NEW 3D Laser Scanning Confocal Microscope

VK-X Series

Transforming 3D Surface Metrology

 Measure across a 50 mm area
with nanometre resolution

Easy to use. Rapid results. Automated operation.

Introducing the next-generation VK Series with functionality that provides
images and data far beyond those from conventional 3D measurement systems.

2
 Industry First

16 times larger measurement area

Measure with guaranteed accuracy using a low magnification lens
The VK-X enables high-accuracy 3D measurements over a large area
—a limitation of conventional laser microscopes.

New Principle

Rapid 3D measurement
Focus Variation ISO 25178-6

Introducing a new measurement method for high-resolution, surface analysis in as little

as 5 seconds.

New Algorithm

Fully automated measurement

RPD II / AI Scanning
One-click data acquisition reduces user subjectivity and ensures accurate
measurement on any sample.

NEW 3D Laser Scanning Confocal Microscope VK-X Series

VK History

Since 1995

VF-7500 VK-8500 VK-9500 VK-9700 VK-X100 VK-X250

3
 Technology Comparison

Issues with Conventional Measurement Systems

Optical Microscopes / SEMs

Shallow depth-of-field Limited magnification and Size and material limitations

colour options

Chip resistor (100×) Toner on paper (1000×)

Profilometers

Damage to surface Difficult to position stylus Stylus tip size limits resolution

Contact profiler

R: 2 µm

Aluminium surface (200×)

Interferometers

Data loss on steep angles Tilt adjustment required Poor spatial resolution

Sample placement

Focus adjustment

Tilting adjustment

Start measurement

Diamond tool (400×) Disk pits (6000×)

4
 Laser Microscope Solutions

High-Resolution Colour Imaging

Large depth-of-field 28,800× with true colour No processing or sample limitations

Chip resistor (100×) Toner on paper (1000×)

Non-Destructive Measurement

Laser provides more accurate

Non-contact measurement Measure anywhere on a surface surface data

Laser Microscope

R: 0.2 µm

Diaphragm (200×, image stitching)

Highly Versatile with No Material Restrictions

No data loss No tilt adjustment required High spatial resolution

Sample placement

Start measurement

Diamond tool (400×) Disk pits (6000×)

5
 Technology Comparison

16 times larger measurement area

Conventional

VK-X1000

16× Larger Area

Compared with Conventional Systems

6
Industry First

Guaranteed Accuracy with Low-Magnification Lenses*

Conventional

When measuring with a high-magnification When measuring with a low-magnification

lens, accuracy is high but measurement lens, measurement area is large but
range is limited. accuracy is low.

VK-X1000
High Accuracy over a Large Area

Measurement is possible at a guaranteed accuracy even with a

low-magnification lens. Accurate 3D observation is possible even
for targets with steep angles and large height differences.
Conventional systems must use higher magnification lenses to
reduce the field-of-view and increase accuracy. The VK-X is able to
perform the same measurements but at a lower magnification.

* Conventional laser microscopes cannot guarantee measurement accuracy with a 5× lens.

7
 Technology Comparison

Rapid 3D measurements

As Little as
5 Seconds

8
 New Principles for Faster Measurement
Conventional
— Point-based scanning —

Approx. 60 seconds

VK-X1000
— Instant surface scanning —

Approx. 5 seconds

Measure up to 12× Faster

with Focus Variation *ISO 25178-6

New Focus Variation Principle Reliable Accuracy Guarantee

Focus Variation captures multiple optical images while Measurement results with Focus Variation are based
the lens is moved up and down. These images are on a traceability system that complies with national
then used to construct a 3D shape according to focus standards.
position height.
Z X-Y

National Institute of Advanced Industrial

National Physical Laboratory (NPL)
Science and Technology (AIST)

UKAS accredited organisation JCSS accredited organisation

Non-contact optical 3D profiler Coordinate measurement equipment

Standard step Reference scale

3D Laser Scanning Confocal Microscope VK-X Series

9
 Technology Comparison

Fully automated measurement

Just Click and Go

10
 AI-SCAN Automates
the Measurement Process
AAG II Function Automatically Adjusts Intensity Double Scan Function for Improved
of Received Light Data Collection
Optimisation of the received laser intensity makes If a surface cannot be measured accurately with a
accurate measurement possible for targets with single scan, the sensitivity of the light-receiving
complex surfaces or those with large differences in element is automatically adjusted and the object is
reflectance. scanned again to generate accurate results.

Conventional Conventional

AAG II function Double Scan function

Diamond tool (400×) Solder (100×)

New Light-Receiving Element and RPD II Algorithm

Accurate ZI Profile Curve Calculation Accurate Peak Detection

The VK-X’s updated light-receiving element (PMT) and The peak position—the point of strongest reflected
algorithm help to reduce noise, while producing light intensity along the ZI profile curve—can be
accurate ZI profile curve calculations even in areas accurately determined using the RPDII algorithm,
that poorly reflect light or with low magnification ensuring that users always get the correct data.
lenses.
Conventional
Z position

Conventional RPD II
Z position

Z position

Detected focal point

Detection of the true focal point is
not possible.

RPD II

Intensity of reflected light Intensity of reflected light Intensity of reflected light Detected focal point
Detection of the true focal point is
possible.

11
 Accuracy

High-Sensitivity 16-Bit PMT

Built-in photomultiplier accurately captures 3D data

Conventional 16-bit

BGA (200×)

Accurate Measurement of Steep Angles with Measure Surfaces with Large Changes in
16× Dynamic Range Reflectance or Colour
With 16 times the dynamic range of conventional Utilising 16-bit (65,536-shade) processing, the VK-X is
systems, the VK-X provides accurate measurement for capable of distinguishing different colours and mixed
samples with steep angles or complicated shapes, as light and dark areas that proved difficult with
well as at low magnification. conventional systems.

Performance differences among Conventional 16-bit

Steep angle-of-detection
light-receiving elements

87.1 degrees

256× more 16× more

shades of grey shades of grey

CCD Conventional VK-X

Blade edge (400×) 8-bit 12-bit 16-bit

Glass + rubber: Sample with an extreme reflectance difference (400×)

12
Accurate Nano-Level Measurements
All-new KEYENCE technology

MEMS actuator (1000×) Provided by Mita Laboratory, Graduate School of Engineering, University of Tokyo,
as part of the Nanotechnology Platform at the university’s VLSI Design and Education Center (VDEC)

Industry-Best 0.5 nm Linear Scale Guaranteed Accuracy and Repeatability

Using a high-precision linear scale, the Z-axis Laser confocal measurements are based on a
movement of objective lenses can be tracked with a traceability system that complies with national
0.5 nm resolution. This gives the VK-X unmatched standards, ensuring guaranteed accuracy in both
performance for 3D measurements. precision and repeatability.

Traceability System Diagram

Z X-Y

National Institute of Standards and National Institute of Advanced Industrial

Technology (NIST) Science and Technology (AIST)
Linear scale module

NVLAP accredited organisation JCSS accredited organisation

Coordinate measurement equipment

Standard step Reference scale

Nano-scale step (3000×)

3D Laser Scanning Confocal Microscope VK-X Series

13
 Efficiency

Visualise and Measure Surface Differences

Multi-File Analysis Function enables comparative analysis for multiple samples

Multi-line Roughness
Horizon 1
Ra Rz RSm
Laser + Optical 3D
Profiles Ave. Ave. Ave.
μm μm μm
Total profile
Sample A

Roughness profile

Total profile

Sample B

Roughness profile

Total profile
Sample C

Roughness profile

Total profile

Sample D

Roughness profile

Roughness measurement of blasted surface (1000×)

By aligning the height range scales, the VK-X is able to perform measurement for multiple data
sources under identical conditions. Differences due to changes in manufacturing conditions or
wear over time can be instantly recognised for drastically reduced analysis time.

Batch Analysis: 3D List Display:

Collective Analysis of Multiple Files Quickly Compare 3D Surfaces
Users can process multiple data files with a single The VK-X is able to display multiple 3D images
operation, ensuring uniformity when evaluating the side-by-side so that users can more easily compare
data and dramatically reducing analysis time. the differences between surfaces. The images can be
adjusted in unison and saved as a single image.

Position alignment,
image processing,
and measurement
unification

Collective height
display setting

Collective graph
display setting

Corrosion evaluation of blasted surface (1000×)

14
Fully Automated, Programmable Inspections
Programming and batch measurement

Wire bonding (400×, image stitching)

Using an advanced motorised stage, images and measurements can be taken at programmed locations, increasing the number of test
samples that can be evaluated and completely automating the inspection process.

Easy Programming-Free Configuration for Automatically Extract Areas for Measurement

Automatic Analysis
With the VK-X, conditions can be specified to extract
The VK-X is capable of applying its various analysis only a specific area based on the height from a
settings to each measurement point. This eliminates reference plane or colour information. This makes it
the need for professional programming and enables possible to instantly calculate the total number or
consecutive measurement of various elements, volume of the extracted areas, or the ratio of the area
including volume, area, dimensions, and flatness. within the field of view.

Volume & area

Laser + Optical Measured values
Volume C.S. area Surface area Surface area/C.S. area Area ratio Average height Max. height Perimeter Horz. Feret Vert. Feret Circle equivalent dia

Total
Max.
Min.
Ave.
Std. DV
3 Sigma

Volume C.S. area Surface area Surface area/C.S. area Area ratio Average height Max. height Perimeter Horz. Feret Vert. Feret Circle equivalent dia

Total
Max.
Min.
Ave.
Std. DV
3 Sigma

Volume C.S. area Surface area Surface area/C.S. area Area ratio Average height Max. height Perimeter Horz. Feret Vert. Feret Circle equivalent dia

Total
Max.
Min.
Ave.
Std. DV
3 Sigma

Volume C.S. area Surface area Surface area/C.S. area Area ratio Average height Max. height Perimeter Horz. Feret Vert. Feret Circle equivalent dia

Total
Max.
Min.
Ave.
Std. DV
3 Sigma

Embossing area ratio measurement (200×)

15
 Analytics

Measure Profiles at Any Location

Non-destructive measurements with just the click of the mouse

Facets on GaAs due to liquid phase growth (3000×) Provided by Prof. Tadaaki Kaneko, Department of Chemistry,
School of Science and Technology, Kwansei Gakuin University

By scanning an entire area, the VK-X can perform non-contact measurements anywhere on an
object, without the need to re-scan when other locations need to be measured.

Assistance Tools Ensure Correct Placement of Edge-detection Tools Ensure Reliable

Measurement Lines Measurement
When using contact profilers, it is nearly impossible to When selecting a location to measure on a profile line,
accurately place the probe to measure on rounded users may not accurately place a measurement point.
objects like wire, hair, or microlenses. The VK-X has These tools will automatically snap the measurement
built-in tools to automatically detect the centre-line point onto the profile line to improve repeatability.
axis and max/min locations over an area to reduce
measurement variation and improve accuracy.

Conventional Conventional

Errors occur depending on the selected position

Measurement of same location is nearly impossible

Cylinder axis function Measurement position detection function

Automatically corrects for errors in measurement position

Accurately measures the centre section of a hair Hair (3000×)

16
Intuitive Roughness Analysis
Compliant with ISO standards-Evaluate roughness on any material

Cutting surface: Surface roughness measurement (1000×)

The VK-X is able to measure surface roughness (ISO 25178) and line roughness (ISO 4287) on
surfaces that have textures too small for normal stylus-based systems to measure. Users can get
a more detailed picture of how their surface looks and accurately quantify it as well.

Parameter Suggestions for Defining Differences in Sample Roughness

42 parameters are used to automatically compare multiple samples. Values such as Ra and Rz are automatically
visualised in relation to each other. Instantly analyse previously undefined aspects used to quantify differences
between targets, from judgement between good and bad products to analysis of samples made through different
processing methods. With explanations attached to each parameter, any user is able to analyse surface texture.

Good sample: Ra = 1.8

Bad sample: Ra = 1.8

17
 Quantification

Volume/Area Measurement Average Step Measurement

Up to 3000 points can be measured, including volume, Within a specified region, users can measure average
surface area, sectional area, area ratio, average height, and height, the step height from a reference plane, and
maximum height. difference in max/min heights. The degree of flatness can
also be calculated using max/min data.

Switch (400×)

Photoresist (1000×) Measure the degree of flatness of the specified section

Single and Multi Line Roughness Measurement Surface Roughness Measurement (ISO 25178)
(ISO 4287)
The VK-X utilises data from the overall surface to achieve
Roughness measurement for ISO-compliant shapes is ISO-based roughness measurements. Instead of using just a
possible with the VK-X. With a spot diameter of 0.4 µm, the line, roughness can be calculated over an area for more
laser light is able to accurately analyse even ultra-fine accurate and stable measurement.
shapes. The VK-X also features a contact-type roughness
measurement mode that can be used to determine
correlation with contact profilers.

Contact roughness gauge data

VK-X roughness data

Processed metal
surface (400×)

Non-contact surface roughness measurement

18
Planar Measurements Film Thickness Measurement
Various XY measurements are possible including distance, The VK-X measures thickness by analysing the light reflected
circular diameter, and angle. The wide selection of functions from two locations of a transparent object—the top surface
helps to reduce variation through automatic extraction of and the bottom surface. The topmost and bottommost layers
target edges and the creation of auxiliary lines and of the film are converted to a 3D image, and the thickness is
intersections. measured from the image’s cross-sectional shape.

Clear coated 3D image

surface

Mobile phone case surface

(1000×)

Plastic case
surface

Clear coated
Thickness of surface
clear coating
Plastic case
surface

Gear: Dimension measurement (50×)

Film Surface Measurement Automatic Measurement

With thin transparent film, the light reflects from both the top Using reflected light intensity data makes it possible for the
and bottom layers, making measurement difficult. With the VK-X to automatically determine various features such as the
VK-X’s Film Surface mode, accurate measurement of only highest point and the edge. Measurement of the height and
the top layer is possible. width can then be performed automatically. Samples can be
measured simply by clicking the mouse, improving
inspection productivity.

Conventional
Cannot measure the top surface of
a transparent layer due to strong
reflection from the bottom layer.

VK-X

Able to isolate the reflection from

the transparent surface layer.

Resist (1000×) PCB (100×, Stitching of 7 × 6 images)

19
 Imaging

Advanced Observation
High-definition optical imaging system

PCB (42×, image stitching)

KEYENCE’s microscope
technology has been cultivated
over many years and allows
anyone to capture clear images
easily.
Through-hole (70×) Colour sensor (200×) Chip resistor (100×)

HDR Observation: Depth Composition Ensures Fully Focused

Improve Image Detail and Contrast Images for Accurate Judgement
A single image with high-level detail is generated by The VK-X can create fully focused images even for
capturing several images at different brightness levels. objects that can only be partially observed in focus
This allows for clear observation of otherwise invisible with an optical microscope. This makes it possible for
defects as well as improvements in colour and users to analyse their parts with greater efficiency.
contrast.

Conventional Optical image

After HDR processing Ink toner (400×) Depth composition Chip resistor (100×)
image

20
High Magnification and Resolution
Comparable to an SEM
28,800× magnification without the need for a vacuum

Fully focused optical image

With high-resolution laser scanning, the VK-X is

capable of creating images with magnification and
resolution comparable to SEM images. Images are
also full-colour and easy to understand. 16-bit laser colour image Abrasive (400×)

Auto-Navigation for Reliable Positioning at C-Laser Differential Interference

High Magnification Visualises Nano-Level Features
The VK-X’s advanced navigation image prevents users The Differential Interference Contrast (DIC) imaging
from losing sight of the observation position. Simply method makes it possible to see nano-level features,
select the desired location and watch as the stage such as textures and scratches, impossible to see with
moves, the lenses switch, and the focus adjusts conventional microscopes. Measurement can also be
completely automatically. performed directly on the 3D display for reliable
analysis.

Optical image

Click to move

Differential interference image Measurement of micro section MEMS (6000×)

Nano-scale bumps or scratches can be specified as measurement targets

Click to move the observation position

21
 Measurement/Observation Principle

Colour CMOS camera X-Y scanning optical system Half mirror

Short-wavelength
laser light source

Condensing lens

Half mirror
Pinhole

Light-receiving element
(photomultiplier)

Half mirror
White light source

Objective lens

Observation target

Functional diagram of measurement principle

Short-wavelength 1024×768
laser light pixels
Measurement range

1. The laser scans in the X and Y directions.

2. The objective lens moves in the Z direction and
the laser scans in the X and Y directions again.
3. This scanning procedure is repeated until the end of
the measurement depth is reached.
4. The measurement is then complete.

22
Dual Light Sources
The VK-X uses two light sources: a laser light source and a white light source. Image and height data
are captured by using a high-speed scanner to raster the laser across the surface of the object.
The white light source enables the capture of colour information, similar to an optical microscope, while
the laser information provides much higher lateral resolution and measurement data.

380 400404 500 600 661 700 780

Laser source: For the VK-X, two types of laser sources are available: 404 nm violet
semiconductor laser and 661 nm red semiconductor laser. The appropriate laser can be
selected based on the application.

Three Types of Images

Laser light, transmitted through an X-Y scanning optical system, scans within the field-of-view by
dividing the region into up to 2048 × 1536 pixels. This scanning is repeated for each Z-position within
the measurement range to obtain matching reflected laser data and colour information for each pixel.
Then, only the colour and height data at each focal position is used to generate the high-resolution
colour and height-difference images.

Colour + laser intensity image Laser intensity image Height difference image

Pinhole Confocal Optical System

The VK-X incorporates a pinhole confocal optical system. Because the pinhole completely eliminates
ambient and out-of-focus light, the position that has reflected the most intense light can be recognised
as the true height. In addition to high-accuracy measurement, high-magnification, fully-focused
imaging is also possible.

Detection of the peak (focal point) by means of the pinhole confocal optical system in comparison to
systems without a pinhole

Z-I curve (light intensity) The peak light intensity is broader in

of systems without PMT conventional optical systems
Received
light intensity

and pinhole because there is no pinhole.

Ambient light from points other

Z-I curve of the pinhole than the peak (focal point)
confocal optical system

Focal point Z position

23
 Optional Software

Analysis Expansion Module VK-H1XP

The Analysis Expansion Module is available for samples that require position compensation and for measuring angles of spheres and
planes. This module provides additional 3D measurement tools for improving analysis efficiency and flexibility.

Measurement of Bumps/Voids Sphere and Surface Angle Measurement Position Correction

Capture regions that lie above (bumps) or Extracts and measures the radii of a Automatically adjusts the image so that it
below (voids) defined limit values, and spherical structure based on 3D surface opens at the same position as another
measure area ratios and volume. data. Eliminates user error by automatically saved image. When applied within a
extracting information instead of relying on a template, this function can automatically
user’s judgement. align, process, and measure a large number
of samples.

Bump measurement Sphere measurement Automatic position correction

Skewed image After automatic position

correction

Wire bond (2000×) Microlenses (1000×)

Particle Analysis Module VK-H1XG

Automatically counts the number of particles and measures the diameters, Particles can be counted and analysed based on
major and minor axes, area, area ratio, etc. on a surface. Processing, such accurate 3D surface data instead of just colour or
as circular shape separation, expansion, and erosion, can also be brightness. The results can be output to Excel or
performed automatically. other software for easy analysis or statistical
processing.

Metal surface with particles (1000×)

24
Optional Stages and Lenses

VK spacer Motorised stage

An optional spacer extends the working distance of the VK by The high-accuracy, motorised XY stage enables more precise
an additional 100 mm so that taller objects can be navigation, programmable measurements, and image stitching
accommodated directly on the stage. capabilities.

100 mm spacer

300 mm wafer stage Large-format stages

Observe and analyse across an entire 300 mm wafer. The If requested, we can propose customised stages that can
stage itself can be attached directly to the VK with no measure larger samples (e.g. solar panel substrates).
alterations. Please contact KEYENCE for other sizes.

Extensive lens lineup

An extensive lineup of VK-X lenses is available, from 2.5× to

150×. All lenses undergo special tuning and inspection before Comprehensive Lineup Including Lenses
with Long Working Distances
being shipped with each system. The lineup includes lenses
with long working distances and those for targets with a high
Examples of lenses with Monitor Working
aspect ratio. long working distances magnification distance

Standard 5× lens 120× 22.5 mm

Ultra-long range
480× 20.5 mm
20× lens

Ultra-long range
1200× 13.8 mm
50× lens

Ultra-long range
2400× 4.7 mm
100× lens

Fluorite, which has low refraction

and colour aberration, is used as
the lens material.

25
 Application Examples

Automotive and Metal

Fracture surface: Maximum height difference measurement (400×) Processed metal surface: Surface roughness comparison (400×)

Drill bit: Radius measurement (100×) Cutting tool: Wear analysis (100×)

26
 Precision Processing and Chemical

Film: Surface roughness measurement (3000×) Light guide panel: Area and volume measurement (3000×)

Microlens: Radius measurement (1000×) Film: Fish eye measurement (1000×)

27
 Application Examples

Semiconductor and Electronics

Inductor: Sectional measurement Provided by Mita Laboratory, Graduate School of Engineering, PCB (42×, image stitching)
(1000×) University of Tokyo, VLSI Design and Education Center (VDEC) (P5)

Wafer backside: Roughness measurement (1000×) MEMS: Sectional Provided by Dr. Matthieu Denoual (GREYC/CNRS, ENSI de Caen, France) and Mita
measurement (1000×) Laboratory, Graduate School of Engineering, University of Tokyo, VLSI Design and
Education Center (VDEC) (Front)

28
 Others

Paper surface: Degree of flatness measurement (100×) Clock movement (100×, image stitching)

Fractured metal surface: Striation (200×) Hair: Cuticle comparison (3000×)

29
 System Lineup

16-bit 3D Laser Scanning Confocal Microscope 16-bit 3D Laser Scanning Confocal Microscope
Controller VK-X1000 Controller VK-X1000
Head VK-X1100 Head VK-X1050
Stage (motorised/manual) Stage (motorised/manual)
VK-D1/VK-S1 VK-D1/VK-S1

Violet semiconductor laser, Red semiconductor laser,

wavelength: 404 nm wavelength: 661 nm

Display resolution: 0.5 nm Display resolution: 5 nm

System Configuration Diagram

Optional Accessories Stage Measurement head Controller

Motorised XY stage:
VK-S2100
Stage for 300 mm wafers:
OP-88231 (optional) Motorised stage: VK-D1 VK-X1100 VK-X1000
Extended height spacer:
OP-88232 (optional)
Ring illumination for 2.5× lens:
OP-88230 (optional)
VK reference gauge:
OP-88248 (optional)
Extension cable set: Manual stage: VK-S1 VK-X1050 Control PC Monitor (optional)
OP-88249 (optional)
* Please contact KEYENCE for a Observation/analysis software set: VK-H2X Particle analysis module: VK-H1XG (optional)
stage suitable for large-sized
samples. Image stitching module: ISO 25178 Surface texture measurement module:
VK-H2J (optional) VK-H1XR (optional)
Analysis expansion module:
VK-H1XP (optional)

Dimensions

Unit: mm

125 328 306 468

Controller: Measurement
VK-X1000 head:
VK-X1100/
184
227.8

213

X1050

Installation 317.7 50.3

surface 181
116
25 1 6
8×M0
th 1
R (Dep less)
De 2.5 or
pth
7 R2.5 Depth 7
94

195
84
80
62

39

98
71

52.5

24.5
38

92.5
88
112 116 Hatching
installation
surface

Stage: VK-D1 Stage: VK-S1

288
288

30
30

77
77

307 45 307 45
192 ø75 218 192 ø75 218
348 428 48 348 428 48

526

30
 Specifications

Basic Functions
Model (controller/head unit) VK-X1000/X1100 VK-X1000/X1050
Total magnification*1 Up to 28,800×
Field of view (minimum range) 11 µm to 7398 µm
Frame rate*2 (laser measurement speed) 4 to 125 Hz, 7900 Hz
Optical system Pinhole confocal optical system, Focus variation
Measurement Light-receiving element 16-bit photomultiplier: High-definition colour CMOS
principle Scanning method (during general Automatic upper/lower limit setting, high-speed light intensity optimisation (AAG II),
measurement and image stitching) poor reflected light intensity supplement (Double Scan)
Display resolution 0.5 nm 5 nm
Linear scale 0.5 nm 5 nm
Dynamic range 16 bits
Height measurement Laser confocal 20× 40 nm, 50× 12 nm 20× 40 nm, 50× 20 nm
Repeatability σ
Focus variation 5× 500 nm, 10× 100 nm, 20× 50 nm, 50× 20 nm 5× 500 nm, 10× 100 nm, 20× 50 nm, 50× 30 nm
Height data acquisition range 700,000 steps
Accuracy*3 0.2+L/100 µm or less (L= Measuring length)
Display resolution 1 nm 10 nm
Laser confocal 20× 100 nm, 50× 40 nm 20× 100 nm, 50× 50 nm
Width measurement Repeatability 3σ
Focus variation 5× 400 nm, 10× 400 nm, 20× 120 nm, 50× 50 nm 5× 400 nm, 10× 400 nm, 20× 120 nm, 50× 65 nm
Accuracy*3 Measured value ±2% or less
XY stage Manual: Operating range 70 mm × 70 mm
configuration Motorised: Operating range 100 mm × 100 mm
High-resolution colour CMOS image
16-bit laser colour confocal image
Observation image
Observation Confocal + ND filter optical system
C-laser differential interference image
Lighting Ring illumination, coaxial illumination
Wavelength Violet semiconductor laser, 404 nm Red semiconductor laser, 661 nm
Measurement laser
Maximum output 1 mW
light source
Laser class Class 2 laser product (IEC60825-1)
Power voltage 100 to 240 VAC, 50/60 Hz
Power supply
Power consumption 150 VA
Measurement head Approx. 13.0 kg
Weight Stage Approx. 16.0 kg (+2.5 kg with motorised stage attached)
Controller Approx. 3.0 kg
*1 When using a 23 inch full-screen display.
*2 At top speed when using a combination of measurement mode/measurement quality/lens magnification. When the line scan has a measurement pitch that is within 0.1 μm.
*3 When measuring a standard sample (standard scale) with a 20× or greater lens.

Measuring Lenses
W/D
Objective lens Field of view VK-X1100 VK-X1050
(mm)
2.5× 8.8 675 × 506 µm to 7398 × 5545 µm Optional Optional
5× 22.5 337 × 253 µm to 3699 × 2773 µm P P
10× 16.5 168 × 126 µm to 1849 × 1386 µm P P
20× 3.1 84 × 63 µm to 924 × 693 µm P P
50× 0.54 33.7 × 25.2 µm to 370 × 277 µm N/A P
100× 0.35 16.8 × 12.6 µm to 185 × 138 µm N/A Optional
APO, 50× 0.35 33.7 × 25.2 µm to 370 × 277 µm P Optional
APO, 100× 0.32 16.8 × 12.6 µm to 185 × 138 µm Optional Optional
APO, 150× 0.2 11 × 8.3 µm to 123 × 92 µm Optional Optional
Long range, 20× 11.0 84 × 63 µm to 924 × 693 µm Optional Optional
Long range, 50× 8.7 33.7 × 25.2 µm to 370 × 277 µm Optional Optional
Long range, 100× 2 16.8 × 12.6 µm to 185 × 138 µm Optional Optional
Ultra-long range, 20× 20.5 84 × 63 µm to 924 × 693 µm Optional Optional
Ultra-long range, 50× 13.8 33.7 × 25.2 µm to 370 × 277 µm Optional Optional
Ultra-long range, 100× 4.7 16.8 × 12.6 µm to 185 × 138 µm Optional Optional
Lens replacement Can be replaced by the user

VK-X Detailed Modules

Auto-focus module Automatic focusing during observation
Navigation function module Creates wide field-of-view images using the motorised XY stage
HDR/Double Scan module Captures images with extended dynamic range by acquiring images at varying brightness levels
Measurement module Measurement of dimensions
Scale display module Displays dimensional scale on observation screen
RPD function module Fast and accurate detection of optimum measurement data
Depth composition module Acquires and combines focus from multiple images for increased depth-of-field
Automatic upper/lower limit setup module Configures measurement range through automatic recognition of upper/lower target limits
Easy measurement module Automatically configures various measurement conditions for easy data acquisition

31
 In-Depth Analysis of Roughness

Introduction to roughness

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