NP90N055
NP90N055
Description
These products are N-channel MOS Field Effect Transistors designed for high current switching applications.
Features
Super low on-state resistance
RDS(on) = 3.8 m MAX. (VGS = 10 V, ID = 45 A)
Low Ciss: Ciss = 4900 pF TYP. (VDS = 25 V)
Designed for automotive application and AEC-Q101 qualified
Ordering Information
Part No. Lead Plating Packing Package
NP90N055MUK-S18-AY *1 Pure Sn (Tin) Tube 50 p/tube TO-220 (MP-25K)
NP90N055NUK-S18-AY *1 TO-262 (MP-25SK)
Note: *1 Pb-free (This product does not contain Pb in the external electrode)
Thermal Resistance
Channel to Case Thermal Resistance Rth(ch-C) 0.85 °C/W
Channel to Ambient Thermal Resistance Rth(ch-A) 83.3 °C/W
D.U.T.
IG = 2 mA RL
PG. 50 Ω VDD
1000
ID(Pulse) = 360 A
RDS(ON) Limited PW
=1
(VGS=10 V) 00
μs
ID - Drain Current - A
100
ID(DC) = 90 A
PW
=1
10
PW
=1
0m
TC = 25°C
Single Pulse
0.1
0.1 1 10 100
1000
Rth(t) - Transient Thermal Resistance - °C/W
Rth(ch-A) = 83.3°C/W
100
10
Rth(ch-C) = 0.85°C/W
1
0.1
Single pulse
0.01
0.1 m 1m 10 m 100 m 1 10 100 1000
PW - Pulse Width - s
350
TA = –55°C
10 25°C
ID - Drain Current - A
300
ID - Drain Curent - A
85°C
150°C
250 1
175°C
200
150 0.1
100
0.01
50 VGS = 10 V VDS = 10 V
Pulsed Pulsed
0 0.001
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 1 2 3 4 5 6
4 1000
10
1
VDS = VGS VDS = 5 V
ID = 250 μA Pulsed
0 1
–100 –50 0 50 100 150 200 0.1 1 10 100
DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN TO SOURCE ON-STATE RESISTANCE vs.
RDS(on) - Drain to Source On-State Resistance - mΩ
6 6
5 5
4 4
3 3
2 2
1 VGS = 10 V 1 ID = 45 A
Pulsed Pulsed
0 0
1 10 100 1000 0 5 10 15 20
DRAIN TO SOURCE ON-STATE RESISTANCE vs. CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
RDS(on) - Drain to Source On-State Resistance - mΩ CHANNEL TEMPERATURE
7 10000
4
1000
3
Coss
2
VGS = 10 V
1 ID = 45 A VGS = 0 V Crss
Pulsed f = 1 MHz
0 100
–100 –50 0 50 100 150 200 0.1 1 10 100
1000 55 11
td(on), tr, td(off), tf - Switching Time - ns
100 VGS = 0 V
10 10
1
di/dt = 100 A/μs
Pulsed VGS = 0 V
0.1 1
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.1 1 10 100
2.8±0.3
15.9 MAX.
6.3±0.3
4
1 2 3
3.1±0.2
13.7±0.3
1.27±0.2
0.8±0.1
0.5±0.2 2.5±0.2
2.54 TYP. 2.54 TYP.
1. Gate
2. Drain
3. Source
4. Fin (Drain)
10.0±0.2 4.45±0.2
1.3±0.2
10.1±0.3
8.9±0.2
4
1 2 3
3.1±0.3
13.7±0.3
1.27±0.2
0.8±0.1
0.5±0.2 2.5±0.2
2.54 TYP. 2.54 TYP.
1. Gate
2. Drain
3. Source
4. Fin (Drain)
Equivalent Circuit
Drain
Body
Gate Diode
Source
Remark: Strong electric field, when exposed to this device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred.
Description
Rev. Date Page Summary
1.00 Jan 11, 2012 — First Edition Issued
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