Adobe Scan 17 Jun 2024
Adobe Scan 17 Jun 2024
ELECTRONIC DEVICES
(PART-B
ESSAY QUESTIONSWITH SOLUTIONS
1.1 FORMATION OF PN JUNCTION
Q7. State the formation of PN-Junction diode.
Answer :
Barrier
potential
Figure
During the formation of PN-junction, the free electrons from N-region diffuse into the P-region to
combine with holes.
This combination of holes with free electrons creates a negative potential (i.e., negative charge
at P-side near the junction.
carriers)
Similarity, the holes from P-region diffuse into the N-region to combine with electrons.
This combination of free electrons with holes creates a positive potential (i.e., positive charge carriers)
at N-side near the junction. Therefore, the region near the junction becomes free from charge carriers. This
region of immobile positive and negativecharge carriers at the junction is known as depletion layer (orn)
depletion region. The depletion region acts as a barrier and thus prevents further motion of charge carriers
near the junction. This potential difference possessed by the depletion region at the PN-junction is called
barrier potential (V).
1.2 DEPLETION REGION
Explain the formation of depletion region. How it is effected in forward bias and reverse bias.
(ModelPaper-1, Q13(a) | MarchiApril-16, Q3(a))
OR
Explain the formation of depletion region in a PN junction and how it varies in forward and
reverse biases in a junction diode.
Oct.-15,Q3(a)
OR
MaylJune-18, Q1
Explain the formation of depletion region in P-N junction diode.
Refer upto figure (3))
Answer :
APN junction is formed by doping a single crystal silicon semiconductor with Pand N-type impurities
as shown in figure (1).
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UNIT-1: PN JUNCTION
ELECTRONICS PAPER-II
Arccptor ion Junction
Donor on
Hole
oO o0
P-side N-side
One hal of the semiconductor is doped with P-type impurities and other half is doped with N-type
impuritics. The meeting point of Pand N-type regions is known as junction. The part of semiconductor doped
with P-typeimpurities have holes as majority carriers and acceptor ions that are changed negatively. Similarly,
the N-type part have electrons as majority carriers and donor ions that are positively charged. Since, it is a
singlecry stal semiconductor there is aconcentration gradient of holes from Pto Nside as well as there is a
concentration gradient of electrons from Nto Pside. Whenever there is a concentrationgradient then the carrier
that is holes and clectrons move(flow) from higher concentration region to a lower concentration region.
Junction
Acceptor ion Donor ion
Electron
Hole
ELECTRONICS PAPER 1
ELECTRONIC DEVICES
Juncton
Donor on
Oo
Electron
Oo
Hole
Oo Oo Oo
Oo
Pside N-side
Electrostatic potential V
P-side
V=0
E-0
Potentialenergy barrier for
ckctrons
In aPN Junction diode, the two types of capaci Discuss the effect of ternoer2re
tances which occur at the junction due to brasing are reverse saturatior Currerta
junction.
(1) Diffusion Capacitance (
OR
(i) Transition Capacitance ()
Explain the dependency of reserse
(i) Diffusion Capacitance (C) saturation current on temperatures
When a forw ard biased diode is reverse biased Answer :
all of asudden, the forw ard current lF flowing through
The V-Icharacteristics of adiodeir the
it ceases instantly. leav ing some majority charge
carriers in the depletion region. Due to sudden reversal bias region is closely approximated by ihe eaa
of the biasing, initially a large reverse current flows
through the diode and itdecreases slowly to the level Where.
of thereverse saturation current IS. The large reverse
currentoccurs due to the presence of majoritycarriers 1-The current fiowing through diode
in the depletion region.This effects may beviewed as I-Reverse saturatior curreoidrce
adischarge of a capacitor. Therefore. it is represented -Externally applied voltage io dide
by a capacitance known as the diffusion capacitance
n-Aconstant
CD. The diffuston capacitance is also termed as the
storage capacitance. V-Thermal voltage
The equation for the diffusion capacitance is, The reverse saturation current /in equztion1
is astrong function of ternperature As 2 rule
C = of thumb. the value of / double for every c
rise the temperature
(iü) Transition Capacitance (C-) 2 The thermal voltage I, in equation (l) is
The space charge region of a PN junction given by.
diode is a layer of immobile charge carriers located
between two blocks of low resistance material (i.e, T
P and N type bars). This describe the qualities of a 11.600
capacitor. Theretore. the depletion region clearly has Where.
a capacitance associated with it. T-The absolute temperature in Kelvin
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Forward
0.7V
Breakdown Reverse
Forward bias region is the characteristics shown by the pn junction diode when it is forward biased. In
forward biasing p side of the pn junction is connected to the positive of the voltage supply and n side of the pn
junction is connected to the negative of the voltage supply. Simply, forward bias region is the characteristics
of the diode for v > 0. From the figure it can be seen that (in the FB region) the diode current is very small
for first fewtenths of a volt. This is because the barrier potential prevents the flow of current through it.
When the external applied voltage is greater than the barrier potential small increase in the voltage produces
a sharp increase in the current. The voltage at which the current starts to increase rapidly is called cut-in or
knee voltage of the diode. It is denoted as V.
For silicon PN diode V= 0.7 V and Germanium diode V
Y
= 0.3 V.
2. Reverse Bias Region
Reverse bias region is the characteristics shown by the pn diode when it is reverse biased. In reverse
biasing Pside of the pn junction is connected to the negative of the voltage supply and Nside of the pn junction
isconnected to the positive of the voltage supply. Simply, reverse bias region is the characteristics of the diode
for v <0. From figure it can be seen that (in RB region) the diode current is very small, almost equal to zero
for allvalues of voltage less than the break down voltage V, This is because in reverse bias the width of the
potential barrier increases. As a consequence, the junction resistance becomes very high and practically no
current flows through the circuit.
3. Breakdown Region
The diode enters the breakdown region when the magnitude of the reverse voltage exceeds a threshold
value that is specific to the particular diode, called the breakdown voltage. It is denoted as 'V,' in figure. In the
breakdown region for very small variation in voltage the current increases rapidly, this can be seen in figure.
Applications
For answer refer Unit-1, Page No. 2,Q.No. 3.
Q13. Explain the characteristics of zener diode.
Answer : March-15, Q3{c)
Zener Diode
The power dissipated at the junction of anormal PN diode operating in breakdown region is very large.
Due to large power dissipation, the diode gets damaged. The diode which is designed to operate in breakdown
region under certain conditions is known as Zener diode. Zener diode is heavily doped than normal PN junction
diodes. The circuit symbol of zener diode is as shown in figure ().
10
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Characteristies
Figure (2) illustrates that V-] characteristics of Zener diode.
(mA)
V,
V(forward)
V(reverse)
Figure (1): Symbol of Zener Diode Figure (2): V-I Characteristics of Zener Diode
During forward bias condition, the Zener diode acts as normal PN junction diode. The diode is heavily
doped, it means that the width of depletion layer is small. Consequently at lower voltages breakdown occurs
it leads to sharp increase in reverse current is as shown in
figure (2).
The applications of zener diode are,
1. Voltage regulators
2. Switches in logic circuits
3. Communication circuits.
Q1K Discuss the V- characteristics of Zener diode. Explain avalance and zener breakdowns.
Oct.-13, Q3(a)
OR
Explain avalanche and zener breakdown mechanisms and explain the forward and reverse
characteristics of a zener diode.
Oct.-12, Q3(a)
Answer :
V-ICharacterisitcs of Zener Diode
For answer refer Unit-1, Page. No. 10, Q.No. 13, Topic: Characteristics.
Avalanche and Zener Breakdown
The diode enters the breakdown region when the magnitude of the reverse voltage exceeds a threshold
value that is specifc to the particular diode, called the breakdown voltage. In the breakdown region for very
smallvariation involtage the current increases rapidly. There are two types of breakdown mechanisms.
1. Avalanche breakdown
2. Zener breakdown.
1. Avalanche Breakdown
In this mechanism, thermally generated electron-hole pairs gains energy from the external voltage
applied and breaks the covalent bonds to produce new electron-hole pairs. This new electron-hole pairs
inturn, generates more electron-hole pairs by disrupting bonds and the process continues cumulatively This
cumulative proccss is known as Avalanche Multiplication. Due to this large current is seen at the terminals of
diodes for small variations in voltage.
2. Zener Breakdown
In this mechanism, electron-hole pairs are generated by applying strong electric field.
Because of the
presence of strong electric field direct rupture of covalent bonds takes place. Due to this new electron-hole
pairs are generated. The breakdown 0ccurring due to application of strong electric fields is known as zener
breakdown.
What is tunnelling? Discuss the charac Llectrons in conduetion band Emply coergy level
teristics of atunneidiode.
Electrons in
March-12, Q3(b) Valeny band
OR
P
Explain V- characteristics of varactor
diode.
Figure (4): Valley Voltage Oct.-15, Q10 |March-13, Q9
V-I
Characteristics of Tunnel Diode OR
Figure (5)
of tunnel diode. illustrates the typical characteristic Explain the
diode. construction of varactor
(MA)
CurTent March-15, Q11
OR
Negative Draw the V-l
Resistance
region
characteristics
diode and explain. of
varactor
Oct.-14, Q3(b)
OR
Write short notes on
varactor diode.
V
V (Oct.-13, Q3(b) |Oct.-12, Q3(b))
Voltage(mV) OR
Explain theworking
Figure (5): V-4
Characteristics of Tunnel diode and draw its principle of varactor
Forward current
with increase in applied
Diode
increases sharply in accordance OR characteristics.
maximum voltage and it reaches the
point. The voltage Explain the working of a
point (or) peak point is (or) ascurrent at maximum Varactor diode.
peak current. referred peak voltage (or)
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PUBLISHERS AND (Refer exchuaing Applicattons)MayiJune-18, Q9(b)
PVT,
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Answer :
A-n junction diode that actsas a voltage variable chpancitor under reverse biasconditon is known as
()
varactor diode. The symbol of varactordiode as show in figure
A K
Figure (1)
Working Principle
Junction capacitance present in allreverse biased diodes because of depletion region is optimized in
avaractor diode and used in high frequencies and switching applications. In other words, the dependence of
junction capacitanceC, on the reversed bias voltage V, is made useful in a number of applications.
Concept
The depletion layer created in the p-n junction acts as an insulator and the p-region and n-region act
as plates of the capacitor. When the reverse voltage increases, the width of depletion layer increases and ca
pacitance becomes smaler. The capacitance C, ofa varactor diode is determined using the equation.
A
.. (1)
Where,
¬-Permittivity of semiconductor material
A-Cross-sectional area of the junction
W,- Width ofthe depletion layer
The characteristic of varactor diode are as shown in figure (2).
CTpF)
capacitance
Junction
OR
Discuss the construction, working of SCR and draw the characteristics of SCR
Gct-12 Q4c)
OR
PI
JI
NI
J2
Bate o P2
J3
N2
Cathode
Figure (1): Basic Structure
K
A
is PHOTOELECTRONIC
siliconcontrolled DEVICES ELECTRONICS PAPER-I|
V-I Characteristics of SCR: Figure (3) rectifier explaincd with the help of its characteristics. 'ER-|
of operation,
illustrates the
(i) Forward blocking region voltape-currcnt
characteristics of SCR. It has three modes plain
and
(ii) Forward conduction Tegion
(ii) Reverse
blocking region. 212(a)
Wave
Torward conduLtin
(on statc)
Reverse Latching current
leakage Holding current
current mA
V
Reverse Forward Forward
blocking blocking leakage
current
ge
or
ng
Figure (3): V-1 Characteristics of SCR
(i) ForwardBlocking Region: In this region of operation, anode terminal is
cathode and the gate terminal is open circuited (i.e., I, = 0). In this mode made positive with respect to the
of operation, junction Jl and J3
are forward biased and J2 is reverse biased. Due to depletion layer at
the junction J2 (gate), no
through the circuit. But some small leakage current flows through the circuit due to drift of current fiows
mobile charge
carriers. From the above point, it is clear that SCR is in forward biased condition but it does not conduct.
(i) Forward Conduction Region: If the applied voltage is increased further keeping gate terminal open circuited.
Then the reversed biased junction J2 leads to avalanche breakdown and SCR turns into high conduction
mode. The voltage at which junction J2 gets breakdown is known as forward break over voltage (V, ).
From the forward break over point SCR switches to ON state. Once SCR started conducting means that the
forward current is higher than minimum leakage current. The gate current is not required to maintain SCR
inconducting state. The current at which the conduction of SCR starts is known as holding current (1).
ii) gale
Reverse Blocking Region: When the cathode is made positive withi spectto the anode and open circuiting
makes SCR to operate in reverse biased mode. The junction JI and J3 are reverse biased and junction J2
Is forward biased therefore small leakage current flows at junction "J2' and that current is referred as reverse
voltage an avalanche breakdown
Teakage current. If the reverse voltage is increased to reverse breakdown
is reterred as reverse blockine
0ccurs at junction JJ and J3 and reverse current increases sharply. I his region
Tegion.
transistors. Discuss its
Cxplain how SCR is represented as a combination of two
characteristics.
Answer : Oct.-15, Q4a)
-CdsO, track
Metal film contact
Resin case
Figure (2): Basic Structure of LDR
Characteristics
Typicalcharacteristic curves of light dependent resistor is as shown in figure(3). The plot is drawn in between
the values of resistance and intensity of light plot willgive the full picture regarding the variation of resistance with
intensity of light. The resistances of LDR reaches high values under dark conditions.
10 K
Bright Sun light
(Ohn1s)
Resistance
1000
100
Light
Glass
Metal W
Tng
A
Junction
Metal contact
60
H= 100 mw/cm
50
40
30
20
10
Applications
Solar cells are broadly used in
Board satellites to recharge their batteries
Caleulator
S MaylJune-17, Q8
(Charge
recombination
-P-type layer
OR -n-type layer
Anode
Answer :
ELEC'
ELECTRONICS PAPER-I| ELECTRONIC DEVICES
4.2.4 When diode is forward biased, the current flows through diode is inereases As the raise in
current results
raise in intensity of light at the output side.
Following table gives the information regarding which material produces which coloured light.
Ansy S.No. Mixture Colour
Phote GaAs IR, Invisible
2. GaP Red (or) Green
3 GaAsP Red or Yellow
transi
takes Applications
curre
acts Digital watches
2. Optical communication system
Phot
3 Microprocessor systems
phot
in fi; 4 Digital computers
S. Calculators
6. Multimeters.