STM32MP151C/F

Arm® Cortex®-A7 800 MHz + Cortex®-M4 MPU,

TFT, 35 comm. interfaces, 25 timers, adv. analog, crypto
Datasheet - production data

Features TFBGA
LFBGA

Includes ST state-of-the-art patented

technology LFBGA448 (18 × 18mm) TFBGA361 (12 × 12 mm)
LFBGA354 (16 × 16mm) TFBGA257 (10 × 10 mm)
Pitch 0.8mm min Pitch 0.5mm
Core
• Internal temperature sensors
• 32-bit Arm® Cortex®-A7
• Low-power modes: Sleep, Stop and Standby
– L1 32-Kbyte I / 32-Kbyte D
– 256-Kbyte unified level 2 cache • DDR memory retention in Standby mode
– Arm® NEON™ and Arm® TrustZone® • Controls for PMIC companion chip
® ®
• 32-bit Arm Cortex -M4 with FPU/MPU
Low-power consumption
– Up to 209 MHz (Up to 703 CoreMark®)
• Total current consumption down to 2 µA
Memories (Standby mode, no RTC, no LSE, no
BKPSRAM, no RETRAM)
• External DDR memory up to 1 Gbyte
– up to LPDDR2/LPDDR3-1066 16/32-bit Clock management
– up to DDR3/DDR3L-1066 16/32-bit
• Internal oscillators: 64 MHz HSI oscillator,
• 708 Kbytes of internal SRAM: 256 Kbytes of 4 MHz CSI oscillator, 32 kHz LSI oscillator
AXI SYSRAM + 384 Kbytes of AHB SRAM +
• External oscillators: 8-48 MHz HSE oscillator,
64 Kbytes of AHB SRAM in Backup domain
32.768 kHz LSE oscillator
and 4 Kbytes of SRAM in Backup domain
• 5 × PLLs with fractional mode
• Dual mode Quad-SPI memory interface
• Flexible external memory controller with up to General-purpose input/outputs
16-bit data bus: parallel interface to connect
• Up to 176 I/O ports with interrupt capability
external ICs and SLC NAND memories with up
to 8-bit ECC – Up to 8 secure I/Os
– Up to 6 Wakeup, 3 tampers, 1 active
Security/safety tamper
• Secure boot, TrustZone® peripherals, active
Interconnect matrix
tamper
• 2 bus matrices
• Cortex®-M4 resources isolation
– 64-bit Arm® AMBA® AXI interconnect, up to
Reset and power management 266 MHz
– 32-bit Arm® AMBA® AHB interconnect, up
• 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
to 209 MHz
• POR, PDR, PVD and BOR
• On-chip LDOs (RETRAM, BKPSRAM, USB 3 DMA controllers to unload the CPU
1.8 V, 1.1 V) • 48 physical channels in total
• Backup regulator (~0.9 V)

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This is information on a product in full production. www.st.com
 STM32MP151C/F

• 1 × high-speed general-purpose master direct Up to 25 timers and 3 watchdogs

memory access controller (MDMA)
• 2 × 32-bit timers with up to 4 IC/OC/PWM or
• 2 × dual-port DMAs with FIFO and request pulse counter and quadrature (incremental)
router capabilities for optimal peripheral encoder input
management
• 2 × 16-bit advanced motor control timers
Up to 35 communication peripherals • 10 × 16-bit general-purpose timers (including 2
basic timers without PWM)
• 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
• 5 × 16-bit low-power timers
• 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816
interface, LIN, IrDA, SPI slave) • RTC with sub-second accuracy and hardware
calendar
• 6 × SPI (50 Mbit/s, including 3 with full duplex
I2S audio class accuracy via internal audio PLL • 4 Cortex®-A7 system timers (secure, non-
or external clock) secure, virtual, hypervisor)
• 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx) • 1 × SysTick M4 timer
• SPDIF Rx with 4 inputs • 3 × watchdogs (2 × independent and window)
• HDMI-CEC interface Hardware acceleration
• MDIO Slave interface
• AES 128, 192, 256, TDES
• 3 × SDMMC up to 8-bit (SD / e•MMC™ / SDIO)
• HASH (MD5, SHA-1, SHA224, SHA256),
• 2 × USB 2.0 high-speed Host HMAC
+ 1 × USB 2.0 full-speed OTG simultaneously
• 2 × true random number generator
– or 1 × USB 2.0 high-speed Host (3 oscillators each)
+ 1 × USB 2.0 high-speed OTG
simultaneously • 2 × CRC calculation unit

• 10/100M or Gigabit Ethernet GMAC Debug mode

– IEEE 1588v2 hardware,
• Arm® CoreSight™ trace and debug: SWD and
MII/RMII/GMII/RGMII
JTAG interfaces
• 8- to 14-bit camera interface up to 140 Mbyte/s
• 8-Kbyte embedded trace buffer
6 analog peripherals
3072-bit fuses including 96-bit unique ID,
• 2 × ADCs with 16-bit max. resolution (12 bits up to 1184-bit available for user
up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up
to 3.6 Msps) All packages are ECOPACK2 compliant
• 1 × temperature sensor
• 2 × 12-bit D/A converters (1 MHz)
• 1 × digital filters for sigma delta modulator
(DFSDM) with 8 channels/6 filters
• Internal or external ADC/DAC reference VREF+

Graphics
• LCD-TFT controller, up to 24-bit // RGB888
– up to WXGA (1366 × 768) @60 fps or up to
Full HD (1920 × 1080) @30 fps
– Pixel clock up to 90 MHz
– Two layers with programmable colour LUT

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Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1 Arm® Cortex®-A7 subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2 Arm® Cortex®-M4 with FPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.3 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.3.1 External SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.3.2 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4 DDR3/DDR3L/LPDDR2/LPDDR3 controller (DDRCTRL) . . . . . . . . . . . . 24
3.5 TrustZone address space controller for DDR (TZC) . . . . . . . . . . . . . . . . 25
3.6 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.7 Power supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.7.1 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.7.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.8 Low-power strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.9 Reset and clock controller (RCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.9.1 Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.9.2 System reset sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.10 Hardware semaphore (HSEM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.11 Inter-processor communication controller (IPCC) . . . . . . . . . . . . . . . . . . 31
3.11.1 IPCC main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.12 General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.13 TrustZone protection controller (ETZPC) . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.14 Bus-interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.15 DMA controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.16 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . . 35
3.17 Extended interrupt and event controller (EXTI) . . . . . . . . . . . . . . . . . . . . 35
3.18 Cyclic redundancy check calculation unit (CRC1, CRC2) . . . . . . . . . . . . 36

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3.19 Flexible memory controller (FMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

3.20 Dual Quad-SPI memory interface (QUADSPI) . . . . . . . . . . . . . . . . . . . . . 36
3.21 Analog-to-digital converters (ADCs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.22 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.23 Digital temperature sensor (DTS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.24 VBAT operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.25 Digital-to-analog converters (DAC1, DAC2) . . . . . . . . . . . . . . . . . . . . . . . 38
3.26 Voltage reference buffer (VREFBUF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.27 Digital filter for sigma delta modulators (DFSDM1) . . . . . . . . . . . . . . . . . 39
3.28 Digital camera interface (DCMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
3.29 LCD-TFT display controller (LTDC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
3.30 True random number generator (RNG1, RNG2) . . . . . . . . . . . . . . . . . . . 41
3.31 Cryptographic and hash processors (CRYP1, CRYP2 and
HASH1, HASH2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.32 Boot and security and OTP control (BSEC) . . . . . . . . . . . . . . . . . . . . . . . 42
3.33 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.33.1 Advanced-control timers (TIM1, TIM8) . . . . . . . . . . . . . . . . . . . . . . . . . 44
3.33.2 General-purpose timers (TIM2, TIM3, TIM4, TIM5, TIM12, TIM13,
TIM14, TIM15, TIM16, TIM17) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
3.33.3 Basic timers TIM6 and TIM7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.33.4 Low-power timer (LPTIM1, LPTIM2, LPTIM3, LPTIM4, LPTIM5) . . . . . 45
3.33.5 Independent watchdog (IWDG1, IWDG2) . . . . . . . . . . . . . . . . . . . . . . . 45
3.33.6 System window watchdog (WWDG1) . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.33.7 SysTick timer (Cortex-M4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.33.8 Generic timers (Cortex-A7 CNT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.34 System timer generation (STGEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.35 Real-time clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.36 Tamper and backup registers (TAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
3.37 Inter-integrated circuit interface (I2C1, I2C2, I2C3, I2C4, I2C5, I2C6) . . . 49
3.38 Universal synchronous asynchronous receiver transmitter
(USART1, USART2, USART3, USART6 and UART4, UART5,
UART7, UART8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.39 Serial peripheral interface (SPI1, SPI2, SPI3, SPI4, SPI5,
SPI6)– inter- integrated sound interfaces (I2S1, I2S2, I2S3) . . . . . . . . . . 50
3.40 Serial audio interfaces (SAI1, SAI2, SAI3, SAI4) . . . . . . . . . . . . . . . . . . . 51
3.41 SPDIF receiver interface (SPDIFRX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

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3.42 Management data input/output (MDIOS) . . . . . . . . . . . . . . . . . . . . . . . . . 52

3.43 Secure digital input/output MultiMediaCard interface
(SDMMC1, SDMMC2, SDMMC3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
3.44 Universal serial bus high-speed host (USBH) . . . . . . . . . . . . . . . . . . . . . 52
3.45 USB on-the-go high-speed (OTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.46 Gigabit Ethernet MAC interface (ETH1) . . . . . . . . . . . . . . . . . . . . . . . . . . 54
3.47 High-definition multimedia interface (HDMI) – Consumer
electronics control (CEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.48 Debug infrastructure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

4 Pinouts, pin description and alternate functions . . . . . . . . . . . . . . . . . 56

5 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

6.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119
6.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
6.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
6.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
6.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
6.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
6.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
6.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . 121
6.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
6.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.3.2 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . 125
6.3.3 Embedded reset and power control block characteristics . . . . . . . . . . 127
6.3.4 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
6.3.5 Embedded regulators characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 130
6.3.6 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
6.3.7 Wakeup time from low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . 141
6.3.8 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 143
6.3.9 External clock source security characteristics . . . . . . . . . . . . . . . . . . . 149
6.3.10 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 149
6.3.11 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
6.3.12 PLL spread spectrum clock generation (SSCG) characteristics . . . . . 154

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6.3.13 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156

6.3.14 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
6.3.15 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 159
6.3.16 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
6.3.17 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
6.3.18 NRST and NRST_CORE pin characteristics . . . . . . . . . . . . . . . . . . . . 169
6.3.19 FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
6.3.20 QUADSPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
6.3.21 Delay block (DLYB) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
6.3.22 16-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
6.3.23 DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
6.3.24 Voltage reference buffer characteristics . . . . . . . . . . . . . . . . . . . . . . . 201
6.3.25 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
6.3.26 DTS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
6.3.27 VBAT ADC monitoring characteristics and charging characteristics . . 204
6.3.28 Temperature and VBAT monitoring characteristics for
tamper detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
6.3.29 VDDCORE monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 205
6.3.30 Voltage booster for analog switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
6.3.31 Compensation cell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
6.3.32 Digital filter for sigma-delta modulators (DFSDM) characteristics . . . . 205
6.3.33 Camera interface (DCMI) characteristics . . . . . . . . . . . . . . . . . . . . . . . 208
6.3.34 LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 209
6.3.35 Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
6.3.36 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
6.3.37 USART interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
6.3.38 USB High-Speed PHY characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 230
6.3.39 JTAG/SWD interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 231

7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234

7.1 TFBGA257 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
7.2 LFBGA354 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
7.3 TFBA361 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241
7.4 LFBGA448 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
7.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248
7.5.1 Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249

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8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250

9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251

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List of tables STM32MP151C/F

List of tables

Table 1. STM32MP151C/F features and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 2. Boot modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 3. System versus domain power mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 4. Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 5. USART features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 6. Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 7. STM32MP151C/F pin and ball definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 8. Alternate function AF0 to AF7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 9. Alternate function AF8 to AF15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Table 10. Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Table 11. Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Table 12. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Table 13. General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Table 14. Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Table 15. Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 127
Table 16. Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Table 17. Embedded reference voltage calibration value. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Table 18. REG1V1 embedded regulator (USB_PHY) characteristics . . . . . . . . . . . . . . . . . . . . . . . 130
Table 19. REG1V8 embedded regulator (USB) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Table 20. Current consumption (IDDCORE) in Run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Table 21. Current consumption (IDD) in Run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
Table 22. Current consumption in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
Table 23. Current consumption in LPLV-Stop mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Table 24. Current consumption in Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Table 25. Current consumption in VBAT mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
Table 26. Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Table 27. Wakeup time using USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Table 28. High-speed external user clock characteristics
(digital bypass) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
Table 29. High-speed external user clock characteristics
(analog bypass) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
Table 30. Low-speed external user clock characteristics
(analog bypass) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
Table 31. Low-speed external user clock characteristics (digital bypass) . . . . . . . . . . . . . . . . . . . . 145
Table 32. 8-48 MHz HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
Table 33. Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
Table 34. High-speed external user clock security system (HSE CSS) . . . . . . . . . . . . . . . . . . . . . . 149
Table 35. HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
Table 36. CSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
Table 37. LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
Table 38. PLL1_1600, PLL2_1600 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Table 39. PLL3_800, PLL4_800 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
Table 40. USB_PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
Table 41. SSCG parameters constraint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
Table 42. OTP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
Table 43. DC specifications – DDR3 or DDR3L mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
Table 44. DC specifications – LPDDR2 or LPDDR3 mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
Table 45. EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158

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Table 46. EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

Table 47. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
Table 48. Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Table 49. I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Table 50. I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
Table 51. Output voltage characteristics for all I/Os except PC13, PC14, PC15 and PI8 . . . . . . . . 163
Table 52. Output voltage characteristics for PC13, PC14, PC15 and PI8 . . . . . . . . . . . . . . . . . . . . 164
Table 53. Output timing characteristics (HSLV OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
Table 54. Output timing characteristics (HSLV ON, _h IO structure) . . . . . . . . . . . . . . . . . . . . . . . . 167
Table 55. Output timing characteristics (HSLV ON, _vh IO structure) . . . . . . . . . . . . . . . . . . . . . . . 168
Table 56. NRST and NRST_CORE pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
Table 57. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . 172
Table 58. Asynchronous non-multiplexed SRAM/PSRAM/NOR read - NWAIT timings . . . . . . . . . . 172
Table 59. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . 173
Table 60. Asynchronous non-multiplexed SRAM/PSRAM/NOR write - NWAIT timings. . . . . . . . . . 174
Table 61. Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . 175
Table 62. Asynchronous multiplexed PSRAM/NOR read-NWAIT timings . . . . . . . . . . . . . . . . . . . . 175
Table 63. Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 177
Table 64. Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . 177
Table 65. Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
Table 66. Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Table 67. Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 182
Table 68. Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
Table 69. Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
Table 70. Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 187
Table 71. QUADSPI characteristics in SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
Table 72. QUADSPI characteristics in DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
Table 73. Dynamics characteristics: Delay block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
Table 74. ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
Table 75. Minimum sampling time versus RAIN with 47 pF PCB capacitor
up to 125 °C and VDDA = 1.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
Table 76. ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
Table 77. Minimum delay for interleaved conversion versus resolution . . . . . . . . . . . . . . . . . . . . . . 195
Table 78. DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
Table 79. DAC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
Table 80. VREFBUF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
Table 81. Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
Table 82. Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
Table 83. DTS characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
Table 84. VBAT ADC monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
Table 85. VBAT charging characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
Table 86. Temperature and VBAT monitoring characteristics for temper detection . . . . . . . . . . . . . 204
Table 87. VDDCORE monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
Table 88. Voltage booster for analog switch characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
Table 89. Compensation cell characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
Table 90. DFSDM measured timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206
Table 91. DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Table 92. LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
Table 93. TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
Table 94. LPTIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
Table 95. Minimum i2c_ker_ck frequency in all I2C modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
Table 96. I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212

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List of tables STM32MP151C/F

Table 97. I2C FM+ pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213

Table 98. SPI dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
Table 99. I2S dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
Table 100. SAI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
Table 101. MDIOS timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
Table 102. Dynamic characteristics: SD / MMC / e•MMC characteristics,
VDD = 2.7 V to 3.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
Table 103. Dynamic characteristics: SD / MMC / e•MMC characteristics
VDD = 1.71 V to 1.9 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
Table 104. USB OTG_FS electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Table 105. Dynamics characteristics: Ethernet MAC timings for MDIO/SMA. . . . . . . . . . . . . . . . . . . 225
Table 106. Dynamics characteristics: Ethernet MAC timings for RMII . . . . . . . . . . . . . . . . . . . . . . . . 225
Table 107. Dynamics characteristics: Ethernet MAC timings for MII . . . . . . . . . . . . . . . . . . . . . . . . . 226
Table 108. Dynamics characteristics: Ethernet MAC signals for GMII . . . . . . . . . . . . . . . . . . . . . . . 227
Table 109. Dynamics characteristics: Ethernet MAC signals for RGMII . . . . . . . . . . . . . . . . . . . . . . 228
Table 110. USART characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Table 111. USB High-Speed PHY characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
Table 112. Dynamics characteristics: JTAG characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232
Table 113. Dynamics characteristics: SWD characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232
Table 114. TFBGA257 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235
Table 115. TFBGA257 - Recommended PCB design rules (0.5/0.65 mm pitch, BGA) . . . . . . . . . . . 236
Table 116. LFBGA354 - Mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
Table 117. LFBGA354 - Recommended PCB design rules (0.8 mm pitch, BGA) . . . . . . . . . . . . . . . 240
Table 118. TFBGA361 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242
Table 119. TFBGA361 - Recommended PCB design rules (0.5/0.65 mm pitch BGA) . . . . . . . . . . . . 243
Table 120. LFBGA448 - Mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
Table 121. LFBGA448 - Recommended PCB design rules (0.8 mm pitch, BGA) . . . . . . . . . . . . . . . 246
Table 122. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248
Table 123. STM32MP151C/F ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
Table 124. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251

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List of figures

Figure 1. STM32MP151C/F block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 2. Power-up/down sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 3. STM32MP151C/F bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 4. Voltage reference buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 5. STM32MP151C/FADxx TFBGA257 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Figure 6. STM32MP151C/FABxx LFBGA354 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 7. STM32MP151C/FACxx TFBGA361 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 8. STM32MP151C/FAAxx LFBGA448 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Figure 9. Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Figure 10. Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Figure 11. Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Figure 12. Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Figure 13. VDDCORE rise time from reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Figure 14. VDDCORE rise time from LPLV-Stop. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Figure 15. High-speed external clock source AC timing diagram (digital bypass) . . . . . . . . . . . . . . . 143
Figure 16. High-speed external clock source AC timing diagram (analog bypass) . . . . . . . . . . . . . . 144
Figure 17. Low-speed external clock source AC timing diagram (analog bypass) . . . . . . . . . . . . . . 145
Figure 18. Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
Figure 19. Typical application with a 24 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
Figure 20. Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
Figure 21. PLL output clock waveforms in center spread mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
Figure 22. PLL output clock waveforms in down spread mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
Figure 23. VIL/VIH for FT I/Os . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
Figure 24. Recommended NRST and NRST_CORE pin protection . . . . . . . . . . . . . . . . . . . . . . . . . 170
Figure 25. Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . 171
Figure 26. Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . 173
Figure 27. Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . 174
Figure 28. Asynchronous multiplexed PSRAM/NOR write waveforms . . . . . . . . . . . . . . . . . . . . . . . 176
Figure 29. Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
Figure 30. Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
Figure 31. Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 182
Figure 32. Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
Figure 33. NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
Figure 34. NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
Figure 35. NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 186
Figure 36. NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 186
Figure 37. QUADSPI timing diagram - SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
Figure 38. QUADSPI timing diagram - DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
Figure 39. ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
Figure 40. Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
Figure 41. 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
Figure 42. Channel transceiver timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
Figure 43. DCMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Figure 44. LCD-TFT horizontal timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
Figure 45. LCD-TFT vertical timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
Figure 46. SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
Figure 47. SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
Figure 48. SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216

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12
List of figures STM32MP151C/F

Figure 49. I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218

Figure 50. I2S master timing diagram (Philips protocol)(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
Figure 51. SAI master timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
Figure 52. SAI slave timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
Figure 53. MDIOS timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
Figure 54. SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
Figure 55. SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
Figure 56. DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Figure 57. Ethernet MDIO/SMA timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
Figure 58. Ethernet RMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
Figure 59. Ethernet MII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
Figure 60. Ethernet GMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
Figure 61. Ethernet RGMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
Figure 62. USART timing diagram in master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
Figure 63. USART timing diagram in slave mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
Figure 64. JTAG timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Figure 65. SWD timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Figure 66. TFBGA257 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
Figure 67. TFBGA257 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
Figure 68. TFBGA257 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
Figure 69. LFBGA354 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
Figure 70. LFBGA354 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239
Figure 71. LFBGA354 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240
Figure 72. TFBGA361 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241
Figure 73. TFBGA361 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243
Figure 74. TFBGA361 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
Figure 75. LFBGA448 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
Figure 76. LFBGA448 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246
Figure 77. LFBGA448 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247

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STM32MP151C/F Introduction

1 Introduction

This datasheet provides the ordering information and mechanical device characteristics of
the STM32MP151C/F microprocessors.
This document should be read in conjunction with the STM32MP151 reference manual
(RM0441), available from the STMicroelectronics website www.st.com.
For information on the Arm®(a) Cortex®-A7 and Cortex®-M4 cores, refer to the Cortex®-A7
and Cortex®-M4 Technical Reference Manuals.
For information on the device errata with respect to the datasheet and reference manual,
refer to the STM32MP151C/F errata sheet (ES0438), available on the STMicroelectronics
website www.st.com.

a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

DS12501 Rev 6 13/255

55
Description STM32MP151C/F

2 Description

The STM32MP151C/F devices are based on the high-performance Arm® Cortex®-A7 32-bit
RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1
instruction cache, a 32-Kbyte L1 data cache and a 256-Kbyte level2 cache. The Cortex-A7
processor is a very energy-efficient application processor designed to provide rich
performance in high-end wearables, and other low-power embedded and consumer
applications. It provides up to 20% more single thread performance than the Cortex-A5 and
provides similar performance than the Cortex-A9.
The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-
A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4
AXI bus interface.
The STM32MP151C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up
to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision
which supports Arm® single-precision data-processing instructions and data types. The
Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU)
which enhances application security.
The STM32MP151C/F devices provide an external SDRAM interface supporting external
memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L
up to 533 MHz.
The STM32MP151C/F devices incorporate high-speed embedded memories with
708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes
each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in
backup domain), as well as an extensive range of enhanced I/Os and peripherals connected
to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI
interconnect supporting internal and external memories access.

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STM32MP151C/F Description

All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit
timers, two PWM timers for motor control, five low-power timers, a true random number
generator (RNG), and a cryptographic acceleration cell. The devices support six digital
filters for external sigma delta modulators (DFSDM). They also feature standard and
advanced communication interfaces.
• Standard peripherals
– Six I2Cs
– Four USARTs and four UARTs
– Six SPIs, three I2Ss full-duplex master/slave. To achieve audio class accuracy, the
I2S peripherals can be clocked via a dedicated internal audio PLL or via an
external clock to allow synchronization.
– Four SAI serial audio interfaces
– One SPDIF Rx interface
– Management data input/output slave (MDIOS)
– Three SDMMC interfaces
– An USB high-speed Host with two ports two high-speed PHYs and a USB OTG
high-speed with full-speed PHY or high-speed PHY shared with second port of
USB Host.
– A Gigabit Ethernet interface
– HDMI-CEC
• Advanced peripherals including
– A flexible memory control (FMC) interface
– A Quad-SPI Flash memory interface
– A camera interface for CMOS sensors
– An LCD-TFT display controller
Refer to Table 1: STM32MP151C/F features and peripheral counts for the list of peripherals
available on each part number.
A comprehensive set of power-saving mode allows the design of low-power applications.
The STM32MP151C/F devices are proposed in 4 packages ranging from 257 to 448 balls
with pitch 0.5 mm to 0.8 mm. The set of included peripherals changes with the device
chosen.
These features make the STM32MP151C/F suitable for a wide range of consumer,
industrial, white goods and medical applications.
shows the general block diagram of the device family.

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55
Description STM32MP151C/F

Table 1. STM32MP151C/F features and peripheral counts

STM32MP151CADxx

STM32MP151CABxx

STM32MP151CACxx

STM32MP151CAAxx
STM32MP151FADxx

STM32MP151FABxx

STM32MP151FACxx

STM32MP151FAAxx

Miscellaneous
Features

TFBGA257 LFBGA354 TFBGA361 LFBGA448

Body size (mm) 10x10 16x16 12x12 18x18

Pitch (mm) 0.5(1) 0.8 0.5(1) 0.8
Package Ball size (mm) 0.30 0.40 0.30 0.40 -
Thickness (mm) <1.2 <1.4 <1.2 <1.4
Ball count 257 354 361 448
CPU Cortex-A7 FPU Neon TrustZone
32-Kbyte L1 data cache
Caches size 32-Kbyte L1 instruction cache
-
256-Kbyte level 2 unified coherent cache
STM32MP151C: 650 MHz
Frequency
STM32MP151F: 800 MHz
MCU core Cortex-M4 FPU
-
Frequency 209 MHz
ROM 128 Kbytes (secure) -
CPU system 256 Kbytes (securable)

708 Kbytes
MCU subsystem 384 Kbytes
Embedded SRAM
MCU retention 64 Kbytes
Backup 4 Kbytes (securable, tamper protected)
16-bit 533 MHz Up to 1 Gbyte, single rank
(securable)

LPDDR2/3
SDRAM

32-bit 533 MHz - -

-
16-bit 533 MHz Up to 1 Gbyte, single rank
DDR3/3L
32-bit 533 MHz - -
Backup registers 128 bytes (32x32-bit, securable, tamper protected) -

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STM32MP151C/F Description

Table 1. STM32MP151C/F features and peripheral counts (continued)

STM32MP151CADxx

STM32MP151CABxx

STM32MP151CACxx

STM32MP151CAAxx
STM32MP151FADxx

STM32MP151FABxx

STM32MP151FACxx

STM32MP151FAAxx

Miscellaneous
Features

TFBGA257 LFBGA354 TFBGA361 LFBGA448

Advanced 16 bits 2

General 16 bits 8
purpose 32 bits 2
Basic 16 bits 2

25 timers
Timers

Low power 16 bits 5

A7 timers 64 bits 4 (secure, non-secure, virtual, hypervisor)
M4
24 bits 1
SysTick
RTC/AWU 1 (securable)
Watchdog 3 (independent, independent secure, window) -
SPI 6 (1 securable)
-
Having I2S 3
I2C (with SMB/PMB support) 6 (2 securable) -
USART (smartcard, SPI, IrDA, LIN) 4 + 4 (including 1 securable USART)
Boot
+ UART (IrDA, LIN) some can be a boot source
Communication peripherals

4 (up to 8 audio channels), with I2S master/slave, PCM input,

SAI -
SPDIF-TX
2 ports -
EHCI/OHCI Host
Embedded HS PHY with BCD -
USB OTG HS/FS
Yes, embedded FS or HS PHY with BCD, can be a boot source Boot
(dual role port)
Embedded PHYs 3 (2 × high-speed + 1 × full-speed) -
SPDIF-RX 4 inputs -
HDMI-CEC 1 -
1 × USART, 1 × SPI, 2 × I2C
Including the following securable 1 × USART, 1 × SPI, 2 × I2C -
on securable GPIOs
SDMMC (SD, SDIO, e•MMC) 3 (8 + 8 + 4 bits), e•MMC or SD can be a boot source Boot
QuadSPI Yes (dual-quad), can be a boot source Boot

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55
Description STM32MP151C/F

Table 1. STM32MP151C/F features and peripheral counts (continued)

STM32MP151CADxx

STM32MP151CABxx

STM32MP151CACxx

STM32MP151CAAxx
STM32MP151FADxx

STM32MP151FABxx

STM32MP151FACxx

STM32MP151FAAxx

Miscellaneous
Features

TFBGA257 LFBGA354 TFBGA361 LFBGA448

Parallel address/data 8/16-bit - 4 × CS, up to 4 × 64 Mbyte No

FMC Parallel AD-Mux 8/16-bit 4 × CS, up to 4 × 64 Mbytes boot

NAND 8/16-bit Yes, 1 × CS, SLC, BCH4/8, can be a boot source Boot
Gigabit Ethernet - MII, RMII, GMII, RGMII with
-
10/100M Ethernet MII, RMII with PTP and EEE PTP and EEE

Up to 24-bit data, up to 90 MHz pixel clock

LCD-TFT Parallel interface -
(up to 1366 × 768 60 fps or up to 1920 × 1080 30 fps)
DMA 3 instances (1 securable), 48 physical channels in total -
DES, TDES, AES-256
Cryptography -
dual instances (secure and non-secure)
SHA-256, MD5, HMAC
Hash -
dual instances (secure and non-secure)
True random number generator True-RNG, dual instances (secure and non-secure) -
Fuses (one-time programmable) 3072 effective bits (secure, >1500 bits available for user) -
Camera interface Bus width 14-bit -
GPIOs with interrupt (total count) 98 148 176
Securable GPIOs - 8
-
Wakeup pins 4 6
Tamper pins (active tamper) 2 (1) 3 (1)
DFSDM 8 input channels with 6 filters -
Up to 16-bit synchronized ADC 2 (up to 3.6/4/4.5/5/6 Msps on 16/14/12/10/8-bit each)
Low noise 16 bit (differential) - 2 (1)
-
16 bit (differential) 17 (7) 20 (9)
ADC channels in total(2) 17 22
12-bit DAC 2 -
Internal ADC/DAC VREF 1.5 V, 1.8 V, 2.048 V, 2.5 V or VREF+ input
-
VREF+ input pin Yes
1. With inner matrix balls having 0.65 mm pitch to allow optimized PCB routing for supplies.
2. In addition, there is also 6 internal channels for temperature, internal voltage reference, VDDCORE, VBAT/4, DAC1 or DAC2
acquisitions.

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STM32MP151C/F Description

Figure 1. STM32MP151C/F block diagram

IC Supplies @VDD_ANA HSI @VDD HSE (XTAL) 2

CSI LSI @VDD_PLL PLL1/2/3/4

T RCC 5

async

T
T PWR 9
debug TimeStamp

T
GENerator TSGEN T EXTI 16ext 176

async
GIC T 128 bits

AXIM: ARM 64-bit AXI interconnect (266 MHz) T

256KB L2$ + SCU
T DAP
DCMI

FIFO
Cortex-A7 CPU (JTAG / SWD)
(Camera I/F)
14b 17
(1)
650/800 MHz + MMU + SYSRAM 256KB

T
DLYBSD3
FPU + NEON T (SDMMC3 DLY control)
ROM 128KB

FIFO
SDMMC3

DLY
32K D$ T 4b 10
T

@VSW
32K I$ BKPSRAM 4KB

FIFO
OTG

PHY
4
CNT (Timer) T T (HS/FS)
RNG1 @VDDA
ADC1 20

Interface
ETM T 16b
T
ETH1 GMAC HASH1 16b ADC2 14
FIFO

29 (R)(G)MII
10/100/1000 T
CRYP1 GPIOA 16b 16
TZC T

DDRCTRL
32b PHY

async

77 LPDDR2/3 DLYBQS GPIOB 16b 16

(QUADSPI DLY control)
DDR3/3L
CRC1 GPIOC 16b 16
QUADSPI (dual)
DLY

13 8b
DLYBSD1 GPIOD 16b 16
37 16b FMC (SDMMC1 DLY control)

DLYBSD2 GPIOE 16b 16

FIFO

SDMMC1
DLY

14 8b T (SDMMC2 DLY control)

GPIOF 16b 16
FIFO

SDMMC2
DLY

14 8b T
GPIOG 16b 16
2 USBH
2 x PHY

MLAHB: ARM 32-bit multi-AHB bus matrix (209 MHz)

FIFO

2 (2 x HS Host) GPIOH 16b 16

AXIMC TT

PLLUSB T MDMA
FIFO

32 Channels
GPIOI 16b 16
LTDC
FIFO

31 24b (LCD)
GPIOJ 16b 16
FIFO

STM
8 8b GPIOZ T
GPIOK 8b 8
FIFO
8KB

17 16b Trace port async

TIM2 32b 5
T
3 I2C4 / SMBUS Cortex-M4 CPU 209 MHz TIM3 16b 5
T AHB2APB + MPU + FPU
3 I2C6 / SMBUS D-Bus
TIM4 16b 5
T
FIFO

4 SPI6 I-Bus TIM5 32b 5

T
FIFO

Smartcard USART1
5 IrDA
S-Bus TIM6 16b
T
APB5 (133MHz)

ETZPC NVIC TIM7 16b

T
@VSW

IWDG1 SYSTICK TIM12 16b 2

BSEC T
SRAM1 128KB TIM13 16b 1
OTP Fuses
@VDD

SRAM2 128KB TIM14 16b 1

2 RTC / AWU T SRAM3/SRAM4 64K/64K LPTIM1 16b 4
@VSW

3 TAMP / Backup Regs T RETSRAM 64KB MDIOS 2

@VSW

FIFO

LSE (32kHz XTAL) HSEM USART2 Smartcard

2 5
APB1 (104.5 MHz)

IrDA
T
FIFO

USART3 Smartcard
Sys. Timing STGENC IPCC IrDA 5
GENeration STGENR
FIFO

CRC2 UART4 4
FIFO

UART5 4
RNG2
APB4

USBPHYC
FIFO

UART7 4
(USB 2 x PHY control)
HASH2
FIFO
@VSW

IWDG2 UART8 4
T
CRYP2 @VDDA
DDRPHYC 12b DAC1 1
Interface

12b DAC2 1
DDRPERFM
Filter

AHB2APB I2C1 / SMBUS 3

@VDDA

1 VREFBUF
Filter

DMA1 I2C2 / SMBUS 3

FIFO

4 16b LPTIM2
8 Streams
APB3 (104.5 MHz)

Filter

I2C3 / SMBUS 3
1 16b LPTIM3 DMAMUX1
Filter

DMA2 I2C5 / SMBUS 3

FIFO

1 16b LPTIM4
8 Streams
CEC (HDMI-CEC) 1
1 16b LPTIM5
FIFO

2x2
SPDIFRX 4ch 4
FIFO

Matrix
13 SAI4
FIFO

BOOT SPI2 / I2S2 5

3 pins SYSCFG DTS
FIFO

(Digital temperature sensor)

AHB2APB SPI3 / I2S3 5
8 8b HDP
WWDG1
10 16b TIM1 / PWM
FIFO

Voltage Regulators AHB2APB USART6 Smartcard

@VDD
IrDA 5
10 16b TIM8 / PWM
APB2 (104.5 MHz)

FIFO

SPI4 4
APB2 (104.5 MHz)

4 16b TIM15 Supply Supervision @VDD_ANA

FIFO

SPI5 4
3 16b TIM16
FIFO

64 bits AXI 64bits AXI master SPI1 / I2S1 5

3 16b TIM17
32 bits AHB 32 bits AHB master DFSDM1 8ch 17
FIFO

13 SAI1
32 bits APB T TrustZone® security protection
FIFO

8 SAI2
FIFO

8 SAI3 APB2 (104.5 MHz)

1. STM32MP151C: 650 MHz, STM32MP151F: 800 MHz MSv47451V5

DS12501 Rev 6 19/255

55
Functional overview STM32MP151C/F

3 Functional overview

3.1 Arm® Cortex®-A7 subsystem

3.1.1 Features
• ARMv7-A architecture
• 32-Kbyte L1 instruction cache
• 32-Kbyte L1 data cache
• 256-Kbyte level2 cache
• Arm® + Thumb®-2 instruction set
• Arm® TrustZone® security technology
• Arm® NEON™ Advanced SIMD
• DSP and SIMD extensions
• VFPv4 floating-point
• Hardware virtualization support
• Embedded trace module (ETM)
• Integrated generic interrupt controller (GIC) with 256 shared peripheral interrupts
• Integrated generic timer (CNT)

3.1.2 Overview
The Cortex-A7 processor is a very energy-efficient applications processor designed to
provide rich performance in high-end wearables, and other low-power embedded and
consumer applications. It provides up to 20 % more single thread performance than the
Cortex-A5 and provides similar performance than the Cortex-A9.
The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-
A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4
AXI bus interface.
The Cortex-A7 processor builds on the energy-efficient 8-stage pipeline of the Cortex-A5
processor. It also benefits from an integrated L2 cache designed for low-power, with lower
transaction latencies and improved OS support for cache maintenance. On top of this, there
is improved branch prediction and improved memory system performance, with 64-bit load-
store path, 128-bit AMBA 4 AXI buses and increased TLB size (256 entry, up from 128 entry
for Cortex-A9 and Cortex-A5), increasing performance for large workloads such as web
browsing.

Thumb-2 technology
Delivers the peak performance of traditional Arm® code while also providing up to a 30 %
reduction in memory requirement for instructions storage.

TrustZone technology
Ensures reliable implementation of security applications ranging from digital rights
management to electronic payment. Broad support from technology and industry partners.

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NEON
NEON technology can accelerate multimedia and signal processing algorithms such as
video encode/decode, 2D/3D graphics, gaming, audio and speech processing, image
processing, telephony, and sound synthesis. The Cortex-A7 provides an engine that offers
both the performance and functionality of the Cortex-A7 floating-point unit (FPU) and an
implementation of the NEON advanced SIMD instruction set for further acceleration of
media and signal processing functions. The NEON extends the Cortex-A7 processor FPU to
provide a quad-MAC and additional 64-bit and 128-bit register set supporting a rich set of
SIMD operations over 8-, 16- and 32-bit integer and 32-bit floating-point data quantities.

Hardware virtualization
Highly efficient hardware support for data management and arbitration, whereby multiple
software environments and their applications are able to simultaneously access the system
capabilities. This enables the realization of devices that are robust, with virtual environments
that are well isolated from each other.

Optimized L1 caches
Performance and power optimized L1 caches combine minimal access latency techniques
to maximize performance and minimize power consumption.

Integrated L2 cache controller

Provides low-latency and high-bandwidth access to cached memory in high-frequency, or to
reduce the power consumption associated with off-chip memory access.

Cortex-A7 floating-point unit (FPU)

The FPU provides high-performance single and double precision floating-point instructions
compatible with the Arm VFPv4 architecture that is software compatible with previous
generations of Arm floating-point coprocessor.

Snoop control unit (SCU)

The SCU is responsible for managing the interconnect, arbitration, communication, cache to
cache and system memory transfers, cache coherence and other capabilities for the
processor.
This system coherence also reduces software complexity involved in maintaining software
coherence within each OS driver.

Generic interrupt controller (GIC)

Implementing the standardized and architected interrupt controller, the GIC provides a rich
and flexible approach to inter-processor communication and the routing and prioritization of
system interrupts.
Supporting up to 288 independent interrupts, under software control, hardware prioritized,
and routed between the operating system and TrustZone software management layer.
This routing flexibility and the support for virtualization of interrupts into the operating
system, provides one of the key features required to enhance the capabilities of a solution
utilizing a hypervisor.

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55
Functional overview STM32MP151C/F

3.2 Arm® Cortex®-M4 with FPU

The Arm® Cortex®-M4 with FPU core is a 32-bit RISC processor that features exceptional
code-efficiency, delivering the high-performance expected from an Arm core in the memory
size usually associated with 8- and 16-bit devices.
The processor supports a set of DSP instructions which allow efficient signal processing and
complex algorithm execution.
Its single precision FPU (floating point unit) speeds up software development by using
metalanguage development tools, while avoiding saturation.
Note: Cortex-M4 with FPU core is binary compatible with the Cortex-M3 core.

Memory protection unit (MPU)

The memory protection unit (MPU) manages the Cortex®-M4 access rights and the
attributes of the system resources. It has to be programmed and enabled before use. Its
main purposes are to prevent an untrusted user program to accidentally corrupt data used
by the OS and/or by a privileged task, but also to protect data processes or read-protect
memory regions.
The MPU defines access rules for privileged accesses and user program accesses. It
allows the definition of up to 16 protected regions that can in turn be divided into up to 8
independent subregions, where region address, size, and attributes can be configured. The
protection area ranges from 32 bytes to 4 Gbytes of addressable memory.
When an unauthorized access is performed, a memory management exception is
generated.

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3.3 Memories

3.3.1 External SDRAM

The STM32MP151C/F devices embed a controller for external SDRAM which support the
following devices
• LPDDR2 or LPDDR3, 16- or 32-bit data, up to 1 Gbyte, up to 533 MHz clock.
• DDR3 or DDR3L, 16- or 32-bit data, up to 1 Gbyte, up to 533 MHz clock.

3.3.2 Embedded SRAM

All devices feature:
• SYSRAM in MPU domain: 256 Kbytes
• SRAM1 in MCU domain: 128 Kbytes
• SRAM2 in MCU domain: 128 Kbytes
• SRAM3 in MCU domain: 64 Kbytes
• SRAM4 in MCU domain: 64 Kbytes
• RETRAM (retention RAM): 64 Kbytes
The content of this area can be retained in Standby or VBAT mode.
• BKPSRAM (backup SRAM): 4 Kbytes
The content of this area is protected against possible unwanted write accesses, and
can be retained in Standby or VBAT mode.
BKPSRAM can be defined (in ETZPC) as accessible by secure software only.

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3.4 DDR3/DDR3L/LPDDR2/LPDDR3 controller (DDRCTRL)

DDRCTRL combined with DDRPHYC provides a complete memory interface solution for
DDR memory subsystem.
• Two 64-bit AMBA 4 AXI4 ports interface (XPI)
• AXI clock asynchronous to the controller
• Supported standards:
– JEDEC DDR3 SDRAM specification, JESD79-3E for DDR3/3L with 32-bit
interface
– JEDEC LPDDR2 SDRAM specification, JESD209-2E for LPDDR2 with 32-bit
interface
– JEDEC LPDDR3 SDRAM specification, JESD209-3B for LPDDR3 with 32-bit
interface
• Advanced scheduler and SDRAM command generator
• Programmable full data width (32-bit) or half data width (16-bit)
• Advanced QoS support with 3 traffic class on read and 2 traffic classes on write
• Options to avoid starvation of lower priority traffic
• Guaranteed coherency for write-after-read (WAR) and read-after-write (RAW) on AXI
ports
• Programmable support for burst length options (4, 8,16)
• Write combine to allow multiple writes to the same address to be combined into a
single write
• Single rank configuration
• Supports automatic SDRAM power-down entry and exit caused by lack of transaction
arrival for programmable time
• Supports automatic clock stop (LPDDR2/3) entry and exit caused by lack of transaction
arrival
• Supports automatic low power mode operation caused by lack of transaction arrival for
programmable time via hardware low power interface
• Programmable paging policy
• Supports automatic or under software control self-refresh entry and exit
• Support for deep power-down entry and exit under software control (LPDDR2)
• Support for explicit SDRAM mode register updates under software control
• Flexible address mapper logic to allow application specific mapping of row, column,
bank bits
• User-selectable refresh control options
• DDRPERFM associated block to help for performance monitoring and tuning
DDRCTRL and DDRPHYC can be defined (in ETZPC) as accessible by secure software
only.

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3.5 TrustZone address space controller for DDR (TZC)

TZC is used to filter read/write accesses to DDR controller according to TrustZone rights
and according to non-secure master (NSAID) on up to 9 programmable regions.
• Configuration is supported by trusted software only
• 2 filter units working concurrently
• 9 regions:
– region 0 is always enabled and covers the whole address range.
– regions 1 to 8 have programmable base/end address and can be assigned to any
one or both filters.
• Secure and non-secure access permissions programmed per region
• Non-secure accesses are filtered according to NSAID
• Regions controlled by same filter must not overlap
• Fail modes with error and/or interrupt
• Acceptance capability = 256
• Gate keeper logic to enable and disable of each filter
• Speculative accesses

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3.6 Boot modes

At startup, the boot source used by the internal BootROM is selected by the BOOT pin and
OTP bytes.

Table 2. Boot modes

BOOT2 BOOT1 BOOT0 Initial boot mode Comments

Wait incoming connection on:

0 0 0 UART and USB(1) – USART2/3/6 and UART4/5/7/8 on default pins
– USB high-speed device(2)
0 0 1 Serial NOR Flash(3) Serial NOR Flash on QUADSPI(4)
0 1 0 e•MMC(3) e•MMC on SDMMC2 (default)(4)(5)
0 1 1 NAND Flash(3) SLC NAND Flash on FMC
1 0 0 Reserved (NoBoot) Used to get debug access without boot from Flash memory
1 0 1 SD card(3) SD card on SDMMC1 (default)(4)(5)
Wait incoming connection on:
1 1 0 UART and USB(1)(3) – USART2/3/6 and UART4/5/7/8 on default pins
– USB high-speed device on OTG_HS_DP/DM pins(2)
1 1 1 Serial NAND Flash(3) Serial NAND Flash on QUADSPI(4)
1. can be disabled by OTP settings.
2. USB requires 24 MHz HSE clock/crystal if OTP is not programmed for different frequency.
3. Boot source can be changed by OTP settings (e.g. initial boot on SD card, then e•MMC with OTP settings).
4. Default pins can be altered by OTP.
5. Alternatively, another SDMMC1 or SDMMC2 interface than this default can be selected by OTP.

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3.7 Power supply management

3.7.1 Power supply scheme

• The VDD is the main supply for I/Os and internal part kept powered during Standby
mode. Useful voltage range is 1.71 V to 3.6 V (e.g. 1.8 V, 2.5 V, 3.0 V or 3.3 V typ.)
– VDD_PLL and VDD_ANA must be star-connected to VDD.
• The VDDCORE is the main digital voltage and is usually shutdown during Standby mode.
Voltage range during Run mode is 1.18 V to 1.25/1.38 V (1.2/1.34 V typ.), see
Table 13: General operating conditions.
• The VBAT pin can be connected to the external battery (1.2 V < VBAT < 3.6 V). If no
external battery is used, it is mandatory to connect this pin to VDD.
• The VDDA pin is the analog (ADC/DAC/VREF), supply voltage range is 1.71 V to 3.6 V.
DAC can only be used when VDDA is above or equal 1.8 V. Using Internal VREF+
requires VDDA equal to or higher than VREF+ + 0.3 V.
• The VDDA1V8_REG pin is the output of internal regulator and connected internally to
USB PHY and USB PLL. Internal VDDA1V8_REG regulator is enabled by default and can
be controlled by software. It is always shut down during Standby mode.
There is specific BYPASS_REG1V8 pin that must be connected either to VSS or VDD to
activate or deactivate the voltage regulator. It is mandatory to bypass the 1.8 V
regulator when VDD is below 2.25 V (BYPASS_REG1V8 = VDD). In that case,
VDDA1V8_REG pin must be connected to VDD (if below 1.98 V) or to a dedicated
1.65 V - 1.98 V supply (1.8 V typ.).
•
• VDDA1V1_REG pin is the output of internal regulator connected internally to USB PHY.
Internal VDDA1V1_REG regulator is enabled by default and can be controlled by
software. It is always shut down during Standby mode.
• VDD3V3_USBHS and VDD3V3_USBFS are respectively the USB high-speed and full-speed
PHY supply. Voltage range is 3.07 V to 3.6 V. VDD3V3_USBFS is used to supply
OTG_VBUS and ID pins. So, VDD3V3_USBFS must be supplied as well when USB high-
speed OTG device is used. If not used, must be connected to VDD.
Caution: VDD3V3_USBHS must not be present unless VDDA1V8_REG is present, otherwise permanent
STM32MP151C/F damage could occur. Must be ensured by PMIC ranking order or with
external component in case of discrete component power supply implementation.
• VDDQ_DDR is the DDR IO supply.
– Voltage range is 1.425 V to 1.575 V for interfacing DDR3 memories (1.5 V typ.).
– Voltage range is 1.283 V to 1.45 V for interfacing DDR3L memories (1.35 V typ.).
– Voltage range is 1.14 V to 1.3 V for interfacing LPDDR2 or LPDDR3 memories
(1.2 V typ.).
During power-up and power-down phases, the following power sequence requirements
must be respected:
• When VDD is below 1 V, other power supplies (VDDCORE, VDDA, VDDA1V8_REG,
VDDA1V1_REG, VDD3V3_USBHS/FS, VDDQ_DDR) must remain below VDD + 300 mV.
• When VDD is above 1 V, all power supplies are independent.
During the power-down phase, VDD can temporarily become lower than other supplies only
if the energy provided to the STM32MP151C/F device remains below 1 mJ; this allows

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external decoupling capacitors to be discharged with different time constants during the
power- down transient phase.

Figure 2. Power-up/down sequence

V

3.6
VDDX(1)

VDD

VBOR0

0.3

Power-on Operating mode Power-down time

Invalid supply area VDDX < VDD + 300 mV VDDX independent from VDD
MSv47490V1

1. VDDX refers to any power supply among VDDCORE, VDDA, VDDA1V8_REG, , VDDA1V1_REG, VDD3V3_USBHS/FS,
VDDQ_DDR.

3.7.2 Power supply supervisor

The devices have an integrated power-on reset (POR)/ power-down reset (PDR) circuitry
coupled with a Brownout reset (BOR) circuitry:
• Power-on reset (POR)
The POR supervisor monitors VDD power supply and compares it to a fixed threshold.
The devices remain in reset mode when VDD is below this threshold,
• Power-down reset (PDR)
The PDR supervisor monitors VDD power supply. A reset is generated when VDD drops
below a fixed threshold.
The PDR supervisor can be enabled/disabled through PDR_ON pin.
• Brownout reset (BOR)
The BOR supervisor monitors VDD power supply. Three BOR thresholds (from 2.1 to
2.7 V) can be configured through option bytes. A reset is generated when VDD drops
below this threshold.
• Power-on reset VDDCORE (POR_VDDCORE)
The POR_VDDCORE supervisor monitors VDDCORE power supply and compares it to
a fixed threshold. The VDDCORE domain remain in reset mode when VDDCORE is below
this threshold,
• Power-down reset VDDCORE (PDR_VDDCORE)
The PDR_VDDCORE supervisor monitors VDDCORE power supply. A VDDCORE domain
reset is generated when VDDCORE drops below a fixed threshold.
The PDR_VDDCORE supervisor can be enabled/disabled through PDR_ON_CORE
pin.

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3.8 Low-power strategy

There are several ways to reduce power consumption on STM32MP151C/F:
• Decrease dynamic power consumption by slowing down the CPU clocks and/or the
bus matrix clocks and/or controlling individual peripheral clocks.
• Save power consumption when the CPU is IDLE, by selecting among the available low-
power mode according to the user application needs. This allows the best compromise
between short startup time, low-power consumption, as well as available wakeup
sources, to be achieved.
The CPUs feature several low-power modes:
• CSleep (CPU clock stopped)
• CStop (CPU sub-system clock stopped)
• Stop (bus matrix clocks stalled, the oscillators can be stopped)
• CStandby (MPU sub-system clock stopped and wakeup via reset)
• Standby (system powered down)
• LP-Stop and LPLV-Stop (bus matrix clocks stalled, the oscillators can be stopped, low-
power mode signaled to external regulator)
CSleep and CStop low-power modes are entered by the CPU when executing the WFI (wait
for interrupt) or WFE (Wait for Event) instructions, or when the SLEEPONEXIT bit of the
Cortex-M4 core is set after returning from an interrupt service routine.
If part of the domain is not in low-power mode, the domain remains in the current mode.
Finally the system can enter Stop or Standby when all EXTI wakeup sources are cleared
and the CPUs are in CStop or CStandby mode.

Table 3. System versus domain power mode

System power mode MPU MCU

CRun or CSleep
CRun or CSleep
Run mode CStop or CStandby
CRun or CSleep CStop
Stop mode
LP-Stop mode CStop or CStandby CStop
LPLV-Stop mode
CStandby or (CStop and CStop and
Standby mode
MPU PDDS = 1 and MPU CSTBYDIS = 1) MCU PDDS = 1

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3.9 Reset and clock controller (RCC)

The clock and reset controller manages the generation of all the clocks, as well as the clock
gating and the control of the system and peripheral resets. It provides a high flexibility in the
choice of clock sources and allows application of clock ratios to improve the power
consumption. In addition, on some communication peripherals that are capable to work with
two different clock domains (either a bus interface clock or a kernel peripheral clock), the
system frequency can be changed without modifying the baudrate.

3.9.1 Clock management

The devices embed four internal oscillators, two oscillators with external crystal or
resonator, three internal oscillators with fast startup time and four PLLs.
The RCC receives the following clock source inputs:
• Internal oscillators:
– 64 MHz HSI clock (1% accuracy)
– 4 MHz CSI clock
– 32 kHz LSI clock
• External oscillators:
– 8-48 MHz HSE clock
– 32.768 kHz LSE clock
The RCC provides four PLLs:
• The PLL1 is dedicated to the MPU clocking
• The PLL2 provides:
– The clocks for the AXI-SS (including APB4, APB5, AHB5 and AHB6 bridges)
– The clocks for the DDR interface
• The PLL3 provides:
– The clocks for the MCU, and its bus matrix (including the APB1, APB2, APB3,
AHB1, AHB2, AHB3 and AHB4)
– The kernel clocks for peripherals
• The PLL4 is dedicated to the generation of the kernel clocks for various peripherals
The system starts on the HSI clock. The user application can then select the clock
configuration.

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3.9.2 System reset sources

The power-on reset initializes all registers while the system reset reinitializes the system
except for the debug, part of the RCC and power controller status registers, as well as the
backup power domain.
An application reset is generated from one of the following sources:
– a reset from NRST pad
– a reset from POR and PDR signal (generally called power-on reset)
– a reset from BOR (generally called brownout)
– a reset from the independent watchdogs 1
– a reset from the independent watchdogs 2
– a software reset from the Cortex-M4 (MCU)
– a software reset from the Cortex-A7 (MPU)
– a failure on HSE, when the clock security system feature is activated
A system reset is generated from one of the following sources:
– An application reset,
– A reset from POR_VDDCORE signal,
– Every time the system exits from Standby.

3.10 Hardware semaphore (HSEM)

The HW semaphore block provides 64 (32-bit) register-based semaphores.
The semaphores can be used to ensure synchronization between different processes
running on a core and between different cores. The HSEM provides a non blocking
mechanism to lock semaphores in an atomic way. The following functions are provided:
• Locking a semaphore can be done in 2 ways:
– 2-step lock: by writing CoreID and ProcessID to the semaphore, followed by a
read check.
– 1-step lock: by reading the CoreID from the semaphore.
• Interrupt generation when a semaphore is freed.
– Each semaphore may generated an interrupt on one of the interrupt lines.
• Semaphore clear protection.
– A semaphore is only cleared when CoreID and ProcessID matches.
• Global semaphore clear per CoreID.

3.11 Inter-processor communication controller (IPCC)

The inter-processor communication controller (IPCC) is used for communicating data
between two processors.
The IPCC block provides a non blocking signaling mechanism to post and retrieve
communication data in an atomic way. It provides the signaling for four channels:
• two channels in the direction from processor 1 to processor 2
• two channels in the opposite direction.

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It is then possible to have two different communication types in each direction.

The IPCC communication data must be located in a common memory, which is not part of
the IPCC block.

3.11.1 IPCC main features

• Status signaling for the four channels
– Channel occupied/free flag, also used as lock
• Two interrupt lines per processor
– One for RX channel occupied (communication data posted by sending processor)
– One for TX channel free (communication data retrieved by receiving processor)
• Interrupt masking per channel
– Channel occupied mask
– Channel free mask
• Two channel operation modes
– Simplex (each channel has its own communication data memory location)
– Half duplex (a single channel in associated to a bidirectional communication data
information memory location)

3.12 General-purpose input/outputs (GPIOs)

Each of the GPIO pins can be configured by software as output (push-pull or open-drain,
with or without pull-up or pull-down), as input (with or without pull-up or pull-down) or as
peripheral alternate function. Most of the GPIO pins are shared with digital or analog
alternate functions. All GPIOs are high-current-capable and have speed selection to better
manage internal noise, power consumption and electromagnetic emission.
After reset, all GPIOs are in analog mode to reduce power consumption.
The I/O configuration can be locked if needed by following a specific sequence in order to
avoid spurious writing to the I/Os registers.
Additionally, GPIO pins on port Z can be individually set as secure, which would mean that
software accesses to these GPIOs and associated peripherals defined as secure are
restricted to secure software running on Cortex-A7.

3.13 TrustZone protection controller (ETZPC)

ETZPC is used to configure TrustZone security of bus masters and slaves with
programmable-security attributes (securable resources) such as:
• On-chip SYSRAM with programmable secure region size
• AHB and APB peripherals to be made secure
Notice that by default, SYSRAM and peripheral are set to secure access only, so, not
accessible by non-secure masters such as Cortex-M4 or DMA1/DMA2.
ETZPC can also allocate peripherals and SRAM to be accessible only by the Cortex-M4
and/or DMA1/DMA2. This ensures the safe execution of the Cortex-M4 firmware, protected
from other masters (e.g. Cortex-A7) unwanted accesses.

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3.14 Bus-interconnect matrix

The devices feature an AXI bus matrix, one main AHB bus matrix and bus bridges that allow
bus masters to be interconnected with bus slaves (see Figure 3, the dots represent the
enabled master/slave connections).

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Figure 3. STM32MP151C/F bus matrix

interconnect
From MCU

SDMMC1

SDMMC2

MDMA
USBH

LTDC
DBG

CPU
ETH

128-bit
M10 M0 M1 M2 M3 M4 M5 M6 M7 M9

S0 MPU_AXI_DDR1
DDRCTRL 533 MHz
S1 MPU_AXI_DDR2

S2 MPU_AHB6
AHB bridge to AHB6

S3 MPU_AHB_MCU
To MCU interconnect

S4 MPU_AXI_FMC
FMC/NAND

S5 MPU_AXI_QUADSPI
QUADSPI
AXIM

S6 MPU_AXI_SYSRAM
SYSRAM 256 KB

S7 MPU_AXI_ROM
ROM 128 KB

S8 MPU_AXI_STM
STM

S9 MPU_AHB5
AHB bridge to AHB5

S10 MPU_APB5
APB bridge to APB5

S11 MPU_DBG_APB
APB bridge to DBG APB

Default
slave

AXIMC Masters access S0 XOR S1 layer

AXI 64 synchronous master port
NIC-400 AXI 64 bits 266 MHz - 10 masters / 12 slaves
AXI 64 synchronous slave port
AXI 64 asynchronous master port
interconnect
From MPU

AXI 64 asynchronous slave port

SDMMC3

USBO
DMA1

DMA2

AHB 32 synchronous master port

CM4

AHB 32 synchronous slave port

AHB 32 asynchronous master port
D-BUS
S-BUS

I-BUS

AHB 32 asynchronous slave port

M0 M1 M2 M3 M4 M5 M6 M7 M8 M9

S0 MCU_AHB_MEM0
SRAM1

S1 MCU_AHB_MEM1
SRAM2

S2 MCU_AHB_MEM2
SRAM3
MLAHB

S8 MCU_AHB_MEM3
SRAM4
S3 MCU_AHB3
Bridge to AHB3

S4 MCU_AHB2
Bridge to AHB2

S5 MCU_AHB_MPU
To MPU interconnect

S6 MCU_AHB_RET
RetentionRAM

S7 MCU_AHB4
Bridge to AHB4

Interconnect AHB 32 bits 209 MHz - 7 masters / 9 slaves

MSv47456V2

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3.15 DMA controllers

The devices features three DMA modules to unload CPU activity:
• A master direct memory access (MDMA)
The MDMA is a high-speed DMA controller, which is in charge of all types of memory
transfers (peripheral to memory, memory to memory, memory to peripheral), without
any CPU action. It features a master AXI interface.
The MDMA is located in MPU domain. It is able to interface with the other DMA
controllers located in MCU domain to extend the standard DMA capabilities, or can
manage peripheral DMA requests directly.
Each of the 32 channels can perform block transfers, repeated block transfers and
linked list transfers.
The MDMA can be set to make secure transfers to secured memories.
• Two DMA controllers (DMA1, DMA2), located in MCU domain. Each controller is a
dual-port AHB, for a total of 16 DMA channels to perform FIFO-based block transfers.
The DMAMUX is an extension of the DMA1 and DMA2 controllers. It multiplexes and routes
the DMA peripheral requests to the DMA1 or DMA2 controllers, with a high flexibility,
maximizing the number of DMA requests that run concurrently, as well as generating DMA
requests from peripheral output trigger or DMA event.

3.16 Nested vectored interrupt controller (NVIC)

The devices embed a nested vectored interrupt controller able to manage 16 priority levels,
and handle up to 150 maskable interrupt channels plus the 16 interrupt lines of the Cortex®-
M4 with FPU core.
• Closely coupled NVIC gives low-latency interrupt processing
• Interrupt entry vector table address passed directly to the core
• Allows early processing of interrupts
• Processing of late arriving, higher-priority interrupts
• Support tail chaining
• Processor context automatically saved
• Interrupt entry restored on interrupt exit with no instruction overhead
This hardware block provides flexible interrupt management features with minimum interrupt
latency.

3.17 Extended interrupt and event controller (EXTI)

The extended interrupt and event controller (EXTI) manages individual CPU and system
wakeup through configurable and direct event inputs. It provides wake-up requests to the
power control, and generates an interrupt request to the CPUs NVIC or GIC and events to
the CPUs event inputs. For each CPU an additional event generation block (EVG) is needed
to generate the CPU event signal.
The EXTI wake-up requests allow the system to be woken up from Stop mode, and the
CPUs to be woken up from CStop and CStandby modes.
The interrupt request and event request generation can also be used in Run mode.

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The block also includes the EXTI IOport selection.

Each interrupt or event can be set as secure in order to restrict access to secure software
only.

3.18 Cyclic redundancy check calculation unit (CRC1, CRC2)

The CRC (cyclic redundancy check) calculation unit is used to get a CRC code using a
programmable polynomial.
Among other applications, CRC-based techniques are used to verify data transmission or
storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of
verifying the Flash memory integrity. The CRC calculation unit helps computing a signature
of the software during runtime, to be compared with a reference signature generated at link-
time and stored at a given memory location.

3.19 Flexible memory controller (FMC)

The FMC controller main features are the following:
• Interface with static-memory mapped devices including:
– NOR Flash memory
– Static or pseudo-static random access memory (SRAM, PSRAM)
– NAND Flash memory with 4-bit/8-bit BCH hardware ECC
• 8-,16-bit data bus width
• Independent chip select control for each memory bank
• Independent configuration for each memory bank
• Write FIFO

3.20 Dual Quad-SPI memory interface (QUADSPI)

The QUADSPI is a specialized communication interface targeting single, dual or quad SPI
Flash memories. It can operate in any of the three following modes:
• indirect mode: all the operations are performed using the QUADSPI registers
• status polling mode: the external Flash memory status register is periodically read and
an interrupt can be generated in case of flag setting
• memory-mapped mode: the external Flash memory is mapped to the address space
and is seen by the system as if it was an internal memory
Both throughput and capacity can be increased two-fold using dual-flash mode, where two
Quad-SPI Flash memories are accessed simultaneously.
QUADSPI is coupled with a delay block (DLYBQS) allowing the support of external data
frequency above 100 MHz.

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3.21 Analog-to-digital converters (ADCs)

The STM32MP151C/F devices embed two analog-to-digital converters, which resolution
can be configured to 16, 14, 12, 10 or 8 bits. Each ADC shares up to 20 external channels,
performing conversions in the single-shot or scan mode. In scan mode, automatic
conversion is performed on a selected group of analog inputs.
Additional logic functions embedded in the ADC interface allow:
• simultaneous ADC1/ADC2 conversion
• interleaved ADC1/ADC2 conversion.
The ADC can be served by the DMA controller, thus allowing the automatic transfer of ADC
converted values to a destination location without any software action.
In addition, an analog watchdog feature can accurately monitor the converted voltage of
one, some or all selected channels. An interrupt is generated when the converted voltage is
outside the programmed thresholds.
In order to synchronize A/D conversion and timers, the ADCs can be triggered by any of
TIM1, TIM2, TIM3, TIM4, TIM6, TIM8, TIM15, LPTIM1, LPTIM2 and LPTIM3 timers.

3.22 Temperature sensor

The STM32MP151C/F devices embed a temperature sensor that generates a voltage (VTS)
that varies linearly with the temperature. This temperature sensor is internally connected to
ADC2_INP12. It can measure the device ambient temperature ranging from –40 to +125 °C
with a precision of ±2%.
The temperature sensor has a good linearity, but it has to be calibrated to obtain a good
overall accuracy of the temperature measurement. As the temperature sensor offset varies
from chip to chip due to process variation, the uncalibrated internal temperature sensor is
suitable for applications that detect temperature changes only. To improve the accuracy of
the temperature sensor measurement, each device is individually factory-calibrated by ST.
The temperature sensor factory calibration data are stored by ST in the OTP area, which is
accessible in read-only mode.

3.23 Digital temperature sensor (DTS)

The device embeds a frequency output temperature sensor. This block counts the
frequency based on the LSE or PCLK to provide the temperature information.
Following functions can be supported:
• Interrupt generation by temperature threshold.
• Wakeup signal generation by temperature threshold.

3.24 VBAT operation

The VBAT power domain contains the RTC, the backup registers, the retention RAM and the
backup SRAM.

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In order to optimize battery duration, this power domain is supplied by VDD when available
or by the voltage applied on VBAT pin (when VDD supply is not present). VBAT power is
switched when the PDR detects that VDD has dropped below the PDR level.
The voltage on the VBAT pin could be provided by an external battery, a supercapacitor or
directly by VDD. In the later case, VBAT mode is not functional.
VBAT operation is activated when VDD is not present.
The VBAT pin supplies the RTC, the backup registers, the retention RAM and the backup
SRAM.
Note: None of these events: external interrupts, TAMP event, or RTC alarm/events are able to
directly restore the VDD supply and force the STM32MP151C/F device out of the VBAT
operation. Nevertheless, TAMP events and RTC alarm/events can be used to generate a
signal to an external circuitry (typically a PMIC) that can restore the STM32MP151C/F VDD
supply.
When PDR_ON pin is connected to VSS (internal reset OFF), the VBAT functionality is no
more available and VBAT pin must be connected to VDD.

3.25 Digital-to-analog converters (DAC1, DAC2)

The two 12-bit buffered DAC channels can be used to convert two digital signals into two
analog voltage signal outputs.
This dual digital interface supports the following features:
• Two DAC converters: one for each output channel
• 8-bit or 12-bit monotonic output
• Left or right data alignment in 12-bit mode
• Synchronized update capability
• Noise-wave generation
• Triangular-wave generation
• Sample and hold mode to reduce the power consumption
• Dual DAC channel independent or simultaneous conversions
• DMA capability for each channel including DMA underrun error detection
• External triggers for conversion
• input voltage reference VREF+ or internal VREFBUF reference.
The DAC channels are triggered through the timer update outputs that are also connected
to different DMA streams.

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3.26 Voltage reference buffer (VREFBUF)

The STM32MP151C/F devices embed a voltage reference buffer which can be used as
voltage reference for ADC, DACs and also as voltage reference for external components
through the VREF+ pin.
The internal voltage reference buffer supports four voltages:
• 1.5 V
• 1.8 V
• 2.048 V
• 2.5 V
An external voltage reference can be provided through the VREF+ pin when the internal
voltage reference buffer is off.

Figure 4. Voltage reference buffer

VREFBUF
VDDA DAC, ADC

Bandgap + VREF+

Low frequency
100 nF
cut-off capacitor

MSv40197V1

3.27 Digital filter for sigma delta modulators (DFSDM1)

The device embeds one DFSDM with support for 6 digital filters modules and 8 external
input serial channels (transceivers) or alternately 8 internal parallel inputs.
The DFSDM peripheral is dedicated to interface external Σ∆ modulators to
STM32MP151C/F and perform digital filtering of the received data streams. Σ∆ modulators
are used to convert analog signals into digital serial streams that constitute the inputs of the
DFSDM. The DFSDM can also interface PDM (pulse density modulation) microphones and
perform the PDM to PCM conversion and filtering (hardware accelerated). The DFSDM
features optional parallel data stream inputs from internal ADC peripherals or
STM32MP151C/F memory (through DMA/CPU transfers into DFSDM).
The DFSDM transceivers support several serial interface formats (to support various Σ∆
modulators). DFSDM digital filter modules perform digital processing according user-defined
filter parameters with up to 24-bit final ADC resolution.

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The DFSDM peripheral supports:

• 8 multiplexed input digital serial channels:
– configurable SPI interface to connect various SD modulator(s)
– configurable Manchester coded 1-wire interface support
– PDM (pulse density modulation) microphone input support
– maximum input clock frequency up to 20 MHz (10 MHz for Manchester coding)
– clock output for SD modulator(s): 0…20 MHz
• Alternative inputs from 8 internal digital parallel channels (up to 16-bit input resolution):
– internal sources: ADC data or memory data streams (DMA)
• 6 digital filter modules with adjustable digital signal processing:
– Sincx filter: filter order/type (1…5), oversampling ratio (1…1024)
– integrator: oversampling ratio (1…256)
• Up to 24-bit output data resolution, signed output data format
• Automatic data offset correction (offset stored in register by user)
• Continuous or single conversion
• Start-of-conversion triggered by:
– software trigger
– internal timers
– external events
– start-of-conversion synchronously with first digital filter module (DFSDM0)
• Analog watchdog feature:
– low value and high value data threshold registers
– dedicated configurable Sincx digital filter (order = 1…3, oversampling ratio =
1…32)
– input from final output data or from selected input digital serial channels
– continuous monitoring independently from standard conversion
• Short circuit detector to detect saturated analog input values (bottom and top range):
– up to 8-bit counter to detect 1…256 consecutive 0’s or 1’s on serial data stream
– monitoring continuously each input serial channel
• Break signal generation on analog watchdog event or on short circuit detector event
• Extremes detector:
– storage of minimum and maximum values of final conversion data
– refreshed by software
• DMA capability to read the final conversion data
• Interrupts: end of conversion, overrun, analog watchdog, short circuit, input serial
channel clock absence
• “Regular” or “injected” conversions:
– “regular” conversions can be requested at any time or even in continuous mode
without having any impact on the timing of “injected” conversions
– “injected” conversions for precise timing and with high conversion priority

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3.28 Digital camera interface (DCMI)

The devices embed a camera interface that can connect with camera modules and CMOS
sensors through an 8-bit to 14-bit parallel interface, to receive video data. The camera
interface can achieve a data transfer rate up to 140 Mbyte/s using a 80 MHz pixel clock and
14-bit of data. It features:
• Programmable polarity for the input pixel clock and synchronization signals
• Parallel data communication can be 8-, 10-, 12- or 14-bit
• Supports 8-bit progressive video monochrome or raw Bayer format, YCbCr 4:2:2
progressive video, RGB 565 progressive video or compressed data (like JPEG)
• Supports continuous mode or snapshot (a single frame) mode
• Capability to automatically crop the image

3.29 LCD-TFT display controller (LTDC)

The LCD-TFT display controller provides a 24-bit parallel digital RGB (Red, Green, Blue)
and delivers all signals to interface directly to a broad range of LCD and TFT panels up to
WXGA (1366 × 768) @60 fps or up to Full HD (1920 × 1080) @30 fps resolution with the
following features:
• Up to 90 MHz pixel clock
• 2 display layers with dedicated FIFO
• Color look-up table (CLUT) up to 256 colors (256×24-bit) per layer
• Up to 8 input color formats selectable per layer
• Flexible blending between two layers using alpha value (per pixel or constant)
• Flexible programmable parameters for each layer
• Color keying (transparency color)
• Up to 4 programmable interrupt events
• AXI master interface

3.30 True random number generator (RNG1, RNG2)

The RNG is a true random number generator that provides full entropy outputs to the
application as 32-bit samples. It is composed of a live entropy source (analog) and an
internal conditioning component.
RNG1 can be defined (in ETZPC) as accessible by secure software only.

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3.31 Cryptographic and hash processors (CRYP1, CRYP2 and

HASH1, HASH2)
The devices embed two cryptographic processors that support the advanced cryptographic
algorithms usually required to ensure confidentiality, authentication, data integrity and non-
repudiation when exchanging messages with a peer:
• Encryption/decryption
– DES/TDES (data encryption standard/triple data encryption standard): ECB
(electronic codebook) and CBC (cipher block chaining) chaining algorithms, 64-,
128- or 192-bit key
– AES (advanced encryption standard): ECB, CBC, GCM, CCM, and CTR (counter
mode) chaining algorithms, 128, 192 or 256-bit key
• Universal HASH
– SHA-1, SHA224 and SHA256 (secure HASH algorithms)
– MD5
– HMAC
The cryptographic accelerator supports DMA request generation.
CRYP1 and HASH1 can be defined (in ETZPC) as accessible by secure software only.

3.32 Boot and security and OTP control (BSEC)

The BSEC (boot and security and OTP control) is intended to control an OTP (one time
programmable) fuse box, used for embedded non-volatile storage for device configuration
and security parameters. Some part of BSEC should be configured as accessible by secure
software only.

3.33 Timers and watchdogs

The devices include two advanced-control timers, ten general-purpose timers, two basic
timers, five low-power timers, three watchdogs, a SysTick timer in Cortex-M4 and 4 system
timers in Cortex-A7.
All timer counters can be frozen in debug mode.
Table 4 compares the features of the advanced-control, general-purpose, basic and low-
power timers.

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Table 4. Timer feature comparison

Max Max
DMA Capture/ Comple-
Timer Counter Counter Prescaler interface timer
Timer request compare mentary
type resolution type factor clock clock
generation channels output
(MHz) (MHz)(1)

Up, Any integer

Advanced TIM1,
16-bit down, between 1 Yes 6 4 104.5 209
-control TIM8
up/down and 65536
Up, Any integer
TIM2,
32-bit down, between 1 Yes 4 No 104.5 209
TIM5
up/down and 65536
Up, Any integer
TIM3,
16-bit down, between 1 Yes 4 No 104.5 209
TIM4
up/down and 65536
Any integer
TIM12 16-bit Up between 1 No 2 No 104.5 209
General and 65536
purpose Any integer
TIM13,
16-bit Up between 1 No 1 No 104.5 209
TIM14
and 65536
Any integer
TIM15 16-bit Up between 1 Yes 2 1 104.5 209
and 65536
Any integer
TIM16,
16-bit Up between 1 Yes 1 1 104.5 209
TIM17
and 65536
Any integer
TIM6,
Basic 16-bit Up between 1 Yes 0 No 104.5 209
TIM7
and 65536
LPTIM1,
LPTIM2, 1, 2, 4, 8,
Low-
LPTIM3, 16-bit Up 16, 32, 64, No 1(2) No 104.5 209
power
LPTIM4, 128
LPTIM5
1. The maximum timer clock is up to 209 MHz depending on TIMGxPRE bit in the RCC.
2. No capture channel on LPTIM.

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3.33.1 Advanced-control timers (TIM1, TIM8)

The advanced-control timers (TIM1, TIM8) can be seen as three-phase PWM generators
multiplexed on 6 channels. They have complementary PWM outputs with programmable
inserted dead times. They can also be considered as complete general-purpose timers.
Their 4 independent channels can be used for:
• Input capture
• Output compare
• PWM generation (edge- or center-aligned modes)
• One-pulse mode output
If configured as standard 16-bit timers, they have the same features as the general-purpose
timers. If configured as 16-bit PWM generators, they have full modulation capability (0-
100%).
The advanced-control timer can work together with the general-purpose timers via the timer
link feature for synchronization or event chaining.
TIM1 and TIM8 support independent DMA request generation.

3.33.2 General-purpose timers (TIM2, TIM3, TIM4, TIM5, TIM12, TIM13,

TIM14, TIM15, TIM16, TIM17)
There are ten synchronizable general-purpose timers embedded in the STM32MP151C/F
devices (see Table 4 for differences).
• TIM2, TIM3, TIM4, TIM5
The devices include 4 full-featured general-purpose timers: TIM2, TIM3, TIM4 and
TIM5. TIM2 and TIM5 are based on a 32-bit auto-reload up/downcounter and a 16-bit
prescaler while TIM3 and TIM4 are based on a 16-bit auto-reload up/downcounter and
a 16-bit prescaler. All timers feature 4 independent channels for input capture/output
compare, PWM or one-pulse mode output. This gives up to 16 input capture/output
compare/PWMs on the largest packages.
TIM2, TIM3, TIM4 and TIM5 general-purpose timers can work together, or with the
other general-purpose timers and the advanced-control timers TIM1 and TIM8 via the
timer link feature for synchronization or event chaining.
Any of these general-purpose timers can be used to generate PWM outputs.
TIM2, TIM3, TIM4, TIM5 all have independent DMA request generation. They are
capable of handling quadrature (incremental) encoder signals and the digital outputs
from 1 to 4 hall-effect sensors.
• TIM12, TIM13, TIM14, TIM15, TIM16, TIM17
These timers are based on a 16-bit auto-reload upcounter and a 16-bit prescaler.
TIM13, TIM14, TIM16 and TIM17 feature one independent channel, whereas TIM12
and TIM15 have two independent channels for input capture/output compare, PWM or
one-pulse mode output. They can be synchronized with the TIM2, TIM3, TIM4, TIM5
full-featured general-purpose timers or used as simple timebases.

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3.33.3 Basic timers TIM6 and TIM7

These timers are mainly used for DAC trigger and waveform generation. They can also be
used as a generic 16-bit time base.
TIM6 and TIM7 support independent DMA request generation.

3.33.4 Low-power timer (LPTIM1, LPTIM2, LPTIM3, LPTIM4, LPTIM5)

The low-power timer has an independent clock and is running also in Stop mode if it is
clocked by LSE, LSI or an external clock. It is able to wakeup the device from Stop mode.
These low-power timer supports the following features:
• 16-bit up counter with 16-bit autoreload register
• 16-bit compare register
• Configurable output: pulse, PWM
• Continuous / one-shot mode
• Selectable software / hardware input trigger
• Selectable clock source:
• Internal clock source: LSE, LSI, HSI or APB clock
• External clock source over LPTIM input (working even with no internal clock source
running, used by the pulse counter application)
• Programmable digital glitch filter
• Encoder mode

3.33.5 Independent watchdog (IWDG1, IWDG2)

The independent watchdog is based on a 12-bit downcounter and 8-bit prescaler. It is
clocked from an independent 32 kHz internal RC(LSI) and as it operates independently from
the main clock, it can operate in Stop and Standby modes. It can be used either as a
watchdog to reset the device when a problem occurs, or as a free-running timer for
application timeout management. It is hardware- or software-configurable through the option
bytes.
IWDG1 can be defined (in ETZPC) as accessible by secure software only.

3.33.6 System window watchdog (WWDG1)

The window watchdog is based on a 7-bit downcounter that can be set as free-running. It
can be used as a watchdog to reset the device when a problem occurs. It is clocked from
the APB clock. It has an early warning interrupt capability and the counter can be frozen in
debug mode.

3.33.7 SysTick timer (Cortex-M4)

This timer is embedded inside Cortex-M4 core and dedicated to real-time operating
systems, but can also be used as a standard downcounter. It features:
• A 24-bit downcounter
• Autoreload capability
• Maskable system interrupt generation when the counter reaches 0
• Programmable clock source.

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3.33.8 Generic timers (Cortex-A7 CNT)

Cortex-A7 generic timers embedded inside Cortex-A7 are fed by value from system timing
generation (STGEN).
The Cortex-A7 processor provides a set of four timers:
• Physical timer for use in secure and non-secure modes. The registers for the physical
timer are banked to provide secure and non-secure copies.
• Virtual timer for use in non-secure modes.
• Physical timer for use in hypervisor mode.
Generic timers are not memory mapped peripherals, they are accessible only by specific
Cortex-A7 coprocessor instructions (cp15).

3.34 System timer generation (STGEN)

The system timing generation (STGEN) generates a time count value that provides a
consistent view of time for all Cortex-A7 generic timers.
The system timing generation has the following key features:
• 64-bit wide to avoid roll-over issues.
• Starts from zero or a programmable value.
• A control APB interface (STGENC) enables the timer to be saved and restored across
powerdown events.
• Read-only APB interface (STGENR) enables the timer value to be read by non-secure
software and debug tools.
• The timer value incrementing can be stopped during system debug.
STGENC can be defined (in ETZPC) as accessible by secure software only.

3.35 Real-time clock (RTC)

The RTC provides an automatic wakeup to manage all low-power modes.
The real-time clock (RTC) is an independent BCD timer/counter. The RTC provides a time-
of-day clock/calendar with programmable alarm interrupts.
The RTC includes also a periodic programmable wakeup flag with interrupt capability.
Two 32-bit registers contain the seconds, minutes, hours (12- or 24-hour format), day (day
of week), date (day of month), month, and year, expressed in binary coded decimal format
(BCD). The sub-seconds value is also available in binary format.
Compensations for 28-, 29- (leap year), 30-, and 31-day months are performed
automatically. Daylight saving time compensation can also be performed.
Additional 32-bit registers contain the programmable alarm subseconds, seconds, minutes,
hours, day, and date.
A digital calibration feature is available to compensate for any deviation in crystal oscillator
accuracy.
After backup domain reset, all RTC registers are protected against possible parasitic write
accesses.

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As long as the supply voltage remains in the operating range, the RTC never stops,
regardless of the device status (Run mode, Low-power mode or under reset).
The RTC unit main features are the following:
• Calendar with subseconds, seconds, minutes, hours (12 or 24 format), day (day of
week), date (day of month), month, and year.
• Daylight saving compensation programmable by software.
• Programmable alarm with interrupt function. The alarm can be triggered by any
combination of the calendar fields.
• Automatic wakeup unit generating a periodic flag that triggers an automatic wakeup
interrupt.
• Reference clock detection: a more precise second source clock (50 or 60 Hz) can be
used to enhance the calendar precision.
• Accurate synchronization with an external clock using the subsecond shift feature.
• Digital calibration circuit (periodic counter correction): 0.95 ppm accuracy, obtained in a
calibration window of several seconds
• Timestamp function for event saving
• Maskable interrupts/events:
– Alarm A
– Alarm B
– Wakeup interrupt
– Timestamp
• TrustZone support:
– RTC fully securable
– Alarm A, alarm B, wakeup timer and timestamp individual secure or non-secure
configuration

3.36 Tamper and backup registers (TAMP)

32 x 32-bit backup registers are retained in all low-power modes and also in VBAT mode.
They can be used to store sensitive data as their content is protected by an tamper
detection circuit. 3 tamper pins and 5 internal tampers are available for anti-tamper
detection. The external tamper pins can be configured for edge detection, edge and level,
level detection with filtering, or active tamper which increases the security level by auto
checking that the tamper pins are not externally opened or shorted.

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TAMP main features

• 32 backup registers:
– the backup registers (TAMP_BKPxR) are implemented in the RTC domain that
remains powered-on by VBAT when the VDD power is switched off.
• 3 external tamper detection events.
– Each external event can be configured to be active or passive.
– External passive tampers with configurable filter and internal pull-up.
• 5 internal tamper events.
• Any tamper detection can generate a RTC timestamp event.
• Any tamper detection erases the backup registers.
• TrustZone support:
– Tamper secure or non-secure configuration.
– Backup registers configuration in 3 configurable-size areas:
1 read/write secure area.
1 write secure/read non-secure area.
1 read/write non-secure area.
• Monotonic counter.

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3.37 Inter-integrated circuit interface (I2C1, I2C2, I2C3, I2C4, I2C5,

I2C6)
The STM32MP151C/F embeds six I2C interfaces.
The I2C bus interface handles communications between the STM32MP151C/F and the
serial I2C bus. It controls all I2C bus-specific sequencing, protocol, arbitration and timing.
The I2C peripheral supports:
• I2C-bus specification and user manual rev. 5 compatibility:
– Slave and master modes, multimaster capability
– Standard-mode (Sm), with a bitrate up to 100 kbit/s
– Fast-mode (Fm), with a bitrate up to 400 kbit/s
– Fast-mode Plus (Fm+), with a bitrate up to 1 Mbit/s and 20 mA output drive I/Os
– 7-bit and 10-bit addressing mode, multiple 7-bit slave addresses
– Programmable setup and hold times
– Optional clock stretching
• System management bus (SMBus) specification rev 2.0 compatibility:
– Hardware PEC (packet error checking) generation and verification with ACK
control
– Address resolution protocol (ARP) support
– SMBus alert
• Power system management protocol (PMBus™) specification rev 1.1 compatibility
• Independent clock: a choice of independent clock sources allowing the I2C
communication speed to be independent from the PCLK reprogramming.
• Wakeup from Stop mode on address match
• Programmable analog and digital noise filters
• 1-byte buffer with DMA capability
I2C4 and I2C6 can be defined (in ETZPC) as accessible by secure software only.

3.38 Universal synchronous asynchronous receiver transmitter

(USART1, USART2, USART3, USART6 and UART4, UART5,
UART7, UART8)
The STM32MP151C/F devices have four embedded universal synchronous receiver
transmitters (USART1, USART2, USART3 and USART6) and four universal asynchronous
receiver transmitters (UART4, UART5, UART7 and UART8). Refer to Table 5 for a summary
of USARTx and UARTx features.
These interfaces provide asynchronous communication, IrDA SIR ENDEC support,
multiprocessor communication mode, single-wire half-duplex communication mode and
have LIN master/slave capability. They provide hardware management of the CTS and RTS
signals, and RS485 Driver Enable. They are able to communicate at speeds of up to
10 Mbit/s.
USART1, USART2, USART3 and USART6 also provide Smartcard mode (ISO 7816
compliant) and SPI-like communication capability.

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All USART have a clock domain independent from the CPU clock, allowing the USARTx to
wake up the STM32MP151C/F from Stop mode using baudrates up to 200 Kbaud.The wake
up events from Stop mode are programmable and can be:
• Start bit detection
• Any received data frame
• A specific programmed data frame
All USART interfaces can be served by the DMA controller.

Table 5. USART features

USART modes/features(1) USART1/2/3/6 UART4/5/7/8

Hardware flow control for modem X X

Continuous communication using DMA X X
Multiprocessor communication X X
Synchronous mode (master/slave) X -
Smartcard mode X -
Single-wire half-duplex communication X X
IrDA SIR ENDEC block X X
LIN mode X X
Dual clock domain and wakeup from low power mode X X
Receiver timeout interrupt X X
Modbus communication X X
Auto baud rate detection X X
Driver Enable X X
USART data length 7, 8 and 9 bits
1. X = supported.

USART1 can be defined (in ETZPC) as accessible by secure software only.

3.39 Serial peripheral interface (SPI1, SPI2, SPI3, SPI4, SPI5,

SPI6)– inter- integrated sound interfaces (I2S1, I2S2, I2S3)
The devices feature up to six SPIs (SPI2S1, SPI2S2, SPI2S3, SPI4, SPI5 and SPI6) that
allow communication at up to 50 Mbit/s in master and slave modes, in half-duplex, full-
duplex and simplex modes. The 3-bit prescaler gives 8 master mode frequencies and the
frame is configurable from 4 to 16 bits. All SPI interfaces support NSS pulse mode, TI mode,
hardware CRC calculation and 8x 8-bit embedded Rx and Tx FIFOs with DMA capability.
Three standard I2S interfaces (I2S1, I2S2, I2S3, multiplexed with SPI1, SPI2 and SPI3) are
available. They can be operated in master or slave mode, in full-duplex and half-duplex
communication modes, and can be configured to operate with a 16-/32-bit resolution as an
input or output channel. Audio sampling frequencies from 8 kHz up to 192 kHz are
supported. When either or both of the I2S interfaces is/are configured in master mode, the
master clock can be output to the external DAC/CODEC at 256 times the sampling

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frequency. All I2S interfaces support 16x 8-bit embedded Rx and Tx FIFOs with DMA
capability.
SPI6 can be defined (in ETZPC) as accessible by secure software only.

3.40 Serial audio interfaces (SAI1, SAI2, SAI3, SAI4)

The devices embed 4 SAIs that allow the design of many stereo or mono audio protocols
such as I2S, LSB or MSB-justified, PCM/DSP, TDM or AC’97. An SPDIF output is available
when the audio block is configured as a transmitter. To bring this level of flexibility and
reconfigurability, the SAI contains two independent audio sub-blocks. Each block has it own
clock generator and I/O line controller.
Audio sampling frequencies up to 192 kHz are supported.
In addition, up to 8 microphones can be supported thanks to an embedded PDM interface.
The SAI can work in master or slave configuration. The audio sub-blocks can be either
receiver or transmitter and can work synchronously or asynchronously (with respect to the
other one). The SAI can be connected with other SAIs to work synchronously.

3.41 SPDIF receiver interface (SPDIFRX)

The SPDIFRX peripheral is designed to receive an S/PDIF flow compliant with IEC-60958
and IEC-61937. These standards support simple stereo streams up to high sample rate,
and compressed multi-channel surround sound, such as those defined by Dolby or DTS (up
to 5.1).
The main SPDIFRX features are the following:
• Up to 4 inputs available
• Automatic symbol rate detection
• Maximum symbol rate: 12.288 MHz
• Stereo stream from 32 to 192 kHz supported
• Supports audio IEC-60958 and IEC-61937, consumer applications
• Parity bit management
• Communication using DMA for audio samples
• Communication using DMA for control and user channel information
• Interrupt capabilities
The SPDIFRX receiver provides all the necessary features to detect the symbol rate, and
decode the incoming data stream. The user can select the wanted SPDIF input, and when a
valid signal is available, the SPDIFRX re-samples the incoming signal, decode the
Manchester stream, recognize frames, sub-frames and blocks elements. It delivers to the
CPU decoded data, and associated status flags.
The SPDIFRX also offers a signal named spdif_frame_sync, which toggles at the S/PDIF
sub-frame rate that is used to compute the exact sample rate for clock drift algorithms.

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3.42 Management data input/output (MDIOS)

The devices embed a MDIO slave interface. It includes the following features:
• 32 MDIO register addresses, each of which is managed using separate input and
output data registers:
– 32 x 16-bit firmware read/write, MDIO read-only output data registers
– 32 x 16-bit firmware read-only, MDIO write-only input data registers
• Configurable slave (port) address
• Independently maskable interrupts/events:
– MDIO register write
– MDIO register read
– MDIO protocol error
• Able to operate in and wake up from Stop mode

3.43 Secure digital input/output MultiMediaCard interface

(SDMMC1, SDMMC2, SDMMC3)
Three secure digital input/output MultiMediaCard interfaces (SDMMC) provide an interface
between the AHB bus and SD memory cards, SDIO cards and MMC devices.
The SDMMC features include the following:
• Full compliance with MultiMediaCard System Specification Version 4.51.
Card support for three different databus modes: 1-bit (default), 4-bit and 8-bit.
• Full compatibility with previous versions of MultiMediaCards (backward compatibility).
• Full compliance with SD memory card specifications version 4.1.
(SDR104 SDMMC_CK speed limited to maximum allowed I/O speed, SPI mode and
UHS-II mode not supported).
• Full compliance with SDIO card specification version 4.0.
Card support for two different databus modes: 1-bit (default) and 4-bit.
(SDR104 SDMMC_CK speed limited to maximum allowed I/O speed, SPI mode and
UHS-II mode not supported).
• Data transfer up to 208 Mbyte/s for the 8-bit mode.
(depending maximum allowed I/O speed).
• Data and command output enable signals to control external bidirectional drivers.
• The SDMMC host interface embeds a dedicated DMA controller allowing high-speed
transfers between the interface and the SRAM.
• IDMA linked list support
Each SDMMC is coupled with a delay block (DLYBSD) allowing support of an external data
frequency above 100 MHz.

3.44 Universal serial bus high-speed host (USBH)

The devices embed one USB high-speed host (up to 480 Mbit/s) with two physical ports.
USBH supports both low, full-speed (OHCI) as well as high-speed (EHCI) operations

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STM32MP151C/F Functional overview

independently on each port. It integrates two transceivers which can be used for either low-
speed (1.2 Mbit/s), full-speed (12 Mbit/s) or high-speed operation (480 Mbit/s), the second
high-speed transceiver is shared with OTG high-speed.
The USB HS is compliant with the USB 2.0 specification. The USB HS controllers require
dedicated clocks that are generated by a PLL inside the USB high-speed PHY.

3.45 USB on-the-go high-speed (OTG)

The devices embed one USB OTG high-speed (up to 480 Mbit/s) device/host/OTG
peripheral. OTG supports both full-speed and high-speed operations. It integrates the
transceivers for full-speed operation (12 Mbit/s) and high-speed operation (480 Mbit/s)
shared with USB Host second port.
The USB OTG HS is compliant with the USB 2.0 specification and with the OTG 2.0
specification. It has software-configurable endpoint setting and supports suspend/resume.
The USB OTG controllers require a dedicated 48 MHz clock that is generated by a PLL
inside RCC or inside the USB high-speed PHY.
The main features are:
• Combined Rx and Tx FIFO size of 4 Kbyte with dynamic FIFO sizing
• Supports the session request protocol (SRP) and host negotiation protocol (HNP)
• 8 bidirectional endpoints
• 16 host channels with periodic OUT support
• Software configurable to OTG1.3 and OTG2.0 modes of operation
• USB 2.0 LPM (link power management) support
• Battery charging specification revision 1.2 support
• Internal FS or HS OTG PHY support
• Internal USB DMA
• HNP/SNP/IP inside (no need for any external resistor)
• For OTG/Host modes, a power switch is needed in case bus-powered devices are
connected

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55
Functional overview STM32MP151C/F

3.46 Gigabit Ethernet MAC interface (ETH1)

The devices provide an IEEE-802.3-2002-compliant gigabit media access controller
(GMAC) for Ethernet LAN communications through an industry-standard medium-
independent interface (MII), a reduced medium-independent interface (RMII), a gigabit
medium-independent interface (GMII) or a reduced gigabit medium-independent interface
(RGMII).
The STM32MP151C/F requires an external physical interface device (PHY) to connect to
the physical LAN bus (twisted-pair, fiber, etc.). The PHY is connected to the device port
using 17 signals for MII, 7 signals for RMII, 26 signals for GMII or 13 signals for RGMII, and
can be clocked using the 25 MHz (MII, RMII, GMII, RGMII) or 125 MHz (GMII, RGMII) from
the STM32MP151C/F or from the PHY.
The devices include the following features:
• Operation modes and PHY interfaces
– 10, 100, and 1000 Mbps data transfer rates
– Support of both full-duplex and half-duplex operations
– MII, RMII, GMII and RGMII PHY interfaces
• Multiple queues support and audio video bridging (AVB) management
– Separate channels or queues for AV data transfer in 100 and 1000 Mbps modes
– Two queues on the Rx paths and two queues on the Tx path for AV traffic
– One DMA for Rx path and two DMA for Tx path (one per transmit channels)
– Several arbitration algorithms between queues: weighted round robin (WRR),
strict priority (SP), weighted strict priority (WSP), IEEE 802.1-Qav specified credit-
based shaper (CBS) algorithm for Transmit channels
• Processing control
– Multi-layer Packet filtering: MAC filtering on source (SA) and destination (DA)
address with perfect and hash filter, VLAN tag-based filtering with perfect and
hash filter, Layer 3 filtering on IP source (SA) or destination (DA) address, Layer 4
filtering on source (SP) or destination (DP) port
– Double VLAN processing: insertion of up to two VLAN tags in transmit path, tag
filtering in receive path
– IEEE 1588-2008/PTPv2 support
– Supports network statistics with RMON/MIB counters (RFC2819/RFC2665)
• Hardware offload processing
– Preamble and start-of-frame data (SFD) insertion or deletion
– Integrity Checksum offload engine for IP header and TCP/UDP/ICMP payload:
transmit checksum calculation and insertion, receive checksum calculation and
comparison
– Automatic ARP request response with the device's MAC address
– TCP Segmentation: Automatic split of large transmit TCP packet into multiple
small packets
• Low-power mode
– Energy efficient Ethernet (Standard IEEE 802.3az-2010)
– Remote wakeup packet and AMD Magic Packet™ detection

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STM32MP151C/F Functional overview

3.47 High-definition multimedia interface (HDMI) – Consumer

electronics control (CEC)
The device embeds a HDMI-CEC controller that provides hardware support for the
consumer electronics control (CEC) protocol (supplement 1 to the HDMI standard).
This protocol provides high-level control functions between all audiovisual products in an
environment. It is specified to operate at low speeds with minimum processing and memory
overhead. It has a clock domain independent from the CPU clock, allowing the HDMI-CEC
controller to wake up the STM32MP151C/F from Stop mode on data reception.

3.48 Debug infrastructure

The devices offer a comprehensive set of debug and trace features to support software
development and system integration.
• Breakpoint debugging
• Code execution tracing
• Software instrumentation
• JTAG debug port
• Serial-wire debug port
• Trigger input and output
• Serial-wire trace port
• Trace port
• Arm® CoreSight™ debug and trace components
The debug can be controlled via a JTAG/serial-wire debug access port, using industry
standard debugging tools.
A trace port allows data to be captured for logging and analysis.

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55
Pinouts, pin description and alternate functions STM32MP151C/F

4 Pinouts, pin description and alternate functions

Figure 5. STM32MP151C/FADxx TFBGA257 pinout

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
JTDO-
JTCK- DDR_ DDR_
A VSS PD1 PB7 PC6 VSS PD3 PC8 PE4 DNU DNU TRACES
WO
SWCLK DQ0 DQ1
VSS

DDR_ DDR_ DDR_ DDR_

B PG15 PE6 PD7 PA15 PG6 PB4 PE5 PA8 PC9 PC10 DNU DNU DNU NJTRST JTDI
DQ3 DQ7 DQS0N DQS0P

VDD_ JTMS- DDR_ DDR_ DDR_ DDR_

C PE12 PE0 PD4 PD5 PD0 PA9 PB3 PB15 PB9 PC7 PC11 DNU
Unused
VSS
SWDIO RESETN DQM0 DQ2 DQ6

DDR_ DDR_
D PG12 PE11 PE15
1 2 3 4 5 6 7 8 9
VSS
DQ4 DQ5

VDD1V2_
E PD8 NRST PE13
1A PE1 PD10 PE3 PB14 PD2 VSS
Unused
DDR_ZQ DDR_A7
DDR_A13 DDR_A9

PC15-
VDDA
F OSC32_
OUT
VSS
1B PD6 PE14
VDD
PC12
VDD
1V8_
VDD1V2_
VSS
VDDQ_ DDR_A2 VSS DDR_A3
CORE CORE Unused DDR
Unused

PC14-
DDR_
G VSS OSC32_
IN
PC13 VSS DDR_A0
BA0
VDD VDD DDR_
1C PD9 PD15 VSS
CORE
VSS
CORE
VSS
DTO1
DDR_A5

PH0- DDR_ DDR_

H BOOT2
OSC_IN
BOOT0
BA2 ODT

VDD VDD VDD DDR_ VDDQ_

PH1-
NRST_
1D VBAT VSS
CORE
VSS
CORE
VSS
CORE DTO0 DDR DDR_ DDR_ DDR_
J OSC_
OUT
CORE CSN WEN CASN

PDR_ON VDD VDD VDD DDR_ DDR_

K PWR_LP
_CORE
BOOT1 1E PD14 VDD VSS
CORE
VSS
CORE
VSS
CORE RASN
VSS
CLKN
VSS

DDR_
L PA14 PA13 PDR_ON
VDD VDD DDR_ VDDQ_ CLKP
DDR_A15
1F VDDA VDDA VDD VSS
CORE
VSS
CORE ATO DDR

M PWR_ON VREF+ DDR_A10 DDR_A12 DDR_A1

VDD VDD
1G VSSA VSS VDD VDD VSS
CORE
VSS
CORE
DDR_A6

N VSS PA3 PA0 VSS DDR_A14 DDR_A11

VDDA VDD
VDDQ_
P PE2 PC2 PC3 1H PA5 VSS VSS VSS 1V8_
REG
VSS 3V3_
USB
VSS
DDR DDR_ DDR_
CKE BA1

DDR_
R PG14 PG13
1J PA4 PB13 VDD PE9 VSS
VDDA
1V1_ PF10
USB_
VSS
DDR_A4
DQ8
VSS
RREF
REG

DDR_ DDR_
T PA1 PC1 PA2 DDR_A8
DQ13 DQ10

BYPASS DDR_ DDR_ DDR_

U PB1 PB0 PB11 PC0 PB10 PG11 PG10 PD11 VSS PF6
_REG1V8
PE8 PD13 PD12 PA11 PA10
DQ14 DQS1N DQ9

USB_ USB_ OTG_ DDR_ DDR_ DDR_

V PC5 PC4 PB12 PB8 PB5 PG8 PE7 PF8 PF9
DP2
PG7 PE10 PB2
DP1
PA12
VBUS DQ15 DQM1 DQS1P

USB_ USB_ DDR_ DDR_ DDR_

W VSS PA7 PA6 PF11 VSS PF7 PG9
DM2
PB6 VSS
DM1 VREF DQ12 DQ11
VSS

MSv47441V2

The above figure shows the package top view.

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STM32MP151C/F Pinouts, pin description and alternate functions

Figure 6. STM32MP151C/FABxx LFBGA354 pinout

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
VDD_ VDD1V2_ DDR_ DDR_
A VSS PG15 PD0 PD1 PE3 PG6 PB3 PB15 PC7 PC9 PC11
Unused
DNU DNU DNU
Unused DQ0 DQ1
VSS

VDDA
VDD1V2_ DDR_ DDR_ DDR_
B PE1 VSS PE6 PD7 PB7 VSS PE5 PA8 PB4 PD2 PE4 1V8_
Unused
DNU DNU DNU
Unused DQ3 DQ7 DQS0N

DDR_ DDR_
C PE11 PE13 VSS PE0 PD10 PD3 PA15 PA9 PB14 PC12 PC8 VSS VSS VSS VSS VSS VSS
DQM0 DQS0P

JTDO-
JTMS- JTCK- DDR_ DDR_ DDR_
D VSS PE12 PE14 VSS VSS PD4 PD5 VSS PB9 PC6 PC10 NJTRST JTDI TRACE
SWO
SWDIO SWCLK DQ5 DQ2 DQ6

VDD VDD VDD VDD VDDQ_ DDR_

E PE15 VSS PD6 VSS VSS VSS
CORE
VSS
CORE
VSS
CORE
VSS
CORE
VSS
DDR
VSS DDR_A7
DQ4

VDD VDD VDD VDD VDD VSS_ VDDQ_

F PG12 PD8 PD14
CORE
VSS
CORE
VSS
CORE
VSS
CORE
VSS
CORE PLL2 DDR
VSS DDR_A13 DDR_ZQ DDR_A3

VDD VDD VDD VDD VDD_ VDDQ_ DDR_ DDR_

G PD15 VSS PD9 VSS
CORE
VSS
CORE
VSS
CORE
VSS
CORE
VSS
PLL2
VSS
DDR RESETN
DDR_A9 DDR_A2
BA0

PC14- PC15-
VDD VDD VDD VDD VDD VDDQ_ DDR_
H OSC32_
IN
OSC32_
OUT
VBAT
CORE
VSS
CORE
VSS
CORE
VSS
CORE
VSS
CORE
VSS
DDR
VSS DDR_A5 DDR_A0
ODT

NRST_ VDD VDD VDD VDD VDDQ_ DDR_ DDR_ DDR_ DDR_
J NRST
CORE
VSS VSS_PLL VDD_PLL VSS
CORE
VSS
CORE
VSS
CORE
VSS
CORE
VSS
DDR BA2 WEN CSN DTO1

VDD VDD VDD VDDQ_ DDR_ DDR_ DDR_

K BOOT0 VSS PC13 BOOT1 VSS VDD VSS
CORE
VSS
CORE
VSS
CORE
VSS
DDR
VSS
CASN DTO0 CLKN

VDD_ VSS_ VDD VDD VDD VDDQ_ DDR_ DDR_

L PWR_ON BOOT2
ANA ANA
VDD VSS VDD VSS
CORE
VSS
CORE
VSS
CORE
VSS
DDR
DDR_A15 DDR_A12
RASN CLKP

PH1-
PH0- VDD VDD VDDQ_
M OSC_IN
OSC_
OUT
VREF- VDDA VSS VDD VSS VDD VSS
CORE
VSS
CORE
VSS
DDR
VSS DDR_A1 DDR_A11 DDR_A10

PDR_ON VDD VDD VDDQ_ DDR_ DDR_

N _CORE
PDR_ON VREF+ VSSA VDD VSS VDD VSS VDD VSS
CORE
VSS
CORE
VSS
DDR
DDR_A6
BA1
DDR_A14
ATO

VDD VDDQ_ DDR_ DDR_

P PWR_LP PA13 PA3 PA5 VSSA VDD VSS VDD VSS VDD VSS
CORE
VSS
DDR
VSS DDR_A4
DQ8 CKE

VDD VDDQ_ DDR_

R PA14 VSS PA0 PA4 VSSA VSS VDD VSS VDD VSS VDD VSS
CORE
VSS
DDR
VSS DDR_A8
DQ10

BYPASS DDR_ DDR_ DDR_

T PE2 PC2 PC3 VSS PA6 PA7 PC0 PB5 PB13 PE7 PE8 PB6 PB2 PG9
_REG1V8
PA10
DQ9 DQ13 DQS1N

VSS_ VSS_ OTG_ DDR_ DDR_

U PG14 PG13 VSS PA1 PF11 VSS PG8 VSS PF10 PF8 PD12 PD13
USBHS USBHS VBUS
PA12 VSS
DQM1 DQS1P

VDDA
VSS_ USB_ USB_ VSS_ USB_ DDR_ DDR_
V PB11 PC1 PB1 PC5 PB12 PG11 PG10 PD11 PF6 PE10 1V8_
REG
USBHS DM2 DP1 USBHS RREF
PA11
DQ14 DQ11

VDDA
VDD3V3_ USB_ USB_ VDD3V3_ DDR_ DDR_ DDR_
W VSS PA2 PB0 PC4 PB10 PB8 PE9 PF7 PF9 PG7 1V1_
REG
USBHS DP2 DM1 USBFS VREF DQ15 DQ12
VSS

MSv47442V2

The above figure shows the package top view.

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118
Pinouts, pin description and alternate functions STM32MP151C/F

Figure 7. STM32MP151C/FACxx TFBGA361 pinout

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
JTDO-
DDR_ DDR_
A VSS PH5 PE13 PE11 PF1 PD5 PA9 PG6 PB3 PA8 PF2 DNU DNU TRACE
SWO
JTDI
DQ20 DQ23
VSS

VDD_ NJ JTCK- DDR_ DDR_ DDR_

B PH15 PH12 PH4 PE12 PD10 PD4 PG15 PD0 PD1 PB9 PC7 PB15 PB4 PC6 DNU DNU DNU
Unused TRST SWCLK DQ19 DQ16 DQS2N

VDDA VDD VDD

JTMS- DDR_ DDR_
C PI0 PH10 PH14 PH11 PH9 PE14 VSS PE1 PE3 PE6 PE5 VSS PB14 1V8_
Unused
DNU VSS 1V2_
Unused
1V2_
Unused
PA15
SWDIO
VSS
DQS2P DQM2

DDR_
DDR_ DDR_ DDR_
D PH13 PD6 PE15 VSS PH8 PE0 PF5 PF0 PF4 PD7 PB7 PD2 PC12 PD3 PC10 PC11 PC9 PC8 PE4 RESET
N
DQ22 DQ17 DQ18

DDR_ DDR_ DDR_ DDR_

E PI3 PI2 PI1 PI4
A7 DQ3 DQ0 DQ21

DDR_ DDR_
F PI7 PI5 PI6
1 2 3 4 5 6 7 8 9 A13
VSS
DQ1

VDD VDD VDD VDDQ_

G PZ1 PZ4 PZ0 PZ3
1A CORE
VSS
CORE
VSS
CORE
VSS
DDR DDR_ DDR_ DDR_ DDR_
A9 DQ7 DQS0P DQS0N

DDR_ DDR_ DDR_ DDR_

H PZ6 PZ5 VSS PI9
1B VDD
CORE
VSS
VDD
CORE
VSS
VDD
CORE
VSS
VDDQ_
DDR
VSS
VDDQ_
DDR A5 DQ2 DQ6 DQM0

DDR_ DDR_ DDR_

J PD15 PZ7 PZ2
VDD VDD VDD VDDQ_
A2 DQ4 DQ5
1C VSS
CORE
VSS
CORE
VSS
CORE
VSS
DDR
VSS

DDR_ DDR_ DDR_

K PD9 PC13 PD8 PG12
DTO0
VSS
A3 ZQ
VDD VDD VDD VDD VDDQ_
PC15- PC14- 1D CORE
VSS
CORE
VSS
CORE
VSS
CORE
VSS
DDR DDR_ DDR_ DDR_ DDR_
L OSC32
_OUT
OSC32
_IN
PD14 PI8
A0 DTO1 ODT BA0

NRST_ VDD VDD VDD VDDQ_ DDR_ DDR_ DDR_

M BOOT2 NRST
CORE 1E VSS
CORE
VSS
CORE
VSS
CORE
VSS
DDR
VSS
WEN BA2 CSN

PWR_ DDR_ DDR_ DDR_ DDR_

N BOOT0 PA13
LP
BOOT1
VDD VDD VDDQ_ CASN RASN CLKP CLKN
1F VBAT VSS VDD VSS
CORE
VSS
CORE
VSS
DDR
PH1-
PH0- DDR_ DDR_ DDR_
P OSC_IN
OSC_
OUT
VSS PI11
A15
VSS
A1 A12
VSS_ VDD_ VDD VDDQ_
1G ANA ANA
VSS VDD VSS
CORE
VSS
DDR
VSS
PWR_ PDR_ DDR_ DDR_ DDR_
R ON ON
VREF+
A11 A14 A10

PDR_ VDD VDDQ_

T PI10 PA14 ON_ PG3 1H VDDA VSSA VDD VSS VDD VSS
CORE
VSS
DDR
DDR_
CKE
DDR_
DQ8
DDR_
DQ10
DDR_
DQ13
CORE

DDR_ DDR_ DDR_ DDR_

U PF3 PA3 ANA0 ANA1
1J VDD VSS VDD VSS VDD VSS
VDDQ_ BA1 DQ9 DQS1P DQS1N
DDR

DDR_ DDR_
V PG2 PA5 PA4
A4
VSS
DQM1

DDR_ DDR_ DDR_ DDR_

W PG1 PC3 VSS PH7
A6 DQ11 DQ14 DQ12

DDR_ DDR_ DDR_ DDR_ DDR_

Y PE2 PC2 PB10 PF15 PF13 PG5 PG11 PB5 PF12 PF11 PH6 PF10 PG9 PB6 PE10 PB2 PA10 PD12
ATO A8 DQ15 DQ25 DQ24

VDD VDD
VSS_ DDR_ DDR_ DDR_
AA PG14 PG13 PH3 PA1 VSS PC1 PB1 VSS PE9 PB13 PE7 VSS PF6 PF9 3V3_
USBHS
USBHS
3V3_
USBFS
PA11 PD13
DQM3
VSS
DQ31 DQ30

BYPAS VDDA VDDA

USB_ USB_ USB_ DDR_ DDR_ DDR_ DDR_
AB PB11 PG4 PA0 PH2 PC0 PB0 PC5 PA7 PG8 PB8 PG10 PF7 S_REG
1V8
1V8_
REG
1V1_
REG
DM2 DM1 RREF
PA12
DQ27 DQ26 DQS3P DQS3N

USB_ USB_ OTG_ DDR_ DDR_ DDR_

AC VSS PG0 PA2 PF14 PB12 PC4 PA6 PD11 PF8 PE8 PG7
DP2 DP1 VBUS VREF DQ29 DQ28
VSS

MSv47443V2

The above figure shows the package top view.

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STM32MP151C/F Pinouts, pin description and alternate functions

Figure 8. STM32MP151C/FAAxx LFBGA448 pinout

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
VDD
VDD_ DDR_ DDR_
A VSS PH5 PH4 PE13 PK6 PK4 PJ13 PD10 PD5 PE3 PA9 PB3 PB14
Unused
DNU DNU DNU 1V2_
Unused
VSS
DQ20 DQ23
VSS

VDDA VDD
DDR_ DDR_ DDR_
B PH10 VSS PH11 PE14 PK7 PK3 PJ14 PJ12 PF1 PD1 PD3 PB15 PA8 1V8_
Unused
DNU DNU DNU 1V2_
Unused
VSS
DQ19 DQ16 DQS2N

DDR_ DDR_
C PH15 PH14 VSS PE15 PE0 PK5 PJ15 VSS PD4 PD0 VSS PE5 PB4 VSS VSS VSS VSS VSS VSS VSS
DQS2P DQM2

JTCK- VDD_ VSS_ DDR_ DDR_ DDR_

D PI0 PI14 PH13 VSS PE11 PH8 PE1 PK0 PF5 PG15 PG6 PD2 PC7 PC9 PC11 JTDI
SWCLK PLL2 PLL2 DQ22 DQ17 DQ18

JTDO-
NJ JTMS- VDDQ_ DDR_ DDR_ DDR_
E PI2 PI1 PI3 PE12 VSS PH9 PK1 PK2 PE6 PF0 PA15 PC12 PC6 PC8
TRST
TRACE
SWO
SWDIO DDR
VSS
DQ3 DQ0 DQ21

DDR_
VDDQ_ DDR_ DDR_
F PI7 PI5 PI15 PZ3 PH12 VSS VSS VSS PF4 PD7 PB7 PB9 PF2 PC10 PE4 VSS
DDR A7
RESET
N
VSS
DQ1

VDDQ_ DDR_ DDR_ DDR_ DDR_ DDR_

G PZ4 PZ0 PZ6 VSS PI6 VSS VSS VSS VSS VSS
DDR
VSS
A13 DQ7 DQM0 DQS0N DQS0P

VDD VDD VDD VDD VDDQ_ DDR_ DDR_ DDR_ DDR_ DDR_
H PI13 PI12 PZ7 PZ5 PZ1 PJ8 VSS
CORE CORE CORE CORE DDR A9 A5 DQ5 DQ2 DQ6

VDD VDD VDD VDD VDDQ_ DDR_ DDR_ DDR_

J PJ3 PJ0 PJ10 PG12 PI9 PI4
CORE
VSS
CORE
VSS
CORE
VSS
CORE DDR
VSS
A2 A3
VSS
DQ4

VDD VDD VDD VDD VDDQ_ DDR_ DDR_ DDR_ DDR_ DDR_
K PJ5 PJ4 VSS PJ2 PZ2 PJ11 VSS
CORE
VSS
CORE
VSS
CORE
VSS
CORE DDR BA2 A0 BA0 DTO1 ZQ

VDD VDD VDD VDD VDDQ_ DDR_ DDR_ DDR_

L PD15 PJ9 PD6 PJ7 PJ6 PJ1
CORE
VSS
CORE
VSS
CORE
VSS
CORE DDR
VSS
CSN
VSS VSS
ODT DTO0

VSS_ VDD_ VDD VDD VDD VDDQ_ DDR_ DDR_ DDR_ DDR_ DDR_
M PD8 PD9 PD14 VBAT
PLL PLL
VSS VDD VSS
CORE
VSS
CORE
VSS
CORE DDR A1 A15 RASN WEN CASN

VDD_ VDD VDD VDDQ_ DDR_ DDR_ DDR_ DDR_ DDR_

N PI8 PC13 BOOT0 BOOT1
ANA
VREF- VDD VSS VDD VSS
CORE
VSS
CORE DDR
VSS
A10 A12 CLKP CLKN DQ8

PC14- PC15-
VSS_ VDD VDD VDDQ_ DDR_ DDR_ DDR_
P OSC32
_IN
OSC32
_OUT
VSS BOOT2
ANA
VREF+ VSS VDD VSS VDD VSS
CORE
VSS
CORE DDR A14 A11
VSS
DQ10

NRST_ VDD VDDQ_ DDR_ DDR_ DDR_ DDR_ DDR_

R CORE
NRST PA14 ANA0 VDDA VSSA VSS VDD VDD
CORE DDR
VSS
BA1 CKE DQ13 DQ9 DQS1N

PH1-
PH0- VDD VDDQ_ DDR_ DDR_ DDR_ DDR_
T OSC_IN
OSC_
OUT
PI11 PA3 ANA1 VSSA VSS VSS VSS VDD
CORE DDR A4
VSS
DQ11 DQM1 DQS1P

PDR_
PWR_ VDDQ_ DDR_ DDR_ DDR_
U LP
ON_
CORE
PC3 PG3 PA5 VSSA VSS PG5 VDD PC0 PG11 VDD VSS VDD VSS
DDR
VSS
A8 A6
VSS
DQ14

PWR_ PDR_ OTG_ VDDQ_ DDR_ DDR_ DDR_

V ON ON
PF3 PA1 VSS PA4 PF14 PF12 PB10 PB13 PH6 PF10 PB2 PD13
VBUS
VSS
DDR
VSS VSS
DQ12 DQ15 DQ24

VDDQ_ DDR_ DDR_ DDR_

W PI10 PH7 PA13 PG2 PG0 PF15 PF13 PF11 PA6 PE7 PE9 PD12 PB6 PE10 PG9 PA12 VSS
DDR
VSS
DQ25 DQ31 DQ30

VSS_ VSS_ VSS_ VDDQ_ DDR_ DDR_

Y PC2 PE2 VSS PG1 PB11 PH3 VSS PG8 PA7 VSS PG7 PE8
USBHS USBHS USBHS
PA11 PA10 VSS
DDR
VSS
DQS3P DQS3N

BYPAS
VSS_ USB_ USB_ VSS_ USB_ DDR_ DDR_ DDR_ DDR_
AA PG13 PG14 PA0 VSS PB1 PC5 PB12 PB5 PG10 PF7 PF6 S_REG
1V8
USBHS DM2 DP1 USBHS RREF
VSS
ATO DQ29 DQ28 DQM3

VDDA1 VDD VDD VDDA

USB_ USB_ DDR_ DDR_ DDR_
AB VSS PA2 PC1 PG4 PB0 PC4 PH2 PB8 PD11 PF8 PF9 V8_
REG
3V3_
USBHS
DP2 DM1
3V3_
USBFS
1V1_
REG
VSS
VREF DQ27 DQ26
VSS

MSv47444V2

The above figure shows the package top view.

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Pinouts, pin description and alternate functions STM32MP151C/F

Table 6. Legend/abbreviations used in the pinout table

Name Abbreviation Definition

Unless otherwise specified, the pin function during and after reset is the same as the actual pin
Pin name
name
S Supply pin
I Input only pin
O Output only pin

Pin type I/O Input / output pin

A Analog or special level pin
Do not use. Used for test purpose during production. Ball should be
DNU individually left open and not connected to any other ball, not even to another
DNU ball.
FT(U/D/PD) 5 V tolerant I/O (with fixed pull-up / pull-down / programmable pull-down)
TT 3.6 V tolerant I/O directly connected to DAC
DDR 1.5 V, 1.35 V or 1.2 V I/O for DDR3, DDR3L, LPDDR2/LPDDR3 interface
A Analog signal
RST Reset pin with weak pull-up resistor
Option for TT or FT I/Os
I/O structure _f(1)
I2C FM+ option
_a(2) Analog option (supplied by VDDA for the analog part of the I/O)
(3)
_u USB option (supplied by VDD3V3_USBxx for the USB part of the I/O)
(4)
_h High-speed output for 1.8V typ. VDD (for SPI, SDMMC, QUADSPI, TRACE)
Very-high-speed option for 1.8V typ. VDD (for ETH, SPI, SDMMC, QUADSPI,
_vh(5)
TRACE)
Notes Unless otherwise specified by a note, all I/Os are set as floating inputs during and after reset
Alternate
Functions selected through GPIOx_AFR registers
functions
Additional
Functions directly selected/enabled through peripheral registers
functions
1. The related I/O structures in Table 7 are: FT_f, FT_favh, FT_fh, FT_fha, FT_uf
2. The related I/O structures in Table 7 are: FT_a, TT_a, FT_avh, FT_favh, FT_fha, FT_ha, TT_ha
3. The related I/O structures in Table 7 are: FT_u, FT_uf
4. The related I/O structures in Table 7 are: FT_h, FT_fh, FT_fha, FT_ha, TT_ha
5. The related I/O structures in Table 7 are: FT_vh, FT_avh, FT_favh

60/255 DS12501 Rev 6

STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

I2C2_SDA, SPI5_NSS,
- - A2 A2 PH5 I/O FT_f - -
SAI4_SD_B, EVENTOUT
TIM5_CH1, I2C4_SMBA,
- - C2 B1 PH10 I/O FT - I2C1_SMBA, DCMI_D1, LCD_R4, -
EVENTOUT
HDP2, TIM5_CH3, I2C4_SDA,
- - B2 F5 PH12 I/O FT_f - I2C1_SDA, DCMI_D3, LCD_R6, -
EVENTOUT
TIM8_CH1N, UART4_TX,
- - D1 D3 PH13 I/O FT - -
LCD_G2, EVENTOUT
1E2 K6 1F3 M9 VDD S - - - -
A1 A1 A1 A1 VSS S - - - -
TIM8_CH2N, UART4_RX,
- - C3 C2 PH14 I/O FT - -
DCMI_D4, LCD_G3, EVENTOUT
TIM8_CH3N, DCMI_D11,
- - B1 C1 PH15 I/O FT - -
LCD_G4, EVENTOUT
TRACED14, TIM1_CH3N,
- - - H6 PJ8 I/O FT_h - TIM8_CH1, UART8_TX, -
LCD_G1, EVENTOUT
TRACECLK, LCD_CLK,
- - - D2 PI14 I/O FT_h - -
EVENTOUT
- - - F3 PI15 I/O FT - LCD_G2, LCD_R0, EVENTOUT -
TIM5_CH4, SPI2_NSS/I2S2_WS,
- - C1 D1 PI0 I/O FT - DCMI_D13, LCD_G5, -
EVENTOUT
TIM8_BKIN2,
- - E3 E2 PI1 I/O FT_h - SPI2_SCK/I2S2_CK, DCMI_D8, -
LCD_G6, EVENTOUT
TIM8_CH4,
- - E2 E1 PI2 I/O FT_h - SPI2_MISO/I2S2_SDI, DCMI_D9, -
LCD_G7, EVENTOUT
1B3 E7 1A2 H9 VDDCORE S - - - -
TIM8_ETR,
- - E1 E3 PI3 I/O FT_h - SPI2_MOSI/I2S2_SDO, -
DCMI_D10, EVENTOUT
TIM8_BKIN, SAI2_MCLK_A,
- - E4 J6 PI4 I/O FT - -
DCMI_D5, LCD_B4, EVENTOUT
TIM8_CH1, SAI2_SCK_A,
- - F3 F2 PI5 I/O FT - DCMI_VSYNC, LCD_B5, -
EVENTOUT
TIM8_CH2, SAI2_SD_A,
- - F4 G5 PI6 I/O FT - -
DCMI_D6, LCD_B6, EVENTOUT
TIM8_CH3, SAI2_FS_A,
- - F2 F1 PI7 I/O FT - -
DCMI_D7, LCD_B7, EVENTOUT

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118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

- A19 A23 A19 VSS S - - - -

I2C6_SDA, I2C2_SDA,
I2C5_SDA,
- - G1 H5 PZ1 I/O FT_fh - SPI1_MISO/I2S1_SDI, -
I2C4_SDA, USART1_RX,
SPI6_MISO, EVENTOUT
I2C6_SDA, I2C2_SDA,
I2C5_SDA, SPI1_NSS/I2S1_WS,
- - G4 F4 PZ3 I/O FT_f - I2C4_SDA, -
USART1_CTS/USART1_NSS,
SPI6_NSS, EVENTOUT
HDP1, UART4_RX,
- - H4 J5 PI9 I/O FT - -
LCD_VSYNC, EVENTOUT
I2C6_SCL, I2C2_SCL,
SPI1_SCK/I2S1_CK,
- - G3 G2 PZ0 I/O FT_fh - -
USART1_CK, SPI6_SCK,
EVENTOUT
I2C6_SCL, I2C2_SCL,
I2C5_SMBA,
- - J4 K5 PZ2 I/O FT_fh - SPI1_MOSI/I2S1_SDO, -
I2C4_SMBA, USART1_TX,
SPI6_MOSI, EVENTOUT
I2C6_SCL, I2C2_SCL,
- - G2 G1 PZ4 I/O FT_f - I2C5_SCL, I2C4_SCL, -
EVENTOUT
G1 B2 - A22 VSS S - - - -
LPTIM1_IN1, SPI6_MISO,
SAI4_CK2,
USART6_RTS/USART6_DE,
D1 F1 K4 J4 PG12 I/O FT_h - -
SPDIFRX_IN2, LCD_B4,
SAI4_SCK_A, ETH1_PHY_INTN,
FMC_NE4, LCD_B1, EVENTOUT
I2C6_SDA, I2C2_SDA,
I2C5_SDA, I2C4_SDA,
- - H2 H4 PZ5 I/O FT_f - -
USART1_RTS/USART1_DE,
EVENTOUT
- E9 - - VDDCORE S - - - -
I2C6_SCL, I2C2_SCL,
USART1_CK, I2S1_MCK,
- - H1 G3 PZ6 I/O FT_f - -
I2C4_SMBA, USART1_RX,
EVENTOUT
I2C6_SDA, I2C2_SDA,
- - J3 H3 PZ7 I/O FT_f - -
USART1_TX, EVENTOUT
TRACED0, HDP0, LCD_HSYNC,
- - - H2 PI12 I/O FT_h - -
EVENTOUT

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STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

- B6 C7 B2 VSS S - - - -
TRACED1, HDP1, LCD_VSYNC,
- - - H1 PI13 I/O FT_h - -
EVENTOUT
- - 1A4 H11 VDDCORE S - - - -
TIM1_CH2N, TIM8_CH2,
- - - J3 PJ10 I/O FT_h - SPI5_MOSI, LCD_G3, -
EVENTOUT
TIM1_CH2, TIM8_CH2N,
- - - K6 PJ11 I/O FT_h - SPI5_MISO, LCD_G4, -
EVENTOUT
TRACED8, LCD_R7, LCD_R1,
- - - J2 PJ0 I/O FT_h - -
EVENTOUT
- - - L6 PJ1 I/O FT_h - TRACED9, LCD_R2, EVENTOUT -
TRACED10, LCD_R3,
- - - K4 PJ2 I/O FT_h - -
EVENTOUT
- L5 - - VDD S - - - -
TRACED11, LCD_R4,
- - - J1 PJ3 I/O FT_h - -
EVENTOUT
N1 C3 - B19 VSS S - - - -
TRACED12, LCD_R5,
- - - K2 PJ4 I/O FT_h - -
EVENTOUT
1D3 E11 - - VDDCORE S - - - -
TRACED2, HDP2, LCD_R6,
- - - K1 PJ5 I/O FT_h - -
EVENTOUT
TRACED3, HDP3, TIM8_CH2,
- - - L5 PJ6 I/O FT_h - -
LCD_R7, EVENTOUT
TRACED13, TIM8_CH2N,
- - - L4 PJ7 I/O FT_h - -
LCD_G0, EVENTOUT
- C17 C12 C3 VSS S - - - -
TIM16_CH1N, SAI1_D1,
DFSDM1_CKIN4,
DFSDM1_DATIN1,
1B1 E3 D2 L3 PD6 I/O FT_ha - SPI3_MOSI/I2S3_SDO, -
SAI1_SD_A, USART2_RX,
FMC_NWAIT, DCMI_D10,
LCD_B2, EVENTOUT
- E13 - H13 VDDCORE S - - - -
TRACED15, TIM1_CH3,
- - - L2 PJ9 I/O FT_h - TIM8_CH1N, UART8_RX, -
LCD_G2, EVENTOUT
- J5 - M6 VDD_PLL S - - - -
- J4 - M5 VSS_PLL S - - - -

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118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

TIM4_CH3, SAI3_MCLK_B,
1E1 F3 L3 M3 PD14 I/O FT_a - UART8_CTS, -
FMC_AD0/FMC_D0, EVENTOUT
TIM4_CH4, SAI3_MCLK_A,
UART8_CTS,
1C2 G1 J2 L1 PD15 I/O FT_a - -
FMC_AD1/FMC_D1, LCD_R1,
EVENTOUT
DFSDM1_CKIN3, SAI3_SCK_B,
USART3_TX, SPDIFRX_IN2,
E1 F2 K3 M1 PD8 I/O FT_a - -
FMC_AD13/FMC_D13, LCD_B7,
EVENTOUT
DFSDM1_DATIN3, SAI3_SD_B,
USART3_RX,
1C1 G3 K1 M2 PD9 I/O FT_a - FMC_AD14/FMC_D14, -
DCMI_HSYNC, LCD_B0,
EVENTOUT
- - - N8 VDD S - - - -
W1 D1 C21 C8 VSS S - - - -
- - 1A6 - VDDCORE S - - - -
1D1 H3 1F1 M4 VBAT S - - - -
- D4 - C11 VSS S - - - -
RTC_OUT2/
RTC_LSCO,
(1)
- - L4 N1 PI8 I/O FT EVENTOUT TAMP_IN2/
TAMP_OUT3,
WKUP4
RTC_OUT1/
RTC_TS/
RTC_LSCO,
(1)
G3 K3 K2 N2 PC13 I/O FT EVENTOUT TAMP_IN1/
TAMP_OUT2/
TAMP_OUT3,
WKUP3
F3 D5 D4 C19 VSS S - - - -
PC15- (1)
F2 H2 L1 P2 I/O FT EVENTOUT OSC32_OUT
OSC32_OUT
- F4 - H15 VDDCORE S - - - -
1C4 F6 1B1 - VDDCORE S - - - -
PC14- (1)
G2 H1 L2 P1 I/O FT EVENTOUT OSC32_IN
OSC32_IN
E2 J1 M3 R2 NRST I/O RST - - -
J3 J2 M4 R1 NRST_CORE I RST - - -

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STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

H3 K1 N1 N3 BOOT0 I FTPD - - -
K3 K4 N4 N4 BOOT1 I FTPD - - -
H1 L2 M2 P4 BOOT2 I FTPD - - -
H2 M1 P1 T1 PH0-OSC_IN I/O FT - EVENTOUT OSC_IN
- - - J8 VDDCORE S - - - -
PH1-
J2 M2 P2 T2 I/O FT - EVENTOUT OSC_OUT
OSC_OUT
- D8 - C20 VSS S - - - -
M2 L1 R2 V1 PWR_ON O FT - - PWR_ONLP
K1 P1 N3 U1 PWR_LP O FT - - -
PDR_ON_
K2 N1 T3 U2 I FT - - -
CORE
L3 N2 R3 V2 PDR_ON I FT - - -
- L3 1G2 N5 VDD_ANA S - - - -
- L4 1G1 P5 VSS_ANA S - - - -
DBTRGO, DBTRGI, MCO1,
L2 P2 N2 W3 PA13 I/O FT_a - BOOTFAILN
UART4_TX, EVENTOUT
DBTRGO, DBTRGI, MCO2,
L1 R1 T2 R3 PA14 I/O FT_a - -
EVENTOUT
MCO1, I2S_CKIN, LCD_G6,
- - P4 T3 PI11 I/O FT - WKUP5
EVENTOUT
HDP0,
USART3_CTS/USART3_NSS,
- - T1 W1 PI10 I/O FT - ETH1_GMII_RX_ER/ -
ETH1_MII_RX_ER,
LCD_HSYNC, EVENTOUT
- L7 1G4 - VDD S - - - -
W5 E2 F21 - VSS S - - - -
- F8 - - VDDCORE S - - - -
1F1 M4 1H1 R5 VDDA S - - - -
1F2 - - - VDDA S - - - -
M3 N3 R4 P6 VREF+ S - - - -
1G1 N4 1H2 R6 VSSA S - - - -
- P5 - T6 VSSA S - - - -
- R5 - U6 VSSA S - - - -
- M3 - N6 VREF- S - - - -

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118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

I2C3_SCL, SPI5_MISO,
ETH1_GMII_RXD3/
ETH1_MII_RXD3/
- - W4 W2 PH7 I/O FT_fh - -
ETH1_RGMII_RXD3,
MDIOS_MDC, DCMI_D9,
EVENTOUT
ETH1_GMII_TX_ER, FMC_A3,
- - U1 V3 PF3 I/O FT_vh - -
EVENTOUT
TRACECLK, DFSDM1_DATIN1,
SPI2_MOSI/I2S2_SDO, ADC1_INP13,
P3 T3 W2 U3 PC3 I/O FT_ha -
ETH1_GMII_TX_CLK/ ADC1_INN12
ETH1_MII_TX_CLK, EVENTOUT
TRACED3, TIM8_BKIN2,
DFSDM1_CKIN1,
- - T4 U4 PG3 I/O FT_vh - -
ETH1_GMII_TXD7, FMC_A13,
EVENTOUT
TRACECLK, SAI1_CK1,
I2C4_SCL, SPI4_SCK,
SAI1_MCLK_A,
QUADSPI_BK1_IO2,
P1 T1 Y1 Y2 PE2 I/O FT_favh - -
ETH1_GMII_TXD3/
ETH1_MII_TXD3/
ETH1_RGMII_TXD3, FMC_A23,
EVENTOUT
- - - N10 VDD S - - - -
- E4 H3 D4 VSS S - - - -
TIM2_CH4, TIM5_CH4,
LPTIM5_OUT, TIM15_CH2,
USART2_RX, LCD_B2, ADC1_INP15,
N2 P3 U2 T4 PA3 I/O FT_a -
ETH1_GMII_COL/ PVD_IN
ETH1_MII_COL, LCD_B5,
EVENTOUT
DFSDM1_CKIN1,
SPI2_MISO/I2S2_SDI,
DFSDM1_CKOUT,
ADC1_INP12,
P2 T2 Y2 Y1 PC2 I/O FT_avh - ETH1_GMII_TXD2/
ADC1_INN11
ETH1_MII_TXD2/
ETH1_RGMII_TXD2,
DCMI_PIXCLK, EVENTOUT
TRACED2, MCO2, TIM8_BKIN,
- - V2 W4 PG2 I/O FT_vh - ETH1_GMII_TXD6, FMC_A12, -
EVENTOUT

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STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

TRACED1, LPTIM1_ETR,
SPI6_MOSI, SAI4_D1,
USART6_TX,
QUADSPI_BK2_IO3,
R2 U1 AA1 AA2 PG14 I/O FT_vh - SAI4_SD_A, ETH1_GMII_TXD1/ -
ETH1_MII_TXD1/
ETH1_RGMII_TXD1/
ETH1_RMII_TXD1, FMC_A25,
LCD_B0, EVENTOUT
TRACED1, ETH1_GMII_TXD5,
- - W1 Y4 PG1 I/O FT_vh - -
FMC_A11, EVENTOUT
TRACED0, LPTIM1_OUT,
SAI1_CK2, SAI4_CK1,
SPI6_SCK, SAI1_SCK_A,
USART6_CTS/USART6_NSS,
SAI4_MCLK_A,
R3 U2 AA2 AA1 PG13 I/O FT_vh - -
ETH1_GMII_TXD0/
ETH1_MII_TXD0/
ETH1_RGMII_TXD0/
ETH1_RMII_TXD0, FMC_A24,
LCD_R0, EVENTOUT
ADC1_INP0,
ADC1_INN1,
- - U3 R4 ANA0 A A - -
ADC2_INP0,
ADC2_INN1
TIM2_CH1/TIM2_ETR,
TIM5_CH1, TIM8_ETR,
TIM15_BKIN,
ADC1_INP16,
N3 R3 AB3 AA3 PA0 I/O FT_ha - USART2_CTS/USART2_NSS,
WKUP1
UART4_TX, SDMMC2_CMD,
SAI2_SD_B, ETH1_GMII_CRS/
ETH1_MII_CRS, EVENTOUT
- E5 - E5 VSS S - - - -
ADC1_INP1,
- - U4 T5 ANA1 A A - -
ADC2_INP1
ETH_CLK, TIM2_CH2,
TIM5_CH2, LPTIM3_OUT,
TIM15_CH1N,
USART2_RTS/USART2_DE,
UART4_RX,
QUADSPI_BK1_IO3, ADC1_INP17,
T1 U4 AA4 V4 PA1 I/O FT_ha -
SAI2_MCLK_B, ADC1_INN16
ETH1_GMII_RX_CLK/
ETH1_MII_RX_CLK/
ETH1_RGMII_RX_CLK/
ETH1_RMII_REF_CLK, LCD_R2,
EVENTOUT

DS12501 Rev 6 67/255

118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

TIM2_CH1/TIM2_ETR, ADC1_INP19,
TIM8_CH1N, SAI4_CK1, ADC1_INN18,
1H1 P4 V3 U5 PA5 I/O TT_ha - SPI1_SCK/I2S1_CK, SPI6_SCK, ADC2_INP19,
SAI4_MCLK_A, LCD_R4, ADC2_INN18,
EVENTOUT DAC_OUT2
HDP0, TIM5_ETR, SAI4_D2,
SPI1_NSS/I2S1_WS,
ADC1_INP18,
SPI3_NSS/I2S3_WS,
1J1 R4 V4 V6 PA4 I/O TT_a - ADC2_INP18,
USART2_CK, SPI6_NSS,
DAC_OUT1
SAI4_FS_A, DCMI_HSYNC,
LCD_VSYNC, EVENTOUT
TRACED0, DFSDM1_DATIN0,
- - AC2 W5 PG0 I/O FT_vh - ETH1_GMII_TXD4, FMC_A10, -
EVENTOUT
TIM2_CH4, LPTIM2_ETR,
I2C2_SDA, DFSDM1_CKIN7,
USART3_RX,
ETH1_GMII_TX_EN/
U3 V1 AB1 Y5 PB11 I/O FT_favh - -
ETH1_MII_TX_EN/
ETH1_RGMII_TX_CTL/
ETH1_RMII_TX_EN, LCD_G5,
EVENTOUT
TIM1_BKIN2,
ETH1_GMII_GTX_CLK/
- - AB2 AB4 PG4 I/O FT_vh - -
ETH1_RGMII_GTX_CLK,
FMC_A14, EVENTOUT
TIM2_CH3, TIM5_CH3,
LPTIM4_OUT, TIM15_CH1,
USART2_TX, SAI2_SCK_B, ADC1_INP14,
T3 W2 AC3 AB2 PA2 I/O FT_ha -
SDMMC2_D0DIR, ETH1_MDIO, WKUP2
MDIOS_MDIO, LCD_R1,
EVENTOUT
1F3 M6 - - VDD S - - - -
TRACED0, SAI1_D1,
ADC1_INP11,
DFSDM1_DATIN0,
ADC1_INN10,
DFSDM1_CKIN4,
ADC2_INP11,
T2 V2 AA6 AB3 PC1 I/O FT_ha - SPI2_MOSI/I2S2_SDO,
ADC2_INN10,
SAI1_SD_A, SDMMC2_CK,
TAMP_IN3,
ETH1_MDC, MDIOS_MDC,
WKUP6
EVENTOUT
A6 - K21 E19 VSS S - - - -
TIM1_ETR,
ETH1_GMII_CLK125/
- - Y6 U8 PG5 I/O FT - -
ETH1_RGMII_CLK125,
FMC_A15, EVENTOUT
- F10 1B3 J10 VDDCORE S - - - -

68/255 DS12501 Rev 6

STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

DFSDM1_CKIN4,
QUADSPI_BK2_IO1,
SAI2_MCLK_B,
- - AA3 Y6 PH3 I/O FT_h - -
ETH1_GMII_COL/
ETH1_MII_COL, LCD_R1,
EVENTOUT
TIM1_CH2N, TIM3_CH3,
TIM8_CH2N, DFSDM1_CKOUT,
UART4_CTS, LCD_R3, ADC1_INP9,
ETH1_GMII_RXD2/ ADC1_INN5,
U2 W3 AB6 AB5 PB0 I/O FT_a -
ETH1_MII_RXD2/ ADC2_INP9,
ETH1_RGMII_RXD2, ADC2_INN5
MDIOS_MDIO, LCD_G1,
EVENTOUT
TRACED7, I2C4_SDA,
- - Y4 W6 PF15 I/O FT_fh - I2C1_SDA, ETH1_GMII_RXD7, -
FMC_A9, EVENTOUT
TIM1_CH3N, TIM3_CH4,
TIM8_CH3N, DFSDM1_DATIN1,
LCD_R6, ETH1_GMII_RXD3/
ADC1_INP5,
U1 V3 AA7 AA5 PB1 I/O FT_a - ETH1_MII_RXD3/
ADC2_INP5
ETH1_RGMII_RXD3,
MDIOS_MDC, LCD_G0,
EVENTOUT
- E6 - F6 VSS S - - - -
TRACED6, DFSDM1_CKIN6,
I2C4_SCL, I2C1_SCL, ADC2_INP6,
- - AC4 V7 PF14 I/O FT_fha -
ETH1_GMII_RXD6, FMC_A8, ADC2_INN2
EVENTOUT
TRACED5, DFSDM1_DATIN6,
I2C4_SMBA, I2C1_SMBA,
- - Y5 W7 PF13 I/O FT_ha - DFSDM1_DATIN3, ADC2_INP2
ETH1_GMII_RXD5, FMC_A7,
EVENTOUT
LPTIM1_IN2,
QUADSPI_BK2_IO0,
- - AB4 AB7 PH2 I/O FT_h - SAI2_SCK_B, ETH1_GMII_CRS/ -
ETH1_MII_CRS, LCD_R0,
EVENTOUT
SAI1_D3, DFSDM1_DATIN2,
SAI4_D4, SAI1_D4,
SPDIFRX_IN4, ADC1_INP8,
ETH1_GMII_RXD1/ ADC1_INN4,
V1 V4 AB7 AA6 PC5 I/O FT_a -
ETH1_MII_RXD1/ ADC2_INP8,
ETH1_RGMII_RXD1/ ADC2_INN4
ETH1_RMII_RXD1, SAI4_D3,
EVENTOUT

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118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

DFSDM1_CKIN2, I2S1_MCK,
SPDIFRX_IN3,
ETH1_GMII_RXD0/ ADC1_INP4,
V2 W4 AC7 AB6 PC4 I/O FT_a -
ETH1_MII_RXD0/ ADC2_INP4
ETH1_RGMII_RXD0/
ETH1_RMII_RXD0, EVENTOUT
- M8 - P9 VDD S - - - -
1D2 E8 P3 F7 VSS S - - - -
1J3 R7 1J2 U9 VDD S - - - -
TRACED4, ETH1_GMII_RXD4, ADC1_INP6,
- - Y9 V8 PF12 I/O FT_ha -
FMC_A6, EVENTOUT ADC1_INN2
1E4 - - - VDDCORE S - - - -
SPI5_MOSI, SAI2_SD_B,
W4 U5 Y10 W8 PF11 I/O FT_ha - DCMI_D12, LCD_G5, ADC1_INP2
EVENTOUT
- E10 - F8 VSS S - - - -
TIM1_CH1N, TIM3_CH2,
TIM8_CH1N, SAI4_D1,
SPI1_MOSI/I2S1_SDO,
SPI6_MOSI, TIM14_CH1, ADC1_INP7,
QUADSPI_CLK, ADC1_INN3,
W2 T6 AB8 Y9 PA7 I/O FT_ha -
ETH1_GMII_RX_DV/ ADC2_INP7,
ETH1_MII_RX_DV/ ADC2_INN3
ETH1_RGMII_RX_CTL/
ETH1_RMII_CRS_DV,
SAI4_SD_A, EVENTOUT
- F12 - J12 VDDCORE S - - - -
TIM1_BKIN, TIM3_CH1,
TIM8_BKIN, SAI4_CK2,
SPI1_MISO/I2S1_SDI,
ADC1_INP3,
W3 T5 AC8 W9 PA6 I/O FT_ha - SPI6_MISO, TIM13_CH1,
ADC2_INP3
MDIOS_MDC, SAI4_SCK_A,
DCMI_PIXCLK, LCD_G2,
EVENTOUT
- - 1H3 - VDD S - - - -
DFSDM1_CKIN0, LPTIM2_IN2,
DFSDM1_DATIN4, SAI2_FS_B, ADC1_INP10,
U4 T7 AB5 U10 PC0 I/O FT_ha -
QUADSPI_BK2_NCS, LCD_R5, ADC2_INP10
EVENTOUT
1G2 E12 P21 F16 VSS S - - - -

70/255 DS12501 Rev 6

STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

TIM2_CH3, LPTIM2_IN1,
I2C2_SCL, SPI2_SCK/I2S2_CK,
DFSDM1_DATIN7, USART3_TX,
U5 W5 Y3 V9 PB10 I/O FT_fha - QUADSPI_BK1_NCS, -
ETH1_GMII_RX_ER/
ETH1_MII_RX_ER, LCD_G4,
EVENTOUT
- - 1B5 - VDDCORE S - - - -
TIM1_BKIN, I2C6_SMBA,
I2C2_SMBA,
SPI2_NSS/I2S2_WS,
DFSDM1_DATIN1, USART3_CK,
V3 V5 AC5 AA7 PB12 I/O FT_avh - USART3_RX, ETH1_GMII_TXD0/ -
ETH1_MII_TXD0/
ETH1_RGMII_TXD0/
ETH1_RMII_TXD0, UART5_RX,
EVENTOUT
- G5 - J14 VDDCORE S - - - -
TIM1_CH1N, DFSDM1_CKOUT,
LPTIM2_OUT,
SPI2_SCK/I2S2_CK,
DFSDM1_CKIN1,
USART3_CTS/USART3_NSS,
1J2 T9 AA10 V10 PB13 I/O FT_vh - -
ETH1_GMII_TXD1/
ETH1_MII_TXD1/
ETH1_RGMII_TXD1/
ETH1_RMII_TXD1, UART5_TX,
EVENTOUT
- E14 V21 F20 VSS S - - - -
ETH_CLK, TIM17_BKIN,
TIM3_CH2, SAI4_D1,
I2C1_SMBA,
SPI1_MOSI/I2S1_SDO,
I2C4_SMBA,
V5 T8 Y8 AA8 PB5 I/O FT_vh - -
SPI3_MOSI/I2S3_SDO,
SPI6_MOSI, SAI4_SD_A,
ETH1_PPS_OUT, UART5_RX,
DCMI_D10, LCD_G7,
EVENTOUT
TRACED11, USART1_TX,
UART4_TX, SPDIFRX_IN1,
ETH1_GMII_TX_EN/
U6 V6 Y7 U11 PG11 I/O FT_vh - ETH1_MII_TX_EN/ -
ETH1_RGMII_TX_CTL/
ETH1_RMII_TX_EN, DCMI_D3,
LCD_B3, EVENTOUT

DS12501 Rev 6 71/255

118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

1B5 G7 1C2 - VDDCORE S - - - -

TIM12_CH1, I2C2_SMBA,
SPI5_SCK, ETH1_GMII_RXD2/
ETH1_MII_RXD2/
- - Y11 V11 PH6 I/O FT_h - -
ETH1_RGMII_RXD2,
MDIOS_MDIO, DCMI_D8,
EVENTOUT
1H2 E16 - G4 VSS S - - - -
HDP6, TIM16_CH1, TIM4_CH3,
DFSDM1_CKIN7, I2C1_SCL,
SDMMC1_CKIN, I2C4_SCL,
SDMMC2_CKIN, UART4_RX,
SDMMC2_D4,
V4 W6 AB10 AB8 PB8 I/O FT_favh - -
ETH1_GMII_TXD3/
ETH1_MII_TXD3/
ETH1_RGMII_TXD3,
SDMMC1_D4, DCMI_D6,
LCD_B6, EVENTOUT
- - - K9 VDDCORE S - - - -
TRACED15,
TIM2_CH1/TIM2_ETR,
ETH_CLK, TIM8_ETR,
SPI6_NSS, SAI4_D2,
V6 U7 AB9 Y8 PG8 I/O FT_vh - USART6_RTS/USART6_DE, -
USART3_RTS/USART3_DE,
SPDIFRX_IN3, SAI4_FS_A,
ETH1_PPS_OUT, LCD_G7,
EVENTOUT
- N5 - P11 VDD S - - - -
TRACED10, UART8_CTS,
LCD_G3, SAI2_SD_B,
U7 V7 AB11 AA9 PG10 I/O FT_h - -
QUADSPI_BK2_IO2, FMC_NE3,
DCMI_D2, LCD_B2, EVENTOUT
- F5 W3 - VSS S - - - -
TIM1_CH1, DFSDM1_CKOUT,
UART7_RTS/UART7_DE,
1J4 W7 AA9 W11 PE9 I/O FT_ha - -
QUADSPI_BK2_IO2,
FMC_AD6/FMC_D6, EVENTOUT
- G9 - - VDDCORE S - - - -
TIM1_ETR, TIM3_ETR,
DFSDM1_DATIN2, UART7_RX,
V7 T10 AA11 W10 PE7 I/O FT_h - -
QUADSPI_BK2_IO0,
FMC_AD4/FMC_D4, EVENTOUT
1C3 F7 - G6 VSS S - - - -

72/255 DS12501 Rev 6

STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

LPTIM2_IN2, I2C4_SMBA,
I2C1_SMBA,
USART3_CTS/USART3_NSS,
U8 V8 AC10 AB9 PD11 I/O FT_h - QUADSPI_BK1_IO0, -
SAI2_SD_A,
FMC_A16/FMC_CLE,
EVENTOUT
1D5 G11 1C4 - VDDCORE S - - - -
TIM17_CH1, SPI5_SCK,
W7 W8 AB12 AA10 PF7 I/O FT_ha - SAI1_MCLK_B, UART7_TX, -
QUADSPI_BK1_IO2, EVENTOUT
TRACED12, TIM16_CH1N,
SPI5_MISO, SAI1_SCK_B,
V8 U10 AC11 AB10 PF8 I/O FT_ha - UART7_RTS/UART7_DE, -
TIM13_CH1,
QUADSPI_BK1_IO0, EVENTOUT
- - - K11 VDDCORE S - - - -
TIM16_BKIN, SAI1_D3, SAI4_D4,
SAI1_D4, QUADSPI_CLK,
1J7 U9 Y12 V12 PF10 I/O FT_h - -
SAI4_D3, DCMI_D11, LCD_DE,
EVENTOUT
- F9 AA5 G8 VSS S - - - -
TIM16_CH1, SPI5_NSS,
SAI1_SD_B, UART7_RX,
U10 V9 AA13 AA11 PF6 I/O FT_ha - -
QUADSPI_BK1_IO3,
SAI4_SCK_B, EVENTOUT
- H4 - - VDDCORE S - - - -
LPTIM1_IN1, TIM4_CH1,
LPTIM2_IN1, I2C4_SCL,
I2C1_SCL,
USART3_RTS/USART3_DE,
U14 U11 Y18 W12 PD12 I/O FT_fha - -
QUADSPI_BK1_IO1,
SAI2_FS_A,
FMC_A17/FMC_ALE,
EVENTOUT
- F11 AA8 G10 VSS S - - - -
TRACED13, TIM17_CH1N,
SPI5_MOSI, SAI1_FS_B,
V9 W9 AA14 AB11 PF9 I/O FT_ha - -
UART7_CTS, TIM14_CH1,
QUADSPI_BK1_IO1, EVENTOUT
- H6 1C6 K13 VDDCORE S - - - -

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118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

TRACED5, SAI1_MCLK_A,
USART6_CK,
UART8_RTS/UART8_DE,
V11 W10 AC14 Y11 PG7 I/O FT_h - -
QUADSPI_CLK,
QUADSPI_BK2_IO3, DCMI_D13,
LCD_CLK, EVENTOUT
1E3 F15 - G12 VSS S - - - -
1F5 - - - VDDCORE S - - - -
TIM16_CH1N, TIM4_CH1,
I2C1_SCL, CEC, I2C4_SCL,
USART1_TX,
W11 T12 Y14 W13 PB6 I/O FT_fha - -
QUADSPI_BK1_NCS,
DFSDM1_DATIN5, UART5_TX,
DCMI_D5, EVENTOUT
TIM1_CH1N, DFSDM1_CKIN2,
U12 T11 AC13 Y12 PE8 I/O FT_h - UART7_TX, QUADSPI_BK2_IO1, -
FMC_AD5/FMC_D5, EVENTOUT
TIM1_CH2N, DFSDM1_DATIN4,
UART7_CTS,
V12 V10 Y15 W14 PE10 I/O FT_ha - -
QUADSPI_BK2_IO3,
FMC_AD7/FMC_D7, EVENTOUT
- H8 1D1 K15 VDDCORE S - - - -
TRACED4, RTC_OUT2,
SAI1_D1, DFSDM1_CKIN1,
USART1_RX, I2S_CKIN,
V13 T13 Y16 V13 PB2 I/O FT_ha - SAI1_SD_A, -
SPI3_MOSI/I2S3_SDO,
UART4_RX, QUADSPI_CLK,
EVENTOUT
- H10 - - VDDCORE S - - - -
LPTIM1_OUT, TIM4_CH2,
I2C4_SDA, I2C1_SDA,
U13 U12 AA19 V14 PD13 I/O FT_fha - I2S3_MCK, QUADSPI_BK1_IO3, -
SAI2_SCK_A, FMC_A18,
EVENTOUT
- N7 - - VDD S - - - -
- G2 AA12 G14 VSS S - - - -
1J8 V16 AB18 AA17 USB_RREF A A - - -
VDD3V3_
- W12 AA15 AB13 S - - - -
USBHS
VDD3V3_
1H7 - - - S - - - -
USB
USBH_HS_DP2,
V10 W13 AC16 AB14 USB_DP2 A FT_u - -
OTG_HS_DP

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STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

USBH_HS_DM2,
W10 V13 AB16 AA14 USB_DM2 A FT_u - -
OTG_HS_DM
- U13 AA16 Y13 VSS_USBHS S - - - -
- - - Y14 VSS_USBHS S - - - -
BYPASS_
U11 T15 AB13 AA12 I FT - - -
REG1V8
DBTRGO, USART6_RX,
SPDIFRX_IN4,
QUADSPI_BK2_IO2,
W8 T14 Y13 W15 PG9 I/O FT_h - SAI2_FS_B, -
FMC_NE2/FMC_NCE,
DCMI_VSYNC, LCD_R1,
EVENTOUT
1G3 - 1H5 R10 VDD S - - - -
- N9 - - VDD S - - - -
VDDA1V8_
1H5 V11 AB14 AB12 S - - - -
REG
1H3 - - G17 VSS S - - - -
VDDA1V1_
1J6 W11 AB15 AB17 S - - - -
REG
- G4 AA21 H7 VSS S - - - -
- - - R12 VDD S - - - -
- P6 - - VDD S - - - -
- U14 - Y15 VSS_USBHS S - - - -
- V12 - AA13 VSS_USBHS S - - - -
1D4 G6 AC1 J9 VSS S - - - -
- V15 - AA16 VSS_USBHS S - - - -
W14 W14 AB17 AB15 USB_DM1 A FT_u - - USBH_HS_DM1
V14 V14 AC17 AA15 USB_DP1 A FT_u - - USBH_HS_DP1
TIM1_ETR, I2C6_SDA,
I2C5_SDA, UART4_TX,
V15 U16 AB19 W16 PA12 I/O FT_uf - USART1_RTS/USART1_DE, OTG_FS_DP
SAI2_FS_B, LCD_R5,
EVENTOUT
- G8 - J11 VSS S - - - -
- - - L8 VDDCORE S - - - -

DS12501 Rev 6 75/255

118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

TIM1_CH4, I2C6_SCL,
I2C5_SCL, SPI2_NSS/I2S2_WS,
U15 V17 AA18 Y16 PA11 I/O FT_uf - UART4_RX, OTG_FS_DM
USART1_CTS/USART1_NSS,
LCD_R4, EVENTOUT
1C6 H12 1D3 - VDDCORE S - - - -
1F4 G10 AC23 - VSS S - - - -
VDD3V3_
- W15 AA17 AB16 S - - - -
USBFS
OTG_FS_VBUS,
V16 U15 AC19 V15 OTG_VBUS A FT_u - -
OTG_HS_VBUS
TIM1_CH3, SPI3_NSS/I2S3_WS,
USART1_RX, MDIOS_MDIO, OTG_FS_ID,
U16 T16 Y17 Y17 PA10 I/O FT_u -
SAI4_FS_B, DCMI_D1, LCD_B1, OTG_HS_ID
EVENTOUT
- - AB20 AB20 DDR_DQ27 I/O DDR - - -
1B9 E15 1A8 E18 VDDQ_DDR S - - - -
- - AB21 AB21 DDR_DQ26 I/O DDR - - -
- G12 - J13 VSS S - - - -
- - AC22 AA21 DDR_DQ28 I/O DDR - - -
1H4 G14 1A3 J17 VSS S - - - -
- - AC21 AA20 DDR_DQ29 I/O DDR - - -
- - Y22 W20 DDR_DQ25 I/O DDR - - -
- - AB22 Y21 DDR_DQS3P I/O DDR - - -
- H5 - J20 VSS S - - - -
- - AB23 Y22 DDR_DQS3N I/O DDR - - -
- - - F17 VDDQ_DDR S - - - -
- - AA20 AA22 DDR_DQM3 O DDR - - -
- F14 1B7 - VDDQ_DDR S - - - -
- - AA22 W21 DDR_DQ31 I/O DDR - - -
- H7 1A5 K3 VSS S - - - -
- - AA23 W22 DDR_DQ30 I/O DDR - - -
U9 H9 1A7 K7 VSS S - - - -
- - Y23 V22 DDR_DQ24 I/O DDR - - -
- - - G16 VDDQ_DDR S - - - -
- - - L10 VDDCORE S - - - -

76/255 DS12501 Rev 6

STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

W16 W16 AC20 AB19 DDR_VREF A A - - -

- H11 - K10 VSS S - - - -
W17 W18 W23 V20 DDR_DQ12 I/O DDR - - -
1C5 H13 1B2 K12 VSS S - - - -
V17 W17 Y21 V21 DDR_DQ15 I/O DDR - - -
- H15 - K14 VSS S - - - -
U17 V18 W22 U21 DDR_DQ14 I/O DDR - - -
W18 V19 W21 T20 DDR_DQ11 I/O DDR - - -
- G15 1B9 H17 VDDQ_DDR S - - - -
V19 U19 U22 T22 DDR_DQS1P I/O DDR - - -
1E5 - 1B4 L9 VSS S - - - -
U18 T19 U23 R22 DDR_DQS1N I/O DDR - - -
V18 U18 V22 T21 DDR_DQM1 O DDR - - -
1D9 - - J16 VDDQ_DDR S - - - -
T18 T18 T23 R20 DDR_DQ13 I/O DDR - - -
- J3 1B6 - VSS S - - - -
U19 T17 U21 R21 DDR_DQ9 I/O DDR - - -
1G5 J6 - L11 VSS S - - - -
T19 R18 T22 P21 DDR_DQ10 I/O DDR - - -
- H14 - - VDDQ_DDR S - - - -
R18 P18 T21 N22 DDR_DQ8 I/O DDR - - -
- J8 1B8 L13 VSS S - - - -
1J5 J10 - L17 VSS S - - - -
1F8 N19 Y19 AA19 DDR_ATO A A - - -
- J7 - - VDDCORE S - - - -
- - 1C8 - VDDQ_DDR S - - - -
1G9 N16 W20 U19 DDR_A6 O DDR - - -
- - - K17 VDDQ_DDR S - - - -
T17 R17 Y20 U18 DDR_A8 O DDR - - -
- J12 1C1 L19 VSS S - - - -
R17 P17 V20 T18 DDR_A4 O DDR - - -
1A6 J14 1C3 L20 VSS S - - - -

DS12501 Rev 6 77/255

118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

P17 P19 T20 R19 DDR_CKE O DDR - - -

P18 N17 U20 R18 DDR_BA1 O DDR - - -
- J15 - L16 VDDQ_DDR S - - - -
N18 N18 R21 P18 DDR_A14 O DDR - - -
- K2 - M7 VSS S - - - -
N19 M18 R20 P19 DDR_A11 O DDR - - -
- K5 1C5 M10 VSS S - - - -
1D6 K7 - M12 VSS S - - - -
M17 M19 R22 N18 DDR_A10 O DDR - - -
- J9 1D5 L12 VDDCORE S - - - -
- - 1D9 - VDDQ_DDR S - - - -
M18 L17 P23 N19 DDR_A12 O DDR - - -
M19 M17 P22 M18 DDR_A1 O DDR - - -
- K9 1C7 M14 VSS S - - - -
J19 K17 N20 M22 DDR_CASN O DDR - - -
1F6 K11 - N9 VSS S - - - -
J18 J17 M20 M21 DDR_WEN O DDR - - -
- K14 - M17 VDDQ_DDR S - - - -
1E9 L18 N21 M20 DDR_RASN O DDR - - -
L17 L19 N22 N20 DDR_CLKP O DDR - - -
- K13 1C9 - VSS S - - - -
K18 K19 N23 N21 DDR_CLKN O DDR - - -
1F9 - 1E8 N16 VDDQ_DDR S - - - -
1D8 K18 K20 L22 DDR_DTO0 O DDR - - -
1C8 J19 L21 K21 DDR_DTO1 O DDR - - -
L18 L16 P20 M19 DDR_A15 O DDR - - -
1H6 - 1D2 N11 VSS S - - - -
1E6 - - - VDDCORE S - - - -
- K15 - N13 VSS S - - - -
J17 J18 M22 L18 DDR_CSN O DDR - - -
H18 H19 L22 L21 DDR_ODT O DDR - - -
H17 J16 M21 K18 DDR_BA2 O DDR - - -

78/255 DS12501 Rev 6

STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

1C7 L6 1D4 N17 VSS S - - - -

G18 H18 L20 K19 DDR_A0 O DDR - - -
- L15 - P17 VDDQ_DDR S - - - -
G19 G19 L23 K20 DDR_BA0 O DDR - - -
E17 F17 F20 G18 DDR_A13 O DDR - - -
- L8 - P3 VSS S - - - -
F17 G18 J20 J18 DDR_A2 O DDR - - -
1E7 L10 1D6 P7 VSS S - - - -
F19 F19 K22 J19 DDR_A3 O DDR - - -
- - 1F9 - VDDQ_DDR S - - - -
DDR_
C16 G16 D20 F19 O DDR - - -
RESETN
- M14 - R16 VDDQ_DDR S - - - -
1C9 H17 H20 H19 DDR_A5 O DDR - - -
- L12 1D8 P10 VSS S - - - -
1A9 E17 E20 F18 DDR_A7 O DDR - - -
- L14 - P12 VSS S - - - -
1A8 F18 K23 K22 DDR_ZQ A A - - -
E18 G17 G20 H18 DDR_A9 O DDR - - -
1G7 M5 1E1 P14 VSS S - - - -
- J11 1D7 L14 VDDCORE S - - - -
D18 E18 J21 J21 DDR_DQ4 I/O DDR - - -
- M7 - P20 VSS S - - - -
D19 D17 J22 H20 DDR_DQ5 I/O DDR - - -
W13 M9 1E3 - VSS S - - - -
C18 D18 H21 H21 DDR_DQ2 I/O DDR - - -
- - - T17 VDDQ_DDR S - - - -
C19 D19 H22 H22 DDR_DQ6 I/O DDR - - -
- - 1G8 - VDDQ_DDR S - - - -
B19 C19 G22 G22 DDR_DQS0P I/O DDR - - -
- M11 - R8 VSS S - - - -
B18 B19 G23 G21 DDR_DQS0N I/O DDR - - -

DS12501 Rev 6 79/255

118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

- N15 - - VDDQ_DDR S - - - -
C17 C18 H23 G20 DDR_DQM0 O DDR - - -
1H9 - - U16 VDDQ_DDR S - - - -
B17 B18 G21 G19 DDR_DQ7 I/O DDR - - -
1B8 M13 1E5 R17 VSS S - - - -
A18 A18 F22 F21 DDR_DQ1 I/O DDR - - -
- M15 1E7 T7 VSS S - - - -
A17 A17 E22 E21 DDR_DQ0 I/O DDR - - -
B16 B17 E21 E20 DDR_DQ3 I/O DDR - - -
- P14 1H9 V17 VDDQ_DDR S - - - -
1H8 - - T9 VSS S - - - -
- J13 - - VDDCORE S - - - -
- - E23 E22 DDR_DQ21 I/O DDR - - -
- N6 1E9 T11 VSS S - - - -
- - D21 D20 DDR_DQ22 I/O DDR - - -
C14 N8 - T19 VSS S - - - -
- - D22 D21 DDR_DQ17 I/O DDR - - -
- - D23 D22 DDR_DQ18 I/O DDR - - -
- - - W18 VDDQ_DDR S - - - -
- - C22 C21 DDR_DQS2P I/O DDR - - -
- N10 1F2 U7 VSS S - - - -
- - B23 B22 DDR_DQS2N I/O DDR - - -
- R15 1J8 - VDDQ_DDR S - - - -
- - C23 C22 DDR_DQM2 O DDR - - -
- - - Y19 VDDQ_DDR S - - - -
- - B22 B21 DDR_DQ16 I/O DDR - - -
- N12 1F4 U13 VSS S - - - -
- - A22 A21 DDR_DQ23 I/O DDR - - -
1J9 N14 - U15 VSS S - - - -
- - B21 B20 DDR_DQ19 I/O DDR - - -
- - A21 A20 DDR_DQ20 I/O DDR - - -
- - 1J4 - VDD S - - - -

80/255 DS12501 Rev 6

STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

- P7 1F6 - VSS S - - - -
- - - M11 VDDCORE S - - - -
C15 D15 C20 E17 JTMS-SWDIO I/O FTU - - -
A16 D16 B20 D17 JTCK-SWCLK I FTD - - -
JTDO-
A15 D14 A19 E16 O FTU - - -
TRACESWO
B15 D13 A20 D16 JTDI I FTU - - -
1G6 K8 1E2 - VDDCORE S - - - -
B14 D12 B19 E15 NJTRST I FTU - - -
- G13 - D18 VDD_PLL2 S - - - -
- F13 - D19 VSS_PLL2 S - - - -
VDDA1V8_Un
1B6 B12 C14 B14 S - - - -
used
- C12 C16 C14 VSS S - - - -
- C13 - C15 VSS S - - - -
A13 B15 B17 B17 DNU DNU - - - -
B13 A15 A17 A17 DNU DNU - - - -
VDD1V2_Unus
1B7 A16 C17 A18 S - - - -
ed
B12 A14 A16 A16 DNU DNU - - - -
A12 B14 B16 B16 DNU DNU - - - -
- C14 - C16 VSS S - - - -
- C15 - C17 VSS S - - - -
- C16 - C18 VSS S - - - -
B11 B13 C15 B15 DNU DNU - - - -
C12 A13 B15 A15 DNU DNU - - - -
- P8 - T13 VDD S - - - -
C13 A12 B18 A14 VDD_Unused S - - - -
VDD1V2_Unus
1A7 B16 C18 B18 S - - - -
ed
D17 P9 - U17 VSS S - - - -

DS12501 Rev 6 81/255

118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

TRACED3, DFSDM1_DATIN5,
SPI3_MISO/I2S3_SDI,
USART3_RX, UART4_RX,
C11 A11 D16 D15 PC11 I/O FT_ha - -
QUADSPI_BK2_NCS,
SAI4_SCK_B, SDMMC1_D3,
DCMI_D4, EVENTOUT
- K10 - - VDDCORE S - - - -
TRACED1, SAI1_D2,
DFSDM1_DATIN3, TIM15_CH1N,
SPI4_NSS, SAI1_FS_A,
A10 B11 D19 F15 PE4 I/O FT_h - SDMMC2_CKIN, -
SDMMC1_CKIN, SDMMC2_D4,
SDMMC1_D4, FMC_A20,
DCMI_D4, LCD_B0, EVENTOUT
- - - M13 VDDCORE S - - - -
TRACED0, TIM3_CH3,
TIM8_CH3, UART4_TX,
USART6_CK,
A9 C11 D18 E14 PC8 I/O FT_ha - -
UART5_RTS/UART5_DE,
SDMMC1_D0, DCMI_D2,
EVENTOUT
- P11 1F8 U20 VSS S - - - -
TRACED2, DFSDM1_CKIN5,
SPI3_SCK/I2S3_CK,
USART3_TX, UART4_TX,
B10 D11 D15 F14 PC10 I/O FT_ha - -
QUADSPI_BK1_IO1,
SAI4_MCLK_B, SDMMC1_D2,
DCMI_D8, LCD_R2, EVENTOUT
1D7 K12 1E4 - VDDCORE S - - - -
TRACED8, TIM16_BKIN,
TIM3_CH1, SAI4_CK2,
SPI1_MISO/I2S1_SDI,
SPI3_MISO/I2S3_SDI,
B6 B9 B13 C13 PB4 I/O FT_ha - -
SPI2_NSS/I2S2_WS,
SPI6_MISO, SDMMC2_D3,
SAI4_SCK_A, UART7_TX,
EVENTOUT
TRACED1, TIM3_CH4,
TIM8_CH4, I2C3_SDA,
I2S_CKIN, UART5_CTS,
B9 A10 D17 D14 PC9 I/O FT_fh - -
QUADSPI_BK1_IO0,
SDMMC1_D1, DCMI_D3,
LCD_B2, EVENTOUT
G17 P13 1G3 V5 VSS S - - - -

82/255 DS12501 Rev 6

STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

HDP4, TIM3_CH2, TIM8_CH2,

DFSDM1_DATIN3, I2S3_MCK,
USART6_RX,
C10 A9 B11 D13 PC7 I/O FT_ha - SDMMC1_D123DIR, -
SDMMC2_D123DIR,
SDMMC2_D7, SDMMC1_D7,
DCMI_D1, LCD_G6, EVENTOUT
- L9 - M15 VDDCORE S - - - -
HDP1, TIM3_CH1, TIM8_CH1,
DFSDM1_CKIN3, I2S2_MCK,
USART6_TX, SDMMC1_D0DIR,
A4 D10 B14 E13 PC6 I/O FT_ha - -
SDMMC2_D0DIR, SDMMC2_D6,
SDMMC1_D6, DCMI_D0,
LCD_HSYNC, EVENTOUT
I2C2_SMBA, SDMMC2_D0DIR,
SDMMC3_D0DIR,
- - A14 F13 PF2 I/O FT_h - -
SDMMC1_D0DIR, FMC_A2,
EVENTOUT
TIM3_ETR, I2C5_SMBA,
UART4_RX, UART5_RX,
1A5 B10 D12 D12 PD2 I/O FT_ha - -
SDMMC1_CMD, DCMI_D11,
EVENTOUT
1G4 P10 - - VDD S - - - -
- P15 - V16 VSS S - - - -
- - 1E6 - VDDCORE S - - - -
MCO1, TIM1_CH1, TIM8_BKIN2,
I2C3_SCL,
SPI3_MOSI/I2S3_SDO,
USART1_CK, SDMMC2_CKIN,
B8 B8 A13 B13 PA8 I/O FT_fh - -
SDMMC2_D4,
OTG_FS_SOF/OTG_HS_SOF,
SAI4_SD_B, UART7_RX,
LCD_R6, EVENTOUT
TIM1_CH2N, TIM12_CH1,
TIM8_CH2N, USART1_TX,
SPI2_MISO/I2S2_SDI,
1A4 C9 C13 A13 PB14 I/O FT_h - -
DFSDM1_DATIN2,
USART3_RTS/USART3_DE,
SDMMC2_D0, EVENTOUT
TRACECLK, MCO2, SAI4_D3,
SPI3_MOSI/I2S3_SDO,
1B4 C10 D13 E12 PC12 I/O FT_h - USART3_CK, UART5_TX, -
SAI4_SD_B, SDMMC1_CK,
DCMI_D9, EVENTOUT
K17 R2 1G5 V18 VSS S - - - -

DS12501 Rev 6 83/255

118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

RTC_REFIN, TIM1_CH3N,
TIM12_CH2, TIM8_CH3N,
USART1_RX,
C8 A8 B12 B12 PB15 I/O FT_h - -
SPI2_MOSI/I2S2_SDO,
DFSDM1_CKIN2, SDMMC2_D1,
EVENTOUT
- L11 - N12 VDDCORE S - - - -
TRACED3, SAI1_CK2,
DFSDM1_CKIN3, TIM15_CH1,
SPI4_MISO, SAI1_SCK_A,
B7 B7 C11 C12 PE5 I/O FT_h - SDMMC2_D0DIR, -
SDMMC1_D0DIR, SDMMC2_D6,
SDMMC1_D6, FMC_A21,
DCMI_D6, LCD_G0, EVENTOUT
- - - U12 VDD S - - - -
TRACED9, TIM2_CH2,
SAI4_CK1, SPI1_SCK/I2S1_CK,
C7 A7 A11 A12 PB3 I/O FT_h - SPI3_SCK/I2S3_CK, SPI6_SCK, -
SDMMC2_D2, SAI4_MCLK_A,
UART7_RX, EVENTOUT
- R6 - V19 VSS S - - - -
TRACED14, TIM17_BKIN,
B5 A6 A10 D11 PG6 I/O FT_h - SDMMC2_CMD, DCMI_D12, -
LCD_R7, EVENTOUT
1F7 - - - VDDCORE S - - - -
HDP5, DFSDM1_CKOUT,
SPI2_SCK/I2S2_CK,
DFSDM1_DATIN0,
USART2_CTS/USART2_NSS,
A7 C6 D14 B11 PD3 I/O FT_h - SDMMC1_D123DIR, -
SDMMC2_D7,
SDMMC2_D123DIR,
SDMMC1_D7, FMC_CLK,
DCMI_D5, LCD_G7, EVENTOUT
HDP7, TIM17_CH1, TIM4_CH4,
DFSDM1_DATIN7, I2C1_SDA,
SPI2_NSS/I2S2_WS, I2C4_SDA,
C9 D9 B10 F12 PB9 I/O FT_fh - SDMMC2_CDIR, UART4_TX, -
SDMMC2_D5, SDMMC1_CDIR,
SDMMC1_D5, DCMI_D7,
LCD_B7, EVENTOUT

84/255 DS12501 Rev 6

STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

DBTRGI, TIM2_CH1/TIM2_ETR,
SAI4_D2, SDMMC1_CDIR, CEC,
SPI1_NSS/I2S1_WS,
SPI3_NSS/I2S3_WS, SPI6_NSS,
B4 C7 C19 E11 PA15 I/O FT_h - UART4_RTS/UART4_DE, -
SDMMC2_D5, SDMMC2_CDIR,
SDMMC1_D5, SAI4_FS_A,
UART7_TX, LCD_R1,
EVENTOUT
N17 - 1G7 W17 VSS S - - - -
TIM1_CH2, I2C3_SMBA,
SPI2_SCK/I2S2_CK,
C6 C8 A8 A11 PA9 I/O FT_h - USART1_TX, SDMMC2_CDIR, -
SDMMC2_D5, DCMI_D0,
LCD_R5, EVENTOUT
TIM17_CH1N, TIM4_CH2,
I2C1_SDA, I2C4_SDA,
A3 B5 D11 F11 PB7 I/O FT_fh - USART1_RX, SDMMC2_D1, -
DFSDM1_CKIN5, FMC_NL,
DCMI_VSYNC, EVENTOUT
- L13 1F5 N14 VDDCORE S - - - -
I2C6_SCL, DFSDM1_DATIN6,
I2C5_SCL, SAI3_SD_A,
A2 A4 B9 B10 PD1 I/O FT_fh - UART4_TX, SDMMC3_D0, -
DFSDM1_CKIN7,
FMC_AD3/FMC_D3, EVENTOUT
- R9 1J6 - VDD S - - - -
I2C6_SDA, DFSDM1_CKIN6,
I2C5_SDA, SAI3_SCK_A,
C5 A3 B8 C10 PD0 I/O FT_fh - UART4_RX, SDMMC3_CMD, -
DFSDM1_DATIN7,
FMC_AD2/FMC_D2, EVENTOUT
- R8 - W19 VSS S - - - -
TRACED0, TIM15_BKIN,
1A3 A5 C9 A10 PE3 I/O FT_h - SAI1_SD_B, SDMMC2_CK, -
FMC_A19, EVENTOUT
USART2_TX, SDMMC3_D2,
C4 D7 A7 A9 PD5 I/O FT_h - -
FMC_NWE, EVENTOUT
TRACED6, DFSDM1_DATIN4,
I2C2_SCL, DFSDM1_CKIN1,
B3 B4 D10 F10 PD7 I/O FT_fh - USART2_CK, SPDIFRX_IN1, -
SDMMC3_D3, FMC_NE1,
EVENTOUT
- M10 - - VDDCORE S - - - -

DS12501 Rev 6 85/255

118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

TRACED7, SAI1_D2, I2C2_SDA,

SAI1_FS_A,
B1 A2 B7 D10 PG15 I/O FT_fh - USART6_CTS/USART6_NSS, -
SDMMC3_CK, DCMI_D13,
EVENTOUT
TRACED2, TIM1_BKIN2,
SAI1_D1, TIM15_CH2,
SPI4_MOSI, SAI1_SD_A,
B2 B3 C10 E9 PE6 I/O FT_h - -
SDMMC2_D0, SDMMC1_D2,
SAI2_MCLK_B, FMC_A22,
DCMI_D7, LCD_G1, EVENTOUT
- R10 1G9 Y3 VSS S - - - -
I2C2_SDA, SDMMC3_D0,
- - D8 E10 PF0 I/O FT_fh - SDMMC3_CKIN, FMC_A0, -
EVENTOUT
- - - P13 VDDCORE S - - - -
I2C2_SCL, SDMMC3_CMD,
- - A5 B9 PF1 I/O FT_fh - SDMMC3_CDIR, FMC_A1, -
EVENTOUT
F18 R12 1H4 - VSS S - - - -
USART2_RX, SDMMC3_D1,
- - D9 F9 PF4 I/O FT_h - SDMMC3_D123DIR, FMC_A4, -
EVENTOUT
1E8 M12 1F7 - VDDCORE S - - - -
SAI3_FS_A,
USART2_RTS/USART2_DE,
C3 D6 B6 C9 PD4 I/O FT_h - -
SDMMC3_D1, DFSDM1_CKIN0,
FMC_NOE, EVENTOUT
- - - U14 VDD S - - - -
USART2_TX, SDMMC3_D2,
- - D7 D9 PF5 I/O FT_h - -
FMC_A5, EVENTOUT
- R14 - Y7 VSS S - - - -
RTC_REFIN, TIM16_BKIN,
DFSDM1_CKOUT, I2C5_SMBA,
SPI3_MISO/I2S3_SDI,
1A2 C5 B5 A8 PD10 I/O FT_h - -
SAI3_FS_B, USART3_CK,
FMC_AD15/FMC_D15, LCD_B3,
EVENTOUT
- N11 - P15 VDDCORE S - - - -
- - - B8 PJ12 I/O FT - LCD_G3, LCD_B0, EVENTOUT -
- - - A7 PJ13 I/O FT - LCD_G4, LCD_B1, EVENTOUT -
- - - B7 PJ14 I/O FT - LCD_B2, EVENTOUT -

86/255 DS12501 Rev 6

STM32MP151C/F Pinouts, pin description and alternate functions

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

A19 R16 1H6 Y10 VSS S - - - -

- - - C7 PJ15 I/O FT - LCD_B3, EVENTOUT -
- - 1G6 - VDDCORE S - - - -
TIM1_CH1N, TIM8_CH3,
- - - D8 PK0 I/O FT_h - SPI5_SCK, LCD_G5, -
EVENTOUT
TRACED4, TIM1_CH1, HDP4,
- - - E7 PK1 I/O FT_h - TIM8_CH3N, SPI5_NSS, -
LCD_G6, EVENTOUT
TRACED5, TIM1_BKIN, HDP5,
- - - E8 PK2 I/O FT_h - TIM8_BKIN, LCD_G7, -
EVENTOUT
- R11 - - VDD S - - - -
- T4 - Y18 VSS S - - - -
- N13 - R14 VDDCORE S - - - -
- - - B6 PK3 I/O FT - LCD_B4, EVENTOUT -
- - - A6 PK4 I/O FT - LCD_B5, EVENTOUT -
TRACED6, HDP6, LCD_B6,
- - - C6 PK5 I/O FT_h - -
EVENTOUT
K19 U3 1H8 Y20 VSS S - - - -
TRACED7, HDP7, LCD_B7,
- - - A5 PK6 I/O FT_h - -
EVENTOUT
1G8 P12 - - VDDCORE S - - - -
- - - B5 PK7 I/O FT - LCD_DE, EVENTOUT -
LPTIM1_ETR, TIM4_ETR,
LPTIM2_ETR,
SPI3_SCK/I2S3_CK,
C2 C4 D6 C5 PE0 I/O FT_h - -
SAI4_MCLK_B, UART8_RX,
SAI2_MCLK_A, FMC_NBL0,
DCMI_D2, EVENTOUT
LPTIM1_IN2, I2S2_MCK,
SAI3_SD_B, UART8_TX,
1A1 B1 C8 D7 PE1 I/O FT - -
FMC_NBL1, DCMI_D3,
EVENTOUT
- U6 1J3 AA4 VSS S - - - -
TIM5_ETR, I2C3_SDA,
- - D5 D6 PH8 I/O FT_f - DCMI_HSYNC, LCD_R2, -
EVENTOUT
- - 1H7 T15 VDDCORE S - - - -
TIM12_CH2, I2C3_SMBA,
- - C5 E6 PH9 I/O FT - -
DCMI_D0, LCD_R3, EVENTOUT

DS12501 Rev 6 87/255

118
Pinouts, pin description and alternate functions STM32MP151C/F

Table 7. STM32MP151C/F pin and ball definitions (continued)

Pin Number Pin functions

I/O structure
Pin type
Pin name
TFBGA257

LFBGA354

TFBGA361

LFBGA448

Notes
(function after Additional
Alternate functions
reset) functions

TIM1_CH2, DFSDM1_CKIN4,
SPI4_NSS, USART6_CK,
D2 C1 A4 D5 PE11 I/O FT - SAI2_SD_B, -
FMC_AD8/FMC_D8, DCMI_D4,
LCD_G3, EVENTOUT
TIM1_CH3N, DFSDM1_DATIN5,
SPI4_SCK, SDMMC1_D0DIR,
C1 D2 B4 E4 PE12 I/O FT_h - SAI2_SCK_B, -
FMC_AD9/FMC_D9, LCD_B4,
EVENTOUT
HDP2, TIM1_CH3,
DFSDM1_CKIN5, SPI4_MISO,
E3 C2 A3 A4 PE13 I/O FT_h - SAI2_FS_B, -
FMC_AD10/FMC_D10,
DCMI_D6, LCD_DE, EVENTOUT
- R13 - - VDDCORE S - - - -
TIM5_CH2, I2C4_SCL,
- - C4 B3 PH11 I/O FT_f - I2C1_SCL, DCMI_D2, LCD_R5, -
EVENTOUT
R19 U8 - AA18 VSS S - - - -
- U17 1J5 AB1 VSS S - - - -
W19 W1 - AB18 VSS S - - - -
- W19 1J7 AB22 VSS S - - - -
TIM1_CH4, SPI4_MOSI,
UART8_RTS/UART8_DE,
SAI2_MCLK_B,
1B2 D3 C6 B4 PE14 I/O FT_h - -
SDMMC1_D123DIR,
FMC_AD11/FMC_D11, LCD_G0,
LCD_CLK, EVENTOUT
HDP3, TIM1_BKIN, TIM15_BKIN,
USART2_CTS/USART2_NSS,
D3 E1 D3 C4 PE15 I/O FT - UART8_CTS, FMC_NCE2, -
FMC_AD12/FMC_D12, LCD_R7,
EVENTOUT
I2C2_SCL, LCD_G5, LCD_G4,
- - B3 A3 PH4 I/O FT_f - -
EVENTOUT
1. IO supplied by VSW domain.

88/255 DS12501 Rev 6

 Table 8. Alternate function AF0 to AF7(1)

STM32MP151C/F
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

TIM2_CH1/ USART2_CTS/
PA0 - TIM5_CH1 TIM8_ETR TIM15_BKIN - -
TIM2_ETR USART2_NSS
USART2_RTS/
PA1 ETH_CLK TIM2_CH2 TIM5_CH2 LPTIM3_OUT TIM15_CH1N - -
USART2_DE
PA2 - TIM2_CH3 TIM5_CH3 LPTIM4_OUT TIM15_CH1 - - USART2_TX
PA3 - TIM2_CH4 TIM5_CH4 LPTIM5_OUT TIM15_CH2 - - USART2_RX
DS12501 Rev 6

SPI1_NSS/ SPI3_NSS/
PA4 HDP0 - TIM5_ETR - SAI4_D2 USART2_CK
I2S1_WS I2S3_WS
TIM2_CH1/ SPI1_SCK/I2S1

Pinouts, pin description and alternate functions

PA5 - - TIM8_CH1N SAI4_CK1 - -
TIM2_ETR _CK
SPI1_MISO/
PA6 - TIM1_BKIN TIM3_CH1 TIM8_BKIN SAI4_CK2 - -
I2S1_SDI
Port A
SPI1_MOSI/
PA7 - TIM1_CH1N TIM3_CH2 TIM8_CH1N SAI4_D1 - -
I2S1_SDO
SPI3_MOSI/
PA8 MCO1 TIM1_CH1 - TIM8_BKIN2 I2C3_SCL - USART1_CK
I2S3_SDO
SPI2_SCK/
PA9 - TIM1_CH2 - - I2C3_SMBA - USART1_TX
I2S2_CK
SPI3_NSS/
PA10 - TIM1_CH3 - - - - USART1_RX
I2S3_WS
SPI2_NSS/ USART1_CTS/
PA11 - TIM1_CH4 I2C6_SCL - I2C5_SCL UART4_RX
I2S2_WS USART1_NSS
USART1_RTS/
PA12 - TIM1_ETR I2C6_SDA - I2C5_SDA - UART4_TX
89/255

USART1_DE
 Table 8. Alternate function AF0 to AF7(1) (continued)
90/255

Pinouts, pin description and alternate functions

AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

PA13 DBTRGO DBTRGI MCO1 - - - - -

PA14 DBTRGO DBTRGI MCO2 - - - - -
Port A
TIM2_CH1/ SDMMC1_ SPI1_NSS/ SPI3_NSS/
PA15 DBTRGI SAI4_D2 CEC SPI6_NSS
TIM2_ETR CDIR I2S1_WS I2S3_WS
DFSDM1_
PB0 - TIM1_CH2N TIM3_CH3 TIM8_CH2N - - -
CKOUT
DS12501 Rev 6

DFSDM1_
PB1 - TIM1_CH3N TIM3_CH4 TIM8_CH3N - - -
DATIN1
DFSDM1_ SPI3_MOSI/
PB2 TRACED4 RTC_OUT2 SAI1_D1 USART1_RX I2S_CKIN SAI1_SD_A
CKIN1 I2S3_SDO
SPI1_SCK/ SPI3_SCK/
PB3 TRACED9 TIM2_CH2 - - SAI4_CK1 -
I2S1_CK I2S3_CK
SPI1_MISO/ SPI3_MISO/ SPI2_NSS/
PB4 TRACED8 TIM16_BKIN TIM3_CH1 - SAI4_CK2
I2S1_SDI I2S3_SDI I2S2_WS
Port B
SPI1_MOSI/ SPI3_MOSI/
PB5 ETH_CLK TIM17_BKIN TIM3_CH2 SAI4_D1 I2C1_SMBA I2C4_SMBA
I2S1_SDO I2S3_SDO
PB6 - TIM16_CH1N TIM4_CH1 - I2C1_SCL CEC I2C4_SCL USART1_TX
PB7 - TIM17_CH1N TIM4_CH2 - I2C1_SDA - I2C4_SDA USART1_RX
DFSDM1_ SDMMC1_ SDMMC2_
PB8 HDP6 TIM16_CH1 TIM4_CH3 I2C1_SCL I2C4_SCL

STM32MP151C/F
CKIN7 CKIN CKIN
DFSDM1_ SPI2_NSS/ SDMMC2_
PB9 HDP7 TIM17_CH1 TIM4_CH4 I2C1_SDA I2C4_SDA
DATIN7 I2S2_WS CDIR
SPI2_SCK/ DFSDM1_
PB10 - TIM2_CH3 - LPTIM2_IN1 I2C2_SCL USART3_TX
I2S2_CK DATIN7
 Table 8. Alternate function AF0 to AF7(1) (continued)

STM32MP151C/F
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

DFSDM1_
PB11 - TIM2_CH4 - LPTIM2_ETR I2C2_SDA - USART3_RX
CKIN7
SPI2_NSS/ DFSDM1_
PB12 - TIM1_BKIN I2C6_SMBA - I2C2_SMBA USART3_CK
I2S2_WS DATIN1
DFSDM1_ SPI2_SCK/ DFSDM1_ USART3_CTS/
Port B PB13 - TIM1_CH1N - LPTIM2_OUT
CKOUT I2S2_CK CKIN1 USART3_NSS
SPI2_MISO/ DFSDM1_ USART3_RTS/
DS12501 Rev 6

PB14 - TIM1_CH2N TIM12_CH1 TIM8_CH2N USART1_TX

I2S2_SDI DATIN2 USART3_DE
SPI2_MOSI/ DFSDM1_
PB15 RTC_REFIN TIM1_CH3N TIM12_CH2 TIM8_CH3N USART1_RX -
I2S2_SDO CKIN2

Pinouts, pin description and alternate functions

DFSDM1_ DFSDM1_
PC0 - - - LPTIM2_IN2 - -
CKIN0 DATIN4
DFSDM1_ DFSDM1_ SPI2_MOSI/
PC1 TRACED0 - SAI1_D1 SAI1_SD_A -
DATIN0 CKIN4 I2S2_SDO
DFSDM1_ SPI2_MISO/ DFSDM1_
PC2 - - - - -
CKIN1 I2S2_SDI CKOUT
DFSDM1_ SPI2_MOSI/
Port C PC3 TRACECLK - - - - -
DATIN1 I2S2_SDO
DFSDM1_
PC4 - - - - I2S1_MCK - -
CKIN2
DFSDM1_
PC5 - - SAI1_D3 SAI4_D4 - SAI1_D4 -
DATIN2
DFSDM1_
PC6 HDP1 - TIM3_CH1 TIM8_CH1 I2S2_MCK - USART6_TX
CKIN3
91/255
 Table 8. Alternate function AF0 to AF7(1) (continued)
92/255

Pinouts, pin description and alternate functions

AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

DFSDM1_
PC7 HDP4 - TIM3_CH2 TIM8_CH2 - I2S3_MCK USART6_RX
DATIN3
PC8 TRACED0 - TIM3_CH3 TIM8_CH3 - - UART4_TX USART6_CK
PC9 TRACED1 - TIM3_CH4 TIM8_CH4 I2C3_SDA I2S_CKIN - -
DFSDM1_ SPI3_SCK/
PC10 TRACED2 - - - - USART3_TX
CKIN5 I2S3_CK
DS12501 Rev 6

Port C DFSDM1_ SPI3_MISO/

PC11 TRACED3 - - - - USART3_RX
DATIN5 I2S3_SDI
SPI3_MOSI/
PC12 TRACECLK MCO2 SAI4_D3 - - - USART3_CK
I2S3_SDO
PC13 - - - - - - - -
PC14 - - - - - - - -
PC15 - - - - - - - -
DFSDM1_
PD0 - - I2C6_SDA I2C5_SDA - SAI3_SCK_A -
CKIN6
DFSDM1_
PD1 - - I2C6_SCL I2C5_SCL - SAI3_SD_A -
DATIN6
PD2 - - TIM3_ETR - I2C5_SMBA - UART4_RX -
Port D

STM32MP151C/F
DFSDM1_ SPI2_SCK/ DFSDM1_ USART2_CTS/
PD3 HDP5 - - -
CKOUT I2S2_CK DATIN0 USART2_NSS
USART2_RTS/
PD4 - - - - - - SAI3_FS_A
USART2_DE
PD5 - - - - - - - USART2_TX
 Table 8. Alternate function AF0 to AF7(1) (continued)

STM32MP151C/F
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

DFSDM1_ DFSDM1_ SPI3_MOSI/

PD6 - TIM16_CH1N SAI1_D1 SAI1_SD_A USART2_RX
CKIN4 DATIN1 I2S3_SDO
DFSDM1_ DFSDM1_
PD7 TRACED6 - - I2C2_SCL - USART2_CK
DATIN4 CKIN1
DFSDM1_
PD8 - - - - - SAI3_SCK_B USART3_TX
CKIN3
DFSDM1_
DS12501 Rev 6

PD9 - - - - - SAI3_SD_B USART3_RX

DATIN3

Port D PD10 DFSDM1_ SPI3_MISO/

RTC_REFIN TIM16_BKIN - I2C5_SMBA SAI3_FS_B USART3_CK
CKOUT I2S3_SDI

Pinouts, pin description and alternate functions

USART3_CTS/
PD11 - - - LPTIM2_IN2 I2C4_SMBA I2C1_SMBA -
USART3_NSS
USART3_RTS/
PD12 - LPTIM1_IN1 TIM4_CH1 LPTIM2_IN1 I2C4_SCL I2C1_SCL -
USART3_DE
PD13 - LPTIM1_OUT TIM4_CH2 - I2C4_SDA I2C1_SDA I2S3_MCK -
PD14 - - TIM4_CH3 - - - SAI3_MCLK_B -
PD15 - - TIM4_CH4 - - - SAI3_MCLK_A -
SPI3_SCK/
PE0 - LPTIM1_ETR TIM4_ETR - LPTIM2_ETR SAI4_MCLK_B -
I2S3_CK

Port E PE1 - LPTIM1_IN2 - - - I2S2_MCK SAI3_SD_B -

PE2 TRACECLK - SAI1_CK1 - I2C4_SCL SPI4_SCK SAI1_MCLK_A -
PE3 TRACED0 - - - TIM15_BKIN - SAI1_SD_B -
93/255
 Table 8. Alternate function AF0 to AF7(1) (continued)
94/255

Pinouts, pin description and alternate functions

AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

DFSDM1_ SDMMC2_
PE4 TRACED1 - SAI1_D2 TIM15_CH1N SPI4_NSS SAI1_FS_A
DATIN3 CKIN
DFSDM1_ SDMMC2_
PE5 TRACED3 - SAI1_CK2 TIM15_CH1 SPI4_MISO SAI1_SCK_A
CKIN3 D0DIR
PE6 TRACED2 TIM1_BKIN2 SAI1_D1 - TIM15_CH2 SPI4_MOSI SAI1_SD_A SDMMC2_D0
DFSDM1_
PE7 - TIM1_ETR TIM3_ETR - - - UART7_RX
DATIN2
DS12501 Rev 6

DFSDM1_
PE8 - TIM1_CH1N - - - - UART7_TX
CKIN2
DFSDM1_ UART7_RTS/
PE9 - TIM1_CH1 - - - -
CKOUT UART7_DE
Port E
DFSDM1_
PE10 - TIM1_CH2N - - - - UART7_CTS
DATIN4
DFSDM1_
PE11 - TIM1_CH2 - - SPI4_NSS - USART6_CK
CKIN4
DFSDM1_
PE12 - TIM1_CH3N - - SPI4_SCK - -
DATIN5
DFSDM1_
PE13 HDP2 TIM1_CH3 - - SPI4_MISO - -
CKIN5
PE14 - TIM1_CH4 - - - SPI4_MOSI - -

STM32MP151C/F
USART2_CTS/
PE15 HDP3 TIM1_BKIN - - TIM15_BKIN - -
USART2_NSS
PF0 - - - - I2C2_SDA - - -
Port F
PF1 - - - - I2C2_SCL - - -
 Table 8. Alternate function AF0 to AF7(1) (continued)

STM32MP151C/F
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

PF2 - - - - I2C2_SMBA - - -
PF3 - - - - - - - -
PF4 - - - - - - - USART2_RX
PF5 - - - - - - - USART2_TX
PF6 - TIM16_CH1 - - - SPI5_NSS SAI1_SD_B UART7_RX
PF7 - TIM17_CH1 - - - SPI5_SCK SAI1_MCLK_B UART7_TX
DS12501 Rev 6

UART7_RTS/
PF8 TRACED12 TIM16_CH1N - - - SPI5_MISO SAI1_SCK_B
UART7_DE

Pinouts, pin description and alternate functions

Port F PF9 TRACED13 TIM17_CH1N - - - SPI5_MOSI SAI1_FS_B UART7_CTS
PF10 - TIM16_BKIN SAI1_D3 SAI4_D4 - - SAI1_D4 -
PF11 - - - - - SPI5_MOSI - -
PF12 TRACED4 - - - - - - -
DFSDM1_ DFSDM1_
PF13 TRACED5 - - I2C4_SMBA I2C1_SMBA -
DATIN6 DATIN3
DFSDM1_
PF14 TRACED6 - - I2C4_SCL I2C1_SCL - -
CKIN6
PF15 TRACED7 - - - I2C4_SDA I2C1_SDA - -
DFSDM1_
PG0 TRACED0 - - - - - -
DATIN0
Port G
PG1 TRACED1 - - - - - - -
PG2 TRACED2 MCO2 - TIM8_BKIN - - - -
95/255
 Table 8. Alternate function AF0 to AF7(1) (continued)
96/255

Pinouts, pin description and alternate functions

AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

DFSDM1_
PG3 TRACED3 - - TIM8_BKIN2 - - -
CKIN1
PG4 - TIM1_BKIN2 - - - - - -
PG5 - TIM1_ETR - - - - - -
PG6 TRACED14 TIM17_BKIN - - - - - -
PG7 TRACED5 - - - - - SAI1_MCLK_A USART6_CK
DS12501 Rev 6

TIM2_CH1/ USART6_RTS/
PG8 TRACED15 ETH_CLK TIM8_ETR - SPI6_NSS SAI4_D2
TIM2_ETR USART6_DE
PG9 DBTRGO - - - - - - USART6_RX
Port G
PG10 TRACED10 - - - - - - -
PG11 TRACED11 - - - USART1_TX - UART4_TX -
USART6_RTS/
PG12 - LPTIM1_IN1 - - - SPI6_MISO SAI4_CK2
USART6_DE
USART6_CTS/
PG13 TRACED0 LPTIM1_OUT SAI1_CK2 - SAI4_CK1 SPI6_SCK SAI1_SCK_A
USART6_NSS
PG14 TRACED1 LPTIM1_ETR - - - SPI6_MOSI SAI4_D1 USART6_TX
USART6_CTS/
PG15 TRACED7 - SAI1_D2 - I2C2_SDA - SAI1_FS_A
USART6_NSS

STM32MP151C/F
PH0 - - - - - - - -
Port H PH1 - - - - - - - -
PH2 - LPTIM1_IN2 - - - - - -
 Table 8. Alternate function AF0 to AF7(1) (continued)

STM32MP151C/F
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

DFSDM1_
PH3 - - - - - - -
CKIN4
PH4 - - - - I2C2_SCL - - -
PH5 - - - - I2C2_SDA SPI5_NSS - -
PH6 - - TIM12_CH1 - I2C2_SMBA SPI5_SCK - -
PH7 - - - - I2C3_SCL SPI5_MISO - -
DS12501 Rev 6

PH8 - - TIM5_ETR - I2C3_SDA - - -

Port H
PH9 - - TIM12_CH2 - I2C3_SMBA - - -

Pinouts, pin description and alternate functions

PH10 - - TIM5_CH1 - I2C4_SMBA I2C1_SMBA - -
PH11 - - TIM5_CH2 - I2C4_SCL I2C1_SCL - -
PH12 HDP2 - TIM5_CH3 - I2C4_SDA I2C1_SDA - -
PH13 - - - TIM8_CH1N - - - -
PH14 - - - TIM8_CH2N - - - -
PH15 - - - TIM8_CH3N - - - -
SPI2_NSS/
PI0 - - TIM5_CH4 - - - -
I2S2_WS
SPI2_SCK/
PI1 - - - TIM8_BKIN2 - - -
I2S2_CK
Port I
SPI2_MISO/
PI2 - - - TIM8_CH4 - - -
I2S2_SDI
SPI2_MOSI/
PI3 - - - TIM8_ETR - - -
97/255

I2S2_SDO
 Table 8. Alternate function AF0 to AF7(1) (continued)
98/255

Pinouts, pin description and alternate functions

AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

PI4 - - - TIM8_BKIN - - - -
PI5 - - - TIM8_CH1 - - - -
PI6 - - - TIM8_CH2 - - - -
PI7 - - - TIM8_CH3 - - - -
PI8 - - - - - - - -
PI9 HDP1 - - - - - - -
DS12501 Rev 6

Port I
PI10 HDP0 - - - - - - -
PI11 MCO1 - - - - I2S_CKIN - -
PI12 TRACED0 - HDP0 - - - - -
PI13 TRACED1 - HDP1 - - - - -
PI14 TRACECLK - - - - - - -
PI15 - - - - - - - -
PJ0 TRACED8 - - - - - - -
PJ1 TRACED9 - - - - - - -
PJ2 TRACED10 - - - - - - -
PJ3 TRACED11 - - - - - - -
Port J

STM32MP151C/F
PJ4 TRACED12 - - - - - - -
PJ5 TRACED2 - HDP2 - - - - -
PJ6 TRACED3 - HDP3 TIM8_CH2 - - - -
PJ7 TRACED13 - - TIM8_CH2N - - - -
 Table 8. Alternate function AF0 to AF7(1) (continued)

STM32MP151C/F
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

PJ8 TRACED14 TIM1_CH3N - TIM8_CH1 - - - -

PJ9 TRACED15 TIM1_CH3 - TIM8_CH1N - - - -
PJ10 - TIM1_CH2N - TIM8_CH2 - SPI5_MOSI - -
PJ11 - TIM1_CH2 - TIM8_CH2N - SPI5_MISO - -
Port J
PJ12 - - - - - - - -
PJ13 - - - - - - - -
DS12501 Rev 6

PJ14 - - - - - - - -
PJ15 - - - - - - - -

Pinouts, pin description and alternate functions

PK0 - TIM1_CH1N - TIM8_CH3 - SPI5_SCK - -
PK1 TRACED4 TIM1_CH1 HDP4 TIM8_CH3N - SPI5_NSS - -
PK2 TRACED5 TIM1_BKIN HDP5 TIM8_BKIN - - - -
PK3 - - - - - - - -
Port K
PK4 - - - - - - - -
PK5 TRACED6 - HDP6 - - - - -
PK6 TRACED7 - HDP7 - - - - -
PK7 - - - - - - - -
SPI1_SCK/
PZ0 - - I2C6_SCL I2C2_SCL - - USART1_CK
I2S1_CK
Port Z
SPI1_MISO/
PZ1 - - I2C6_SDA I2C2_SDA I2C5_SDA I2C4_SDA USART1_RX
I2S1_SDI
99/255
 Table 8. Alternate function AF0 to AF7(1) (continued)
100/255

Pinouts, pin description and alternate functions

AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

SPI1/I2S1/ SPI2/I2S2/
SAI4/I2C2/ SAI4/
SPI2/I2S2/ SPI3/I2S3/ SPI3/I2S3/
Port TIM1/2/16/17/ SAI1/4/I2C6/ TIM8/ I2C1/2/3/4/5/
SPI3/I2S3/ SAI1/3/4/ SPI6/
HDP/SYS/RTC LPTIM1/SYS/ TIM3/4/5/12/ LPTIM2/3/4/5/ USART1/
SPI4/5/6/I2C1/ I2C4/UART4/ USART1/2/3/6/
RTC HDP/SYS DFSDM1 TIM15/LPTIM2/
SDMMC1/3/ DFSDM1 UART7/
/SDMMC1 DFSDM1/CEC
CEC SDMMC2

SPI1_MOSI/
PZ2 - - I2C6_SCL I2C2_SCL I2C5_SMBA I2C4_SMBA USART1_TX
I2S1_SDO
SPI1_NSS/ USART1_CTS/
PZ3 - - I2C6_SDA I2C2_SDA I2C5_SDA I2C4_SDA
I2S1_WS USART1_NSS

Port Z PZ4 - - I2C6_SCL I2C2_SCL I2C5_SCL - I2C4_SCL -

USART1_RTS/
PZ5 - - I2C6_SDA I2C2_SDA I2C5_SDA - I2C4_SDA
USART1_DE
DS12501 Rev 6

PZ6 - - I2C6_SCL I2C2_SCL USART1_CK I2S1_MCK I2C4_SMBA USART1_RX

PZ7 - - I2C6_SDA I2C2_SDA - - - USART1_TX
1. Refer to Table 9 for AF8 to AF15.

STM32MP151C/F
 Table 9. Alternate function AF8 to AF15(1)

STM32MP151C/F
AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

ETH1_GMII_
PA0 UART4_TX SDMMC2_CMD SAI2_SD_B CRS/ - - - EVENTOUT
ETH1_MII_CRS
ETH1_GMII_RX
_CLK/
ETH1_MII_RX_
QUADSPI_ CLK/
PA1 UART4_RX SAI2_MCLK_B - - LCD_R2 EVENTOUT
BK1_IO3 ETH1_RGMII_
DS12501 Rev 6

RX_CLK/
ETH1_RMII_
REF_CLK

Pinouts, pin description and alternate functions

SDMMC2_
PA2 SAI2_SCK_B - ETH1_MDIO MDIOS_MDIO - LCD_R1 EVENTOUT
D0DIR

Port A ETH1_GMII_
PA3 - LCD_B2 - COL/ - - LCD_B5 EVENTOUT
ETH1_MII_COL
PA4 SPI6_NSS - - - SAI4_FS_A DCMI_HSYNC LCD_VSYNC EVENTOUT
PA5 SPI6_SCK - - - SAI4_MCLK_A - LCD_R4 EVENTOUT
PA6 SPI6_MISO TIM13_CH1 - MDIOS_MDC SAI4_SCK_A DCMI_PIXCLK LCD_G2 EVENTOUT
ETH1_GMII_RX
_DV/
ETH1_MII_RX_
DV/
PA7 SPI6_MOSI TIM14_CH1 QUADSPI_CLK SAI4_SD_A - - EVENTOUT
ETH1_RGMII_
RX_CTL/
ETH1_RMII_
101/255

CRS_DV
 Table 9. Alternate function AF8 to AF15(1) (continued)
102/255

Pinouts, pin description and alternate functions

AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

SDMMC2_ OTG_FS_SOF/
PA8 SDMMC2_D4 - SAI4_SD_B UART7_RX LCD_R6 EVENTOUT
CKIN OTG_HS_SOF
SDMMC2_
PA9 - SDMMC2_D5 - - DCMI_D0 LCD_R5 EVENTOUT
CDIR
PA10 - - - MDIOS_MDIO SAI4_FS_B DCMI_D1 LCD_B1 EVENTOUT

Port A PA11 - - - - - - LCD_R4 EVENTOUT

DS12501 Rev 6

PA12 SAI2_FS_B - - - - - LCD_R5 EVENTOUT

PA13 UART4_TX - - - - - - EVENTOUT
PA14 - - - - - - - EVENTOUT
UART4_RTS/ SDMMC2_
PA15 SDMMC2_D5 SDMMC1_D5 SAI4_FS_A UART7_TX LCD_R1 EVENTOUT
UART4_DE CDIR
ETH1_GMII_
RXD2/
ETH1_MII_
PB0 UART4_CTS LCD_R3 - MDIOS_MDIO - LCD_G1 EVENTOUT
RXD2/
ETH1_RGMII_
RXD2
ETH1_GMII_
Port B RXD3/
ETH1_MII_
PB1 - LCD_R6 - MDIOS_MDC - LCD_G0 EVENTOUT

STM32MP151C/F
RXD3/
ETH1_RGMII_
RXD3
PB2 UART4_RX QUADSPI_CLK - - - - - EVENTOUT
PB3 SPI6_SCK SDMMC2_D2 - - SAI4_MCLK_A UART7_RX - EVENTOUT
 Table 9. Alternate function AF8 to AF15(1) (continued)

STM32MP151C/F
AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

PB4 SPI6_MISO SDMMC2_D3 - - SAI4_SCK_A UART7_TX - EVENTOUT

ETH1_PPS_
PB5 SPI6_MOSI - SAI4_SD_A UART5_RX DCMI_D10 LCD_G7 EVENTOUT
OUT
QUADSPI_BK1 DFSDM1_
PB6 - - UART5_TX DCMI_D5 - EVENTOUT
_NCS DATIN5
DFSDM1_
PB7 - - SDMMC2_D1 FMC_NL DCMI_VSYNC - EVENTOUT
CKIN5
DS12501 Rev 6

ETH1_GMII_
TXD3/
ETH1_MII_

Pinouts, pin description and alternate functions

PB8 UART4_RX - SDMMC2_D4 SDMMC1_D4 DCMI_D6 LCD_B6 EVENTOUT
TXD3/
ETH1_RGMII_
TXD3
Port B
SDMMC1_CDI
PB9 UART4_TX - SDMMC2_D5 SDMMC1_D5 DCMI_D7 LCD_B7 EVENTOUT
R
ETH1_GMII_
QUADSPI_ RX_ER/
PB10 - - - - LCD_G4 EVENTOUT
BK1_NCS ETH1_MII_
RX_ER
ETH1_GMII_
TX_EN/
ETH1_MII_
TX_EN/
PB11 - - - - - LCD_G5 EVENTOUT
ETH1_RGMII_
TX_CTL/
ETH1_RMII_
103/255

TX_EN
 Table 9. Alternate function AF8 to AF15(1) (continued)
104/255

Pinouts, pin description and alternate functions

AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

ETH1_GMII_
TXD0/
ETH1_MII_
TXD0/
PB12 USART3_RX - - - - UART5_RX EVENTOUT
ETH1_RGMII_
TXD0/
ETH1_RMII_
TXD0
DS12501 Rev 6

ETH1_GMII_
Port B TXD1/
ETH1_MII_
TXD1/
PB13 - - - - - UART5_TX EVENTOUT
ETH1_RGMII_
TXD1/
ETH1_RMII_
TXD1
PB14 - SDMMC2_D0 - - - - - EVENTOUT
PB15 - SDMMC2_D1 - - - - - EVENTOUT
QUADSPI_BK2
PC0 SAI2_FS_B - - - - LCD_R5 EVENTOUT
_NCS
PC1 - SDMMC2_CK - ETH1_MDC MDIOS_MDC - - EVENTOUT
ETH1_GMII_

STM32MP151C/F
Port C
TXD2/
ETH1_MII_
PC2 - - - - DCMI_PIXCLK - EVENTOUT
TXD2/
ETH1_RGMII_
TXD2
 Table 9. Alternate function AF8 to AF15(1) (continued)

STM32MP151C/F
AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

ETH1_GMII_
TX_CLK/
PC3 - - - - - - EVENTOUT
ETH1_MII_
TX_CLK
ETH1_GMII_
RXD0/
ETH1_MII_
RXD0/
DS12501 Rev 6

PC4 - SPDIFRX_IN3 - - - - EVENTOUT

ETH1_RGMII_
RXD0/
ETH1_RMII_

Pinouts, pin description and alternate functions

RXD0
ETH1_GMII_
RXD1/
Port C ETH1_MII_
RXD1/
PC5 - SPDIFRX_IN4 - SAI4_D3 - - EVENTOUT
ETH1_RGMII_
RXD1/
ETH1_RMII_
RXD1
SDMMC1_ SDMMC2_
PC6 SDMMC2_D6 - SDMMC1_D6 DCMI_D0 LCD_HSYNC EVENTOUT
D0DIR D0DIR
SDMMC1_ SDMMC2_
PC7 SDMMC2_D7 - SDMMC1_D7 DCMI_D1 LCD_G6 EVENTOUT
D123DIR D123DIR
UART5_RTS/
PC8 - - - SDMMC1_D0 DCMI_D2 - EVENTOUT
UART5_DE
105/255

QUADSPI_BK1
PC9 UART5_CTS - - SDMMC1_D1 DCMI_D3 LCD_B2 EVENTOUT
_IO0
 Table 9. Alternate function AF8 to AF15(1) (continued)
106/255

Pinouts, pin description and alternate functions

AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

QUADSPI_
PC10 UART4_TX SAI4_MCLK_B - SDMMC1_D2 DCMI_D8 LCD_R2 EVENTOUT
BK1_IO1
QUADSPI_
PC11 UART4_RX SAI4_SCK_B - SDMMC1_D3 DCMI_D4 - EVENTOUT
BK2_NCS
Port C PC12 UART5_TX - SAI4_SD_B - SDMMC1_CK DCMI_D9 - EVENTOUT
PC13 - - - - - - - EVENTOUT
DS12501 Rev 6

PC14 - - - - - - - EVENTOUT
PC15 - - - - - - - EVENTOUT

STM32MP151C/F
 Table 9. Alternate function AF8 to AF15(1) (continued)

STM32MP151C/F
AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

DFSDM1_ FMC_AD2/
PD0 UART4_RX - SDMMC3_CMD - - EVENTOUT
DATIN7 FMC_D2
DFSDM1_ FMC_AD3/
PD1 UART4_TX - SDMMC3_D0 - - EVENTOUT
CKIN7 FMC_D3
PD2 UART5_RX - - - SDMMC1_CMD DCMI_D11 - EVENTOUT
SDMMC1_ SDMMC2_
PD3 SDMMC2_D7 SDMMC1_D7 FMC_CLK DCMI_D5 LCD_G7 EVENTOUT
D123DIR D123DIR
DS12501 Rev 6

DFSDM1_
Port D PD4 - - SDMMC3_D1 FMC_NOE - - EVENTOUT
CKIN0

Pinouts, pin description and alternate functions

PD5 - - SDMMC3_D2 - FMC_NWE - - EVENTOUT
PD6 - - - - FMC_NWAIT DCMI_D10 LCD_B2 EVENTOUT
PD7 - SPDIFRX_IN1 SDMMC3_D3 - FMC_NE1 - - EVENTOUT
FMC_AD13/
PD8 - SPDIFRX_IN2 - - - LCD_B7 EVENTOUT
FMC_D13
FMC_AD14/
PD9 - - - - DCMI_HSYNC LCD_B0 EVENTOUT
FMC_D14
107/255
 Table 9. Alternate function AF8 to AF15(1) (continued)
108/255

Pinouts, pin description and alternate functions

AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

FMC_AD15/
PD10 - - - - - LCD_B3 EVENTOUT
FMC_D15
QUADSPI_ FMC_A16/
PD11 - SAI2_SD_A - - - EVENTOUT
BK1_IO0 FMC_CLE
QUADSPI_ FMC_A17/FMC
PD12 - SAI2_FS_A - - - EVENTOUT
BK1_IO1 _ALE
Port D
QUADSPI_
DS12501 Rev 6

PD13 - SAI2_SCK_A - FMC_A18 - - EVENTOUT

BK1_IO3
FMC_AD0/
PD14 UART8_CTS - - - - - EVENTOUT
FMC_D0
FMC_AD1/
PD15 UART8_CTS - - - - LCD_R1 EVENTOUT
FMC_D1

STM32MP151C/F
 Table 9. Alternate function AF8 to AF15(1) (continued)

STM32MP151C/F
AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

PE0 UART8_RX - SAI2_MCLK_A - FMC_NBL0 DCMI_D2 - EVENTOUT

PE1 UART8_TX - - - FMC_NBL1 DCMI_D3 - EVENTOUT
ETH1_GMII_
TXD3/
QUADSPI_ ETH1_MII_
PE2 - - FMC_A23 - - EVENTOUT
BK1_IO2 TXD3/
ETH1_RGMII_
DS12501 Rev 6

Port E TXD3
PE3 - SDMMC2_CK - - FMC_A19 - - EVENTOUT
SDMMC1_

Pinouts, pin description and alternate functions

PE4 SDMMC2_D4 - SDMMC1_D4 FMC_A20 DCMI_D4 LCD_B0 EVENTOUT
CKIN
SDMMC1_
PE5 SDMMC2_D6 - SDMMC1_D6 FMC_A21 DCMI_D6 LCD_G0 EVENTOUT
D0DIR
PE6 SDMMC1_D2 - SAI2_MCLK_B - FMC_A22 DCMI_D7 LCD_G1 EVENTOUT
109/255
 Table 9. Alternate function AF8 to AF15(1) (continued)
110/255

Pinouts, pin description and alternate functions

AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

QUADSPI_ FMC_AD4/
PE7 - - - - - EVENTOUT
BK2_IO0 FMC_D4
QUADSPI_ FMC_AD5/
PE8 - - - - - EVENTOUT
BK2_IO1 FMC_D5
QUADSPI_ FMC_AD6/
PE9 - - - - - EVENTOUT
BK2_IO2 FMC_D6
QUADSPI_ FMC_AD7/
DS12501 Rev 6

PE10 - - - - - EVENTOUT
BK2_IO3 FMC_D7
FMC_AD8/
Port E PE11 - - SAI2_SD_B - DCMI_D4 LCD_G3 EVENTOUT
FMC_D8
SDMMC1_ FMC_AD9/
PE12 - SAI2_SCK_B - - LCD_B4 EVENTOUT
D0DIR FMC_D9
FMC_AD10/
PE13 - - SAI2_FS_B - DCMI_D6 LCD_DE EVENTOUT
FMC_D10
UART8_RTS/ SDMMC1_ FMC_AD11/
PE14 - SAI2_MCLK_B LCD_G0 LCD_CLK EVENTOUT
UART8_DE D123DIR FMC_D11
FMC_AD12/
PE15 UART8_CTS - FMC_NCE2 - - LCD_R7 EVENTOUT
FMC_D12
SDMMC3_
PF0 - SDMMC3_D0 - FMC_A0 - - EVENTOUT
CKIN

STM32MP151C/F
SDMMC3_
Port F PF1 - SDMMC3_CMD - FMC_A1 - - EVENTOUT
CDIR
SDMMC2_ SDMMC3_ SDMMC1_
PF2 - FMC_A2 - - EVENTOUT
D0DIR D0DIR D0DIR
 Table 9. Alternate function AF8 to AF15(1) (continued)

STM32MP151C/F
AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

ETH1_GMII_
PF3 - - - FMC_A3 - - EVENTOUT
TX_ER
SDMMC3_
PF4 - SDMMC3_D1 - FMC_A4 - - EVENTOUT
D123DIR
PF5 - SDMMC3_D2 - - FMC_A5 - - EVENTOUT
QUADSPI_
PF6 - - - SAI4_SCK_B - - EVENTOUT
BK1_IO3
DS12501 Rev 6

QUADSPI_
PF7 - - - - - - EVENTOUT
BK1_IO2

Pinouts, pin description and alternate functions

QUADSPI_
PF8 - TIM13_CH1 - - - - EVENTOUT
Port F BK1_IO0
QUADSPI_
PF9 - TIM14_CH1 - - - - EVENTOUT
BK1_IO1
PF10 - QUADSPI_CLK - - SAI4_D3 DCMI_D11 LCD_DE EVENTOUT
PF11 - - SAI2_SD_B - - DCMI_D12 LCD_G5 EVENTOUT
ETH1_GMII_
PF12 - - - FMC_A6 - - EVENTOUT
RXD4
ETH1_GMII_
PF13 - - - FMC_A7 - - EVENTOUT
RXD5
ETH1_GMII_
PF14 - - - FMC_A8 - - EVENTOUT
RXD6
ETH1_GMII_
Port F PF15 - - - FMC_A9 - - EVENTOUT
RXD7
111/255
 Table 9. Alternate function AF8 to AF15(1) (continued)
112/255

Pinouts, pin description and alternate functions

AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

ETH1_GMII_
PG0 - - - FMC_A10 - - EVENTOUT
TXD4
ETH1_GMII_
PG1 - - - FMC_A11 - - EVENTOUT
TXD5
ETH1_GMII_
PG2 - - - FMC_A12 - - EVENTOUT
TXD6
ETH1_GMII_
DS12501 Rev 6

PG3 - - - FMC_A13 - - EVENTOUT

TXD7
ETH1_GMII_
GTX_CLK/
PG4 - - - FMC_A14 - - EVENTOUT
ETH1_RGMII_
Port G GTX_CLK
ETH1_GMII_
CLK125/
PG5 - - - FMC_A15 - - EVENTOUT
ETH1_RGMII_
CLK125
PG6 - - SDMMC2_CMD - - DCMI_D12 LCD_R7 EVENTOUT
UART8_RTS/ QUADSPI_
PG7 QUADSPI_CLK - - DCMI_D13 LCD_CLK EVENTOUT
UART8_DE BK2_IO3
USART3_RTS/ ETH1_PPS_
PG8 SPDIFRX_IN3 SAI4_FS_A - - LCD_G7 EVENTOUT
USART3_DE OUT

STM32MP151C/F
QUADSPI_ FMC_NE2/FMC
PG9 SPDIFRX_IN4 SAI2_FS_B - DCMI_VSYNC LCD_R1 EVENTOUT
BK2_IO2 _NCE
 Table 9. Alternate function AF8 to AF15(1) (continued)

STM32MP151C/F
AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

QUADSPI_
PG10 UART8_CTS LCD_G3 SAI2_SD_B FMC_NE3 DCMI_D2 LCD_B2 EVENTOUT
BK2_IO2
ETH1_GMII_
TX_EN/
ETH1_MII_
TX_EN/
PG11 SPDIFRX_IN1 - - - DCMI_D3 LCD_B3 EVENTOUT
ETH1_RGMII_
TX_CTL/
DS12501 Rev 6

ETH1_RMII_
TX_EN
ETH1_PHY_

Pinouts, pin description and alternate functions

PG12 SPDIFRX_IN2 LCD_B4 SAI4_SCK_A FMC_NE4 - LCD_B1 EVENTOUT
INTN
ETH1_GMII_
Port G TXD0/
ETH1_MII_
TXD0/
PG13 - - SAI4_MCLK_A FMC_A24 - LCD_R0 EVENTOUT
ETH1_RGMII_
TXD0/
ETH1_RMII_
TXD0
ETH1_GMII_
TXD1/
ETH1_MII_
QUADSPI_ TXD1/
PG14 - SAI4_SD_A FMC_A25 - LCD_B0 EVENTOUT
BK2_IO3 ETH1_RGMII_
TXD1/
ETH1_RMII_
113/255

TXD1
 Table 9. Alternate function AF8 to AF15(1) (continued)
114/255

Pinouts, pin description and alternate functions

AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

Port G PG15 - - SDMMC3_CK - - DCMI_D13 - EVENTOUT

PH0 - - - - - - - EVENTOUT
PH1 - - - - - - - EVENTOUT
ETH1_GMII_
QUADSPI_
PH2 - SAI2_SCK_B CRS/ - - LCD_R0 EVENTOUT
BK2_IO0
ETH1_MII_CRS
DS12501 Rev 6

ETH1_GMII_
QUADSPI_
PH3 - SAI2_MCLK_B COL/ - - LCD_R1 EVENTOUT
BK2_IO1
ETH1_MII_COL
PH4 - LCD_G5 - - - - LCD_G4 EVENTOUT
PH5 - - - - SAI4_SD_B - - EVENTOUT
Port H ETH1_GMII_
RXD2/
ETH1_MII_
PH6 - - - MDIOS_MDIO DCMI_D8 - EVENTOUT
RXD2/
ETH1_RGMII_
RXD2
ETH1_GMII_
RXD3/
ETH1_MII_
PH7 - - - MDIOS_MDC DCMI_D9 - EVENTOUT
RXD3/

STM32MP151C/F
ETH1_RGMII_
RXD3
PH8 - - - - - DCMI_HSYNC LCD_R2 EVENTOUT
 Table 9. Alternate function AF8 to AF15(1) (continued)

STM32MP151C/F
AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

PH9 - - - - - DCMI_D0 LCD_R3 EVENTOUT

PH10 - - - - - DCMI_D1 LCD_R4 EVENTOUT
PH11 - - - - - DCMI_D2 LCD_R5 EVENTOUT
Port H PH12 - - - - - DCMI_D3 LCD_R6 EVENTOUT
PH13 UART4_TX - - - - - LCD_G2 EVENTOUT
PH14 UART4_RX - - - - DCMI_D4 LCD_G3 EVENTOUT
DS12501 Rev 6

PH15 - - - - - DCMI_D11 LCD_G4 EVENTOUT

PI0 - - - - - DCMI_D13 LCD_G5 EVENTOUT

Pinouts, pin description and alternate functions

PI1 - - - - - DCMI_D8 LCD_G6 EVENTOUT
PI2 - - - - - DCMI_D9 LCD_G7 EVENTOUT
PI3 - - - - - DCMI_D10 - EVENTOUT
PI4 - - SAI2_MCLK_A - - DCMI_D5 LCD_B4 EVENTOUT
PI5 - - SAI2_SCK_A - - DCMI_VSYNC LCD_B5 EVENTOUT
Port I PI6 - - SAI2_SD_A - - DCMI_D6 LCD_B6 EVENTOUT
PI7 - - SAI2_FS_A - - DCMI_D7 LCD_B7 EVENTOUT
PI8 - - - - - - - EVENTOUT
PI9 UART4_RX - - - - - LCD_VSYNC EVENTOUT
ETH1_GMII_
USART3_CTS/ RX_ER/
PI10 - - - - LCD_HSYNC EVENTOUT
USART3_NSS ETH1_MII_
115/255

RX_ER
 Table 9. Alternate function AF8 to AF15(1) (continued)
116/255

Pinouts, pin description and alternate functions

AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

PI11 - LCD_G6 - - - - - EVENTOUT

PI12 - - - - - - LCD_HSYNC EVENTOUT
Port I PI13 - - - - - - LCD_VSYNC EVENTOUT
PI14 - - - - - - LCD_CLK EVENTOUT
PI15 - LCD_G2 - - - - LCD_R0 EVENTOUT
PJ0 - LCD_R7 - - - - LCD_R1 EVENTOUT
DS12501 Rev 6

PJ1 - - - - - - LCD_R2 EVENTOUT

PJ2 - - - - - - LCD_R3 EVENTOUT
PJ3 - - - - - - LCD_R4 EVENTOUT
PJ4 - - - - - - LCD_R5 EVENTOUT
PJ5 - - - - - - LCD_R6 EVENTOUT
PJ6 - - - - - - LCD_R7 EVENTOUT
Port J PJ7 - - - - - - LCD_G0 EVENTOUT
PJ8 UART8_TX - - - - - LCD_G1 EVENTOUT
PJ9 UART8_RX - - - - - LCD_G2 EVENTOUT
PJ10 - - - - - - LCD_G3 EVENTOUT

STM32MP151C/F
PJ11 - - - - - - LCD_G4 EVENTOUT
PJ12 - LCD_G3 - - - - LCD_B0 EVENTOUT
PJ13 - LCD_G4 - - - - LCD_B1 EVENTOUT
PJ14 - - - - - - LCD_B2 EVENTOUT
 Table 9. Alternate function AF8 to AF15(1) (continued)

STM32MP151C/F
AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15

SAI2/4/
SPI6/SAI2/
TIM13/14/ QUADSPI/ DFSDM1/
Port USART3/ SAI4/UART5/
QUADSPI/ FMC/ QUADSPI/ UART7/DCMI/
UART4/5/8/ FMC/SDMMC1/ UART5/LCD SYS
SDMMC2/3/ SDMMC2/3/ SDMMC1/ LCD/RNG
SDMMC1/2/ MDIOS
LCD/SPDIFRX OTG_FS/ MDIOS/ETH1
SPDIFRX
OTG_HS

Port J PJ15 - - - - - - LCD_B3 EVENTOUT

PK0 - - - - - - LCD_G5 EVENTOUT
PK1 - - - - - - LCD_G6 EVENTOUT
PK2 - - - - - - LCD_G7 EVENTOUT
PK3 - - - - - - LCD_B4 EVENTOUT
Port K
PK4 - - - - - - LCD_B5 EVENTOUT
DS12501 Rev 6

PK5 - - - - - - LCD_B6 EVENTOUT

PK6 - - - - - - LCD_B7 EVENTOUT

Pinouts, pin description and alternate functions

PK7 - - - - - - LCD_DE EVENTOUT
PZ0 SPI6_SCK - - - - - - EVENTOUT
PZ1 SPI6_MISO - - - - - - EVENTOUT
PZ2 SPI6_MOSI - - - - - - EVENTOUT
PZ3 SPI6_NSS - - - - - - EVENTOUT
Port Z
PZ4 - - - - - - - EVENTOUT
PZ5 - - - - - - - EVENTOUT
PZ6 - - - - - - - EVENTOUT
PZ7 - - - - - - - EVENTOUT
1. Refer to Table 8 for AF0 to AF7.
117/255
Memory mapping STM32MP151C/F

5 Memory mapping

Refer to the product line reference manual for details on the memory mapping as well as the
boundary addresses for all peripherals.

118/255 DS12501 Rev 6

STM32MP151C/F Electrical characteristics

6 Electrical characteristics

6.1 Parameter conditions

Unless otherwise specified, all voltages are referenced to VSS.

6.1.1 Minimum and maximum values

Unless otherwise specified the minimum and maximum values are guaranteed in the worst
conditions of junction temperature, supply voltage and frequencies by tests in production on
100% of the devices with an junction temperature at TJ = 25 °C and TJ = TJmax (given by the
selected temperature range).
Data based on characterization results, design simulation and/or technology characteristics
are indicated in the table footnotes and are not tested in production. Based on
characterization, the minimum and maximum values refer to sample tests and represent the
mean value plus or minus three times the standard deviation (mean±3σ).

6.1.2 Typical values

Unless otherwise specified, typical data are based on TJ = 25 °C, VDD = 3.3 V, VDDCORE =
1.2 V. They are given only as design guidelines and are not tested.
Typical ADC accuracy values are determined by characterization of a batch of samples from
a standard diffusion lot over the full temperature range, where 95% of the devices have an
error less than or equal to the value indicated (mean±2σ).

6.1.3 Typical curves

Unless otherwise specified, all typical curves are given only as design guidelines and are
not tested.

6.1.4 Loading capacitor

The loading conditions used for pin parameter measurement are shown in Figure 9.

6.1.5 Pin input voltage

The input voltage measurement on a pin of the device is described in Figure 10.

Figure 9. Pin loading conditions Figure 10. Pin input voltage

Device pin Device pin

VIN
C = 50 pF

MSv47493V1 MSv47494V1

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Electrical characteristics STM32MP151C/F

6.1.6 Power supply scheme

Figure 11. Power supply scheme

VDD3V3_USBHS

VDD3V3_USBFS
VDDA1V1_REG

VDDA1V8_REG
VSS_USBHS
VDDQ_DDR

VDD

VDD
USB FS
DDR 1V1 USB HS 1V8 IOs
PHY regulator PHY regulator
VSS VSS VSS VSS

VDDCORE Core domain

VSS
(MPU, (MCU,
Level shifter

peripherals, peripherals,
IO RAM) RAM)
IOports IOs
logic
(System logic, Peripherals)

VDD (VDD_ANA)

VDD HSI, CSI, HSE,

LSI, WKUP, VSW domain
VDD IO IWDG Retention domain
IOports IOs logic Power switch
Retention
VRET
regulator
VSS VSW Retention
VBAT Power switch
RAM
VDD_PLL PLLs Backup Backup domain
VBKP
VSS_PLL VDD domain regulator

Backup RAM
LSE, RTC, AWU,
BKUP IO
IOports IOs logic
Tamper, backup
registers, Reset

VSS
VDDA Analog domain VSS

REF_BUF ADC, DAC

VREF+ VREF+
VREF- VREF-
VSSA

MSv46560V3

Caution: Each power supply pair (VDD/VSS, VDDCORE/VSS, VDDA/VSSA ...) must be decoupled with
filtering ceramic capacitors. These capacitors must be placed as close as possible to, or
below, the appropriate pins on the underside of the PCB to ensure good operation of the
device. It is not recommended to remove filtering capacitors to reduce PCB size or cost.
This might cause incorrect operation of the device.

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STM32MP151C/F Electrical characteristics

The number of needed capacitances and their values are provided in AN5031 “Getting
started with STM32MP1 Series hardware development” available from the ST website
www.st.com.

6.1.7 Current consumption measurement

Figure 12. Current consumption measurement scheme

IDD_CORE
VDDCORE

IDD_VBAT
VBAT

IDD
VDD

VDDA

VDD_ANA

VDD_PLL

MSv50921V2

6.2 Absolute maximum ratings

Stresses above the absolute maximum ratings listed in Table 10: Voltage characteristics,
Table 11: Current characteristics, and Table 12: Thermal characteristics may cause
permanent damage to the device. These are stress ratings only and the functional operation
of the device at these conditions is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability. Device mission profile (application conditions)
is compliant with JEDEC JESD47 qualification standard, extended mission profiles are
available on demand.

Table 10. Voltage characteristics (1)

Symbols Ratings Min Max Unit

External main supply voltage (including VDD,

VDDX - VSSX VDD_ANA, VDD_PLL, VDDA, VDD3V3_USB, VBAT, -0.3 3.9 V
VREF+)
VDDCORE -
External core supply voltage -0.3 1.5 V
VSS
VDDA_DDR -
DDR IO supply voltage -0.3 1.98 V
VSS
VDDA1V8 -
1.8 V supply (VDDA1V8_REG) -0.3 3.9 V
VSS

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233
Electrical characteristics STM32MP151C/F

Table 10. Voltage characteristics (continued)(1)

Symbols Ratings Min Max Unit

Min(VDD, VDDA,
Input voltage on FT_xxx pins VDD3V3_USB, V
VBAT) +3.9(3)(4)
Input voltage on TT_xx pins 3.9 V
(2)
VIN Input voltage on OTG_VBUS pin VSS - 0.3 6.0 (5)
V
Input voltage on USB/OTG_HS_DP/DM pins 5.25 V
(5)
Input voltage on OTG_FS_DP/DM pins 5.5 V
Input voltage on any other pins 3.9 V
Variations between different VDDX power pins of
|∆VDDX| - 50 mV
the same domain
|VSSx-VSS| Variations between all the different ground pins - 50 mV
VREF+ - VDDA Allowed voltage difference for VREF+ > VDDA - 0.4 V
1. All power (VDD, VDDA, VDD3V3_USB, VDDCORE, VBAT) and ground (VSS, VSSA, VSSX) pins must always be
connected to the external/internal power supply, in the permitted range.
2. VIN maximum must always be respected. Refer to Table 49 for the maximum allowed injected current
values.
3. This formula has to be applied on power supplies related to the IO structure described by the pin definition
table.
4. To sustain a voltage higher than 3.9 V the internal pull-up/pull-down resistors must be disabled.
5. Voltage should be also below Min(VDD, VDD3V3_USBFS) + 3.9 V

Table 11. Current characteristics

Symbols Ratings Max Unit

ΣIVDD Total current into sum of all VDD power lines (source)(1) 440
ΣIVSS Total current out of sum of all VSS ground lines (sink)(1) 440
IVDD Maximum current into each VDD power pin (source)(1) 100
IVSS Maximum current out of each VSS ground pin (sink)(1) 100
IIO Output current sunk by any I/O and control pin 20
mA
Total output current sunk by sum of all I/Os and control pins(2) 140
ΣI(PIN)
Total output current sourced by sum of all I/Os and control pins(2) 140
Injected current on FT_xxx, TT_xx, NRST pins except PA4, PA5 -5/+0
IINJ(PIN)(3)(4)
Injected current on PA4, PA5 -0/0
ΣIINJ(PIN) Total injected current (sum of all I/Os and control pins)(5) ±25
1. All power (VDD, VDDA, VDD3V3_USB, VDDCORE) and ground (VSS, VSSA, VSSX) pins must always be
connected to the external/internal power supply, in the permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output
current must not be sunk/sourced between two consecutive power supply pins.
3. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the
specified maximum value.
4. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS. IINJ(PIN) must
never be exceeded. Refer also to Table 10: Voltage characteristics for the maximum allowed input voltage
values.

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STM32MP151C/F Electrical characteristics

5. When several inputs are submitted to a current injection, the maximum ∑IINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values).

Table 12. Thermal characteristics

Symbol Ratings Value Unit

TSTG Storage temperature range -65 to +150

Maximum junction temperature (suffix 1) 105 °C
TJ
Maximum junction temperature (suffix 3) 125

6.3 Operating conditions

6.3.1 General operating conditions

Table 13. General operating conditions

Symbol Parameter Operating conditions Min. Typ Max. Unit

STM32MP151C 0 - 650
Fmpuss_ck Cortex-A7 subsystem
STM32MP151F 0 - 800
Internal AXI, AHB5,
Faxiss_ck, Fhclk5,
AHB6 clock - 0 - 266
Fhclk6
frequency
Internal MCU AHB
Fmcu_ck - 0 - 209
clock frequency
Internal APB1 clock
Fpclk1 - 0 - 104.5
frequency MHz
Internal APB2 clock
Fpclk2 - 0 - 104.5
frequency
Internal APB3 clock
Fpclk3 - 0 - 104.5
frequency
Internal APB4 clock
Fpclk4 - 0 - 133
frequency
Internal APB5 clock
Fpclk5 - 0 - 133
frequency
I/Os and embedded SYSCFG_IOCTRLSETR = 0 1.71(1)(2) - 3.6
regulators (REG1V1,
VDD V
REG1V8) supply SYSCFG_IOCTRLSETR ≠ 0 1.71 - 2.7
voltage
System analog
VDD_ANA(3) - 1.71 - 3.6 V
supply voltage
VDD_PLL,
PLL supply voltage - 1.71 - 3.6 V
VDD_PLL2(4)

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233
Electrical characteristics STM32MP151C/F

Table 13. General operating conditions (continued)

Symbol Parameter Operating conditions Min. Typ Max. Unit

Run mode
1.30 1.34 1.38
(Fmpuss_ck above 650 MHz)(5)
Run mode
1.18 1.20 1.25
Digital core domain (Fmpuss_ck up to 650 MHz)
VDDCORE V
supply voltage
Stop, LP-Stop mode 1.10 1.20 1.25
LPLV-Stop mode 0.85 0.90 1.25(6)
Standby mode 0 0 0.75
ADC used with VREF < 2 V 1.62 - 2
ADC used with VREF > 2 V 2 - 3.6
DAC used 1.8 - 3.6
VREFBUF with VREF = 1.5 V(7) - 3.6
Analog operating VREFBUF with VREF = 1.5 V 1.8
VDDA - 2 V
voltage and ADC used
VREFBUF with VREF = 1.8 V(8) 2.1 - 3.6
VREFBUF with VREF = 2.048 V 2.35 - 3.6
VREFBUF with VREF = 2.5 V 2.8 - 3.6
ADC, DAC, VREF not used 0 - 3.6

Backup operating 64 KB retention SRAM not used 1.2

VBAT - 3.6 V
voltage 64 KB retention SRAM used 1.4

USB FS I/O supply USB OTG FS used 3 3.3 3.6

VDD3V3_USBFS(9) V
voltage USB OTG FS not used 0 - 3.6
USBH or USB OTG HS used 3.07 3.3 3.6
(9)(10) USB HS I/O supply
VDD3V3_USBHS USBH and USB OTG HS not V
voltage 0 - 3.6
used

USB I/O supply USB used 3.07 3.3 3.6

VDD3V3_USB(9) V
voltage USB not used 0 - 3.6
DDR3 memory 1.425 1.5 1.575
(11) DDR PHY supply
VDDQ_DDR DDR3L memory 1.283 1.35 1.45 V
voltage
LPDDR2 or LPDDR3 1.14 1.2 1.3
USB HS PHY voltage
supply with 1.8 V
VDDA1V8_REG BYPASS_REG1V8 = VDD 1.65 1.8 1.95 V
regulator in bypass
mode

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STM32MP151C/F Electrical characteristics

Table 13. General operating conditions (continued)

Symbol Parameter Operating conditions Min. Typ Max. Unit

TTxa I/O -0.3 - VDD+0.3

OTG_VBUS I/O -0.3 - 6(12)
VIN I/O Input voltage DDR I/O -0.3 - VDDQ_DDR V
USB HS I/O -1 - 5.25
All I/O except TTxa -0.3 - See(13)

Junction temperature Suffix 1 version -20 - 105

o
TJ C
range Suffix 3 version -40 - 125
1. Once nRST is released functionality is guaranteed down to VBOR falling edge max.
2. Min VDD is 2.25 V when REG1V8 is used BYPASS_REG1V8 = 0.
3. Should be connected to same power supply voltage as VDD.
4. It is recommended to connect VDD_PLL and VDD_PLL2 to same power supply as VDD.
5. Only for STM32MP151Fxx1 devices
6. 1.25 V is the max allowed voltage, however LPLV-Stop mode is only relevant for VDDCORE up to 0.95 V. In LPLV-Stop
mode, if VDDQ_DDR is not shutdown, to avoid overconsumption on VDDQ_DDR, the DDR memory must be put in
SelfRefresh and DDR PHY must be set in retention mode (setting bit DDRRETEN: DDR retention enable of PWR control
register 3 (PWR_CR3)).
7. DAC cannot be used with VREF below 1.8 V.
8. ADC cannot be used with VREF below 2 V and VDDA above 2 V.
9. Depending on package selected, either VDD3V3_USBFS and VDD3V3_USBHS or only VDD3V3_USB are available.
10. For operation with voltage higher than Min (VDD, VDDA, VDD3V3_USBFS) + 0.3 V, the internal Pull-up and Pull-Down resistors
must be disabled.
11. Independent from any other supply, see details in Section 3.7.1: Power supply scheme.
12. Min(VDD, VDD3V3_USBFS) + 3.6 V < 6 V.
13. Min(VDD, VDDA, VDD3V3_USBFS) + 3.6 V < 5.5 V. This formula has to be applied on power supplies related to the IO
structure described by the pin definition table.

6.3.2 Operating conditions at power-up / power-down

Subject to general operating conditions.

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233
Electrical characteristics STM32MP151C/F

Table 14. Operating conditions at power-up / power-down

Symbol Parameter Min Max Unit

VDD rise time rate 0 ∞

tVDD(1)
VDD fall time rate 10 ∞
VDDA rise time rate 0 ∞
tVDDA
VDDA fall time rate 10 ∞
(2)
tVDD3V3_USB VDD3V3_USBxx rise time rate 0 ∞
tVDD3V3_USBHS µs/V
tVDD3V3_USBFS VDD3V3_USBxx fall time rate 10 ∞

VDDCORE rise time rate (from

- 2000(3)
reset to RUN mode)
tVDDCORE VDDCORE rise time rate (from
- 1000(4)
LPLV-Stop to RUN mode)
VDDCORE fall time rate 7.33 ∞
1. VDD must be present before VDDCORE .
2. VDDA1V8_REG must be present before VDD3V3_USBHS.
3. In case VDDCORE rise time is larger than 2 ms/V, user should control the NRST_CORE signal with a Power
Good (PG) control signal from the external regulator to avoid dysfunction of the device due to VDDCORE
potentially not yet established when internal reset signal is de-activated after tVDDCORETEMPO (cf.Table 14
and Figure 13).
4. In case VDDCORE rise time at exit of LPLV-Stop is larger than 1 ms/V, there is a risk of unwanted reset due
to VDDCORE potentially not yet established after tSEL_VDDCORETEMPO (cf.Table 14 and Figure 14). In such a
case, the VDDCORE supply should not be decreased during LPLV-Stop mode.

Figure 13. VDDCORE rise time from reset

average rise time rate should be less than
tVDDCORE Max (from reset to Run mode)

VDDCORE VDDCORE should be above

V VDDCORE Min when vddcore_ok is
enabled

VDDCORE Min

VPVDCORE_0 (rising edge)

tVDDCORETEMPO

pvdcore_out
Run mode

vddcore_ok

VDDCORE Min = VPVDCORE_0 Min (rising edge) + tVDDCORETEMPO Min / tVDDCORE Max
MSv47497V2

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STM32MP151C/F Electrical characteristics

Figure 14. VDDCORE rise time from LPLV-Stop

average rise time rate should be less than
tVDDCORE Max (from LPLV-Stop to Run
mode)
VDDCORE VDDCORE should be above
V VDDCORE Min at the end of
tSEL_VDDCORETEMPO

VDDCORE Min

VPVDCORE_1 (falling edge)

tSEL_VDDCORETEMPO

PWR_LP

LPLV-
Stop Wait Run mode
mode

VDDCORE Min = VPVDCORE_1 Min (falling edge) + tVSEL_VDDCORETEMPO Min / tVDDCORE Max
MSv47499V2

6.3.3 Embedded reset and power control block characteristics

The parameters given in Table 15 are derived from tests performed under ambient
temperature and VDD supply voltage conditions summarized in Table 13: General operating
conditions.

Table 15. Embedded reset and power control block characteristics

Symbol Parameter Conditions Min Typ Max Unit

Reset temporization. after

tRSTTEMPO(1) - - 377 550 µs
BOR0 released
Rising edge 1.62 1.67 1.71
VBOR0(1) Brown-out reset threshold 0 V
Falling edge 1.58 1.63 1.67
Rising edge 2.055 2.1 2.145
VBOR1 Brown-out reset threshold 1 V
Falling edge 1.955 2 2.045
Rising edge 2.355 2.4 2.445
VBOR2 Brown-out reset threshold 2 V
Falling edge 2.255 2.3 2.345
Rising edge 2.655 2.7 2.745
VBOR3 Brown-out reset threshold 3 V
Falling edge 2.555 2.6 2.645

Programmable Voltage Rising edge 1.905 1.95 1.995

VPVD0 V
Detector threshold 0 Falling edge 1.805 1.85 1.895

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233
Electrical characteristics STM32MP151C/F

Table 15. Embedded reset and power control block characteristics (continued)
Symbol Parameter Conditions Min Typ Max Unit

Programmable Voltage Rising edge 2.055 2.1 2.145

VPVD1 V
Detector threshold 1 Falling edge 1.955 2 2.045

Programmable Voltage Rising edge 2.205 2.25 2.295

VPVD2 V
Detector threshold 2 Falling edge 2.105 2.15 2.195

Programmable Voltage Rising edge 2.355 2.4 2.445

VPVD3 V
Detector threshold 3 Falling edge 2.255 2.3 2.345

Programmable Voltage Rising edge 2.505 2.55 2.595

VPVD4 V
Detector threshold 4 Falling edge 2.405 2.45 2.495

Programmable Voltage Rising edge 2.655 2.7 2.745

VPVD5 V
Detector threshold 5 Falling edge 2.555 2.6 2.645
Rising edge 2.805 2.85 2.895
Programmable Voltage
VPVD6 Falling edge in V
Detector threshold 6 2.705 2.75 2.795
RUN mode
Hysteresis in
Vhyst_BOR0 Hysteresis voltage of BOR0 - 40 - mV
RUN mode
Vhyst_BOR Hysteresis voltage of BOR Unless BOR0 - 100 - mV
Hysteresis voltage of BOR Hysteresis in
Vhyst_BOR_PVD - 100 - mV
(unless BOR0) and PVD(2) RUN mode
BOR (unless BOR0) and PVD
IDD_BOR_PVD(1)(3) - 0.246 - 0.626 µA
consumption from VDD

Analog voltage (VDDA) detector Rising edge 1.655 1.7 1.745

VAVM_0 V
threshold 0 Falling edge 1.555 1.6 1.645

Analog voltage (VDDA) detector Rising edge 2.055 2.1 2.145

VAVM_1 V
threshold 1 Falling edge 1.955 2 2.045

Analog voltage (VDDA) detector Rising edge 2.455 2.5 2.545

VAVM_2 V
threshold 2 Falling edge 2.355 2.4 2.445

Analog voltage (VDDA) detector Rising edge 2.755 2.8 2.845

VAVM_3 V
threshold 3 Falling edge 2.655 2.7 2.745
Hysteresis of analog voltage
Vhyst_VDDA - - 100 - mV
(VDDA) detector
Analog Voltage Monitoring
IVDD_AVM(1) - - - 0.248 µA
(VDDA) consumption on VDD
Analog Voltage Monitoring
IVDDA_AVM(1) Resistor bridge - 2.12 - µA
(VDDA) consumption on VDDA
Digital core domain supply Rising edge 0.95 0.995 1.04
VPVDCORE_0(4) voltage (VDDCORE) detector V
threshold 0 (Run) Falling edge 0.91 0.955 1

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STM32MP151C/F Electrical characteristics

Table 15. Embedded reset and power control block characteristics (continued)
Symbol Parameter Conditions Min Typ Max Unit

Digital core domain supply

VPVDCORE_1(5) voltage (VDDCORE) detector Falling edge 0.71 0.755 0.8 V
threshold 1 (LPLV_Stop)
Hysteresis of Digital core
Vhyst_VDDCORE domain supply voltage - - 40 - mV
(VDDCORE) detector
Tempo on VPVDCORE_0 at
rising edge of VDDCORE to
tVDDCORETEMPO - 200 340 550 µs
ensure that VDDCORE is fully
established
Tempo on VPVDCORE_1 at rising
tSEL_VDDCORETE edge of VDDCORE to ensure that
- 234 380 606 µs
MPO VDDCORE is fully established on
exit of LPLV-Stop mode
IVDD_VDDCOREVM VDDCORE Voltage Monitoring
(1) - 1.7 2.6 4.2 µA
consumption on VDD
USB_VTH USB Threshold voltage - - 1.21 - V
1. Guaranteed by design.
2. No hysteresis when using PVD_IN pin.
3. BOR0 is enabled in all modes and its consumption is therefore included in the supply current characteristics tables.
4. During the first rising edge of VDDCORE, the slope should be less than 2 ms/V to ensure VDDCORE is fully established before
the end of the tVDDCORETEMPO.
5. When exiting from LPLV-Stop mode to RUN mode the rising slope for VDDCORE should be less than 1 ms/V to ensure
VDDCORE is fully established before the end of the tVDDCORETEMPO.

6.3.4 Embedded reference voltage

The parameters given in Table 16, Table 17 are derived from tests performed under ambient
temperature and VDD supply voltage conditions summarized in Table 13: General operating
conditions.

Table 16. Embedded reference voltage

Symbol Parameter Conditions Min Typ Max Unit

VREFINT Internal reference voltages -40 °C < TJ < 125 °C 1.175 1.210 1.241 V
ADC sampling time when
tS_vrefint(1)(2) reading the internal reference - 4.3 - -
voltage
VBAT sampling time when
µs
tS_vbat(1) reading the internal VBAT - 9.8 - -
reference voltage
Start time of reference voltage
tstart_vrefint - 0.8 - 4.6
buffer when ADC is enable
Reference Buffer consumption
Irefbuf(2) VDDA = 3.3 V 9.1 13.6 27.7 µA
for ADC

DS12501 Rev 6 129/255

233
Electrical characteristics STM32MP151C/F

Table 16. Embedded reference voltage (continued)

Symbol Parameter Conditions Min Typ Max Unit

Internal reference voltage

ΔVREFINT(2) spread over the temperature -40 °C < TJ < 125 °C - 4.3 15 mV
range
Average temperature Average temperature
Tcoeff_VREFINT - 19 67 ppm/°C
coefficient coefficient
VDDcoeff Average Voltage coefficient 3.0 V < VDD < 3.6 V - 10 1370 ppm/V
1. The shortest sampling time for the application can be determined by multiple iterations.
2. Guaranteed by design.

Table 17. Embedded reference voltage calibration value

Symbol Parameter Memory address

VREFIN_CAL Raw data acquired at temperature of 30 °C, VDDA = VREF+ = 3.3 V 0x5C00 5250[31:16](1)(2)
1. Mandatory to read in 32-bits word and do relevant mask and shift to isolate required bits.
2. These address is inside BSEC which should be enabled in RCC to allow access.

6.3.5 Embedded regulators characteristics

The parameters given in Table 18, Table 19 are derived from tests performed under ambient
temperature and VDD supply voltage conditions summarized in Table 13: General operating
conditions.

REG1V1 embedded regulator (USB_PHY)

Table 18. REG1V1 embedded regulator (USB_PHY) characteristics(1)

Symbol Parameter Condition Min Typ Max Unit

VDDA1V1_
Regulated output voltage - 1.045 1.1 1.155 V
REG

CL Load Capacitor - 1.1 2.2(2) 3.3 µF

esr Equivalent Serial Resistor of Cload - 0.1 25 600 mΩ
Iload Static load current(3) - 0 - 30 mA
Start-up time. from CL=2.2uF - 93 -
tSTART PWR_CR3.REG11EN = 1 to µs
PWR_CR3.REG11RDY = 1 CL=3.3uF - - 180

VDD Inrush Current to load external

IINRUSH - - 50 60 mA
capacitor at start
Regulator Enabled and Iload =
- 150 205
Regulator Current consumption on 0 mA
IVDD µA
VDD Regulator Enabled and Iload =
- 176 242
30 mA
1. Guaranteed by design.
2. For better dynamic performances a 2.2 μF typical value external capacitor is recommended.
3. Load is for internal STM32MP151C/F analog blocks, no additional external load is accepted unless mentioned.

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STM32MP151C/F Electrical characteristics

REG1V8 embedded regulator (USB)

Table 19. REG1V8 embedded regulator (USB) characteristics(1)

Symbol Parameter Condition Min Typ Max Unit

VDD Regulator input voltage - 2.25 3.3 3.6 V

VDDA1V8_
Regulated output voltage after trimming 1.7 1.8 1.9 V
REG

CL Load Capacitor - 0.5 2.2(2) 3.3 µF

esr Equivalent Serial Resistor of Cload - 0.1 25 600 mΩ
(3)
Iload Static load current - - - 70 mA
Start-up time. from CL=2.2uF - 81 -
tSTART PWR_CR3.REG11EN = 1 to µs
PWR_CR3.REG11RDY = 1 CL=3.3uF - - 150

VDD Inrush Current to load external

IINRUSH - - 80 100 mA
capacitor at start
Regulator Enabled and Iload =
- 130 181
Regulator Current consumption on 0 mA
IVDD µA
VDD Regulator Enabled and Iload =
- 170 231
70 mA
1. Guaranteed by design.
2. For better dynamic performances a 2.2 μF typical value external capacitor is recommended.
3. Load is for internal STM32MP151C/F analog blocks, no additional external load is accepted unless mentioned.

6.3.6 Supply current characteristics

The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in Figure 12: Current consumption
measurement scheme.
All the Run mode current consumption measurements given in this section are performed
with a CoreMark code unless otherwise specified.

Typical and maximum current consumption

The device is placed under the following conditions:
• All I/O pins are in analog input mode except when explicitly mentioned.
• All peripherals are disabled except when explicitly mentioned.
• The maximum values are obtained for VDD/VBAT = 3.6 V and VDDCORE = 1.25 V, and
the typical values for VDD/VBAT = 3.3 V and VDDCORE = 1.2 V unless otherwise
specified.
The parameters given in Table 21 to Table 25 are derived from tests performed under
supply voltage conditions summarized in Table 13: General operating conditions.

DS12501 Rev 6 131/255

233
 Table 20. Current consumption (IDDCORE) in Run mode(1)
132/255

Electrical characteristics
Conditions Typ Max

Symbol Parameter MCU MPU MCU Unit

MPU SS Tj = Tj = Tj = Tj = Tj =
- SS Oscillator clk clk
mode 25 °C 25 °C 85 °C 105 °C 125 °C
mode (MHz) (MHz)

800(3) 470 520 765 955

744(3) 465 510 755 945
Supply
All peripherals
IDDCORE current in CRun CRun HSE+HSI+LSI+PLL 648 209 330 410 600 745 940 mA
enabled(2)
Run mode
600 325 405 580 740 935
400 295 375 565 705 905
800(3) 455 505 750 940
744(3) 445 495 740 930
Supply
All peripherals
DS12501 Rev 6

IDDCORE current in CRun CStop HSE+HSI+LSI+PLL 648 209 320 400 590 730 930 mA
enabled(2)
Run mode
600 310 390 580 725 920
400 285 360 550 695 890
(3)
HSE+HSI+PLL 800 - 275 320 575 760 -
HSE+HSI+PLL 744(3) - 265 310 565 750 -
HSE+HSI+PLL 648 - 180 240 425 570 770
HSE+HSI+PLL 600 - 175 230 420 565 765
HSE+HSI+PLL 300 - 135 190 380 520 725
Supply HSE+HSI+PLL 150 - 92 135 330 470 675
All peripherals
IDDCORE current in CRun CStop mA
disabled HSE+HSI+PLL 64 - 65 105 295 440 645
Run mode
HSE+HSI+PLL 24 - 51 90 280 425 630

STM32MP151C/F
HSE+HSI 24 - 35.5 70 265 410 615
HSI+PLL 64 - 65 85 275 420 625
HSI+PLL 24 - 51 75 270 415 620
HSI 64 - 49 75 270 410 615
 Table 20. Current consumption (IDDCORE) in Run mode(1) (continued)

STM32MP151C/F
Conditions Typ Max

Symbol Parameter MCU MPU MCU Unit

MPU SS Tj = Tj = Tj = Tj = Tj =
- SS Oscillator clk clk
mode 25 °C 25 °C 85 °C 105 °C 125 °C
mode (MHz) (MHz)

HSE+HSI+PLL 800(3) - 165 210 465 650 -

(3)
HSE+HSI+PLL 744 - 160 205 465 650 -
HSE+HSI+PLL 648 - 110 160 350 495 695
HSE+HSI+PLL 600 - 110 155 350 490 695
MPU in HSE+HSI+PLL 300 - 100 150 340 485 685
CSleep with
Supply HSE+HSI+PLL 150 - 74 115 310 450 655
WFI (CLK
IDDCORE current in CSleep CStop mA
OFF). All HSE+HSI+PLL 64 - 57 95 290 430 635
Run mode
peripherals
HSE+HSI+PLL 24 - 48.5 85 280 420 625
DS12501 Rev 6

disabled
HSE+HSI 24 - 32.5 70 265 405 610
HSI+PLL 64 - 57 80 275 415 620
HSI+PLL 24 - 48 75 270 410 615
HSI 64 - 41 70 265 405 610

Electrical characteristics
133/255
 Table 20. Current consumption (IDDCORE) in Run mode(1) (continued)
134/255

Electrical characteristics
Conditions Typ Max

Symbol Parameter MCU MPU MCU Unit

MPU SS Tj = Tj = Tj = Tj = Tj =
- SS Oscillator clk clk
mode 25 °C 25 °C 85 °C 105 °C 125 °C
mode (MHz) (MHz)

HSE+HSI+PLL - 209 71 115 305 450 650

HSE+HSI+PLL - 100 53 95 285 430 635
HSE+HSI+PLL - 64 59.5 100 295 435 640
HSE+HSI+PLL - 24 53 95 285 430 635
HSE+HSI+PLL - 10 38.5 75 270 410 615
HSE+HSI+PLL - 4 37.5 75 270 410 615
Supply HSE+HSI - 24 27.5 65 260 400 605
All peripherals
IDDCORE current in CStop CRun mA
disabled HSI+PLL - 64 59 85 280 420 625
DS12501 Rev 6

Run mode
HSI+PLL - 24 53 80 275 415 620
HSI - 64 33.5 65 260 400 605
CSI+HSI+PLL - 64 59.5 85 280 420 625
CSI+HSI+PLL - 24 53 80 275 415 620
CSI+HSI+PLL - 4 37 70 265 405 610
CSI+HSI - 4 24 60 255 395 600

STM32MP151C/F
 Table 20. Current consumption (IDDCORE) in Run mode(1) (continued)

STM32MP151C/F
Conditions Typ Max

Symbol Parameter MCU MPU MCU Unit

MPU SS Tj = Tj = Tj = Tj = Tj =
- SS Oscillator clk clk
mode 25 °C 25 °C 85 °C 105 °C 125 °C
mode (MHz) (MHz)

HSE+HSI+PLL - 209 59.5 100 295 435 640

HSE+HSI+PLL - 100 47.5 90 280 420 625
HSE+HSI+PLL - 64 56 95 290 430 635
HSE+HSI+PLL - 24 52 90 285 425 630
HSE+HSI+PLL - 10 38 75 270 410 615
MCU in HSE+HSI+PLL - 4 37 75 270 410 615
CSleep with
Supply HSE+HSI - 24 26 65 260 400 605
WFI (CLK
IDDCORE current in CStop CSleep mA
OFF). All HSI+PLL - 64 55.5 80 275 415 620
DS12501 Rev 6

Run mode
peripherals
disabled HSI+PLL - 24 51.5 80 275 410 620
HSI - 64 30 65 260 400 605
CSI+HSI+PLL - 64 56 85 275 420 625
CSI+HSI+PLL - 24 51.5 80 275 415 620
CSI+HSI+PLL - 4 37 70 265 405 610
CSI+HSI - 4 23.5 60 255 395 600
1. HSE = 24 MHz, AXI clk (Faxiss_ck) = Max(Fmpuss_ck, 264).
2. Activity on peripherals and bus masters other than processors, could lead to additional power consumption above these values, largely dependent on the amount of
initialized peripherals and their activity.

Electrical characteristics
3. Typical value given with VDDCORE = 1.34 V, maximum values given with VDDCORE = 1.38 V.
135/255
 Table 21. Current consumption (IDD) in Run mode(1)
136/255

Electrical characteristics
Conditions Typ Max

Symbol Parameter MCU Unit

Tj = Tj = Tj = Tj = Tj =
MPU SS mode SS Oscillator
25 °C 25 °C 85 °C 105 °C 125 °C
mode

IDD Supply current in Run mode CRun CRun HSE+HSI+LSI+PLL1,2,3,4 3.95 6.14 6.40 6.50 6.60 mA
HSI+PLL1,2 3.00 4.67 4.90 5.00 5.10
IDD Supply current in Run mode CRun CStop HSE+HSI 1.75 3.45 3.48 3.49 3.50 mA
HSI 1.25 2.46 2.48 2.49 2.50
1. HSE = 24 MHz.

Table 22. Current consumption in Stop mode(1)

Conditions Typ Max
DS12501 Rev 6

Symbol Parameter Unit

MPU SS MCU SS Tj = Tj = Tj = Tj = Tj = Tj = Tj = Tj =
-
mode mode 25 °C 85 °C 105 °C 125 °C 25 °C 85 °C 105 °C 125 °C

All peripherals
CStop CStop 980 985 985 995 1500 1560 1580 1600
disabled
IDD
All peripherals
Supply CStandby CStop 980 985 985 995 1500 1560 1580 1600
disabled
current in µA
Stop mode All peripherals
CStop CStop 19000 90500 150000 230000 55000 261000 425000 585000
disabled
IDDCORE
All peripherals
CStandby CStop 19000 90000 150000 225000 54500 261000 425000 585000
disabled
1. HSE = 24 MHz.

STM32MP151C/F
 Table 23. Current consumption in LPLV-Stop mode(1)

STM32MP151C/F
Conditions Typ(2) Max(3)
Symbol Parameter Unit
MPU SS MCU SS Tj = Tj = Tj = Tj = Tj = Tj = Tj = Tj =
-
mode mode 25 °C 85 °C 105 °C 125 °C 25 °C 85 °C 105 °C 125 °C

All Peripheral
CStop CStop 980 985 985 995 1500 1560 1580 1600
disabled
IDD
Supply All Peripheral
CStandby CStop 980 985 985 995 1500 1560 1580 1600
current in disabled
µA
LPLV-Stop All Peripheral
mode CStop CStop 7150 39000 67500 105000 25000 122000 190000 290000
disabled
IDDCORE
All Peripheral
CStandby CStop 7150 39000 67500 105000 25000 122000 190000 290000
disabled
1. HSE = 24 MHz.
2. VDDCORE = 0.9 V.
DS12501 Rev 6

3. VDDCORE = 0.95 V.

Electrical characteristics
137/255
 Table 24. Current consumption in Standby mode(1)
138/255

Electrical characteristics
Conditions Typ Max

Symbol Parameter MCU Unit

MPU SS Tj = Tj = Tj = Tj = Tj = Tj = Tj = Tj=
- SS
mode 25 °C 85 °C 105 °C 125 °C 25 °C 85 °C 105 °C 125 °C
mode

Backup
SRAM
OFF,
RTC Retention CStandby CStop 1.95 4.00 7.60 13.5 4 12 18 32
OFF, RAM OFF
LSE
Supply OFF
current in Backup CStandby CStop 9.6 38.5 64.5 105 17.5 70 110 180
IDD µA
Standby SRAM
mode ON,
RTC
DS12501 Rev 6

ON, LSE Retention

ON, CStandby CStop 74 460 800 1300 130 850 1500 2300
RAM ON
medium
_high
drive
1. IWDG OFF, LSI OFF, VDDCORE = 0 V.

STM32MP151C/F
 Table 25. Current consumption in VBAT mode

STM32MP151C/F
Conditions Typ Max
Symbol Parameter Unit
Tj = Tj = Tj = Tj = Tj = Tj = Tj = Tj =
- VBAT (V)
25 °C 85 °C 105 °C 125 °C 25 °C 85 °C 105 °C 125 °C

1.6 0.007 0.13 0.39 1.1 - - - -

2.4 0.008 0.14 0.415 1.15 - - - -
Backup SRAM OFF,
3 0.012 0.175 0.495 1.35 - - - -
RTC OFF, LSE OFF
3.3 0.041 0.52 1.45 3.9 - - - -
3.6 0.073 0.62 1.65 4.25 0.11 1 2.2 6
1.6 0.84 1.05 1.35 2.1 - - - -
2.4 1.05 1.3 1.6 2.45 - - - -
Backup SRAM OFF,
RTC ON, LSE ON, 3 1.25 1.5 1.9 2.8 - - - -
medium_high drive
DS12501 Rev 6

3.3 1.4 2 3.05 5.7 - - - -

Supply 3.6 1.55 2.25 3.35 6.25 2 3.5 5.5 9
Retention
IDDVBAT current in µA
RAM OFF 1.6 7.75 31 54 87.5 - - - -
VBAT mode
2.4 8.25 31.5 55 88.5 - - - -
Backup SRAM ON,
RTC ON,. LSE ON, 3 8.45 33 57 91.5 - - - -
medium_high drive
3.3 9.5 34 59 95.5 - - - -
3.6 9.55 35 60.5 98 15 62 93 151
1.6 7.9 31.5 55 89 - - - -
2.4 8.4 32.5 56 90 - - - -

Electrical characteristics
Backup SRAM ON,
RTC ON,. LSE ON, 3 8.6 33.5 58 93 - - - -
high drive
3.3 9.2 35 60.5 97.5 - - - -
3.6 9.85 36 62.5 100 15 63 93 151
139/255
 Table 25. Current consumption in VBAT mode (continued)
140/255

Electrical characteristics
Conditions Typ Max
Symbol Parameter Unit
Tj = Tj = Tj = Tj = Tj = Tj = Tj = Tj =
- VBAT (V)
25 °C 85 °C 105 °C 125 °C 25 °C 85 °C 105 °C 125 °C

1.6 74 405 760 1250 - - - -

2.4 76 410 765 1250 - - - -
Backup SRAM ON,
RTC ON,. LSE ON, 3 81 420 785 1300 - - - -
medium_high drive
3.3 79 430 795 1300 - - - -
Supply 3.6 84.5 435 815 1350 180 850 1350 2000
Retention
IDDVBAT current in µA
RAM ON 1.6 75.5 405 770 1250 - - - -
VBAT mode
2.4 75.5 410 770 1250 - - - -
Backup SRAM ON,
RTC ON, LSE ON, 3 76 425 790 1300 - - - -
high drive
DS12501 Rev 6

3.3 78 435 805 1300 - - - -

3.6 84.5 440 820 1350 180 870 1350 2000

STM32MP151C/F
STM32MP151C/F Electrical characteristics

I/O system current consumption

The current consumption of the I/O system has two components: static and dynamic.

I/O static current consumption

All the I/Os used as inputs with pull-up generate a current consumption when the pin is
externally held low. The value of this current consumption can be simply computed by using
the pull-up/pull-down resistors values given in Table 50: I/O static characteristics.
For the output pins, any external pull-down or external load must also be considered to
estimate the current consumption.
An additional I/O current consumption is due to I/Os configured as inputs if an intermediate
voltage level is externally applied. This current consumption is caused by the input Schmitt
trigger circuits used to discriminate the input value. Unless this specific configuration is
required by the application, this supply current consumption can be avoided by configuring
these I/Os in analog mode. This is notably the case of ADC input pins which should be
configured as analog inputs.
Caution: Any floating input pin can also settle to an intermediate voltage level or switch inadvertently,
as a result of external electromagnetic noise. To avoid a current consumption related to
floating pins, they must either be configured in analog mode, or forced internally to a definite
digital value. This can be done either by using pull-up/down resistors or by configuring the
pins in output mode.

I/O dynamic current consumption

The I/Os used by an application contribute to the current consumption. When an I/O pin
switches, it uses the current from the MCU supply voltage to supply the I/O pin circuitry and
to charge/discharge the capacitive load (internal or external) connected to the pin.
The theoretical formula is provided below:

I SW = V DDx × f SW × C L

where
ISW is the current sunk by a switching I/O to charge/discharge the capacitive load
VDDx is the MCU supply voltage
fSW is the I/O switching frequency
CL is the total capacitance seen by the I/O pin: C = CINT+ CEXT

6.3.7 Wakeup time from low-power modes

The wakeup times given in Table 26 are measured starting from the wakeup event trigger up
to the first instruction executed by the MPU or MCU:
• For CSleep modes:
– the MPU or MCU goes in low-power mode after WFE (Wait For Event) instruction.
• For CStop modes:
– MCU goes in low-power mode after WFE (Wait For Event) instruction.
– MPU goes in low-power mode after WFI (Wait For Interrupt) instruction.
• WKUPx pin is used to wakeup from low-power modes.

DS12501 Rev 6 141/255

233
Electrical characteristics STM32MP151C/F

All timings are derived from tests performed under ambient temperature and VDD = 3.3 V.

Table 26. Low-power mode wakeup timings

System Max(
Symbol Parameter Conditions (after wakeup) Typ(1) 1) Unit
mode

MPU wakeup
mpuss_
tWUCSLEEP_M MPU wakeup from
Run HSE 24 MHz, SYSRAM 31 32 ck clock
PU CSleep, MCU in CSleep
cycles

MPU wakeup from HSI 64 MHz, SYSRAM 5.7 9

Stop
CStop, MCU in CStop HSE + PLL 648 MHz, SYSRAM 112 220
tWUCSTOP_MP
U
MPU wakeup from HSI 64 MHz, SYSRAM 0.54 1
Run
CStop, MCU in CRun HSE + PLL 648 MHz, SYSRAM 0.083 0.17 µs
MPU wakeup from
tWULPLV- CStop with system in LPLV-
HSI 64 MHz, SYSRAM 410 640
Stop_MPU LPLV-Stop (LVDS=1), Stop
MCU in CStop
MCU wakeup
mcu_ck
tWUCSLEEP_M MCU wakeup from
Run HSE 24 MHz, SRAM 6 7 clock
CU CSleep, MPU in CSleep
cycles
HSI 64 MHz, SRAM,
MCU wakeup from 5.3 8 µs
MCTMPSKP = 1
tWULPLV- CStop with system in LPLV-
LPLV-Stop (LVDS=1), Stop HSI 64 MHz, SRAM,
Stop_MCU
MPU in CStop MCTMPSKP = 0, PWR_LP 1.4 2.2 ms
delay = 1 ms
tWUCSTOP_ MCU wakeup from
Stop HSI 64 MHz, SRAM 5.3 8
MCU CStop, MPU in CStop
MCU wakeup from
Stop
tWUCSTOP_ CStop, HSI active
(HSI HSI 64 MHz, SRAM 0.33 0.5
MCU2 (HSIKERON=1), MPU in
active) µs
CStop
tWUCSTOP_ MCU wakeup from
Run HSI 64 MHz, SRAM 0.12 0.18
MCU3 CStop, MPU in CRun
tWUSTANDBY_ MCU wakeup from
Standby HSI 64 MHz, RETRAM 2550 3000
MCU STANDBY
1. Guaranteed by characterization results unless otherwise specified.

Table 27. Wakeup time using USART(1)

Symbol Parameter Conditions Typ Max Unit

Wakeup time needed to calculate the

maximum USART baud rate allowing the
tWUUSART Stop - 6.7 µs
wakeup from Stop mode when USART
clock source is HSI.
1. Guaranteed by design.

142/255 DS12501 Rev 6

STM32MP151C/F Electrical characteristics

6.3.8 External clock source characteristics

High-speed external user clock generated from an external source
In bypass mode the HSE oscillator is switched off and the input pin is a standard I/O.
Digital and analog bypass modes are available.
The external clock signal has to respect the Table 50: I/O static characteristics. However,
the recommended clock input waveform is shown in Figure 15 for digital bypass mode and
in Figure 16 for analog bypass mode. In analog bypass mode the clock can be a sinusoidal
waveform.

Table 28. High-speed external user clock characteristics

(digital bypass)(1)
Symbol Parameter Min Typ Max Unit

fHSE_ext User external clock source frequency 8 24 48 MHz

VSW (VHSEH -VHSEL) OSC_IN amplitude 0.7×VDD - VDD
V
VDC OSC_IN input voltage VSS - 0.3×VSS
tW(HSE) OSC_IN high or low time 7 - - ns
1. Guaranteed by design.

Figure 15. High-speed external clock source AC timing diagram (digital bypass)

VHSEH
90 %
10 %
VHSEL
tr(HSE) tf(HSE) tW(HSE) tW(HSE) t

THSE

External fHSE_ext
IL
clock source OSC_IN
STM32

ai17528b

Table 29. High-speed external user clock characteristics

(analog bypass)(1)
Symbol Parameter Min Typ Max Unit

User external clock source frequency 8 24 48 MHz

fHSE_ext duty cycle (Square wave) 45 50 55 %
duty cycle deterioration 0 ±10(2) ±20(3) %
VHSE Absolute input range 0 - VDD -

DS12501 Rev 6 143/255

233
Electrical characteristics STM32MP151C/F

Table 29. High-speed external user clock characteristics

(analog bypass)(1) (continued)
Symbol Parameter Min Typ Max Unit
(4)
VPP OSC_IN peak-to-peak amplitude 0.2 - 0.67×VDD V
tSU(5) Time to start - 1 10(6) µs
Rise and Fall time
tr/tf(HSE) (10% to 90% threshold levels of the 0.05 ×THSE - 0.3 ×THSE ns
input peak-to-peak amplitude)
I(HSE) Power consumption - 150(7) 500(8) µA
1. Guaranteed by design.
2. Guaranteed by design with a square wave signal (@25 °C, VDD=3.3 V /VPP = 400 mV / VDC=1 V) where
VDC is the DC component of the input signal.
3. Guaranteed by design with a square wave signal (@25 °C, VDD=1.71 V /VPP = 200 mV / VDC=0.8 V) where
VDC is the DC component of the input signal.
4. minimum peak-to-peak amplitude (@25 °C, 0.1<VDC<VDD-0.1 V) where VDC is the DC component of the
input signal.
5. tSU(HSE) is the startup time measured from the moment it is enabled (by software) to a stabilized analog
bypass clock interface is reached. This value is measured with 200 mV peak-to-peak amplitude.
6. Maximum start-up time is obtained with 200 mV peak-to-peak amplitude.
7. with a sine wave signal (VPP = 400 mV / VDC=0.4 V) where VDC is the DC component of the input signal.
8. with a sine wave signal (VDD = 3.6 V / VPP = 800 mV / VDC = 1.8 V) where VDC is the DC component of the
input signal.

Figure 16. High-speed external clock source AC timing diagram (analog bypass)
VHSE

90%

VPP

10%

THSE tr(HSE) t

External
fHSE_ext OSC_IN
clock source IL

STM32
MSv47498V1

Table 30. Low-speed external user clock characteristics

(analog bypass)(1)
Symbol Parameter Min Typ Max Unit

fLSE_ext User external clock source frequency - 32.768 - kHz

VLSE Absolute input range 0 - VSW(2) -

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Table 30. Low-speed external user clock characteristics

(analog bypass)(1) (continued)
Symbol Parameter Min Typ Max Unit
(3)
VPP OSC32_IN peak-to-peak amplitude 0.2 1 - V
I(LSE) Power consumption - 120 - nA
1. Guaranteed by design.
2. VSW is equal to VDD when present or VBAT otherwise
3. Minimum peak-to-peak amplitude (@25 °C, 0.1 < VDC < VSW - 0.1 V) where VDC is the DC component of
the input signal.

Figure 17. Low-speed external clock source AC timing diagram (analog bypass)
VLSE

VPP

TLSE t

External
fLSE_ext OSC32_IN
clock source IL

STM32
MSv63037V1

Low-speed external user clock generated from an external source

In bypass mode the LSE oscillator is switched off and the input pin is a standard I/O. The
external clock signal has to respect the Table 50: I/O static characteristics. However, the
recommended clock input waveform is shown in Figure 18 for digital bypass and Figure 17
for analog bypass.

Table 31. Low-speed external user clock characteristics (digital bypass)(1)

Symbol Parameter Min Typ Max Unit

fLSE_ext User external clock source frequency - 32.768 1000 kHz

VLSEH OSC32_IN input pin high level voltage 0.7 × VDD - VDD
V
VLSEL OSC32_IN input pin low level voltage VSS - 0.3 VDD
tw(LSEH)
OSC32_IN high or low time 250 - - ns
tw(LSEL)
1. Guaranteed by design.

Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.

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Figure 18. Low-speed external clock source AC timing diagram

VLSEH
90%
10%
VLSEL
tr(LSE) tf(LSE) tW(LSE) tW(LSE) t

TLSE

External fLSE_ext
OSC32_IN IL
clock source
STM32

ai17529b

High-speed external clock generated from a crystal/ceramic resonator

The high-speed external (HSE) clock can be supplied with a 8 to 48 MHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on
characterization results obtained with typical external components specified in Table 32. In
the application, the resonator and the load capacitors have to be placed as close as
possible to the oscillator pins in order to minimize output distortion and startup stabilization
time. Refer to the crystal resonator manufacturer for more details on the resonator
characteristics (frequency, package, accuracy).

Table 32. 8-48 MHz HSE oscillator characteristics(1)

Symbol Parameter Operating conditions(2) Min Typ Max Unit

F Oscillator frequency - 8 24 48 MHz

RF Feedback resistor - - 200 - kΩ
(3)
During startup - - 4
VDD = 3 V, Rm = 150 Ω
- 0.35 -
CL = 12 pF at 4 MHz
VDD = 3 V, Rm = 120 Ω
- 0.40 -
CL = 12 pF at 16 MHz
IDD(HSE) HSE current consumption VDD = 3 V, Rm = 100 Ω mA
- 0.45 -
CL = 10 pF at 24 MHz
VDD = 3 V, Rm = 80 Ω
- 0.65 -
CL = 8 pF at 32 MHz
VDD = 3 V, Rm = 80 Ω
- 0.95 -
CL = 8 pF at 48 MHz
Gmcritmax Maximum critical crystal gm Startup - - 1.5 mA/V
tSU(4) Start-up time VDD is stabilized - 2 - ms
1. Guaranteed by design.
2. Resonator characteristics given by the crystal/ceramic resonator manufacturer.

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3. This consumption level occurs during the first 2/3 of the tSU(HSE) startup time.
4. tSU(HSE) is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz oscillation is
reached. This value is measured for a standard crystal resonator and it can vary significantly with the crystal manufacturer.

For CL1 and CL2, it is recommended to use high-quality external ceramic capacitors in the
5 pF to 25 pF range (typical), designed for high-frequency applications, and selected to
match the requirements of the crystal or resonator (see Figure 19). CL1 and CL2 are usually
the same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of CL1 and CL2. The PCB and MCU pin capacitance must be included
(10 pF can be used as a rough estimate of the combined pin and board capacitance) when
sizing CL1 and CL2.
Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.

Figure 19. Typical application with a 24 MHz crystal

CL1
OSC_IN fHSE

Bias
24 MHz
RF controlled
crystal
gain

OSC_OUT
STM32
CL2
MSv63062V1

Low-speed external clock generated from a crystal/ceramic resonator

The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on
characterization results obtained with typical external components specified in Table 33. In
the application, the resonator and the load capacitors have to be placed as close as
possible to the oscillator pins in order to minimize output distortion and startup stabilization
time. Refer to the crystal resonator manufacturer for more details on the resonator
characteristics (frequency, package, accuracy).

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Table 33. Low-speed external user clock characteristics(1)

Symbol Parameter Operating conditions(2) Min Typ Max Unit

F Oscillator frequency - - 32.768 - kHz

LSEDRV[1:0] = 00,
- 290 -
Low drive capability
LSEDRV[1:0] = 01,
- 390 -
LSE current Medium Low drive capability
IDD nA
consumption LSEDRV[1:0] = 10,
- 550 -
Medium high drive capability
LSEDRV[1:0] = 11,
- 900 -
High drive capability
LSEDRV[1:0] = 00,
- - 0.5
Low drive capability
LSEDRV[1:0] = 01,
- - 0.75
Maximum critical crystal Medium Low drive capability
Gmcritmax µA/V
gm LSEDRV[1:0] = 10,
- - 1.7
Medium high drive capability
LSEDRV[1:0] = 11,
- - 2.7
High drive capability
tSU(3) Startup time VDD is stabilized - 2 - s
1. Guaranteed by design.
2. Refer to the note and caution paragraphs below the table, and to the application note AN2867 “Oscillator design guide for
ST microcontrollers.
3. tSU is the startup time measured from the moment it is enabled (by software) to a stabilized 32.768 k Hz oscillation is
reached. This value is measured for a standard crystal resonator and it can vary significantly with the crystal manufacturer.

Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.

Figure 20. Typical application with a 32.768 kHz crystal

Resonator with
integrated capacitors CL1
OSC32_IN fHSE

Bias
32.768 kHz
RF controlled
resonator
gain

OSC32_OUT
STM32
CL2
ai17531c

1. Adding an external resistor between OSC32_IN and OSC32_OUT is forbidden.

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6.3.9 External clock source security characteristics

Table 34. High-speed external user clock security system (HSE CSS)(1)
Symbol Parameter Min Typ Max Unit

tDCM(HSE_CSS) Time to detect clock missing - 2 - μs

tDCP(HSE_CSS) Time to detect clock presence - - 250 ns
IVDD(HSE_CSS) Power consumption (fHSE = 48 MHz) - - 50 μA
1. Guaranteed by design.

6.3.10 Internal clock source characteristics

The parameters given in Table 35, Table 36 and Table 37 are derived from tests performed
under ambient temperature and VDD supply voltage conditions summarized in Table 13:
General operating conditions.

64 MHz high-speed internal RC oscillator (HSI)

Table 35. HSI oscillator characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

fHSI(2) HSI frequency VDD = 3.3 V, TJ = 30 °C 63.7 64 64.3 MHz

Trimming is not a multiple
- 0.24 0.33
of 32
Trimming is 128, 256 and
- -2.43 -
384

TRIM HSI user trimming step Trimming is 64, 192, 320 %

- -0.70 -
and 448
Other trimming are a
multiple of 32 (not
- -0.30 -
including multiple of 64
and 128)
DuCy(HSI) Duty Cycle - 45 - 55 %
HSI oscillator frequency drift over VDD
ΔVDD (HSI) VDD = 1.71 to 3.6 V -0.12 - 0.03 %
(reference is 3.3 V)

HSI oscillator frequency drift over TJ = -20 to 110 °C -1.25 - 0.75

ΔTEMP (HSI)(3) %
temperature after factory calibration TJ = -40 to 125 °C -1.75 - 0.95
HSI oscillator start-up time (Time
tsu(HSI) between Enable rising and First output - - 1.47 2 µs
clock edge.)
tstab(HSI) HSI oscillator stabilization time at 1% of target frequency - 3 - µs
IDD(HSI) HSI oscillator power consumption - - 300 400 µA
1. Guaranteed by design unless otherwise specified.
2. Guaranteed by test in production.
3. Guaranteed by characterization results.

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4 MHz low-power internal RC oscillator (CSI)

Table 36. CSI oscillator characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

fCSI(2) CSI frequency VDD = 3.3 V, TJ = 30 °C 3.98 4 4.02 MHz

Trimming code is not a
- 0.85 1 %
multiple of 16
TRIM Trimming step
Trimming code is a multiple of
- -1.65 - -
16
DuCy(CSI) Duty Cycle - 45 - 55 %

∆VDD (CSI) + CSI oscillator frequency drift over VDD = 1.71 to 3.6 V
- ±1.43 - %
∆TEMP (CSI)(3) VDD & drift over temperature TJ = 0 to 85 °C
tsu(CSI) CSI oscillator startup time - - 1.5 2.4 µs
CSI oscillator stabilization time
tstab(CSI) TJ = 0 to 85 °C - 5 - cycle
(to reach ±5% of fCSI)
IDD(CSI) CSI oscillator power consumption - - 30 - µA
1. Guaranteed by design.
2. Guaranteed by test in production.
3. Guaranteed by characterization results.

32 kHz low-speed internal (LSI) RC oscillator

Table 37. LSI oscillator characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

TJ = 30 °C,(2)
31.4 32 32.6
VDD = 3.3 V
fLSI LSI frequency kHz
TJ = -40 to 125 °C,
29 32 33.6
VDD = 1.71 to 3.6 V
LSI oscillator startup time (Time
tsu(LSI) between Enable rising and First - - 64 125
output clock edge.) µs
LSI oscillator stabilization time
tstab(LSI) - - 110 170
(5% of final value)
LSI oscillator power
IDD(LSI) - - 120 230 nA
consumption
1. Guaranteed by design.
2. Guaranteed by test in production.

6.3.11 PLL characteristics

The parameters given in Table 38, Table 39, Table 40 are derived from tests performed
under temperature and VDD supply voltage conditions summarized in Table 13: General
operating conditions.

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PLL1_1600, PLL2_1600 characteristics

Table 38. PLL1_1600, PLL2_1600 characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

PLL input clock Normal mode and Sigma delta mode 8 - 16 MHz
fPLL_IN PLL input clock
- 10 - 90 %
duty cycle
PLL P,Q,R
multiplier output - 3.125 - 800(2) MHz
clock
Division by 1 45 50 55
fPLL_P_Q_R_ Even divisions
45 50 55
OUT (N multiple of 2)
PLL P,Q,R clock
%
duty cycle [100,
[100, [100,
Odd divisions (N+1)/
(N+1)/ (N+1)/
(N not multiple of 2) 2N] +
2N] - 5 2N]
5
fVCO_OUT PLL VCO output - 800 - 1600 MHz
Normal mode - 50 150
tLOCK PLL lock time µs
Sigma-delta mode (CKIN ≥ 8 MHz) - 65 170
Lock Accuracy
(Ratio VCO
ALOCK frequency versus - - - ±2 %
target frequency at
lock)

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Table 38. PLL1_1600, PLL2_1600 characteristics(1) (continued)

Symbol Parameter Conditions Min Typ Max Unit
(3)
VCO = 800 MHz - 18 -
fPLL_P_Q_R_OUT division = 1
to 16 VCO = 1066 MHz - 14(3) -
RMS cycle-to- Without Fractional mode (3)
VCO = 1600 MHz - 12 - ±ps
cycle jitter (3)
fPLL_P_Q_R_OUT division = 1 VCO = 1066 MHz - 20 -
to 16
With Fractional mode VCO = 1600 MHz - 18(3) -

VCO = 800 MHz - 16(3) -

fPLL_P_Q_R_OUT division = 1
to 16 VCO = 1066 MHz - 12(3) -
Without Fractional mode (3)
RMS period jitter VCO = 1600 MHz - 10 - ±ps
Jitter
fPLL_P_Q_R_OUT division = 1 VCO = 1066 MHz - 16(3) -
to 16
With Fractional mode VCO = 1600 MHz - 15(3) -

fPLL_P_Q_R_OUT division = 1 VCO = 800 MHz - 225(4) -

to 16
VCO = 1066 MHz - 200(4) -
fPLL_IN = 8 MHz
Without Fractional mode VCO = 1600 MHz - 100(4) -
Long term jitter ps
fPLL_P_Q_R_OUT division = 1 VCO = 800 MHz - 350(4) -
to 16
VCO = 1066 MHz - 250(4) -
fPLL_IN = 8 MHz
With Fractional mode VCO = 1600 MHz - 150(4) -

PLL power VCO freq = 1600 MHz - 930 -

IVDD_PLL(2) consumption on µA
VDD_PLL (Analog) VCO freq = 800 MHz - 560 -

PLL power VCO freq = 1600 MHz - 4200 -

IVDDCORE(2) consumption on μA
VDDCORE (Digital) VCO freq = 800 MHz - 2100 -

1. Guaranteed by design unless otherwise specified.

2. Guaranteed by characterization results.
3. Measured on DDR high speed IO.
4. Measured on DDR high speed IO for 10000 output clock cycles.

PLL3_800, PLL4_800 characteristics

Table 39. PLL3_800, PLL4_800 characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

PLL input clock Normal mode 4 - 16

MHz
- Sigma delta mode 8 - 16
fPLL_IN
PLL input clock
- 10 - 90 %
duty cycle

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Table 39. PLL3_800, PLL4_800 characteristics(1) (continued)

Symbol Parameter Conditions Min Typ Max Unit

PLL P,Q,R
multiplier output - 3.125 - 800(2) MHz
clock
Even divisions
fPLL_P_Q_R_ 45 50 55
(N multiple of 2)
OUT
PLL P,Q,R clock [100,
[100, [100, %
duty cycle Odd divisions (N+1)/
(N+1)/ (N+1)/
(N not multiple of 2) 2N] +
2N] - 5 2N]
5
fVCO_OUT PLL VCO output - 400 - 800 MHz
Normal mode 15 50 150
tLOCK PLL lock time µs
Sigma-delta mode (CKIN ≥ 8 MHz) 25 65 170
Lock accuracy
(Ratio VCO
ALOCK frequency versus - - - ±2 %
target frequency at
lock)
VCO = 400 MHz - 80(3) -
fPLL_P_Q_R_OUT division =
25 to 100 (3)
VCO = 600 MHz - 50 -
RMS cycle-to- Without Fractional mode
VCO = 800 MHz - 45(3) - ±ps
cycle jitter
fPLL_P_Q_R_OUT division = VCO = 600 MHz - 65(3) -
25 to 100
With Fractional mode VCO = 800 MHz - 60(3) -

VCO = 400 MHz - 75(3) -

fPLL_P_Q_R_OUT division =
25 to 100 (3)
VCO = 600 MHz - 38 -
Without Fractional mode (3)
RMS period jitter VCO = 800 MHz - 30 - ±ps
Jitter
fPLL_P_Q_R_OUT division = VCO = 600 MHz - 55(3) -
25 to 100
With Fractional mode VCO = 800 MHz - 50(3) -

fPLL_P_Q_R_OUT division = VCO = 400 MHz - 225(4) -

25 to 100
VCO = 600 MHz - 150(4) -
fPLL_IN = 8 MHz
Without Fractional mode VCO = 800 MHz - 125(4) -
Long term jitter ps
fPLL_P_Q_R_OUT division = VCO = 400 MHz - 300(4) -
25 to 100
VCO = 600 MHz - 200(4) -
fPLL_IN = 8 MHz
With Fractional mode VCO = 800 MHz - 150(4) -

PLL power VCO freq = 800 MHz - 600 610

IVDD_PLL consumption on µA
VDD_PLL (Analog) VCO freq = 400 MHz - 320 350

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Table 39. PLL3_800, PLL4_800 characteristics(1) (continued)

Symbol Parameter Conditions Min Typ Max Unit

PLL power VCO freq = 800 MHz - 2200 5250

IVDDCORE consumption on µA
VDDCORE (Digital) VCO freq = 400 MHz - 1130 4550

1. Guaranteed by design unless otherwise specified.

2. Guaranteed by characterization results.
3. Measured on GPIO.
4. Measured on GPIO for 10000 output clock cycles.

PLL_USB (2880 MHz) characteristics

Table 40. USB_PLL characteristics(1)

Symbol Parameter Condition Min Typ Max Unit

fPLL_IN PLL input clock 19.2 24 38.4 MHz

fPLL_INFIN PFD input clock 19.2 24 38.4 MHz
fPLL_OUT PLL multiplier output clock - 480 - MHz
fVCO_OUT PLL VCO output - 2880 - MHz
tLOCK PLL lock time - - 100 µs
tPDN PLL power down time 10 - - µs

IDDA1V1_R PLL power consumption on PLL in power down - 5 425 µA

EG(PLL) VDDA1V1_REG (internal connection) fVCO_OUT = 2880 MHz - 4.4 5.6 mA

IDDA1V8_R PLL power consumption on PLL in power down - - 2 µA

EG(PLL) VDDA1V8_REG (internal connection) fVCO_OUT = 2880 MHz - 2 2.5 mA
1. Guaranteed by design unless otherwise specified.

6.3.12 PLL spread spectrum clock generation (SSCG) characteristics

The spread spectrum clock generation (SSCG) feature allows the reduction of
electromagnetic interferences (see Table 46: EMI characteristics). It is available only on the
PLL1_1600 and PLL2_1600.

Table 41. SSCG parameters constraint

Symbol Parameter Min Typ Max(1) Unit

fMod Modulation frequency 20 - 60 kHz

md Peak modulation depth 0.25 - 2 %
MODEPER * INCSTEP - - - 215-1 -
1. Guaranteed by design.

Equation 1

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The frequency modulation period (MODEPER) is given by the equation below:

MODEPER = round [ f PLL_IN ⁄ ( 4 × f Mod ) ]

fPLL_IN and fMod must be expressed in Hz.

As an example:
If fPLL_IN = 1 MHz, and fMOD = 1 kHz, the modulation depth (MODEPER) is given by
equation 1:
6 3
MODEPER = round [ 10 ⁄ ( 4 × 10 ) ] = 250

Equation 2
Equation 2 allows the increment step (INCSTEP) calculation:
15
INCSTEP = round [ ( ( 2 – 1 ) × md × PLLN ) ⁄ ( 100 × 5 × MODEPER ) ]

fVCO_OUT must be expressed in MHz.

With a modulation depth (md) = ±2% (4% peak-to-peak), and PLLN = 240 (in MHz):
15
INCSTEP = round [ ( ( 2 – 1 ) × 2 × 240 ) ⁄ ( 100 × 5 × 250 ) ] = 126md(quantitazed)%

An amplitude quantization error may be generated because the linear modulation profile is
obtained by taking the quantized values (rounded to the nearest integer) of MODPER and
INCSTEP. As a result, the achieved modulation depth is quantized. The percentage
quantized modulation depth is given by the following formula:
15
md quantized % = ( MODEPER × INCSTEP × 100 × 5 ) ⁄ ( ( 2 – 1 ) × PLLN )

As a result:
15
md quantized % = ( 250 × 126 × 100 × 5 ) ⁄ ( ( 2 – 1 ) × 240 ) = 2.002%(peak)

Figure 21 and Figure 22 show the main PLL output clock waveforms in center spread and
down spread modes, where:
F0 is fPLL_OUT nominal.
Tmode is the modulation period.
md is the modulation depth.

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Figure 21. PLL output clock waveforms in center spread mode

Frequency (PLL_OUT)

md
F0
md

Time
tmode 2xtmode
ai17291

Figure 22. PLL output clock waveforms in down spread mode

Frequency (PLL_OUT)

F0
2xmd

Time
tmode 2xtmode
ai17292b

6.3.13 Memory characteristics

OTP characteristics
The characteristics are given at TJ = -40 to 125 °C unless otherwise specified.

Table 42. OTP characteristics

Symbol Parameter Conditions Min Max Unit

Programming - 450 µA
IVDDCORE OTP consumption on VDDCORE Reading - 490 µA
PowerDown - 4.2 µA
Programming - 10000 µA
IVDD OTP consumption on VDD Reading - 2200 µA
PowerDown - 1 µA
(1)
FOTP OTP operating Frequency - - 67 MHz
(2)
NB_CYCLE Maximum number of reading cycles - - 500 Million
1. Guaranteed by design.
2. Guaranteed by characterization results.

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DDR characteristics
DDR3, DDR3L I/O DC specifications
The following table provides input and output DC threshold values and on-die-termination
(ODT) recommended values. The conditions for the output threshold values are un-
terminated outputs loaded with 1 pF capacitor load. The ODT values are measured after
impedance calibration.

Table 43. DC specifications – DDR3 or DDR3L mode(1)

Symbol Parameter Min Typ Max Unit

VIH(DC) DC input voltage high VREF + 0.09 - VDDQ V

VIL(DC) DC input voltage low VSSQ - 0.3 - VREF - 0.09 V
VOH DC output logic high 0.8 × VDDQ - - V
VOL DC output logic low - - 0.2 × VDDQ V
100 120 140
RTT Input termination resistance (ODT) to VDDQ/2 54 60 66 Ω
36 40 44
ILS Input leakage current, SSTL mode, unterminated - 0.01 4.8 μA
1. Guaranteed by design.

LPDDR2, LPDDR3 I/O DC specifications

The following table provides input and output DC threshold values. The conditions for the
output threshold values are un-terminated outputs loaded with 1 pF capacitor load.

Table 44. DC specifications – LPDDR2 or LPDDR3 mode(1)

Symbol Parameter Min Typ Max Unit

VIH(DC) DC input voltage high VREF + 0.13 - VDDQ V

VIL(DC) DC input voltage low VSSQ - VREF - 0.13 V
VOH DC output logic high 0.9 × VDDQ - - V
VOL DC output logic low - - 0.1 × VDDQ V
ILEAK Input leakage current - 0.01 4.51 μA
1. Guaranteed by design.

6.3.14 EMC characteristics

Susceptibility tests are performed on a sample basis during device characterization.

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Functional EMS (electromagnetic susceptibility)

While a simple application is executed on the device (toggling 2 LEDs through I/O ports).
the device is stressed by two electromagnetic events until a failure occurs. The failure is
indicated by the LEDs:
• Electrostatic discharge (ESD) (positive and negative) is applied to all device pins until
a functional disturbance occurs. This test is compliant with the IEC 61000-4-2 standard.
• FTB: a burst of fast transient voltage (positive and negative) is applied to VDD and VSS
through a 100 pF capacitor, until a functional disturbance occurs. This test is compliant
with the IEC 61000-4-4 standard.
A device reset allows normal operations to be resumed.
The test results are given in Table 45. They are based on the EMS levels and classes
defined in application note AN1709 available from the ST website www.st.com.

Table 45. EMS characteristics

Level/
Symbol Parameter Conditions
Class

Voltage limits to be applied on any I/O pin to induce a V = 3.3 V, T = +25 °C, LFBGA448,
VFESD DD A 2B
functional disturbance F = 650 or 800 MHz,
mpuss_ck
Fast transient voltage burst limits to be applied Fmcu_ck = 209 MHz,
VFTB through 100 pF on VDD and VSS pins to induce a M4 core not running, 5A
functional disturbance conforms to IEC 61000-4-2

As a consequence, it is recommended to add a serial resistor (1 kΩ) located as close as

possible to the MCU to the pins exposed to noise (connected to tracks longer than 50 mm
on PCB).

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.

Software recommendations
The software flowchart must include the management of runaway conditions such as:
• Corrupted program counter
• Unexpected reset
• Critical Data corruption (control registers...)

Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened

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to prevent unrecoverable errors occurring (see application note AN1015 available from the
ST website www.st.com.).

Electromagnetic Interference (EMI)

The electromagnetic field emitted by the device are monitored while a simple application,
executing EEMBC code, is running. This emission test is compliant with SAE IEC61967-2
standard which specifies the test board and the pin loading.

Table 46. EMI characteristics

Max vs. [fHSE/Fmpuss_ck]
Monitored
Symbol Parameter Conditions Unit
frequency band
24/650 MHz 24/800 MHz

0.1 to 30 MHz 5 5
VDD = 3.6 V, TA = 25 °C,
30 to 130 MHz -2 -1
LFBGA448 package, dBµV
SEMI Peak level Fmcu_ck = 209 MHz, 130 MHz to 1 GHz 19 22
M4 core not running,
1 GHz to 2 GHz 9 10
conforming to IEC61967-2
EMI Level 3.5 3.5 -

6.3.15 Absolute maximum ratings (electrical sensitivity)

Based on three different tests (ESD, LU) using specific measurement methods, the device is
stressed in order to determine its performance in terms of electrical sensitivity.

Electrostatic discharge (ESD)

Electrostatic discharges (a positive then a negative pulse) are applied to the pins of each
sample according to each pin combination. This test conforms to the ANSI/ESDA/JEDEC
JS-001 and ANSI/ESDA/JEDEC JS-002 standards.

Table 47. ESD absolute maximum ratings

Maximum
Symbol Ratings Conditions Packages Class Unit
value(1)

Electrostatic discharge TA = +25 °C conforming

VESD(HBM) voltage (human body to ANSI/ESDA/JEDEC All 2 2000
model) JS-001
V
Electrostatic discharge TA = +25 °C conforming
VESD(CDM) voltage (charge device to ANSI/ESDA/JEDEC All C1 250
model) JS-002
1. Guaranteed by characterization results.

Static latchup
Two complementary static tests are required on three parts to assess the latchup
performance:
• A supply overvoltage is applied to each power supply pin
• A current injection is applied to each input, output and configurable I/O pin
These tests are compliant with JESD78 IC latchup standard.

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Table 48. Electrical sensitivities

Symbol Parameter Conditions Class

LU Static latchup class TA = +25 °C conforming to JESD78 II level A

6.3.16 I/O current injection characteristics

As a general rule, a current injection to the I/O pins, due to external voltage below VSS or
above VDD (for standard, 3.3 V-capable I/O pins) should be avoided during the normal
product operation. However, in order to give an indication of the robustness of the device in
cases when an abnormal injection accidentally happens, susceptibility tests are performed
on a sample basis during the device characterization.

Functional susceptibility to I/O current injection

While a simple application is executed on the device, the device is stressed by injecting
current into the I/O pins programmed in floating input mode. While current is injected into
the I/O pin, one at a time, the device is checked for functional failures.
The failure is indicated by an out of range parameter: ADC error above a certain limit (higher
than 5 LSB TUE), out of conventional limits of induced leakage current on adjacent pins (out
of –5 µA/+0 µA range), or other functional failure (for example reset, oscillator frequency
deviation).
The following tables are the compilation of the SIC1/SIC2 and functional ESD results.
Negative induced A negative induced leakage current is caused by negative injection and
positive induced leakage current by positive injection.

Table 49. I/O current injection susceptibility(1)

Negative Positive
Symbol Description Unit
injection injection

ANA0, ANA1, PA4, PA5 0 0

IINJ PG2, PG3, PG4, PH2 0 N/A mA
All other FTxx I/Os 5 N/A
1. Guaranteed by characterization.

6.3.17 I/O port characteristics

General input/output characteristics
Unless otherwise specified, the parameters given in Table 50: I/O static characteristics are
derived from tests performed under the conditions summarized in Table 13: General
operating conditions. All I/Os are CMOS and TTL compliant.

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Table 50. I/O static characteristics

Symbol Parameter Condition Min Typ Max Unit

1.71 V < VDD < 2.7 V - - 0.35 × VDD

2.7 V < VDD < 3.6 V - - 0.3 × VDD
VIL(1) I/O input low level voltage V
0.45 × VDD
1.71 V < VDD < 3.6 V - -
+ 0.35
VIH(1) I/O input high level voltage 1.71 V < VDD < 3.6 V 0.7 × VDD - - V
TT_xx, FT_xxx and NRST I/O 0.1 ×
VHYS(1) 1.71 V < VDD < 3.6 V - - mV
input hysteresis VDD
0 < VIN ≤ Max(VDD)(6) - - 250
FT_xx input leakage current(1) Max(VDD) < VIN ≤ 5.5 V
(6)(2)(3) - - 3500

Ileak 0 < VIN ≤ Max(VDD)(6) - - 500 nA

FT_u, IO Max(VDD) < VIN ≤ 5.5 V
(6)(3) - - 5000(4)

TT_xx input leakage current 0 < VIN ≤ Max(VDD) (6) - - 100

Weak pull-up equivalent
RPU VIN=VSS 25 40 55
resistor(5)
kΩ
Weak pull-down equivalent (6)
RPD VIN=VDD 25 40 55
resistor(5)
CIO I/O pin capacitance - - 5 - pF
1. Guaranteed by design.
2. All FT_xx IO except FT_uf, FT_u.
3. VIN must be less than Max(VDD) + 3.6 V.
4. To sustain a voltage higher than MIN(VDD, VDDA, VDD3V3_USBxxx) +0.3 V, the internal pull-up and pull-down resistors must
be disabled.
5. The pull-up and pull-down resistors are designed with a true resistance in series with a switchable PMOS/NMOS. This
PMOS/NMOS contribution to the series resistance is minimal (~10% order).
6. Max(VDD) is the maximum value of all the I/O supplies.

All I/Os are CMOS and TTL compliant (no software configuration required). Their
characteristics cover more than the strict CMOS-technology or TTL parameters. The
coverage of these requirements for FT I/Os is shown in Figure 23.

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Figure 23. VIL/VIH for FT I/Os

Output driving current

The GPIOs (general purpose input/outputs) can sink or source up to ±8 mA, and sink or
source up to ±20 mA (with a relaxed VOL/VOH).
In the user application, the number of I/O pins which can drive current must be limited to
respect the absolute maximum rating specified in Section 6.2. In particular:
• The sum of the currents sourced by all the I/Os on VDD, plus the maximum Run mode
consumption of the MCU sourced on VDD, cannot exceed the absolute maximum rating
∑IVDD (see Table 11).
• The sum of the currents sunk by all the I/Os on VSS plus the maximum Run mode
consumption of the MCU sunk on VSS cannot exceed the absolute maximum rating
∑IVSS (see Table 11).

Output voltage levels

Unless otherwise specified, the parameters given in Table 51 are derived from tests
performed under ambient temperature and VDD supply voltage conditions summarized in
Table 13: General operating conditions. All I/Os are CMOS and TTL compliant.

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Table 51. Output voltage characteristics for all I/Os except PC13, PC14, PC15 and PI8(1)
Symbol Parameter Conditions(3) Min Max Unit

CMOS port(2)
VOL Output low level voltage IIO = 8 mA - 0.4
2.0 V ≤ VDD ≤ 3.6 V
CMOS port(2)
VOH Output high level voltage IIO = -8 mA VDD-0.4 -
2.0 V ≤ VDD ≤ 3.6 V
TTL port(2)
VOL(3) Output low level voltage IIO = 8 mA - 0.4
2.0 V ≤ VDD ≤ 3.6 V
TTL port(2)
VOH (3)
Output high level voltage IIO = -8 mA 2.4 -
2.0 V ≤ VDD ≤ 3.6 V
V
IIO = 20 mA
VOL(3) Output low level voltage - 1.3
2.7 V ≤ VDD ≤ 3.6 V
IIO = -20 mA
VOH(3) Output high level voltage VDD-1.3 -
2.7 V ≤ VDD ≤ 3.6 V
IIO = 4 mA
VOL(3) Output low level voltage - 0.45
1.71 V ≤ VDD ≤ 3.6 V
IIO = -4 mA
VOH (3) Output high level voltage VDD-0.45 -
1.71 V ≤ VDD ≤ 3.6 V
IIO = 20 mA
- 0.4
Output low level voltage for an FT_f 2.7 V ≤ VDD ≤ 3.6 V
VOLFM+(3)
IO pin in FM+ mode I = 10 mA IO
- 0.4
1.71 V ≤ VDD ≤ 3.6 V
1. The IIO current sourced or sunk by the device must always respect the absolute maximum rating specified in Table 10:
Voltage characteristics, and the sum of the currents sourced or sunk by all the I/Os (I/O ports and control pins) must always
respect the absolute maximum ratings ∑IIO.
2. TTL and CMOS outputs are compatible with JEDEC standards JESD36 and JESD52.
3. Guaranteed by design.

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Table 52. Output voltage characteristics for PC13, PC14, PC15 and PI8(1)
Symbol Parameter Conditions(3) Min Max Unit

CMOS port(2)
VOL Output low level voltage IIO = 3 mA - 0.4
2.7 V ≤ VDD ≤ 3.6 V
CMOS port(2)
VOH Output high level voltage IIO = -3 mA VDD − 0.4 -
2.7 V ≤ VDD ≤ 3.6 V
TTL port(2)
VOL(3) Output low level voltage IIO = 3 mA - 0.4
V
2.7 V ≤ VDD ≤ 3.6 V
TTL port(2)
VOH (2)
Output high level voltage IIO = -3 mA 2.4 -
2.7 V ≤ VDD ≤ 3.6 V
IIO = 1.5 mA
VOL(2) Output low level voltage - 0.4
1.62 V ≤ VDD ≤ 3.6 V
IIO = -1.5 mA
VOH(2) Output high level voltage VDD − 0.4 -
1.62 V ≤ VDD ≤ 3.6 V
1. The IIO current sourced or sunk by the device must always respect the absolute maximum rating specified in Table 10:
Voltage characteristics, and the sum of the currents sourced or sunk by all the I/Os (I/O ports and control pins) must always
respect the absolute maximum ratings ΣIIO.
2. TTL and CMOS outputs are compatible with JEDEC standards JESD36 and JESD52.
3. Guaranteed by design.

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Output buffer timing characteristics (HSLV option disabled)

Table 53. Output timing characteristics (HSLV OFF)(1)(2)

Speed Symbol Parameter conditions Min Max Unit

C = 50 pF, 2.7 V ≤ VDD ≤ 3.6 V - 20

C = 30 pF, 2.7 V ≤ VDD ≤ 3.6 V - 24
C = 20 pF, 2.7 V ≤ VDD ≤ 3.6 V - 26
C = 10 pF, 2.7 V ≤ VDD ≤ 3.6 V - 30
Fmax(3) Maximum frequency MHz
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 10
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 11
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 12
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 13
00
C = 50 pF, 2.7 V ≤ VDD ≤ 3.6 V - 13.3
C = 30 pF, 2.7 V ≤ VDD ≤ 3.6 V - 11.4
C = 20 pF, 2.7 V ≤ VDD ≤ 3.6 V - 10.2
Output high to low level C = 10 pF, 2.7 V ≤ VDD ≤ 3.6 V - 8.8
tr/tf(4) fall time and output low ns
to high level rise time C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 23
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 20
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 18.3
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 16
C = 50 pF, 2.7 V ≤ VDD ≤ 3.6 V - 68
C = 30 pF, 2.7 V ≤ VDD ≤ 3.6 V - 83
C = 20 pF, 2.7 V ≤ VDD ≤ 3.6 V - 88
C = 10 pF, 2.7 V ≤ VDD ≤ 3.6 V - 103
Fmax(3) Maximum frequency MHz
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 25
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 28
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 30
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 36
01
C = 50 pF, 2.7 V ≤ VDD ≤ 3.6 V - 4.9
C = 30 pF, 2.7 V ≤ VDD ≤ 3.6 V - 3.9
C = 20 pF, 2.7 V ≤ VDD ≤ 3.6 V - 3.3
Output high to low level C = 10 pF, 2.7 V ≤ VDD ≤ 3.6 V - 2.7
tr/tf(4) fall time and output low ns
to high level rise time C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 8.1
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 6.5
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 5.7
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 4.6

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Table 53. Output timing characteristics (HSLV OFF)(1)(2) (continued)

Speed Symbol Parameter conditions Min Max Unit
(5)
C = 50 pF, 2.7 V ≤ VDD ≤ 3.6 V - 94
C = 30 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 124
(5)
C = 20 pF, 2.7 V ≤ VDD ≤ 3.6 V - 144
(5)
C = 10 pF, 2.7 V ≤ VDD ≤ 3.6 V - 166
Fmax(3) Maximum frequency MHz
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V (5)
- 53
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 66
(5)
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 72
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V (5)
- 81
10
C = 50 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 3.5
C = 30 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 2.7
C = 20 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 2.2
Output high to low level C = 10 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 1.7
tr/tf(4) fall time and output low ns
to high level rise time C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 6.3
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 4.8
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 4
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 3.2
C = 50 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 110
C = 30 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 150
C = 20 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 185
C = 10 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 210
Fmax(3) Maximum frequency MHz
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 62
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 70
(5)
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 79
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 94
11
C = 50 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 3
C = 30 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 2.2
C = 20 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 1.8
Output high to low level C = 10 pF, 2.7 V ≤ VDD ≤ 3.6 V(5) - 1.3
tr/tf(4) fall time and output low ns
(5)
to high level rise time C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 5.3
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 4
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 3.3
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(5) - 2.5
1. Guaranteed by design.
2. GPIO under VSW domain (PC13, PC14, PC15, PI8) are frequency limited. The maximum frequency is 2 MHz with a
maximum load of 30 pF. Only one I/O at a time can be used as GPIO output and these I/Os must not be used as a current
source (e.g to drive a LED). For theses IOs, the speed value must be kept to (default) 00.

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3. The maximum frequency is defined with the following conditions: (tr+tf) ≤ 2/3, skew ≤ 1/20 T and 45% < duty cycle < 55%.
4. The fall and rise times are defined between 90% and 10% and between 10% and 90% of the output waveform,
respectively.
5. Compensation system enabled.

Output buffer timing characteristics (IO structure with _h, HSLV option
enabled)
The HSLVEN_xx bits of SYSCFG_IOCTRLSETR register (together with OTP bit
PRODUCT_BELOW_2V5) can be used to optimize the I/O speed when the product voltage
is below 2.5 V typ. (2.7 V max.).

Table 54. Output timing characteristics (HSLV ON, _h IO structure)(1)

Speed Symbol Parameter conditions Min Max Unit

C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 20

C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 22
Fmax(2) Maximum frequency MHz
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 24
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 28
00
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 9.9
Output high to low level C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 8.1
tr/tf(3) fall time and output low ns
to high level rise time C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 7.1
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 5.8
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 58
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 79
Fmax(2) Maximum frequency MHz
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 90
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 100
01
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 5.7
Output high to low level C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 4.2
tr/tf(3) fall time and output low ns
to high level rise time C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 3.5
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 2.7
(4)
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 71
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 101
Fmax(2) Maximum frequency MHz
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 126
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 162
10
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 4.7
Output high to low level C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 3.3
tr/tf(3) fall time and output low ns
to high level rise time C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 2.7
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 1.9

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Table 54. Output timing characteristics (HSLV ON, _h IO structure)(1) (continued)

Speed Symbol Parameter conditions Min Max Unit
(4)
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 77
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 111
Fmax(2) Maximum frequency MHz
(4)
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 145
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 172
11
(4)
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 4.3
Output high to low level C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 3
tr/tf(3) fall time and output low ns
(4)
to high level rise time C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 2.3
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 1.6
1. Guaranteed by design.
2. The maximum frequency is defined with the following conditions: (tr+tf) ≤ 2/3, skew ≤ 1/20 T and 45% < duty cycle < 55%.
3. The fall and rise times are defined between 90% and 10% and between 10% and 90% of the output waveform,
respectively.
4. Compensation system enabled.

Output buffer timing characteristics (IO structure with _vh, HSLV option
enabled)
The HSLVEN_xx bits of SYSCFG_IOCTRLSETR register (together with OTP bit
PRODUCT_BELOW_2V5) can be used to optimize the I/O speed when the product voltage
is below 2.5 V typ. (2.7 V max.).

Table 55. Output timing characteristics (HSLV ON, _vh IO structure)(1)

Speed Symbol Parameter conditions Min Max Unit

C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 36

C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 41
Fmax(2) Maximum frequency MHz
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 46
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 55
00
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 9.2
Output high to low level C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 7.4
tr/tf(3) fall time and output low ns
to high level rise time C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 6.5
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 5.2

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Table 55. Output timing characteristics (HSLV ON, _vh IO structure)(1) (continued)
Speed Symbol Parameter conditions Min Max Unit

C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 55

C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 71
Fmax(2) Maximum frequency MHz
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 85
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 100
01
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V - 6.1
Output high to low level C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V - 4.7
tr/tf(3) fall time and output low ns
to high level rise time C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 3.9
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V - 3
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 68
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 95
Fmax(2) Maximum frequency MHz
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 118
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 162
10
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 4.9
Output high to low level C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 3.5
tr/tf(3) fall time and output low ns
to high level rise time C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 2.8
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 2.1
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 80
C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 121
Fmax(2) Maximum frequency MHz
C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 162
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 245
11
C = 50 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 4.2
Output high to low level C = 30 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 2.8
tr/tf(3) fall time and output low ns
(4)
to high level rise time C = 20 pF, 1.71 V ≤ VDD ≤ 2.7 V - 2.1
C = 10 pF, 1.71 V ≤ VDD ≤ 2.7 V(4) - 1.4
1. Guaranteed by design.
2. The maximum frequency is defined with the following conditions: (tr+tf) ≤ 2/3, skew ≤ 1/20 T and 45% < Duty cycle < 55%.
3. The fall and rise times are defined between 90% and 10% and between 10% and 90% of the output waveform,
respectively.
4. Compensation system enabled.

6.3.18 NRST and NRST_CORE pin characteristics

The NRST and NRST_CORE pins input driver uses CMOS technology. It is connected to a
permanent pull-up resistor, RPU (see Table 50: I/O static characteristics).
Unless otherwise specified, the parameters given in Table 56 are derived from tests
performed under the ambient temperature and VDD supply voltage conditions summarized
in Table 13: General operating conditions.

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Table 56. NRST and NRST_CORE pin characteristics

Symbol Parameter Conditions Min Typ Max Unit

Weak pull-up equivalent

RPU(2) VIN = VSS 30 40 50 kΩ
resistor(1)
NRST/NRST_CORE Input
VF(NRST)(2) 1.71 V < VDD < 3.6 V - - 50
filtered pulse
ns
NRST/NRST_CORE Input
VNF(NRST)(2) 1.71 V < VDD < 3.6 V 350 - -
not filtered pulse
1. The pull-up is designed with a true resistance in series with a switchable PMOS. This PMOS contribution to
the series resistance must be minimum (~10% order).
2. Guaranteed by design.

Figure 24. Recommended NRST and NRST_CORE pin protection

VDD
External
reset circuit (1)
RPU
NRST (2) Internal Reset
Filter

0.1 μF

STM32

ai14132d

1. The reset network protects the device against parasitic resets.

2. The user must ensure that the level on the NRST/NRST_CORE pin can go below the VIL(NRST) max level
specified in Table 56. Otherwise the reset is not taken into account by the device.

6.3.19 FMC characteristics

Unless otherwise specified, the parameters given in Table 57 to Table 70 for the FMC
interface are derived from tests performed under the ambient temperature, Fmc_hclk (Fhclk6)
frequency and VDD supply voltage conditions summarized in Table 13: General operating
conditions, with the following configuration:
• Output speed is set to OSPEEDRy[1:0] = 11
• Measurement points are done at CMOS levels: 0.5×VDD
Refer to Section 6.3.17: I/O port characteristics for more details on the input/output
characteristics.

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Asynchronous waveforms and timings

Figure 25 through Figure 28 represent asynchronous waveforms and Table 57 through
Table 64 provide the corresponding timings. The results shown in these tables are obtained
with the following FMC configuration:
• AddressSetupTime = 0x1
• AddressHoldTime = 0x1
• DataSetupTime = 0x1 (except for asynchronous NWAIT mode, DataSetupTime = 0x5)
• DataHoldTime = 0x1 (1×Tfmc_ker_ck for read operations and 2×Tfmc_ker_ck for write
operations)
• ByteLaneSetup = 0x1
• BusTurnAroundDuration = 0x0
• Capacitive load CL = 30 pF
In all the timing tables, the Tfmc_ker_ck is the fmc_ker_ck clock period.

Figure 25. Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms

tw(NE)

FMC_NE

tv(NOE_NE) t w(NOE) t h(NE_NOE)

FMC_NOE

FMC_NWE

tv(A_NE) t h(A_NOE)

FMC_A[25:0] Address
tv(BL_NE) t h(BL_NOE)

FMC_NBL[1:0]

t h(Data_NE)

t su(Data_NOE) th(Data_NOE)

t su(Data_NE)

FMC_D[15:0] Data

t v(NADV_NE)

tw(NADV)

FMC_NADV (1)

FMC_NWAIT
th(NE_NWAIT)

tsu(NWAIT_NE)

MS32753V1

1. Mode 2/B, C and D only. In Mode 1, FMC_NADV is not used.

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Table 57. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings(1)

Symbol Parameter Min Max Unit

tw(NE) FMC_NE low time 3Tfmc_ker_ck-1 3Tfmc_ker_ck+0.5

tv(NOE_NE) FMC_NEx low to FMC_NOE low 0 1
tw(NOE) FMC_NOE low time 2Tfmc_ker_ck-1 2Tfmc_ker_ck+1
th(NE_NOE) FMC_NOE high to FMC_NE high hold time Tfmc_ker_ck-1 -
tv(A_NE) FMC_NEx low to FMC_A valid - 1
th(A_NOE) Address hold time after FMC_NOE high 2Tfmc_ker_ck-1 -
ns
tsu(Data_NE) Data to FMC_NEx high setup time Tfmc_ker_ck+15 -
tsu(Data_NOE) Data to FMC_NOEx high setup time 16 -
th(Data_NOE) Data hold time after FMC_NOE high 0 -
th(Data_NE) Data hold time after FMC_NEx high 0 -
tv(NADV_NE) FMC_NEx low to FMC_NADV low - 0
tw(NADV) FMC_NADV low time - Tfmc_ker_ck+1
1. Guaranteed by characterization results.

Table 58. Asynchronous non-multiplexed SRAM/PSRAM/NOR read - NWAIT timings(1)(2)

Symbol Parameter Min Max Unit

tw(NE) FMC_NE low time 7Tfmc_ker_ck-0.5 7Tfmc_ker_ck+1

tw(NOE) FMC_NWE low time 6Tfmc_ker_ck-0.5 6Tfmc_ker_ck+1
tw(NWAIT) FMC_NWAIT low time Tfmc_ker_ck - ns
tsu(NWAIT_NE) FMC_NWAIT valid before FMC_NEx high 7Tfmc_ker_ck+2 -
th(NE_NWAIT) FMC_NEx hold time after FMC_NWAIT invalid 5Tfmc_ker_ck -
1. Guaranteed by characterization results.
2. NWAIT pulse width is equal to 1 AHB cycle.

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Figure 26. Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms

tw(NE)

FMC_NEx

FMC_NOE
tv(NWE_NE) tw(NWE) t h(NE_NWE)

FMC_NWE

tv(A_NE) th(A_NWE)

FMC_A[25:0] Address
tv(BL_NE) th(BL_NWE)

FMC_NBL[1:0] NBL
tv(Data_NE) th(Data_NWE)

FMC_D[15:0] Data
t v(NADV_NE)

tw(NADV)
FMC_NADV (1)

FMC_NWAIT
th(NE_NWAIT)

tsu(NWAIT_NE)
MS32754V1

1. Mode 2/B, C and D only. In Mode 1, FMC_NADV is not used.

Table 59. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings(1)

Symbol Parameter Min Max Unit

tw(NE) FMC_NE low time 4Tfmc_ker_ck-0.5 4Tfmc_ker_ck+1

tv(NWE_NE) FMC_NEx low to FMC_NWE low Tfmc_ker_ck-0.5 Tfmc_ker_ck+1
tw(NWE) FMC_NWE low time Tfmc_ker_ck-0.5 Tfmc_ker_ck+0.5
th(NE_NWE) FMC_NWE high to FMC_NE high hold time 2Tfmc_ker_ck-0.5 -
tv(A_NE) FMC_NEx low to FMC_A valid - 0
th(A_NWE) Address hold time after FMC_NWE high 3Tfmc_ker_ck-1 -
ns
tv(BL_NE) FMC_NEx low to FMC_BL valid - 0.5
th(BL_NWE) FMC_BL hold time after FMC_NWE high 3Tfmc_ker_ck-0.5 -
tv(Data_NE) Data to FMC_NEx low to Data valid - 2.5
th(Data_NWE) Data hold time after FMC_NWE high 3Tfmc_ker_ck-1 -
tv(NADV_NE) FMC_NEx low to FMC_NADV low - 0.5
tw(NADV) FMC_NADV low time - Tfmc_ker_ck+0.5
1. Guaranteed by characterization results.

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Table 60. Asynchronous non-multiplexed SRAM/PSRAM/NOR write - NWAIT timings(1)(2)

Symbol Parameter Min Max Unit

tw(NE) FMC_NE low time 8Tfmc_ker_ck-0.5 8Tfmc_ker_ck+0.5

tw(NWE) FMC_NWE low time 5Tfmc_ker_ck-0.5 5Tfmc_ker_ck+1
ns
tsu(NWAIT_NE) FMC_NWAIT valid before FMC_NEx high 8Tfmc_ker_ck+4 -
th(NE_NWAIT) FMC_NEx hold time after FMC_NWAIT invalid 6Tfmc_ker_ck -
1. Guaranteed by characterization results.
2. NWAIT pulse width is equal to 1 AHB cycle.

Figure 27. Asynchronous multiplexed PSRAM/NOR read waveforms

tw(NE)

FMC_ NE
tv(NOE_NE) t h(NE_NOE)

FMC_NOE

t w(NOE)

FMC_NWE

tv(A_NE) th(A_NOE)

FMC_ A[25:16] Address

tv(BL_NE) th(BL_NOE)

FMC_ NBL[1:0] NBL

th(Data_NE)
tsu(Data_NE)
t v(A_NE) tsu(Data_NOE) th(Data_NOE)

FMC_ AD[15:0] Address Data

t v(NADV_NE) th(AD_NADV)
tw(NADV)

FMC_NADV

FMC_NWAIT
th(NE_NWAIT)

tsu(NWAIT_NE)

MS32755V1

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Table 61. Asynchronous multiplexed PSRAM/NOR read timings(1)

Symbol Parameter Min Max Unit

tw(NE) FMC_NE low time 4Tfmc_ker_ck-0.5 4Tfmc_ker_ck+1

tv(NOE_NE) FMC_NEx low to FMC_NOE low 2Tfmc_ker_ck-0.5 2Tfmc_ker_ck+1
ttw(NOE) FMC_NOE low time Tfmc_ker_ck-0.5 Tfmc_ker_ck+0.5
th(NE_NOE) FMC_NOE high to FMC_NE high hold time Tfmc_ker_ck-1 -
tv(A_NE) FMC_NEx low to FMC_A valid - 3
tv(NADV_NE) FMC_NEx low to FMC_NADV low 0.5 1.5
tw(NADV) FMC_NADV low time Tfmc_ker_ck Tfmc_ker_ck+1
FMC_AD(address) valid hold time after ns
th(AD_NADV) Tfmc_ker_ck-3 -
FMC_NADV high
Address held
th(A_NOE) Address hold time after FMC_NOE high until next read -
operation
tsu(Data_NE) Data to FMC_NEx high setup time Tfmc_ker_ck+15 -
tsu(Data_NOE) Data to FMC_NOE high setup time 16 -
th(Data_NE) Data hold time after FMC_NEx high 0 -
th(Data_NOE) Data hold time after FMC_NOE high 0 -
1. Guaranteed by characterization results.

Table 62. Asynchronous multiplexed PSRAM/NOR read-NWAIT timings(1)

Symbol Parameter Min Max Unit

tw(NE) FMC_NE low time 7Tfmc_ker_ck-0.5 8Tfmc_ker_ck+1

tw(NOE) FMC_NWE low time 5Tfmc_ker_ck-0.5 6Tfmc_ker_ck+1
tsu(NWAIT_NE) FMC_NWAIT valid before FMC_NEx high 7Tfmc_ker_ck+2 - ns

FMC_NEx hold time after FMC_NWAIT

th(NE_NWAIT) 5Tfmc_ker_ck -
invalid
1. Guaranteed by characterization results.

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Figure 28. Asynchronous multiplexed PSRAM/NOR write waveforms

tw(NE)

FMC_ NEx

FMC_NOE
tv(NWE_NE) tw(NWE) t h(NE_NWE)

FMC_NWE

tv(A_NE) th(A_NWE)

FMC_ A[25:16] Address

tv(BL_NE) th(BL_NWE)

FMC_ NBL[1:0] NBL

t v(A_NE) t v(Data_NADV) th(Data_NWE)

FMC_ AD[15:0] Address Data

t v(NADV_NE) th(AD_NADV)

tw(NADV)

FMC_NADV

FMC_NWAIT
th(NE_NWAIT)

tsu(NWAIT_NE)
MS32756V1

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Table 63. Asynchronous multiplexed PSRAM/NOR write timings(1)

Symbol Parameter Min Max Unit

tw(NE) FMC_NE low time 5Tfmc_ker_ck-0.5 5Tfmc_ker_ck+1

tv(NWE_NE) FMC_NEx low to FMC_NWE low Tfmc_ker_ck-0.5 Tfmc_ker_ck+1
tw(NWE) FMC_NWE low time 2Tfmc_ker_ck-1 2Tfmc_ker_ck+0.5
th(NE_NWE) FMC_NWE high to FMC_NE high hold time 2Tfmc_ker_ck-0.5 -
tv(A_NE) FMC_NEx low to FMC_A valid - 0.5
tv(NADV_NE) FMC_NEx low to FMC_NADV low 0 1
tw(NADV) FMC_NADV low time Tfmc_ker_ck+0.5 Tfmc_ker_ck+1
ns
th(AD_NADV) FMC_AD(address) valid hold time after FMC_NADV high Tfmc_ker_ck+0.5 -
Address held
th(A_NWE) Address hold time after FMC_NWE high until next write -
operation
th(BL_NWE) FMC_BL hold time after FMC_NWE high 3Tfmc_ker_ck+0.5 -
tv(BL_NE) FMC_NEx low to FMC_BL valid - 0.5
tv(Data_NADV) FMC_NADV high to Data valid - Tfmc_ker_ck+4
th(Data_NWE) Data hold time after FMC_NWE high 3Tfmc_ker_ck+0.5 -
1. Guaranteed by characterization results.

Table 64. Asynchronous multiplexed PSRAM/NOR write-NWAIT timings(1)

Symbol Parameter Min Max Unit

tw(NE) FMC_NE low time 9Tfmc_ker_ck-0.5 9Tfmc_ker_ck+0.5

tw(NWE) FMC_NWE low time 6Tfmc_ker_ck-0.5 6Tfmc_ker_ck+1 ns

tsu(NWAIT_NE) FMC_NWAIT valid before FMC_NEx high 8Tfmc_ker_ck+4 -

th(NE_NWAIT) FMC_NEx hold time after FMC_NWAIT invalid 6Tfmc_ker_ck -
1. Guaranteed by characterization results.

Synchronous waveforms and timings

Figure 29 through Figure 32 represent synchronous waveforms and Table 65 through
Table 68 provide the corresponding timings. The results shown in these tables are obtained
with the following FMC configuration:
• BurstAccessMode = FMC_BurstAccessMode_Enable
• MemoryType = FMC_MemoryType_CRAM
• WriteBurst = FMC_WriteBurst_Enable
• CLKDivision = 1
• DataLatency = 1 for NOR Flash; DataLatency = 0 for PSRAM

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In all the timing tables, the Tfmc_ker_ck is the fmc_ker_ck clock period, with the following
FMC_CLK maximum values:
• For 2.7 V < VDD < 3.6 V, FMC_CLK = 130 MHz at 20 pF
• For 1.71 V < VDD < 1.9 V, FMC_CLK = 95 MHz at 20 pF

Figure 29. Synchronous multiplexed NOR/PSRAM read timings

tw(CLK) tw(CLK) BUSTURN = 0

FMC_CLK

Data latency = 0
td(CLKL-NExL) td(CLKH-NExH)

FMC_NEx
t d(CLKL-NADVL) td(CLKL-NADVH)

FMC_NADV
td(CLKL-AV) td(CLKH-AIV)

FMC_A[25:16]

td(CLKL-NOEL) td(CLKH-NOEH)

FMC_NOE
td(CLKL-ADIV) th(CLKH-ADV)
t d(CLKL-ADV) tsu(ADV-CLKH) tsu(ADV-CLKH) th(CLKH-ADV)

FMC_AD[15:0] AD[15:0] D1 D2
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 1b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b) tsu(NWAITV-CLKH) th(CLKH-NWAITV)

MS32757V1

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Table 65. Synchronous multiplexed NOR/PSRAM read timings(1)

Symbol Parameter Min Max Unit

tw(CLK) FMC_CLK period R×Tfmc_ker_ck-1(2) -

td(CLKL-NExL) FMC_CLK low to FMC_NEx low (x=0..2) - 1
td(CLKH_NExH) FMC_CLK high to FMC_NEx high (x= 0…2) R×Tfmc_ker_ck/2+0.5(2) -
td(CLKL-NADVL) FMC_CLK low to FMC_NADV low - 1.5
td(CLKL-NADVH) FMC_CLK low to FMC_NADV high 1 -
td(CLKL-AV) FMC_CLK low to FMC_Ax valid (x=16…25) - 1
td(CLKH-AIV) FMC_CLK high to FMC_Ax invalid (x=16…25) R×Tfmc_ker_ck/2+1.5(2) -
td(CLKL-NOEL) FMC_CLK low to FMC_NOE low - 2 ns
td(CLKH-NOEH) FMC_CLK high to FMC_NOE high R×Tfmc_ker_ck /2+0.5(2) -
td(CLKL-ADV) FMC_CLK low to FMC_AD[15:0] valid - 1.5
td(CLKL-ADIV) FMC_CLK low to FMC_AD[15:0] invalid 1 -
tsu(ADV-CLKH) FMC_A/D[15:0] valid data before FMC_CLK high 3 -
th(CLKH-ADV) FMC_A/D[15:0] valid data after FMC_CLK high 1 -
tsu(NWAIT-CLKH) FMC_NWAIT valid before FMC_CLK high 3 -
th(CLKH-NWAIT) FMC_NWAIT valid after FMC_CLK high 1.5 -
1. Guaranteed by characterization results.
2. Clock ratio R = (FMC_CLK period / fmc_ker_ck period).

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Figure 30. Synchronous multiplexed PSRAM write timings

tw(CLK) tw(CLK) BUSTURN = 0

FMC_CLK

Data latency = 0
td(CLKL-NExL) td(CLKH-NExH)

FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)

FMC_NADV
td(CLKL-AV) td(CLKH-AIV)

FMC_A[25:16]

td(CLKL-NWEL) td(CLKH-NWEH)

FMC_NWE
td(CLKL-ADIV) td(CLKL-Data)
td(CLKL-ADV) td(CLKL-Data)

FMC_AD[15:0] AD[15:0] D1 D2

FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b) tsu(NWAITV-CLKH) th(CLKH-NWAITV)

td(CLKH-NBLH)

FMC_NBL

MS32758V1

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Table 66. Synchronous multiplexed PSRAM write timings(1)

Symbol Parameter Min Max Unit

tw(CLK) FMC_CLK period, VDD range = 2.7 to 3.6 V R×Tfmc_ker_ck-1(2) -

td(CLKL-NExL) FMC_CLK low to FMC_NEx low (x=0..2) - 1
(2)
td(CLKH-NExH) FMC_CLK high to FMC_NEx high (x= 0…2) R×Tfmc_ker_ck/2+0.5 -
td(CLKL-NADVL) FMC_CLK low to FMC_NADV low - 1.5
td(CLKL-NADVH) FMC_CLK low to FMC_NADV high 1 -
td(CLKL-AV) FMC_CLK low to FMC_Ax valid (x=16…25) - 1
td(CLKH-AIV) (2)
FMC_CLK high to FMC_Ax invalid (x=16…25) R×Tfmc_ker_ck/2+1.5 -
td(CLKL-NWEL) FMC_CLK low to FMC_NWE low - 1
ns
t(CLKH-NWEH) FMC_CLK high to FMC_NWE high R×Tfmc_ker_ck/2+0.5(2) -
td(CLKL-ADV) FMC_CLK low to FMC_AD[15:0] valid - 1.5
td(CLKL-ADIV) FMC_CLK low to FMC_AD[15:0] invalid 1 -
td(CLKL-DATA) FMC_A/D[15:0] valid data after FMC_CLK low - 3
td(CLKL-NBLL) FMC_CLK low to FMC_NBL low 1 -
td(CLKH-NBLH) FMC_CLK high to FMC_NBL high R×Tfmc_ker_ck/2+0.5(2) -
tsu(NWAIT-CLKH) FMC_NWAIT valid before FMC_CLK high 3 -
th(CLKH-NWAIT) FMC_NWAIT valid after FMC_CLK high 1.5 -
1. Guaranteed by characterization results.
2. Clock ratio R = (FMC_CLK period / fmc_ker_ck period).

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Figure 31. Synchronous non-multiplexed NOR/PSRAM read timings

tw(CLK) tw(CLK)

FMC_CLK
td(CLKL-NExL) td(CLKH-NExH)
Data latency = 0
FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)

FMC_NADV
td(CLKL-AV) td(CLKH-AIV)

FMC_A[25:0]

td(CLKL-NOEL) td(CLKH-NOEH)

FMC_NOE
tsu(DV-CLKH) th(CLKH-DV)
tsu(DV-CLKH) th(CLKH-DV)

FMC_D[15:0] D1 D2

tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 1b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) t h(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) th(CLKH-NWAITV)

MS32759V1

Table 67. Synchronous non-multiplexed NOR/PSRAM read timings(1)

Symbol Parameter Min Max Unit

tw(CLK) FMC_CLK period R×Tfmc_ker_ck -1(2) -

t(CLKL-NExL) FMC_CLK low to FMC_NEx low (x=0..2) - 1
td(CLKH-NExH) FMC_CLK high to FMC_NEx high (x= 0…2) R×Tfmc_ker_ck/2+0.5(2) -
td(CLKL-NADVL) FMC_CLK low to FMC_NADV low - 1.5
td(CLKL-NADVH) FMC_CLK low to FMC_NADV high 1 -
td(CLKL-AV) FMC_CLK low to FMC_Ax valid (x=16…25) - 1
td(CLKH-AIV) FMC_CLK high to FMC_Ax invalid (x=16…25) R×Tfmc_ker_ck/2+1.5(2) - ns
td(CLKL-NOEL) FMC_CLK low to FMC_NOE low - 2
td(CLKH-NOEH) FMC_CLK high to FMC_NOE high R×Tfmc_ker_ck/2+1.5(2) -
tsu(DV-CLKH) FMC_D[15:0] valid data before FMC_CLK high 3 -
th(CLKH-DV) FMC_D[15:0] valid data after FMC_CLK high 1 -
t(NWAIT-CLKH) FMC_NWAIT valid before FMC_CLK high 3 -
th(CLKH-NWAIT) FMC_NWAIT valid after FMC_CLK high 1.5 -
1. Guaranteed by characterization results.

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2. Clock ratio R = (FMC_CLK period / fmc_ker_ck period).

Figure 32. Synchronous non-multiplexed PSRAM write timings

tw(CLK) tw(CLK)

FMC_CLK

td(CLKL-NExL) td(CLKH-NExH)
Data latency = 0
FMC_NEx

td(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV

td(CLKL-AV) td(CLKH-AIV)

FMC_A[25:0]

td(CLKL-NWEL) td(CLKH-NWEH)
FMC_NWE

td(CLKL-Data) td(CLKL-Data)

FMC_D[15:0] D1 D2

FMC_NWAIT
(WAITCFG = 0b, WAITPOL + 0b) tsu(NWAITV-CLKH) td(CLKH-NBLH)
th(CLKH-NWAITV)
FMC_NBL

MS32760V1

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Table 68. Synchronous non-multiplexed PSRAM write timings(1)

Symbol Parameter Min Max Unit

t(CLK) FMC_CLK period R×Tfmc_ker_ck -1(2) -

td(CLKL-NExL) FMC_CLK low to FMC_NEx low (x=0..2) - 1
(2)
t(CLKH-NExH) FMC_CLK high to FMC_NEx high (x= 0…2) R×Tfmc_ker_ck/2+0.5 -
td(CLKL-NADVL) FMC_CLK low to FMC_NADV low - 1.5
td(CLKL-NADVH) FMC_CLK low to FMC_NADV high 1 -
td(CLKL-AV) FMC_CLK low to FMC_Ax valid (x=16…25) - 1
td(CLKH-AIV) (2)
FMC_CLK high to FMC_Ax invalid (x=16…25) R×Tfmc_ker_ck/2+1.5 -
ns
td(CLKL-NWEL) FMC_CLK low to FMC_NWE low - 1
td(CLKH-NWEH) FMC_CLK high to FMC_NWE high R×Tfmc_ker_ck/2+0.5(2) -
td(CLKL-Data) FMC_D[15:0] valid data after FMC_CLK low - 3
td(CLKL-NBLL) FMC_CLK low to FMC_NBL low 1 -
td(CLKH-NBLH) FMC_CLK high to FMC_NBL high R×Tfmc_ker_ck/2+0.5(2) -
tsu(NWAIT-CLKH) FMC_NWAIT valid before FMC_CLK high 3 -
th(CLKH-NWAIT) FMC_NWAIT valid after FMC_CLK high 1.5 -
1. Guaranteed by characterization results.
2. Clock ratio R = (FMC_CLK period / fmc_ker_ck period).

NAND controller waveforms and timings

Figure 33 through Figure 36 represent synchronous waveforms, and Table 69 and Table 70
provide the corresponding timings. The results shown in this table are obtained with the
following FMC configuration:
• FMC_SetupTime = 0x01
• FMC_WaitSetupTime = 0x03
• FMC_HoldSetupTime = 0x02
• FMC_HiZSetupTime = 0x01
• Bank = FMC_Bank_NAND
• MemoryDataWidth = FMC_MemoryDataWidth_16b
• ECC = FMC_ECC_Enable
• ECCPageSize = FMC_ECCPageSize_512Bytes
• TCLRSetupTime = 0
• TARSetupTime = 0
• CL = 30 pF
In all timing tables, the Tfmc_ker_ck is the fmc_ker_ck clock period.

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Figure 33. NAND controller waveforms for read access

FMC_NCEx

ALE (FMC_A17)
CLE (FMC_A16)

FMC_NWE

td(ALE-NOE) th(NOE-ALE)

FMC_NOE (NRE)

tsu(D-NOE) th(NOE-D)
FMC_D[15:0]

MS32767V1

Figure 34. NAND controller waveforms for write access

FMC_NCEx

ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NWE) th(NWE-ALE)

FMC_NWE

FMC_NOE (NRE)
tv(NWE-D) th(NWE-D)

FMC_D[15:0]

MS32768V1

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Figure 35. NAND controller waveforms for common memory read access

FMC_NCEx

ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NOE) th(NOE-ALE)

FMC_NWE

tw(NOE)
FMC_NOE

tsu(D-NOE) th(NOE-D)

FMC_D[15:0]

MS32769V1

Figure 36. NAND controller waveforms for common memory write access

FMC_NCEx

ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NOE) tw(NWE) th(NOE-ALE)

FMC_NWE

FMC_N OE

td(D-NWE)

tv(NWE-D) th(NWE-D)

FMC_D[15:0]

MS32770V1

Table 69. Switching characteristics for NAND Flash read cycles(1)

Symbol Parameter Min Max Unit

tw(N0E) FMC_NOE low width 4Tfmc_ker_ck-1 4Tfmc_ker_ck+1

tsu(D-NOE) FMC_D[15-0] valid data before FMC_NOE high 11 -
th(NOE-D) FMC_D[15-0] valid data after FMC_NOE high 0 - ns
td(ALE-NOE) FMC_ALE valid before FMC_NOE low - 2Tfmc_ker_ck+1
th(NOE-ALE) FMC_NWE high to FMC_ALE invalid 3Tfmc_ker_ck+0.5 -
1. Guaranteed by characterization results.

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Table 70. Switching characteristics for NAND Flash write cycles(1)

Symbol Parameter Min Max Unit

tw(NWE) FMC_NWE low width 4Tfmc_ker_ck-1 4Tfmc_ker_ck+1

tv(NWE-D) FMC_NWE low to FMC_D[15-0] valid 0 -
th(NWE-D) FMC_NWE high to FMC_D[15-0] invalid 3Tfmc_ker_ck -
ns
td(D-NWE) FMC_D[15-0] valid before FMC_NWE high 4Tfmc_ker_ck-3 -
td(ALE-NWE) FMC_ALE valid before FMC_NWE low - 2Tfmc_ker_ck+1
th(NWE-ALE) FMC_NWE high to FMC_ALE invalid 3Tfmc_ker_ck+0.5 -
1. Guaranteed by characterization results.

6.3.20 QUADSPI interface characteristics

Unless otherwise specified, the parameters given in Table 71 and Table 72 for QUADSPI
are derived from tests performed under the ambient temperature, Faxiss_ck frequency and
VDD supply voltage conditions summarized in Table 13: General operating conditions, with
the following configuration:
• Output speed is set to OSPEEDRy[1:0] = 11
• Measurement points are done at CMOS levels: 0.5×VDD
• I/O compensation cell enabled
• HSLV activated when VDD ≤ 2.7 V
Refer to Section 6.3.17: I/O port characteristics for more details on the input/output alternate
function characteristics.

Table 71. QUADSPI characteristics in SDR mode

Symbol Parameter Conditions Min Typ Max Unit

2.7 V ≤ VDD < 3.6 V

- - 166
CL = 20 pF
Fck1/t(CLK) QUADSPI clock frequency MHz
1.71 V < VDD <3.6 V
- - 90
CL = 15 pF
tw(CLKH) QUADSPI clock high and low t(CLK)/2 - 0.5 - t(CLK)/2 + 0.5
-
tw(CLKL) time t(CLK)/2 - 0.5 - t(CLK)/2 + 0.5
ts(IN) Data input setup time - 1.25 - -
ns
th(IN) Data input hold time - 2.75 - -
tv(OUT) Data output valid time - - 1 1.5
th(OUT) Data output hold time - 0 - -

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Table 72. QUADSPI characteristics in DDR mode

Symbol Parameter Conditions Min Typ Max Unit

2.7 V < VDD < 3.6 V

- - 90
QUADSPI clock CL=20 pF
Fck1/t(CLK) MHz
frequency 1.71 V < VDD < 3.6 V
- - 90
CL=15 pF
tw(CLKH) QUADSPI clock high and - t(CLK)/2 - 0.5 - t(CLK)/2 + 0.5
tw(CLKL) low time - t(CLK)/2 - 0.5 - t(CLK)/2 + 0.5
tsr(IN), tsf(IN) Data input setup time - 0.5 - -
thr(IN), thf(IN) Data input hold time - 2.75 - -
DHHC = 0 - 1 1.5 ns
tvr(OUT),
Data output valid time DHHC = 1
tvf(OUT) - t(CLK)/4+1 t(CLK)/4+1.5
Pres = 1, 2...
DHHC = 0 0 - -
thr(OUT),
Data output hold time DHHC = 1
thf(OUT) t(CLK)/4 - -
Pres = 1, 2...

Figure 37. QUADSPI timing diagram - SDR mode

tr(CLK) t(CLK) tw(CLKH) tw(CLKL) tf(CLK)

Clock
tv(OUT) th(OUT)

Data output IO0 IO1 IO2

ts(IN) th(IN)

Data input IO0 IO1 IO2

MSv36878V2

Figure 38. QUADSPI timing diagram - DDR mode

tr(CLK) t(CLK) tw(CLKH) tw(CLKL) tf(CLK)

Clock
tvf(OUT) thr(OUT) tvr(OUT) thf(OUT)

Data output IO0 IO1 IO2 IO3 IO4 IO5

tsf(IN) thf(IN) tsr(IN) thr(IN)

Data input IO0 IO1 IO2 IO3 IO4 IO5

MSv36879V3

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6.3.21 Delay block (DLYB) characteristics

Unless otherwise specified, the parameters given in Table 73 for the delay block are derived
from tests performed under the ambient temperature, frcc_c_ck frequency and VDD supply
voltage summarized in Table 13: General operating conditions.

Table 73. Dynamics characteristics: Delay block characteristics

Symbol Parameter Conditions Min Typ Max Unit

tinit Initial delay - 900 1200 1500

ps
t∆ Unit Delay - 42 46 50

6.3.22 16-bit ADC characteristics

Unless otherwise specified, the parameters given in Table 74 are derived from tests
performed under the ambient temperature, fpclk2 frequency and VDDA supply voltage
conditions summarized in Table 13: General operating conditions.

Table 74. ADC characteristics(1)(2)

Symbol Parameter Conditions Min Typ Max Unit

VDDA Analog power supply - 1.62 - 3.6

VDDA ≥ 2 V 2 - VDDA
VREF+ Positive reference voltage V
VDDA < 2 V VDDA
VREF- Negative reference voltage - VSSA
BOOST = 1 0.12 - 36
fADC ADC clock frequency 2 V ≤ VDDA ≤3.3 V MHz
BOOST = 0 0.12 - 20

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Table 74. ADC characteristics(1)(2) (continued)

Symbol Parameter Conditions Min Typ Max Unit

16-bit resolution - - 3.60

Sampling rate for Fast 14-bit resolution - - 4.00
channels, BOOST = 1,
12-bit resolution - - 4.50
fADC = 36 MHz,
sampling time = 1.5 cycles 10-bit resolution - - 5.00
8-bit resolution - - 6.00
16-bit resolution - - 2.00
Sampling rate for Fast 14-bit resolution - - 2.20
channels, BOOST = 0,
12-bit resolution - - 2.50
fADC = 20 MHz,
sampling time = 1.5 cycles 10-bit resolution - - 2.80
8-bit resolution - - 3.30
fS MSPS
16-bit resolution - - 2.55
Sampling rate for Slow 14-bit resolution - - 2.80
channels, BOOST = 1,
12-bit resolution - - 3.11
fADC = 28 MHz,
sampling time = 2.5 cycles 10-bit resolution - - 3.50
8-bit resolution - - 4.00
16-bit resolution - - 1.82
Sampling rate for Slow 14-bit resolution - - 2.00
channels, BOOST = 0,
12-bit resolution - - 2.22
fADC = 20 MHz,
sampling time = 2.5 cycles 10-bit resolution - - 2.50
8-bit resolution - - 2.86
fADC = 36 MHz - - 3.6 MHz
fTRIG External trigger frequency
16-bit resolution - - 10 1/fADC
VAIN (3) Conversion voltage range - 0 - VREF+
Common mode input VREF/2- V /2+ V
VCMIV - VREF/2 REF
voltage 10% 10%
Internal sample and hold
CADC - - 4 - pF
capacitor
tADCREG_
ADC LDO startup time - - 5 10 µs
STUP

tSTAB ADC power-up time LDO already started 1 1/fADC

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Table 74. ADC characteristics(1)(2) (continued)

Symbol Parameter Conditions Min Typ Max Unit

Offset and linearity

tCAL - 16384
calibration time
tOFF_CAL Offset calibration time - 1280
CKMODE = 00 1.5 2 2.5
Trigger conversion latency
for regular and injected CKMODE = 01 - - 2.5
tLATR
channels without aborting CKMODE = 10 - - 2.5
the conversion
CKMODE = 11 - - 2.25
1/fADC
CKMODE = 00 2.5 3 3.5
Trigger conversion latency
for regular and injected CKMODE = 01 - - 3.5
tLATRINJ
channels when a regular CKMODE = 10 - - 3.5
conversion is aborted
CKMODE = 11 - - 3.25
tS Sampling time - 1.5 - 810.5
Total conversion time
tCONV N-bit resolution ts + N/2(4)
(including sampling time)

ADC consumption from FS = 3.6 Msps, BOOST = 1 - 1900 -

IDDA(ADC)
VDDA supply (differential) FS = 1 Msps, BOOST = 0 - 460 -

ADC consumption from FS = 3.6 Msps, BOOST = 1 - 260 -

IDDA(REF)
VREF+ (differential) FS = 1 Msps, BOOST = 0 - 140 -
μA
ADC consumption from FS = 3.6 Msps, BOOST = 1 - 1700 -
IDDA(ADC)
VDDA supply (single-ended) F = 1 Msps, BOOST = 0 - 445 -
S

ADC consumption from FS = 3.6 Msps, BOOST = 1 - 160 -

IDDA(REF) VREF+ supply (single-
ended) FS = 1 Msps, BOOST = 0 - 75 -

1. Guaranteed by design.
2. Voltage BOOSTER on ADC switches must be used for VDDA < 2.4 V (switches inside IO).
3. Depending on the package, VREF- can be internally connected to VSSA.
4. 9 to 818 cycles @ 14-bit mode.

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Table 75. Minimum sampling time versus RAIN with 47 pF PCB capacitor
up to 125 °C and VDDA = 1.6 V(1)
Fast Slow
Resolution(2) RAIN (Ω)
channels(3) (ns) channels(4) (ns)

16 bits 47(5) 107 166

47 90.8 144
68 967 151
14 bits 100 108 157
150 128 171
(5)
220 161 192
47 76.7 125
68 81.5 127
100 89.8 134
150 107 146
12 bits 220 132 169
330 177 205
470 2.36 264
680 329 345
(5)
1000 462 488
47 62.5 103
68 66.2 106
100 72.7 112
150 85.4 121
220 106 137
330 140 168
10 bits 470 187 209
680 258 279
1000 367 381
1500 537 552
2200 776 786
3300 1130 1140
(5)
4700 1600 1600

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Table 75. Minimum sampling time versus RAIN with 47 pF PCB capacitor
up to 125 °C and VDDA = 1.6 V(1) (continued)
Fast Slow
Resolution(2) RAIN (Ω)
channels(3) (ns) channels(4) (ns)

47 48.7 82.4
68 51.4 84.6
100 56.4 88.7
150 65.8 95.7
220 80.4 108
330 106 130
470 139 160
680 189 208
8 bits 1000 269 284
1500 390 405
2200 562 572
3300 827 840
4700 1170 1170
6800 1670 1670
10000 2440 2430
15000 3660 3630
(5)
2200 5360 5310
1. Guaranteed by design.
2. The tolerance is 8 LSB for 16-bit, 4 LSB for 14-bit, 2 LSB for 12-bit, 10-bit and 8-bit conversions.
3. On ADC1, fast channels are PA6, PA7, PB0, PB1, PC4, PC5, PF11, PF12.
On ADC2, fast channels are PA6, PA7, PB0, PB1, PC4, PC5, PF13, PF14.
4. Slow channels are all ADC inputs except the fast channels.
5. Maximum external input impedance value authorized for the given resolution.

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Table 76. ADC accuracy(1)(2)(3)(4)(5)(6)(7)

Symbol Parameter Conditions(8) Min Typ(9) Max Unit

BOOST = 1 - ±5 -
Single ended
Total BOOST = 0 - ±7 -
ET(10) unadjusted
error BOOST = 1 - ±6 -
Differential
BOOST = 0 - ±5 -
BOOST = 1 - 3 -
Single ended
Differential BOOST = 0 - 1 -
ED ±LSB
linearity error BOOST = 1 - 8 -
Differential
BOOST = 0 - 2 -
BOOST = 1 - ±6 -
Single ended
Integral BOOST = 0 - ±4 -
EL
linearity error BOOST = 1 - ±6 -
Differential
BOOST = 0 - ±4 -
BOOST = 1 - 12.5 -
Effective Single ended
number of BOOST = 0 - 12.75 -
ENOB(11) bits
bits BOOST = 1 - 13.3 -
(2 MSPS) Differential
BOOST = 0 - 13.7 -

Signal-to- BOOST = 1 - 77.5 -

Single ended
noise and BOOST = 0 - 78.75 -
SINAD(11) distortion
ratio BOOST = 1 - 82 -
Differential
(2 MSPS) BOOST = 0 - 84.2 -
BOOST = 1 - 77.6 -
Single ended
Signal-to- BOOST = 0 - 79 -
SNR(11) noise ratio dB
(2 MSPS) BOOST = 1 - 82.4 -
Differential
BOOST = 0 - 84.3 -
BOOST = 1 - -85 -
Single ended
Total BOOST = 0 - -88 -
THD(11) harmonic
distortion BOOST = 1 - -90 -
Differential
BOOST = 0 - -93 -
1. Guaranteed by characterization.
2. ADC DC accuracy values are measured after internal calibration.
3. ADC accuracy versus negative injection current: injecting negative current on any analog input pins should be avoided as
this significantly reduces the accuracy of the conversion being performed on another analog input. It is recommended to
add a Schottky diode (pin to ground) to analog pins which may potentially inject negative current.
4. The above table gives the ADC performance in 16-bit mode.
5. Dual Simultaneous mode is limited to 12-bit.
6. Dual mode consisting in an injected conversion (reset) occurring during another (regular) conversion is forbidden.
7. Dual Interleaved 16-bit/14-bit/12-bit modes can work if the delay between the 2 ADCs is as specified in Table 77.

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8. ADC clock frequency ≤36 MHz, 2 V ≤ VDDA ≤ 3.3 V, 1.6 V ≤ VREF+ ≤ VDDA, BOOSTEN (for I/O) = 1.
9. VDDA = VREF+ = 3.3 V, 25 °C.
10. ET, ED, EL are specified for [2 V ≤ VDDA ≤ 3.3 V with 2 V ≤ VREF+ ≤ VDDA] and [1.6V ≤ VDDA ≤ 2 V with 1.6V ≤ VREF+ ≤
VDDA].
11. ENOB, SINAD, SNR and THD are specified for VDDA = VREF+ = 3.3 V.

Table 77. Minimum delay for interleaved conversion versus resolution

16-bit Mode 14-bit mode 12-bit Mode

Delay Delay Delay

Data rate Data rate Data rate
Boost Fclk (MHz) ADC1/ADC2 ADC1/ADC2 ADC1/ADC2
(MSPS) (MSPS) (MSPS)
(clock cycles) (clock cycles) (clock cycles)

0 1 1.5 1.0 1.5 1.0 1.5 1.0

0 2 1.5 2.0 1.5 2.0 1.5 2.0
0 3 1.5 1.5 1.5 1.5 1.5 1.5
0 4 1.5 2.0 1.5 2.0 1.5 2.0
0 5 1.5 1.7 1.5 1.7 1.5 2.5
0 6 1.5 2.0 1.5 2.0 1.5 2.0
0 7 2.5 1.8 1.5 2.3 1.5 2.3
0 8 2.5 2.0 2.5 2.0 1.5 2.7
0 9 3.5 1.8 2.5 2.3 2.5 2.3
0 10 3.5 2.0 3.5 2.0 2.5 2.5
0 11 4.5 1.8 3.5 2.2 2.5 2.8
0 12 4.5 2.0 4.5 2.0 3.5 2.4
0 13 4.5 2.2 4.5 2.2 3.5 2.6
0 14 4.5 2.3 4.5 2.3 3.5 2.8
0 15 5.5 2.1 4.5 2.5 3.5 3.0
0 16 5.5 2.3 4.5 2.7 3.5 3.2
0 17 5.5 2.4 4.5 2.8 3.5 3.4
0 18 5.5 2.6 4.5 3.0 3.5 3.6
0 19 5.5 2.7 4.5 3.2 3.5 3.8
0 20 5.5 2.9 4.5 3.3 3.5 4.0
1 21 4.5 3.5 3.5 4.2 3.5 4.2
1 22 4.5 3.7 3.5 4.4 3.5 4.4
1 23 4.5 3.8 3.5 4.6 3.5 4.6
1 24 4.5 4.0 4.5 4.0 3.5 4.8
1 25 4.5 4.2 4.5 4.2 3.5 5.0
1 26 4.5 4.3 4.5 4.3 3.5 5.2
1 27 5.5 3.9 4.5 4.5 3.5 5.4

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Table 77. Minimum delay for interleaved conversion versus resolution (continued)
16-bit Mode 14-bit mode 12-bit Mode

Delay Delay Delay

Data rate Data rate Data rate
Boost Fclk (MHz) ADC1/ADC2 ADC1/ADC2 ADC1/ADC2
(MSPS) (MSPS) (MSPS)
(clock cycles) (clock cycles) (clock cycles)

1 28 5.5 4.0 4.5 4.7 3.5 5.6

1 29 5.5 4.1 4.5 4.8 3.5 5.8
1 30 5.5 4.3 4.5 5.0 3.5 6.0
1 31 5.5 4.4 4.5 5.2 3.5 6.2
1 32 5.5 4.6 4.5 5.3 3.5 6.4
1 33 5.5 4.7 4.5 5.5 3.5 6.6
1 34 5.5 4.9 4.5 5.7 3.5 6.8
1 35 5.5 5.0 4.5 5.8 3.5 7.0
1 36 5.5 5.1 4.5 6.0 3.5 7.2

Note: ADC accuracy vs. negative injection current: injecting a negative current on any analog
input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to
ground) to analog pins which may potentially inject negative currents.
Any positive injection current within the limits specified for IINJ(PIN) and ∑IINJ(PIN) in
Section 6.2 does not affect the ADC accuracy.

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Figure 39. ADC accuracy characteristics

V REF+ V DDA
[1LSB IDEAL = (or depending on package)]
4096 4096
EG
4095
4094
4093

(2)
ET
7 (3)
(1)
6
5
EO EL
4
3
ED
2
1L SBIDEAL
1

0
1 2 3 456 7 4093 4094 4095 4096
V SSA VDDA
ai14395c

1. Example of an actual transfer curve.

2. Ideal transfer curve.
3. End point correlation line.
4. ET = Total Unadjusted Error: maximum deviation between the actual and the ideal transfer curves.
EO = Offset Error: deviation between the first actual transition and the first ideal one.
EG = Gain Error: deviation between the last ideal transition and the last actual one.
ED = Differential Linearity Error: maximum deviation between actual steps and the ideal one.
EL = Integral Linearity Error: maximum deviation between any actual transition and the end point
correlation line.

Figure 40. Typical connection diagram using the ADC

VDD STM32
Sample and hold ADC
VT converter
0.6 V
RAIN(1) AINx RADC(1)
12-bit
converter
VT
VAIN
0.6 V C ADC(1)
Cparasitic
IL±1 μA

ai17534b

1. Refer to Table 74 for the values of RAIN, RADC and CADC.

2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 5 pF). A high Cparasitic value downgrades conversion accuracy. To remedy this,
fADC should be reduced.

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233
Electrical characteristics STM32MP151C/F

General PCB design guidelines

PCB design guidelines are provided in AN5031 “Getting started with STM32MP1 Series
hardware development.” available from the ST website www.st.com.

6.3.23 DAC electrical characteristics

Table 78. DAC characteristics(1)(2)

Symbol Parameter Conditions Min Typ Max Unit

VDDA Analog supply voltage - 1.8 3.3 3.6

VREF+ Positive reference voltage - 1.80 - VDDA
V
Negative reference
VREF- - - VSSA -
voltage

DAC output connected to

5 - -
buffer ON, Not VSSA
RL Resistive Load
valid in Sample connected to kΩ
& Hold mode 25 - -
VDDA
RO Output Impedance DAC output buffer OFF 10.3 13 16
Output impedance sample VDD = 2.7 V - - 1.6
DAC output
RBON and hold mode, output kΩ
buffer ON VDD = 2.0 V - - 2.6
buffer ON
Output impedance sample VDD = 2.7 V - - 17.8
DAC output
RBOFF and hold mode, output kΩ
buffer OFF VDD = 2.0 V - - 18.7
buffer OFF
CL DAC output buffer OFF - - 50 pF
Capacitive Load
CSH Sample and Hold mode - 0.1 1 µF
VDDA
DAC output buffer ON 0.2 - -
Voltage on DAC_OUT 0.2(3)
VDAC_OUT V
output
VREF
DAC output buffer OFF 0 -
+

Settling time (full scale: for Normal mode,

a 12-bit code transition DAC output ±1 LSB - 2 -
between the lowest and buffer ON
tSETTLING µs
the highest input codes Normal mode,
when DAC_OUT reaches DAC output buffer OFF, - - 2
the final value of ±1LSB) +/-1LSB, Cload ≤ 10 pF

Wakeup time from off Normal mode,

- 5 7.5
state (setting the Enx bit in DAC output buffer ON
tWAKEUP(4) µs
the DAC Control register) Normal mode,
until the ±1LSB final value - 2 5
DAC output buffer OFF
Normal mode
PSRR VDDA supply rejection ratio - -80 -28 dB
DAC output buffer ON

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Table 78. DAC characteristics(1)(2) (continued)

Symbol Parameter Conditions Min Typ Max Unit

Sampling time in Sample DACMCR.MODEx[2:0] =

and Hold mode 100/101 - 0.7 -
CSH=100nF (BUFFER ON)
tSAMP (Code transition between DACMCR.MODEx[2:0] = 110 ms
the lowest input code and - 11.5 -
(BUFFER OFF)
the highest input code
when DAC_OUT reaches DACMCR.MODEx[2:0] = 111
- 0.3 -
final value ± 1LSB) (INTERNAL BUFFER OFF)
Internal sample and hold
CIint - - 2.2 - pF
capacitor

Middle code offset for 1 VREF+ = 3.6 V - 450 -

Voffset µV
trim code step VREF+ = 1.8 V - 213 -
No load, middle
- 360 -
DAC output code (0x800)
buffer ON No load, worst
- 490 -
code (0xF1C)
DAC quiescent No load,
IDDA(DAC) DAC output
consumption from VDDA middle/worst - 20 -
buffer OFF
code (0x800)
360×TON/
Sample and Hold mode,
- (TON+TOFF) -
CSH = 100 nF (5)

No load, middle
- 170 -
DAC output code (0x800) µA
buffer ON No load, worst
- 170 -
code (0xF1C)
No load,
DAC output
middle/worst - 160 -
DAC consumption from buffer OFF
IDDV(DAC) code (0x800)
VREF+
170×TON/
Sample and Hold mode, Buffer
- (TON+TOFF) -
ON, CSH = 100 nF (worst code) (5)

170×TON/
Sample and Hold mode, Buffer
- (TON+TOFF) -
OFF, CSH = 100 nF (worst code) (5)

1. Guaranteed by design.
2. Unless otherwise noted, CL ≤ 50 pF with RL ≥ 5 kΩ when DAC output buffer is ON, or CL ≤ 10 pF with no RL when DAC
output buffer is OFF.
3. Since VREF+ must always be ≤ VDDA, maximum VDAC_OUT = minimum value between Max(VREF+) and Max(VDDA-0.2)
4. In buffered mode, the output can overshoot above the final value for low input code (starting from the minimum value).
5. TON is the refresh phase duration, while TOFF is the hold phase duration. Refer to the product reference manual for more
details.

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Table 79. DAC accuracy(1)

Symbol Parameter Conditions Min Typ(2) Max Unit

Differential
DNL non - - ±2 - LSB
linearity(3)
Integral non
INL - - ±4 - LSB
linearity(4)
VREF+ =
- ±5 -
DAC output 3.6 V
Offset error
Offset at code buffer ON VREF+ = LSB
- ±7 -
0x800 (4) 1.8 V
DAC output buffer OFF - ±8 -
Offset error
Offset1 at code DAC output buffer OFF - ±5 - LSB
0x001(5)
Gain Gain error(6) - - ±1 - %
Total VREF+=3.6 V - ±10 -
DAC output
TUECal unadjusted LSB
buffer ON VREF+=1.8 V - ±8 -
error
Signal-to-
SNR 1 kHz, BW = 500 kHz - 67.8 - dB
noise ratio(7)
Total
THD harmonic 1kHz - -78.6 - dB
distorsion(7)
Signal-to-
noise and
SINAD 1 kHz - 67.5 - dB
distortion
ratio(7)
Effective
ENOB number of 1 kHz - 10.9 - bits
bits
1. Unless otherwise noted, CL ≤ 50 pF with RL ≥ 5 kΩ when DAC output buffer is ON, or CL ≤ 10 pF with no RL when DAC
output buffer is OFF.
2. Guaranteed by characterization.
3. Difference between two consecutive codes minus 1 LSB.
4. Difference between measured the value at Code i and the value measured at Code i on a line drawn between Code 0 and
last Code 4095.
5. Difference between the value measured at Code (0x001) and the ideal value.
6. Difference between the ideal slope of the transfer function and the measured slope computed from code 0x000 and 0xFFF
when the buffer is OFF, and from code giving 0.2 V and (VREF+ - 0.2 V) when the buffer is ON.
7. Signal is -0.5dBFS with Fsampling=1 MHz.

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Figure 41. 12-bit buffered /non-buffered DAC

Buffered/Non-buffered DAC

Buffer(1)
RL

12-bit DAC_OUTx
digital to
analog
converter
CL

ai17157V3

1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external
loads directly without the use of an external operational amplifier. The buffer can be bypassed by
configuring the BOFFx bit in the DAC_CR register.

6.3.24 Voltage reference buffer characteristics

Table 80. VREFBUF characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

VSCALE = 000 2.8 3.3 3.6

VSCALE = 001 2.4 - 3.6
Normal mode
VSCALE = 010 2.1 - 3.6
VSCALE = 011 1.8 - 3.6
VDDA Analog supply voltage
VSCALE = 000 1.62 - 2.80
VSCALE = 001 1.62 - 2.40
Degraded mode(2)
VSCALE = 010 1.62 - 2.10
VSCALE = 011 1.62 - 1.80
VSCALE = 000 2.498 2.500 2.502
Normal mode
VSCALE = 001 2.047 2.049 2.051 V
@30 °C
@Iload = 10 uA VSCALE = 010 1.800 1.804 1.807
VDDA = 3.3 V
VSCALE = 011 1.500 1.504 1.507
VDDA-
VREFBUF Voltage Reference VSCALE = 000 - VDDA
220 mV
_OUT Buffer Output
VDDA-
VSCALE = 001 - VDDA
220 mV
Degraded mode(2)
VDDA-
VSCALE = 010 - VDDA
220 mV
VDDA-
VSCALE = 011 - VDDA
220 mV
TRIM Trim step resolution - - - ±0.05 - %
CL Load capacitor - - 0.5 1 1.50 uF

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Table 80. VREFBUF characteristics(1) (continued)

Symbol Parameter Conditions Min Typ Max Unit

Equivalent Serial
esr - - - - 2 Ω
Resistor of CL
Iload Static load current - - - - 4 mA
Iload = 500 µA - 200 -
Iline_reg Line regulation 2.8 V ≤ VDDA ≤ 3.6 V ppm/V
Iload = 4 mA - 100 -
500 µA ≤ ILOAD ≤ ppm/
Iload_reg Load regulation Normal Mode - 50 -
4 mA mA
Tcoeff_
Temperature VREF ppm/
Tcoeff -40 °C < TJ < +125 °C - - -
coefficient INT °C
+75
DC - - 60 -
PSRR Power supply rejection dB
100 kHz - - 40 -
CL = 0.5 µF - - 300 350
tSTART Start-up time(3) CL = 1 µF - - 500 650 µs
CL = 1.5 µF - - 650 800
Control of maximum
DC current drive on
IINRUSH - - 8 13.5 mA
VREFBUF_OUT during
startup phase(4)
ILOAD = 0 µA - - 15 16
VREFBUF
IDDA(VRE
consumption from ILOAD = 500 µA - - 16 21 µA
FBUF) VDDA
ILOAD = 4 mA - - 32 41
RVREF
Pull-down resistor
BUF_PullD - - 100 - Ω
when ENVR = HIZ = 0
own

1. Guaranteed by design.
2. In degraded mode, the voltage reference buffer cannot accurately maintain the output voltage (VDDA-drop voltage).
3. if VREF+ pin has residual voltage when VREFBUF is enabled (VREFBUF_CSR.ENVR=1), this might create an overshoot
on VREFBUF output longer than tSTART.
To avoid this, it is necessary that VREF+ pin is correctly discharged before being enabled (below VREFBUF_OUT minus
1 V, for example below 1.5 V for VSCALE = 000)
This could be achieved by ensuring VREFBUF is in OFF mode (VREFBUF_CSR.ENVR=0 and VREFBUF_CSR.HIZ=0) for
sufficient time to discharge CL through VREFBUF pull-down.
4. To properly control VREFBUF IINRUSH current during the startup phase and the change of scaling, VDDA voltage should be
in the range of 1.8 V-3.6 V, 2.1 V-3.6 V, 2.4 V-3.6 V and 2.8 V-3.6 V for VSCALE = 011, 010, 001 and 000, respectively.

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6.3.25 Temperature sensor characteristics

Table 81. Temperature sensor characteristics

Symbol Parameter Min Typ Max Unit

VSENSE linearity with temperature (from Vsensor

- - 3
TL(1) voltage) °C
VSENSE linearity with temperature (from ADC counter) - - 3
Average slope (from Vsensor voltage) - 2 -
Avg_Slope(2) mV/°C
Average slope (from ADC counter) - 2 -
V30(3) Voltage at 30 °C ± 5 °C - 0.62 - V
tstart_run (1) Startup time in Run mode (buffer startup) 5.3 - 40.5
µs
tS_temp(1) ADC sampling time when reading the temperature 9.8 - -
Isens(1) Sensor consumption 0.11 0.18 0.31
µA
Isensbuf(1) Sensor buffer consumption 2.3 3.8 6.1
1. Guaranteed by design.
2. Guaranteed by characterization.
3. Measured at VDDA = 3.3 V ± 10 mV. The V30 ADC conversion result is stored in the TS_CAL1 byte.

Table 82. Temperature sensor calibration values

Symbol Parameter Memory address

TS ADC raw data acquired at temperature of

TS_CAL1 30 °C ±5 °C 0x5C00 525C[15:0](1)(2)
VDDA = VREF+ = 3.3 V ±10 mV
TS ADC raw data acquired at temperature of
TS_CAL2 130 °C ±2 °C 0x5C00 525C[31:16](1)(2)
VDDA = VREF+ = 3.3 V ±10 mV
1. It is mandatory to read a 32-bit word and to do relevant masking and shifting to isolate the required bits.
2. This address is located inside the BSEC and the access is allowed after being enabled in the RCC.

6.3.26 DTS characteristics

Table 83. DTS characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

Output Clock frequency (PTAT

fDTS - - 500 - kHz
clock)
TSLOPE Average slope - - 1600 - Hz/°C
Linearity with temperature (from
TL VDDCORE = 1.2 V - - 3.8 °C
Output clock frequency).
VDDCORE = 1.2 V
TTOTAL_
Temperature measurement error Temperature: -5 - +5 °C
ERROR
-40 to 125 °C

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Table 83. DTS characteristics(1) (continued)

Symbol Parameter Conditions Min Typ Max Unit

TVDD Additional error due to VDDCORE

- - 10 - °C/V
CORE variation
tTRIM Calibration time - 2 - - ms
Wake-up time from off state until
tWAKE_UP - - 50 - μs
DTS ready signal = 1
IDDCORE_DTS DTS consumption on VDDCORE - - 20 - µA
1. Guaranteed by design.

6.3.27 VBAT ADC monitoring characteristics and charging characteristics

Table 84. VBAT ADC monitoring characteristics

Symbol Parameter Min Typ Max Unit

R Resistor bridge for VBAT - 26 - kΩ

Q Ratio on VBAT measurement - 4 - -
Er(1) Error on Q –10 - +10 %
tS_vbat(1) ADC sampling time when reading VBAT input 9.8 - - µs
1. Guaranteed by design.

Table 85. VBAT charging characteristics

Symbol Parameter Condition Min Typ Max Unit

VBRS in PWR_CR3= 0 - 5 -
RBC Battery charging resistor kΩ
VBRS in PWR_CR3= 1 - 1.5 -

6.3.28 Temperature and VBAT monitoring characteristics for

tamper detection

Table 86. Temperature and VBAT monitoring characteristics for temper detection
Symbol Parameter Min Typ Max Unit

TEMPhigh High temperature monitoring 105 116 126

oC
TEMPlow Low temperature monitoring -42 -31 -20
VBAThigh(1) High supply monitoring 3.47 3.59 3.73
V
VBATlow(1) Low supply monitoring 1.3 1.34 1.43
1. Monitored supply is VSW (i.e. VDD if VDD is present, VBAT otherwise)

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6.3.29 VDDCORE monitoring characteristics

Table 87. VDDCORE monitoring characteristics

Symbol Parameter Min Typ Max Unit

ADC sampling time when reading VDDCORE

tS_vddcore(1) 100 - - ns
input
1. Guaranteed by design.

6.3.30 Voltage booster for analog switch

Table 88. Voltage booster for analog switch characteristics

Symbol Parameter Condition Min Typ Max Unit

VDD Supply voltage - 1.71 - 3.6 V

tSU(BOOST) Booster startup time - - - 50 µs
1.71 V ≤ VDD ≤ 2.7 V - - 125
IDD(BOOST) Booster consumption µA
2.7 V < VDD < 3.6 V - - 250

6.3.31 Compensation cell

Table 89. Compensation cell characteristics

Symbol Parameter Condition Min Typ Max Unit

VDD current consumption 1.71 V ≤ VDD ≤ 2.7 V - - 3.5

ICOMPCELL mA
during code calculation 2.7 V < VDD < 3.6 V - - 10

Time needed for code 1.71 V ≤ VDD ≤ 2.7 V - - 300

TREADY µs
calculation 2.7 V < VDD < 3.6 V - - 250

6.3.32 Digital filter for sigma-delta modulators (DFSDM) characteristics

Unless otherwise specified, the parameters given in Table 90 for DFSDM are derived from
tests performed under the ambient temperature, fpclkx frequency and VDD supply voltage
summarized in Table 13: General operating conditions, with the following configuration:
• Output speed is set to OSPEEDRy[1:0] = 10
• Capacitive load C = 30 pF
• Measurement points are done at CMOS levels: 0.5×VDD
Refer to Section 6.3.17: I/O port characteristics for more details on the input/output alternate
function characteristics (DFSDMx_CKINx, DFSDMx_DATINx, DFSDMx_CKOUT for
DFSDMx).

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Table 90. DFSDM measured timing

Symbol Parameter Conditions Min Typ Max Unit

fDFSDMCLK DFSDM clock 1.71 V < VDD < 3.6 V - - fSYSCLK

SPI mode (SITP[1:0]=0,1),
20
External clock mode
- - (fDFSDMCLK
(SPICKSEL[1:0]=0),
/4)
1.71 V < VDD < 3.6 V
SPI mode (SITP[1:0]=0,1),
20
External clock mode
- - (fDFSDMCLK
(SPICKSEL[1:0]=0),
/4)
fCKIN Input clock 2.7 < VDD < 3.6 V
(1/TCKIN) frequency SPI mode (SITP[1:0]=0,1), MHz
20
Internal clock mode
- - (fDFSDMCLK
(SPICKSEL[1:0]≠0),
/4)
1.71 < VDD < 3.6 V
SPI mode (SITP[1:0]=0,1),
20
Internal clock mode
- - (fDFSDMCLK
(SPICKSEL[1:0]≠0),
/4)
2.7 < VDD < 3.6 V
Output clock
fCKOUT 1.71 < VDD < 3.6 V - - 20
frequency
Even division
CKOUTDIV[7:0] = n 45 50 55
Output clock 1,3,5,..
1.71 < VDD
DuCyCKOUT frequency duty %
< 3.6 V Odd division (((n/2+1)/
cycle (((n/2+1)/ ((n/2+1)/
CKOUTDIV[7:0] = n (n+1))*100)
(n+1))*100)-5 (n+1))*100
2,4,6,.. +5
SPI mode (SITP[1:0]=0,1),
Input clock
twh(CKIN) External clock mode
high and low TCKIN/2 - 0.5 TCKIN/2 -
twl(CKIN) (SPICKSEL[1:0]=0),
time
1.71 < VDD < 3.6 V
SPI mode (SITP[1:0]=0,1),
Data input External clock mode
tsu 1 - -
setup time (SPICKSEL[1:0]=0),
1.71 < VDD < 3.6 V
ns
SPI mode (SITP[1:0]=0,1),
Data input hold External clock mode
th 0.5 - -
time (SPICKSEL[1:0]=0),
1.71 < VDD < 3.6 V
Manchester Manchester mode (SITP[1:0]=2,3), (CKOUTDIV+ (2×CKOUT
data period Internal clock mode 1) DIV) ×
TManchester -
(recovered (SPICKSEL[1:0]≠0), ×TDFSDMCLK TDFSDMCLK
(1) (1)
clock period) 1.71 < VDD < 3.6 V
1. See DFSDM section in RM0441 reference manual for definition of CKOUTDIV.

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Figure 42. Channel transceiver timing diagrams

DFSDM_CKINy (SPICKSEL=0)
SPI timing : SPICKSEL = 0

twl twh tr tf
tsu th
DFSDM_DATINy

SITP = 00

tsu th

SITP = 01

SPICKSEL=3
DFSDM_CKOUT

SPICKSEL=2
SPI timing : SPICKSEL = 1, 2, 3

SPICKSEL=1

twl twh tr tf
tsu th
DFSDM_DATINy

SITP = 0

tsu th

SITP = 1

SITP = 2
DFSDM_DATINy
Manchester timing

SITP = 3

recovered clock

recovered data 0 0 1 1 0
MS30766V2

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6.3.33 Camera interface (DCMI) characteristics

Unless otherwise specified, the parameters given in Table 91 for DCMI are derived from
tests performed under the ambient temperature, Fmcu_ck frequency and VDD supply voltage
summarized in Table 13: General operating conditions, with the following configuration:
• DCMI_PIXCLK polarity: falling
• DCMI_VSYNC and DCMI_HSYNC polarity: high
• Data formats: 14 bits
• Capacitive load C = 30 pF
• Measurement points are done at CMOS levels: 0.5×VDD

Table 91. DCMI characteristics(1)

Symbol Parameter Min Max Unit

- Frequency ratio DCMI_PIXCLK/Fmcu_ck - 0.4 -

DCMI_PIXCLK Pixel clock input - 80 MHz
DPixel Pixel clock input duty cycle 30 70 %
tsu(DATA) Data input setup time 2 -
th(DATA) Data input hold time 0.5 -
tsu(HSYNC) ns
DCMI_HSYNC/DCMI_VSYNC input setup time 2 -
tsu(VSYNC)
th(HSYNC)
DCMI_HSYNC/DCMI_VSYNC input hold time 1 -
th(VSYNC)
1. Guaranteed by characterization results.

Figure 43. DCMI timing diagram

1/DCMI_PIXCLK

DCMI_PIXCLK

tsu(HSYNC) th(HSYNC)

DCMI_HSYNC

tsu(VSYNC) th(HSYNC)

DCMI_VSYNC
tsu(DATA) th(DATA)

DATA[0:13]

MS32414V2

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6.3.34 LCD-TFT controller (LTDC) characteristics

Unless otherwise specified, the parameters given in Table 92 for LCD-TFT are derived from
tests performed under the ambient temperature, Fpclk4 frequency and VDD supply voltage
summarized in Table 13: General operating conditions, with the following configuration:
• LCD_CLK polarity: high
• LCD_DE polarity: low
• LCD_VSYNC and LCD_HSYNC polarity: high
• Pixel formats: 24 bits
• Output speed is set to OSPEEDRy[1:0] = 11
• Capacitive load C = 30 pF
• Measurement points are done at CMOS levels: 0.5×VDD
• I/O compensation cell enabled

Table 92. LTDC characteristics (1)

Symbol Parameter Conditions Min Max Unit

2.7 V < VDD < 3.6 V

- 90
OSPEEDR[1:0] = 11, 10
1.71 V < VDD < 3.6 V
fCLK LTDC clock output frequency - 45 MHz
OSPEEDR[1:0] = 11
1.71 V < VDD < 3.6 V
- 38
OSPEEDR[1:0] = 10
DCLK LTDC clock output duty cycle - 45 55 %
tw(CLKH),
Clock High time, low time - tw(CLK)/2 - 0.5 tw(CLK)/2 + 0.5
tw(CLKL)
OSPEEDR[1:0] = 11 - 3
tv(DATA) Data output valid time
OSPEEDR[1:0] = 10 - 4
th(DATA) Data output hold time - 0 -
ns
tv(HSYNC), OSPEEDR[1:0] = 11 - 2.5
tv(VSYNC), HSYNC/VSYNC/DE output valid time
tv(DE) OSPEEDR[1:0] = 10 - 3.5

th(HSYNC),
th(VSYNC), HSYNC/VSYNC/DE output hold time - 0 -
th(DE)
1. Guaranteed by characterization results.

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Figure 44. LCD-TFT horizontal timing diagram

tCLK

LCD_CLK

LCD_VSYNC

tv(HSYNC) tv(HSYNC)

LCD_HSYNC
tv(DE) th(DE)

LCD_DE
tv(DATA)
LCD_R[0:7]
LCD_G[0:7] Pixel Pixel Pixel
1 2 N
LCD_B[0:7]
th(DATA)

HSYNC Horizontal Active width Horizontal

width back porch back porch

One line
MS32749V1

Figure 45. LCD-TFT vertical timing diagram

tCLK

LCD_CLK

tv(VSYNC) tv(VSYNC)

LCD_VSYNC

LCD_R[0:7]
LCD_G[0:7] M lines data
LCD_B[0:7]

VSYNC Vertical Active width Vertical

width back porch back porch

One frame
MS32750V1

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6.3.35 Timer characteristics

The parameters given in Table 93 are guaranteed by design.
Refer to Section 6.3.17: I/O port characteristics for details on the input/output alternate
function characteristics (output compare, input capture, external clock, PWM output).

Table 93. TIMx characteristics(1)(2)

Symbol Parameter Min Max Unit

tres(TIM) Timer resolution time 1 - tTIMxCLK

fTIMxCLK Timer kernel clock 0 209
MHz
fEXT Timer external clock frequency on CH1 to CH4 0 fTIMxCLK/2
ResTIM Timer resolution - 16/32 bit
Maximum possible count with 16-bit counters 65536
tMAX_COUNT Maximum possible count with 32-bit counter - 65536 × tTIMxCLK
(TIM2, TIM5) 65536
1. TIMx is used as a general term to refer to the TIM1 to TIM17 timers.
2. Guaranteed by design.

Table 94. LPTIMx characteristics(1)(2)

Symbol Parameter Min Max Unit

tres(TIM) Timer resolution time 1 - tTIMxCLK

fLPTIMxCLK Timer kernel clock 0 104.5
Timer external clock frequency on Input1 and fLPTIMxCLK/ MHz
fEXT 0
Input2 2
ResTIM Timer resolution - 16 bit
tMAX_COUNT Maximum possible count - 65536 tTIMxCLK
1. LPTIMx is used as a general term to refer to the LPTIM1 to LPTIM5 timers.
2. Guaranteed by design.

6.3.36 Communications interfaces

I2C interface characteristics
The I2C interface meets the timings requirements of the I2C-bus specification for:
• Standard-mode (Sm): with a bit rate up to 100 kbit/s
• Fast-mode (Fm): with a bit rate up to 400 kbit/s.
• Fast-mode Plus (Fm+): with a bit rate up to 1 Mbit/s.
The I2C timings requirements are guaranteed by design when the I2C peripheral is properly
configured and when the i2c_ker_ck frequency is greater than the minimum shown in the
table below:

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Table 95. Minimum i2c_ker_ck frequency in all I2C modes

Symbol Parameter Condition Min Unit

Standard-mode - 2
Analog filter ON
8
DNF=0
Fast-mode
Analog filter OFF
I2CCLK 9
f(I2CCLK) DNF=1 MHz
frequency
Analog filter ON
19
DNF=0
Fast-mode Plus
Analog filter OFF
16
DNF=1

The SDA and SCL I/O requirements are met with the following restrictions:
• The SDA and SCL I/O pins are not “true” open-drain. When configured as open-drain,
the PMOS connected between the I/O pin and VDD is disabled, but is still present.
• The 20 mA output drive requirement in Fast-mode Plus is not supported. This limits the
maximum load Cload supported in Fm+, which is given by these formulas:
tr(SDA/SCL) = 0.8473 × Rp × Cload
Rp(min) = (VDD-VOL(max))/IOL(max)
Where Rp is the I2C lines pull-up. Refer to Section 6.3.17: I/O port characteristics for the I2C
I/Os characteristics.
All I2C SDA and SCL I/Os embed an analog filter. Refer to Table 96 for the analog filter
characteristics:

Table 96. I2C analog filter characteristics(1)

Symbol Parameter Min Max Unit

Maximum pulse width of spikes that

tAF 40(2) 260(3) ns
are suppressed by the analog filter
1. Guaranteed by design.
2. Spikes with widths below tAF(min) are filtered.
3. Spikes with widths above tAF(max) are not filtered.

The I2C pins can be set in FM+ mode in SYSCFG_PMCR register.

Unless otherwise specified, the parameters given in Table 55 are derived from tests
performed under the ambient temperature and VDD supply voltage conditions summarized
in Table 13: General operating conditions.

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Table 97. I2C FM+ pin characteristics

Symbol Parameter Conditions Min Max Unit

Fmax(1) Maximum frequency C = 50 pF - 1 MHz

Tf(2) Output high to low level fall time 1.71 ≤ VDD ≤ 3.6 V - 5 ns
1. The maximum frequency is defined with the following conditions:
- (Tr + Tf) ≤ ⅔T
- 45% < duty cycle < 55%.
2. The fall time is defined between 70% and 30% of the output waveform accordingl to I2C specification NXP
UM10204 rev- Oct 2012.

SPI interface characteristics

Unless otherwise specified, the parameters given in Table 98 for the SPI interface are
derived from tests performed under the ambient temperature, fpclkx frequency and VDD
supply voltage conditions summarized in Table 13: General operating conditions, with the
following configuration:
• Output speed is set to OSPEEDRy[1:0] = 11
• Capacitive load C = 30 pF
• Measurement points are done at CMOS levels: 0.5×VDD
• I/O compensation cell enabled
• HSLV activated when VDD ≤ 2.7 V
Refer to Section 6.3.17: I/O port characteristics for more details on the input/output alternate
function characteristics (NSS, SCK, MOSI, MISO for SPI).

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Table 98. SPI dynamic characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

Master mode
1.71 V ≤ VDD ≤ 3.6 V 70
SPI1
Master mode
2.7 V ≤ VDD ≤ 3.6 V 80
SPI1
Master mode
1.71 V ≤ VDD ≤ 3.6 V 80
SPI2, SPI3
Master mode
2.7 V ≤ VDD ≤ 3.6 V 100
SPI2, SPI3
fSCK SPI clock frequency Master mode - - MHz
1.71 V ≤ VDD ≤ 3.6 V 66
SPI4, SPI5, SPI6
Slave receiver mode
1.71 V ≤ VDD ≤ 3.6 V 100
SPI1, SPI2, SPI3
Slave receiver mode
1.71 V ≤ VDD ≤ 3.6 V 66
SPI4, SPI5, SPI6
Slave mode transmitter/full duplex
38(2)
2.7 V ≤ VDD ≤ 3.6 V
Slave mode transmitter/full duplex
35(2)
1.71 V ≤ VDD ≤ 3.6 V
tsu(NSS) NSS setup time 2 - -
Slave mode
th(NSS) NSS hold time 1 - -
ns
tw(SCKH),
SCK high and low time Master mode Tpclk - 1 Tpclk Tpclk + 1
tw(SCKL)

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Table 98. SPI dynamic characteristics(1) (continued)

Symbol Parameter Conditions Min Typ Max Unit

tsu(MI) Master mode 1 - -

Data input setup time
tsu(SI) Slave mode 2 - -
th(MI) Master mode 3 - -
Data input hold time
th(SI) Slave mode 1 - -
ta(SO) Data output access time Slave mode 9 11 16
tdis(SO) Data output disable time Slave mode 3 5 7.5
Slave mode ns
- 11 13
2.7 V ≤ VDD ≤ 3.6 V
tv(SO)
Data output valid time Slave mode
- 11 14
1.71 V ≤ VDD ≤ 3.6 V
tv(MO) Master mode - 1.5 2.5
Slave mode
th(SO) 8 - -
Data output hold time 1.71 V ≤ VDD ≤ 3.6 V
th(MO) Master mode 1 - -
1. Guaranteed by characterization results.
2. Maximum frequency in slave transmitter mode is determined by the sum of tv(SO) and tsu(MI) which has to fit into SCK low or
high phase preceding the SCK sampling edge. This value can be achieved when the SPI communicates with a master
having tsu(MI) = 0 while Duty(SCK) = 50%.

Figure 46. SPI timing diagram - slave mode and CPHA = 0

NSS input

tc(SCK) th(NSS)

tsu(NSS) tw(SCKH) tr(SCK)

CPHA=0
SCK input

CPOL=0

CPHA=0
CPOL=1
ta(SO) tw(SCKL) tv(SO) th(SO) tf(SCK) tdis(SO)

MISO output First bit OUT Next bits OUT Last bit OUT

th(SI)
tsu(SI)

MOSI input First bit IN Next bits IN Last bit IN

MSv41658V1

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Figure 47. SPI timing diagram - slave mode and CPHA = 1(1)

NSS input

tc(SCK)

tsu(NSS) tw(SCKH) tf(SCK) th(NSS)

CPHA=1
SCK input

CPOL=0

CPHA=1
CPOL=1
ta(SO) tw(SCKL) tv(SO) th(SO) tr(SCK) tdis(SO)

MISO output First bit OUT Next bits OUT Last bit OUT

tsu(SI) th(SI)

MOSI input First bit IN Next bits IN Last bit IN

MSv41659V1

1. Measurement points are done at 0.5×VDD and with external CL = 30 pF.

Figure 48. SPI timing diagram - master mode(1)

High

NSS input

tc(SCK)
SCK Output

CPHA= 0
CPOL=0
CPHA= 0
CPOL=1
SCK Output

CPHA=1
CPOL=0
CPHA=1
CPOL=1

tw(SCKH) tr(SCK)
tsu(MI) tw(SCKL) tf(SCK)
MISO
INP UT MSB IN BIT6 IN LSB IN

th(MI)
MOSI
MSB OUT B I T1 OUT LSB OUT
OUTPUT
tv(MO) th(MO)
ai14136c

1. Measurement points are done at 0.5×VDD and with external CL = 30 pF.

I2S interface characteristics

Unless otherwise specified, the parameters given in Table 99 for the I2S interface are
derived from tests performed under the ambient temperature, fpclkx frequency and VDD

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supply voltage conditions summarized in Table 13: General operating conditions, with the
following configuration:
• Output speed is set to OSPEEDRy[1:0] = 10
• Capacitive load C = 30 pF
• Measurement points are done at CMOS levels: 0.5×VDD
• I/O compensation cell enabled
Refer to Section 6.3.17: I/O port characteristics for more details on the input/output alternate
function characteristics (CK, SD, WS).

Table 99. I2S dynamic characteristics(1)

Symbol Parameter Conditions Min Max Unit

fMCK I2S main clock output - 256×8K 256×Fs MHz

Master data - 64×Fs
fCK I2S clock frequency MHz
Slave data - 64×Fs
tv(WS) WS valid time Master mode - 6.5
th(WS) WS hold time Master mode 0.5 -
tsu(WS) WS setup time Slave mode 1 -
th(WS) WS hold time Slave mode 0 -
tsu(SD_MR) Master receiver 2 -
Data input setup time
tsu(SD_SR) Slave receiver 1.5 -
ns
th(SD_MR) Master receiver 2 -
Data input hold time
th(SD_SR) Slave receiver 0.5 -
tv(SD_ST) Slave transmitter (after enable edge) - 15
Data output valid time
tv(SD_MT) Master transmitter (after enable edge) - 1
th(SD_ST) Slave transmitter (after enable edge) 8.5 -
Data output hold time
th(SD_MT) Master transmitter (after enable edge) 0 -
1. Guaranteed by characterization results.

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Figure 49. I2S slave timing diagram (Philips protocol)(1)

1. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.

Figure 50. I2S master timing diagram (Philips protocol)(1)

1. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.

SAI characteristics
Unless otherwise specified, the parameters given in Table 100 for SAI are derived from tests
performed under the ambient temperature, Fpclk2 frequency and VDD supply voltage

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conditions summarized in Table 13: General operating conditions, with the following
configuration:
• Output speed is set to OSPEEDRy[1:0] = 10
• Capacitive load C = 30 pF
• Measurement points are performed at CMOS levels: 0.5×VDD
Refer to Section 6.3.17: I/O port characteristics for more details on the input/output alternate
function characteristics (SCK,SD,WS).

Table 100. SAI characteristics(1)

Symbol Parameter Conditions Min Max Unit

fMCK SAI Main clock output - - 50 MHz

Master transmitter
- 45
2.7 V ≤ VDD ≤ 3.6 V
Master transmitter
- 27
1.71 V ≤ VDD ≤ 3.6 V
Master receiver
- 27
SAI bit clock 1.71 V ≤ VDD ≤ 3.6 V
FCK MHz
frequency(2) Slave transmitter
- 45
2.7 V ≤ VDD ≤ 3.6 V
Slave transmitter
- 31
1.71 V ≤ VDD ≤ 3.6 V
Slave receiver
- 50
1.71 ≤ VDD ≤ 3.6 V
Master mode
- 11
2.7 V ≤ VDD ≤ 3.6 V
tv(FS) FS valid time
Master mode
- 18
1.71 V ≤ VDD ≤ 3.6 V
tsu(FS) FS setup time Slave mode 7 -
Master mode 2 - ns
th(FS) FS hold time
Slave mode 2.5 -
tsu(SD_A_MR) Master receiver 2 -
Data input setup time
tsu(SD_B_SR) Slave receiver 1.5 -
th(SD_A_MR) Master receiver 3 -
Data input hold time
th(SD_B_SR) Slave receiver 0.5 -

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Table 100. SAI characteristics(1) (continued)

Symbol Parameter Conditions Min Max Unit

Slave transmitter (after enable edge)

- 11
2.7 V ≤ VDD ≤ 3.6 V
tv(SD_B_ST) Data output valid time
Slave transmitter (after enable edge)
- 16
1.71 V ≤ VDD ≤ 3.6 V
th(SD_B_ST) Data output hold time Slave transmitter (after enable edge) 8.5 -
ns
Master transmitter (after enable edge)
- 10
2.7 V ≤ VDD ≤ 3.6 V
tv(SD_A_MT) Data output valid time
Master transmitter (after enable edge)
- 18
1.71 V ≤ VDD ≤ 3.6 V
th(SD_A_MT) Data output hold time Master transmitter (after enable edge) 7 -
1. Guaranteed by characterization results.
2. APB clock frequency must be at least twice SAI clock frequency.

Figure 51. SAI master timing waveforms

1/fSCK

SAI_SCK_X
th(FS)

SAI_FS_X
(output) tv(FS) tv(SD_MT) th(SD_MT)

SAI_SD_X
Slot n Slot n+2
(transmit)
tsu(SD_MR) th(SD_MR)

SAI_SD_X Slot n
(receive)
MS32771V1

Figure 52. SAI slave timing waveforms

SAI_SCK_X
tw(CKH_X) tw(CKL_X) th(FS)

SAI_FS_X
(input) tsu(FS) tv(SD_ST) th(SD_ST)

SAI_SD_X
Slot n Slot n+2
(transmit)
tsu(SD_SR) th(SD_SR)

SAI_SD_X Slot n
(receive)
MS32772V1

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MDIOS characteristics

Table 101. MDIOS timing parameters

Symbol Parameter Min Typ Max Unit

FMDC Management data clock - - 30 MHz

td(MDIOS) Management data input/output output valid time 6.5 8 19
tsu(MDIOS) Management data input/output setup time 1 - - ns
th(MDIOS) Management data input/output hold time 0.5 - -

The MDIOS controller is mapped on APB1 domain. The frequency of the APB bus should at
least 1.5 times the MDC frequency: Fpclk1 ≥ 1.5 * FMDC.

Figure 53. MDIOS timing diagram

TMDC

MDIOS_MDC

td(MDIOS)

MDIOS_MDIO(O)

tsu(MDIOS) th(MDIOS)

MDIOS_MDIO(I)

MSv50900V1

SD/SDIO MMC card host interface (SDMMC) characteristics

Unless otherwise specified, the parameters given in Table 102 for the SDIO/MMC interface
are derived from tests performed under the ambient temperature, Fhclk6 frequency and VDD
supply voltage conditions summarized in Table 13: General operating conditions, with the
following configuration:
• Output speed is set to OSPEEDRy[1:0] = 11
• Capacitive load C = 30 pF
• Measurement points are done at CMOS levels: 0.5×VDD
• I/O compensation cell enabled
• HSLV activated when VDD ≤ 2.7 V
• Delay block disabled
Refer to Section 6.3.17: I/O port characteristics for more details on the input/output
characteristics.

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Table 102. Dynamic characteristics: SD / MMC / e•MMC characteristics,

VDD = 2.7 V to 3.6 V(1)(2)
Symbol Parameter Conditions Min Typ Max Unit

fPP Clock frequency in data transfer mode - 0 - 130 MHz

- SDIO_CK/fpclk2 frequency ratio - - - 8/3 -
tW(CKL) Clock low time 8.5 9.5 -
fPP = 52 MHz ns
tW(CKH) Clock high time 8.5 9.5 -
CMD, D inputs (referenced to CK) in MMC and SD HS/SDR(3)/DDR(3) mode
tISU Input setup time HS 1.5 - -
tIH Input hold time HS - 1.5 - - ns
tIDW(4) Input valid window (variable window) 2.5 - -
(3)/DDR(3)
CMD, D outputs (referenced to CK) in MMC and SD HS/SDR mode
tOV Output valid time HS - 5 6.5
- ns
tOH Output hold time HS 2.5 - -
CMD, D inputs (referenced to CK) in SD default mode
tISUD Input setup time SD 1.5 - -
- ns
tIHD Input hold time SD 1.5 - -
CMD, D outputs (referenced to CK) in SD default mode
tOVD Output valid default time SD - 0.5 1.5
- ns
tOHD Output hold default time SD 0 - -
1. Guaranteed by characterization results.
2. Above 100 MHz, CL = 20 pF.
3. For SD 1.8 V support, an external voltage converter is required.
4. The minimum window of time where the data needs to be stable for proper sampling in tuning mode.

Table 103. Dynamic characteristics: SD / MMC / e•MMC characteristics

VDD = 1.71 V to 1.9 V(1)(2)
Symbol Parameter Conditions Min Typ Max Unit

fPP Clock frequency in data transfer mode - 0 - 105 MHz

- SDIO_CK/fpclk2 frequency ratio - - - 8/3 -
tW(CKL) Clock low time 8.5 9.5 -
fPP = 52 MHz ns
tW(CKH) Clock high time 8.5 9.5 -
CMD, D inputs (referenced to CK) in e•MMC mode
tISU Input setup time HS 1.5 - -
tIH Input hold time HS - 2.5 - - ns
tIDW(3) Input valid window (variable window) 3 - -
CMD, D outputs (referenced to CK) in e•MMC mode

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Table 103. Dynamic characteristics: SD / MMC / e•MMC characteristics

VDD = 1.71 V to 1.9 V(1)(2) (continued)
Symbol Parameter Conditions Min Typ Max Unit

tOV Output valid time HS - 5 6

- ns
tOH Output hold time HS 4 - -
1. Guaranteed by characterization results.
2. CL = 20 pF.
3. The minimum window of time where the data needs to be stable for proper sampling in tuning mode.

Figure 54. SDIO high-speed mode

Figure 55. SD default mode

CK
tOVD tOHD
D, CMD
(output)

ai14

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Figure 56. DDR mode

tr(CK) t(CK) tw(CKH) tw(CKL) tf(CK)

Clock
tvf(OUT) thr(OUT) tvr(OUT) thf(OUT)

Data output D0 D1 D2 D3 D4 D5

tsf(IN) thf(IN) tsr(IN) thr(IN)

Data input D0 D1 D2 D3 D4 D5
MSv63044V1

USB OTG_FS characteristics

The USB interface is fully compliant with the USB specification version 2.0 and is USB-IF
certified (for Full-speed device operation).

Table 104. USB OTG_FS electrical characteristics

Symbol Parameter Condition Min Typ Max Unit

USB transceiver operating

VDD33USB - 3.0(1) - 3.6 V
voltage
Embedded USB_DP pull-up
RPUI - 900 1250 1600
value during idle
Embedded USB_DP pull-up Ω
RPUR - 1400 2300 3200
value during reception
ZDRV Output driver impedance(2) Driver high and low 28 36 44
1. The USB functionality is ensured down to 2.7 V but not the full USB electrical characteristics which are degraded in the 2.7
to 3.0 V voltage range.
2. No external termination series resistors are required on USB_DP (D+) and USB_DM (D-); the matching impedance is
already included in the embedded driver.

Note: When VBUS sensing feature is enabled, a typical 200 μA input current (required to
determine the different sessions validity according to USB standard) can be observed.

Ethernet (ETH) characteristics

Unless otherwise specified, the parameters given in Table 105, Table 106, Table 107,
Table 108 and Table 109 for MDIO/SMA, RMII, GMII, RGMII and MII are derived from tests
performed under the ambient temperature, Faxiss_ck frequency summarized in Table 13:
General operating conditions, with the following configuration:
• Output speed is set to OSPEEDRy[1:0] = 10
• Capacitive load C = 20 pF
• Measurement points are done at CMOS levels: 0.5×VDD.
Refer to Section 6.3.17: I/O port characteristics for more details on the input/output
characteristics.
Table 105 gives the list of Ethernet MAC timings for the MDIO/SMA and Figure 57 shows
the corresponding timing diagram.

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Table 105. Dynamics characteristics: Ethernet MAC timings for MDIO/SMA(1)

Symbol Parameter Min Typ Max Unit

tMDC MDC cycle time(2.5 MHz) 399 400 401

Td(MDIO) Write data valid time 0.5 1 3
ns
tsu(MDIO) Read data setup time 13.5 - -
th(MDIO) Read data hold time 0 - -
1. Guaranteed by characterization results.

Figure 57. Ethernet MDIO/SMA timing diagram

tMDC

ETH_MDC

td(MDIO)

ETH_MDIO(O)

tsu(MDIO) th(MDIO)

ETH_MDIO(I)

MS31384V1

Table 106 gives the list of Ethernet MAC timings for the RMII and Figure 58 shows the
corresponding timing diagram.

Table 106. Dynamics characteristics: Ethernet MAC timings for RMII(1)

Symbol Parameter Min Typ Max Unit

tsu(RXD) Receive data setup time 2 - -

tih(RXD) Receive data hold time 1.5 - -
tsu(CRS) Carrier sense setup time 1.5 - -
ns
tih(CRS) Carrier sense hold time 1.5 - -
td(TXEN) Transmit enable valid delay time 5.5 6.5 9.5
td(TXD) Transmit data valid delay time 6 6.5 10
1. Guaranteed by characterization results.

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Figure 58. Ethernet RMII timing diagram

RMII_REF_CLK

td(TXEN)
td(TXD)

RMII_TX_EN
RMII_TXD[1:0]

tsu(RXD) tih(RXD)
tsu(CRS) tih(CRS)

RMII_RXD[1:0]
RMII_CRS_DV

ai15667b

Table 107 gives the list of Ethernet MAC timings for MII and Figure 59 shows the
corresponding timing diagram.

Table 107. Dynamics characteristics: Ethernet MAC timings for MII(1)

Symbol Parameter Min Typ Max Unit

tsu(RXD) Receive data setup time 2 - -

tih(RXD) Receive data hold time 1 - -
tsu(DV) Data valid setup time 1 - -
tih(DV) Data valid hold time 0.5 - -
ns
tsu(ER) Error setup time 1 - -
tih(ER) Error hold time 0.5 - -
td(TXEN) Transmit enable valid delay time 6 7.5 10.5
td(TXD) Transmit data valid delay time 7 8 11
1. Guaranteed by characterization results.

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Figure 59. Ethernet MII timing diagram

MII_RX_CLK

tsu(RXD) tih(RXD)
tsu(ER) tih(ER)
tsu(DV) tih(DV)
MII_RXD[3:0]
MII_RX_DV
MII_RX_ER

MII_TX_CLK

td(TXEN)
td(TXD)

MII_TX_EN
MII_TXD[3:0]

ai15668b

Table 108. Dynamics characteristics: Ethernet MAC signals for GMII (1)
Symbol Parameter Min Typ Max Unit

tsu(RXD) Receive data setup time 1 - -

tih(RXD) Receive data hold time 0.5 - -
tsu(DV) Data valid setup time 1 - -
tih(DV) Data valid hold time 0.5 - -
ns
tsu(ER) Error setup time 1 - -
tih(ER) Error hold time 0.5 - -
td(TXEN) Transmit enable valid delay time 1 1.5 2
td(TXD) Transmit data valid delay time 1 2 3
1. Guaranteed by characterization results.

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Figure 60. Ethernet GMII timing diagram

GMII_RX_CLK

tsu(RXD) tih(RXD)
tsu(ER) tih(ER)
tsu(DV) tih(DV)
GMII_RXD[7:0]
GMII_RX_DV
GMII_RX_ER

GTX_CLK
td(TXEN)
td(TXD)

GMII_TX_EN
GMII_TXD[7:0]
MSv50970V1

Table 109. Dynamics characteristics: Ethernet MAC signals for RGMII (1)
Symbol Rating Min Typ Max Unit

tsu(RXD) Receive data setup time 1.12(2) - -

(2)
tih(RXD) Receive data hold time 0.83 - -
tsu(RX_CTL) Receive control valid setup time 1.12(2) - -
ns
tih(RX_CTL) Receive control valid hold time 0.83(2) - -
TskewT(TX_CTL) Transmit control valid delay time -0.25 0.25 0.5
TskewT(TXD) Transmit data valid delay time -0.25 0.25 0.5
1. Guaranteed by characterization results.
2. Guaranteed by design.

Figure 61. Ethernet RGMII timing diagram

tskewT

RGMII_GTX_CLK

RGMII_TXD[3:0]
RGMII_TX_CTL

tsu tih

RGMII_RX_CLK

RGMII_RXD[3:0]
RGMII_RX_CTL
MSv50971V2

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6.3.37 USART interface characteristics

Unless otherwise specified, the parameters given in Table 110 for USART are derived from
tests performed under the ambient temperature, fHCLK frequency and VDD supply voltage
conditions summarized in Table 110, with the following configuration:
• Output speed is set to OSPEEDRy[1:0] = 10
• Capacitive load C = 30 pF
• Measurement points are done at CMOS levels: 0.5×VDD
Refer to Section 6.3.17: I/O port characteristics for more details on the input/output alternate
function characteristics (NSS, CK, TX, RX for USART).

Table 110. USART characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

Master mode
12.5
USART2,3,6
- -
fCK USART clock frequency Master mode MHz
16.5
USART1
Slave mode - - 27
tsu(NSS) NSS setup time Slave mode tker(2)+2 - - ns
th(NSS) NSS hold time Slave mode 2 - - ns
tw(CKH),
CK high and low time Master mode 1/fCK/2 - 1 1/fCK/2 1/fCK/2 + 1 ns
tw(CKL)
Master mode tker(2)+3 - -
tsu(RX) Data input setup time ns
Slave mode 2 - -
Master mode 1 - -
th(RX) Data input hold time ns
Slave mode 1 - -
Slave mode - 10 18
tv(TX) Data output valid time ns
Master mode - 0.5 1
Slave mode 8 - -
th(TX) Data output hold time ns
Master mode 0 - -
1. Guaranteed by characterization results.
2. Tker is the usart_ker_ck_pres clock period defined in the product reference manual.

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Figure 62. USART timing diagram in master mode

1/fCK

CK Output
CPHA=0
CPOL=0
CPHA=0
CK Output CPOL=1

CPHA=1
CPOL=0
CPHA=1
CPOL=1
tw(CKH)
tsu(RX) tw(CKL)
RX
INPUT MSB IN BIT6 IN LSB IN
th(RX)
TX
OUTPUT MSB OUT BIT1 OUT LSB OUT
tv(TX) th(TX)
MSv65386V4

Figure 63. USART timing diagram in slave mode

NSS
input
1/fCK th(NSS)
tsu(NSS) tw(CKH)
CPHA=0
CK input

CPOL=0

CPHA=0
CPOL=1
tw(CKL) tv(TX) th(TX)

TX output First bit OUT Next bits OUT Last bit OUT

th(RX)
tsu(RX)

RX input First bit IN Next bits IN Last bit IN

MSv65387V4

6.3.38 USB High-Speed PHY characteristics

Table 111. USB High-Speed PHY characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

RREF Reference resistor on USB_RREF pin - 2.97 3.00 3.03 kΩ

One USB port - 1.4 -
High-Speed TX(2)
Two USB ports - 2.4 -
IDDA1V1_REG(PHY) One USB port - 5.4 - mA
High-Speed RX(3) / Idle
Two USB ports - 10.4 -
Ful-Speed and Low-Speed mode (Suspend, TX or RX) - 0 -

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Table 111. USB High-Speed PHY characteristics(1) (continued)

Symbol Parameter Conditions Min Typ Max Unit

One USB port - 25.5 -

High-Speed TX(2)
Two USB ports - 50.5 -
IDDA1V8_REG(PHY) One USB port - 2.5 - mA
High-Speed RX(3) / Idle
Two USB ports - 5.5 -
Ful-Speed and Low-Speed mode (Suspend, TX or RX) - 0 -
One USB port - 5 -
High-Speed TX(2)
Two USB ports - 7 -
One USB port - 6 -
High-Speed RX(3) / Idle
Two USB ports - 10 -
One USB port - 0 -
Full-Speed Suspend (host mode)
Two USB ports - 0 -
One USB port - 0.2 -
Full-Speed Suspend (peripheral mode)
Two USB ports - 0.4 -
IDDA3V3_USBHS(PHY) mA
One USB port - 6.5 -
Full-Speed TX(2)
Two USB ports - 10.5 -
One USB port - 6.5 -
Full-Speed RX(3)
Two USB ports - 11.5 -
One USB port - 7 -
Low-Speed TX(2)
Two USB ports - 11.5 -
One USB port - 4.3 -
Low-Speed RX(3)
Two USB ports - 6.1 -
1. Guaranteed by design unless otherwise specified.
2. USB link 100% of the time in transmission
3. USB link 100% of the time in reception

6.3.39 JTAG/SWD interface characteristics

Unless otherwise specified, the parameters given in Table 112 and Table 113 for JTAG/SWD
are derived from tests performed under the ambient temperature, frcc_c_ck frequency and
VDD supply voltage summarized in Table 13: General operating conditions, with the
following configuration:
• Output speed is set to OSPEEDRy[1:0] = 0x10
• Capacitive load C = 30 pF
• Measurement points are done at CMOS levels: 0.5×VDD
Refer to Section 6.3.17: I/O port characteristics for more details on the input/output
characteristics.

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Table 112. Dynamics characteristics: JTAG characteristics

Symbol Parameter Conditions Min Typ Max Unit

Fpp TCK clock 2.7 V < VDD < 3.6 V - - 35

MHz
1/tc(TCK) frequency 1.71 V < VDD < 3.6 V - - 27
TMS input
tisu(TMS) - 2.5 - -
setup time
TMS input
tih(TMS) - 1 - -
hold time
TDI input
tisu(TDI) - 2 - -
setup time
TDI input ns
tih(TDI) - 1 - -
hold time

TDO output 2.7 V < VDD < 3.6 V - 8 14

tov (TDO)
valid time 1.71 V < VDD< 3.6 V - 8 18
TDO output
toh(TDO) - 7 - -
hold time

Table 113. Dynamics characteristics: SWD characteristics

Symbol Parameter Conditions Min Typ Max Unit

Fpp SWCLK 2.7 V < VDD < 3.6 V - - 71

clock MHz
1/tc(SWCLK) frequency 1.71 V < VDD < 3.6 V - - 55

SWDIO input
tisu(SWDIO) - 2.5 - -
setup time
SWDIO input
tih(SWDIO) - 1 - -
hold time
SWDIO 2.7 V < VDD < 3.6 V - 8.5 14 ns
tov (SWDIO) output valid
time 1.71 V < VDD < 3.6 V - 8.5 18

SWDIO
toh(SWDIO) output hold - 8 - -
time

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Figure 64. JTAG timing diagram

tc(TCK)

TCK

tsu(TMS/TDI) th(TMS/TDI)
tw(TCKL) tw(TCKH)
TDI/TMS

tov(TDO) toh(TDO)

TDO

MSv40458V1

Figure 65. SWD timing

tc(SWCLK)

SWCLK

tsu(SWDIO) th(SWDIO) twSWCLKL) tw(SWCLKH)

SWDIO
(receive)

tov(SWDIO) toh(SWDIO)

SWDIO
(transmit)

MSv40459V1

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Package information STM32MP151C/F

7 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.

7.1 TFBGA257 package information

This TFBGA is a 257 balls, 10x10 mm, 0.5/0.65 mm pitch, low profile fine pitch ball grid
array package

Figure 66. TFBGA257 - Outline

b (257 balls)
eee M C A B A1 ball pad corner
fff M C
Peripheral ball matrix pitch 0.5 mm
F2 D B
e1 18 16 14 12 10 8 6 4 2
19 17 15 13 11 9 7 5 3 1
A
B
Peripheral ball matrix pitch 0.5 mm

C
Central ball matrix pitch 0.65 mm

D
1A E
1B F
G
1C
H
1D J
E1 E2 e2 1E K E
1F L
M
1G N
1H P
1J R
T
F1 U
V
W
8 6 4 2 e1
F1 9 7 5 3 1

Central ball matrix pitch 0.65 mm

A
F2 e2
D2
D1
SEATING
PLANE BOTTOM VIEW TOP VIEW
C
ddd C

A2 A
A1
SIDE VIEW
B02Y_ME_V1

1. Drawing is not to scale.

2. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone

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Table 114. TFBGA257 - Mechanical data

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

A - - 1.200 - - 0.0472
(2)
A1 0.170 - - 0.007 - -
A2 - 0.810 - - 0.0319 -
(3)
b 0.250 0.300 0.350 0.010 0.012 0.0157
D 9.850 10.000 10.150 0.3878 0.3937 0.3996
D1 - 9.000 - - 0.3543 -
E 9.850 10.000 10.150 0.3878 0.3937 0.3996
E1 - 9.000 - - 0.3543 -
D2 - 5.200 - - 0.2047 -
E2 - 5.200 - - 0.2047 -
e1 - 0.500 - - 0.0197 -
e2 - 0.650 - - 0.0256 -
F1 - 0.500 - - 0.0197 -
F2 - 2.400 - - 0.0945 -
ddd - - 0.100 - - 0.0039
(4)
eee - - 0.150 - - 0.0059
(5)
fff - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. - The terminal A1 corner must be identified on the top surface by using a corner chamfer,
ink or metalized markings, or other feature of package body or integral heat slug.
- A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1
corner. Exact shape of each corner is optional.
3. Initial ball equal 0.300 mm.
4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone.
5. The tolerance of position that controls the location of the balls within the matrix with respect to each other.
For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position
as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each
tolerance zone fff in the array is contained entirely in the respective zone eee above The axis of each ball
must lie simultaneously in both tolerance zones.

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Package information STM32MP151C/F

Figure 67. TFBGA257 - Recommended footprint

Dpad

Dsm
B02Y_FP_V1

1. Dimensions are expressed in millimeters.

Table 115. TFBGA257 - Recommended PCB design rules (0.5/0.65 mm pitch, BGA)
Dimension Recommended values

Pitch 0.5/0.65 mm
Dpad 0.230 mm
Dsm 0.390 mm typ.
Stencil opening 0.230 mm
Stencil thickness 0.125 mm to 0.100 mm

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Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.

Figure 68. TFBGA257 marking (package top view)

Product
identification

STM32MP15x

xADxx
Revision

Y WW

MSv60330V1

1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples in
production. ST’s Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity.

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Package information STM32MP151C/F

7.2 LFBGA354 package information

This LFBGA is a 354 balls, 16x16 mm, 0.8 mm pitch, low profile fine pitch ball grid array
package

Figure 69. LFBGA354 - Outline

b (354 balls)
eee M C A B A1 ball pad corner
fff M C
18 16 14 12 10 8 6 4 2
e 19 17 15 13 11 9 7 5 3 1

C
D
E
F
G
H
J
D1 K D
L
M
N
P
R
T
F U
V
W

F
e
E1
A
B
E

SEATING
BOTTOM VIEW TOP VIEW
PLANE
C

ddd C

A2 A1 A
SIDE VIEW
B02Z_ME_V1

1. Drawing is not to scale.

2. The tolerance of position that controls the location of the balls within the matrix with respect to each other.
For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position
as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.
Each tolerance zone fff in the array is contained entirely in the respective zone eee above. The axis of each
ball must lie simultaneously in both tolerance zones.

Table 116. LFBGA354 - Mechanical data

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

A(2) - - 1.290 - - 0.0508

(3)
A1 0.250 - - 0.0098 - -
A2 - 0.900 - - 0.0354 -
b(4) 0.350 0.400 0.450 0.0138 0.0157 0.0177
D 15.850 16.000 16.150 0.6240 0.6299 0.6358

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Table 116. LFBGA354 - Mechanical data (continued)

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

D1 - 14.400 - - 0.5669 -
E 15.850 16.000 16.150 0.6240 0.6299 0.6358
E1 - 14.400 - - 0.5669 -
e - 0.800 - - 0.0315 -
F - 0.800 - - 0.0315 -
ddd - - 0.120 - - 0.0050
(5)
eee - - 0.150 - - 0.0059
fff(6) - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. LFBGA stands for Low profile Fine pitch Ball Grid Array package.
Low profile: 1.20mm < A ≤ 1.70mm / Fine pitch: e < 1.00mm pitch. The total profile height (Dim A) is
measured from the seating plane to the top of the component The maximum total package height is
calculated by the RSS method (Root Sum Square).
A Max = A1 Typ + A2 Typ + A4 Typ + √(A1² + A2² + A4² tolerance values).
3. The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metalized
markings, or other feature of package body or integral heat slug.
A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1
corner. Exact shape of each corner is optional.
4. Initial ball equal 0.400 mm.
5. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone.
6. The tolerance of position that controls the location of the balls within the matrix with respect to each other.
For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position
as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.
Each tolerance zone fff in the array is contained entirely in the respective zone eee above The axis of each
ball must lie simultaneously in both tolerance zones.

Figure 70. LFBGA354 - Recommended footprint

Dpad

Dsm
B02Z_FP_V1

1. Dimensions are expressed in millimeters.

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Table 117. LFBGA354 - Recommended PCB design rules (0.8 mm pitch, BGA)
Dimension Recommended values

Pitch 0.8 mm
Dpad 0.320 mm
Dsm 0.520 mm typ.
Stencil opening 0.320 mm
Stencil thickness 0.125 mm to 0.100 mm

Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.

Figure 71. LFBGA354 marking (package top view)

Product
identification

STM32MP15xxABx

Revision

Y WW

MSv60332V1

1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples in
production. ST’s Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity.

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7.3 TFBA361 package information

This TFBGA is a 361 ball, 12x12 mm, 0.5/0.65 mm pitch, thin profile fine pitch ball grid array
package.

Figure 72. TFBGA361 - Outline

eee M C A B
fff M C
b (361 balls)
A1 ball pad corner
Peripheral ball matrix pitch 0.5 mm

e1 22 20 18 16 14 12 10
23 21 19 17 15 13 11 9
8
7
6
5
4
3
2
1

A
B
C
D

Peripheral ball matrix pitch 0.5 mm

Central ball matrix pitch 0.65 mm

E
F
1A G
1B H
J
1C
K
1D L
E1 E2 e2 1E
1F
M
N E
P
1G R
1H T
1J U
V
W
Y
F2 AA
AB
AC

8 6 4 2
9 7 5 3 1
F1 F1 Central ball matrix pitch 0.65 mm e1 A
e2
B
D2
F2 D
D1
BOTTOM VIEW TOP VIEW
SEATING C
PLANE

ddd C

A2 A1 A
SIDE VIEW

B031_ME_V1

1. Drawing is not to scale.

2. The terminal A1 corner must be identified on the top surface by using a corner chamfer,
ink or metalized markings, or other feature of package body or integral heat slug.
A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1
corner. Exact shape of each corner is optional.

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Table 118. TFBGA361 - Mechanical data

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

A(2) - - 1.200 - - 0.0472

A1 0.150 - - 0.0059 - -
A2 - 0.810 - - 0.0319 -
(3)
b 0.250 0.300 0.350 0.010 0.012 0.0157
D 11.850 12.000 12.150 0.4665 0.4724 0.4783
D1 - 11.000 - - 0.4331 -
E 11.850 12.000 12.150 0.4665 0.4724 0.4783
E1 - 11.000 - - 0.4331 -
D2 - 5.200 - - 0.2047 -
E2 - 5.200 - - 0.2047 -
e1 - 0.500 - - 0.0197 -
e2 - 0.650 - - 0.0256 -
F1 - 0.500 - - 0.0197 -
F2 - 3.400 - - 0.1339 -
ddd - - 0.080 - - 0.0031
(4)
eee - - 0.150 - - 0.0059
(5)
fff - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. TFBGA stands for Thin Profile Fine Pitch Ball Grid Array. The total profile height (dim A) is measured from
the seating plane to the top of the component.
3. Initial ball equal to 0.300 mm.
4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone.
5. The tolerance of position that controls the location of the balls within the matrix with respect to each other.
For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position
as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each
tolerance zone fff in the array is contained entirely in the respective zone eee above The axis of each ball
must lie simultaneously in both tolerance zones.

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Figure 73. TFBGA361 - Recommended footprint

Dpad

Dsm
B031_FP_V2

Table 119. TFBGA361 - Recommended PCB design rules (0.5/0.65 mm pitch BGA)
Dimension Recommended values

Pitch 0.5/0.65 mm
Dpad 0.230 mm
Dsm 0.390 mm typ.
Stencil opening 0.230 mm
Stencil thickness 0.125 mm to 0.100 mm

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Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.

Figure 74. TFBGA361 marking (package top view)

Product
identification

STM32MP15x

xACxx
Revision

Y WW

MSv60331V1

1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples in
production. ST’s Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity.

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7.4 LFBGA448 package information

This LFBGA is a 448 balls, 18x18 mm, 0.8 mm pitch, low profile fine pitch ball grid array
package.

Figure 75. LFBGA448 - Outline

eee C A B
A1 corner index area
fff C B
b (448 Balls) A
E
22 20 18 16 14 12 10 8 6 4 2
21 19 17 15 13 11 9 7 5 3 1
e
A
B
C
D
E
F
G
H
J
K D
D1 L
M
N
P
R
T
U
V
W
Y
AA
AB

F F e
E1

BOTTOM VIEW TOP VIEW

ddd C

A SEATING
C PLANE

A4 A3
A1
SIDE VIEW
B032_LFBGA448_ME_V1

1. Drawing is not to scale.

2. The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metalized
markings, or other feature of package body or integral heat slug.
A distinguishing feature is allowed on the surface of the package to identify the terminal A1 corner.The
exact shape and size of this feature are optional.

Table 120. LFBGA448 - Mechanical data

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

A(2) - - 1.320 - - 0.0520

A1 0.210 0.290 - 0.0083 0.0114 -
A3 - 0.400 - - 0.0157 -
A4 - - 0.650 - - 0.0256
(3)
b 0.350 0.400 0.450 0.0138 0.0157 0.0177
D 17.850 18.000 18.150 0.7028 0.7087 0.7146

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Table 120. LFBGA448 - Mechanical data (continued)

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

D1 - 16.800 - - 0.6614 -
E 17.850 18.000 18.150 0.7028 0.7087 0.7146
E1 - 16.800 - - 0.6614 -
e - 0.800 - - 0.0315 -
F - 0.600 - - 0.0236 -
ddd 0.120 0.0047
(4)
eee 0.150 0.0059
fff(5) 0.080 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Low profile: 1.20 mm < A ≤ 1.70 mm / Fine pitch: e < 1.00 mm pitch.
The total profile height (Dim.A) is measured from the seating plane “C” to the top of the component. The
maximum total package height is calculated by the RSS method (Root Sum Square).
A Max = A1 Typ + A3 Typ + A4 Typ + √(A1² + A3² + A4² tolerance values).
3. The typical ball diameter before mounting is 0.40 mm
4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone.
5. The tolerance of position that controls the location of the balls within the matrix with respect to each other.
For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position
as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each
tolerance zone fff in the array is contained entirely in the respective zone eee above.
The axis of each ball must lie simultaneously in both tolerance zones.

Figure 76. LFBGA448 - Recommended footprint

Dpad

Dsm
BGA_WLCSP_FT_V1

Table 121. LFBGA448 - Recommended PCB design rules (0.8 mm pitch, BGA)
Dimension Recommended values

Pitch 0.8 mm
Dpad 0.320 mm

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Table 121. LFBGA448 - Recommended PCB design rules (0.8 mm pitch, BGA)
Dimension Recommended values

Dsm 0.520 mm typ.

Stencil opening 0.320 mm
Stencil thickness 0.125 mm to 0.100 mm

Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.

Figure 77. LFBGA448 marking (package top view)

Product
identification

STM32MP15xxAAx

Revision

Y WW

MSv60333V1

1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples in
production. ST’s Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity.

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7.5 Thermal characteristics

Package thermal characteristics in Table 122 are specified with conditions as per JEDEC
JESD51-6, JESD51-8, JESD51-9, and JESD51-12. These typical values will vary in function
of board thermal characteristics and other components on the board.
ΘJA : Thermal resistance junction-ambient.
ΘJB: Thermal resistance junction-board.
ΘJC: Thermal resistance junction-top-case.
Θjb: Thermal parameter junction-board.
Ψjt: Thermal parameter junction-top-case.
Motherboard type: four layers, JEDEC 2S2P

Table 122. Thermal characteristics

Value
Symbol Parameter Unit
Natural convection 1m/s (200 ft/mn)

TFBGA257 - 257-ball 10x10 mm 0.50/0.65 mm pitch 36.079 31.79

TFBGA361 - 361-ball 12x12 mm 0.50/0.65 mm pitch 35.151 30.953
ΘJA(1) °C/W
LFBGA354 - 354-ball 16x16 mm 0.80 mm pitch 34.145 30.121
LFBGA448 - 448-ball 18x18 mm 0.80 mm pitch 28.545 24.797
TFBGA257 - 257-ball 10x10 mm 0.50/0.65 mm pitch 19.487
TFBGA361 - 361-ball 12x12 mm 0.50/0.65 mm pitch 20.555
ΘJB(2) °C/W
LFBGA354 - 354-ball 16x16 mm 0.80 mm pitch 22.038
LFBGA448 - 448-ball 18x18 mm 0.80 mm pitch 17.409
TFBGA257 - 257-ball 10x10 mm 0.50/0.65 mm pitch 10.768
TFBGA361 - 361-ball 12x12 mm 0.50/0.65 mm pitch 10.049
ΘJC(3) °C/W
LFBGA354 - 354-ball 16x16 mm 0.80 mm pitch 9.675
TLFBGA448 - 448-ball 18x18 mm 0.80 mm pitch 8.439
TFBGA257 - 257-ball 10x10 mm 0.50/0.65 mm pitch 18.949 18.332
TFBGA361 - 361-ball 12x12 mm 0.50/0.65 mm pitch 20.002 19.398
Ψjb (4) °C/W
LFBGA354 - 354-ball 16x16 mm 0.80 mm pitch 21.456 20.894
LFBGA448 - 448-ball 18x18 mm 0.80 mm pitch 16.946 16.574
TFBGA257 - 257-ball 10x10 mm 0.50/0.65 mm pitch 0.383 0.812
TFBGA361 - 361-ball 12x12 mm 0.50/0.65 mm pitch 0.354 0.735
Ψjt (5) °C/W
LFBGA354 - 354-ball 16x16 mm 0.80 mm pitch 0.339 0.658
LFBGA448 - 448-ball 18x18 mm 0.80 mm pitch 0.297 0.542
1. Per JEDEC JESD51-9
2. Per JEDEC JESD51-8
3. Per JEDEC JESD51-12 best practice guidelines
4. Per JEDEC JESD51-12.
5. Per JEDEC JESD51-12.

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7.5.1 Reference documents

JESD51-6 Integrated Circuit Thermal Test Method Environmental Conditions - Forced
Convection (Moving Air). Available from www.jedec.org.
JESD51-8 Integrated Circuit Thermal Test Method Environmental Conditions —Junction-to-
Board. Available from www.jedec.org.
JESD51-9 Test Boards for Area Array Surface. Mount Package Thermal. Measurements.
Available from www.jedec.org.
JESD51-12 Guidelines for Reporting and Using Electronic Package Thermal Information.
Available from www.jedec.org.

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Ordering information STM32MP151C/F

8 Ordering information

Table 123. STM32MP151C/F ordering information scheme

Example: STM32 MP 151 F AA 1 T

Device family
STM32 = Arm-based 32-bit processor

Product type
MP = MPU product

Device subfamily
151 = STM32MP151 Line

Security option
C = Secure boot, cryptography hardware, 650 MHz
F = Secure boot, cryptography hardware, 800 MHz

Package and pin count

AD = TFBGA257 10x10, 257 balls pitch 0.5 mm
AB = LFBGA354 16x16, 354 balls pitch 0.8 mm
AC = TFBGA361 12x12, 361 balls pitch 0.5 mm
AA = LFBGA448 18x18, 448 balls pitch 0.8 mm

Junction temperature range

1 = -20 °C < TJ < +105 °C, up to 800 MHz Cortex®-A7(1)
3 = -40 °C < TJ < +125 °C, up to 650 MHz Cortex®-A7(1)

Options
Blank = no options

Packing
T = tape and reel
No character = tray or tube
1. Refer also to the application note AN5438 “STM32MP1 Series lifetime estimates” available from the ST
website www.st.com.

For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST sales office.

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9 Revision history

Table 124. Document revision history

Date Revision Changes

08-Feb-2019 1 Initial release.

Updated ADC characteristics on cover page.
Updated Table 1: STM32MP151C/F features and
peripheral counts
Updated Section 3.7.1: Power supply scheme.
Updated Table 7: STM32MP151C/F pin and ball
definitions.
Updated Table 8: Alternate function AF0 to AF7.
Updated Table 10: Voltage characteristics.
Updated Table 13: General operating conditions.
Updated Table 14: Operating conditions at power-up /
power-down.
Updated Table 15: Embedded reset and power control
block characteristics.
Updated Figure 13: VDDCORE rise time from reset.
Updated Table 15: Embedded reset and power control
block characteristics.
Updated Table 16: Embedded reference voltage.
Updated Table 18: REG1V1 embedded regulator
(USB_PHY) characteristics.
Updated Table 19: REG1V8 embedded regulator (USB)
characteristics.
01-Aug-2019 2 Updated Table 20: Current consumption (IDDCORE) in
Run mode.
Updated Table 21: Current consumption (IDD) in Run
mode.
Updated Table 22: Current consumption in Stop mode.
Updated Table 23: Current consumption in LPLV-Stop
mode.
Updated Table 25: Current consumption in VBAT mode.
Updated Table 28: High-speed external user clock
characteristics (digital bypass).
Updated Table 29: High-speed external user clock
characteristics (analog bypass).
Added Table 30: Low-speed external user clock
characteristics (analog bypass).
Added Figure 17: Low-speed external clock source AC
timing diagram (analog bypass).
Updated Table 32: 8-48 MHz HSE oscillator
characteristics.
Updated Figure 19: Typical application with a 24 MHz
crystal.
Updated Figure 20: Typical application with a
32.768 kHz crystal.

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Revision history STM32MP151C/F

Table 124. Document revision history

Date Revision Changes

Updated Table 35: HSI oscillator characteristics.

Updated Table 36: CSI oscillator characteristics.
Updated Table 37: LSI oscillator characteristics.
Updated Table 38: PLL1_1600, PLL2_1600
characteristics.
Updated Table 35: HSI oscillator characteristics.
Updated Table 36: CSI oscillator characteristics.
Updated Table 37: LSI oscillator characteristics.
Updated Table 38: PLL1_1600, PLL2_1600
characteristics.
Updated Table 39: PLL3_800, PLL4_800
characteristics.
Updated Table 40: USB_PLL characteristics.
Updated Table 46: EMI characteristics.
Updated Table 47: ESD absolute maximum ratings.
Updated Section : Static latchup
Updated Table 49: I/O current injection susceptibility.
Updated Table 50: I/O static characteristics.
2 Updated Table 51: Output voltage characteristics for all
01-Aug-2019 I/Os except PC13, PC14, PC15 and PI8.
(continued)
Added Table 52: Output voltage characteristics for
PC13, PC14, PC15 and PI8.
Updated Table 53: Output timing characteristics (HSLV
OFF).
Added Figure 23: VIL/VIH for FT I/Os.
Updated Table 74: ADC characteristics.
Updated Table 75: Minimum sampling time versus RAIN
with 47 pF PCB capacitor up to 125 °C and VDDA =
1.6 V.
Updated Table 78: DAC characteristics.
Updated Table 83: DTS characteristics.
Updated Table 84: VBAT ADC monitoring characteristics.
Updated Table 86: Temperature and VBAT monitoring
characteristics for temper detection.
Added Section 6.3.31: Compensation cell.
Updated Table 96: I2C analog filter characteristics.
Added Section 6.3.38: USB High-Speed PHY
characteristics.
Added Section 7.5: Thermal characteristics.
Introduced STM32MP151F corresponding to the
800 MHz upgrade of the microprocessor, in all the
document.
04-Feb-2020 3 Updated Table 1: STM32MP151C/F features and
peripheral counts.
Updated Figure 1: STM32MP151C/F block diagram.
Updated Table 4: Timer feature comparison.

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Table 124. Document revision history

Date Revision Changes

Updated Table 7: STM32MP151C/F pin and ball

definitions.
Updated Table 8: Alternate function AF0 to AF7.
Updated Table 9: Alternate function AF8 to AF15.
Updated Table 10: Voltage characteristics.
Updated Table 12: Thermal characteristics.
Updated Table 13: General operating conditions.
Updated Table 20: Current consumption (IDDCORE) in
Run mode.
Updated Table 38: PLL1_1600, PLL2_1600
characteristics.
Updated Section 6.3.12: PLL spread spectrum clock
generation (SSCG) characteristics.
Updated Table 45: EMS characteristics.
3 Updated Table 46: EMI characteristics.
04-Feb-2020
(continued) Updated Table 74: ADC characteristics.
Updated Table 78: DAC characteristics.
Updated Table 79: DAC accuracy.
Updated Table 80: VREFBUF characteristics.
Updated Table 109: Dynamics characteristics: Ethernet
MAC signals for RGMII.
Updated Figure 61: Ethernet RGMII timing diagram.
Updated Table 111: USB High-Speed PHY
characteristics.
Updated Table 112: Dynamics characteristics: JTAG
characteristics.
Updated Table 113: Dynamics characteristics: SWD
characteristics.
Updated Table 123: STM32MP151C/F ordering
information scheme.
Updated Table 1: STM32MP151C/F features and
peripheral counts.
Updated Table 4: Timer feature comparison.
Updated Table 6: Legend/abbreviations used in the
pinout table.
Updated Table 7: STM32MP151C/F pin and ball
08-Sep-2020 4
definitions.
Updated Table 10: Voltage characteristics.
Updated Table 13: General operating conditions.
Updated Table 26: Low-power mode wakeup timings.
Updated Section : Output buffer timing characteristics
(IO structure with _vh, HSLV option enabled).

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Revision history STM32MP151C/F

Table 124. Document revision history

Date Revision Changes

Updated Table 55: Output timing characteristics (HSLV

ON, _vh IO structure).
Added Note to Section : USB OTG_FS characteristics.
Updated Section 7.1: TFBGA257 package information.
Added Note to Figure 66: TFBGA257 - Outline.
Updated Table 114: TFBGA257 - Mechanical data.
Updated Section 7.2: LFBGA354 package information.
4 Updated Table 116: LFBGA354 - Mechanical data.
08-Sep-2020
(continued) Updated Section 7.3: TFBA361 package information.
Updated Table 118: TFBGA361 - Mechanical data.
Updated Section 7.4: LFBGA448 package information.
Added Note for Figure 75: LFBGA448 - Outline..
Updated Table 120: LFBGA448 - Mechanical data.
Updated Table 121: LFBGA448 - Recommended PCB
design rules (0.8 mm pitch, BGA).
Updated Section 8: Ordering information.
Updated Graphics on cover page.
Updated LCD-TFT and DSI in Table 1:
15-Dec-2020 5
STM32MP151C/F features and peripheral counts.
Updated Table 3.29: LCD-TFT display controller (LTDC).
Added patented technology information on cover page.
Added reference to Errata Sheet in Section 1:
Introduction.
Updated Section 3.30: True random number generator
(RNG1, RNG2).
Updated DuCyCKOUT in Table 90: DFSDM measured
17-May-2021 6 timing.
Updated Table 110: USART characteristics.
Updated Figure 62: USART timing diagram in master
mode.
Updated junction temperature range related information
in Table 123: STM32MP151C/F ordering information
scheme.

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