flash Block 1 Erase Program Flash Block 2 Erase Program Flash Block 3
FIGURE 4-1:
The actual Bulk Erase function is a self-timed operation. Once the erase has started (falling edge of the 4th PGC after the NOP command), serial execution will cease until the erase completes (parameter P11). During this time, PGC may continue to toggle but PGD must be held low.
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PIC18F1XK22/LF1XK22
FIGURE 4-2:
1 PGC P5 P5A P5 P5A P11 2 3 4
PGD
0 Erase Time
4-bit Command
4-bit Command
4-bit Command
PGD = Input
4.1.2
4.1.3
When using low-voltage ICSP, the part must be supplied by the voltage specified in parameter D111 if a Bulk Erase is to be executed. All other Bulk Erase details as described above apply. If it is determined that a program memory erase must be performed at a supply voltage below the Bulk Erase limit, refer to the erase methodology described in Section 4.1.3 ICSP Row Erase and Section 4.2.1 Modifying Program Flash. If it is determined that a data EEPROM erase must be performed at a supply voltage below the Bulk Erase limit, follow the methodology described in Section 4.3 Data EEPROM Programming and write 1s to the array.
Regardless of whether high or low-voltage ICSP is used, it is possible to erase one row (64 bytes of data), provided the block is not code or write-protected. Rows are located at static boundaries beginning at program memory address 000000h, extending to the internal program memory limit (see Section 3.0 Memory Maps). The Row Erase duration is self-timed. After the WR bit in EECON1 is set, two NOPs are issued. Erase starts upon the 4th PGC of the second NOP. It ends when the WR bit is cleared by hardware. The code sequence to Row Erase a PIC18F1XK22/ LF1XK22 device is shown in Table 4-3. The flowchart shown in Figure 4-3 depicts the logic necessary to completely erase the PIC18F1XK22/LF1XK22 devices. The timing diagram for Row Erase is identical to the data EEPROM write timing shown in Figure 4-7. Note 1: The TBLPTR register can point at any byte within the row intended for erase. 2: ICSP row erase of the User ID locations is also possible using the technique described in Section 4.1.3 ICSP Row Erase. The address argument used should be 0x200000. A row erase of the User ID locations is required when VDD is below the Bulk Erase threshold.
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TABLE 4-3:
4-bit Command
Step 1: Direct access to program Flash and enable writes. 0000 0000 0000 8E A6 9C A6 84 A6 BSF BCF BSF EECON1, EEPGD EECON1, CFGS EECON1, WREN
Step 2: Point to first row in program Flash. 0000 0000 0000 6A F8 6A F7 6A F6 CLRF CLRF CLRF TBLPTRU TBLPTRH TBLPTRL
Step 3: Enable erase and erase single row. 0000 0000 0000 0000 88 A6 82 A6 00 00 00 00 BSF BSF NOP NOP EECON1, FREE EECON1, WR Erase starts on the 4th clock of this instruction
Step 4: Poll WR bit. Repeat until bit is clear. 0000 0000 0000 0010 50 A6 6E F5 00 00 <MSB><LSB> MOVF EECON1, W, 0 MOVWF TABLAT NOP Shift out data(1)
Step 5: Hold PGC low for time P10. Step 6: Repeat step 3 with Address Pointer incremented by 64 until all rows are erased. Step 7: Disable writes. 0000 Note 1: 94 A6 BCF EECON1, WREN
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PIC18F1XK22/LF1XK22
FIGURE 4-3: SINGLE ROW ERASE PROGRAM FLASH FLOW
Start Addr = 0 Configure Device for Row Erases
Addr = Addr + 64 WR Bit Clear? Yes No All Rows done? Yes Done No
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4.2 Program Flash Programming
Programming program Flash is accomplished by first loading data into the write buffer and then initiating a programming sequence. The write and erase buffer sizes shown in Table 4-4 can be mapped to any location of the same size beginning at 000000h. The actual memory write sequence takes the contents of this buffer and programs the proper amount of program Flash that contains the Table Pointer. The programming duration is externally timed and is controlled by PGC. After a Start Programming command is issued (4-bit command, 1111), a NOP is issued, where the 4th PGC is held high for the duration of the programming time, P9. After PGC is brought low, the programming sequence is terminated. PGC must be held low for the time specified by parameter P10 to allow high-voltage discharge of the memory array. The code sequence to program a PIC18F1XK22/ LF1XK22 device is shown in Table 4-5. The flowchart shown in Figure 4-4 depicts the logic necessary to completely write a PIC18F1XK22/LF1XK22 device. The timing diagram that details the Start Programming command and parameters P9 and P10 is shown in Figure 4-5. Note: The TBLPTR register must point to the same region when initiating the programming sequence as it did when the write buffers were loaded.
TABLE 4-4:
PIC18F14K22 PIC18F13K22
TABLE 4-5:
4-bit Command
Step 1: Direct access to program Flash. 0000 0000 0000 8E A6 9C A6 84 A6 BSF BCF BSF EECON1, EEPGD EECON1, CFGS EECON1, WREN
Step 2: Point to row to write. 0000 0000 0000 0000 0000 0000 0E <Addr[21:16]> 6E F8 0E <Addr[15:8]> 6E F7 0E <Addr[7:0]> 6E F6 MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF <Addr[21:16]> TBLPTRU <Addr[15:8]> TBLPTRH <Addr[7:0]> TBLPTRL
Step 3: Load write buffer. Repeat for all but the last two bytes. 1101 <MSB><LSB> Write 2 bytes and post-increment address by 2.
Step 4: Load write buffer for last two bytes and start programming. 1111 0000 <MSB><LSB> 00 00 Write 2 bytes and start programming. NOP - hold PGC high for time P9 and low for time P10.
To continue writing data, repeat steps 2 through 4, where the Address Pointer is incremented by 2 at each iteration of the loop.
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PIC18F1XK22/LF1XK22
FIGURE 4-4: PROGRAM FLASH FLOW
Start N=1 LoopCount = 0 Configure Device for Writes
N=N+1
No
All bytes written? Yes Start Write Sequence and Hold PGC High until Done and Wait P9 Hold PGC Low for Time P10
No
FIGURE 4-5:
PGC
PGD
0 Programming Time
4-bit Command
4-bit Command
PGD = Input
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4.2.1 MODIFYING PROGRAM FLASH
The previous programming example assumed that the device has been Bulk Erased prior to programming (see Section 4.1.1 High-Voltage ICSP Bulk Erase). It may be the case, however, that the user wishes to modify only a section of an already programmed device. The appropriate number of bytes required for the erase buffer must be read out of program Flash (as described in Section 5.2 Verify Program Flash and ID Locations) and buffered. Modifications can be made on this buffer. Then, the block of program Flash that was read out must be erased and rewritten with the modified data. The WREN bit must be set if the WR bit in EECON1 is used to initiate a write sequence.
TABLE 4-6:
4-bit Command
Step 1: Direct access to program Flash. 0000 0000 8E A6 9C A6 BSF BCF EECON1, EEPGD EECON1, CFGS
Step 2: Read program Flash into buffer (Section 5.1 Read Program Flash, ID Locations and Configuration Bits). Step 3: Set the Table Pointer for the block to be erased. 0000 0000 0000 0000 0000 0000 0000 0000 Step 5: Initiate erase. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 1101 1111 0000 88 A6 82 A6 00 00 00 00 50 A6 6E F5 00 00 <MSB><LSB> 0E <Addr[21:16]> 6E F8 0E <Addr[8:15]> 6E F7 0E <Addr[7:0]> 6E F6 <MSB><LSB> <MSB><LSB> 00 00 BSF BSF NOP NOP EECON1, FREE EECON1, WR Erase starts on the 4th clock of this instruction 0E <Addr[21:16]> 6E F8 0E <Addr[8:15]> 6E F7 0E <Addr[7:0]> 6E F6 84 A6 88 A6 MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF BSF BSF <Addr[21:16]> TBLPTRU <Addr[8:15]> TBLPTRH <Addr[7:0]> TBLPTRL EECON1, WREN EECON1, FREE
Step 6: Poll WR bit. Repeat until bit is clear. MOVF EECON1, W, 0 MOVWF TABLAT NOP Shift out data(1) MOVLW <Addr[21:16]> MOVWF TBLPTRU MOVLW <Addr[8:15]> MOVWF TBLPTRH MOVLW <Addr[7:0]> MOVWF TBLPTRL Write 2 bytes and post-increment address by 2. Repeat as many times as necessary to fill the write buffer Write 2 bytes and start programming. NOP - hold PGC high for time P9 and low for time P10.
Step 7: Load write buffer. The correct bytes will be selected based on the Table Pointer.
To continue modifying data, repeat Steps 2 through 6, where the Address Pointer is incremented by the appropriate number of bytes (see Table 4-4) at each iteration of the loop. The write cycle must be repeated enough times to completely rewrite the contents of the erase buffer. Step 8: Disable writes. 0000 94 A6 BCF EECON1, WREN
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PIC18F1XK22/LF1XK22
4.3 Data EEPROM Programming
FIGURE 4-6: PROGRAM DATA FLOW
Start
Data EEPROM is accessed one byte at a time via an Address Pointer (register EEADR) and a data latch (EEDATA). Data EEPROM is written by loading EEADR with the desired memory location, EEDATA with the data to be written and initiating a memory write by appropriately configuring the EECON1 register. A byte write automatically erases the location and writes the new data (erase-before-write). When using the EECON1 register to perform a data EEPROM write, both the EEPGD and CFGS bits must be cleared (EECON1<7:6> = 00). The WREN bit must be set (EECON1<2> = 1) to enable writes of any sort and this must be done prior to initiating a write sequence. The write sequence is initiated by setting the WR bit (EECON1<1> = 1). The write begins on the falling edge of the 24th PGC after the WR bit is set. It ends when the WR bit is cleared by hardware. After the programming sequence terminates, PGC must be held low for the time specified by parameter P10 to allow high-voltage discharge of the memory array.
Set Address
Set Data
Enable Write
No
FIGURE 4-7:
1 2 3 4
PGC
P5 0 0 0 0 P5A
PGD
4-bit Command
PGD = Input
15 16 P5A
4 P5
15 16 P5A
PGC
P5
4-bit Command
4-bit Command
PGD = Input
PGD = Output
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TABLE 4-7:
4-bit Command
Step 1: Direct access to data EEPROM. 0000 0000 9E A6 9C A6 BCF EECON1, EEPGD BCF EECON1, CFGS
Step 2: Set the data EEPROM Address Pointer. 0000 0000 0E <Addr> 6E A9 MOVLW <Addr> MOVWF EEADR
Step 3: Load the data to be written. 0000 0000 0E <Data> 6E A8 MOVLW <Data> MOVWF EEDATA
Step 4: Enable memory writes. 0000 Step 5: Initiate write. 0000 0000 0000 82 A6 00 00 00 00 BSF EECON1, WR NOP NOP ;write starts on 4th clock of this instruction 84 A6 BSF EECON1, WREN
Step 6: Poll WR bit, repeat until the bit is clear. 0000 0000 0000 0010 50 A6 6E F5 00 00 <MSB><LSB> MOVF EECON1, W, 0 MOVWF TABLAT NOP Shift out data(1)
Step 7: Hold PGC low for time P10. Step 8: Disable writes. 0000 94 A6 BCF EECON1, WREN
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PIC18F1XK22/LF1XK22
4.4 ID Location Programming
The ID locations are programmed much like the program Flash. The ID registers are mapped in addresses 200000h through 200007h. These locations read out normally even after code protection. Note: The user only needs to fill the first 8 bytes of the write buffer in order to write the ID locations. Table 4-8 demonstrates the code sequence required to write the ID locations. In order to modify the ID locations, refer to the methodology described in Section 4.2.1 Modifying Program Flash. As with program Flash, the ID locations must be erased before being modified.
TABLE 4-8:
4-bit Command 0000 0000 0000 0000 0000 0000 0000 0000 0000 1101 1101 1101 1111 0000
WRITE ID SEQUENCE
Data Payload Core Instruction
Step 1: Direct access to program Flash. 8E A6 9C A6 84 A6 0E 20 6E F8 0E 00 6E F7 0E 00 6E F6 <MSB><LSB> <MSB><LSB> <MSB><LSB> <MSB><LSB> 00 00 BSF EECON1, EEPGD BCF EECON1, CFGS BSF EECON1, WREN MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF Write Write Write Write NOP 20h TBLPTRU 00h TBLPTRH 00h TBLPTRL 2 bytes and post-increment address by 2 bytes and post-increment address by 2 bytes and post-increment address by 2 bytes and start programming. hold PGC high for time P9 and low for
Step 2: Set Table Pointer to ID. Load write buffer with 8 bytes and write.
2. 2. 2. time P10.
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4.5 Boot Block Programming 4.6 Configuration Bits Programming
The code sequence detailed in Table 4-5 should be used, except that the address used in Step 2 will be in the following ranges: If BBSIZ = 0: 000000h-0003FFh for PIC18F13K22/LF13K22 000000h-0007FFh for PIC18F14K22/LF14K22 If BBSIZ = 1: 000000h-0007FFh for PIC18F13K22/LF13K22 000000h-000FFFh for PIC18F14K22/LF14K22 Unlike program Flash, the Configuration bits are programmed a byte at a time. The Table Write, Begin Programming 4-bit command (1111) is used, but only 8 bits of the following 16-bit payload will be written. The LSB of the payload will be written to even addresses and the MSB will be written to odd addresses. The code sequence to program two consecutive configuration locations is shown in Table 4-9. See Figure 4-5 for the timing diagram. Note: The address must be explicitly written for each byte programmed. The addresses can not be incremented in this mode.
TABLE 4-9:
4-bit Command 0000 0000 0000 0000 0000 0000 0000 0000 0000 1111 0000 0000 0000 1111 0000
Note 1:
Step 1: Direct access to configuration memory. 8E A6 8C A6 84 A6 0E 30 6E F8 0E 00 6E F7 0E 00 6E F6 <MSB ignored><LSB> 00 00 0E 01 6E F6 <MSB><LSB ignored> 00 00 BSF EECON1, EEPGD BSF EECON1, CFGS BSF EECON1, WREN MOVLW 30h MOVWF TBLPTRU MOVLW 00h MOVWF TBLPRTH MOVLW 00h MOVWF TBLPTRL Load 2 bytes and start programming. NOP - hold PGC high for time P9 and low for time P10. MOVLW 01h MOVWF TBLPTRL Load 2 bytes and start programming. NOP - hold PGC high for time P9A and low for time P10.
Step 2(1): Set Table Pointer for configuration byte to be written. Write even/odd addresses.
Enabling the write protection of Configuration bits (WRTC = 0 in CONFIG6H) will prevent further writing of Configuration bits. Always write all the Configuration bits before enabling the write protection for Configuration bits.
FIGURE 4-8:
Program LSB
Program MSB
Done
Done
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PIC18F1XK22/LF1XK22
5.0
5.1
Program Flash is accessed one byte at a time via the 4-bit command, 1001 (table read, post-increment). The contents of memory pointed to by the Table Pointer (TBLPTRU:TBLPTRH:TBLPTRL) are serially output on PGD.
The 4-bit command is shifted in LSb first. The read is executed during the next 8 clocks, then shifted out on PGD during the last 8 clocks, LSb to MSb. A delay of P6 must be introduced after the falling edge of the 8th PGC of the operand to allow PGD to transition from an input to an output. During this time, PGC must be held low (see Figure 5-1). This operation also increments the Table Pointer by one, pointing to the next byte in program Flash for the next read. This technique will work to read any memory in the 000000h to 3FFFFFh address space, so it also applies to the reading of the ID and Configuration registers.
TABLE 5-1:
4-bit Command 0000 0000 0000 0000 0000 0000 1001
Step 1: Set Table Pointer 0E <Addr[21:16]> 6E F8 0E <Addr[15:8]> 6E F7 0E <Addr[7:0]> 6E F6 00 00 MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF Addr[21:16] TBLPTRU <Addr[15:8]> TBLPTRH <Addr[7:0]> TBLPTRL
Step 2: Read memory and then shift out on PGD, LSb to MSb TBLRD *+
FIGURE 5-1:
4 P5
8 P6
10
11
12
13
14
15
16 P5A
PGC
P14
(Note 1) PGD
1 0 0 1 LSb 1 2 3 4 5 6 MSb n n n n
PGD = Output
PGD = Input
Magnification of the high-impedance delay between PGC and PGD is shown in Figure 5-5.
DS41357B-page 22
Advance Information
PIC18F1XK22/LF1XK22
5.2 Verify Program Flash and ID Locations
The Table Pointer must be manually set to 200000h (base address of the ID locations) once the program Flash has been verified. The post-increment feature of the table read 4-bit command can not be used to increment the Table Pointer beyond the program Flash space. In a 64-Kbyte device, for example, a postincrement read of address FFFFh will wrap the Table Pointer back to 000000h, rather than point to unimplemented address, 010000h.
The verify step involves reading back the program Flash space and comparing it against the copy held in the programmers buffer. Memory reads occur a single byte at a time, so two bytes must be read to compare against the word in the programmers buffer. Refer to Section 5.1 Read Program Flash, ID Locations and Configuration Bits for implementation details of reading program Flash.
FIGURE 5-2:
Set TBLPTR = 0
Increment Pointer
Does Word = Expect data? Yes No All program Flash verified? Yes No No Failure, Report Error
Does Word = Expect data? Yes All ID locations verified? Yes Done No Failure, Report Error
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DS41357B-page 23
PIC18F1XK22/LF1XK22
5.3 Verify Configuration Bits
FIGURE 5-3:
A Configuration address may be read and output on PGD via the 4-bit command, 1001. Configuration data is read and written in a byte-wise fashion, so it is not necessary to merge two bytes into a word prior to a compare. The result may then be immediately compared to the appropriate configuration data in the programmers memory for verification. Refer to Section 5.1 Read Program Flash, ID Locations and Configuration Bits for implementation details of reading Configuration data.
Set Address
Read Byte
5.4
Data EEPROM is accessed one byte at a time via an Address Pointer (register EEADR) and a data latch (EEDATA). Data EEPROM is read by loading EEADR with the desired memory location and initiating a memory read by appropriately configuring the EECON1 register. The data will be loaded into EEDATA, where it may be serially output on PGD via the 4-bit command, 0010 (Shift Out Data Holding register). A delay of P6 must be introduced after the falling edge of the 8th PGC of the operand to allow PGD to transition from an input to an output. During this time, PGC must be held low (see Figure 5-4). The command sequence to read a single byte of data is shown in Table 5-2.
No
TABLE 5-2:
4-bit Command
Step 1: Direct access to data EEPROM. 0000 0000 9E A6 9C A6 0E <Addr> 6E A9 80 A6 50 A8 6E F5 00 00 <MSB><LSB> BCF EECON1, EEPGD BCF EECON1, CFGS
Step 2: Set the data EEPROM Address Pointer. 0000 0000 MOVLW <Addr> MOVWF EEADR
Step 3: Initiate a memory read. 0000 0000 0000 0000 0010 Note 1: BSF EECON1, RD MOVF EEDATA, W, 0 MOVWF TABLAT NOP Shift Out Data(1) Step 4: Load data into the Serial Data Holding register.
DS41357B-page 24
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PIC18F1XK22/LF1XK22
FIGURE 5-4:
1 PGC P5 P6 P14 (Note 1) PGD 0 1 0 0 LSb 1 2 3 4 5 6 MSb n n n n P5A 2 3 4
Note
1:
Magnification of the high-impedance delay between PGC and PGD is shown in Figure 5-5.
FIGURE 5-5:
HIGH-IMPEDANCE DELAY
P3 1 2
5.6
Blank Check
PGC
The term Blank Check means to verify that the device has no programmed memory cells. All memories must be verified: program Flash, data EEPROM, ID locations and Configuration bits. The device ID registers (3FFFFEh:3FFFFFh) should be ignored.
PGD
MSb
n P19
5.5
A blank or erased memory cell will read as a 1. Therefore, Blank Checking a device merely means to verify that all bytes read as FFh except the Configuration bits. Unused (reserved) Configuration bits will read 0 (programmed). Refer to Table 6-1 for blank configuration expect data for the various PIC18F1XK22/LF1XK22 devices. Given that Blank Checking is merely code and data EEPROM verification with FFh expect data, refer to Section 5.4 Read Data EEPROM Memory and Section 5.2 Verify Program Flash and ID Locations for implementation details.
A data EEPROM address may be read via a sequence of core instructions (4-bit command, 0000) and then output on PGD via the 4-bit command, 0010 (TABLAT register). The result may then be immediately compared to the appropriate data in the programmers memory for verification. Refer to Section 5.4 Read Data EEPROM Memory for implementation details of reading data EEPROM.
FIGURE 5-6:
Start
Yes
Continue
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DS41357B-page 25
PIC18F1XK22/LF1XK22
6.0 CONFIGURATION WORD
6.2 Device ID Word
The PIC18F1XK22/LF1XK22 devices have several Configuration Words. These bits can be set or cleared to select various device configurations. All other memory areas should be programmed and verified prior to setting Configuration Words. These bits may be read out normally, even after read or code protection. See Table 6-1 for a list of Configuration bits and device IDs and Table 6-3 for the Configuration bit descriptions. The device ID word for the PIC18F1XK22/LF1XK22 devices is located at 3FFFFEh:3FFFFFh. These bits may be used by the programmer to identify what device type is being programmed and read out normally, even after code or read protection. See Table 6-2 for a complete list of device ID values.
FIGURE 6-1:
6.1
ID Locations
A user may store identification information (ID) in eight ID locations mapped in 200000h:200007h. It is recommended that the Most Significant nibble of each ID be Fh. In doing so, if the user code inadvertently tries to execute from the ID space, the ID data will execute as a NOP.
TABLE 6-1:
File Name 300001h 300002h 300003h 300005h 300006h 300008h 300009h 30000Ah 30000Bh 30000Ch 30000Dh 3FFFFEh 3FFFFFh Legend: Note 1: 2:
CONFIG1H CONFIG2L CONFIG2H CONFIG3H CONFIG4L CONFIG5L CONFIG5H CONFIG6L CONFIG6H CONFIG7L CONFIG7H DEVID1(2) DEVID2(2)
x = unknown, u = unchanged, = unimplemented. Shaded cells are unimplemented, read as 0. These bits are only implemented on specific devices. Refer to Section 3.0 Memory Maps to determine which bits apply based on available memory. DEVID registers are read-only and cannot be programmed by the user.
DS41357B-page 26
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PIC18F1XK22/LF1XK22
TABLE 6-2: DEVICE ID VALUE
Device ID Value Device DEVID2 PIC18LF13K22 PIC18LF14K22 PIC18F13K22 PIC18F14K22 Note: 4Fh 4Fh 4Fh 4Fh DEVID1 100x xxxx 011x xxxx 010x xxxx 001x xxxx
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DS41357B-page 27
PIC18F1XK22/LF1XK22
TABLE 6-3:
Bit Name IESO
FCMEN
CONFIG1H
PRI_CLK_EN
CONFIG1H
PLL_EN
CONFIG1H
FOSC<3:0>
CONFIG1H
BORV<1:0>
CONFIG2L
BOREN<1:0>
CONFIG2L
PWRTEN
CONFIG2L
DS41357B-page 28
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PIC18F1XK22/LF1XK22
TABLE 6-3:
Bit Name WDPS<3:0>
WDTEN
CONFIG2H
MCLRE
CONFIG3H
HFOFST
CONFIG3H
ENHCPU
CONFIG4L
BBSIZ
CONFIG4L
LVP
CONFIG4L
STVREN
CONFIG4L
CP1
CONFIG5L
CP0
CONFIG5L
CPD
CONFIG5H
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DS41357B-page 29
PIC18F1XK22/LF1XK22
TABLE 6-3:
Bit Name CPB
WRT1
CONFIG6L
WRT0
CONFIG6L
WRTD
CONFIG6H
WRTB
CONFIG6H
WRTC
CONFIG6H
EBTR1
CONFIG7L
EBTR0
CONFIG7L
EBTRB
CONFIG7H
DEV<10:3>
DEVID2
DEV<2:0>
DEVID1
Device ID bits These bits are used with the DEV<10:3> bits in the DEVID2 register to identify part number.
REV<4:0> .
DEVID1
Revision ID bits These bits are used to indicate the revision of the device.
DS41357B-page 30
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PIC18F1XK22/LF1XK22
7.0 EMBEDDING CONFIGURATION WORD INFORMATION IN THE HEX FILE
Table 7-1 describes how to calculate the checksum for each device. Note: The checksum calculation differs depending on the code-protect setting. Since the program Flash locations read out differently depending on the codeprotect setting, the table describes how to manipulate the actual program Flash values to simulate the values that would be read from a protected device. When calculating a checksum by reading a device, the entire program Flash can simply be read and summed. The Configuration Word and ID locations can always be read.
To allow portability of code, a PIC18F1XK22/LF1XK22 programmer is required to read the Configuration Word locations from the hex file. If Configuration Word information is not present in the hex file, then a simple warning message should be issued. Similarly, while saving a hex file, all Configuration Word information must be included. An option to not include the Configuration Word information may be provided. When embedding Configuration Word information in the hex file, it should start at address 300000h. Microchip Technology Inc. feels strongly that this feature is important for the benefit of the end customer.
7.1
To allow portability of code, a PIC18F1XK22/LF1XK22 programmer is required to read the data EEPROM information from the hex file. If data EEPROM information is not present, a simple warning message should be issued. Similarly, when saving a hex file, all data EEPROM information must be included. An option to not include the data EEPROM information may be provided. When embedding data EEPROM information in the hex file, it should start at address F00000h. Microchip Technology Inc. believes that this feature is important for the benefit of the end customer.
7.2
Checksum Computation
The checksum is calculated by summing the following: The contents of all program Flash locations The Configuration Word, appropriately masked ID locations (Only if any portion of program memory is code-protected) The Least Significant 16 bits of this sum are the checksum. Code protection limits access to program memory by both external programmer (code-protect) and code execution (table read protect). The ID locations, when included in a code protected checksum, contain the checksum of an unprotected part. The unprotected checksum is distributed: one nibble per ID location. Each nibble is right justified.
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DS41357B-page 31
PIC18F1XK22/LF1XK22
TABLE 7-1:
Device
CHECKSUM COMPUTATION
Code-Protect BBSIZ = 0 None Checksum SUM[0000:01FFF]+SUM[2000:3FFF]+ (CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+ (CONFIG2H & 1F)+(CONFIG3L & 00h)+(CONFIG3H & 88h)+ (CONFIG4L & CDh)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+ (CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+ (CONFIG7L & 03h)+(CONFIG7H & 40h) SUM[0800:1FFF]+SUM[2000:3FFF]+ (CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+ (CONFIG2H & 1F)+(CONFIG3L & 00h)+ (CONFIG3H & 88h)+ (CONFIG4L & CDh)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+ (CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+ (CONFIG7L & 03h)+(CONFIG7H & 40h)+SUM_ID SUM[2000:3FFF]+ (CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+ (CONFIG2H & 1F)+(CONFIG3L & 00h)+(CONFIG3H & 88h)+ (CONFIG4L & CDh)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+ (CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+ (CONFIG7L & 03h)+(CONFIG7H & 40h)+SUM_ID (CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+ (CONFIG2H & 1F)+(CONFIG3L & 00h)+(CONFIG3H & 88h)+ (CONFIG4L & CDh)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+ (CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+ (CONFIG7L & 03h)+(CONFIG7H & 40h)+SUM_ID SUM[0000:0FFF]+SUM[1000:1FFF]+ (CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+ (CONFIG2H & 1F)+(CONFIG3L & 00h)+(CONFIG3H & 88h)+ (CONFIG4L & CDh)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+ (CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+ (CONFIG7L & 03h)+(CONFIG7H & 40h) SUM[0400:0FFF]+SUM[1000:1FFF]+ (CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+ (CONFIG2H & 1F)+(CONFIG3L & 00h)+ (CONFIG3H & 88h)+ (CONFIG4L & CDh)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+ (CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+ (CONFIG7L & 03h)+(CONFIG7H & 40h)+SUM_ID SUM[1000:1FFF]+ (CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+ (CONFIG2H & 1F)+(CONFIG3L & 00h)+(CONFIG3H & 88h)+ (CONFIG4L & CDh)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+ (CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+ (CONFIG7L & 03h)+(CONFIG7H & 40h)+SUM_ID (CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+ (CONFIG2H & 1F)+(CONFIG3L & 00h)+(CONFIG3H & 88h)+ (CONFIG4L & CDh)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+ (CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+ (CONFIG7L & 03h)+(CONFIG7H & 40h)+SUM_ID Blank Value C35Bh 0xAA at 0 and Max Address C2B1h
Boot Block
CB3Ah
CAE0h
PIC18F14K22/ PIC18LF14K22
Boot/ Block 0
E537h
E2DFh
All
0337h
0332h
None
E35Bh
E2B1h
Boot Block
E73Ch
E6E2h
PIC18F13K22/ PIC18LF13K22
Boot/ Block 0
F539h
F2E1h
All
0339h
0334h
Legend:
= = = = =
Description Configuration Word Sum of locations, a to b inclusive Byte-wise sum of lower four bits of all customer ID locations Addition Bit-wise AND
DS41357B-page 32
Advance Information
PIC18F1XK22/LF1XK22
8.0 AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/ VERIFY TEST MODE
Standard Operating Conditions Operating Temperature: 25C is recommended Para m No. D110 D110 A D111 D112 D113 D031 D041 D080 D090 D012 Sym. VIHH VIHL VDD IPP IDDP VIL VIH VOL VOH CIO Characteristic High-Voltage Programming Voltage on MCLR/VPP/RA3 Low-Voltage Programming Voltage on MCLR/VPP/RA3 PIC18F1XK22 (includes Bulk Erase) PIC18LF1XK22 (includes Bulk Erase) Programming Current on MCLR/VPP/RA3 Supply Current During Programming Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Capacitive Loading on I/O pin (PGD) Min. 8 1.80 2.70 2.70 VSS 0.8 VDD VDD 0.7 Max. 9 VDD 5.50 3.60 5 5 0.2 VDD VDD 0.6 50 Units V V V V mA mA V V V V pF IOL = 3.0 mA @ 2.7V IOH = -2.0 mA @ 2.7V To meet AC specifications (Note 1) VDD = 3.6V VDD = 1.8V VDD = 3.6V VDD = 1.8V VDD = 3.6V VDD = 1.8V Conditions
MCLR/VPP/RA3 Rise Time to enter Program/Verify mode Serial Clock (PGC) Period Serial Clock (PGC) Low Time Serial Clock (PGC) High Time Input Data Setup Time to Serial Clock Input Data Hold Time from PGC Delay between 4-bit Command and Command Operand
1.0
s ns s ns ns ns ns ns ns ns ns ns ms ms
TDLY1A Delay between 4-bit Command Operand and next 4-bit Command TDLY2 TDLY5 TDLY5
A
Delay between Last PGC of Command Byte to First PGC of Read of Data Word PGC High Time (minimum programming time) PGC High Time PGC Low Time after Programming (high-voltage discharge time) Delay to allow Self-Timed Data Write or Bulk Erase to occur
TDLY6 TDLY7
s ms ms
Note 1:
Do not allow excess time when transitioning MCLR between VIL and VIHH; this can cause spurious program executions to occur. The maximum transition time is: 1 TCY + TPWRT (if enabled) + 1024 TOSC (for LP, HS, HS/PLL and XT modes only) + 2 ms (for HS/PLL mode only) + 1.5 s (for EC mode only) where TCY is the instruction cycle time, TPWRT is the Power-up Timer period and TOSC is the oscillator period. For specific values, refer to the Electrical Characteristics section of the device data sheet for the particular device.
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DS41357B-page 33
PIC18F1XK22/LF1XK22
8.0 AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/ VERIFY TEST MODE (CONTINUED)
Standard Operating Conditions Operating Temperature: 25C is recommended Para m No. P12 P12A P13 P13A P14 P15 P16 P17 P18 P19 P20 Sym. THLD2 THLD2
A
Characteristic Input Data Hold Time from MCLR/VPP/RA3 Input Data Hold Time from MCLR/VPP/RA3 VDD Setup Time to MCLR/VPP/RA3 VDD Setup Time to MCLR/VPP/RA3 Data Out Valid from PGC PGM Setup Time to MCLR/VPP/RA3 Delay between Last PGC and MCLR/VPP/RA3 MCLR/VPP/RA3 to VDD MCLR/VPP/RA3 to PGM Delay from PGC to PGD High-Z Hold time after VPP changes
Min. 2 70 100 70 10 2 0 0 3 5
Max. 100 10
Units s s ns s ns s s ns s nS s
Conditions
TSET2 TSET2
A
Note 1:
Do not allow excess time when transitioning MCLR between VIL and VIHH; this can cause spurious program executions to occur. The maximum transition time is: 1 TCY + TPWRT (if enabled) + 1024 TOSC (for LP, HS, HS/PLL and XT modes only) + 2 ms (for HS/PLL mode only) + 1.5 s (for EC mode only) where TCY is the instruction cycle time, TPWRT is the Power-up Timer period and TOSC is the oscillator period. For specific values, refer to the Electrical Characteristics section of the device data sheet for the particular device.
DS41357B-page 34
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Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Companys quality system processes and procedures are for its PIC MCUs and dsPIC DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchips quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
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DS41357B-page 35
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFIC
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EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/26/09
DS41357B-page 36
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