SOLDERING TECHNIQUES

AIM: To learn basic of soldering.

OBJECTİVES:
To understand soldering concept.
To learn Soldering Techniques.
To demonstrate soldering process.
To list advantage and limitations of hand soldering.

APPARATUS:
Soldering Iron (Temp. controlled & simple), Solder Wire, Flux, Sponge, Desoldering Pump,
Tweezers.

THEORY:
INTRODUCTION:-
I. Soldering Concepts
A. Solder is used to hold two (or more) conductors in electrical contact with each other.
B. Solder is not used to make the electrical contact.
C. Solder is not used to provide the main mechanical support for a joint.
D. Solder is used to encapsulate a joint, prevent oxidation of the joint, and provide minor
mechanical support for a connection.
In other words-
Soldering is the process of joining two metals together by the use of a solder alloy and its one of
the oldest known joining techniques. Or
Soldering is the process of joining two metals together to form an electrically and mechanically
secure bond using heat and a third metal alloy known as solder.
II Soldering Irons and Accessories
A. Soldering Iron Types
1. Temperature-controlled Iron: A soldering iron with electronic temperature control is highly
recommended. Irons without temperature control can reach temperatures that are high enough to
irreversibly damage the tips. Since temperature is not proportional to wattage with this type of
iron, the wattage rating is relatively unimportant. A higher wattage iron results in a faster
temperature recovery time between soldering operations (40 W to 60 W units seem to work
well). See Figure 1.

Figure 1: Temperature Controlled Soldering Iron

2. Non-temperature-controlled iron: A low wattage (10 W to 25 W) pencil-type (not gun-type)
can be used but is not recommended. This type of iron must be unplugged when not in use to
save the tips. The temperature is proportional to wattage and most of these types of soldering
irons will reach temperatures that can destroy tips quickly.

Figure.2 Non-Temperature Controlled Iron

3. Modified, non-temperature-controlled iron: A 10 W to 40 W pencil-type iron can be
operated from a variac to limit the wattage (and therefore the temperature) and is a reasonable
substitute for a temperature-controlled iron. However, a variac can cost more than a temperature
controlled station and will yield less satisfactory results.
B. Sponge: A sponge is required for keeping tips clean for best heat transfer. A clean soldering
iron tip is one of the most important steps towards producing good solder joints. Most soldering
stations come with sponges and sponge holders.
C. Tips: Currently, most tips sold for electronics work are iron-clad copper and have long life
spans. Iron-clad tips cannot be filed or sanded when they become oxidized; they must be
replaced. Many tip shapes are available, but miniature needle or chisel point tips are best for
most work. The tip shape should be chosen to provide the highest contact surface area for best
heat conduction. Minimizing the shank length can increase the heat transfer from the iron
(heater) to the tip. Copper tips can still be purchased but are not recommended because of their
short life span and poor wetting properties.
III. Solder and Flux
A.Flux
1. Flux is used to prepare the surfaces of the conductors prior to soldering. Flux removes
oxidation from the conductors and maintains oxide-free surfaces at elevated temperature during
the soldering process. This allows all surfaces to “wet” properly.
2. The most common flux used in hand soldering of electronic components is rosin, a
combination of mild organic acids extracted from pine trees (some manufacturers use synthetic
compounds).
3. Although fluxes can be obtained in liquid or paste form, they are typically contained in solders
(rosin core) used for hand assembly of electronics. Fluxes labeled as “Acid” are strong acids (as
opposed to the mild rosins) and should never be used for electronics assembly.
B. Solder
1. Rosin core. 60/40 Sn/Pb (M.P. 361-376°F) and 63/37 Sn/Pb (M.P. 361°F) solders are the most
common types used for electronics assembly. These solders are available in various diameters
and small diameters are most appropriate for small electronics work (0.02” - 0.05” dia. is
recommended). See Figure 3.

Figure 3. Acceptable solder types (60/40 and

63/37).
2.Lead-free. Lead-free solders are used as more environmental-friendly substitutes for leaded
solder, but they are typically not as easy to use mainly because of their higher melting point and
poorer wetting properties.
3. Silver. Silver solders are typically used for low resistance connections but they have a higher
melting point and are more expensive than Sn/Pb solders.
4. Acid-core. NEVER USE ACID CORE SOLDERS FOR ELECTRONICS! They are intended
for plumbing or non-electronics assembly work. The acid-core flux will cause corrosion of
circuitry and can damage components.
5. Other Specialty Solders:
a. Various melting point eutectics. These specialty solders are typically used for non-
electronics assembly of difficult to construct mechanical items that must be assembled in
a particular sequence.
b. Paste solders. These solders are used in field applications or in specialized
manufacturing applications.

IV. Preparation for Soldering

A. Warm-up. Allow the soldering iron to reach adequate temperature. The recommended
temperature setting is between 600 and 750° F. Some tips may have recommended
operating temperatures that should be observed.
B. Clean Tip. A clean tip promotes heat transfer and helps to prevent unwanted “solder
bridges” from forming. A heavily oxidized tip will make it impossible to solder properly.
The steps to maintain clean tips are as follows:
1. Moisten sponge.
2. Wipe tip on sponge.
3. “Wet” tip with solder – just enough for a very thin coating.
4. Repeat if necessary to obtain a clean, shiny tip surface. Also, repeat between
each solder operation to maintain a clean tip (Figure 4)

Figure 4. A properly cleaned and “wetted” soldering iron tip

C. Prepare surfaces to be soldered
1. If soldering to a bare copper (non-pretinned) printed circuit board (PCB), the copper should be
cleaned using fine steel wool or other fine abrasive. All oils and remaining abrasives should be
removed with light soap and water followed by an alcohol rinse. The copper should have a
bright, shiny appearance prior to soldering.
2. If soldering to magnet wire or other wire with a varnish insulation or with oxidized surfaces,
fine grit sandpaper can be used to prepare the surfaces to be soldered.
Components are then soldered to the board as shown:
a. The soldering iron tip should be placed in contact with both the trace (foil) and the lead. The
two should be heated only enough to melt solder in order to avoid damaging sensitive
components and to avoid delamination of the PCB traces.
b. Solder is then touched to the area and allowed to flow freely around the lead and to cover the
solder pad. A minimal amount of solder should be applied. Only enough solder to cover the joint
and to form a smooth fillet should be used.
c. The iron should be removed after the solder has flowed properly and wetted all surfaces. The
component and the board should not be moved until the solder has hardened (up to several
seconds, depending on the lead and trace size).

Figure 5. Steps for soldering components to a PCB.

Solder joints should be inspected when completed to determine if they have been properly made:
a. Qualities of good solder joints (See Figure 6):
1. Shiny surface.
2. Good, smooth fillet.

Figure 6.A good solder Joint

b. Qualities of poor solder joints
1. Dull or crystallized surfaces - This is an indicator of a cold solder joint. Cold solder joints
result from moving the components after the soldering iron has been removed but before the
solder has hardened. Cold solder joints may work at first but will eventually fail.
2. Air pockets-Air pockets (voids) result from incomplete wetting of surfaces, allowing air to be
in contact with the connecting metals. This will cause oxidation of the joint and eventual failure.
Blowholes can occur due to vaporization of moisture on the surface of the board and exiting
through the molten solder. Boards should be clean and dry prior to soldering. Ethanol (100%)
can be used as a moisture chaser if boards are wet prior to soldering.
3. Dimples-Dimples in the surface do not always indicate a serious problem, but they should be
avoided since they are precursors to voids.
4. Floaters. Black spots “floating” in the solder fillet should be avoided because they indicate
contamination and a potential for failure as in the case of voids. These black spots usually result
from overheated (burnt) rosin or other contaminants such as burnt wire insulation. Maintaining a
clean tip will help to avoid these problems.
5. Balls. A solder ball, instead of a fillet, can occur if the trace was heated but the lead was not
(or vice-versa). This prevents proper wetting of both surfaces and results in solder being attached
to only one surface (component or trace).
6. Excess Solder. Excess solder usage can cover up other potential problems and should be
avoided. It can also lead to solder bridges. In addition, spherical solder joints can result from the
application of too much solder.

THE ADVANTAGE OF SOLDERING

Soldering is the process of connecting two pieces of metal together to form a reliable electrical
path. But why solder them in the first place? They can also be put together with nuts & bolts, or
with staples, rivets, or with some other kind of mechanical fasting. These methods, though
present two important problems. First, we can't be assured that good contact will exist between
two surfaces to begin with, and that vibration or other mechanical shocks won't, later, work the
joint loose. Second, oxidation or corrosion will be continuously occurring on the metal surfaces.
This will progressively decrease the electrical connection between the two A soldering
connection does away these two problems. There is no
movement in that joint and no interfacing surfaces to oxidize. A continuous conductive path is
formed from one end to other.

PROCEDURE:-
1) Switch on the soldering iron.
2) Clean the joints, which are required to be soldered.
3) Tin the joint with the solder.
4) Take sufficient solder on the tip of the soldering iron.
5) Apply it to the joint to be soldered.
6) Remove the soldering iron when the soldering is confirmed.
PRECAUTIONS:
1) Don't touch the hot parts of soldering iron.
2) Don't do the excessive heating of component leads.
3) Keep a hot tip of soldering iron away from electrical wiring

CONCLUSION:

Post-Lab Assignment:
1.Define Soldering.
2.List advantage and limitations of hand soldering.
3.List different soldering techniques.