BANGALORE INSTITUTE OF TECHNOLOGY

Department Of Mechanical Engineering

Project Work 21MEP76

Final Year Project Viva Voice
Title of our Project

HEAT DISSIPATION ANALYSIS IN IGBT

USING LIQUID COLD PLATE

DEPARTMENT OF MECHANICAL ENGINEERING

BANGALORE INSTITUTE OF TECHNOLOGY , BENGALURU-04
1
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering

HEAT DISSIPATION ANALYSIS IN IGBT USING LIQUID COLD PLATE

TEAM MEMBERS

GANESH S 1BI21ME019
KARTHIK L 1BI21ME028
M MANJUNATHA 1BI21ME033
PUNITH A 1BI21ME044

2
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering

HEAT DISSIPATION ANALYSIS IN IGBT USING LIQUID COLD PLATE

Internal Guide External Guide

Dr. ASWATHA Mr. Chinamaya Bhat
Professor & Head Founder & Director
Department of Mechanical Engineering Incresol Engineering Solutions Pvt. Ltd.
BIT Bangalore 560 004 Harohalli, Bangalore 562 112

3
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Project Road Map

Ganesh Karthik L M Manjunatha Punith A 4

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Contents
• About IGBT & LCP
Introduction • Our Mapping work

• Various design & respective

Designing parameters
• Industrial Projects

• Simulation results
Analysis • Parameter Analysis & Scope of
future work

Ganesh Karthik L M Manjunatha Punith A 5

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Introduction on IGBT
A power semiconductor device combining the advantages of MOSFET and BJT

Key Features :

• High efficiency
• Handles high voltage & current
• Used in power electronics applications
• Low Power consumption
Ganesh Karthik L M Manjunatha Punith A 6
1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering

Power Source (+V) → IGBT (Collector) → Load → IGBT (Emitter) → Ground

Gate (G) receives control signals (ON/OFF) from a PWM or microcontroller.

When Gate is ON : Current flows → Load is powered.
When Gate is OFF : No current → Load is disconnected.

Demerits of IGBT:
 Gate Drive Complexity  Heat Dissipation
 Lower Switching Frequency  Susceptibility to Voltage Transients

Solutions for IGBT Demerits

 Optimized Gate Drive Circuits
 New IGBT Designs

 Heat Management Techniques

Ganesh Karthik L M Manjunatha Punith A 7

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
What is Liquid Cold Plate (LCP)?
• A high-efficiency cooling method used for thermal management of power electronics.
• It uses a liquid coolant (water, glycol, or dielectric fluid) to absorb and dissipate heat.
• Commonly used in IGBT cooling, EV batteries, data centers, aerospace applications.

 Liquid cooling is just like forced convection in that fluid

is forced through the system by an external source like a
pump.
 There are various methods of construction which can be
used on liquid cold plates to minimize the strain of the
pump and still achieve the required thermal
performance.
 Our team worked with Incresol Engineering Solutions
Private Limited to find the alternative method of
construction in an effort to find the minimal cost that still
meets the required performance.

Ganesh Karthik L M Manjunatha Punith A 8

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering

Basic Working Principle:

 Heat-generating components (e.g., IGBTs, processors, or power modules) are mounted on a metal cold plate
 A coolant circulates through internal channels, absorbing heat from components
 The heated coolant is pumped to a heat exchanger (radiator) where heat is dissipated
 The cooled liquid returns to the cold plate, ensuring continuous cooling

Advantages of Liquid Cold Plates:

 Superior Heat Dissipation – More efficient than air cooling
 Compact & Lightweight – Saves space compared to traditional heat sinks
 Improved Reliability – Extends the lifespan of electronic components
 Scalability – Can be customized for high-power applications

Ganesh Karthik L M Manjunatha Punith A 9

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering

Ganesh Karthik L M Manjunatha Punith A 10

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering

Cooling Heat Cooling

Complexity Best Applications
Method Dissipation Mechanism
Efficiency
Air Cooling
Uses airflow to Low-power electronics,
(Fans & Heat Low Simple
dissipate heat PCs
Sinks)
Uses phase
Heat Pipes Moderate change to Moderate Laptops, LED cooling
transfer heat

Coolant absorbs
Liquid Cold IGBT modules, EVs,
High & transports Moderate
Plate (LCP) power electronics
heat away

Uses
Phase Change Aerospace, extreme
Very High refrigerants & Complex
Cooling cooling applications
phase transitions

Ganesh Karthik L M Manjunatha Punith A 11

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Why is LCP Better?
1 Higher Heat Dissipation Efficiency
✅ LCP outperforms air cooling because liquids have a much higher heat capacity than air.
✅ It can handle high heat loads in power electronics without overheating.
2 Compact & Lightweight
✅ Compared to large heat sinks & fans, LCP systems can be designed more compactly.
✅ Ideal for space-constrained applications like EVs & high-performance computing.
3 Improved Reliability & Longevity
✅ Minimizes thermal stress, preventing component failure.
✅ Unlike fans, LCP has no moving parts in direct contact with heat-sensitive electronics,
reducing wear & tear.

Ganesh Karthik L M Manjunatha Punith A 12

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering

Key Takeaways – Why Choose LCP?

✅ More efficient than air cooling – Handles higher power densities.
✅ Better than heat pipes – No performance drop over time.
✅ More practical than phase-change cooling – Easier to implement & maintain.
✅ Ideal for high-power applications – Used in EVs, aerospace, power electronics, etc.,

Liquid Cold Plate (LCP) offers

the best balance of performance,
reliability, and efficiency for
cooling high power components.

Ganesh Karthik L M Manjunatha Punith A 13

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Our Mapping Work

Ganesh Karthik L M Manjunatha Punith A 14

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Our Mapping Work

Ganesh Karthik L M Manjunatha Punith A 15

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering

Literature survey &

Parameter Collection 3D modeling Simulation & Testing

1 2 3 4 5
Preliminary Design Model Refinement

Ganesh Karthik L M Manjunatha Punith A 16

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Literature Survey
Background & Importance
 IGBT (Insulated Gate Bipolar Transistor) is a critical component in electric & hybrid
vehicles, used in power electronics.
 Increasing power rating & miniaturization leads to higher heat flux, demanding efficient
cooling solutions.
Traditional Cooling Methods
 Air Cooling: Simple but inefficient for high-power applications (limited to 50 W/cm²).
 Microchannel Cooling: Provides higher cooling capacity (~120 W/cm²) but struggles with
clogging & erosion.
 Jet Impingement Cooling: Offers localized cooling, but temperature uniformity is a
challenge.
Advanced Cooling Strategies : Vapour Chamber Cooling (Phase Change Cooling)
 Replaces copper baseplate with a lightweight vapour chamber.
 Direct phase change cooling enhances heat dissipation & temperature uniformity.
 Removes high thermal resistance layers (thermal grease, baseplate).
 Results: 34.6% lower junction temperature, 76.6% better temperature uniformity,
and 41.6% reduced thermal resistance.
Ganesh Karthik L M Manjunatha Punith A 17
1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Gap Analysis & Objectives
Identified Gaps in Literature
 Air Cooling: Inadequate for high heat flux (>1500 W).
 Jet Impingement: Non-uniform cooling away from the jet center.
 3D Printed Cooling Systems: Limited due to sub-millimeter fabrication constraints.
Objectives of the Study
To design, develop, and evaluate a Liquid Cold Plate (LCP) cooling system for IGBT modules,
optimizing thermal performance by enhancing heat dissipation, temperature uniformity,
and system reliability
Key Metrics for Evaluation:
 Temperature Distribution
 Junction Temperature & Uniformity
 Thermal Resistance Reduction
Expected Benefits:
 34.6% Reduction in Junction Temperature
 76.6% Improvement in Temperature Uniformity
 41.6% Reduction in Thermal Resistance

Ganesh Karthik L M Manjunatha Punith A 18

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering

Property Water Glycol 30 (30% Ethylene Glycol 50 (50% Ethylene

Glycol) Glycol)
Boiling Point 100°C ~108-112°C ~108-112°C
Freezing Point 0°C ~-7°C ~-12°C
Density (at 25°C) 1.00 g/cm³ 1.05 g/cm³ 1.07 g/cm³
Viscosity (at 20°C) 0.001 N-s/m2 0.0025-0.0035 N-s/m2 0.0035-0.0045 N-s/m2
Thermal Conductivity 0.606 W/m·K 0.27-0.30 W/m·K 0.27-0.30 W/m·K
Specific Heat 4.18 J/g·K ~2.4-2.7 J/g·K ~2.4-2.7 J/g·K
Surface Tension 72.8 N/m ~45-50 N/m ~45-50 N/m
Flash Point Not applicable (non- 111°C 111°C
flammable)
Corrosivity Non-corrosive Mildly corrosive (without Mildly corrosive (without
inhibitors) inhibitors)
Electrical Conductivity Insulator Moderate (depending on Moderate (depending on
concentration) concentration)

Ganesh Karthik L M Manjunatha Punith A 19

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP
Parameter for model 1
Parameters Value

Dimension Of LCP 95mm(L), 62mm(W), 20mm(H)

LCP Material Aluminium 6061 T6
Working Fluid Glycol 50
Number Of Ribs 4 no’s
Dimension Of Ribs 87mm(L), 6mm(W), 12mm(H)
Distance between the ribs 26.2
Inlet and outlet channels 1 and 1 no’s
Sheet metal 163mm(L), 130mm(W), 4mm(H)
Direction of flow One way flow

Ganesh Karthik L M Manjunatha Punith A 20

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP

Ganesh Karthik L M Manjunatha Punith A 21

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP
Parameter for model 2
Parameters Value

Dimension Of LCP 95mm(L), 62mm(W), 20mm(H)

LCP Material Aluminium 6061 T6
Working Fluid Glycol 50
Number Of Ribs 4 no’s
Dimension Of Ribs 82mm(L), 6mm(W), 12mm(H)
Distance between the ribs 26.2
Inlet and outlet channels 1 and 1 no’s
Sheet metal 163mm(L), 130mm(W), 4mm(H)
Direction of flow One way flow

Ganesh Karthik L M Manjunatha Punith A 22

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP

Ganesh Karthik L M Manjunatha Punith A 23

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP
Parameter for model 3

Parameters Value
Dimension of LCP 460mm(L), 290mm(W), 25mm(H)
LCP material Aluminium 6061 T6
Working fluid Glycol 50
Direction of flow One Way Flow

Ganesh Karthik L M Manjunatha Punith A 24

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP

Ganesh Karthik L M Manjunatha Punith A 25

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP
Parameter for model 4

Parameters Value
Dimension of LCP 460mm(L), 290mm(W), 25mm(H)
LCP material Aluminium 6061 T6
Working fluid Glycol 30
Direction of flow One Way Flow

Ganesh Karthik L M Manjunatha Punith A 26

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP

Ganesh Karthik L M Manjunatha Punith A 27

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP
Parameter for model 5

Parameters Value
Dimension of LCP 460mm(L), 290mm(W), 25mm(H)
LCP material Aluminium 6061 T6
Working fluid Water
Direction of flow One Way Flow

Ganesh Karthik L M Manjunatha Punith A 28

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP

Ganesh Karthik L M Manjunatha Punith A 29

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP
Parameter for model 6

Parameters Value
Dimension of LCP 460mm(L), 290mm(W), 25mm(H)
LCP material Aluminium 6061 T6
Working fluid Glycol 50
Direction of flow One Way Flow

Ganesh Karthik L M Manjunatha Punith A 30

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Designing of LCP

Ganesh Karthik L M Manjunatha Punith A 31

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation

Boundary Conditions
Boundary conditions Value
Ambient temperature 55 0C
Operating temperature 85 0C
Mass flow rate 0.33 kg/sec
Coolant temperature 55 0C
Maximum power
dissipation 15000 W
Constant pressure 2 bar

Ganesh Karthik L M Manjunatha Punith A 32

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation of LCP
Software utilized: ANSYS workbench 2022 R1

Importing CAD Models Result Analysis

Meshing
Comparison of Models

Defining Material Properties Fluid Dynamics Analysis

Boundary Conditions Thermal Analysis

Ganesh Karthik L M Manjunatha Punith A 33

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation of LCP
Boundary conditions for analysis 1
Boundary conditions Value
Ambient temperature 250C
Operating temperature 300C
Mass flow rate 0.42 kg/sec
Coolant temperature 30 0C
Maximum power dissipation 500 W
Constant pressure 2 bar

Ganesh Karthik L M Manjunatha Punith A 34

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 1

Ganesh Karthik L M Manjunatha Punith A 35

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 1

Ganesh Karthik L M Manjunatha Punith A 36

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 1

Ganesh Karthik L M Manjunatha Punith A 37

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 1

Ganesh Karthik L M Manjunatha Punith A 38

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation of LCP
Boundary conditions for analysis 2
Boundary conditions Value
Ambient temperature 250C
Operating temperature 300C
Mass flow rate 0.42 kg/sec
Coolant temperature 30 0C
Maximum power dissipation 500 W
Constant pressure 2 bar

Ganesh Karthik L M Manjunatha Punith A 39

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation of LCP
Boundary conditions for analysis 1
Boundary conditions Value
Ambient temperature 250C
Operating temperature 300C
Mass flow rate 0.42 kg/sec
Coolant temperature 30 0C
Maximum power dissipation 500 W
Constant pressure 2 bar

Ganesh Karthik L M Manjunatha Punith A 40

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 2

Ganesh Karthik L M Manjunatha Punith A 41

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 2

Ganesh Karthik L M Manjunatha Punith A 42

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 2

Ganesh Karthik L M Manjunatha Punith A 43

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 2

Ganesh Karthik L M Manjunatha Punith A 44

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation of LCP
Boundary conditions for analysis 3
Boundary conditions Value
Ambient temperature 550C
Operating temperature 850C
Mass flow rate 0.33 kg/sec
Coolant temperature 600C
Maximum power dissipation 15000 W
Constant pressure 2 bar

Ganesh Karthik L M Manjunatha Punith A 45

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 3

Ganesh Karthik L M Manjunatha Punith A 46

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 3

Ganesh Karthik L M Manjunatha Punith A 47

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 3

Ganesh Karthik L M Manjunatha Punith A 48

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation of LCP
Boundary conditions for analysis 4, 5 & 6
Boundary conditions Value
Ambient temperature 250C
Operating temperature 300C
Mass flow rate 0.42 kg/sec
Coolant temperature 30 0C
Maximum power dissipation 500 W
Constant pressure 2 bar

Ganesh Karthik L M Manjunatha Punith A 49

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 4

Ganesh Karthik L M Manjunatha Punith A 50

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 4

Ganesh Karthik L M Manjunatha Punith A 51

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 4

Ganesh Karthik L M Manjunatha Punith A 52

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 5

Ganesh Karthik L M Manjunatha Punith A 53

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 5

Ganesh Karthik L M Manjunatha Punith A 54

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 5

Ganesh Karthik L M Manjunatha Punith A 55

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 6

Ganesh Karthik L M Manjunatha Punith A 56

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 6

Ganesh Karthik L M Manjunatha Punith A 57

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Simulation results of LCP 6

Ganesh Karthik L M Manjunatha Punith A 58

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Parameter Analysis
 Temperature Distribution / Power Input
Standard model
Model 2
Model 3
Model 5

Improved model
Model 1
Model 4
Model 6

Ganesh Karthik L M Manjunatha Punith A 59

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Parameter Analysis
 Temperature Distribution / Flow rate
Standard model
Model 2
Model 3
Model 5

Improved model
Model 1
Model 4
Model 6

Ganesh Karthik L M Manjunatha Punith A 60

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Parameter Analysis
Temperature distribution / Coolant Mixture
Standard model
Model 2
Model 3
Model 5

Improved model
Model 1
Model 4
Model 6

Ganesh Karthik L M Manjunatha Punith A 61

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Results and Conclusion

Comparison of Model 1 and Model 2:

Model 1
 As Model 1 has uniform temperature distribution . Model 1 with a maximum
temperature lower than model 2.
 Exhibited a higher heat transfer coefficient, indicating better thermal performance.
 Had a slightly higher pressure drop, which could lead to increased energy
consumption for the cooling pump.

Model 2
 Model 2 has a higher maximum temperature and less uniform temperature
distribution.
 Showed a lower heat transfer coefficient, indicating less efficient heat removal.
Exhibited a lower pressure drop, which could be beneficial for energy efficiency.

Ganesh Karthik L M Manjunatha Punith A 62

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Results and Conclusion

Comparison of Model 3 and Model 4:

Model 3
 It Had a higher maximum temperature and medium uniform temperature distribution.
 Showed a lower heat transfer coefficient, indicating less efficient heat removal.
 Model 3 Exhibited a lower pressure drop, which could be beneficial for energy efficiency .

Model 4
 Model 4 has a higher maximum temperature and medium uniform temperature distribution
with Glycol 50 as coolant
 Showed a lower heat transfer coefficient, indicating less efficient heat removal.
 Exhibited a lower pressure drop, which could be beneficial for energy efficiency.
 Results Indicate that model 4 is more heat efficient than model 3 suggesting an optimized
cooling channel design enhances performance even with two side cooling.

Ganesh Karthik L M Manjunatha Punith A 63

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Results and Conclusion

Comparison of Model 5 and Model 6:

Model 5
 This has a higher maximum temperature as and medium uniform temperature distribution
with water as coolant.
 Showed a lower heat transfer coefficient, indicating less efficient heat removal.
 Model 5 Exhibited a lower pressure drop, which could be beneficial for energy efficiency.

Model 6
 Had a higher maximum temperature and medium uniform temperature distribution with
Glycol 30 as coolant
 Showed a lower heat transfer coefficient, indicating less efficient heat removal.
 Exhibited a lower pressure drop, which could be beneficial for energy efficiency
 As a result, model 6 is More efficient Than model 5

Ganesh Karthik L M Manjunatha Punith A 64

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Results and Conclusion

 Objective: To develop and optimize an LCP based cooling system for IGBT
modules to enhance thermal performance and reliability.
 Design & Simulation: Utilized Solid Works & ANSYS Workbench for CFD
simulations, optimizing coolant flow, temperature distribution and heat
dissipation.
 Findings & Results:
 LCP significantly reduces junction temperature and enhances IGBT
longitivity.
 Two-sided cooling design offers better heat dissipation than traditional air
cooling.
 Conclusion: LCP cooling is a game-changer for high-power electronics,
paving the way for higher efficiency, reliability and sustainability in power
electronics applications.

Ganesh Karthik L M Manjunatha Punith A 65

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering
Scope of future work
Enhanced Heat Dissipation in IGBTs
Next-Gen Cooling Technologies
Nanotechnology in Cooling
Smart & Adaptive Cooling Systems
Additive Manufacturing for Cooling Solutions
Cost-Effective & Scalable Solutions

Ganesh Karthik L M Manjunatha Punith A 66

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044
 BANGALORE INSTITUTE OF TECHNOLOGY
Department Of Mechanical Engineering

Ganesh Karthik L M Manjunatha Punith A 67

1BI21ME019 1BI21ME028 1BI21ME033 1BI21ME044