DCDC L4962
DCDC L4962
DESCRIPTION
The L4962 is a monolithic power switching regula- The L4962 is mounted in a 16-lead Powerdip plastic
tor delivering 1.5A at a voltage variable from 5V to package and Heptawatt package and requires very
40V in step down configuration. few external components.
Features of the device include current limiting, soft Efficient operation at switching frequencies up to
start, thermal protection and 0 to 100% duty cycle 150KHz allows a reduction in the size and cost of
for continuous operating mode. external filter components.
BLOCK DIAGRAM
Pin X = Powerdip
Pin (X) = Heptawatt
V7 Input voltage 50 V
V7 - V2 Input to output voltage difference 50 V
V2 Negative output DC voltage -1 V
Output peak voltage at t = 0.1µs; f = 100KHz -5 V
V11, V15 Voltage at pin 11, 15 5.5 V
V10 Voltage at pin 10 7 V
I11 Pin 11 sink current 1 mA
I14 Pin 14 source current 20 mA
Power dissipation at Tpins ≤ 90°C (Powerdip) 4.3 W
Ptot
Tcase ≤ 90°C (Heptawatt) 15 W
Tj, Tstg Junction and storage temperature -40 to 150 °C
THERMAL DATA
Symbol Parameter Heptawatt Powerdip
Rth j-case Thermal resistance junction-case max 4°C/W -
Rth j-pins Thermal resistance junction-pins max - 14°C/W
Rth j-amb Thermal resistance junction-ambient max 50°C/W 80°C/W*
* Obtained with the GND pins soldered to printed circuit with minimized copper area.
PIN FUNCTIONS
2 10 FEEDBACK INPUT The feedback terminal of the regulation loop. The output
is connected directly to this terminal for 5.1V operation;
it is connected via a divider for higher voltages.
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L4962
1, 3, 6, N.C.
8, 9, 16
ELECTRICAL CHARACTERISTICS (Refer to the test circuit, Tj = 25 °C, Vi = 35V, unless otherwise
specified)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICS
Vo Output voltage range Vi = 46V Io = 1A Vref 40 V
Io = 1A Vo = 12V 80 %
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L4962
DC CHARACTERISTICS
I7Q Quiescent drain current 100% duty cycle 30 40 mA
pins 2 and 14 open
Vi = 46V
0% duty cycle 15 20 mA
SOFT START
I15SO Source current 100 140 180 µA
ERROR AMPLIFIER
V11H High level output voltage V10 = 4.7V I11 = 100µA 3.5 V
V11L Low level output voltage V10 = 5.3V I11 = 100µA 0.5 V
OSCILLATOR
-I14 Oscillator source current 5 mA
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Figure 10. Open loop fre- Figure 11. Switching fre- Figure 12. Switching fre-
quency and phase re- sponse quency vs. input voltage quency vs. junction tem-
of error amplifier perature
Figure 13. Switching fre- Figure 14. Line transient Figure 15. Load transient
quency vs. R2 (see test circuit) response response
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L4962
Figure 16. Supply voltage Figure 17. Dropout voltage Figure 18. Dropout voltage
ripple rejection vs. frequency between pin 7 and pin 2 vs. between pin 7 and 2 vs.
current at pin 2 junction temperature
Fig ure 19. Effi ciency vs. Fi gure 20. Effici ency vs. Fi gure 21 . Effi ciency vs.
output current output current output current
F igu re 22. Effi ciency vs. Fi gure 23. Effici ency vs. Figure 24. Maximum allow-
output voltage output voltage able power dissipation vs. am-
bient temperature (Powerdip)
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L4962
APPLICATION INFORMATION
Figure 26. P.C. board and component layout of the circuit of Fig. 25 (1 : 1 scale)
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L4962
Figure 27. - A minimal 5.1V fixed regulator; Very few component are required
Vo = 5.1V to 15V
Io = 1.5A max
Load regulation (0.5A to 1.5A) = 10mV (Vo = 5.1V)
Line regulation (220V ± 15% and to Io = 1A) = 15mV (Vo = 5.1V)
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L4962
Figure 29. DC-DC converter 5.1V/4A, ± 12V/1A. A suggestion how to synchronize a negative output
Figure 30. In multiple supplies several Figure 31. Preregulator for distributed supplies
L4962s can be synchronized as shown
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L4962
MOUNTING INSTRUCTION
The Rth-j-amb of the L4962 can be reduced by soldering the pins temperature must not exceed
soldering the GND pins to a suitable copper area of 260°C and the soldering time must not be longer
the printed circuit board (Fig. 32). than 12 seconds.
The diagram of figure 33 shows the Rth-j-amb as a The external heatsink or printed circuit copper are
function of the side "l" of two equal square copper must be connected to electrical ground.
areas having the thickness of 35µ (1.4 mils). During
Figure 32. Example of P.C. board copper area which is used Figure 33. Maximum dissipable
as heatsink power and junction to ambient
thermal resistance vs. side "l"
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L4962
mm inch
DIM. OUTLINE AND
MIN. TYP. MAX. MIN. TYP. MAX. MECHANICAL DATA
a1 0.51 0.020
b 0.50 0.020
D 20.0 0.787
E 8.80 0.346
e 2.54 0.100
e3 17.78 0.700
F 7.10 0.280
I 5.10 0.201
L 3.30 0.130
Powerdip 16
Z 1.27 0.050
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L4962
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX. OUTLINE AND
A 4.8 0.189 MECHANICAL DATA
C 1.37 0.054
D 2.4 2.8 0.094 0.110
D1 1.2 1.35 0.047 0.053
E 0.35 0.55 0.014 0.022
E1 0.7 0.97 0.028 0.038
F 0.6 0.8 0.024 0.031
F1 0.9 0.035
G 2.34 2.54 2.74 0.095 0.100 0.105
G1 4.88 5.08 5.28 0.193 0.200 0.205
G2 7.42 7.62 7.82 0.295 0.300 0.307
H2 10.4 0.409
H3 10.05 10.4 0.396 0.409
L 16.7 16.9 17.1 0.657 0.668 0.673
L1 14.92 0.587
L2 21.24 21.54 21.84 0.386 0.848 0.860
L3 22.27 22.52 22.77 0.877 0.891 0.896
L4 1.29 0.051
L5 2.6 2.8 3 0.102 0.110 0.118
L6 15.1 15.5 15.8 0.594 0.610 0.622
L7 6 6.35 6.6 0.236 0.250 0.260
L9 0.2 0.008
M 2.55 2.8 3.05 0.100 0.110 0.120
M1 4.83 5.08 5.33 0.190 0.200 0.210 Heptawatt V
V4 40˚ (typ.)
Dia 3.65 3.85 0.144 0.152
L V V
E
L1
M1
A M
C D
D1
L2 H2
L5 L3 F
E1
E
V4
L9
H3 H1 G G1 G2
Dia.
F
L7 L4 H2 F1
L6
HEPTAMEC
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mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX. OUTLINE AND
A 4.8 0.189 MECHANICAL DATA
C 1.37 0.054
D 2.4 2.8 0.094 0.110
D1 1.2 1.35 0.047 0.053
E 0.35 0.55 0.014 0.022
F 0.6 0.8 0.024 0.031
F1 0.9 0.035
G 2.41 2.54 2.67 0.095 0.100 0.105
G1 4.91 5.08 5.21 0.193 0.200 0.205
G2 7.49 7.62 7.8 0.295 0.300 0.307
H2 10.4 0.409
H3 10.05 10.4 0.396 0.409
L 14.2 0.559
L1 4.4 0.173
L2 15.8 0.622
L3 5.1 0.201
L5 2.6 3 0.102 0.118
L6 15.1 15.8 0.594 0.622
L7 6 6.6 0.236 0.260
L9 4.44 0.175 Heptawatt H
Dia 3.65 3.85 0.144 0.152
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L4962
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