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NP90N055

The document provides a preliminary data sheet for the NP90N055MUK and NP90N055NUK N-channel MOS Field Effect Transistors, designed for high current switching applications with features like low on-state resistance and AEC-Q101 qualification. It includes detailed specifications such as maximum ratings, electrical characteristics, thermal resistance, and typical performance graphs. Additionally, it outlines ordering information and package drawings for the components.

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0% found this document useful (0 votes)
9 views8 pages

NP90N055

The document provides a preliminary data sheet for the NP90N055MUK and NP90N055NUK N-channel MOS Field Effect Transistors, designed for high current switching applications with features like low on-state resistance and AEC-Q101 qualification. It includes detailed specifications such as maximum ratings, electrical characteristics, thermal resistance, and typical performance graphs. Additionally, it outlines ordering information and package drawings for the components.

Uploaded by

suhobrusovsto
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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You are on page 1/ 8

Preliminary Data Sheet

NP90N055MUK, NP90N055NUK R07DS0602EJ0100


Rev.1.00
MOS FIELD EFFECT TRANSISTOR Jan 11, 2012

Description
These products are N-channel MOS Field Effect Transistors designed for high current switching applications.

Features
 Super low on-state resistance
RDS(on) = 3.8 m MAX. (VGS = 10 V, ID = 45 A)
 Low Ciss: Ciss = 4900 pF TYP. (VDS = 25 V)
 Designed for automotive application and AEC-Q101 qualified

Ordering Information
Part No. Lead Plating Packing Package
NP90N055MUK-S18-AY *1 Pure Sn (Tin) Tube 50 p/tube TO-220 (MP-25K)
NP90N055NUK-S18-AY *1 TO-262 (MP-25SK)
Note: *1 Pb-free (This product does not contain Pb in the external electrode)

Absolute Maximum Ratings (TA = 25°C)


Item Symbol Ratings Unit
Drain to Source Voltage (VGS = 0 V) VDSS 55 V
Gate to Source Voltage (VDS = 0 V) VGSS 20 V
Drain Current (DC) (TC = 25°C) ID(DC) 90 A
Drain Current (pulse) *1 ID(pulse) 360 A
Total Power Dissipation (TC = 25°C) PT1 176 W
Total Power Dissipation (TA = 25°C) PT2 1.8 W
Channel Temperature Tch 175 °C
Storage Temperature Tstg –55 to 175 °C
Repetitive Avalanche Current *2 IAR 38 A
Repetitive Avalanche Energy *2 EAR 144 mJ
Notes: *1 TC = 25°C, PW  10 s, Duty Cycle  1%
*2 RG = 25 , VGS = 20  0 V

Thermal Resistance
Channel to Case Thermal Resistance Rth(ch-C) 0.85 °C/W
Channel to Ambient Thermal Resistance Rth(ch-A) 83.3 °C/W

R07DS0602EJ0100 Rev.1.00 Page 1 of 6


Jan 11, 2012
NP90N055MUK, NP90N055NUK

Electrical Characteristics (TA = 25°C)


Item Symbol MIN. TYP. MAX. Unit Test Conditions
Zero Gate Voltage Drain Current IDSS — — 1 A VDS = 55 V, VGS = 0 V
Gate Leakage Current IGSS — — 100 nA VGS = 20 V, VDS = 0 V
Gate to Source Threshold Voltage VGS(th) 2.0 3.0 4.0 V VDS = VGS, ID = 250 A
Forward Transfer Admittance *1 | yfs | 35 70 — S VDS = 5 V, ID = 45 A
Drain to Source On-state Resistance *1 RDS(on) — 3.15 3.80 m VGS = 10 V, ID = 45 A
Input Capacitance Ciss — 4900 7350 pF VDS = 25 V
Output Capacitance Coss — 500 750 pF VGS = 0 V
Reverse Transfer Capacitance Crss — 180 330 pF f = 1 MHz
Turn-on Delay Time td(on) — 28 70 ns VDD = 28 V, ID = 45 A
Rise Time tr — 12 30 ns VGS = 10 V
Turn-off Delay Time td(off) — 70 140 ns RG = 0 
Fall Time tf — 7 20 ns
Total Gate Charge QG — 80 120 nC VDD = 44 V
Gate to Source Charge QGS — 21 — nC VGS = 10 V
Gate to Drain Charge QGD — 20 — nC ID = 90 A
Body Diode Forward Voltage *1 VF(S-D) — 0.9 1.5 V IF = 90 A, VGS = 0 V
Reverse Recovery Time trr — 52 — ns IF = 90 A, VGS = 0 V
Reverse Recovery Charge Qrr — 95 — nC di/dt = 100 A/s
Note: *1 Pulsed test

TEST CIRCUIT 1 AVALANCHE CAPABILITY TEST CIRCUIT 2 SWITCHING TIME

D.U.T. D.U.T. VGS


RG = 25 Ω L RL
VGS 90%
10% VGS
Wave Form
RG 0
PG. 50 Ω VDD PG.
VDD
VGS = 20 → 0 V VDS
90% 90%
VGS VDS
BVDSS 10% 10%
0 VDS 0
IAS Wave Form
ID VDS τ td(on) tr td(off) tf
VDD
τ = 1 μs ton toff
Duty Cycle ≤ 1%
Starting Tch

TEST CIRCUIT 3 GATE CHARGE

D.U.T.
IG = 2 mA RL

PG. 50 Ω VDD

R07DS0602EJ0100 Rev.1.00 Page 2 of 6


Jan 11, 2012
NP90N055MUK, NP90N055NUK

Typical Characteristics (TA = 25°C)


DERATING FACTOR OF FORWARD BIAS SAFE TOTAL POWER DISSIPATION vs.
OPERATING AREA CASE TEMPERATURE
120 200
dT - Percentage of Rated Power - %

PT - Total Power Disslpation - W


180
100
160
140
80
120
60 100
80
40
60
40
20
20
0 0
0 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175

TC - Case Temperature - °C TC - Case Temperature - °C

FORWARD BIAS SAFE OPERATING AREA

1000
ID(Pulse) = 360 A
RDS(ON) Limited PW
=1
(VGS=10 V) 00
μs
ID - Drain Current - A

100
ID(DC) = 90 A
PW
=1

Power Dissipation Limited


ms

10
PW
=1
0m

Secondary Breakdown Limited


1
s
DC

TC = 25°C
Single Pulse
0.1
0.1 1 10 100

VDS - Drain to Source Voltage - V

TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH

1000
Rth(t) - Transient Thermal Resistance - °C/W

Rth(ch-A) = 83.3°C/W
100

10

Rth(ch-C) = 0.85°C/W
1

0.1

Single pulse
0.01
0.1 m 1m 10 m 100 m 1 10 100 1000

PW - Pulse Width - s

R07DS0602EJ0100 Rev.1.00 Page 3 of 6


Jan 11, 2012
NP90N055MUK, NP90N055NUK

DRAIN CURRENT vs. FORWARD TRANSFER CHARACTERISTICS


DRAIN TO SOURCE VOLTAGE
400 100

350
TA = –55°C
10 25°C
ID - Drain Current - A

300

ID - Drain Curent - A
85°C
150°C
250 1
175°C

200

150 0.1

100
0.01
50 VGS = 10 V VDS = 10 V
Pulsed Pulsed
0 0.001
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 1 2 3 4 5 6

VDS - Drain to Source Voltage - V VGS - Gate to Source Voltage - V

GATE TO SOURCE THRESHOLD VOLTAGE vs. FORWARD TRANSFER ADMITTANCE vs.


CHANNEL TEMPERATURE DRAIN CURRENT
VGS(th) - Gate to Source Threshold Voltage - V

4 1000

|yfs| - Forward Transfer Admittance - S


3 TA = –55°C
25°C
100 85°C
150°C
175°C
2

10
1
VDS = VGS VDS = 5 V
ID = 250 μA Pulsed
0 1
–100 –50 0 50 100 150 200 0.1 1 10 100

Tch - Channel Temperature - °C ID - Drain Current - A

DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN TO SOURCE ON-STATE RESISTANCE vs.
RDS(on) - Drain to Source On-State Resistance - mΩ

RDS(on) - Drain to Source On-State Resistance - mΩ

DRAIN CURRENT GATE TO SOURCE VOLTAGE


7 7

6 6

5 5

4 4

3 3

2 2

1 VGS = 10 V 1 ID = 45 A
Pulsed Pulsed
0 0
1 10 100 1000 0 5 10 15 20

ID - Drain Current - A VGS - Gate to Source Voltage - V

R07DS0602EJ0100 Rev.1.00 Page 4 of 6


Jan 11, 2012
NP90N055MUK, NP90N055NUK

DRAIN TO SOURCE ON-STATE RESISTANCE vs. CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
RDS(on) - Drain to Source On-State Resistance - mΩ CHANNEL TEMPERATURE
7 10000

Ciss, Coss, Crss - Capacitance -pF


6 Ciss

4
1000
3

Coss
2
VGS = 10 V
1 ID = 45 A VGS = 0 V Crss
Pulsed f = 1 MHz
0 100
–100 –50 0 50 100 150 200 0.1 1 10 100

Tch - Channel Temperature - °C VDS - Drain to Source Voltage - V

SWITCHING CHARACTERISTICS DYNAMIC INPUT/OUTPUT CHARACTERISTICS

1000 55 11
td(on), tr, td(off), tf - Switching Time - ns

VDS - Drain to Source Voltage - V

VGS - Gate to Source Voltage - V


50 10
45 VDD = 44 V 9
28 V
40 11 V
8
100 td(off)
35 7
td(on) 30 6
25 VGS 5
tr
20 4
10
tf 15 3
VDD = 28 V
VGS = 10 V 10 VDS 2
RG = 0 Ω 5 ID = 90 A 1
1 0 0
0.1 1 10 100 0 10 20 30 40 50 60 70 80 90

ID - Drain Current - A QG- Gate Charge - nC

SOURCE TO DRAIN DIODE FORWARD VOLTAGE REVERSE RECOVERY TIME vs.


DRAIN CURRENT
1000 100
VGS = 10 V
trr - Reverse Recovery Time - ns
IF - Diode Forward Current - A

100 VGS = 0 V

10 10

1
di/dt = 100 A/μs
Pulsed VGS = 0 V
0.1 1
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.1 1 10 100

VF(S-D) - Source to Drain Voltage - V IF - Drain Current - A

R07DS0602EJ0100 Rev.1.00 Page 5 of 6


Jan 11, 2012
NP90N055MUK, NP90N055NUK

Package Drawing (Unit: mm)

TO-220 (MP-25K) (Mass: 1.9 g TYP.)

10.0±0.2 3.8±0.2 4.45±0.2


1.3±0.2

2.8±0.3

15.9 MAX.
6.3±0.3
4
1 2 3

3.1±0.2
13.7±0.3
1.27±0.2
0.8±0.1

0.5±0.2 2.5±0.2
2.54 TYP. 2.54 TYP.
1. Gate
2. Drain
3. Source
4. Fin (Drain)

TO-262 (MP-25SK) (Mass: 1.8 g TYP.)


1.2±0.3

10.0±0.2 4.45±0.2
1.3±0.2
10.1±0.3
8.9±0.2

4
1 2 3
3.1±0.3
13.7±0.3

1.27±0.2
0.8±0.1

0.5±0.2 2.5±0.2
2.54 TYP. 2.54 TYP.
1. Gate
2. Drain
3. Source
4. Fin (Drain)

Equivalent Circuit

Drain

Body
Gate Diode

Source
Remark: Strong electric field, when exposed to this device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred.

R07DS0602EJ0100 Rev.1.00 Page 6 of 6


Jan 11, 2012
Revision History NP90N055MUK, NP90N055NUK Data Sheet

Description
Rev. Date Page Summary
1.00 Jan 11, 2012 — First Edition Issued

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