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cgp30

The document provides specifications for the CGP30 and DGP30 glass passivated plastic rectifiers, highlighting their features such as low forward voltage drop, high surge capability, and typical applications in power supplies and clamping circuits. It includes detailed electrical characteristics, maximum ratings, and thermal properties, along with ordering information and package dimensions. Additionally, it contains a legal disclaimer regarding product suitability and liability.

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md wasim
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0% found this document useful (0 votes)
2 views

cgp30

The document provides specifications for the CGP30 and DGP30 glass passivated plastic rectifiers, highlighting their features such as low forward voltage drop, high surge capability, and typical applications in power supplies and clamping circuits. It includes detailed electrical characteristics, maximum ratings, and thermal properties, along with ordering information and package dimensions. Additionally, it contains a legal disclaimer regarding product suitability and liability.

Uploaded by

md wasim
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Not for New Designs

CGP30, DGP30
www.vishay.com
Vishay General Semiconductor
Clamper/Damper Glass Passivated Plastic Rectifier
FEATURES
• Superectifier structure
• Cavity-free glass passivated junction
SUPERECTIFIER® • Low forward voltage drop
• Typical IR less than 0.1 μA
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DO-201AD
TYPICAL APPLICATIONS
For use in high voltage rectification of power supplies,
inverters, converters and freewheeling diodes specially
PRIMARY CHARACTERISTICS designed for clamping circuits, horizontal deflection
IF(AV) 3.0 A systems, and damper applications.
VRRM 1400 V, 1500 V
IFSM 100 A MECHANICAL DATA
IR 5.0 μA Case: DO-201AD, molded epoxy over glass body
VF 1.2 V Molding compound meets UL 94 V-0 flammability rating
TJ max. 175 °C Base P/N-E3 - RoHS-compliant, commercial grade
Package DO-201AD Terminals: matte tin plated leads, solderable per
Circuit configuration Single
J-STD-002 and JESD 22-B102
E3 suffix meets JESD 201 class 1A whisker test
Polarity: color band denotes cathode end

MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)


PARAMETER SYMBOL CGP30 DGP30 UNIT
Maximum repetitive peak reverse voltage VRRM 1400 1500 V
Maximum RMS voltage VRMS 980 1050 V
Maximum DC blocking voltage VDC 1400 1500 V
Maximum average forward rectified current
IF(AV) 3.0 A
0.375" (9.5 mm) lead lengths at TA = 50 °C
Peak forward surge current 8.3 ms single half
IFSM 100 A
sine-wave superimposed on rated load
Maximum full load reverse current, full cycle average
IR(AV) 200 μA
0.375" (9.5 mm) lead length at TA = 70 °C
Operating junction and storage temperature range TJ, TSTG -65 to +175 °C

Revision: 06-Oct-2021 1 Document Number: 88569


For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not for New Designs
CGP30, DGP30
www.vishay.com
Vishay General Semiconductor

ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)


PARAMETER TEST CONDITIONS SYMBOL CGP30 DGP30 UNIT
Maximum instantaneous
IF = 3.0 A VF (1) 1.2 V
forward voltage
TA = 25 °C 5.0
Maximum reverse current Rated VR IR μA
TA = 100 °C 100
Maximum reverse recovery time IF = 0.5 A, IR = 50 mA trr 15 20 μs
IF = 0.5 A, IR = 1.0 A, Typical 1.0
Reverse recovery time trr μs
Irr = 0.25 A Maximum 2.0
Typical junction capacitance 4.0 V, 1 MHz CJ 40 pF
Note
(1) Pulse test: 300 μs pulse width, 1 % duty cycle

THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)


PARAMETER SYMBOL CGP30 DGP30 UNIT
Typical thermal resistance RθJA (1) 20 °C/W
Note
(1)
Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, with leads attached to heat sink

ORDERING INFORMATION (Example)


PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
CGP30-E3/54 1.28 54 1400 13" diameter paper tape and reel
CGP30-E3/73 1.28 73 1000 Ammo pack packaging

Revision: 06-Oct-2021 2 Document Number: 88569


For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not for New Designs
CGP30, DGP30
www.vishay.com
Vishay General Semiconductor
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)

4.0 10
Average Forward Rectified Current (A)

Instantaneous Reverse Current (μA)


TJ = 100 °C

3.0
1

2.0

0.1
1.0
60 Hz
Resistive or Inductive Load TJ = 25 °C
0.375" (9.5 mm) Lead Length
0 0.01
0 25 50 75 100 125 150 175 0 20 40 60 80 100
Ambient Temperature (°C) Percent of Rated Peak Reverse Voltage (%)

Fig. 1 - Forward Current Derating Curve Fig. 4 - Typical Reverse Characteristics

1000 100
TA = 50 °C TJ = 25 °C
8.3 ms Single Half Sine-Wave f = 1.0 MHz
Peak Forward Surge Current (A)

(JEDEC Method) Vsig = 50 mVp-p


Junction Capacitance (pF)

100

10 10
1 10 100 1 10 100
Number of Cycles at 60 Hz Reverse Voltage (V)

Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current Fig. 5 - Typical Junction Capacitance

100
Instantaneous Forward Current (A)

10

0.1
TJ = 25 °C
Pulse Width = 300 μs
1 % Duty Cycle
0.01
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Instantaneous Forward Voltage (V)

Fig. 3 - Typical Instantaneous Forward Characteristics

Revision: 06-Oct-2021 3 Document Number: 88569


For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not for New Designs
CGP30, DGP30
www.vishay.com
Vishay General Semiconductor
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

DO-201AD

1.0 (25.4)
MIN.

0.210 (5.3)
0.190 (4.8)
DIA.

0.375 (9.5)
0.285 (7.2)

1.0 (25.4)
MIN.
0.052 (1.32)
0.048 (1.22)
DIA.

Revision: 06-Oct-2021 4 Document Number: 88569


For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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© 2025 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED

Revision: 01-Jan-2025 1 Document Number: 91000

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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