LABREPORTTWO

PRI
NTEDCI
RCUI
TBOARDFABRI
CATI
ONPROCESS

 Obj
ect
ive
 ToSt
udyTheBasi
cOfPr
int
edCi
rcui
tBoar
dandI
tsFabr
icat
ionMet
hod.

 Under
standi
ngt
hePCBFabr
icat
ionPr
ocess:

-Tosystemati
cal
l
ylear
nthest
epsi
nvol
vedi
ndesi
gni
ng,
transf
err
ing,
etchi
ng,
dri
l
li
ng,
andassembli
ngaPCB.

-Togai
nhands-
onexperi
encewit
htool
sandt
echni
quessuchasphot
oli
thogr
aphy
,
chemi
cal
etchi
ng,
andsolder
ing.

 Desi
gnandLay
outI
mpl
ement
ati
on:

-Tot
ranslat
easchemati
cdi
agr
am i
ntoaphy
sical
PCBl
ayoutusi
ngCAD(
Comput
er-
Ai
dedDesign)sof
twar
e.

-Toensurepropert
racerout
ing,
componentpl
acement
,andadher
encet
odesi
gnr
ules
(
e.g.
,spaci
ng,hol
esizes)
.

 Fabr
icat
ionAccur
acy
:

-Topract
icepr
eci
sionint
ransf
err
ingt
heci
rcui
tdesi
gnont
oacopper
-cl
adboar
dusi
ng
UVexposur
eortonertr
ansf
ermethods.

-Toeval
uat
et heeffect
ivenessofet
chi
ngpr
ocessesi
nremov
ingexcesscopperwhi
l
e
pr
eser
vingci
rcuitt
races.

 Funct
ional
Test
ing:

-Tov ali
dat
ethefabr
icat
edPCBbyt
est
ingel
ect
ri
cal
cont
inui
tyandf
unct
ional
i
tywi
th
connectedcomponent
s.

-Totr
oubl
eshootcommoni
ssues(
e.g.
,sol
der
inger
ror
s,connect
ivi
typr
obl
ems)and
pr
oposesol
uti
ons.

1
  Mt
eri
alsusedi
npcbFabr
icat
ion
1.CNCMet
hod

2.Sol
derMask

3.Conduct
iveLay
er

4.Sur
faceFi
nishes

5.Pl
ant
ingAndEachi
ngChemi
cal

6.Pr
otect
iveCoat
ing……et
c

 THEORY
 Pri
ntedCircuitBoards(PCBs)ar
eusedinalmostallel
ectroni
cappl
i
cat
ions.Fr
om mobi
l
e
phonestoai r
craft
s,goingthr
oughmedicaldev
icesorindustr
ial
machi
nery,
all
oft
he
el
ectroni
cpr oductsuseddail
yaresupport
edbyPCBs.

 Printedci r
cuitboar dsar eelectronicci rcui tsboar dscr eatedf ormount i
ngel ect r
onic
component sonanonconduct iveboar d, andf orcr eati
ngconduct iveconnect ions
betweent hem.Apr intedcircuitboar d, isusedt omechani call
ysuppor tandel ectri
call
y
connectel ectr
oniccomponent susingconduct i
vepat hway s,t
racksort raceset ched
fr
om coppersheet sl aminatedont oanon- conduct ivesubst r
ate.Pri
ntedci r
cui tboards
areel ectr
oni ccir
cuitsboar dscr eatedf ormount i
ngel ectroniccomponent sona
nonconduct iveboar d,andforcr eatingconduct i
veconnect i
ons.betweent hem.The
creationofci rcui
tpat t
ernsisaccompl ishedusi ngbot haddi t
iveandsubt ractivemet hods.
Theconduct i
vecircuitisgener all
ycopper ,alt
houghal umi num, ni
ckel,chr ome, andother
met alsar esomet imesused.I tisalsor ef erredtoaspr intedwi ri
ngboar d( PWB)or
etchedwi ri
ngboar d.APCBpopul atedwi t helectroniccomponent sisapr i
ntedci rcuit
assembl y(PCA) ,al
soknownasapr intedci r
cuitboar dassembl y(PCBA) .Printedcircuit
boar dshav ecoppert racksconnect ingt hehol eswher et hecomponent sar epl aced.They
aredesi gnedspeci al l
yforeachci rcui tandmakeconst r
uct i
onv eryeasy.

 Aprint
edcircui
tboard:PCB,isanon-conducti
vesubst
rat
eplatet
hatisusedforthe
assemblyandint
erconnecti
onofelectr
oniccomponentst
hroughrout
esortracksofa
materi
alconduct
orrecordedonthesubstrat
e.

 ThePCBsar
emostcommonl
ymadeoutoff
iber
glass,
composi
teepoxy
,oranot
her

2
 composi
temater
ial
.Di
ff
erentel
ect
roni
cpr
oduct
shav
edi
ff
erentr
equi
rement
sont
he
PCBbasemateri
al.

 MostPCBsf orsi
mpleel
ectr
oni
csaresimpleandcomposedofonlyasi
ngl
elayer
.
However,mor esophi
sti
cat
edel
ectr
onicci
rcui
tssuchascomputergr
aphi
cscardsor
motherboardsusetohavemult
ipl
elay
ers,someti
mesuptosixt
eenormore,cal
le
“
Multi
layer”PCBs.

 Ty
picalPCBsubst
rat
esar
emadef
rom acomposi
teof
:

 SomekindofRei
nfor
cementMat
eri
alorcor
epr
ovi
dingt
he"
skel
etal
"suppor
tfort
he
l
aminat
e.

Thispar
tofthePCBgi v
esst
rengthanddi
mensi
onalst
abi
l
ity
.Tefl
onfi
berorQuar
tzclot
hsar
e
usedasrei
nforcementmat
eri
als.TheFR-
4composi
temater
ial
isagoodexampleofcore
materi
alf
orPCBs.

TheFR-
4isacomposi
temat er
ial
composedofwovenfiber
glassclot
hwithanepoxyresi
n
bi
ndert
hati
sfl
ameresi
stantusedascommonreinf
orcementmat eri
alf
orPCBsfabri
cati
on.

 Resi
nBi
nderSy
stem:

I
tpr
ovi
desthe"gl
ue"t
obindthelaminatet
ogether.Someexamplesofthi
ski
ndofbi
nder
mat
eri
alsar
ether
moplast
ics,
thermoplast
icsorgeneral
purposeresi
ns.

 Conduct
iveorCat
aly
ticSur
faceCoat
ing:

I
tpr
ovi
dest
hebasi
sforcr
eat
ingt
heci
rcui
tpat
ter
n.

Oncet
hePCBi
smanuf
act
ured,
thecomponent
sassembl
edandt
hePCBv
eri
fi
ed

t
wot
ypesofpr
oduct
sar
eusual
l
yappl
i
edt
othesamePCB.Fi
rst
,someki
ndof

cl
eanerorf
luxsol
venti
sappl
i
edt
othePCB.Thenapr
otect
ivecoat
ingi
sappl
i
ed

cov
eri
ngt
heci
rcui
t.Thi
sfi
nal
prot
ect
ivecoat
ingav
oidst
hecoppert
ooxi
dizeand

gi
vesagr
eat
erdur
abi
l
ityt
othepl
ates.

3
  Mai
nadv
ant
agesoft
heuseofPCB’
sinel
ect
roni
cci
rcui
tsar
ethef
oll
owi
ng[
1-2]
:

 Thesi
zeofcomponentassembl
yisr
educedaswel
last
hewei
ght
.•

 Quant
it
ypr
oduct
ioncanbeachi
evedatl
oweruni
tcostandt
hewi
ri
ngand

assembl
ycanbeaut
omat
ed.

 Theyensur
eahi
ghl
evel
ofr
epeat
abi
l
ityandof
feruni
for
mit
yofel
ect
ri
cal

char
act
eri
sti
csf
rom assembl
ytoassembl
y.

 Thel
ocat
ionofpar
tsi
sfi
xed,
whi
chsi
mpl
i
fiesi
dent
if
icat
ionandmai
ntenance

ofel
ect
roni
cequi
pmentandsy
stems.Mor
eov
er,
Inspect
iont
imei
sreduced

becausepr
int
edci
rcui
tr
yel
i
minat
est
hepr
obabi
l
ityofer
ror
s.

 Pr
int
edwi
ri
ngper
sonnel
requi
remi
nimal
techni
cal
ski
l
lsandt
rai
ning.I
n

addi
ti
on,
chancesofshor
t-
cir
cui
tedwi
ri
ngar
emi
nimi
zed.

 Ci
rcui
tchar
act
eri
sti
cscanbemai
ntai
nedwi
thouti
ntr
oduci
ngv
ari
ati
oni
nint
er-

ci
rcui
tcapaci
tanceandpar
asi
ti
cef
fect
s.

 CADsof
twar
eforPCBdesi
gn

Ther
ear
emanydi
ff
erentway
stocr
eat
eaPCBdesi
gnbutt
hemostcommoni
sby

usi
ngaCADsof
twar
epackagespeci
fi
cal
l
ydesi
gnedf
orPCBci
rcui
ts.These

sof
twar
epackagesi
ncl
udeboar
dandschemat
icedi
tor
sthatwor
ktoget
hert
o

pr
ovi
dey
out
hebestdesi
gnpr
ocess.Theboar
dedi
torcani
mpor
tal
loft
he

component
s,f
oot
pri
nts,
andwi
resi
ntot
hePCBf
il
e,whi
chwi
l
lmaket
hePCB

desi
gnpr
ocesseasi
er.

 I
nter
msoft
hemostpopul
arPCBdesi
gnsof
twar
epackages,
her
eisal
i
stoft
he

mostwi
del
yusedi
nthei
ndust
ry.

1.
Eagl
e:-Eagl
est
andsf
orEasi
l
yAppl
i
cabl
eGr
aphi
cal
Lay
outEdi
tor
.Thi
ssof
twar
e

i
sav
ail
abl
einf
reeandpai
dver
sions.I
nthepai
dver
sion,
theuseri
spr
ovi
dedwi
th

4
t
echni
cal
suppor
tthati
ncl
udescal
l
,mai
landonl
i
nechatsuppor
tandpr
ovi
des

accesst
olat
estr
eleasesof
twar
e.Eagl
ehasav
erysi
mpl
e,ef
fect
iveandeasy

i
nter
faceandpr
ovi
deal
i
brar
ywhi
chcont
ainsal
argenumberofel
ect
ri
cal
and

el
ect
roni
cscomponent
s.Thati
sthemai
nreasonf
orbei
ngsopopul
arPCB

desi
gni
ngsof
twar
eamongeducat
ioni
st,
hobby
ist
,andpr
ofessi
onal
s.I
naddi
ti
on,

y
oucanf
indv
erygoodr
esour
cesandt
utor
ial
sfr
om i
nter
netwhi
chi
sver
yhel
pful

i
fyouar
ebegi
nner
.

2.
Desi
gnSpar
k.፡
-I
tisaneasy
-to-
usef
reePCBdesi
gnt
ool
prov
idedbyRS

Component
s.Desi
gnSpar
kismoder
nandi
ntui
ti
ve,
wit
hnopr
act
ical
desi
gn

l
i
mit
ati
onsi
nthear
eaoft
heboar
d,l
ayer
sandnumberofcont
act
s.Desi
gnSpar
k

gener
atesGer
berf
il
esaccor
dingt
oindust
ryst
andar
ds.I
tisof
fer
edf
reeofchar
ge

f
orcompani
es,
hobby
ist
s,educat
orsandmor
e.I
naddi
ti
on,
youcanqui
ckl
yupl
oad

y
ourbi
l
lofmat
eri
als(
BOM)t
otheRSComponent
swebsi
teusi
ngBOM-
Quot
e

ser
vice.

3.
KiCAD፡
-Iti
saf
reesof
twar
esui
tet
hathandl
esSchemat
icCapt
ure,
andPCBLay
out

wi
thGer
berout
put
.Itpr
ovi
desav
eryeasywayofr
out
ingt
hecomponent
sandi
t

makeseasyPCBt
roubl
eshoot
ingaswel
l
.Thi
ssof
twar
eisgoodf
orbegi
nner
sand

t
hebi
ggestadv
ant
agei
sthatt
hissof
twar
edoesnotr
equi
repur
chasi
nganyl
i
cense,

i
tisf
ree.

 PCBManuf
act
uri
ngst
eps
Fol
l
owi
ngar
ethest
epsi
nvol
vedi
nfabr
icat
ionofPCB.

 Desi
gni
ngOfEl
ect
roni
csCi
rcut
eandLay
out

 l
ayoutBr
indi
ng

5
  Basemat
eri
alcut
ti
ng

 Dr
il
li
ng

 Thr
oughhol
epl
ati
ng

 Lay
erf
il
m gener
ati
on

 Sol
derr
esi
stf
il
m gener
ati
on

 Legendpr
int
ingf
il
m(opt
ional
)

 Lami
nat
ing

 Exposi
ng

 Spr
aydev
elopi
ng

 Et
chi
ngpr
ocess

 Sol
derr
esi
stmaski
ng

 Legendpr
int
ing(
opt
ional
)

 Desi
gni
ngOfEl
ect
roni
csCi
rcut
eandLay
out

6
  l
ayoutBr
indi
ng

7
  Basemat
eri
alcut
ti
ng

Basemat eri
alwhichi
sselect
edbasedonappli
cati
on,
maybeepoxyr
esi
n(FR4)
,dur
oid(
of
requi
reddiel
ectr
icconst
ant),
iscuti
ntot
herequi
redsi
ze

 Dr
il
li
ng

PCBdril
l
ing,
orprintedcir
cuitboar
ddril
li
ng,i
st heprocessofcr
eati
ngholes,sl
ots,
andother
el
ectr
onicci
rcui
tboar dbefor
esolder
ing/mount i
ngcomponentsontoit.I
tist
ypi
call
ydoneby
usi
ngaPCBdr il
lbit(anautomatedmachine)thatissli
ghtl
ysmall
erthanthecomponents
pl
acedonit.

Holesaredri
lledthrought heboardusinganaut omateddr i
l
lingmachi ne.Acncdril
l
ing/mil
li
ng
machine,whichiscont rol
ledbyanEx cell
onfi
lewitht
hehol eposi t
iondataandalisofthelabel
s
oftherequi
reddrill
bits,isusedt odri
ll
theholes,t
omi l
lcertainboardcontoursandtoproduce
multi
plepri
ntedpanel .Thehol esareusedtomountelectroniccomponent sontheboar dandto
provi
deaconduct ivecircuitf
rom onelayeroftheboardtoanot her.PCBDesignGuideSheet

 Thr
oughhol
epl
ati
ng

Fol
lowi
ngdril
li
ng, t
heboar disscr
ubbedtoremovefinecopperpart
icl
esl ef
tbythedri
l
l.After
bei
ngscrubbed,theboar discl
eanedandetchedtopromotegoodadhesi onandthenisplated
wit
hanadditi
onal l
ay erofcopper
.Sincet
heholesarenotconducti
ve,elect
rol
ysi
scopperpl at
ing
i
semployedtopr ovideat hi
nconti
nuousconduct
ivelay
eroverthesurfaceoftheboardand
thr
oughtheholes.

8
  Lay
erf
il
m

Formul
ti
lay
erboar
dsf
il
msmustbepr
oducedaccor
dingt
othenumberofl
ayer
s.

Powerful
soft
waretoolsgener
ateapl
otfi
l
e, whosedat
acontr
olaphotoplot
ter.Af
terdev
elopi
ng
thefi
l
ms, t
heyhavetobeinspect
edundertabl
elampforanytr
ackbreaks,l
ineshort
agesor
missi
ngofanytrack.

 Sol
derr
esi
stf
il
m

Inordertoensurenoshort
ingsi
nthePCBduet of
ormati
onofmoi st
ure,orduetospreadi
ngof
sol
derl eads,
thecomplet
eboardexceptt
hepadsaretobesol
deredmasked.Thi sisdonein
CADdesi gnt
oolsandt
hephotofi
l
mi sgener
atedi
nthephot
oplot
ter.Thenthephotofi
l
mi s
developed.

 Legendpr
int
ingf
il
m(opt
ional
)

Thi
sisdevel
opedi
nor
dertoensur
eeaseandfast
nessdur
ingsol
deri
ngofcomponent
s.Thi
sis
al
sodesi
gnedinCADsyst
em andt
hefi
lmisgenerat
edi
nthePohotoplot
or.t
hent
hephotofi
lm
i
sdevel
oped.

 Lami
nat
ing

Bythisprocesst
hedri
l
ledandplat
ed‐
throughboar
dsar
elami
nat
edbyr
oll
i
ngunderpr
essur
ea
photo‐r
esistl
ami
nat
eonbot hsi
desoftheboard.

 Exposi
ng

Afterpr
oper
lyal
igni
ngfi
lmsonthephot
oresi
stl
ami
nat
edboar
d,t
heboar
disexposedbyaUV
l
ightonbothsi
desintheUVexposur
eunit
.

 Spr
aydev
elopi
ng

Theex posedboar
disdev el
opedinaspr aydeveloperunit
.Thedevel
opersoluti
onissprayedon
bothsidesoftheboardbyaspr ayrotat
ingsystem.After
wardstherestofthenon‐exposed
l
ami nateisr
emovedbyar i
nsi
ngprocess,wher eastheexposedl
aminateisetchresist
antand
thusprotect
sthecir
cuitpatt
ernagainstetchi
ng

9
  Et
chi
ngpr
ocess

I
nt hatprocesstheUVnonexposedcopperiset
ched.Aft
erwardstheetchresi
stantmat
eri
al
overthetracks,
padsofPCBisr i
nsedbymeansofasol ventThepurposeofetchi
ngist
o
remov eunnecessar
ycoppertr
acesfrom t
hesubstr
ate.

Therearesever
aletchi
ngsolut
ionsavail
abl
e,al
lbasedondi
ff
erentt
ypesofchemical
sli
kef
err
ic
chlori
de,
ammoni um per
-sul
phate,
etc.Themostcommonlyusedarefer
ri
cchlor
ideor
hydrochl
ori
cacid.

Dur
ingt
hispr
ocess,
thePCBi
sputonachemi
cal
bowl
andcl
eanedupwi
thabr
ush.

 El
ect
rol
essCopperDeposi
ti
on(
Plat
ing)

10
I
nor
dert
omaket
het
hroughhol
esconduct
ivet
oel
ect
ri
cal
l
yconnectt
odi
ff
erent

l
ayer
soft
hePCB,
athi
nlay
erofcopperi
schemi
cal
l
ydeposi
tedi
ntot
het
hrough

hol
es.Thi
scopperwi
l
llat
erbet
hickenedt
hroughel
ect
rol
yti
ccopperpl
ati
ng.

 Sol
derMask

Thesol
dermaski
susual
l
ythegr
eencoat
ingonaPCBboar
d.Sol
dermaskusual
l
y

cov
ersev
ery
thi
ngont
hePCBboar
dexceptpadsandv
ias.Thepr
imar
ypur
poseof

t
hemaski
stor
est
ri
ctt
hear
east
hatwi
l
lbecov
eredwi
thsol
der
.Ital
sopr
otect
s

panel
sfr
om cont
ami
nat
ion,
handl
i
ngdamageandpossi
bleel
ect
ri
cal
shor
ti
ngdur
ing

assembl
yandi
nst
all
ati
on.

 Sur
facef
ini
sh

TheSur
faceFi
nishi
sthemosti
mpor
tantst
epi
nthepr
ocessbet
weenPCB

manuf
act
uri
ngandPCBassembl
ywi
tht
womai
nfunct
ions,
oneofwhi
chi
sto

pr
eser
vet
heexposedcopperci
rcui
tr
yandt
heot
herofwhi
chi
stopr
ovi
desol
der
abl
e

sur
facewhensol
der
ingcomponent
stot
hePCB.Sur
facef
ini
shi
slocat
edatt
he

out
ermostl
ayerofPCBandabov
ecopper
,pl
ayi
ngar
oleasa"
coat
"forcopper
.

Ther
ear
edi
ff
erentt
ypeofsur
facef
ini
sh,
eachonehasadi
ff
erentpur
pose

(
dependi
ngonwher
ethePCBhast
owor
kandassembl
ypr
ocessr
equi
rement
s)and

al
sohasadi
ff
erentappl
i
cat
ionmet
hod.Themostpopul
arar
e:ENI
G(El
ect
rol
ess

Ni
quel
Immer
sionGol
d),
OSP(
Organi
cSur
facePr
otect
ion)
,HASL(
HotAi
r

Lev
eli
ng)
,Immer
sionSi
l
verandI
mmer
sionTi
n.

 El
ect
ri
cal
test

Oneoft
hel
astst
epsoft
hePCBf
abr
icat
ionpr
ocessi
stoensur
ethePCBi
sfr
eeof

def
ect
sandmeett
heexpect
edqual
i
tyst
andar
ds.Nowaday
s,t
her
ear
emany

11
aut
omat
ict
est
ingequi
pment
sav
ail
abl
efort
hehi
ghv
olumet
est
ingoft
hePCBs.

PCBsar
etest
edf
oropensandshor
tsi
ntheci
rcui
tr
y.Thebasi
cofal
ltest
sincl
ude

acomput
erpr
ogr
am whi
chwi
l
linst
ructt
heel
ect
ri
cal
testuni
ttoappl
yasmal
l

v
olt
aget
oeachcont
actpoi
nt,
andv
eri
fyt
hatacer
tai
nvol
tageappear
satt
he

appr
opr
iat
econt
actpoi
nts.

 Concl
usi
on

Basedont
her
esul
tsoft
heact
ivi
ty,
thef
oll
owi
ngconcl
usi
onswer
emade:

1.Ferr
icchl
ori
de(
FeCl3)i
saneff
ecti
vechemical
compoundwheni
tcomest
oPCBet
chi
ng
becauseofit
scor
rosi
veandaci
dicpr
opert
ies.

2.Stacki
ngPCBsthatar
efaci
ngeachot
her
'scoppersi
demaycauseoxi
dat
ionr
esul
ti
ngi
na
darkercol
oroft
hecopper.

3.Thesemiconduct
orssuchast
heresi
storandLEDwer
esuccessf
ull
ysol
der
edont
hePCBand
ful
lyf
unct
ionalwit
htheuseofa9Vbatt
ery.

12