OPA

27
OPA27
OPA
27
OPA37

SBOS135C – JANUARY 1984 – REVISED AUGUST 2005

Ultra-Low Noise, Precision

OPERATIONAL AMPLIFIERS

FEATURES DESCRIPTION
● LOW NOISE: 4.5nV/√Hz max at 1kHz The OPA27 and OPA37 are ultra-low noise, high-precision
● LOW OFFSET: 100µV max monolithic operational amplifiers.

● LOW DRIFT: 0.4µV/°C Laser-trimmed thin-film resistors provide excellent long-term

voltage offset stability and allow superior voltage offset
● HIGH OPEN-LOOP GAIN: 117dB min
compared to common zener-zap techniques.
● HIGH COMMON-MODE REJECTION: 100dB min
A unique bias current cancellation circuit allows bias and
● HIGH POWER-SUPPLY REJECTION: 94dB min offset current specifications to be met over the full –40°C to
● FITS OP-07, OP-05, AD510, AND AD517 +85°C temperature range.
SOCKETS The OPA27 is internally compensated for unity-gain stability.
The decompensated OPA37 requires a closed-loop gain ≥ 5.
APPLICATIONS The Texas Instruments’ OPA27 and OPA37 are improved
● PRECISION INSTRUMENTATION replacements for the industry-standard OP-27 and OP-37.

● DATA ACQUISITION
● TEST EQUIPMENT
7
● PROFESSIONAL AUDIO EQUIPMENT +VCC
● TRANSDUCER AMPLIFIERS
● RADIATION HARD EQUIPMENT
8
Trim
1
Trim

6
Output

2
–In
3
+In

4
–VCC

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Copyright © 1984-2005, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

www.ti.com
ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC
Supply Voltage ................................................................................... ±22V
Internal Power Dissipation (2) ....................................................... 500mW DISCHARGE SENSITIVITY
Input Voltage ..................................................................................... ±VCC
Output Short-Circuit Duration (3) ................................................. Indefinite This integrated circuit can be damaged by ESD. Texas Instru-
Differential Input Voltage (4) ............................................................. ±0.7V ments recommends that all integrated circuits be handled with
Differential Input Current (4) ........................................................... ±25mA
appropriate precautions. Failure to observe proper handling
Storage Temperature Range .......................................... –55°C to +125°C
Operating Temperature Range ......................................... –40°C to +85°C and installation procedures can cause damage.
Lead Temperature:
ESD damage can range from subtle performance degradation
P (soldering, 10s) ....................................................................... +300°C
U (soldering, 3s) ......................................................................... +260°C to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade changes could cause the device not to meet its published
device reliability. (2) Maximum package power dissipation versus ambient specifications.
temperature. (2) To common with ±VCC = 15V. (4) The inputs are protected by
back-to-back diodes. Current limiting resistors are not used in order to achieve
low noise. If differential input voltage exceeds ±0.7V, the input current should PIN CONFIGURATION
be limited to 25mA.
Top View

PACKAGE/ORDERING INFORMATION(1)
PACKAGE PACKAGE Offset Trim 1 8 Offset Trim
PRODUCT PACKAGE-LEAD θJA DRAWING MARKING
–In 2 7 +VCC
OPA27 DIP-8 100°C/W P OPA27GP
OPA27 SO-8 160°C/W D OPA27U +In 3 6 Output
OPA37 DIP-8 100°C/W P OPA37GP –VCC 4 5 NC
OPA37 SO-8 160°C/W D OPA37U

NOTE: (1) For the most current package and ordering information, see the NC = No Connection
Package Option Addendum located at the end of this document, or see the TI
website at www.ti.com.

2
OPA27, OPA37
www.ti.com SBOS135C
ELECTRICAL CHARACTERISTICS
At VCC = ±15V and TA = +25°C, unless otherwise noted.

OPA27
OPA37

PARAMETER CONDITIONS MIN TYP MAX UNITS

INPUT NOISE (6)
Voltage, fO = 10Hz 3.8 8.0 nV/√Hz
fO = 30Hz 3.3 5.6 nV/√Hz
fO = 1kHz 3.2 4.5 nV/√Hz
fB = 0.1Hz to 10Hz 0.09 0.25 µVPP
Current,(1) fO = 10Hz 1.7 pA/√Hz
fO = 30Hz 1.0 pA/√Hz
fO = 1kHz 0.4 0.6 pA/√Hz

OFFSET VOLTAGE (2)

Input Offset Voltage ±25 ±100 µV
Average Drift (3) TA MIN to TA MAX ±0.4 ±1.8 (6) µV/°C
Long Term Stability (4) 0.4 2.0 µV/mo

Supply Rejection ±VCC = 4 to 18V 94 120 dB

±VCC = 4 to 18V ±1 ±20 µV/V
BIAS CURRENT
Input Bias Current ±15 ±80 nA
OFFSET CURRENT
Input Offset Current 10 75 nA
IMPEDANCE
Common-Mode 2 || 2.5 GΩ || pF
VOLTAGE RANGE
Common-Mode Input Range ±11 ±12.3 V
Common-Mode Rejection VIN = ±11VDC 100 122 dB
OPEN-LOOP VOLTAGE GAIN, DC RL ≥ 2kΩ 117 124 dB
RL ≥ 1kΩ 124 dB
FREQUENCY RESPONSE
Gain-Bandwidth Product (5) OPA27 5 (6) 8 MHz
OPA37 45 (6) 63 MHz
Slew Rate (5) VO = ±10V,
RL = 2kΩ
OPA27, G = +1 1.7 (6) 1.9 V/µs
OPA37, G = +5 11(6) 11.9 V/µs
Settling Time, 0.01% OPA27, G = +1 25 µs
OPA37, G = +5 25 µs
RATED OUTPUT
Voltage Output RL ≥ 2kΩ ±12 ±13.8 V
RL ≥ 600Ω ±10 ±12.8 V
Output Resistance DC, Open Loop 70 Ω
Short Circuit Current RL = 0Ω 25 60(6) mA
POWER SUPPLY
Rated Voltage ±15 VDC
Voltage Range,
Derated Performance ±4 ±22 VDC
Current, Quiescent IO = 0mADC 3.3 5.7 mA
TEMPERATURE RANGE
Specification –40 +85 °C
Operating –40 +85 °C

NOTES: (1) Measured with industry-standard noise test circuit (Figures 1 and 2). Due to errors introduced by this method, these current noise specifications should
be used for comparison purposes only. (2) Offset voltage specification are measured with automatic test equipment after approximately 0.5 seconds from power turn-
on. (3) Unnulled or nulled with 8kΩ to 20kΩ potentiometer. (4) Long-term voltage offset vs time trend line does not include warm-up drift. (5) Typical specification only
on plastic package units. Slew rate varies on all units due to differing test methods. Minimum specification applies to open-loop test. (6) This parameter specified by
design.

OPA27, OPA37 3
SBOS135C www.ti.com
ELECTRICAL CHARACTERISTICS (Cont.)
At VCC = ±15V and –40°C ≤ TA ≤ +85°C, unless otherwise noted.

OPA27
OPA37

PARAMETER CONDITIONS MIN TYP MAX UNITS

INPUT VOLTAGE (1)

Input Offset Voltage ±48 ±220(3) µV
Average Drift (2) TA MIN to TA MAX ±0.4 ±1.8 (3) µV/°C
Supply Rejection ±VCC = 4.5 to 18V
±VCC = 4.5 to 18V 90 (3) 122 dB
BIAS CURRENT
Input Bias Current ±21 ±150 (3) nA
OFFSET CURRENT
Input Offset Current 20 135 (3) nA
VOLTAGE RANGE
Common-Mode Input Range ±10.5 (3) ±11.8 V
Common-Mode Rejection VIN = ±11VDC 96 (3) 122 dB
OPEN-LOOP GAIN, DC
Open-Loop Voltage Gain RL ≥ 2kΩ 113 (3) 120 dB
RATED OUTPUT
Voltage Output RL = 2kΩ ±11.0 (3) ±13.4 V
Short Circuit Current VO = 0VDC 25 mA
TEMPERATURE RANGE
Specification –40 +85 °C

NOTES: (1) Offset voltage specification are measured with automatic test equipment after approximately 0.5s from power turn-on. (2) Unnulled or nulled with 8kΩ to
20kΩ potentiometer. (3) This parameter specified by design.

4
OPA27, OPA37
www.ti.com SBOS135C
TYPICAL CHARACTERISTICS
At TA = +25°C, ±VCC = ±15VDC, unless otherwise noted.

INPUT VOLTAGE NOISE vs NOISE BANDWIDTH

INPUT OFFSET VOLTAGE WARM-UP DRIFT (0.1Hz to Indicated Frequency)
+10 10
Offset Voltage Change (µV)

+5

Voltage Noise (µVrms)

1

0.1
–5
RS = 0 Ω

–10 0.01
0 1 2 3 4 5 6 100 1k 10k 100k
Time From Power Turn-On (min) Noise Bandwidth (Hz)

TOTAL INPUT VOLTAGE NOISE SPECTRAL DENSITY VOLTAGE NOISE SPECTRAL DENSITY
vs SOURCE RESISTANCE vs SUPPLY VOLTAGE
100 5
80
60 R1
40 - 10Hz
Voltage Noise (nV/√Hz)

Voltage Noise (nV/√Hz)

4
+
20 R1
RSOURCE = 2 x R 1
10 3 1kHz
8
6
10Hz
4
2
1kHz Resistor Noise Only
2

1 1
100 1k 10k 0 ±5 ±10 ±15 ±20
Source Resistance (Ω) Supply Voltage (VCC )

VOLTAGE NOISE SPECTRAL DENSITY

vs TEMPERATURE INPUT CURRENT NOISE SPECTRAL DENSITY
5 10
8 Current Noise Test Circuit
6
10Hz
4 100kΩ 500kΩ 10kΩ
Voltage Noise (nV/√Hz)

Current Noise (pA/√Hz)

4 en
o
2 DUT

500kΩ
3 1
1kHz 0.8 In = √(e n )2 – (130nV)2
o
0.6 1M Ω x 100
0.4
2
Warning: This industry-standard equation
0.2 is inaccurate and these figures should
be used for comparison purposes only!
1 0.1
–75 –50 –25 0 +25 +50 +75 +100 +125 10 100 1k 10k
Ambient Temperature (°C) Frequency (Hz)

OPA27, OPA37 5
SBOS135C www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, ±VCC = ±15VDC, unless otherwise noted.

INPUT VOLTAGE NOISE SPECTRAL DENSITY OPEN-LOOP FREQUENCY RESPONSE

10 140

120
8
Voltage Noise (nV/√Hz)

100

Voltage Gain (dB)

OPA37
6
80
OPA27
4 60

40
2
20

0 0
1 10 100 1k 10 100 1k 10k 100k 1M 10M 100M
Frequency (Hz) Frequency (Hz)

OPA27 CLOSED-LOOP VOLTAGE GAIN AND

BIAS AND OFFSET CURRENT vs TEMPERATURE PHASE SHIFT vs FREQUENCY (G = 100)
20 20 50

40 0
Absolute Offset Current (nA)
Absolute Bias Current (nA)

Bias
15 15

Phase Shift (degrees)

30 –45
Voltage Gain (dB)

∅
Offset 20 –90
10 10
10 Gain –135

0 –180
5 5
–10 –225

0 0 –20
–75 –50 –25 0 +25 +50 +75 +100 +125 10 100 1k 10k 100k 1M 10M 100M
Ambient Temperature (°C) Frequency (Hz)

OPA37 CLOSED-LOOP VOLTAGE GAIN AND

PHASE SHIFT vs FREQUENCY (G = 100) COMMON-MODE REJECTION vs FREQUENCY
50 140

40 0 120
Common-Mode Rejection (dB)
Phase Shift (degrees)

30 –45 100
Voltage Gain (dB)

Ø
20 –90 80 OPA37
G=5
10 Gain –135 60
OPA27
0 –180 40

–10 –225 20

–20 0
10 100 1k 10k 100k 1M 10M 100M 1 10 100 1k 10k 100k 1M 10M
Frequency (Hz) Frequency (Hz)

6
OPA27, OPA37
www.ti.com SBOS135C
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, ±VCC = ±15VDC, unless otherwise noted.

POWER SUPPLY REJECTION vs FREQUENCY OPEN-LOOP VOLTAGE GAIN vs SUPPLY VOLTAGE

140 130
OPA27
120 R L = 2k Ω
Power Supply Rejection (dB)

100

Voltage Gain (dB)

–VCC 125
80 R L = 600 Ω

60 +VCC

120
40

20

0 115
1 10 100 1k 10k 100k 1M 10M ±5 ±10 ±15 ±20 ±25
Frequency (Hz) Supply Voltage (VCC )

OPEN-LOOP VOLTAGE GAIN vs TEMPERATURE SUPPLY CURRENT vs SUPPLY VOLTAGE

135 6

5
130 Supply Current (mA) +125°C
Voltage Gain (dB)

+25°C
125 RL = 2kΩ 3
–55°C
2
120
1

115 0
–75 –50 –25 0 +25 +50 +75 +100 +125 0 ±5 ±10 ±15 ±20
Ambient Temperature (°C) Supply Voltage (VCC )

COMMON-MODE INPUT VOLTAGE RANGE

vs SUPPLY VOLTAGE OPA27 SMALL SIGNAL TRANSIENT RESPONSE
+15 +60

+10 +40
Common-Mode Range (V)

T A = –55°C
Output Voltage (mV)

+5 T A = +25°C +20
TA = +125°C
0 0
TA = –55°C

–5 TA = +25°C –20
A VCL = +1
TA = +125°C C L = 15pF
–10 –40

–15 –60
0 ±5 ±10 ±15 ±20 0 0.5 1 1.5 2 2.5
Supply Voltage (VCC ) Time (µs)

OPA27, OPA37 7
SBOS135C www.ti.com
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, ±VCC = ±15VDC, unless otherwise noted.

OPA37 SMALL SIGNAL TRANSIENT RESPONSE OPA27 LARGE SIGNAL TRANSIENT RESPONSE
+60 +6

+40 +4
Output Voltage (mV)

Output Voltage (V)

+20 +2

0 0

–20 –2
A V = +5 A VCL = +1
C L = 25pF
–40 –4

–60 –6
0 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 12
Time (µs) Time (µs)

OPA37 LARGE SIGNAL TRANSIENT RESPONSE

+15

+10
Output Voltage (V)

+5

–5
A V = +5
–10

–15
0 1 2 3 4 5 6
Time (µs)

8
OPA27, OPA37
www.ti.com SBOS135C
APPLICATIONS INFORMATION THERMOELECTRIC POTENTIALS
The OPA27 and OPA37 are laser-trimmed to microvolt-level
OFFSET VOLTAGE ADJUSTMENT input offset voltages, and for very-low input offset voltage
The OPA27 and OPA37 offset voltages are laser-trimmed drift.
and require no further trim for most applications. Offset Careful layout and circuit design techniques are necessary to
voltage drift will not be degraded when the input offset is prevent offset and drift errors from external thermoelectric
nulled with a 10kΩ trim potentiometer. Other potentiometer potentials. Dissimilar metal junctions can generate small
values from 1kΩ to 1MΩ can be used, but VOS drift will be EMFs if care is not taken to eliminate either their sources
degraded by an additional 0.1µV/°C to 0.2µV/°C. Nulling (lead-to-PC, wiring, etc.) or their temperature difference (see
large system offsets by use of the offset trim adjust will Figure 11).
degrade drift performance by approximately 3.3µV/°C per
millivolt of offset. Large system offsets can be nulled without Short, direct mounting of the OPA27 and OPA37 with close
drift degradation by input summing. spacing of the input pins is highly recommended. Poor layout
can result in circuit drifts and offsets which are an order of
The conventional offset voltage trim circuit is shown in Figure
magnitude greater than the operational amplifier alone.
3. For trimming very small offsets, the higher resolution
circuit shown in Figure 4 is recommended.
The OPA27 and OPA37 can replace 741-type operational
amplifiers by removing or modifying the trim circuit.

0.1µF

100kΩ

10Ω
2kΩ
DUT 4.3kΩ 22µF

4.7µF OPA111
Scope
Voltage Gain
2.2µF x1
Total = 50,000
100kΩ RIN = 1MΩ

110kΩ
0.1µF

24.3kΩ

NOTE: All capacitor values are for nonpolarized capacitors only.

FIGURE 1. 0.1Hz to 10Hz Noise Test Circuit.

0.1Hz TO 10Hz NOISE

1s/div 40nv/div

FIGURE 2. Low Frequency Noise.

OPA27, OPA37 9
SBOS135C www.ti.com
NOISE: BIPOLAR VERSUS FET COMPENSATION
Low-noise circuit design requires careful analysis of all noise Although internally compensated for unity-gain stability, the
sources. External noise sources can dominate in many OPA27 may require a small capacitor in parallel with a
cases, so consider the effect of source resistance on overall feedback resistor (RF) which is greater than 2kΩ. This ca-
operational amplifier noise performance. At low source im- pacitor will compensate the pole generated by RF and CIN
pedances, the lower voltage noise of a bipolar operational and eliminate peaking or oscillation.
amplifier is superior, but at higher impedances the high
current noise of a bipolar amplifier becomes a serious liabil- INPUT PROTECTION
ity. Above about 15kΩ, the OPA111 low-noise FET opera-
Back-to-back diodes are used for input protection on the
tional amplifier is recommended for lower total noise than the
OPA27 and OPA37. Exceeding a few hundred millivolts differ-
OPA27, as shown in Figure 5.
ential input signal will cause current to flow, and without
external current limiting resistors, the input will be destroyed.
+VCC
Accidental static discharge, as well as high current, can dam-
age the amplifier’s input circuit. Although the unit may still be
(1)
NOTE: (1) 10kΩ to 1MΩ functional, important parameters such as input offset voltage,
Trim Potentiometer drift, and noise may be permanently damaged, as will any
7 (10kΩ Recommended).
8 precision operational amplifier subjected to this abuse.
2
1 Transient conditions can cause feedthrough due to the amplifier’s
6
OPA27/37
finite slew rate. When using the OPA27 as a unity-gain buffer
3
(follower) a feedback resistor of 1kΩ is recommended, as
4
±4mV Typical Trim Range shown in Figure 6.

–VCC
RF
FIGURE 3. Offset Voltage Trim. ≈ 1kΩ

+VCC
–

(1) OPA27 Output

+
NOTE: (1) 1kΩ Trim Potentiometer. Input
1.9V/µs
7 4.7kΩ 4.7kΩ
2 8
1
OPA27/37
6 FIGURE 6. Pulsed Operation.
3

4 ±280µV Typical Trim Range G ≈ 40dB at 1kHz. 7.87kΩ

Metal film resistors.
–VCC
Film capacitors. 0.01µF 0.03µF
RL and CL per cartridge
FIGURE 4. High Resolution Offset Voltage Trim. manufacturer’s
97.6kΩ
recommendations.
100Ω
2
1µF Output
1k 6
OPA27 + Resistor OPA37
Voltage Noise Spectral Density, EO

EO 3
OPA111 + Resistor
Typical at 1kHz (nV/√Hz)

Moving 20kΩ
RS Magnet RL CL
100
Cartridge

OPA111 + Resistor Resistor Noise Only

FIGURE 7. Low-Noise RIAA Preamplifier.
10

Resistor Noise Only 1kΩ

OPA27 + Resistor
1 1kΩ
100 1k 10k 100k 1M 10M 2
Input
Source Resistance, RS (Ω) 6
OPA27 Output
3
EO = √en2 + (inRS)2 + 4kTRS FO = 1kHz

FIGURE 5. Voltage Noise Spectral Density Versus Source FIGURE 8. Unity-Gain Inverting Amplifier.
Resistance.

10
OPA27, OPA37
www.ti.com SBOS135C
 G ≈ 50dB at 1kHz.
Metal film resistors.
Film capacitors. 4.99kΩ 0.01µF
1kΩ RL and CL per head
manufacturer’s 316kΩ
recommendations.
1kΩ
2 100Ω
Input 2
6 1µF
OPA37 Output 6 Output
250Ω 3 OPA37
3

500pF 20kΩ
RL CL

Magnetic Tape Head

FIGURE 9. High Slew Rate Unity-Gain Inverting Amplifier. FIGURE 10. NAB Tape Head Preamplifier.

10kΩ
Total Gain = 106
10Ω

10Hz Low- Chart 10mV/mm

DUT G =1k
Pass Filter Recorder 5mm/s
Offset

A. 741 noise with circuit well-shielded from air

5µV
currents and RFI. (Note scale change.)

B. OP-07AH with circuit well-shielded from air

0.5µV
currents and RFI.

C. OPA27AJ with circuit well-shielded from air

currents and RFI. (Represents ultimate 0.5µV
OPA27 performance potential.)

D. OPA27 with circuit unshielded and exposed

to normal lab bench-top air currents.
0.5µV
(External thermoelectric potentials far
exceed OPA27 noise.)

E. OPA27 with heat sink and shield which

protects input leads from air currents.
0.5µV
Conditions same as (D).

FIGURE 11. Low Frequency Noise Comparison.

OPA27, OPA37 11
SBOS135C www.ti.com
 3 Gain = 100
–In For Gain = 1000, use INA106 differential amplifier.
6
OPA37 Bandwidth ≈ 500kHz
2 INA105
Differential Amplifier
RF
5kΩ 25kΩ 25kΩ
2 5

RG Input Stage Gain = 1 + 2RF /RG

101Ω
RF 6
5kΩ 25kΩ
3 Output

2
25kΩ
6
OPA37
3
+In 1

FIGURE 12. Low Noise Instrumentation Amplifier.

0.1µF
1kΩ

100Ω 100kΩ
200Ω
2
0.1µF Output 2
500pF 6
OPA37 6 Output
3
OPA27
3
2kΩ
1MΩ
NOTE: Use metal film resistors
Dexter 1M
and plastic film capacitor. Circuit
Thermopile
EDO 6166 must be well shielded to achieve
Detector
Transducer Frequency Response low noise.
≈ 1kHz to 50kHz
Responsivity ≈ 2.5 x 104V/W
Output Noise ≈ 30µVrms, 0.1Hz to 10Hz

FIGURE 13. Hydrophone Preamplifier. FIGURE 14. Long-Wavelength Infrared Detector Amplifier.

20pF

TTL INPUT GAIN

9.76kΩ
“1” +1
“0” –1
Balance
500Ω Trim

Input 10kΩ
2
6 Output
D1 4.99kΩ OPA27
3
8
S1
D2 S2 1

4.75kΩ 4.75kΩ
1kΩ
TTL DG188
In Offset
Trim
+VCC

FIGURE 15. High Performance Synchronous Demodulator.

12
OPA27, OPA37
www.ti.com SBOS135C
 Gain = –1010V/V
VOS ≈ 2µV
Drift ≈ 0.07µV/°C
en ≈ 1nV/√Hz at 10Hz
0.9nV/√Hz at 100Hz
0.87nV/√Hz at 1kHz
Full Power Bandwidth ≈ 180kHz
Gain Bandwidth ≈ 500MHz
Equivalent Noise Resistance ≈ 50Ω

Input 20Ω 2kΩ

Signal-to-Noise Ratio ∝ √N
since amplifier noise is
2 uncorrelated.
6 2kΩ
OPA37
3

20Ω 2kΩ

2
6 2kΩ
OPA37
3

20Ω 2kΩ 2kΩ

2 2
6 2kΩ 6
OPA37 OPA37
3 3

20Ω 2kΩ Output

2
6 2kΩ
OPA37
3

20Ω 2kΩ

2
6 2kΩ
OPA37
3

N = 10 Each OPA37

FIGURE 16. Ultra-Low Noise “N”-Stage Parallel Amplifier.

OPA27, OPA37 13
SBOS135C www.ti.com
 5V
5V
+10V
+10V

Output
0V
Output

0V

–10V
–10V

5µs
5µs
RS = 50Ω
RS = 50Ω
1kΩ

1kΩ
2
6
2 OPA37 Output
250Ω 3
6
OPA27 Output
3
Input 500pF
Input

FIGURE 17. Unity-Gain Buffer. FIGURE 18. High Slew Rate Unity-Gain Buffer.

+15V

200Ω 20kΩ 10µF/20V 100Ω 10kΩ

+

VIRTEC V1000 2 1 2
50Ω Planar Tunnel 100µF/20V
Input 0.01µF 6 Tantalum 6
Diode OPA37 OPA27
3 2 3
Video Output
+
Output
RFC 200Ω 500pF 10kΩ 10kΩ

Siemens LHI 948 3

FIGURE 19. RF Detector and Video Amplifier. FIGURE 20. Balanced Pyroelectric Infrared Detector.

4.8V
+
1kΩ
2
6
Airpax OPA27 0
3 Output
Magnetic
Pickup
–

fOUT ∝ RPM • N
Where N = Number of Gear Teeth

FIGURE 21. Magnetic Tachometer.

14
OPA27, OPA37
www.ti.com SBOS135C
 PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Top-Side Markings Samples
(1) Drawing Qty (2) (3) (4)

OPA27GP ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA27GP
& no Sb/Br)
OPA27GPG4 ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA27GP
& no Sb/Br)
OPA27GU ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 27U
OPA27GU/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 27U
OPA27GU/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 27U
OPA27GUE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 27U
OPA27GUG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 27U
OPA37GP ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA37GP
& no Sb/Br)
OPA37GPG4 ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA37GP
& no Sb/Br)
OPA37GU ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 37U
OPA37GU/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 37U
OPA37GU/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 37U
OPA37GUE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 37U

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 9-Sep-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPA27GU/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA37GU/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 9-Sep-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA27GU/2K5 SOIC D 8 2500 367.0 367.0 35.0
OPA37GU/2K5 SOIC D 8 2500 367.0 367.0 35.0

Pack Materials-Page 2
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