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Name : ……………………………………………………………
Roll No. : ……………………………………………..…………..
Invigilator's Signature : ………………………………………..

CS/B.TECH(ECE-N)/SEM-8/EC-803B/2011
2011
EMBEDDED SYSTEM
Time Allotted : 3 Hours Full Marks : 70

The figures in the margin indicate full marks.

GROUP – A
( Multiple Choice Type Questions )

1. Choose the correct alternatives for any ten of the following :

10 × 1 = 10

i) I 2 C bus stands for

a) Intra IC connect bus

b) Interface IC connect bus

c) Inter IC connect bus

d) none of these.

ii) The number of bit of microcontroller in sophisticated

a) 8 or 16 b) 16 or 32

c) 32 or 64 d) none of these.

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iii) MAC unit is present in which type of processor ?

a) ARM processor b) DSP processor

c) ASIP processor d) none of these.

iv) In distributed embedded controller which type of bus is

a) CAN bus b) I 2 C bus

c) USB bus d) none of these.

v) Architecture used in DSP Processor is

a) Van Newman b) Harvard Architecture

c) SIMD d) All of these.

vi) Which one of the following address structures denotes

a) Tag 5; Block 7; word 4

b) Tag 12; word 4

c) Tag 6; Block 6; word 4

d) None of these.

vii) SOC means

a) a single chip that would realize the entire system

b) a system is distributed in different chips

c) a partially filled system within a chip

d) various program modules included within a chip.

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viii) Let h be the hit rate, M the miss penalty, C the time to

access information in the cache. The average access

time experienced by the processor is

a) tavg = ( 1 – h ) C + ( 1 – h ) M

b) tavg = hC + ( 1 – h ) M

c) tavg = ( 1 – h ) C + hM

d) tavg = hC + hM.

ix) L1 Cache is made of

a) DRAM b) SRAM

c) Both of these d) None of these.

x) Memory requirement of ARM in Thumb mode is

a) less

b) same

c) more

d) depends on the system.

xi) G-sensor is used to sense

a) temperature b) speed/position

c) light intensity d) none of these.

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xii) UART stands for

a) Uniform Access for Receiver & Transmitter

b) Universal Access for Receiver Transmitter

c) Universal Asynchronous Receiver Transmitter

d) none of these.

GROUP – B
( Short Answer Type Questions )
Answer any three of the following. 3 × 5 = 15

2. a) Define an embedded system.

b) How does DSP differ from general purpose processor

( GPP ) ? 2+3

3. Explain the need of watchdog timer and reset after the

watch time. 5

4. a) What is the difference between Neuman architecture

and Harvard architecture ?

b) Whatr do you mean by Memory Hierarchy in an

embedded system ? 3+2

5. What do you mean by fixed point and floating point

arithmetic in connection with embedded system

computation ? Discuss with example. 5

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6. a) Define the terms 'Transducer' and 'Actuator' in

connection with embedded system design.

b) Distinguish between embedded computing and

distributed computing. 3+2

GROUP – C
( Long Answer Type Questions )
Answer any three of the following. 3 × 15 = 45

7. a) Compare SRAM and DRAM.

b) What is the difference between Standard write & late

write in SRAM ?

c) What is meant by Dynamic power loss of SRAM ?

d) Name and explain, different reading mechanisms of

SRAM from the memory with timing diagram.

3+2+2+8

8. What do you mean by Pipelining ? How is this concept

implemented in ARM core processor ? Describe different

modes of ARM core. 3+4+8

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9. a) What is Cache Memory ? What is its importance ?

b) What is Direct map Cache ? Write the problems

associated with this.

c) Explain how does a function is implemented in FPGA

using LUT. 3+2+4+2+4

10. a) Discuss different characteristics of DSP Processor.

Write the names of DSP Processor used for commercial

purpose.

b) What are the advantages of modified Harvard

Architecture ? Why is such architecture necessary in

DSP Processor ? What is zero overhead looping ?

c) What is VLIW processing ? 5+2+3+2+1+2

11. a) What are different utility in mail box, pipe and queue in

RTOS ?

b) What are the different management techniques adopted

and why in real time OS ?

c) What are the different interrupt rules in real time

system ? 5+5+5

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12. Write down the short notes on any three on the following :

3×5

a) Device Driver

b) System On Chip ( SOC )

c) Different types of PLD

d) Pressure and temperature sensors

e) Architecture of FPGA.

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