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LM10-MIL
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LM10-MIL Operational Amplifier and Voltage Reference

1 Features The circuit is recommended for portable equipment
and is completely specified for operation from a
•
1 Input Offset Voltage: 2 mV (Maximum) single power cell. In contrast, high output-drive
• Input Offset Current: 0.7 nA (Maximum) capability, both voltage and current, along with
• Input Bias Current: 20 nA (Maximum) thermal overload protection, suggest it in demanding
• Reference Regulation: 0.1% (Maximum) general-purpose applications.
• Offset Voltage Drift: 2 μV/°C The device is capable of operating in a floating mode,
independent of fixed supplies. It can function as a
• Reference Drift: 0.002%/°C
remote comparator, signal conditioner, SCR controller
or transmitter for analog signals, delivering the
2 Applications processed signal on the same line used to supply
• Remote Amplifiers power. It is also suited for operation in a wide range
• Battery-Level Indicators of voltage and current regulator applications, from low
voltages to several hundred volts, providing greater
• Thermocouple Transmitters precision than existing ICs.
• Voltage and Current regulators
This series is available in the three standard
temperature ranges, with the commercial part having
3 Description relaxed limits. In addition, a low-voltage specification
The LM10-MIL is a monolithic linear IC consisting of a (suffix L) is available in the limited temperature
precision reference, an adjustable reference buffer, ranges at a cost savings.
and an independent, high-quality operational
amplifier. Device Information(1)
The unit can operate from a total supply voltage as PART NUMBER PACKAGE BODY SIZE (NOM)
low as 1.1 V or as high as 40 V, drawing only 270 μA. SOIC (14) 8.992 mm × 7.498 mm
A complementary output stage swings within 15 mV LM10-MIL SDIP (8) 8.255 mm × 8.255 mm
of the supply terminals or will deliver ±20-mA output PDIP (8) 9.81 mm × 6.35 mm
current with ±0.4-V saturation. Reference output can
be as low as 200 mV. (1) For all available packages, see the orderable addendum at
the end of the data sheet.

Operational Amplifier Schematic

(Pin numbers are for 8-pin packages)

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 8 Application and Implementation ........................ 14
2 Applications ........................................................... 1 8.1 Application Information............................................ 14
3 Description ............................................................. 1 8.2 Typical Application ................................................. 14
4 Revision History..................................................... 2 8.3 System Examples ................................................... 15
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations...................... 23
6 Specifications......................................................... 4 10 Layout................................................................... 23
6.1 Absolute Maximum Ratings ...................................... 4 10.1 Layout Guidelines ................................................. 23
6.2 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 23
6.3 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 24
6.4 Electrical Characteristics........................................... 5 11.1 Device Support .................................................... 24
6.5 Typical Characteristics .............................................. 7 11.2 Documentation Support ........................................ 24
7 Detailed Description ............................................ 13 11.3 Community Resources.......................................... 24
7.1 Overview ................................................................. 13 11.4 Trademarks ........................................................... 25
7.2 Functional Block Diagram ....................................... 13 11.5 Electrostatic Discharge Caution ............................ 25
7.3 Feature Description................................................. 13 11.6 Glossary ................................................................ 25
7.4 Device Functional Modes........................................ 13 12 Mechanical, Packaging, and Orderable
Information ........................................................... 25

4 Revision History
DATE REVISION NOTES
June 2017 * Initial Release

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5 Pin Configuration and Functions

NEV Package
8-Pin SDIP P Package
Top View 8-Pin PDIP
Top View

Pin Functions — 8-Pin SDIP or PDIP

PIN
I/O DESCRIPTION
NAME NO.
Balance 5 I Used for offset nulling
Op Amp Input (+) 3 I Noninverting input of operational amplifier
Op Amp Input (–) 2 I Inverting input of operational amplifier
Op Amp Output 6 O Output terminal of operational amplifier
Reference Feedback 8 I Feedback terminal of reference
Reference Output 1 O Output terminal of reference
V+ 7 I Positive supply voltage
V– 4 I Negative supply voltage

NPA Package
14-Pin SOIC
Top View

Pin Functions — 14-Pin SOIC

PIN
I/O DESCRIPTION
NAME NO.
Balance 9 I Used for offset nulling
NC 1, 2, 7, 8, 14, 13 — No connection
Op Amp Input (–) 4 I Inverting input of operational amplifier
Op Amp Input (+) 5 I Noninverting input of operational amplifier
Op Amp Output 10 O Output terminal of operational amplifier
Reference Feedback 12 I Feedback terminal of reference
Reference Output 3 O Output terminal of reference
V+ 11 I Positive supply voltage
V– 6 I Negative supply voltage

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6 Specifications
6.1 Absolute Maximum Ratings
(1) (2) (3)
See
MIN MAX UNIT
Total supply voltage 45 V
(4)
Differential input voltage ±40 V
Power dissipation (5) Internally limited
Output short-circuit duration (6) Continuous
TO Soldering (10 seconds) 300 °C
Soldering (10 seconds) 260 °C
Lead temperature
DIP Vapor phase (60 seconds) 215 °C
Infrared (15 seconds) 220 °C
Maximum junction temperature 150 °C
Storage temperature, Tstg −55 150 °C

(1) Refer to RETS10X for LM10H military specifications.

(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) The Input voltage can exceed the supply voltages provided that the voltage from the input to any other terminal does not exceed the
maximum differential input voltage and excess dissipation is accounted for when VIN < V−.
(5) The maximum, operating-junction temperature is 150°C for the LM10-MIL. At elevated temperatures, devices must be derated based on
package thermal resistance.
(6) Internal thermal limiting prevents excessive heating that could result in sudden failure, but the IC can be subjected to accelerated stress
with a shorted output and worst-case conditions.

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VS Supply input voltage range (V–) – (V+) 1.2 40 V
VCM Common-mode voltage (V–) (V+) – 0.85 V
VREF Reference voltage 0.2 V
IREF Reference current 0 1 mA

6.3 Thermal Information

LM10-MIL
THERMAL METRIC (1) NEV (SDIP) NPA (SOIC) P (PDIP) UNIT
8 PINS 14 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 150 90 87 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45 — — °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.

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6.4 Electrical Characteristics

TJ=25°C unless otherwise specified (1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TJ=25°C 0.3 2 mV
Input offset voltage (1)
TMIN ≤ TJ ≤ TMAX (see ) 3 mV
TJ=25°C 0.25 0.7 nA
Input offset current (2) (1)
TMIN ≤ TJ ≤ TMAX (see ) 1.5 nA
TJ=25°C 10 20 nA
Input bias current (1)
TMIN ≤ TJ ≤ TMAX (see ) 30 nA
TJ=25°C 250 500 kΩ
Input resistance (1)
TMIN ≤ TJ ≤ TMAX (see ) 150 kΩ
VS = ±20 V, IOUT = 0 120 400 V/mV
(1)
VOUT = ±19.95 V, TMIN ≤ TJ ≤ TMAX (see ) 80 V/mV
VS = ±20 V, VOUT = ±19.4 V 50 130 V/mV
(1)
IOUT = ±20 mA, TMIN ≤ TJ ≤ TMAX (see ) 20 V/mV
Large signal voltage (1)
IOUT = ±15 mA, TMIN ≤ TJ ≤ TMAX (see ) 20 V/mV
gain
VS = ±0.6 V, IOUT = ±2 mA 1.5 3 V/mV
(1)
VS = ±0.65 V, IOUT = ±2 mA, TMIN ≤ TJ ≤ TMAX (see ) 1.5 3 V/mV
(1)
VOUT = ±0.4 V, TMIN ≤ TJ ≤ TMAX (see ) 0.5 V/mV
(1)
VOUT = ±0.3 V, VCM = −0.4 V, TMIN ≤ TJ ≤ TMAX (see ) 0.5 V/mV
1.2 V ≤ VOUT ≤ 40 V, RL = 1.1 kΩ 14 33 V/mV
(1)
1.3 V ≤ VOUT ≤ 40 V, RL = 1.1 kΩ, TMIN ≤ TJ ≤ TMAX (see ) 14 33 V/mV
Shunt gain (3) 0.1 mA ≤ IOUT ≤ 5 mA, TMIN ≤ TJ ≤ TMAX (see (1)
) 6 V/mV
+
1.5 V ≤ V ≤ 40 V, RL = 250 Ω 8 25 V/mV
(1)
0.1 mA ≤ IOUT ≤ 20 mA, TMIN ≤ TJ ≤ TMAX (see ) 4 V/mV
−20 V ≤ VCM ≤ 19.15 V 93 102 dB
Common-mode (1)
−20 V ≤ VCM ≤ 19 V, TMIN ≤ TJ ≤ TMAX (see ) 93 102 dB
rejection
(1)
VS = ±20 V, TMIN ≤ TJ ≤ TMAX (see ) 87 dB
−0.2 V ≥ V− ≥ −39 V 90 96 dB
V+ = 1 V, TMIN ≤ TJ ≤ TMAX (see (1)
) 84 dB
+ (1)
Supply-voltage V = 1.1 V, TMIN ≤ TJ ≤ TMAX (see ) 84 dB
rejection 1 V ≤ V+ ≤ 39.8 V 96 106 dB
1.1 V ≤ V+ ≤ 39.8 V, TMIN ≤ TJ ≤ TMAX (see (1)
) 96 106 dB
− (1)
V = −0.2 V, TMIN ≤ TJ ≤ TMAX (see ) 90 dB
Offset voltage drift 2 μV/°C
Offset current drift 2 pA/°C
Bias current drift TC < 100°C 60 pA/°C
1.2 V ≤ VS ≤ 40 V 0.001 0.003 %/V
(1)
Line regulation 1.3 V ≤ VS ≤ 40 V, TMIN ≤ TJ ≤ TMAX (see ) 0.001 0.003 %/V
(1)
0 ≤ IREF ≤ 1 mA, VREF = 200 mV, TMIN ≤ TJ ≤ TMAX (see ) 0.006 %/V
0 ≤ IREF ≤ 1 mA 0.01% 0.1%
Load regulation V+− VREF ≥ 1 V, TMIN ≤ TJ ≤ TMAX (see (1)
) 0.15%
V+− VREF ≥ 1.1 V, TMIN ≤ TJ ≤ TMAX (see (1)
) 0.15%

(1) These specifications apply for V− ≤ VCM ≤ V+− 0.85 V, 1 V (TMIN ≤ TJ ≤ TMAX), 1.2 V, 1.3 V (TMIN ≤ TJ ≤ TMAX) < VS ≤ VMAX, VREF = 0.2 V
and 0 ≤ IREF ≤ 1 mA, unless otherwise specified: VMAX = 40 V for the standard part and 6.5 V for the low voltage part. The full-
temperature-range operation is −55°C to 125°C for the LM10-MIL. The specifications do not include the effects of thermal gradients (τ1 ≃
20 ms), die heating (τ2 ≃ 0.2 s) or package heating. Gradient effects are small and tend to offset the electrical error (see curves).
(2) For TJ > 90°C, IOS may exceed 1.5 nA for VCM = V−. With TJ = 125°C and V− ≤ VCM ≤ V− + 0.1 V, IOS ≤ 5 nA.
(3) This defines operation in floating applications such as the bootstrapped regulator or two-wire transmitter. Output is connected to the V+
terminal of the IC and input common mode is referred to V− (see System Examples). Effect of larger output-voltage swings with higher
load resistance can be accounted for by adding the positive-supply rejection error.
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Electrical Characteristics (continued)

TJ=25°C unless otherwise specified(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TJ=25°C 50 75 V/mV
Amplifier gain 0.2 V ≤ VREF ≤ 35 V (1)
TMIN ≤ TJ ≤ TMAX (see ) 23 V/mV
Feedback sense TJ=25°C 195 200 205 mV
voltage TMIN ≤ TJ ≤ TMAX (see (1)
) 194 206 mV
TJ=25°C 20 50 nA
Feedback current (1)
TMIN ≤ TJ ≤ TMAX (see ) 65 nA
Reference drift 0.002 %/°C
TJ=25°C 270 400 μA
Supply current (1)
TMIN ≤ TJ ≤ TMAX (see ) 500 μA
TJ=25°C 15
1.2 V ≤ VS ≤ 40 V (1)
μA
TMIN ≤ TJ ≤ TMAX (see ) 75
Supply current change
TJ=25°C 15
1.3 V ≤ VS ≤ 40 V (1)
μA
TMIN ≤ TJ ≤ TMAX (see ) 75

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6.5 Typical Characteristics

6.5.1 Typical Characteristics (Op Amp)

Figure 1. Input Current Figure 2. Common-Mode Limits

Figure 3. Output Voltage Drift Figure 4. Input Noise Voltage

Figure 5. DC Voltage Gain Figure 6. Transconductance

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Typical Characteristics (Op Amp) (continued)

Figure 7. Output Saturation Characteristics Figure 8. Output Saturation Characteristics

Figure 9. Output Saturation Characteristics Figure 10. Minimum Supply Voltage

Figure 11. Minimum Supply Voltage Figure 12. Minimum Supply Voltage

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Typical Characteristics (Op Amp) (continued)

Figure 13. Output Impedance Figure 14. Typical Stability Range

Figure 15. Large Signal Response Figure 16. Comparator Response Time For Various Input
Overdrives

Figure 17. Comparator Response Time For Various Input Figure 18. Follower Pulse Response
Overdrives

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Typical Characteristics (Op Amp) (continued)

Figure 19. Noise Rejection Figure 20. Rejection Slew Limiting

Figure 21. Supply Current Figure 22. Thermal Gradient Feedback

Figure 23. Thermal Gradient Cross-Coupling Figure 24. Shunt Gain

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Typical Characteristics (Op Amp) (continued)

Figure 25. Shunt Gain Figure 26. Shunt Gain

Figure 28. Shunt Gain

Figure 27. Shunt Gain

Figure 29. Shunt Gain

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6.5.2 Typical Characteristics (Reference)

Figure 30. Line Regulation Figure 31. Load Regulation

Figure 32. Reference Noise Voltage Figure 33. Minimum Supply Voltage

Figure 34. Output Saturation Figure 35. Typical Stability Range

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7 Detailed Description

7.1 Overview
The LM10-MIL is a dual-operational amplifier combined with a voltage reference capable of a single-supply
operation down to 1.1 V. It provides high overall performance, making it ideal for many general-purpose
applications. The circuit can also operate in a floating mode, powered by residual voltage, independent of fixed
supplies and it is well-protected from temperature drift.

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 Operating Characteristics
The LM10-MIL is specified for operation from 1.2 V to 40 V. Many of the specifications apply from –55⁰C to
125⁰C. Parameters that can exhibit significant variance with regard to operating voltage or temperature are
presented in electrical characteristics tables under Specifications and in the Typical Characteristics section.

7.3.2 Common-Mode Voltage Range

The input common-mode voltage range of the LM10-MIL extends from the negative rail to 0.85 V less than the
positive rail.

7.3.3 Operational Amplifier

The minimum operating voltage is reduced to nearly one volt and the current gain is less affected by
temperature, resulting in a fairly flat bias current over temperature.

7.3.4 Voltage Reference

Second-order nonlinearities are compensated for which eliminates the bowed characteristics of conventional
designs, resulting in better temperature stability.

7.4 Device Functional Modes

7.4.1 Floating Mode
To use the device in a floating mode, the operational amplifier output is shorted to V+ which disables the PNP
portion of the output stage. Thus, with a positive input signal, neither halves of the output conducts and the
current between the supply terminals is equal to the quiescent supply current. With negative input signals, the
NPN portion of the output begins to turn on, reaching the short circuit current for a few hundred microvolts
overdrive.

7.4.2 Linear Operation

This device can also operate linearly while in the floating mode. An example of this is shown in the Typical
Application section.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

With heavy amplifier loading to V−, resistance drops in the V− lead can adversely affect reference regulation.
Lead resistance can approach 1 Ω. Therefore, the common to the reference circuitry should be connected as
close as possible to the package.

8.2 Typical Application

* required for capacitive loading

Figure 36. Shunt Voltage Regulator

8.2.1 Design Requirements

Table 1 lists the design parameters for this example.

Table 1. Design Parameters

DESIGN PARAMETERS EXAMPLE VALUE
Ambient Temperature Range –55⁰C to 125⁰C
Supply Voltage Range 1.2 V to 40 V
Common-Mode Input Range (V–) to (V+) – 0.85 V

8.2.2 Detailed Design Procedure

Given that the transfer function of this circuit is:
R
VO U T = (1 + 2 )V R E F
R1 (1)
the output can be set between 0.2 V and the breakdown voltage of the IC by selecting an appropriate value for
R2. The circuit regulates for input voltages within a saturation drop of the output (typically 0.4 V at 20 mA and
0.15 V at 5 mA). The regulator is protected from shorts or overloads by current limiting and thermal shutdown.

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Typical regulation is about 0.05% load and 0.003%/V line. A substantial improvement in regulation can be
effected by connecting the operational amplifier as a follower and setting the reference to the desired output
voltage. This has the disadvantage that the minimum input-output differential is increased to a little more than a
diode drop. If the operational amplifier were connected for a gain of 2, the output could again saturate. But this
requires an additional pair of precision resistors.
The regulator in Figure 36 could be made adjustable to zero by connecting the operational amplifier to a
potentiometer on the reference output. This has the disadvantage that the regulation at the lower voltage settings
is not as good as it might otherwise be.

8.2.3 Application Curve

Figure 37. Frequency Response

8.3 System Examples

Circuit descriptions available in application note AN-211 (SNOA638).

8.3.1 Operational Amplifier Offset Adjustment

(Pin numbers are for 8-pin packages)

Figure 38. Standard Figure 39. Limited Range

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System Examples (continued)

(Pin numbers are for 8-pin packages)

Figure 40. Limited Range With Boosted Reference

8.3.2 Positive Regulators

(Pin numbers are for 8-pin packages)

Figure 41. Low Voltage Figure 42. Best Regulation

Use only electrolytic output capacitors.

Figure 43. Zero Output Figure 44. Current Regulator

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System Examples (continued)

(Pin numbers are for 8-pin packages)

Required For Capacitive Loading

*Electrolytic
Figure 45. Shunt Regulator Figure 46. Negative Regulator

*VOUT=10−4 R3

Figure 47. Precision Regulator Figure 48. Laboratory Power Supply

Figure 49. HV Regulator Figure 50. Protected HV Regulator

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System Examples (continued)

(Pin numbers are for 8-pin packages)

*800°C Threshold Is Established By Connecting Balance To VREF.

*Provides Hysteresis
Figure 51. Flame Detector Figure 52. Light Level Sensor

Figure 53. Remote Amplifier Figure 54. Remote Thermocouple Amplifier

10 mA≤IOUT≤50 mA
500°C≤TP≤1500°C
*Gain Trim
Figure 55. Transmitter for Bridge Sensor Figure 56. Precision Thermocouple Transmitter

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System Examples (continued)

(Pin numbers are for 8-pin packages)

††Level-shift Trim
*Scale Factor Trim
†Copper Wire Wound

Figure 57. Resistance Thermometer Transmitter Figure 58. Optical Pyrometer

1 mA≤IOUT≤5 mA
‡50 μA≤ID≤500 μA
††Center Scale Trim
†Scale Factor Trim
200°C≤Tp≤700°C *Copper Wire Wound
1 mA≤IOUT≤5 mA
†Gain Trim
Figure 59. Thermocouple Figure 60. Logarithmic Light Sensor
Transmitter

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System Examples (continued)

(Pin numbers are for 8-pin packages)

Figure 61. Battery-level Indicator Figure 62. Battery-threshold Indicator

Flashes Above 1.2V Flash Rate Increases

Rate Increases With Above 6V and Below 15V
Voltage
Figure 63. Single-cell Voltage Monitor Figure 64. Double-ended Voltage Monitor

*Trim For Span

INPUT
†Trim For Zero
10 mV, 100nA
FULL-SCALE
Figure 65. Meter Amplifier Figure 66. Thermometer

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System Examples (continued)

(Pin numbers are for 8-pin packages)

ZOUT∼680Ω @ 5 kHz
5
AV≤1k
1≤λ/λ0≤10
f1∼100 Hz
f2∼5 kHz
RL∼500
*Max Gain Trim
Figure 67. Light Meter Figure 68. Microphone Amplifier

†Controls “Loop Gain”

*Optional Frequency Shaping

Figure 69. Isolated Voltage Sensor Figure 70. Light-Level Controller

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System Examples (continued)

(Pin numbers are for 8-pin packages)
8.3.3 Reference and Internal Regulator

Figure 71. Reference and Internal Regulator

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9 Power Supply Recommendations

The LM10-MIL is specified for operation from 1.2 V to 40 V unless otherwise stated. Many specifications apply
from –55⁰C to 125⁰C. Parameters that can exhibit significant variance with regard to operating voltage or
temperature are presented in the Specifications section.

CAUTION
Supply voltages larger than 40 V can permanently damage the device; see the
Absolute Maximum Ratings table.

10 Layout

10.1 Layout Guidelines

For best operational performance of the device, good printed-circuit board (PCB) layout practices are
recommended. Low-loss, 0.1-uF bypass capacitors should be connected between each supply pin and ground,
placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable to single-
supply applications.

10.2 Layout Example

1 8
AMP_IN+ AMP_IN+ AMP_IN+
AMP_IN+ AMP_IN+
AMP_IN+

2 7
VOUT VOUT
AMP_IN+
VOUT

1 2
AM

3 6
P_

VOUT VOUT
IN

AMP_IN+ VOUT
–

AMP_1– 2
2 1
AMP-IN– AMP_INT– AMP-IN–

4
V– BAL
1
V+

V–

Figure 72. Layout Example

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Device Nomenclature

11.1.1.1 Definition of Terms

Input offset voltage: That voltage which must be applied between the input terminals to bias the unloaded
output in the linear region.
Input offset current: The difference in the currents at the input terminals when the unloaded output is in the
linear region.
Input bias current: The absolute value of the average of the two input currents.
Input resistance: The ratio of the change in input voltage to the change in input current on either input with the
other grounded.
Large signal voltage gain: The ratio of the specified output voltage swing to the change in differential input
voltage required to produce it.
Shunt gain: The ratio of the specified output voltage swing to the change in differential input voltage required to
produce it with the output tied to the V+ terminal of the IC. The load and power source are
connected between the V+ and V− terminals, and input common-mode is referred to the V− terminal.
Common-mode rejection: The ratio of the input voltage range to the change in offset voltage between the
extremes.
Supply-voltage rejection: The ratio of the specified supply-voltage change to the change in offset voltage
between the extremes.
Line regulation: The average change in reference output voltage over the specified supply voltage range.
Load regulation: The change in reference output voltage from no load to that load specified.
Feedback sense voltage: The voltage, referred to V−, on the reference feedback terminal while operating in
regulation.
Reference amplifier gain: The ratio of the specified reference output change to the change in feedback sense
voltage required to produce it.
Feedback current: The absolute value of the current at the feedback terminal when operating in regulation.
Supply current: The current required from the power source to operate the amplifier and reference with their
outputs unloaded and operating in the linear range.

11.2 Documentation Support

11.2.1 Related Documentation
For related documentation, see the following:
AN-211 New Op Amp Ideas, SNOA638

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

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11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback 25

Product Folder Links: LM10-MIL
 PACKAGE OPTION ADDENDUM

www.ti.com 9-Sep-2023

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

LM10BH ACTIVE TO-CAN LMG 8 500 Non-RoHS Call TI Level-1-NA-UNLIM -40 to 85 ( LM10BH, LM10BH) Samples
& Green
LM10BH/NOPB ACTIVE TO-CAN LMG 8 500 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 85 ( LM10BH, LM10BH) Samples

LM10CH ACTIVE TO-CAN LMG 8 500 Non-RoHS Call TI Level-1-NA-UNLIM 0 to 70 ( LM10CH, LM10CH) Samples
& Green
LM10CH/NOPB ACTIVE TO-CAN LMG 8 500 RoHS & Green Call TI Level-1-NA-UNLIM 0 to 70 ( LM10CH, LM10CH) Samples

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 9-Sep-2023

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE OUTLINE
LMG0008A TO-CAN - 5.72 mm max height
TRANSISTOR OUTLINE

8.001-8.509
[.315-.335]

4.19-4.70
[.165-.185]
1.02 MAX
[.04 MAX] 5.72 MAX C
[.225 MAX]

0.38-1.02
UNCONTROLLED [.015-.040]
LEAD DIA
1.397 [.055] MAX SEATING PLANE

12.7 MIN
[.5]

8X 0.406-0.483
[.016-.019]

2.794-3.048 2.92-3.68
[.1100-.1200] [.1150-.1448]
4

5 8.890-9.398
3 [.350-.370]
6
5.715-5.969
[.225-.235]
2

A 7
1
0.737-1.143
8
[.0291-.0450]

0.711-0.864
45 TYP [.028-.034]

4224369/C 09/2024

NOTES:

1. All linear dimensions are in millimeters [inches]. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.

www.ti.com
 EXAMPLE BOARD LAYOUT
LMG0008A TO-CAN - 5.72 mm max height
TRANSISTOR OUTLINE

METAL
8X ( 0.8 [.0315])
( 1.4 [.055]) 8 VIA

7 7X ( 1.4 [.055])
0.07 [.003] MAX 1 METAL
ALL AROUND

(R0.05 [.002]) TYP

7X SOLDER MASK
SOLDER MASK OPENING
OPENING

2 6

7X 0.07 [.003] MAX

ALL AROUND
(45 ) TYP

3 5
( 5.842 [.230])

LAND PATTERN EXAMPLE

NON-SOLDER MASK DEFINED
SCALE: 12X

4224369/C 09/2024

www.ti.com
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