INTEGRATED CIRCUITS

SA5778
Serial triple gauge driver (STGD)

Product specification 1998 Apr 03

Supersedes data of 1997 May 27
IC18 Data Handbook

 
   
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

DESCRIPTION FEATURES
The Serial Triple Gauge Driver (STGD), is a single chip air core • Major Gauge 10-bit resolution Drive provides 0.35° resolution
driver providing drive to one major gauge, and two minor gauges, for
– Sine/Cosine outputs for 360° operation
automotive applications such as Speedometer, Fuel, Temperature,
Tachometer, Volts, and Oil pressure information display. The STGD – 0.2° accuracy typical throughout entire range
operates in conjunction with a microcontroller receiving serial data • Minor gauge drivers provide 0.35° resolution
inputs, and can provide status back to the microcontroller either
– 112° operation
serially or via a status line. The protocol is compatible with the
– 0.5° accuracy typical throughout entire range
Philips Single Gauge Driver (SGD) and Dual Gauge Driver (DGD).
The STGD also includes a protected battery supply for external • Serial Data Input
single Serial Gauge Drivers or Dual Gauge Drivers. – Supports interface from microcontrollers
– Compatible with Philips SGD SA5775A and DGD SA5777A
PIN CONFIGURATION
• Serial Data Output
SIN+ 1 28 SIN– – Permits the STGD to be wired in series using a common chip
RUN 2 27 COS+
select to additional STGDs, SGDs, and DGDs
– Permits fault status information to be returned to the
GOE 3 26 COS–
microcontroller
• Over Voltage Protection, Over Temperature Protection and Low
SwCONTROL 4 25 ST

SwBATT1 5 24 SCLK
Standby Current Operation
GND 6 23 GND – Gauge drivers disabled when supply voltage exceeds specified
GND 7 22 GND operating voltage, protection to 40V.
GND 8 21 GND – Gauge drivers disabled when die temperature exceeds
operating range
GND 9 20 GND
– External switch may supply overvoltage protected battery
VBATT 10 19 CS
supply to other devices operating off battery
SwBATT2 11 18 DATAIN
• Thermally Enhanced SO-28 surface mount package
DATAOUT 12 17 C1–

COM 13 16 C1+

C2– 14 15 C2+

SR01116

Figure 1. Pin Configuration

BLOCK DIAGRAM
SCLK
MINOR GAUGE 2 MINOR GAUGE 1 MAJOR GAUGE

DATAIN 10-BIT SR 10-BIT SR 10-BIT SR DATAOUT

CS

GOE 9-BIT DATA 9-BIT DATA 10-BIT DATA 4-BIT STATUS ST

LATCH LATCH LATCH LATCH
RUN
ENABLE
7-BIT 7-BIT 7–BIT, SINE
BIAS, TSD Tan Tan /COSINE
VBATT
SwBATT, DAC DAC DAC
COMMON
REFERENCE
MUX MUX MUX
SwBATT1

SwBATT2

COS+

SIN+
C2–

C2+

C1–

C1+

COS–

SIN–
SwControl

COM

GND

SR01117

Figure 2. STGD Internal Block Diagram

1998 Apr 03 2 853–2055 19199

Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

ORDERING INFORMATION
DESCRIPTION TEMPERATURE RANGE ORDER CODE DWG #
28-Pin Small Outline (SO) thermally enhanced Package –40 to +105°C SA5778D SOT136-1

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PIN DESCRIPTION

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Mnemonic Pin No. Type Name and Function

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GND 6,7,8,9,20, I Circuit Ground Potential. The pins are used for heat dissipation to board. All pins should be soldered
21,22,&23 to foil on the board per the thermal management description.

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GOEÁÁ
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VBATT

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10 I

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3 I
Battery supply voltage
Gauge Output Enable: A high on this input enables normal operation of the gauge coil drivers.

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See Table 1.

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RUN 2 I RUN (Ignition): Input to sense the state of the Ignition switch. See Table 1.

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SwCONTROL 4 O Switched Battery Control: Control output to switch on a protected VBATT supply via an external PNP
transistor. This output is controlled by the RUN input, GOE input and the on chip protection circuits.

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SwBATT1 5, I Switched Battery Supplies: Used as the reference level for the DACs, bias voltage for the second coils

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SwBATT2 11 I of the minor gauges, and the supply for the output buffers for the major and minor gauges. One supplies
the major gauge drivers and related circuits, while the other supplies the minor gauge circuits. Both

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SwBATT inputs must be connected to the control transistor as the two inputs are not connected internally.

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SCLK 24 I Serial Clock: Used to clock data into and out of the STGD. Data is shifted MSB first.

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DATAIN 18 I Data In: Data is loaded on the rising edge of SCLK and is shifted in MSB first.
DATAOUT 12 O Data Out: Is provided to permit the STGD to pass status information back to the controlling

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microcontroller, and to allow multiple devices to be connected in series.

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ST 25 O Status Output: This is an open drain output. Status outputs from several devices may be wire OR’ed
together. This output is low when the outputs are disabled due to a fault condition. The outputs may be

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disabled due to shorted outputs, over temperature, power up reset, or the GOE control pin and this

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condition is reflected on the ST pin. The outputs will also be disabled due to an over voltage condition,
however this is not reported on the ST pin as over voltage should be a transient condition.

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CS

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19 I

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Chip Select: Active high chip select input. When CS is high, the part is enabled to receive data on the

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DATAin pin and output data on the DATAout pin. A low to high transition of CS captures device status in
the shift register for output. A high to low transition of CS loads gauge data from the shift register into

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the data latches.

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SIN+ 1 O Sine Positive: Driver output to sine coil of major gauge, positive side.

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SIN– 28 O Sine Negative: Driver output to sine coil of major gauge, negative side.
COS+ 27 O Cosine Positive: Driver output to cosine coil of major gauge, positive side.

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COS–
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C1+
26 O

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16 O
Cosine Negative: Driver output to cosine coil of major gauge, negative side.
Coil 1 Positive: Driver output to driven coil of minor gauge 1, positive side.

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C1– 17 O Coil 1 Negative: Driver output to driven coil of minor gauge 1, negative side.

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C2+ 15 O Coil 2 Positive: Driver output to driven coil of minor gauge 2, positive side.

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C2– 14 O Coil 2 Negative: Driver output to driven coil of minor gauge 2, negative side.

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COM 13 O Common: Driver output for junction of bias coils for minor gauges. This output is regulated to half of
SwBATT.

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ABSOLUTE MAXIMUM RATINGS

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SYMBOL PARAMETER RATING UNIT
VBATT Battery supply voltage, with recommended 1K
series resistor 40 V

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VIN1

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VIN2 ÁÁÁÁÁÁÁÁÁÁÁÁ
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Input voltage; Data In, CS, SCLK, GOE

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Input voltage; SwBATT
–1 to +7
–1 to +24
V
V

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VIN3 Input voltage; RUN, with recommended RC Circuit –1 to +40 V

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PD Power Dissipation (Tamb = 105°C) SO-28 Package 1400 mw

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Tamb Ambient operating temperature –40 to +105 °C
Junction temperature1 °C

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TJ +150/+160
θJA Thermal Impedance See Thermal Management Section °C/W
NOTE:
1. 160°C junction temperature is permitted during high battery (>16V) fault operation

1998 Apr 03 3
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

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DC ELECTRICAL CHARACTERISTICS
VBATT = 8.0 to 16V; Tamb = –40 to +105°C

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SYMBOL
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PARAMETER
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TEST CONDITION
MIN
LIMITS
TYP MAX
UNITS

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VBATT Battery supply voltage Normal operating range 8 16 V

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VSWBATT Switched battery supply voltage Normal operating range 7.5 16 V

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VBATT = VBATTMAX 0.5 ma
IBATT Battery supply current, operating
RL = RLMIN

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ISWBATT

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IBATTSB ÁÁÁÁ
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Switched battery supply current, operating

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Battery supply current, standby
Normal operating range
VBATT = 12 V
400
60
ma
µA

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VOH1 Output high voltage DATAOUT, IOH = 300µA 4.0 V

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VOH2 Output high voltage SwCONTROL, IOH = 10µA 40 V

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IOH Off state output current ST, VOH = 5 V 25 µA

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VOL1 Output low voltage ST, DATAOUT, IOL = 1.5 mA 0.4 V

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SwCONTROL,
VOL2 Output low voltage IOL = 50 mA @ VBATTMAX 1.5 V

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VIH ÁÁÁÁ
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Input high voltage ÁÁÁÁ
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IOL = 20 mA @ VBATTMIN
CS, SCLK, DATAIN, GOE, RUN 3.5
1.2 V
V

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VIL Input low voltage CS, SCLK, DATAIN, GOE, RUN 1.5 V

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VOVSD Battery overvoltage shutdown voltage VBATT 18 23 V

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CS, SCLK, DATAIN, RUN GOE;
IIH Input high current 10 µA
VIH = 3.5

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IIL
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ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ
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Input low current

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CS, SCLK, DATAIN, RUN GOE;
VIL=1.5
10 µA

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ACC1 Output function accuracy, major gauge RL = RLMIN; major gauge, G1 –0.5 +0.5 Deg

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ACC2,3 Output function accuracy, minor gauges RL = RLMIN; minor gauges, G2 & G3 –1.0 +1.0 Deg
%

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VDRIVE1 Coil drive voltage, major gauge 68 71 78
SwBATT

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%
VDRIVE2,3 Coil drive voltage, minor gauges 70 74 80

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SwBATT
Tamb = 105°C 226 Ω

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RLMIN

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ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ
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Minimum coil load resistance

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Tamb = 25°C
Tamb = –40°C
171
127
Ω
Ω

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IOB (Source or Sink) 0.475 × 0.525 ×
VCOM Minor gauge bias voltage V
RL = RLMIN SwBATT SwBATT

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ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ ÁÁÁÁ
AC ELECTRICAL CHARACTERISTICS

ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ ÁÁÁÁ
VBATT = 7.5 to 16V; Tamb = –40 to +105°C
LIMITS

ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
SYMBOL PARAMETER TEST CONDITION UNITS
MIN TYP MAX

ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
tCYC

ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
FSCLK ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Clock cycle time

ÁÁÁÁ
Clock frequency ÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ TCYC
625
1.60
ns
MHz

ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
tSCLKL SCLK LOW time 175 ns

ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
tSCLKH SCLK HIGH time 175 ns

ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
tCSH CS high to SCLK high time 75 ns

ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ
tCSL SCLK low to CS low time 75 ns
tSU DATAIN setup to SCLK high time 75 ns

ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
tHD
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
tDR ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁ
DATAOUT rise time ÁÁÁÁ
SCLK high to DATAIN hold time

ÁÁÁÁ 0.8 to 3.6V; CL = 90pF

75
75
ns
ns

ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
tDF
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
DATAOUT fall time
ÁÁÁÁ 3.6 to 0.8V; CL = 90pF 75 ns

1998 Apr 03 4
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

4
J1850 360° MAJOR
GOE
PROTOCOL GAUGE
CONTROLLER 80C51
MICRO– SA5778
SERIAL 2
CONTROLLER SERIAL
TRIPLE
GAUGE
DRIVER 112° MINOR
GAUGE
AU5780 2
J1850 VPW
TRANSCEIVER
RUN
IGNITION
ADDITIONAL GAUGE
DRIVERS; SA5775A
OR SA5777A
PROTECTED BY
J1850 BUS SA5778

VBATT SR01118

Figure 3. System Connections for the STGD

FUNCTIONAL DESCRIPTION
Figure 1 shows the pin-out of the STGD, which is packaged in an
MICRO- SA5778 SERIAL
SO-28 pin package, enhanced for improved thermal management. TRIPLE
CONTROLLER
Four pins on each side of the package serve as a heat spreader to GAUGE DRIVER
remove heat from the die, and also function as the ground DATAOUT DATAIN

connection. The recommended mounting includes an area of copper SCLK SCLK

on the PC board to aid in thermal management. PORT N CS
DATAIN DATAOUT
Figure 2 is a block diagram of the STGD. A serial interface connects INT ST
the STGD to the microcontroller. A data output pin is provided to
permit the STGD to be wired in series with other Philips air core ADDITIONAL
gauge drivers such as the Serial Gauge Driver, SA5775, and the 5V GAUGE DRIVER(S),
DATAIN
Dual Gauge Driver, SA5777 or additional STGDs. Status information SA5775A,
SCLK SA5777A OR
may be passed back to the microcontroller via a status output, or via SA5778
CS
the serial interface.
DATAOUT
Figure 3 shows the connection of the STGD in a typical application. ST

SR01119
APPLICATION INFORMATION Figure 4. Serial Communications Between STGD,
Figure 4 demonstrates the connections between the STGD, the
Microcontroller and Other Gauge Drivers
microcontroller, and optionally additional gauge drivers such as the
SGD and DGD. With an active high on the chip select input (CS),
data is shifted into the STGD through DATAIN on the rising edge of Figure 5 shows the gauge connections to the STGD. The major
SCLK. Several gauge drivers may be wired in series using a gauge, G1, supports full 360° operation with two coils driven. The
common chip select and clock line, when more than three gauges seven least significant bits of the gauge information are converted to
are needed. The DATAOUT pins are cascaded to the DATAIN pins of an analog level by digital-to-analog converter. The display range is
the following gauge drivers. Status information can be returned to divided into eight sections, two sections per quadrant. The coils are
the microcontroller via the ST pins of each gauge driver. These are driven with a Sine/Cosine approximation. The three most significant
open-drain, active low outputs, which may be wire OR’ed together to bits of gauge display information control the multiplexer to select
signal that a fault, such as a thermal shut down, has occurred within which coil is fed by the DAC and which coil receives a fixed bias.
one of the gauge drivers. This pin may be connected to a The multiplexer also determines the polarity of the voltages supplied
microcontroller port pin for polling in software, or may be connected to the coils.
to an external interrupt input to cause entry into an interrupt service
routine. The STGD, may also pass status information back to the The minor gauges, G2 and G3, each have one coil driven by a DAC.
microcontroller serially. The rising edge of chip select loads status The other coils of each gauge are wired in series with the switched
information into the shift register for the first four bits that will be battery supply to supply the bias. The switched battery supply is
shifted out of the STGD by the shift clock. Figure 11 shows the data turned off during over voltage conditions. Only 9-bits of information
bits within the shift register. A low on the ST pin signals that one or are required for the minor gauges, however, 10-bits are shifted
more status bits have been set in the status register. A high through the part to maintain compatibility with the SGD and DGD.
indicates all status bits are reset. The status output bits include Hence, all gauges, both major and minor, are supplied with 10-bit
minor gauge over current, major gauge over current, thermal data for consistency.
shutdown and RUN. Gauge data is captured in latches by the falling
edge of the chip select.

1998 Apr 03 5
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

placed in a standby mode with a low on both the GOE and RUN
DATAIN DATA / STATUS SHIFT REGISTERS input pin. In this mode, battery current drain is minimized.
DATA
SCLK OUT The SwBATT1 and SwBATT2 inputs are the supply for the DACs,
STATUS DATA
and the output buffers driving the coils including the COM output
ST
LATCH LATCHES which stabilizes the voltages applied to the bias coils of the minor
CS gauges. Both SwBATT1 and SwBATT2 should be connected to the
GOE collector of the control transistor as these inputs are not connected
THERMAL DIGITAL-to-ANALOG
CONVERTERS and OUTPUT internally and supply different portions of the circuit. This switched
ENABLE

RUN PROTECTION
SwBATT, BIAS MULTIPLEXERS battery supply is protected from voltages exceeding the specified
VBATT operating range and is controlled by the SwCONTROL output. This
supply may optionally be used to supply additional circuits which
operate from unregulated battery supplies but which need protection
from over voltage transients. Typical devices which may benefit from
SwControl

SIN+
COS+

this protection include the Serial Gauge Driver, SA5775A and Dual
C2–
C2+

C1–

SIN–
C1+

COS–
COM

GND
SwBATT1
SwBATT2

Gauge Driver, SA5777A, which are often used in conjunction with

the STGD in 4 and 5 gauge applications.
This switched battery supply is turned off when the STGD enters the
standby mode in response to the RUN and GOE inputs both being
SwBATT TRANSISTOR 112° MINOR GAUGES 360° MAJOR GAUGE
SR01120
low, or a VBATT supply exceeding the specified operating range. The
switched battery supply depends on the RUN signal to prevent
Figure 5. Gauge Connections to the STGD
undesired needle movement on the minor gauges when going from
standby to active mode. This movement would otherwise occur if
5V
the voltage to the fixed bias coils of the minor gauges was switched
5V
18-24V
+ REGULATOR LOGIC on before the coil voltages provided by the DACs within the STGD
REFERENCE – were defined. The start up jump is prevented as follows. In the sleep
OUTPUT mode the switched battery supply is off, and the gauge drive outputs
VBATT BUFFER SUPPLY of the STGD are in a high impedance state. The gauges are in their
1KΩ
GOE DAC REFERENCES zero position from the previous power-down sequence. When the
RUN input goes high, but the GOE is kept low, the STGD enters the
RUN SwControl SwBATT1/2
start up mode in which the minor gauges are driven to zero, the
10KΩ
RB BIAS COILS internal 5V regulator for the logic is turned on, and the switched
battery supply is turned on to supply the bias coil and STGD output
VBATT
EXTERNAL buffers. However, the output buffers for the major gauge remain in
GAUGE DRIVERS
the high impedance output state. The microcontroller may load
SR01121 values into the STGD via the serial interface while GOE is low.
Figure 6. Gauge Enable/Standby Circuit and Over Voltage When the microcontroller applies a high to GOE, the major gauge
Protection Circuit output buffers are enabled. When the RUN signal is removed the
STGD continues to operate in the normal mode, however, the
Figure 6 shows the protection and gauge enable logic for the STGD. controlling microcontroller should also monitor RUN and, when it
The battery supply voltage VBATT is monitored, and if the supply goes low, send a series of values to the STGD to move the needles
exceeds the specified operating range, the STGD is put in a to their zero positions before taking GOE low to put the part in the
shutdown mode in which the output buffers are disabled. The STGD standby mode.
will also enter the shutdown mode by excessive die temperature, Table 1 describes the operation and control of the SwBATT supply,
and will return to normal operation when the die temperature the output buffers, and the operations normally performed by the
decreases to within specified limits. Thermal shutdown may occur at microcontroller. Normal operation of a vehicle will follow the
VBATT supply voltages over 16V at high ambient temperatures near sequence of the truth table from top to bottom. The RUN input is
105°C. Internal logic will continue to function and status may be read typically connected to the switched ignition voltage, while GOE is
out to determine the source of the shutdown. The STGD may be controlled by the microcontroller.

1998 Apr 03 6
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
Table 1. Truth Table

ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
RUN GOE
SwControl Swbatt1,2 Minor Gauge Driver Major Gauge
Input Input System Status

ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
1=ON Voltage Outputs Driver Outputs
1=High 1=High

ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
High
0 0 0 Off High Impedance Standby mode
Impedance

ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ ÁÁÁÁÁ
ÁÁÁ
1 ÁÁÁÁ
ÁÁÁÁÁ ÁÁÁÁÁÁÁ
ÁÁÁÁ ÁÁÁÁÁ
ÁÁÁÁÁÁÁ
0 ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
1 VBATT
Enabled High
Start up mode, sets minor gauge driver to
zero position, and disables major gauge

ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
(output forced to zero)

ÁÁÁÁÁ
Impedance

ÁÁÁÁÁÁÁÁÁÁÁÁ
driver. Load values into STGD via the serial
port.

ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ ÁÁÁÁÁ
ÁÁÁ
1
ÁÁÁÁ
ÁÁÁÁÁ ÁÁÁÁÁÁÁ
ÁÁÁÁ ÁÁÁÁÁ
ÁÁÁÁÁÁÁ
1
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
1 VBATT Enabled Enabled
Normal Operating mode. Periodically
update gauge data as required by the
application.

ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ ÁÁÁÁÁ
ÁÁÁ
0 ÁÁÁÁ
ÁÁÁÁÁ ÁÁÁÁÁÁÁ
ÁÁÁÁ ÁÁÁÁÁ
ÁÁÁÁÁÁÁ
1 ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
1 VBATT Enabled Enabled
Power down sequence. Load a series of
values into the STGD to return needles to
zero before power is removed.

ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ ÁÁÁÁÁ
ÁÁÁ ÁÁÁÁ
ÁÁÁÁÁ
0
ÁÁÁÁÁÁÁ
ÁÁÁÁ ÁÁÁÁÁ
ÁÁÁÁÁÁÁ
0
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
0 Off High Impedance
High
Impedance
Returned to standby mode (same as first
row of table)

THERMAL MANAGEMENT AND POWER The actual value used is dependent on the current needed to
DISSIPATION keep the PNP in saturation.
The power dissipated by the STGD has three components. The first All gauges at 45° to a quadrant axis, as this is the highest
term in the equation below represents the power dissipated in the internal power dissipation position.
STGD from current through the coil resistance. This component of If only the nominal coil resistance is known at a given nominal
the power dissipation is a function of both the battery voltage and ambient temperature such as 25°C, the coil operating resistance at
the coil resistance. Most of the external loads such as the coils are a high temperature ambient may be calculated using the following
resistive, so the current drawn by the output buffers is proportional formula:
to the supply voltage, resulting in power dissipation that is RCA = RCN (1+(0.4%/°C)*((TSH+Tamb)–25°C))
proportional to the square of the supply voltage for these circuits.
Where:
The highest power dissipation for a given coil driver will occur when RCA = Resistance of Coil at Ambient temperature, including self
the coil voltage is being driven to 50% of VBATT. Thus the power heating
dissipated by each coil driver is (VBATT/2)* (VBATT/2Rc) or
RCN = Nominal Resistance of Coil at 25°C, without self heating
VBATT(VBATT/4Rc). If the coil resistance of the two minor gauge coils
and the two coils of the major gauge all have the same resistance, Tamb = Ambient temperature, °C
then the maximum total power dissipation of the drivers becomes TSH = Self heating of coil, °C
4*VBATT(VBATT/4Rc) or simply VBATT(VBATT/Rc). Much of the 0.4%/°C = Resistance increase coefficient for copper
internal analog circuits appears to the supply pins as a current sink
and is represented by the second term. The current drawn by these Figure 7 shows power dissipation plotted as a function of coil
circuits is relatively constant despite changes in supply voltage, resistance and voltage. Since coil resistance is a function of
resulting in power dissipation that is proportional to the supply temperature, the maximum power dissipation plotted will only occur
voltage. Finally some power is dissipated in driving the external PNP at the lowest specified operating temperature. The power dissipation
transistor used to control the switched battery supply. The total is lowest at the highest ambient temperature because of the
power dissipation is a combination of these components and may be increase in coil resistance with temperature.
calculated from the formula: This maximum power dissipation will only occur during a fault
condition in which the system voltage rises to 18V, generally
PD=VBATT(VBATT/RC)+VBATT(0.012) + because of a failed voltage regulator controlling the vehicles battery
VOL2(VBATT–VOL2–VBE(PNP))/RB voltage. Power dissipation will be lower when air core meter
movements with higher nominal coil resistance are used.
Where:
PD = Power dissipation in watts
VBATT = Battery supply voltage in volts
RC = Coil resistance in ohms at ambient temperature including
any self heating effects
VOL2 = Output low voltage of the SwCONTROL pin as specified
in the DC Characteristics
VBE(PNP)= The VBE drop of the external PNP transistor
RB = Resistor is series with base of external PNP transistor.
The minimum value of RB = VBATTMAXIOL=16/0.050=320 Ω

1998 Apr 03 7
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

3.0 125
POWER
(W)
POWER DISSIPATION FOR COIL
RESISTANCE IN OHMS AND OP- 150
2.5 ERATING BATTERY VOLTAGE

175

2.0
235

1.5 325

LOAD RESISTANCE
(Ω)

1.0

0.5

0.0
10.5

12.5

13.5

14.5

15.5

16.5

17.5
11.5
7.5

8.5

9.5

10

12

13

14

15

16

17

18
11
8

VSWBATT
(V)
SR01430

Figure 7. Power Dissipation of the STGD as a Function of Coil Resistance and Operating Voltage

The STGD is specified to operate up to VBATTmax. The over voltage Figure 8 shows the thermal resistance of the STGD mounted on a
shutdown circuit will turn off the output buffers and the switched PC board with heat-sinking copper on the component side only.
battery supply when the battery voltage reaches VOVSD. Over Figure 9 is a similar plot for a two sided PC board (same size copper
temperature conditions will also cause the output buffers to be areas on each side). Both plots assume a 60 x 60 x 1.57 mm FR4
disabled. board with varying square-shaped sizes of 2 oz. copper. The two
sided board also assumes 8 thermal bias with 0.36 mm2 cross
The STGD employs a thermally enhanced SO-28 package. The
section.
center four pins on each side are fused to the die pad to create a
path for removal of heat from the package to the copper foil on the It is important to note that at such a high ambient temperature (worst
PC board. An area of copper foil is required on the PC board for case of 105°C assumed), radiation is just as significant as
heat dissipation at higher power dissipation levels. convection in the dissipation of heat. Good radiation is highly
dependent on the emissivity of the heated surface, so the thermal
In order to determine the size of the copper foil required, both
radiation properties of the copper foil should be considered. Bare,
thermal testing and thermal modeling were used. The effective
clean copper is a good thermal conductor, but it has a low emissivity,
ΘJA (thermal resistance, junction to ambient) was determined using
and is therefore a bad radiator. It is recommended that the copper
both single and double sided PCBs with heat-sinking copper foil
areas intended for heat dissipation be left covered with solder mask
areas. Figures 8 and 9 show the effect of PCB copper foil area on
or otherwise blackened to increase the emissivity, thereby improving
the effective thermal resistance of the STGD part/PCB system.
the heat radiating ability of the board.

1998 Apr 03 8
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

50

ΘJA (°C/W)

45

40 1.4W LIMIT

35

30

25
0 500 1000 1500 2000 2500 3000 3500

PCB COPPER HEAT SINK AREA (SQ mm)

SR01497

Figure 8. θJA for SO28 with 8 Fused Pins

One-sided PCB (2 oz. Copper), e = 0.9, Tamb = 105°C, P = 1.4–1.8W

45

ΘJA (°C/W)

40 1.4W LIMIT

35

30

25
0 500 1000 1500 2000 2500 3000

PCB COPPER HEAT SINK AREA (SQ mm)

SR01498

Figure 9. θJA for SO28 with 8 Fused Pins

Two-sided PCB (2 oz. Copper), e = 0.9, Tamb = 105°C, P = 1.4–1.8W

1998 Apr 03 9
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

Sample Calculations for Power Dissipation and From Figure 8, the copper area required, using a single sided board,
Thermal Management to keep the junction temperature within limits is approximately
2200 mm2. Figure 9 shows 1200 mm2 is required on each side of a
Worst Case Example double-sided board.
The worst case example will occur when the STGD is operating at
The above example illustrates the worst case situation of the STGD
VBATTMAX (16V, in the highest specified ambient temperature
operating in at a maximum battery voltage, with the lowest nominal
(105°C), and with the lowest specified coil resistance (171 ohms at
coil resistance (171Ω at room temperature), and at the highest
25°C). Typical coil self heating of 15°C is assumed.
ambient temperature. This will produce the highest junction
Calculation of Coil resistance operating at 105°C ambient. temperature. At lower ambient temperatures the power dissipation
R may be higher because the coil resistance is decreased, however
CA= RCN (1+(0.4%W/°C)*((TSH+Tamb)–25°C))
the junction temperature will be lower.
= 171 x(1+(0.4%((15+105)–25)))
= 236 Ohms at Tamb=105°C, with 15°C of self heating. Serial Interface
Figure 10 demonstrates the serial interface timing referenced in the
Calculation of STGD power dissipation at 16 volt operation.
AC specifications. Figure 11 shows the order of information transfer
PD = VBATT (VBATT/RC) + VBATT (0.012) through the serial interface. On a low to high transition of the CS pin,
+VOL2 (VBATT – VOL2 – VBE(PNP)) / RL status information replaces the four most significant bits of data in
= 16(16/236)+16(0.012)+1.5(16–1.5–0.5)/320 the shift register and are the first bits shifted out. Output data is
= 1.085+0.192+0.066 Watts changed on the falling edge of SCLK, while input data is captured on
= 1.34 Watts the rising edge of SCLK. Major gauge data is loaded first, starting
with the most significant bit, followed by minor gauge 1 data then
Required board area and Junction Temperature calculation minor gauge 2 data.
The maximum junction temperature desired is 150°C. The
permissible temperature rise and required ΘJA may be calculated
as:
∆T = Tj–Tamb
ΘJA = ∆T/PD
Where; ∆T = Temperature rise in °C
PD = Power dissipation
Tj = Junction Temperature
Tamb = Ambient Temperature
∆T = TJ–Tamb = 150 – 105 = 45°C
ΘJA = ∆T/PD=55°C/1.34 watts = 33°C/W.

tCYC

tCF
tCR tCSL
tCSH
1 29 30
SCLK tSCLKL
tSCLKH

CS
30 CLOCK CYCLES

DATAIN D29 D1 D0*

tSU tHD

tDR tDF

DATAOUT S4 D1* D0*

SR01499

Figure 10. Serial Interface Timing

1998 Apr 03 10
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

MINOR GAUGE 2 MINOR GAUGE 1 MAJOR GAUGE/STATUS

DATA IN D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 DATA OUT
LSB MSB LSB MSB LSB MSB

During Read out:

D26: RUN Input State; 1 = RUN input high
0 = RUN input low
D27: Thermal Shutdown; 1 = Shutdown
0 = Normal operation
D28: Minor Gauge Over Current; 1 = Over Current Shutdown
0 = Normal operation
D29: Major Gauge Over Current; 1 = Over Current Shutdown
0 = Normal operation
SR01123

Figure 11. Internal Shift Register

15

10 COS SIN
DIFFERENTIAL OUTPUT VOLTAGE

0
0 127 255 383 511 639 767 895 1023

–5

–10

–15 INPUT CODE

SR01500

Figure 12. Major Gauge Output Voltages (VSWBATT = 14V)

1998 Apr 03 11
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

14.00

12.00

10.00

8.00

6.00

4.00
C+ – C– (VOLTS)

2.00

0.00

–2.00 31 63 95 127 159 191 223 255 287 319

INPUT CODE
–4.00

–6.00

–8.00

–10.00

–12.00

–14.00
SL00462

Figure 13. Typical Minor Gauge Output Voltage vs. Input Code (VSWBATT = 14V)

0.5 x VSWBATT ASSUMING CODE 0 IS 0°:

CODE POSITION
0 –56.097
31 –45.194
63 –33.940

–56° +56° 95 –22.685

127 –11.430
159 –0.176
191 11.079

–0.744 x VSWBATT 0.744 x VSWBATT 223 22.333

255 33.588
TOTAL SPAN = 112.15° STEP SIZE = 0.35°
287 44.843
319 56.097
IDEAL ANGLE(DEGREE)=CODE/319*2* ArcTan (0.744/0.5)–ArcTan(0.744/0.5)
SR01501

Figure 14. Minor Gauge Total Span

1998 Apr 03 12
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

120

100

80
ANGLE (DEGREES)

60

40

20

0
0 15 31 41 63 79 95 111 127 143 159 175 191 207 223 239 255 271 287 303 319
INPUT CODE

SL00464

Figure 15. Meter Position (degrees) vs. Input Code for Minor Gauges

1998 Apr 03 13
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

SO28: plastic small outline package; 28 leads; body width 7.5mm SOT136-1

1998 Apr 03 14
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

NOTES

1998 Apr 03 15
Philips Semiconductors Product specification

Serial triple gauge driver (STGD) SA5778

Data sheet status

Data sheet Product Definition [1]
status status

Objective Development This data sheet contains the design target or goal specifications for product development.
specification Specification may change in any manner without notice.

Preliminary Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date.
specification Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make
specification changes at any time without notice in order to improve design and supply the best possible product.

[1] Please consult the most recently issued datasheet before initiating or completing a design.

Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.

Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

Philips Semiconductors  Copyright Philips Electronics North America Corporation 1998

811 East Arques Avenue All rights reserved. Printed in U.S.A.
P.O. Box 3409
Sunnyvale, California 94088–3409 Date of release: 04–98
Telephone 800-234-7381
Document order number: 9397 750 03715

 
   
1998 Apr 03 16