TB6559FG

TOSHIBA Bi-CD Integrated Circuit Silicon Monolithic

TB6559FG
Full-Bridge DC Motor Driver IC

The TB6559FG is a full-bridge DC motor driver with LDMOS

output transistors.
It uses P-channel MOSFETs on the high side and N-channel
MOSFETs on the low side, eliminating the need for a charge
pump. The TB6559FG achieves high thermal efficiency.
Four operating modes are selectable via IN1 and IN2: clockwise
(CW), counterclockwise (CCW), short brake and stop.

Features
Weight: 0.50 g (typ.)
• Power supply voltage: 50 V (max)
• Output current: 2.5 A (max)
• Low-ON resistance (upper and lower sum): 1.3 Ω (typ.)
• Constant-current or direct PWM
• Standby mode
• Clockwise (CW), counterclockwise (CCW), short brake and stop
• Overcurrent protection
• Thermal shutdown

1 2013-04-10
 TB6559FG

Block Diagram

VREG ALERT VCC

15 11 5

REG

Overcurrent Protection
Thermal Shutdown
IN1 1
7 OUT1

IN2 16
9 OUT2
Decoder
SB 2
Timing Logic

OSC/PWM 14 OSC/PWM

4/12/13 3 8 10
S-GND RSA P-GND
Vref

2 2013-04-10
 TB6559FG

Pin Functions

Pin No Pin Name Functional Description Remarks

1 IN1 Control signal input 1 Apply either a 0-V or 5-V signal.

2 SB Standby pin H: Start, L: Standby
0 to 3 V: constant-current control
3 Vref Supply voltage pin for current control
4.5 to 5.5 V: PWM control
4 S-GND Ground ―
5 VCC Power supply pin VCC (ope) = 10 to 30 V
6 (NC) No connection ―
7 OUT1 Output pin 1 Connect OUT1 to a motor coil pin.
Connection pin for an output current
8 RSA ―
detection resistor
9 OUT2 Output pin 2 Connect OUT2 to a motor coil pin.
10 P-GND Power ground ―
5 V: Protective operation
11 ALERT Protective operation alert output
0 V: Normal
12 S-GND Ground ―
13 S-GND Ground ―

Connection pin for an external Vref = 0 to 3 V: Connect a capacitor for oscillation

14 OSC/PWM
capacitor/PWM input Vref = 4.5 to 5.5 V : Input PWM signal
15 VREG 5-V output pin Connect a capacitor between VREG and S-GND.
16 IN2 Control signal input 2 Apply either a 0-V or 5-V signal.
Fin Fin Ground Connect Fin to S-GND

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Supply voltage VCC 50 V

IO (Peak) 2.5 (Note 1)
Output current A
IO (Ave) 1.0
Power dissipation PD 1.4 (Note 2) W
Operating temperature Topr −30 to 85 °C
Storage temperature Tstg −55 to 150 °C

Note 1: The absolute maximum ratings are the limits that must not be exceeded, even for an instant, under worst
possible conditions.

Note 2: Measured on a 60 mm × 30 mm × 1.6 mm PCB with a 50% dissipating copper surface.

Operating Ranges (Ta = 25°C)

Characteristics Symbol Rating Unit

Supply voltage VCC 10 to 30 V

PWM frequency fCLK up to 100 kHz
OSC frequency fOSC up to 500 kHz
VREG output current VREGout up to 1 mA

3 2013-04-10
 TB6559FG

Electrical Characteristics (VCC = 24 V, Ta = 25°C, unless otherwise specified)

Characteristics Symbol Test Condition Min Typ. Max Unit

ICC1 Stop mode ― 4 8

ICC2 CW and CCW modes ― 4 8
Supply current mA
ICC3 Short brake mode ― 4 8
ICC4 Standby mode ― 1 2
VINH ― 2 ― 5.5
Input voltage
VINL ― −0.2 ― 0.8
V
(Design target only. Not tested
Control circuit Hysteresis voltage VIN (HYS) ― 0.1 ―
in production.)
IINH VIN = 5 V ― 50 75
Input current μA
IINL VIN = 0 V ― ― 2
VPWMH ― 2 ― VREG
Input voltage
VPWML ― −0.2 ― 0.8
V
(Design target only. Not tested
Hysteresis voltage VPWM(HYS) ― 0.5 ―
in production.)
OSC/PWM input
IPWMH VPWM = 5 V ― 55 75
circuit Input current μA
IPWML VPWM = 0 V ― ― 2
PWM frequency fPWM Duty cycle = 50% ― ― 100 kHz
Minimum clock
tw(PWM) ― 2 ― ― μs
pulse width
VINSH ― 2 ― 5.5
Input voltage
VINSL ― −0.2 ― 0.8
V
(Design target only. Not tested
Standby circuit Hysteresis voltage VIN (HYS) ― 0.1 ―
in production.)
IINSH VIN = 5 V ― 50 75
Input current μA
IINSL VIN = 0 V ― ― 2
Constant current
VOSC 0 ― 3.0
control ― V
Vref input circuit
PWM control VPWM 4.5 ― 5.5
Input current Iref IIN = VREG ― 1 3 μA
IO = 0.2 A ― 1.3 1.8
Output ON-resistance Ron (U + L) Ω
IO = 1.5 A ― 1.3 1.8
IL (U) VCC = 30 V ― 0.1 10
Output leakage current μA
IL (L) VCC = 30 V ― 0.1 10
VF (U) IO = 1.5 A ― 1.3 1.7
Diode forward voltage V
VF (L) IO = 1.5 A ― 1.3 1.7
Internal reference voltage VREG VREGout = 1 mA 4.5 5 5.5 V
(Design target only. Not tested
Thermal shutdown temperature TSD ― 160 ― °C
in production.)
(Design target only. Not tested
Thermal shutdown hysteresis ΔTSD ― 40 ― °C
in production.)
VOSC/PWM = 1.5 V
Charge current IOSC(+) -1.05 ― -0.65
(source current)
OSC frequency mA
VOSC/PWM = 3.2 V
Discharge current IOSC(−) 3.8 ― 6.0
(sink current)
VREG
VALERT(H) IALERT = −1 mA ― ―
ALERT voltage −1 V
VALERT(L) IALERT = 1 mA ― ― 0.5

4 2013-04-10
 TB6559FG

Functional Descriptions
Control Input Pins
VREG

IN1, IN2, SB

100 kΩ

*The circuit diagram is simplified for description.

• The input voltage ranges of the IN1, IN2, OSC/PWM and SB inputs must be as follows. These inputs are
CMOS- and TTL-compatible, and have a hysteresis of 0.2 V (typ.).
VINH: 2 to 5.5 V
VINL: GND to 0.8 V
• The PWM input frequency should be 100 kHz or less.
• In Standby mode, all circuits are turned off, except the standby and 5-V circuits.
• To bring the device out of Standby mode, IN1 and IN2 must be set Low once (Stop mode); for an operating
mode must be selected after the power supply becomes stable.

OSC/PWM Input Pin

VREG
SW1

OSC/PWM

SW2

100 kΩ

*The circuit diagram is simplified for description.

Either constant-current or direct PWM is selectable according to the voltage of the Vref input (See the “Pin
Functions” table). SW1 and SW2 in the above diagram are controlled by the Vref voltage.

• Constant current PWM

For constant-current PWM, Vref must be between 0 V and 3 V (SW1: ON, SW2: OFF) and a capacitor must
be connected between OSC/PWM and ground.

• Direct PWM
For direct PWM, Vref must be between 4.5 V and 5.5 V (SW1: OFF, SW2: ON).
When a PWM signal with an amplitude between 0 V and 5 V is applied to the OSC/PWM input, the OUT1
and OUT2 levels change accordingly, resulting in an alternating sequence of CW/CCW and short brake.

5 2013-04-10
 TB6559FG
Input/Output Functions
Input Output
IO (100%)
Vref IN1 IN2 SB PWM/OSC OUT1 OUT2 Mode
(typ.)
H H H Capacitor ― L L Short brake
Constant-current
Vref chopping
6 ⋅ RSA L CCW
L H H Capacitor
L Short brake

Constant-current
OSC

0 to 3 V chopping
Vref
L CW
H L H Capacitor 6 ⋅ RSA
L Short brake

OFF
L L H Capacitor ― Stop
(Hi-Z)
OFF
X X L Capacitor ― Standby
(Hi-Z)
H
H H H L L Short brake
L
H L H CCW
L H H
L L L Short brake
H H L CW
PWM

4.5 to
H L H
5.5 V L L L Short brake
H OFF
L L H Stop
L (Hi-Z)
H OFF
X X L Standby
L (Hi-Z)

Note: X = Don’t care

6 2013-04-10
 TB6559FG
Output Operation
• Control mode selection
Either constant-current or direct PWM control can be selected by the Vref input voltage as follows:
Constant-current PWM control: Vref = 0 to 3 V
Direct PWM control: Vref = 4.5 to 5.5 V
The constant-current feature is disabled in direct PWM mode.

In either mode, the motor operating mode changes between CW/CCW and short brake alternately.
To eliminate shoot-through current that flows from supply to ground due to the simultaneous conduction of
high-side and low-side transistors in the bridge output, a dead time of 300 ns (design target only) is generated in
the IC when transistors switch from on to off, or vice versa.
The shoot-through protection permits a synchronous rectification PWM operation without controlling the dead
time externally. A dead time is also provided internally when the motor operation mode switches between CW
and CCW, and between CW (CCW) and short brake, thereby eliminating the need for external dead time
insertion.

VCC VCC VCC

OUT1 M OUT1 M OUT1 M

RSA RSA RSA

PWM ON PWM ON → OFF PWM OFF

t1 t2 = 300 ns (typ.) t3
VCC VCC

OUT1 M OUT1 M

RSA RSA

PWM OFF → ON PWM ON

t4 = 300 ns (typ.) t5

VCC
t5
Output voltage
t1
waveform t3
(OUT1)
GND
t4
t2

7 2013-04-10
 TB6559FG
Constant-Current Regulation
When the Vref voltage is kept constant, the constant current regulator keeps the output current constant by
using a peak current detection technique.

(1) Constant-current chopping

When VRSA reaches the reference voltage (Vref), the regulator enters Discharge mode.
After four cycles of CK, an internal clock generated by OSC, the regulator moves from Discharge mode
to Charge mode.

Coil current

Vref/6

VRSA

OSC

Internal clock

Vref/6
Coil current

VRSA Discharge Charge Discharge

GND

(2) Changing the predefined current (during deceleration)

When VRSA reaches the reference voltage (Vref/6), the regulator enters Discharge mode. Four CK
cycles later, the regulator exits Discharge mode and enters Charge mode. If VRSA > Vref/6 when it
enters Charge mode, however, it then reenters Discharge mode. Four CK cycles later, VRSA is again
compared against Vref/6. If VRSA < Vref/6, the regulator enters and remains in Charge mode until
VRSA reaches Vref/6.

OSC

Internal clock

Vref/6
VRSA

Discharge Discharge Charge

Charge
GND

8 2013-04-10
 TB6559FG
(3) Changing the predefined current (during acceleration)
Even when the reference voltage is increased, the regulator remains in Discharge mode for four CK
cycles and then it enters Charge mode.

OSC

Internal clock

Vref/6
Coil current

VRSA

Discharge Charge Discharge

GND

The average current value becomes lower than the set current value because of the peak current detection
method. It should be noted that the average current value changes, depending on the motor characteristics.

Calculation of the Internal Oscillation Frequency

The OSC oscillation frequency can be approximated by the following equation:
fOSC [Hz] = (0.445 × 10-3) / COSC [F]

Reference Voltage Generator

In constant-current mode, the peak current is determined by the Vref voltage, as follows:

IO = Vref/RSA × 1/6 [A]

VCC

Control circuit

OUT1 M OUT2

IO

Vref
1/6

RSA
IO

9 2013-04-10
 TB6559FG
Internal Constant-Voltage (5 V) Circuit

VCC

VCC

VREG

• The TB6559FG includes a 5-V power supply for control circuit biasing.
• For oscillation prevention, a capacitor should be connected between VREG and S-GND.
Although VRGE can be used to control the inputs to the TB6559FG, the maximum load current should be
limited to 1 mA.
• The TB6559FG has power monitoring circuitry that turns off the output when VREG falls below 6.0 V
(design target only). With a hysteresis of 0.3 V (design target only), the output is turned back on when
VREG reaches 6.3 V (design target only) again.

Output Circuit

VCC

OUT1
(OUT2)

RSA

• The TB6559FG uses P-channel MOS transistors on the high side and N-channel MOS transistors on the
low side.
• The output ON-resistance (Ron) is 1.3 Ω (high-side and low-side sum)
• The switching characteristics of the output transistors are shown below.

PWM input

tpLH
tpHL

90% 90%
Output voltage 50%
50%
(OUT1, OUT2)
10% 10%

tr tf

Switching Characteristics

Item Typical Value Unit

tpLH 750
tpHL 1000
tr 100 ns
tf 150
Dead time 700

10 2013-04-10
 TB6559FG
VCC Power Supply
• VCC supplies a voltage to the output circuit and the internal 5-V circuit.
• The operating voltage range is:
VCC (opr.) = 10 to 30 V
• IN1, IN2, and SB should be set Low at power-on. (In direct PWM mode, OSC/PWM should also be set
Low.)

GND Section
• The TB6559FG has two separate grounds: S-GND for the control circuitry and P-GND for the output
circuitry. S-GND and P-GND should be short-circuited at a location as close to the TB6559FG as possible.

ALERT Circuit
• When either the thermal shutdown or overcurrent protection circuit is activated, the ALERT output goes
High (CMOS output). When the ALERT pin is changed from low to high or vice versa, its output signal
may become unstable, causing chattering or noise pulses. To avoid such instability, it is recommended to
insert an RC filter to the output line.
Normal operation: Low
Protective operation: High

Thermal Shutdown (TSD) Circuit

The TB6559FG incorporates a thermal shutdown circuit. When the junction temperature (Tj) exceeds
160°C (typ.), the output transistors are turned off.
The output transistors are automatically turned on when the junction temperature cools past the shutdown
threshold, which is lowered by a hysteresis of 40°C.
The IC has 40°C of temperature hysteresis.
TSD = 160°C (design target only)
ΔTSD = 40°C (design target only)

<Thermal Shutdown>

160°C (typ.)
120°C (typ.)
Chip temperature
TSD

H
ALERT output
L

11 2013-04-10
 TB6559FG
Overcurrent Protection Circuit (ISD)

<Overcurrent Protection>

ILIM

Output current

0
OFF OFF
10 μs 50 μs 50 μs
(typ.) (typ.) (typ.)
Not detected
10 μs
(typ.)
H
ALERT output
L

The TB6559FG allows for the sensing of the current that flows through each output transistor.
The currents through each of the output transistors are continually monitored. In the event of an overcurrent
in at least one of the transistors, the overcurrent protection circuitry turns all transistors off.
The overcurrent protection circuitry incorporates a timer to measure 50 μs (typ.) after the transistors are
turned off. After 50 μs, the protection circuitry turns the output transistors back on again automatically. If the
overcurrent persists, the device begins cycling into and out of thermal shutdown. To prevent false detection due
to glitches, the overcurrent protection circuitry turns off the transistors only when the current exceeds the
shutdown threshold for 10 μs or longer.
The design target only for current limiting is 5 A (typ.) but has variations between 4.0 to 6.0 A.

12 2013-04-10
 TB6559FG

Typical Characteristics Graphs

TB6559FG TB6559FG

External Components

Symbol Use Recommended Value Remarks

C1 VREG oscillation prevention 0.1 μF to 1.0 μF ―

C2 Power noise absorption 0.001 μF to 1 μF ―
C3 Power noise absorption 50 μF to 100 μF ―

13 2013-04-10
 TB6559FG

Typical Application Examples

Note 4 Fuse
Direct-PWM Drive
C1 C2
5V Note 5 C3 24 V
11 15 5 Note 1
VDD ALERT VREG VCC
PWM 14 OSC/PWM

OUT1 7
PORT1 1 IN1
TB6559FG M
PORT2 16 IN2 9
OUT2
Note 2
PORT3 2 SB
GND Vref RSA S-GND P-GND
3 8 4/12/13 10

Microcontroller Note 3

5V

Constant-current PWM Drive

Note 4 Fuse

C1 C2
5V C3 24 V
Note 5
11 15 5 Note 1
VDD PORT1 1 IN1 ALERT VREG VCC

PORT2 16 IN2
OUT1 7

SB
TB6559FG M
PORT3 2
OUT2 9
PORT4 3 Vref Note 2
0 V to 3 V
GND OSC/PWM RSA S-GND P-GND
14 8 4/12/13 10

Microcontroller Note 3

Note 1: A bypass capacitor should be connected between VCC and P-GND and placed as close as possible to the
TB6559FG.

Note 2: When a capacitor is connected between the motor pins to reduce noise, a resistor should also be inserted to
limit the charge current. This capacitor causes the switching loss to increase for PWM control; therefore, this
capacitor should not be used, if possible.

Note 3: S-GND and P-GND should be short-circuited at a location as close to the TB6559FG as possible. (Same for
Fin)

Note 4: The capacitor C1 should be connected to S-GND.

Note 5: If there is chattering or noise in the output signal, connect an RC filter to ALERT.

14 2013-04-10
 TB6559FG

Usage Precautions
• Although the TB6559FG contains overcurrent detection circuitry, a large current might abruptly flow through
the IC in case of a short-circuit to power supply, a short-circuit to ground or a short-circuit across the load,
damaging the device permanently. This possibility should be fully considered in the design of the output, VCC
and ground lines. If the device is damaged, a large current might continually flow through the device as a
secondary effect. Therefore, Toshiba recommends that a fuse be connected to the power supply line.
• Install this IC properly. If not, (e.g., installing it in the wrong position), the IC might be broken.
• If external components are shorted together, the IC might be broken.

15 2013-04-10
 TB6559FG

Package Dimensions

Weight: 0.50 g (typ.)

16 2013-04-10
 TB6559FG

Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.

2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.

3. Timing Charts
Timing charts may be simplified for explanatory purposes.

4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.

5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.

IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.

(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.

(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.

(4) Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.

17 2013-04-10
 TB6559FG
Points to Remember on Handling of ICs
(1) Over Current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs
under all circumstances. If the Over current protection circuits operate against the over current, clear
the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before operation.
In addition, depending on the method of use and usage conditions, if over current continues to flow for
a long time after operation, the IC may generate heat resulting in breakdown.

(2) Thermal Shutdown Circuit

Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.

(3) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time
and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.

(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow
back to the motor’s power supply due to the effect of back-EMF. If the current sink capability
of the power supply is small, the device’s motor power supply and output pins might be
exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the
effect of back-EMF into consideration in system design.

18 2013-04-10
 TB6559FG

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

19 2013-04-10