ZTx Series Modules

Version: 20240614

Online Version
 Contents

Contents

1 Overview 2

2 Serial communication protocol 3

3 Serial communication between a module and an MCU 4

4 Level translator reference 6

5 Design specification 8
5.1 Serial port pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.3 Pins of the module . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.4 Power-on sequence of the module . . . . . . . . . . . . . . . . . . . . 9
5.5 Antenna clearance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.6 Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

I
 Contents

This topic describes information about implementing serial communication between

ZTx series modules and MCUs.

1 / 13
 1 Overview

1 Overview

ZTx series is the Zigbee module developed by Tuya.

This topic applies to the following Zigbee models.

Average
current in
continuous TX Average Average
(250 current in current in
Input voltage kbps/+10 continuous RX deep sleep
Module model (TYP) dBm) (250 kbps) mode

ZT3L 3.3V 9.15 mA 7.35 mA 2.8 μA

ZTU-IPEX 3.3V 8.9 mA 6.9 mA 2.8 μA
ZTU 3.3V 8.9 mA 6.9 mA 2.8 μA
ZT5 3.3V 9.1 mA 6.6 mA 2.8 μA
ZT2S 3.3V 9.25 mA 7.35 mA 2.8 μA
ZTLC5 3.3V 8.66 mA 6.54 mA 2.8 μA
ZTC 3.3V 8.66 mA 6.54 mA 2.8 μA

For more information, see the module datasheet.

• ZT3L Datasheet
• ZTU-IPEX Datasheet
• ZTU Datasheet
• ZT5 Datasheet
• ZT2S Datasheet
• ZTLC5 Datasheet
• ZTC Datasheet

2 / 13
 2 Serial communication protocol

2 Serial communication protocol

See serial communication protocol for Zigbee protocol.

3 / 13
 3 Serial communication between a module and an MCU

3 Serial communication between a module and an MCU

• Connection between a module and a 3.3V MCU

Figure 1: Image

• Connection between a module and a 5V MCU

In the following circuit diagram, voltage level translation can be implemented

with a bidirectional voltage-level translator, a MOS transistor, or a triode.

Figure 2: Image

Things to note

For low-power devices with sleep mode, two reserved GPIOs (PB4 and PB5) are used
for a handshake to make a connection between the MCU and the module. PB4 is
used for the Zigbee module to wake up the MCU. PB5 is used for the MCU to wake up

4 / 13
 3 Serial communication between a module and an MCU

the Zigbee module. These two GPIOs default to a high level and need to be pulled
low for at least 10 ms to be active.

For battery-powered devices with sleep mode, a handshake is required each time
before a party sends a command.

For mains-powered devices without sleep mode, the serial port keeps listening for
any connection attempts, so the PB4 and PB5 connection is not necessary.

5 / 13
 4 Level translator reference

4 Level translator reference

• N-channel MOSFET level translator

In the following circuit diagram, an N-channel MOSFET and a built-in body diode
are used to implement two-way communication.

Figure 3: Image

• NPN triode level translator

In the following circuit diagram, an NPN triode is used to implement one-way

communication.

6 / 13
 4 Level translator reference

Figure 4: Image

7 / 13
 5 Design specification

5 Design specification

5.1 Serial port pin

The following table lists the specification and pin information of ZTx modules for
serial communication with an MCU.

Peak
cur-
rent
in RX
(250 TX RX RX PB4 PB4 PB5 PB5
Module kbps/+10
TX pin silk pin silk pin silk pin silk
model dBm) No. screen No. screen No. screen No. screen

ZT3L 38.78 16 TXD 15 RXD 13 B4 14 B5

mA
ZTU- 38.78 15 B1 16 B7 11 B4 12 B5
IPEX mA
ZTU 38.78 15 B1 16 B7 11 B4 12 B5
mA
ZT5 44 3 C2 4 C3 1 B4 00 B5
mA
ZT2S 38.78 7 TX 5 RX 9 B4 11 B5
mA
ZTLC5 38.78 7 TX 5 RX - - - -
mA
ZTC 38.7 3 TX 2 RX 7 B4 8 B5
mA

The ZTLC5 module does not support serial communication applications applied
to low power devices with sleep mode.

8 / 13
 5 Design specification

5.2 Power supply

• The supply current for 3.3V modules must be greater than the maximum input
current. The total capacity of the external filter capacitor should be greater
than 10 μF.
• Place the filter capacitors C1 and C2 near the power pin of the module.
• Given the serial connection between the module and the MCU, if you only shut
down the module, the current from the MCU might flow into the power man-
agement system of the module, which causes the module to be stuck.

5.3 Pins of the module

• The reset pin or enable pin of the module is a hardware reset pin. The module
has internal weak pull-up resistors configured. If the pin is not used, it can
float. If a module has been paired, this pin cannot be used to clear pairing
information.
• The SWS pin of the module is used for firmware flashing. It is not recommended
to use it as GPIO. You can leave it floating or add a pull-up resistor.
• Other unused pins can float.
• For more information about pin configuration, see module datasheet.

5.4 Power-on sequence of the module

• Every time a module is powered on, its power pin must be started with 0V.

• If the voltage of the power pin does not drop to zero after the last power-off,
the module will be stuck when it is powered on again.

• If a capacitor of large capacity connected in the power circuit leads to a slow

discharge after power-off, you can connect a 1K dummy load on the 3.3V output
to speed up discharge.

9 / 13
 5 Design specification

Figure 5: Image

5.5 Antenna clearance

• Do not use metal shells or plastic shells with metallic paint or coating in the
direction of the antenna radiation. Do not use metal objects such as screws
and rivets near the antenna, which might affect the antenna efficiency.

• Try to increase the distance from the top shell to the antenna to minimize the
impact on antenna performance.

Figure 6: Antenna 3

• Try to increase the distance from the upper and bottom shells to the antenna
to minimize the impact on antenna performance.

10 / 13
 5 Design specification

• Keep the module away from speakers, power switches, cameras, HDMI, USB,
and other high-speed signals to avoid interference.

• Avoid metal shielding near the antenna. If co-channel interference occurs, you
must evaluate the impact on the antenna performance and ensure isolation
from interference.

5.6 Placement

• Horizontal placement

We recommend that you place the module at the edge of the backplane with
the antenna facing outward, and flush the module’s GND terminal with the
backplane’s GND terminal. Both terminals are fully connected.

Figure 7: Antenna 1

11 / 13
 5 Design specification

• Embedded placement
Embed the module into the backplane through a slot that is flushed with or
deeper than the module’s GND terminal. The side of the slot must be 15 mm
or farther from the module’s board edge.
A wider slot can achieve better performance that is still weaker than that of
horizontal placement.

Figure 8: Antenna 2

• Vertical placement
Insert the module vertically into the backplane slot with the antenna facing
upward. The module’s GND terminal and the backplane’s GND terminal must
be fully connected. We recommend that you keep a clearance distance of 15
mm or more around the antenna.

If the RF antenna of the module is traced along the ANT pin and backplane (the
PCB board on which the module is mounted) to connect to the antenna, the RF
trace (ANT pin is broken out) on the backplane should be surrounded by grounding
copper and designed to provide 50Ω impedance matching. The bottom layer under
the RF trace should not be traced to ensure a complete ground plane. If you do

12 / 13
 5 Design specification

not use the companion antenna of the module, you can reserve the π network for
antenna matching.

13 / 13