Failure analysis (Notes for CIE-2 May 2024)

A general definition of failure is an occurrence that falls short of the planned outcome. Failure analysis is
extremely important in ceramic engineering to isolate cause for failure.

Failure analysis of ceramic and glass components is a scientific method used to identify the reason
behind a product or component failure and then take steps to ensure it doesn't happen again. The loss
of normal function is the result of a material component failing.

System components can fail in a variety of ways, such as excessive deformation, fracture, corrosion,
burning out, or deterioration of particular qualities (thermal, electrical, or magnetic).

Component failure, particularly with regard to machine parts, devices and structural members, can
result in significant financial loss, human casualties, and even social instability. In this course (DWC)
examines failures caused by mechanical methods, or application stressors.

Steps involved in failure analysis

Figure shows steps involved in Failure analysis (Student has to explain above figure)

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Fractography of ceramics and glasses

Brittle fracture is fracture that takes place with little or no plastic deformation. Nature has partially
compensated for this shortcoming by furnishing clear fracture patterns and fracture surface markings
that provide a wealth of interpretable information. Indeed, in many respects, fractographic analysis of
ceramics and glasses is easier and can produce more quantitative information than the fractographic
analysis of metals or polymers.

Figure Shows Analysis of fracture pattern or crack pattern one can interpret the cause of failure.

Fractographic analysis of glasses and ceramics can play an essential role in not only locating and
characterizing fracture origins but identifying failure mechanisms. The commonly observed features of
brittle fracture are mirror, mist, hackle, and crack-branching patterns which are normally formed in
fracture surfaces particularly for silicate glasses, as shown in following figure.

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Figure shows Schematic of fracture mirror, mist, hackle, and branching patterns on typical ceramic
fracture surface [1]: cf represents the critical flaw size, and rm, rh, and rb represent the fracture mirror
size, hackle length, and crack branching length, respectively. A fracture surface and a crack branching
pattern represent in A and B, respectively.

The size of the fracture mirror is dependent upon material charactertics and stress applied for fracture
and it is related as

Where, f is fracture stress and rm is radius (size) of mirror. As the mirror size increased, sample is
fractured at lower stress and effect of length of branching length is shown in following example figure.

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Fracture strength as a function of fracture (a) mirror size and (b) crack branching length

The main factors those affect the fracture of a material are:

Prevention failures
Finally, it is important to note that engineering designs can be improved by applying the concepts of
failure analysis to failure prevention.
1. Use designs without structural discontinuities that can reduce stress concentrators.
2. Test the materials for suitability of the applications
3. Practice of Preventive Maintenance of components and parts, like painting, changing parts and
oils etc
4. Reduce the inappropriate abuse of components by proper training and skill development
5. Keeping records and continuous tracking of performance of components.

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 Procedure and tools for Fracture analysis (Fractography)

(20 marks lesson)

Figure Shows major sequential steps in fractography

Step 1 The general examination often begins with specimen reassembly or reconstruction. Ideally all
fragments are available are collected and joined to reconstruct the object using adhesive tapes and
suitable adhesives on a substrate. Then visual examination of the fractured pieces and review of data
regarding the test or service conditions under which the hardware failed. Crack branching and radiating

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patterns may be interpreted before the fracture surfaces are examined. Much of the fractographer’s
craft is in the observation and interpretation of these patterns. Crack branch patterns can lead back to
an origin and also tell much about the stress state and stress magnitude.

Main objective of visual examination is to locate ( i) Origin of fracture, (ii) Mirror size, wallner lines, mist
etc.
STEP 2 origins are often very small and magnification by a microscope is necessary 40X or more .
Stereoptical microscopes are ideal for initial fracture surface examinations. At first, surface of fracrture
identified and then cleaned and further replicated (not to loss evidence) on cellulose acetates and PVC
(Poly vinyl chloride sheets).

STEP 3 In other instances, the flaw at the origin is so small that scanning electron microscopy (SEM) is
needed to magnify fracture oirgin and mirror without loss of resolution. As the wavelength of electron
beam is small, they can magnify up to 100000X without loss of resolution than optical microscope. Most
fractography is conducted between 10X to 5000X. Origin location is identified in step 2 and step 3.
The greater the stress in the part at fracture, the more the stored energy, and the richer the fracture
markings. A typical SEM image is shown below:

STEP 4 Once the origin is located, evaluation of localized chemistry is analyzed using Energy dispersive
x-ray spectroscopy (EDX), Auger spectroscopy , Microprobe, Transmission electron microscopy (TEM),
Secondary ion mass spectroscopy (SIMS). Chemical in-homogeneities, corrosive agents etc can cause
fracture, therefore, chemical analysis at origin of fracture is best method to identify the cause for failure
using tools as mentioned earlier.

EDX analysis Of adjacent specimen shows Aluminium

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