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13 views76 pages

fda803u

Uploaded by

Ahmet
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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FDA803U

1 x 45 W class D digital input automotive power amplifier with diagnostics,


wide voltage operation range for car audio and telematic
Datasheet - production data

Description
The FDA803U is a single bridge class D amplifier,
designed in the most advanced BCD technology,
intended for any automotive audio application (car
3RZHU662 6OXJXS *$'*36 radio, telematics and e-call, noise and tone
generators, etc).
Features The FDA803U integrates a high performance D/A
converter together with powerful MOSFET
 AEC-Q100 qualified
outputs in class D, so it is very compact and
 Integrated 108 dB D/A conversion powerful, moreover it reaches outstanding
 I2S and TDM digital input (4/8/16CH TDM) efficiency performances (90%).
 Input sampling frequency: 44.1 kHz, 48 kHz, It has a very wide operating range: it can be
96 kHz, 192 kHz operated both with standard car battery levels
 Full I2C bus driving (3.3/1.8 V) (5.5-18 V operating, compatible to load dump
 CISPR 25 - Class V (Fourth edition) pulse) and with external step-down generated
 Very low quiescent current voltages or emergency battery (since it is
compatible to minimum 3.3 V operative).
 Output lowpass filter included in the feedback
allowing outstanding audio performances The feedback loop includes the output L-C low-
 Wide operating supply range from 3.3 to 18 V, pass filter, allowing superior frequency response
suitable for car radio, telematics and e-call linearity and lower distortion.
 MOSFET power outputs allowing high output FDA803U is configurable through I2C bus
power capability interface and integrates a complete diagnostics
– 1 x 25 W /4 Ω @ 14.4 V, 1 kHz THD = 1% array specially intended for automotive
– 1 x 30 W /4 Ω @ 14.4 V, 1 kHz THD = 10% applications including innovative open load and
 2 Ω loads driving DC offset detection in play mode.
 Power limiting function (configurable through I2C) Thanks to the solutions implemented to solve the
 I2C bus diagnostics: EMI problems, the device is intended to be used
– Short to VCC/GND in the standard single DIN car-radio box together
– Short load and open load detection (also in with the tuner.
play mode) Moreover FDA803U features a configurable
– Four thermal warnings power limiting function, and can be optionally
 DC offset detector (also in play) and 'hot spot' operated under no I2C mode ('legacy mode').
detection
 Clipping detector Table 1. Device summary
 Integrated thermal protection Order code Package Packing
 Legacy mode ('no I2C' mode), 4 configurable FDA803U-KBT Tape & reel
PowerSSO-36
settings
FDA803U-KBX (Slug-up) Tube
 Short circuit and ESD integrated protections
 Package: PowerSSO-36 exposed pad up

July 2019 DS12497 Rev 2 1/76


This is information on a product in full production. www.st.com
Contents FDA803U

Contents

1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2 Pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3 Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.4 Typical curves of the main electrical parameters . . . . . . . . . . . . . . . . . . . 16

5 General information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1 LC filter design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.2 Load possibilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

6 Finite state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23


6.1 Device state and address selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6.2 Standby state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.3 Diagnostic Vcc-Gnd state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.4 ECO-mode state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.5 MUTE-PLAY and diagnostic states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6.6 Operation compatibility vs battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7 Muting function architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28


7.1 Command dependence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.2 Analog-Mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.3 Digital-Mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.4 Mixed mute advantages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

8 Hardware mute pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

9 Power limiter function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33


9.1 Power limiter control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

2/76 DS12497 Rev 2


FDA803U Contents

10 Diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
10.1 DC diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
10.1.1 Diagnostic control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
10.1.2 Relation with short circuit protection activation . . . . . . . . . . . . . . . . . . . 36
10.1.3 Load range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
10.2 Short to Vcc / GND diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
10.3 Diagnostic time-line diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
10.4 Open load in play detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
10.4.1 Open load in play detector operation overview . . . . . . . . . . . . . . . . . . . 40
10.4.2 Processing bandwidth range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
10.4.3 Audio signal evaluation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
10.4.4 Impedance threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
10.4.5 I2C control and timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
10.5 Input offset detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
10.6 Output voltage offset detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
10.7 Output current offset detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
10.7.1 Output current offset detector operation principle . . . . . . . . . . . . . . . . . 44
10.7.2 Result communication and I2C control . . . . . . . . . . . . . . . . . . . . . . . . . 44
10.7.3 Hot spot detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
10.8 PWM pulse skipping detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
10.9 Thermal protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
10.10 Watch-dog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
10.11 Error frame check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

11 Additional features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.1 AM operation mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.2 Noise gating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
11.3 Dither PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

12 I2S bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50


12.1 I2S standard mode description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
12.2 TDM 4CH mode description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
12.3 TDM 8CH mode description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
12.4 TDM 16CH mode description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
12.5 Timing requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

DS12497 Rev 2 3/76


4
Contents FDA803U

12.6 Group delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

13 I2C bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56


13.1 Writing procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
13.2 Reading procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
13.3 Data validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
13.4 Start and stop conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
13.5 Byte format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
13.6 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
13.7 I2C timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
13.8 I2S, I2C and Enable relationship . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

14 I2C register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
14.1 Instruction bytes- “I00xxxxx” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
14.2 Data bytes - “I01xxxxx” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

15 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
15.1 PowerSSO-36 (slug-up) package information . . . . . . . . . . . . . . . . . . . . . 72
15.2 PowerSSO-36 (slug up) marking information . . . . . . . . . . . . . . . . . . . . . . 74

16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

4/76 DS12497 Rev 2


FDA803U List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1


Table 2. Pins list function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 5. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6. Operation mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 7. Command dependence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 8. Power limiter function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 9. Open load in play detector impedance and validity thresholds. . . . . . . . . . . . . . . . . . . . . . 41
Table 10. I2S Interface timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 11. Group delay dependency from input sampling frequency. . . . . . . . . . . . . . . . . . . . . . . . . . 55
Table 12. I2C bus interface timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Table 13. IB0-ADDR: “I0000000” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 14. IB1-ADDR: “I0000001” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Table 15. IB2-ADDR: “I0000010” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 16. IB3-ADDR: “I0000011” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 17. IB4-ADDR: “I0000100” - CDDiag pin configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 18. IB5-ADDR: “I0000101” - CDDiag pin configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 19. IB6-ADDR: “I0000110” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 20. IB7-ADDR: “I0000111” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 21. IB8-ADDR: “I0001000” - CHANNEL CONTROLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 22. IB9-ADDR: “I0001001” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 23. IB10-ADDR: “I0001010” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 24. IB11-ADDR: “I0001011” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table 25. IB12-ADDR: “I0001100” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table 26. IB13-ADDR: “I0001101” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 27. IB14-ADDR: “I0001110” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 28. DB0-ADDR: “I0100000” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 29. DB1-ADDR: “I0100001” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 30. DB2-ADDR:"I0100010" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 31. DB3-ADDR: “I0100011” DC Diagnostic Error code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Table 32. DB6-ADDR:"I0100110" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Table 33. PowerSSO-36 (slug-up) package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 34. Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

DS12497 Rev 2 5/76


5
List of figures FDA803U

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8


Figure 2. Pins connection diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 3. Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 4. Efficiency and power dissipation (Vs = 14.4 V, RL = 1 x 4 Ω, f = 1 kHz sine wave) . . . . . . 16
Figure 5. Efficiency and power dissipation (Vs = 14.4 V, RL = 1 x 4 Ω, pink noise) . . . . . . . . . . . . . . 16
Figure 6. Efficiency and power dissipation (Vs = 14.4 V, RL = 1 x 2 Ω, f = 1 kHz sine wave) . . . . . . 16
Figure 7. Efficiency and power dissipation (Vs = 14.4 V, RL = 1 x 2 Ω, pink noise) . . . . . . . . . . . . . . 16
Figure 8. Efficiency and power dissipation (Vs = 14.4 V, RL = 1 x 8 Ω, f = 1 kHz sine wave) . . . . . . 16
Figure 9. Efficiency and power dissipation (Vs = 14.4 V, RL = 1 x 8 Ω, pink noise) . . . . . . . . . . . . . . 16
Figure 10. Efficiency and power dissipation (Vs = 18 V, RL = 1 x 4 Ω, f = 1 kHz sine wave) . . . . . . . . 17
Figure 11. Efficiency and power dissipation (Vs = 18 V, RL = 1 x 4 Ω, pink noise) . . . . . . . . . . . . . . . 17
Figure 12. Efficiency and power dissipation (Vs = 16 V, RL = 1 x 2 Ω, f = 1 kHz sine wave) . . . . . . . 17
Figure 13. Efficiency and power dissipation (Vs = 16 V, RL = 1 x 2 Ω, pink noise) . . . . . . . . . . . . . . . 17
Figure 14. Efficiency and power dissipation (Vs = 18 V, RL = 1 x 8 Ω, f = 1 kHz sine wave) . . . . . . . . 17
Figure 15. Efficiency and power dissipation (Vs = 18 V, RL = 1 x 8 Ω, pink noise) . . . . . . . . . . . . . . . 17
Figure 16. Efficiency and power dissipation (Vs = 3.3 V, RL = 1 x 4 Ω, f = 1 kHz sine wave) . . . . . . . 18
Figure 17. Efficiency and power dissipation (Vs = 3.3 V, RL = 1 x 4 Ω, pink noise) . . . . . . . . . . . . . . . 18
Figure 18. Efficiency and power dissipation (Vs = 3.3 V, RL = 1 x 2 Ω, f = 1 kHz sine wave) . . . . . . . 18
Figure 19. Efficiency and power dissipation (Vs = 3.3 V, RL = 1 x 2 Ω, pink noise) . . . . . . . . . . . . . . . 18
Figure 20. Efficiency and power dissipation (Vs = 3.3 V, RL = 1 x 8 Ω, f = 1 kHz sine wave) . . . . . . . 18
Figure 21. Efficiency and power dissipation (Vs = 3.3 V, RL = 1 x 8 Ω, pink noise) . . . . . . . . . . . . . . . 18
Figure 22. Output power vs. supply voltage (RL = 4 Ω, sine wave) . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 23. Output power vs. supply voltage (RL = 2 Ω, sine wave) . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 24. Output power vs. supply voltage (RL = 8 Ω, sine wave) . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 25. THD vs. output power (VS = 14.4 V, RL = 4 Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 26. THD vs. output power (VS = 14.4 V, RL = 2 Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 27. THD vs. output power (VS = 14.4 V, RL = 8 Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 28. THD vs. frequency (VS = 14.4 V, RL = 4 Ω, PO = 1 W). . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 29. THD vs. frequency (VS = 14.4 V, RL = 2 Ω, PO = 1 W). . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 30. THD vs. frequency (VS = 14.4 V, RL = 8 Ω, PO = 1 W). . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 31. Frequency response (1 W, RL = 4 Ω, f = 1 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 32. Frequency response (1 W, RL = 2 Ω, f = 1 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 33. Frequency response (1 W, RL = 8 Ω, f = 1 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 34. PSRR vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 35. Quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 36. Dynamic range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 37. FFT - Output spectrum (-60 dBFS input signal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 38. Finite state machine diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 39. Operation vs. battery charge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 40. Analog-Mute diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 41. Digital-Mute diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 42. Mixed mute diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 43. Analog-Mute vs. Mixed-Mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 44. HWMute pin schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 45. Response obtained with a limitation corresponding to 80% of the full-scale . . . . . . . . . . . 34
Figure 46. Load range detection configured properly setting IB5 d7-d6 . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 47. DC diagnostic before turn on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 48. Short to VCC at device turn on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

6/76 DS12497 Rev 2


FDA803U List of figures

Figure 49. DC Diagnostic in Mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38


Figure 50. Short circuit protection activation - Short to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 51. Short Circuit Protection activation due to short across load, short to Vcc/Gnd not present 39
Figure 52. Open load in play detector guaranteed thresholds with standard gain setting . . . . . . . . . . 41
Figure 53. Open load in play detector guaranteed thresholds with low gain setting . . . . . . . . . . . . . . 41
Figure 54. Open load in play detector timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 55. Output voltage offset detector operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 56. Current offset measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 57. Hot spot detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 58. PWM pulse skipping detector operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 59. Thermal attenuation curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 60. PWM switching frequency selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 61. LRF effect on PWM output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 62. Dither PWM effect on output PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 63. I2S standard mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 64. TDM4 mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 65. TDM8 mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 66. TDM16 mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Figure 67. I2S Interface timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figure 68. I2S clock transition timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figure 69. I2C bus protocol description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Figure 70. Reading procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 71. Without/with auto-increment reading procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 72. I2C bus interface timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Figure 73. PowerSSO-36 (slug-up) package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Figure 74. PowerSSO-36 (slug up) marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

DS12497 Rev 2 7/76


7
Block diagram FDA803U

1 Block diagram

Figure 1. Block diagram

'9695

$9695
(QDEOH 
(QDEOH 
(QDEOH 
(QDEOH 

,&GDWD
,&&ON

9&&0
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695

*$3*36

8/76 DS12497 Rev 2


FDA803U Pins description

2 Pins description

Figure 2. Pins connection diagram

*1'3   7$%
9&&3   *1'0
1&   9&&0
2873   2870
2873   2870
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695   '*QG
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$9695   (QDEOH
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*$'*36

Table 2. Pins list function

Pin # Pin name Function

1 TAB Device slug connection


2 GNDM Channel half bridge minus, Power Ground
3 VCCM Channel half bridge minus, Power Supply
4 OUTM Channel half bridge minus, Output
5 OUTM Channel half bridge minus, Output
6 FBM Channel half bridge minus, Feedback
7 NC Not connected
8 DGnd Digital ground
9 DVdd Digital supply
10 Enable1 Enable 1
11 Enable2 Enable 2
12 Enable3 Enable 3
13 Enable4 Enable 4
14 NC Not connected
15 CDDiag Clipping detector and diagnostic output pin

DS12497 Rev 2 9/76


75
Pins description FDA803U

Table 2. Pins list function (continued)

Pin # Pin name Function

16 NC Not connected
17 D1V8SVR Positive digital supply V(SVR)+0.9V (Internally generated)
18 DGSVR Negative digital supply V(SVR)-0.9V (Internally generated)
19 I2Cdata I2C Data
20 I2Cclk I2C Clock
21 I2Stest test pin, left open
22 I2Sdata I2S/TDM data
23 I2Sclk I2S/TDM Clock input
24 I2Sws I2S/TDM Sync input /Word Select input
25 AGnd Analog ground
26 AVdd Analog supply
27 A5VSVR Positive Analog Supply V(SVR)+2.5V (Internally generated)
28 AGSVR Negative Analog Supply V(SVR)-2.5V (Internally generated)
29 SVR Supply Voltage Ripple Rejection Capacitor
30 HWMute Hardware mute pin
31 FBP Channel half bridge plus, Feedback
32 OUTP Channel half bridge plus, Output
33 OUTP Channel half bridge plus, Output
34 NC Not connected
35 VCCP Channel half bridge plus, Power Supply
36 GNDP Channel half bridge plus, Power Ground

10/76 DS12497 Rev 2


FDA803U Application diagram

3 Application diagram

Figure 3. Application diagram

,6B:6  *1'3 
,6:6
,6B6&/  
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9&& 5
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DS12497 Rev 2 11/76


75
Electrical specifications FDA803U

4 Electrical specifications

4.1 Absolute maximum ratings


Table 3. Absolute maximum ratings
Symbol Parameter Value Unit

VCC [VCCP ,VCCM, AVDD, DC supply voltage -0.3 to 28 V


DVDD] Transient supply voltage for t = 100 ms(1) -0.3 to 40 V
GNDmax [DGND, AGND,
Ground pin voltage difference -0.3 to 0.3 V
GNDP, GNDM]
I2Cdata, I2Cclk I2C bus pins voltage -0.3 to 5.5 V
2 2 2 2 2
I Stest, I Sdata, I Sclk, I Sws I S bus pins voltage -0.3 to 5.5 V
Enable1,2,3,4 Enables -0.3 to 5.5 V
HWMute Hardware mute -0.3 to 7 V
CDDiag Clip detection -0.3 to 5.5 V
Io Output current (repetitive f > 10 Hz) Internally limited A
Tamb Ambient operating temperature -40 to 125 °C
Tstg, Tj Storage and junction temperature -55 to 150 °C
ESDHBM ESD protection HBM 2000 V
ESDCDM ESD protection CDM 500 V
1. VCC = 35 V for t < 400 ms as per ISO16750-2 load dump with centralized load dump suppression.

4.2 Thermal data


Table 4. Thermal data
Symbol Parameter Typ Max Unit

Rth j-case Thermal resistance junction-to-case 3.5 5.5 °C/W

12/76 DS12497 Rev 2


FDA803U Electrical specifications

4.3 Electrical characteristics


Vcc = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; I2C defaults, unless otherwise specified. LC
filter: L = 10 μH, C = 3.3 μF. PWM in In-phase modulation, feedback connected after the
filter.

Table 5. Electrical characteristics


Symbol Parameter Test condition Min Typ Max Unit
RL = 4 Ω 3.3 - 18 V
VCC Supply voltage range
RL = 2 Ω 3.3 - 16
Device in Standby - 1 5 μA
IVCC (1)
Quiescent current Device on (MUTE state) - 35 - mA
ECO MODE - 22 - mA
Vos Offset voltage Mute & Play -10 - +10 mV
Digital supply voltage
DVDD - 3.3 - 18 V
range
Analog supply voltage
AVDD - 3.3 - 18 V
range
IB11 D5-4 = 00 9.5 11 12.5 A

Overcurrent IB11 D5-4 = 01 6.7 8 9.3 A


Iop
protection(2) IB11 D5-4 = 10 5 6 7 A
IB11 D5-4 = 11 3 4 5 A
IAVDD Analog current Device on (MUTE state) - 9 20 mA
IDVDD Digital current Device on (MUTE state) - 13 20 mA
- Overvoltage shutdown Attenuation = 0.5 dB(3) 18.5 19.5 20.5 V
Attenuation <0.5 dB
2.7 2.9 3.3 V
Vcc low supply mute Low voltage mode (IB0D0=1)
VlowM
threshold Attenuation <0.5 dB
4.5 4.7 5 V
Standard mode (IB0D0=0)
VhighM Vcc high voltage mute(3) - 18 18.9 20.3 V

Vcc supply UVLO Standard mode (IB0D0=0) 4.4 4.6 4.8 V


UVLOVCC
threshold Low voltage mode (IB0D0=1) 2.55 2.7 2.85 V
Tsh Thermal shutdown - 170 180 190 °C
Thermal protection
Tpl Attenuation = 0.5 dB 150 160 170 °C
junction temperature
Tw1 - - Tpl-5 - °C
Tw2 Thermal warning - - Tpl-15 - °C
Tw3 junction temperature(4) - - Tpl-35 - °C
Tw4 - - Tpl-50 - °C

DS12497 Rev 2 13/76


75
Electrical specifications FDA803U

Table 5. Electrical characteristics (continued)


Symbol Parameter Test condition Min Typ Max Unit

Audio performances
THD = 10 % 28 30 - W
THD = 1 % 22 25 - W
Max power; Vcc = 15.2 V(6) 45 50 - W
Po Output power(5)
RL = 2 Ω THD = 10% (6)
50 55 - W
(6)
RL = 2 Ω THD = 1% 40 45 - W
RL = 2 Ω, max power 76 85 - W
THD = 10% Vcc = 5 V 3.8 - - W
Po Output power(5)
THD = 10% Vcc = 3.3 V 1.6 - - W
Power supply rejection
PSRR f = 1 kHz; Vr = 1Vpk; 70 80 - -
ratio
THD Total harmonic distortion PO = 1 W, f = 1 kHz - 0.01 0.05 %
Standard gain 5.5 5.9 6.3 Vp
Gain at Amplitude = -10 dBFs
Low gain(7) 3.3 3.6 3.9 Vp
DR Dynamic range A-wtd and brickwall 20 kHz filter 102 107.5 - dB
SNR Signal to noise ratio A-wtd and brickwall 20 kHz filter 107 112 - dB
A-wtd and brickwall 20 kHz filter used, no
Eout1 Output noise - 35 55 μV
output signal;
Eout2 Output noise CCIR 468 filtered - 84 130 μV
ITU Pop filter output Standby to Mute and Mute to Standby
ΔVOITU -7.5 - +7.5 mV
voltage transition
Mute
Attenuation <0.5 dB, and digital mute
2.3 - -
Mute pin voltage disabled
VMth(8) V
threshold Attenuation ≥60 dB, and digital mute
- - 1
disabled
IM Mute pin source current - 9 11 13 μA
Mute pin internal clamp
VMcl - 5.5 6 6.5 V
voltage
Peak current flowing in Standby condition, all feedbacks forced to
Ifeed - 110 130 μA
the feedback pins Vcc, output floating
I2C bus interface
fSCL Clock frequency - - - 400 kHz
VIL I2C pins low voltage - - - 0.8 V
VIH I2C pins high voltage - 1.3 - - V
Maximum I2C data pin
VOLMAX low voltage when Isink = 4 mA - 0.12 0.5 V
current Isink is sinked
Maximum input leakage
ILIMAX V = 3.6 V - - 1 μA
current

14/76 DS12497 Rev 2


FDA803U Electrical specifications

Table 5. Electrical characteristics (continued)


Symbol Parameter Test condition Min Typ Max Unit
I2S bus interface
VIL-I2S I2S pins low voltage - - - 0.8 V
IL Input logic current, low VI = 0 V - - 500 nA
VIH-I2S I2S pins high voltage - 1.3 - - V
IH Input logic current, high VI = 3.6 V - - 500 nA
High level output
- @ Iout = 1 mA 1.6 1.75 - V
voltage
- Low level output voltage @ Iout = 1 mA - 0.075 0.2 V
Control pins characteristics
VENL Enable pins low voltage - - - 0.9 V
VENH Enable pins high voltage - 2.4 - - V

Clipping and offset detector

THD @ 100 Hz with average


CDTHD Clip det THD (9) 5 7 9 %
Vclipdet = 2 V - Vpullup = 3.3 V

CDSAT Clip det sat. voltage CD on; ICD = 1 mA - 150 300 mV


CDLK Clip det leakage current CD pin at 3.6 V - - 15 μA
Input DC offset Theshold at which an offset present at inputs
Vofflin - -18 - dB
detection threshold is detected
Output DC offset
Voffout Input high pass filter disable ±1.4 ±2 ±2.6 V
detection threshold(10)
1. Value measured using output coil with following characteristics: core saturation current higher than 10 A, RS at
400 kHz = 145 mΩ.
2. Measured at bench during product validation (values before LC filter). Guaranteed by correlation factor.
3. Parameter values based on bench measurements (guaranteed by correlation with overvoltage shutdown).
4. The thermal warnings are always in tracking.
5. Test correlated to the RdsON measurement (ATE test).
6. If outphase modulation selected (IB1,D0), slow slope configuration must be used (IB11,D3).
7. When selecting the low gain, also the thresholds for "DC diagnostic" function and "Open load in play detector" function
scale of the same factor with respect to standard gain configuration.
8. See Chapter 7: Muting function architecture for more details.
9. Guaranteed by correlation.
10. Measured at bench during product validation.

DS12497 Rev 2 15/76


75
Electrical specifications FDA803U

4.4 Typical curves of the main electrical parameters


Figure 4. Efficiency and power dissipation Figure 5. Efficiency and power dissipation
(Vs = 14.4 V, RL = 1 x 4 Ω, f = 1 kHz sine wave) (Vs = 14.4 V, RL = 1 x 4 Ω, pink noise)
3',66>:@ Ș >@ 3',66>:@ Ș >@
   
Ș
 
Ș
   

 

   

 
3',66
   
3',66
 
96 9
   96 9 
5/ [ȍ
5/ [ȍ
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32&+>:@ 32&+>:@
*$'*36 *$'*36

Figure 6. Efficiency and power dissipation Figure 7. Efficiency and power dissipation
(Vs = 14.4 V, RL = 1 x 2 Ω, f = 1 kHz sine wave) (Vs = 14.4 V, RL = 1 x 2 Ω, pink noise)
3',66>:@ Ș>@ 3',66>:@ Ș >@
   

Ș   Ș 



  

3',66  
 
 
  96 9
 5/ [ȍ 
 
3LQN1RLVH 

 
 
 96 9  3',66
 
5/ [ȍ
   
I N+]6LQH:DYH
   
                 
32&+>:@ 32&+>:@
*$'*36 *$'*36

Figure 8. Efficiency and power dissipation Figure 9. Efficiency and power dissipation
(Vs = 14.4 V, RL = 1 x 8 Ω, f = 1 kHz sine wave) (Vs = 14.4 V, RL = 1 x 8 Ω, pink noise)
3',66>:@ Ș >@ 3',66>:@ Ș >@
   
Ș
 
 Ș 
 
 
 

3',66  


 3',66 
 
 
96 9  96 9 
5/ [ȍ 5/ [ȍ
 
I N+]6LQH:DYH 3LQN1RLVH
   
                
32&+>:@ 32&+>:@
*$'*36 *$'*36

16/76 DS12497 Rev 2


FDA803U Electrical specifications

Figure 10. Efficiency and power dissipation Figure 11. Efficiency and power dissipation
(Vs = 18 V, RL = 1 x 4 Ω, f = 1 kHz sine wave) (Vs = 18 V, RL = 1 x 4 Ω, pink noise)
3',66>:@ Ș >@ 3',66>:@ Ș >@
   
Ș  
Ș
   
 
 3',66   
 
3',66
   
 
96 9 96 9
   
5/ [ȍ 5/ [ȍ
I N+]6LQH:DYH  3LQN1RLVH 
   
                
32&+>:@ 32&+>:@
*$'*36 *$'*36

Figure 12. Efficiency and power dissipation Figure 13. Efficiency and power dissipation
(Vs = 16 V, RL = 1 x 2 Ω, f = 1 kHz sine wave) (Vs = 16 V, RL = 1 x 2 Ω, pink noise)
3',66>:@ Ș >@ 3',66>:@ Ș >@
   

   


Ș
Ș  
 
 
  96 9
 5/ [ȍ 
 3',66 
3LQN1RLVH 

 
 
 
 
 96 9 
 3',66 
5/ [ȍ
 I N+]6LQH:DYH   

   
                  
32&+>:@ 32&+>:@
*$'*36 *$'*36

Figure 14. Efficiency and power dissipation Figure 15. Efficiency and power dissipation
(Vs = 18 V, RL = 1 x 8 Ω, f = 1 kHz sine wave) (Vs = 18 V, RL = 1 x 8 Ω, pink noise)
3',66>:@ Ș >@ 3',66>:@ Ș >@
   
Ș  

 
Ș
 
 
3',66  
3',66 

 
 
 
96 9 96 9
 
5/ [ȍ 5/ [ȍ
 3LQN1RLVH 
I N+]6LQH:DYH
   
            
32&+>:@ 32&+>:@
*$'*36 *$'*36

DS12497 Rev 2 17/76


75
Electrical specifications FDA803U

Figure 16. Efficiency and power dissipation Figure 17. Efficiency and power dissipation
(Vs = 3.3 V, RL = 1 x 4 Ω, f = 1 kHz sine wave) (Vs = 3.3 V, RL = 1 x 4 Ω, pink noise)
3',66>:@ Ș >@ 3',66>:@ Ș>@
   
Ș  
Ș
 
 
 
 
96 9
5/ [ȍ  96 9 
I N+]6LQH:DYH 5/ [ȍ
 
3LQN1RLVH
 
 
 
3',66 3',66
 
   
           
32&+>:@ 32&+>:@
*$'*36 *$'*36

Figure 18. Efficiency and power dissipation Figure 19. Efficiency and power dissipation
(Vs = 3.3 V, RL = 1 x 2 Ω, f = 1 kHz sine wave) (Vs = 3.3 V, RL = 1 x 2 Ω, pink noise)
3',66>:@ Ș >@ 3',66>:@ Ș >@
   
Ș
Ș  

 

 
 
 
96 9 96 9
5/ [ȍ  5/ [ȍ 
I N+]6LQH:DYH  3LQN1RLVH 
 
 
3',66
 
3',66
 

   
                 
32&+>:@ 32&+>:@
*$'*36 *$'*36

Figure 20. Efficiency and power dissipation Figure 21. Efficiency and power dissipation
(Vs = 3.3 V, RL = 1 x 8 Ω, f = 1 kHz sine wave) (Vs = 3.3 V, RL = 1 x 8 Ω, pink noise)
3',66>:@ Ș>@ 3',66 >:@ Ș>@
   
Ș
 
Ș
 
 
 
 
96 9 96 9
5/ [ȍ  5/ [ȍ 
I N+]6LQH:DYH  3LQN1RLVH 
 
 
 
3',66
3',66  
   
              
32&+>:@ 32&+>:@
*$'*36 *$'*36

18/76 DS12497 Rev 2


FDA803U Electrical specifications

Figure 22. Output power vs. supply voltage Figure 23. Output power vs. supply voltage
(RL = 4 Ω, sine wave) (RL = 2 Ω, sine wave)
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Figure 24. Output power vs. supply voltage Figure 25. THD vs. output power
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Figure 26. THD vs. output power Figure 27. THD vs. output power
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DS12497 Rev 2 19/76


75
Electrical specifications FDA803U

Figure 28. THD vs. frequency Figure 29. THD vs. frequency
(VS = 14.4 V, RL = 4 Ω, PO = 1 W) (VS = 14.4 V, RL = 2 Ω, PO = 1 W)
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Figure 30. THD vs. frequency Figure 31. Frequency response


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Figure 32. Frequency response Figure 33. Frequency response


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20/76 DS12497 Rev 2


FDA803U Electrical specifications

Figure 34. PSRR vs. frequency Figure 35. Quiescent current vs. supply voltage
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Figure 36. Dynamic range Figure 37. FFT - Output spectrum (-60 dBFS
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DS12497 Rev 2 21/76


75
General information FDA803U

5 General information

5.1 LC filter design


The audio performance of a Class D amplifier is heavily influenced by the characteristics of
the output LC filter. The choice of its components is quite critical because a lot of constraints
have to be fulfilled at the same time: size, cost, filter for EMI suppression, efficiency. In
particular, both the inductor and the capacitor exhibit a non linear behavior: the value of the
inductance is a function of the instantaneous current in it and similarly the value of the
capacitor is a function of the voltage across it.
In the classical approach, where the feedback loop is closed right at the output of the power
stage, the LC filter is placed outside the loop and these nonlinearities cause the Total
Harmonic Distortion (THD) to increase. The only way to avoid this phenomenon would be to
use components which are highly linear, but this means they are also bigger and/or more
expensive.
Furthermore, when the LC filter is outside the loop, its frequency response heavily depends
on the impedance of the loudspeaker; this is one of the most critical aspects of Class-D
amplifiers. In standard class D this can be mitigated, but not solved, by means of additional
damping networks, increasing cost, space and power dissipation. FDA803U, instead,
provides a very flat frequency response over audio-band which cannot be achieved by
standard class D without feedback after LC filter.
Since the demodulator group is now in the feedback path, some constraints regarding the
inductor and capacitor choice are still present but of course less stringent than in the case of
a typical switching application.

5.2 Load possibilities


FDA803U supports several load possibilities, driving 2 Ω, 4 Ω and higher ohmic loads.
Possible channel configurations are:
 1 x 4 ohm (or higher) (up to 18 V)
 1 x 2 ohm (up to 16 V)

22/76 DS12497 Rev 2


FDA803U Finite state machine

6 Finite state machine

FDA803U has a finite state machine which manages amplifier functionality, reacting to user
and system inputs

Figure 38. Finite state machine diagram


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DS12497 Rev 2 23/76


75
Finite state machine FDA803U

6.1 Device state and address selection


Through Enable pins configuration it is possible to select different I2C addresses (up to 8) or
to configure the device in 4 different legacy ('no I2C' modes) according to table 6.

Table 6. Operation mode


Enable 1 Enable 2 Enable 3 Enable 4

Stand By 0 0 0 0
Amplifier ON address 1 = ‘1110000’ 0 1 0 0
Amplifier ON address 2 = ‘1110001’ 1 1 0 0
Amplifier ON address 3 = ‘1110010’ 0 0 1 0
Amplifier ON address 4 = ‘1110011’ 0 1 1 0
Amplifier ON address 5 = ‘1110100’ 0 1 0 1
Amplifier ON address 6 = ‘1110101’ 1 1 0 1
Amplifier ON address 7 = ‘1110110’ 0 0 1 1
Amplifier ON address 8 = ‘1110111’ 0 1 1 1
Legacy mode: low voltage mode; in-phase 1 1 1 0
Reserved 1 1 1 1
Legacy mode: standard voltage mode; in-phase 1 0 0 0
Reserved 1 0 0 1

In this way, up to 8 devices can be easily used in the same application with a single I2C bus.
Moreover it is possible to work without I2C configuring the voltage range and switching
mode to be used.
When a valid combination of Enable 1/2/3/4 is recognized the device turns on all the internal
supply voltages and outputs are biased to Vcc/2.
The internal I2C registers are pre-settled in "default condition", waiting for the I2C next
instruction.
The return in the Standby condition, (all enable pins at 0), will cause the reset of the
amplifier. As defined in the finite state machine, The same event will happen if PLL is not
locked, I2S is missing or not correct, Vcc for system reset.
FDA803U can work only in I2C slave mode.

24/76 DS12497 Rev 2


FDA803U Finite state machine

6.2 Standby state


ENABLE1, ENABLE2, ENABLE3, ENABLE4 pins have a double function: set of I2C
addresses and start-up of the system.
If ENABLE1/2/3/4 are all low, ("000"), then the FDA803U is off, the outputs remain biased to
ground and the current consumption is limited to Isb. In this case the FSM is in "Standby"
state.

6.3 Diagnostic Vcc-Gnd state


After exiting from Stand-By state the device passes through Diagnostic Vcc/Gnd state.
In this state the amplifier checks the presence of the following faults:
 Shorts to ground or to Vcc;
 Under-voltage (UVLOVCC);
 Thermal shutdown
FDA803U will then move to the next state (Eco-mode) only if there isn't any of these faults
for at least 90ms, thus avoiding any danger for the amplifier and the user system.
Meanwhile, if a stable fault is present, it will be communicated to the user via I2C after
90 ms, in order to provide always only stable information about the system. In this case the
device will not move to Eco-mode, waiting the fault cause is removed.
While the amplifier is in Diagnostic Vcc-Gnd state it can receive all the I2C commands, but it
will turn-on the PWM only when it enters in the next state: ECO-mode. This procedure
prevents wrong or unwanted I2C communication to bring the amplifier into dangerous
situation (if a short to Vcc or Gnd is present).
The following conditions will move the amplifier in Diagnostic Vcc-Gnd state from any other
functional state:
 Over current protection trigger
 UVLOVCC
 Over voltage (through DUMP condition)
 Thermal shutdown

6.4 ECO-mode state


In ECO-mode state the amplifier is fully operative from a communication point of view and
can receive and actuate all the commands given by the user.
In ECO-mode the output switching is disabled, thus allowing low quiescent current
consumption and therefore low power dissipation. The device is also able to move from
ECO-mode state to MUTE state, turning on the output switching, within about 1 ms -
without experiencing POP-noise.
This allows a very fast transition from ECO-mode to PLAY.

DS12497 Rev 2 25/76


75
Finite state machine FDA803U

6.5 MUTE-PLAY and diagnostic states


The amplifier can move from ECO-mode state to MUTE state selecting "PWM-ON" via I2C.
This operation turns-on the output PWM.
FDA803U can move to PLAY state (from MUTE state) via "PLAY" I2C command and returns
to MUTE state from PLAY state acting on the same bit.
Transition time between mute and play states could be selected via I2C.
Some external conditions could lead the amplifier in mute state automatically:
 Low battery mute
 High battery mute
 Thermal mute
 Hardware pin mute
Once mute condition is no more present the FDA803U will return automatically in PLAY
state, following I2C register program set.
Of course the user can decide to change the amplifier programming in the meanwhile, thus
avoiding the automatic return in PLAY.
From MUTE state the user can also select to enter DC diagnostic state.

26/76 DS12497 Rev 2


FDA803U Finite state machine

6.6 Operation compatibility vs battery


The FDA803U operation compatibility vs the battery value is reported in the figure below.

Figure 39. Operation vs. battery charge


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Note: When Overvoltage Shutdown is reached, I2S interface is switched off and relative I/O are
maintained in HighZ.

DS12497 Rev 2 27/76


75
Muting function architecture FDA803U

7 Muting function architecture

FDA803U uses a mixed signal approach for muting function.


Muting function is activated by different "mute command signal":
 “High voltage mute”: active when Vcc enters in a voltage window over the max voltage;
the window is specified in the electrical parameters table.
 “Low Battery mute”: active when Vcc enters in a voltage window under the min voltage;
the window is specified in the electrical parameters table.
 “Hardware mute”: active when HWMute pin enters in the voltage window specified in
the electrical parameters table.
 Thermal mute”: active when temperature enters in the temperature window over the
max temperature; the window is specified in the electrical parameters table.
 “I2C Mute”: active user select mute/play I2C bits.
The mute is achieved by the combination of two separated actuators, “Analog-mute” and
“Digital-mute”.

7.1 Command dependence


Analog and digital mute actuators activation could be different based on the mute command
signal. This is described in the following table:

Table 7. Command dependence


Command signal When? Mute Unmute

When Vcc enters inside Mixed mute. Analog &


Low Battery mute the low battery mute Digital, at the same Digital (1)
window time (1)
When Vcc enters inside Mixed mute. Analog &
High Voltage mute the high voltage mute Digital, at the same Digital (1)
window time (1)
When temperature
Thermal Mute enters inside thermal Analog Analog
mute window
When hardware pin Mixed mute. Analog &
Hardware Mute voltage enters inside its Digital, at the same Digital (1)
mute window time(1)
When I2C mute bits are
I2C Mute Digital Digital
selected
1. User can decide to disable Digital-Mute/Unmute using bit IB13-d6; in this case in all the conditions, (except
I2C Mute), the Mute/Unmute will be purely Analog.

28/76 DS12497 Rev 2


FDA803U Muting function architecture

7.2 Analog-Mute
Analog-Mute senses when the mute command signal transits across the muting window,
and attenuates the output signal proportionally to the command signal level inside the
muting window.

Figure 40. Analog-Mute diagram

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7.3 Digital-Mute
Digital-Mute acts on the digitally elaborated output signal attenuating it gradually to zero with
digital steps in a pre-defined time frame (tmute). The muting time, (tmute), can be selected by
I2C, (IB6 d7-d6). There are two different actions performed by digital-mute function:
Mute: it starts when any mute command signal, marked as Mixed Mute in Table 7, enters in
the muting window. This event rises the Start-Analog-Mute signal, communicated on
DB6[4]. The muting ends after tmute, selectable through IB6[7-6]. The Start-Analog-Mute
signal is ignored until the muting ramp has ended.
Approximately, the corresponding analog mute attenuation at the beginning of the muting
window is 0.5dB.
UnMute: it starts when all the mute commands, marked with Mixed Mute in Table 7, exit
from the muting window. This event resets the Start-Analog-Mute signal, communicated on
DB6[4]. The unmuting ends after tmute, selectable through IB6[7-6]. The Start-Analog-Mute
signal is ignored until the unmuting ramp has ended.

DS12497 Rev 2 29/76


75
Muting function architecture FDA803U

Figure 41. Digital-Mute diagram

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Note: in case of I2C mute the Digital-mute actuation does not follow Analog-mute level but only the
I2C command.

7.4 Mixed mute advantages


The mixed mute approach is the superposition of the two mute actuators, Analog-Mute and
Digital-mute, at the same time.
Here below the example of previous pages with mixed mute:

Figure 42. Mixed mute diagram

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30/76 DS12497 Rev 2


FDA803U Muting function architecture

The Mixed-Mute approach is more robust than Analog-Mute only approach. The effects are
visible when the command signal variations inside the muting window last longer than the
muting/unmuting time. An example is depicted in the figure below:

Figure 43. Analog-Mute vs. Mixed-Mute

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In any moment the user can disable the Digital-mute, acting on I2C bit IB13-d6, obtaining the
standard Analog-mute function.

DS12497 Rev 2 31/76


75
Hardware mute pin FDA803U

8 Hardware mute pin

The pin "HWMute" (pin 30) acts as mute command for the channel. The device is muted
when this pin is low, while it is in play when this pin is high (low/high threshold in Table 5:
Electrical characteristics).
Inside the device, connected to this pin a pull-up current generator puts the device in play if
left floating. An internal clamp limits the Mute pin voltage. If not used, this pin should remain
floating.
To drive the Mute pin to get a hardware mute an external pull-down open drain is needed.
(See Figure 44), RMute must be < 60 kΩ

Figure 44. HWMute pin schematic

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32/76 DS12497 Rev 2


FDA803U Power limiter function

9 Power limiter function

An adjustable power limiting function has been integrated to protect "small speakers"
applications: thanks to this feature, it's possible to limit by configuration the max power
delivered to the load.
Taking advantage of digital input architecture, the output power limitation is obtained through
the management of the input signal. It's important to underline that the limitation is
implemented independently of the supply voltage value.
The intervention thresholds, configurable through I2C are listed in the table below.

Table 8. Power limiter function


Output Voltage limit [V]
I2C IB2[3-0] Full-Scale Voltage limit
Standard gain
Low gain setting
setting

0000 100% (Disabled) 19 (1) 11.4


1011 80% 15.2 9.12
1010 70% 13.3 7.98
1001 60% 11.4 6.84
1000 50% 9.5 5.7
0111 45% 8.55 5.13
0110 40% 7.6 4.56
0101 35% 6.65 3.99
0100 30% 5.7 3.42
0011 25% 4.75 2.85
0010 20% 3.8 2.28
0001 15% 2.85 1.71
1. 19 V is only a reference level, coherently with "standard gain" value in Section 4.3, to deduce the power
limiter thresholds. The reference level is unreachable due to the maximum supply voltage range, equal to
18 V.

The limitation is gradual in order to have no impact on the acoustic performance. Depending
on the signal amplitude and the desired attenuation, different gains are applied to the signal
itself.
Here is an example of the response obtained with a limitation corresponding to 80% of the
full-scale: the blue line represents the signal when the power limiter is not employed, while
the red line is the result of the applied attenuation.

DS12497 Rev 2 33/76


75
Power limiter function FDA803U

Figure 45. Response obtained with a limitation corresponding to 80% of the full-scale



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9.1 Power limiter control


The function can be controlled with I2C bus, properly setting the bits IB2[3-0].
The configuration of the power limiter threshold and the enable/disable are available only in
MUTE state.

34/76 DS12497 Rev 2


FDA803U Diagnostic

10 Diagnostic

The FDA amplifiers family provides diagnostic function for detecting several possible faults
conditions.
Any warning information will be stored in the I2C interface and kept until the first I2C bus
reading operation. Some fault events can be sent to CDDiag pin as trigger for an interrupt
process.
Here reported the faults detectable taking advantage of FDA803U's diagnostic features:
 Short to VCC/GND;
 Short or open load (with DC diagnostic);
 Open load during play;
 Under/over voltage events;
 Chip over temperature;
 Digital input offset;
 Output voltage offset;
 Output current offset;
 Output clipping;
 Over current.
The fault events are managed with different actions depending on their severity.
It is important, for a correct diagnostic result collection, to clean diagnosis related I2C
register and the DB6, to clean eventual Start Analog Mute flag, through a read operation.

10.1 DC diagnostic
The DC diagnostic is a routine performed to detect the load connection status.
FDA amplifiers family provides a highly reliable and noise immune load diagnostic
algorithm, in order to prevent false detections induced by supply voltage variations or
mechanical stress on the speaker (e.g. car door closing). The algorithm includes the internal
generation of a properly calibrated and pop-free test signal.
For an extensive description of the DC diagnostic feature, please refer to the DC Diagnostic
user manual.

10.1.1 Diagnostic control


DC diagnostic can be run setting via I2C "Start Diag DC".
Diagnostic signal is generated and test is performed only when all the following conditions
are true:
1. Channel is in MUTE state.
2. DC test enable bit is set from '0' to '1'.
3. The channel has power stage ON
4. Device is NOT kept in mute by means of the dedicated hardware pin

DS12497 Rev 2 35/76


75
Diagnostic FDA803U

At the end of the diagnostic cycle the "Start Diag DC" instruction bit is reset to '0' by the
device itself, and the "open load" or "short load" messages respectively will be displayed on
I2C data bits.
If "Start Diag DC" bit is set to '1' while the channel is not in "MUTE" state, (for example:
"PLAY" state or "Eco-mode" state), the channel will perform the diagnostic as soon as it
enters in "MUTE" state.
If the amplifier channel is in "Eco-mode" and I2C instructions for PWM ON + DIAG DC +
PLAY are given at the same time the channel will perform the following sequence
automatically:
1. turn on power stage
2. perform DC diagnostic
3. enter PLAY mode

10.1.2 Relation with short circuit protection activation


After a short circuit protection intervention amplifier is set automatically in a protected status
during which "Short to Vcc/Gnd" diagnostic is performed.
At the end of "Short to Vcc/Gnd" diagnostic, if no shorts to Vcc/Gnd are present on the
outputs, the amplifier will run DC diagnostic only if the corresponding "Start Diag DC" bit is
set to "1". Otherwise the amplifier will go back to the state preceding the short circuit
protection intervention without performing diagnostic cycles.
After the diagnostic completion "Start Diag DC" bit is set back to "0" by the amplifier.

10.1.3 Load range


The thresholds for short load detection and open load detection can be configured through
IB10[7,6]. Including the tolerance, the impedance values to be considered are reported in
Figure 46.

Figure 46. Load range detection configured properly setting IB5 d7-d6

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The DC diagnostic pulse has a configurable time duration: for detailed timings definition,
please refer to the DC Diagnostic user manual.
The DC diagnostic result is provided on I2C register DB2.

36/76 DS12497 Rev 2


FDA803U Diagnostic

10.2 Short to Vcc / GND diagnostic


The short to Vcc/GND diagnostic performs the detection of:
 "Hard" and "soft" short to Vcc
 "Hard" and "soft" short to Gnd

Timing
Short to Vcc/Gnd diagnostic cycle duration is 90 ms(*).
If a short to Vcc/Gnd is not stable during diagnostic cycle the channel will remain in "Diag.
Vcc/Gnd" state until a fault or non-fault condition is stable for at least 90 ms(*).
This special function avoids wrong detections in case of disturbs caused by mechanical
stresses applied to the speaker (e.g. car door closing).
The short to Vcc/Gnd diagnostic starts automatically following the logic shown in Figure 38.

Results communication and I2C control


After performing Short to Vcc/Gnd diagnostic for 90 ms(*) with a stable fault/non-fault
condition, there are two different scenarios:
1. Fault present: the device is communicating the fault condition setting the I2C bit DB2[3]
(in case of short to Vcc) or DB2[2] (in case of short to Gnd). The amplifier is remaining
in "Diag. Vcc/Gnd" state until the short is removed
2. Fault not present: Short to Vcc/Gnd diagnostic ends and the state machine can evolve
following the I2C commands.
Note: (*) Time when default I2C parameters settings are used

10.3 Diagnostic time-line diagrams


Figure 47. DC diagnostic before turn on
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DS12497 Rev 2 37/76


75
Diagnostic FDA803U

Figure 48. Short to VCC at device turn on


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FDA803U Diagnostic

Figure 50. Short circuit protection activation - Short to VCC

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10.4 Open load in play detector


The open load in play detector aim is to detect the possible speaker detachment during
PLAY state.
The innovative internal architecture allows to detect an open load condition taking
advantage of the audio signal itself, guaranteeing high detection reliability without requiring
a dedicated test signal.

10.4.1 Open load in play detector operation overview


The open load in play detection consists in one single shot test, which can be repeated
according to the user's need.
The test firstly checks the audio signal characteristics. If the audio signal is judged good
enough to provide a reliable result, the test result is valid. Otherwise, if the audio signal
doesn't allow to perform a reliable detection, the test result is not valid and the user needs to
repeat the test.
During the same evaluation time window, an internal circuit measures the differential current
flowing through the pins OUTP and OUTM. The test consequently evaluates both the digital
input signal and the output current, monitoring the average load impedance over time.
If the test result is valid and the average load impedance exceeds the chosen impedance
threshold, the device communicates that the load is not connected. Otherwise, if the test
result is valid and the average load impedance is lower than the chosen threshold, the
device communicates that the load is connected.

10.4.2 Processing bandwidth range


The feature requires an accurate measurement of the current flowing through the speaker.
The filter capacitors behave like an undesired load connected in parallel with the speaker,
altering the current measurement. However, this undesired contribution is significant only in
the high frequency range of the audio bandwidth.
On the other side, the most of the audio signal energy is distributed in the midde-low
frequency range of the audio bandwidth.
Due to the mentioned reasons, Open Load in Play Detector processes the audio bandwidth
up to 2kHz approximately, in order to guarantee a highly reliable solution without affecting
the rate of valid tests.
Please note that the processing bandwidth limitation does not affect the main signal path
from digital input signal to output voltage on FBP and FBM pins.

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10.4.3 Audio signal evaluation


The audio signal is considered a good test signal if its amplitude allows the internal circuits
to perform accurate measurements. In particular, Open Load in Play Detector processes the
audio signal only if its amplitude exceeds the values expressed in Table 9:

Table 9. Open load in play detector impedance and validity thresholds


Open load impedance threshold Digital input signal amplitude threshold

25 Ω (IB10[6]=’0’) 67 mFs
15 Ω (IB10[6]=’1’) 40 mFs

The audio signal is unknown and not stationary, while the speaker has a complex
impedance. Open Load in Play Detector evaluates the audio signal for a time window lasting
up to 1s in order to properly average the data over time. The detection is considered valid if,
during the evaluation time window, the input audio signal exceeds for 300ms the thresholds
reported in Table 9.

10.4.4 Impedance threshold


Open Load in Play Detector includes two different impedance thresholds which can be
configured through IB10[6] and which depend also on gain setting through IB6[4]. Their
value has been calibrated in the following conditions:
 ideal sinusoidal signal,
 absence of external disturbances.
The uncertainly on audio signal characteristics and on external disturbances requires to
keep proper tolerances. The guaranteed thresholds are reported in Figure 52 and in
Figure 53:

Figure 52. Open load in play detector guaranteed thresholds with standard gain
setting

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Figure 53. Open load in play detector guaranteed thresholds with low gain setting

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Please note that an exact value of impedance can be defined only in case of an ideal
sinusoid at a fixed frequency. In case of a generic audio signal, the overall complex
impedance vs frequency characteristic of the speaker is involved.

10.4.5 I2C control and timing


The user must set IB3[0] in order to start the open load in play detection.
Once the test is started, the internal circuits required for the detection are turned on,
requiring a settling time lasting approximately 500 ms.
When the internal circuits are ready to work, both digital input signal and output current
measurement start being evaluated, following the impedance threshold set through IB10[6].
Depending on the audio signal characteristics, the evaluation can last from 300 ms to 1 s
approximately.
At the end of the evaluation, the device:
 Sets DB0[2]='1' to communicate that the test ended successfully, and resets IB3[0]
allowing the user to perform another test afterwards
 Sets DB0[1]='1' to communicate that the test result is valid, otherwise sets DB0[1]='0' to
communicate that the test result is not valid.
 Sets DB0[0]='1' to communicate that an open load has been detected, otherwise sets
DB0[0]='0' to communicate that an open load has not been detected.
Please note that the value on DB0[0] is significant only if the test result is valid.
If the test ends successfully but the result is not valid, the user must repeat the test. This
condition happens when the audio signal is not good enough for a reliable detection.
The detection timings are represented in Figure 54:

Figure 54. Open load in play detector timing

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If the device FSM moves from PLAY to another state during the open load in play detection
routine, the test ends unsuccessfully by keeping the flag DB0[2] clear. The device
automatically resets IB3[0] allowing the user to repeat the test.

10.5 Input offset detector


The input offset detector aim is to detect an offset coming from the audio signal source
through I2S/TDM input stream.
For this purpose, the feature evaluates the input offset through a low-pass filter, which is
compared with a threshold equal to -18dBFs. If the measured offset exceeds the threshold,
Input Offset Detector sets the flag DB0[7] to '1'.

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Moreover, if the high-pass filter function is enabled through IB3[2], the input offset is
eliminated, guaranteeing a complete robustness in case of any malfunction coming from the
audio signal source.

10.6 Output voltage offset detector


The output voltage offset detector aim is to detect a voltage offset on the output.
For this purpose, an internal circuit detects when the voltage value on FBP pin or on FBM
pin exceeds 1V difference with respect to Vcc/2 value, generating a fault condition. If the
fault condition persists for 90ms consecutively, the circuits sets the flag on I2C bit DB0[3]. As
soon as the fault condition is removed, both the flag DB0[3] and the 90ms counter are reset.
The implemented logic avoids false detections in case of very low signal frequency.
The feature operation is showed in Figure 55:

Figure 55. Output voltage offset detector operation

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When enabled, the feature is active both in MUTE and in PLAY states.
Please note that the Output Voltage Offset Detector must not be enabled when FBP and
FBM pins are shorted with OUTP and OUTM pins the full-swing PWM outputs don't allow
the fault condition persisting for more than 90ms even in case of offset. A valid and robust
alternative is provided by the Output Current Offset Detector.
The offset detector output is provided in two forms:
 Enables the pull down on CDDiag pin, if IB4[7]='1'
 Sets the flag DB0[3]='1'

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10.7 Output current offset detector


The output current offset detector aim is to detect a current offset on the output.

10.7.1 Output current offset detector operation principle


The device senses the differential DC current flowing through the output pins OUTP and
OUTM. In particular, in reference to Figure 56, the measured current offset is:
IOFFSET = |IOUTP-IOUTM|/2.

Figure 56. Current offset measurement

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The measured current offset is then compared with a current threshold, which can be set by
means of I2C bits IB10[4,3]: if it exceeds the chosen threshold, the device communicate that
an output current offset has been detected.

10.7.2 Result communication and I2C control


The output current offset detection consists in one single-shot test. The feature is controlled
through I2C commands.
In order to start the detection, the user must set IB3[3]='1'.
At the end of the test, the internal control logic performs the following operations:
 Sets DB0[6]='1' to communicate that the test is ended and the result is valid
 Sets DB0[5]='1' if an offset has been detected, or DB0[5]='0' if no offset has been
detected
 Sets IB3[3]='0', allowing the user to perform another test afterwards
The detection can be started in MUTE state or in PLAY state. If the user sets IB3[3]='1' while
the device FSM state is different, the test starts as soon as the device FSM enters in MUTE
or PLAY state.

10.7.3 Hot spot detection


The output current offset detector enables the possibility to detect a soft short to Vcc or to
Gnd occurring when the PWM is already turned on, guaranteeing improved robustness
against hot spot formation.
The operation principle is shown in Figure 57:

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Figure 57. Hot spot detection

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In standard operative condition, the DC value of IOUTP and IOUTM is zero, therefore the
measured output current offset is zero.
When a soft short is connected between one output and Vcc or Gnd, the corresponding
output drives an additional current ISHORT. The device interprets half of the mentioned
current as offset: IOFFSET = |IOUTP-IOUTM|/2 = |ISHORT|/2.
In conclusion, if half of the DC current flowing in the short circuit exceeds the threshold
selected through IB10[4,3], Output Current Offset Detector communicates an offset
detection.

10.8 PWM pulse skipping detector


The pulse skipping detector aim is to detect the PWM stage saturation.
The feature detects pulse skipping when, for each output, at least two consecutive PWM
commutations have been skipped. The operation is shown in Figure 58:

Figure 58. PWM pulse skipping detector operation

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In order to enable the PWM pulse skipping detector, the user must set IB5[5,4]='01'.
When detecting pulse skipping, the feature provides the output in two forms:
 Enables the pull down on CDDiag pin
 Sets the flag DB1[0]='1'
As soon as the pulse skipping condition is removed, both the outputs are reset.
The suggested utilization for this function is to connect a low-pass filter to CDDiag pin,
therefore comparing the output with a voltage threshold. The lower is the CDDiag pin
average voltage, the higher is the distortion.

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10.9 Thermal protection


The device integrates different protection levels against over-temperature conditions.
The first protection level consists only in communicating if the temperature exceeds four
different thresholds, from TW4 to TW1. The result is provided in two ways:
 Setting DB1[7-4];
 Pulling down the CDDiag pin, coherently with the setting of IB4[6-4].
If needed, the user is in charge of taking proper actions to counteract the temperature rising.
The second protection level consists in the output signal attenuation as a function of the
temperature, in order to reduce the power dissipation. The thermal attenuation occurs in the
temperature range between Tpl and Tph, as shown in Figure 59.
The third level protection consists in switching off the power stage when the temperature
overpasses the Tsh value. As shown in Figure 2, after thermal shutdown triggering, the
device FSM enters in "Short to Vcc / Gnd diagnostic state", preventing subsequent power
stage turn on in case of shorts to battery or ground.
The temperature values TW4, TW3, TW2, TW1, Tpl, Tph, Tsh are always in tracking,
independently of the parameters spread. If the user sets the I2C bit IB12[7], all the
mentioned thresholds are reduced of 15°C.

Figure 59. Thermal attenuation curve

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10.10 Watch-dog
The user can enable an internal watch-dog, setting I2C IB9[4]='1'.
The function is based on a timer which is reset at each Word Select line rising edge, and
which reaches the timeout in:
 2.9 ms if fs = 44.1 kHz;
 2.7 ms if fs = 48 kHz, 96 kHz, 192 kHz.
When the timer reaches the timeout, the function performs two operations:
 Sends a muting command to the amplifier
 Sets a flag on DB6[2]
In case of timeout, the muting command is released as soon as the timer is reset by a new
Word Select line edge.

10.11 Error frame check


The device integrates a function called "Error frame check", which is permanently enabled.
The function counts the number of rising edges received on the Clock line, starting from
each rising edge of Word Select line. At the end of the data frame, marked by the
subsequent rising edge on Word Select line, the function checks that the reached count is
coherent with the I2C configuration of the I2S protocol.
In case the function detects an error, the device sets a flag on DB6[1].

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11 Additional features

11.1 AM operation mode


The device provides special functions in order to avoid EM interferences when the radio is
tuned on an AM station.
The first function consists in allowing the user to select a proper PWM switching frequency
through I2C interface, depending on the AM station selected by the tuner. The PWM
switching frequency selection is available only in case the I2S frame clock is 44.1 kHz or 48
kHz, as shown in Figure 60.

Figure 60. PWM switching frequency selection


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Actually, the PWM spectrum of the output square wave can be controlled in AM band just in
case it is possible to fix the switching frequency, in other words without skipping any power
stage commutation (typical phenomenon for a class D amplifier close to the clipping). The
device provides an additional function called LRF (Low Radiation Function). This I2C option
assures a minimum duty cycle for the PWM output square wave avoiding any missing
pulses.

Figure 61. LRF effect on PWM output


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Please note that, by limiting the PWM duty cycle, a limitation of the output power occurs: the
output power in case of usage of LRF function decreases about 10 % @ 1 % THD.

11.2 Noise gating


Noise gating is an automatic noise reduction feature that activates when output signal
reaches not audible levels.
When input signal levels falls below -109 dBFs, the system activity is automatically
optimized in order to exploit very low noise level on the output speakers.
The noise gating process has a 500 ms watching time before turning on, in order to avoid
spurious activations.
The feature is enabled by default and can be disabled selecting IB3[1].

11.3 Dither PWM


The device implements a function, Dither PWM, which can be enabled through I2C bus by
setting IB1[2].
The main target of this feature is to improve the EMC performances in the range [10 –
30 MHz], especially in MUTE condition.
The function consists in modulating the period of the output PWM. The function doesn’t
affect the average PWM frequency.
The modulation pattern is repeated every 8 PWM clock cycles, in order to avoid introducing
significant noise in the audio bandwidth.
A qualitative example of the function operation is depicted in Figure 62.

Figure 62. Dither PWM effect on output PWM

        

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I2S bus interface FDA803U

12 I2S bus interface

The device receives the audio signal through I2S bus.


The I2S bus is composed of three lines:
 Clock line (I2Sclk pin);
 Word Select line (I2Sws pin);
 Serial Data line (I2Sdata pin).
The Word Select line frequency must be always equal to the audio sampling frequency fs.
According to the I2C setting of IB1[7-5], the device supports the following standards for
sampling frequency:
 44.1 kHz;
 48 kHz;
 96 kHz;
 192 kHz.
According to the I2C setting of IB0[6-5], the user can send the audio signal with the following
data formats:
 I2S standard (max fs = 192 kHz);
 TDM - 4CHs (max fs = 192 kHz);
 TDM - 8CHs (max fs = 96 kHz);
 TDM - 16CHs (max fs = 48 kHz).
For all the mentioned data formats, the user must provide the data word following two's
complement representation, starting from the MSB. The data word is composed of 32 bits:
the device processes only the first 24 most significant bits, while it does not care the least
significant 8 bits.
The internal PLL locks on the Clock line signal: when the I2S clock is missing or corrupted,
the PLL consequently unlocks and the device forces the finite state machine in standby
state. Furthermore, since the Clock line frequency is dependent on I2S bus configuration, it
is strictly necessary to configure the I2C bits IB0[6-5] and IB1[7-5] accordingly.

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12.1 I2S standard mode description


The I2S standard format is shown in Figure 63.
The Clock line frequency is equal to 64 fs.
With a proper I2C configuration, the user can select the channel containing the data to be
processed:
 Right channel - IB0[4-1]='0000'
 Left channel - IB0[4-1]='0001'

Figure 63. I2S standard mode


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12.2 TDM 4CH mode description


The TDM4 format is shown in Figure 64.
The clock line frequency is equal to 128 fs.
With a proper I2C configuration, the user can select the slot containing the data to be
processed:
 Slot 0 - IB0[4-1]='0000'’
 Slot 1 - IB0[4-1]='0001'’
 Slot 2 - IB0[4-1]='0010'’
 Slot 3 - IB0[4-1]='0011'.

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DS12497 Rev 2 51/76


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I2S bus interface FDA803U

12.3 TDM 8CH mode description


The TDM8 format is shown in Figure 65.
The clock line frequency is equal to 256 fs.
With a proper I2C configuration, the user can select the slot containing the data to be
processed:
 Slot 0 - IB0[4-1]='0000',
 Slot 1 - IB0[4-1]='0001',
 Slot 2 - IB0[4-1]='0010',
 Slot 3 - IB0[4-1]='0011',
 Slot 4 - IB0[4-1]='0100',
 Slot 5 - IB0[4-1]='0101',
 Slot 6 - IB0[4-1]='0110',
 Slot 7 - IB0[4-1]='0111'.

Figure 65. TDM8 mode


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12.4 TDM 16CH mode description


The TDM8 format is shown in Figure 66.
The clock line frequency is equal to 512 fs.
With a proper I2C configuration, the user can select the slot containing the data to be
processed:
 Slot 0 - IB0[4-1]='0000',
 Slot 1 - IB0[4-1]='0001',
 Slot 2 - IB0[4-1]='0010',
 Slot 3 - IB0[4-1]='0011',
 Slot 4 - IB0[4-1]='0100',
 Slot 5 - IB0[4-1]='0101',
 Slot 6 - IB0[4-1]='0110',
 Slot 7 - IB0[4-1]='0111',
 Slot 8 - IB0[4-1]='1000',
 Slot 9 - IB0[4-1]='1001',
 Slot 10 - IB0[4-1]='1010,'
 Slot 11 - IB0[4-1]='1011',
 Slot 12 - IB0[4-1]='1100',
 Slot 13 - IB0[4-1]='1101',
 Slot 14 - IB0[4-1]='1110',
 Slot 15 - IB0[4-1]='1111'.

Figure 66. TDM16 mode

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I2S bus interface FDA803U

12.5 Timing requirements


Figure 67. I2S Interface timings
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Table 10. I2S Interface timings


Symbol Parameter Note Min Max Unit

I2S clock period 40.69 ns


TSCK I2S clock period tolerance 0.9 x TSCK 1.1 x TSCK
I2S clock duty cycle 40 60 %
TSCKH I2S clock high time 15 ns
TSCKL I2S clock low time 15 ns
TSCKT I2S clock transition time 6 ns
I2S data (and word select)
TDS setup time (before I2S clock 8 ns
rising edge)
I2S data (and word select)
TDH hold time (after I2S clock rising 8 ns
edge)
I2S standard 32 x TSCK
TDM4 format 1 x TSCK 127 x TSCK
TWSH I2S word select high time
TDM8 format 1 x TSCK 255 x TSCK
TDM16 format 1 x TSCK 511 x TSCK

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12.6 Group delay


The group delay depends on the sampling frequency fs, properly configured with I2C bits
IB1[7-5]. The typical value for all the configurations is reported in Table 11:

Table 11. Group delay dependency from input sampling frequency


Input sampling frequency fs Group delay

44.1 kHz 465 μs


48 kHz 430 μs
96 kHz 50 μs
192 kHz 30 μs

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I2C bus interface FDA803U

13 I2C bus interface

Data transmission from microprocessor to the FDA803U and viceversa takes place through
the 2 wires I2C bus interface, consisting of the two lines SDA and SCL (pull-up resistors to
positive supply voltage must be connected).
When I2C bus is active any operating mode of the IC may be modified and the diagnostic
may be controlled and results read back.
The protocol used for the bus is depicted in Figure 69 and comprises:
 a start condition (S)
 a chip address byte (the LSB bit determines read/write transmission)
 a subaddress byte
 a sequence of data (N-bytes + acknowledge)
 a stop condition (P)

Figure 69. I2C bus protocol description


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1. The I2C addresses are:


Address 1 = 1110000
Address 2 = 1110001
Address 3 = 1110010
Address 4 = 1110011
Address 5 = 1110100
Address 6 = 1110101
Address 7 = 1110110
Address 8 = 1110111
Description:
– S = Start
– R/W = '0' => Receive-Mode (Chip could be programmed by μP)
– I = Auto increment; when 1, the address is automatically incremented for each
byte transferred
– X: not used
– A = Acknowledge
– P = Stop
– MAX CLOCK SPEED 400kbit/sec

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13.1 Writing procedure


There are two possible procedures:
1. without increment: the I bit is set to 0 and the register is addressed by the subaddress.
Only this register is written by the data following the subaddress byte.
2. with increment: the I bit is set to 1 and the first register write is the one addressed by
subaddress. The registers are written from this address up to stop bit or the reaching of
last register.

13.2 Reading procedure


The reading procedure is made up only by the device address (sent by master) and the data
(sent by slave) as reported in Figure 70 (a). In particular when a reading procedure is
performed the first register read is the last addressed in a previous access to I2C peripheral.
Hence, to read a particular register also a sort of write action (a write interrupted after the
sub-address is sent) is needed to specify which register has to be read. Figure 70 (b) shows
the complete procedure to read a specific register where:
 the master performs a write action by sending just the device address and the
subaddress; the transmission must be interrupted with the stop condition when the
subaddress is sent.
 now, the read procedure can be performed: the master starts a new communication
and sends the device address; then the slave (FDA803U) will respond by sending the
data bits.
 the read communication is ended by the master which sends a stop condition preceded
by a not-acknowledge.
Instead, performing a start immediately after the stop condition could be possible for
generating the repeated start condition (Sr) which also keeps busy the I2C bus until the stop
is reached (Figure 70 (c)).

Figure 70. Reading procedure


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There are two possible reading procedures:


1. without auto-increment (Figure 71 (a)) if the "I" bit of the last I2C writing procedure has
been set to 0: in this case only the register addressed by the sub-address sent in the
previous writing procedure is read;
2. with auto-increment (Figure 71 (b)) if the "I" bit of the last I2C write procedure has been
set to 1: in this case the first register read is the one addressed by sub-address sent in
the previous writing procedure. Only the registers from this address up to the stop bit
are read.

DS12497 Rev 2 57/76


75
I2C bus interface FDA803U

Figure 71. Without/with auto-increment reading procedure


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If a microcontroller tries to read an undefined register, FDA803U will return a "0xFF" data;
for more details refer directly to I2C specification.

13.3 Data validity


The data on the SDA line must be stable during the high period of the clock. The HIGH and
LOW state of the data line can only change when the clock signal on the SCL line is LOW.

13.4 Start and stop conditions


A start condition is a HIGH to LOW transition of the SDA line while SCL is HIGH.
The stop condition is a LOW to HIGH transition of the SDA line while SCL is HIGH.

13.5 Byte format


Every byte transferred to the SDA line must contain 8 bits. Each byte must be followed by an
acknowledge bit. The MSB is transferred first.

13.6 Acknowledge
The transmitter* puts a resistive HIGH level on the SDA line during the acknowledge clock
pulse. The receiver** has to pull-down (LOW) the SDA line during the acknowledge clock
pulse, so that the SDA line is stable LOW during this clock pulse.
* Transmitter
= master (μP) when it writes an address to the FDA803U
= slave (FDA803U) when the μP reads a data byte from FDA803U
** Receiver
= slave (FDA803U) when the μP writes an address to the FDA803U
= master (μP) when it reads a data byte from FDA803U

58/76 DS12497 Rev 2


FDA803U I2C bus interface

13.7 I2C timing


This paragraph describes more in detail the I2C bus protocol used and its timings.
Please refer to Table 12 and Figure 72 below.

Figure 72. I2C bus interface timing


4BUF 4SCLH

4SCLL

3#,

4SCLP
4SSTART 4HSTART 4SSDA 4HSDA 4SSTOP

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START STOP
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Table 12. I2C bus interface timing


Symbol Parameter Min Max Unit

Fscl SCL (clock line) frequency - 400 kHz


Tscl SCL period 2500 - ns
Tsclh SCL high time 0.6 - μs
Tscll SCL low time 1.3 - μs
Tsstart Setup time for start condition 0.6 - μs
Thstart Hold time for start condition 0.6 - μs
Tsstop Setup time for stop condition 0.6 - μs
Tbuf Bus free time between a stop and a start condition 1.3 - μs
Tssda Setup time for data line 100 - ns
(1)
Thsda Hold time for data line 0 - ns
Tf Fall time for SCL and SDA - 300 ns
1. Device must internally provide a hold time of at least 300 ns for the SDA signal to bridge the undefined
region of the falling edge of SCL.

DS12497 Rev 2 59/76


75
I2C bus interface FDA803U

13.8 I2S, I2C and Enable relationship


FDA803U provides both I2C and I2S communication by means of two different digital
interfaces but connected to each other interfaces and clock domains.
To program the I2C interface the I2S clock must be present, and at least 10 ms should have
passed from the Enable pins setting event.
In FDA803U the digital part has different clock domains:
 The I2C programming block clock is the I2C clock
 The I2S receiver clock which is the I2S clock
 The system clock which is generated by an internal PLL.
The I2C commands are not effective if I2S clock is not present. However they will remain
memorized inside I2C registers.
If I2S clock is lost the digital machine goes in standby.
I2S clock (SCK) should be given to device before enabling it (Enable pins set to ‘out of
standby’).

60/76 DS12497 Rev 2


FDA803U I2C register

14 I2C register

14.1 Instruction bytes- “I00xxxxx”


Table 13. IB0-ADDR: “I0000000”
Data bit Default value Definition

Lock bit:
D7 0 0 - Write on IBs is enable
1 - Write on IBs is disable

Digital input settings:


D6 D6-D5 Input setting
00 I2S standard
00
01 TDM – 4 CHs
10 TDM – 8 CHs
D5
11 TDM – 16 CHs

4 bits for channel position selection for I2S standard, TDM4, 8 and 16:
D4-D1 Position selection
0000 slot 0 (TDM mode) - right ch. (I2S mode
0001 slot 1 (TDM mode) - left ch. (I2S mode)
0010 slot 2 (TDM mode)
0011 slot 3 (TDM mode)
0100 slot 4 (TDM 8 and 16 mode)
0101 slot 5 (TDM 8 and 16 mode)
0110 slot 6 (TDM 8 and 16 mode)
D4-D1 0000
0111 slot 7 (TDM 8 and 16 mode)
1000 slot 8 (TDM 16 mode)
1001 slot 9 (TDM 16 mode)
1010 slot 10 (TDM 16 mode)
1011 slot 11 (TDM 16 mode)
1100 slot 12 (TDM 16 mode)
1101 slot 13 (TDM 16 only)
1110 slot 14 (TDM 16 only)
1111 slot 15 (TDM 16 only)
0 - Standard voltage mode
D0 0
1 - Low voltage mode

DS12497 Rev 2 61/76


75
I2C register FDA803U

Table 14. IB1-ADDR: “I0000001”


Data bit Default value Definition

Digital input frame sync frequency (Fs):


D7-D6 Frame sync (WS) frequency
00 44.1 kHz
D7 - D6 00
01 48 kHz
10 96 kHz
11 192 kHz

D5 0 Reserved

Switching frequency expressed in kHz.


D4-D3 I2S frame sync frequencies (WS) [kHz]
44.1 48 96 192
D4 - D3 00 00 308.7 336 384 384
01 352.8 384 384 384
10 396.9 432 384 384
11 Reserved Reserved Reserved Reserved
0 - PWM amplifier clock not dithered
D2 0
1 - PWM amplifier clock dithered

D1 0 Reserved

0 - PWM in phase (BD mode)


D0 0 1 - PWM out of phase (AD mode)
Slow slope configuration must be used (IB11,D3)

62/76 DS12497 Rev 2


FDA803U I2C register

Table 15. IB2-ADDR: “I0000010”


Data bit Default value Definition

"DiagShort2Supply" timing selection:


D7-D6 Timing
00 90 ms
D7-D6 00
01 70 ms
10 45 ms
11 20 ms
D5 0 Reserved
0 - Low radiation function OFF
D4 0
1 - Low radiation function ON
Power limiting Function configuration
D3-D0 Power limiting Config
0000 Power limiter disabled
0001 Power limited with maximum voltage scale at 15%
0010 Power limited with maximum voltage scale at 20%
0011 Power limited with maximum voltage scale at 25%
0100 Power limited with maximum voltage scale at 30%
0101 Power limited with maximum voltage scale at 35%
0110 Power limited with maximum voltage scale at 40%
D3 - D0 0000
0111 Power limited with maximum voltage scale at 45%
1000 Power limited with maximum voltage scale at 50%
1001 Power limited with maximum voltage scale at 60%
1010 Power limited with maximum voltage scale at 70%
1011 Power limited with maximum voltage scale at 80%
1100 Reserved
1101 Reserved
1110 Reserved
1111 Reserved

DS12497 Rev 2 63/76


75
I2C register FDA803U

Table 16. IB3-ADDR: “I0000011”


Data bit Default value Definition

D7 - D6 0 Reserved

0 - Output Voltage offset detector disable


D5 0
1 - Output Voltage offset detector enable
0 - Input offset detector disable
D4 0
1 - Input offset detector enable
0 - Output Current offset / hot spot detector disable
D3 0
1 - Output Current offset / hot spot detector enable
0 - No Highpass in the DAC
D2 0
1 - Highpass in the DAC
0 - Noise gating enable
D1 0
1 - Noise gating disable
0 - Open Load detection in play disable
D0 0
1 - Open Load detection in play enable

Table 17. IB4-ADDR: “I0000100” - CDDiag pin configuration


Data bit Default value Definition

0 - No Output Voltage offset information on CDDiag pin


D7 0
1 - Output Voltage offset information on CDDiag pin
Temperature warning information on CD/DIAG pin:
D6-D4 CDDiag configuration
000 No thermal warning
001 TW1
010 TW2
D6-D4 00
011 TW3
100 TW4
101 Reserved
110 Reserved
111 Reserved
0 - No Overcurrent information on CD/DIAG pin
D3 0
1 - Overcurrent information on CD/DIAG pin
0 - No Input Offset information on CD/DIAG pin
D2 0
1 - Input Offset information on CD/DIAG pin
0 - No Short to Vcc / Short to GND information on CD/DIAG pin
D1 0
1 - Short to Vcc / Short to GND information on CD/DIAG pin
0 - No High Voltage Mute information on CD/Diag pin
D0 0
1 - High Voltage Mute information on CD/Diag pin

64/76 DS12497 Rev 2


FDA803U I2C register

Table 18. IB5-ADDR: “I0000101” - CDDiag pin configuration


Data bit Default value Definition
0 - No UVLOVCC information on CDDiag pin
D7 0
1 - UVLOVCC information on CDDiag pin
0 - No Thermal shutdown information on CDDiag pin
D6 0
1 - Thermal shutdown information on CDDiag pin
Clipping information on CDDiag pin:
D5-D4 CDDiag configuration
00 No clipping information
D5-D4 00
01 PWM Pulse Skipping detector
10 Reserved
11 Reserved
D3-D0 0000 Reserved

Table 19. IB6-ADDR: “I0000110”


Data bit Default value Definition
Mute timing setup, (values with fsample = 44.1 kHz):
D7-D6 Type of mute Mute time Unit
00 Very Fast 3 ms
D7-D6 00
01 Fast 45 ms
10 Slow 90 ms
11 Very Slow 185 ms
Audio signal gain control:
D5 0 0 - standard digital audio gain
1 - +6 db digital audio gain
0 - standard gain
D4 0
1 - low gain
D3-D0 0000 Reserved

Table 20. IB7-ADDR: “I0000111”


Data bit Default value Definition
Diagnostic ramp time selection:
D7-D6 Timing
00 Normal
D7-D6 00
01 x2
10 x4
11 /2
Diagnostic Hold Time selection:
D5-D4 Timing
00 Normal
D5-D4 00
01 x2
10 x4
11 /2
D3-D0 0000 Reserved

DS12497 Rev 2 65/76


75
I2C register FDA803U

Table 21. IB8-ADDR: “I0001000” - CHANNEL CONTROLS


Data bit Default value Definition

D7-D6 11 Reserved
0 - Channel in TRISTATE (PWM OFF)
D5 0
1 - Channel with PWM ON
0 - Channel DC Diag disable
D4 0
1 - Channel DC Diag start
I2Stest pin configuration:
D3-D1 Function
000 High impedance configuration
001 Reserved
010 Reserved
D3-D1 000
011 Reserved
100 Reserved
101 Output: PWM synchronization signal
110 Reserved
111 Reserved
0 - Channel in MUTE
D0 0
1 - Channel in PLAY

Table 22. IB9-ADDR: “I0001001”


Data bit Default value Definition

D7-D5 000 Reserved


0 - watch-dog for word select managing
D4 0
1 - no watch-dog for word select managing
D3-D0 1000 Reserved(1)
1. In case this register is written, [D3] must be set to 1 to preserve its default value.

Table 23. IB10-ADDR: “I0001010”


Data bit Default value Definition

Short load impedance threshold (DC Diagnostic):


D7 0 0 - 0.75 Ω
1 - 0.5 Ω
Open load impedance threshold (DC Diagnostic & Open load in play
detector):
D6 0
0 - 25 Ω
1 - 15 Ω
D5 0 Reserved

66/76 DS12497 Rev 2


FDA803U I2C register

Table 23. IB10-ADDR: “I0001010” (continued)


Data bit Default value Definition

Output Current Offset Detector threshold configuration


D3-D2 Offset Detector threshold
00 Reserved
D4-D3 10
01 0.25 A (i.e. 2 V with 8 Ω load)
10 0.5 A (i.e. 2 V with 4 Ω load)
11 1.0 A (i.e. 2 V with 2 Ω load)
D2-D0 000 Reserved

Table 24. IB11-ADDR: “I0001011”


Data bit Default value Definition

D7-D6 00 Reserved
Over current protection level selection:
D5 D4 Iprot VDD>5.4VIprot VDD<5.4V
0 0 11A 6A
D5-D4 0
0 1 8A 6A
1 0 6A 4A
1 1 4A 4A
0 - Deafult
D3 0 1 - PWM Slow Slope; Must be used when Out Of Phase modulation selected
(IB1,D0)
D2-D0 000 Reserved

Table 25. IB12-ADDR: “I0001100”


Data bit Default value Definition

0 - Standard thermal warning


D7 0
1 - Thermal warning shift -15 °C
D6-D0 0001000 Reserved

DS12497 Rev 2 67/76


75
I2C register FDA803U

Table 26. IB13-ADDR: “I0001101”


Data bit Default value Definition

D7 0 Reserved
0 - Digital mute enabled in PLAY when StartAnalogMute without Thermal
Warning 1 occurs
D6 0
1 - Digital mute disabled in PLAY when StartAnalogMute without Thermal
Warning 1 occurs
D5-D0 100000 Reserved

Table 27. IB14-ADDR: “I0001110”


Data bit Default value Definition

D7-D4 0000 Reserved

D3 LC filter setup:(1) (2)


d3-d2-d1 LC filter
D2
000 Reserved
001 10 μH + 2.2 μF Out Phase
010 10 μH + 2.2 μF In Phase
100
011 10 μH + 3.3 μF Out Phase
D1 100 10 μH + 3.3 μF In Phase
101 10 μH + 4.7 μF Out Phase
110 10 μH + 4.7 μF In Phase
111 Reserved

0 – FIRST setup not programmed via I2C


D0 0
1 – FIRST setup programmed – ready to work
1. The optional configurations - different from 100 setting - can lead to electrical characteristics different than those declared
in spec.
2. The listed configurations can be varied keeping the same LC product. However some limits on C and L have to be kept in
account (the min value of L that can be used is 4.7 μH and the max C that can be used is 4.7μF)

68/76 DS12497 Rev 2


FDA803U I2C register

14.2 Data bytes - “I01xxxxx”


Legend:
 Type "S/C": the hardware can only set the flag. An I2C reading operation clears the
flag.
 Type "SR/C": the hardware can set or reset the flag. An I2C reading operation clears
the flag.
 Type "SR": the hardware can set or reset the flag. An I2C reading operation doesn't
affect the flag.

Table 28. DB0-ADDR: “I0100000”


Data bit Type Definition

0 – Offset at input not present


D7 S/C
1 – Offset at input present
0 – Output Current offset not valid
D6 SR/C
1 – Output Current offset valid
0 – Output Current offset not present
D5 SR/C
1 – Output Current offset present
D4 S/C Reserved
0 – Output Voltage offset not present
D3 S/C
1 – Output Voltage offset present
0 – Open Load in Play test not ended
D2 SR/C
1 – Open Load in Play test ended
0 – Open Load in Play test input signal not valid
D1 SR/C
1 – Open Load in Play test input signal valid
0 – Open Load in Play not detected
D0 SR/C
1 – Open Load in Play detected

DS12497 Rev 2 69/76


75
I2C register FDA803U

Table 29. DB1-ADDR: “I0100001”


Data bit Type Definition

0 – Thermal warning 1 not active


D7 SR/C
1 – Thermal warning 1 active
0 – Thermal warning 2 not active
D6 SR/C
1 – Thermal warning 2 active
0 – Thermal warning 3 not active
D5 SR/C
1 – Thermal warning 3 active
0 – Thermal warning 4 not active
D4 SR/C
1 – Thermal warning 4 active
0 - PLL not locked
D3 SR/C
1 - PLL locked
0 - UVLOALL not detected
D2 S/C 1 - UVLOALL detected
(NOTE: after turn-on, the first reading of this flag will be always 1)
0 - No Overvoltage Shutdown detected
D1 S/C
1 - Overvoltage Shutdown detected
0 - PWM pulse skipping not detected
D0 S/C
1 - PWM pulse skipping detected

Table 30. DB2-ADDR:"I0100010"


Data bit Type Definition

0 – Channel DC diagnostic pulse not ended


D7 SR/C
1 – Channel DC diagnostic pulse ended
0 – Channel DC diagnostic data not valid
D6 SR/C
1 – Channel DC diagnostic data valid
0 – Channel Over current not detected
D5 S/C
1 – Channel Over current protection triggered
0 – No Short Load on Channel
D4 SR/C
1 – Short Load on Channel
0 – No Short to Vcc on Channel
D3 SR
1 – Short to Vcc on Channel
0 – No short to Gnd on Channel
D2 SR
1 – Short to Gnd on Channel
0 – No Open Load on Channel
D1 SR/C
1 – Open Load on Channel
0 – Channel in mute
D0 SR/C
1 – Channel in play

70/76 DS12497 Rev 2


FDA803U I2C register

Table 31. DB3-ADDR: “I0100011” DC Diagnostic Error code


Data bit Type Definition

D7
D6
D5
D4
SR/C DC Diagnostic Error code
D3
D2
D1
D0

Table 32. DB6-ADDR:"I0100110"


Data bit Type Definition

0 – High Voltage Mute not Started


D7 S/C
1 – High Voltage Mute Started
0 – UVLOVCC not detected
D6 S/C
1 – UVLOVCC detected
0 – Thermal shutdown not detected
D5 S/C
1 – Thermal shutdown detected
0 – No analog mute started
D4 S/C
1 – Start analog mute (-0.5 dB attenuation reached)
D3 S/C Reserved
0 – watch-dog for word select not occured
D2 SR/C
1 – watch-dog for word select occurred
0 – no error frame checked
D1 S/C
1 – error frame checked
D0 S/C Reserved

DS12497 Rev 2 71/76


75
Package information FDA803U

15 Package information

In order to meet environmental requirements, ST offers these devices in different grades of


ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.

15.1 PowerSSO-36 (slug-up) package information


Figure 73. PowerSSO-36 (slug-up) package outline
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72/76 DS12497 Rev 2


FDA803U Package information

Table 33. PowerSSO-36 (slug-up) package mechanical data


Dimensions (mm)
Ref
Min. Typ. Max.

A 2.15 - 2.45
A2 2.15 - 2.35
a1 0 - 0.10
b 0.18 - 0.36
c 0.23 - 0.32
D(1) 10.10 - 10.50
E(1) 7.4 - 7.6
e - 0.5 -
e3 - 8.5 -
F - 2.3 -
G - - 0.10
H 10.10 - 10.50
h - - 0.40
k 0° - 8°
L 0.55 - 0.85
M - 4.3 -
N - - 10°
O - 1.2 -
Q - 0.8 -
S - 2.9 -
T - 3.65 -
U - 1.0 -
X See VARIATIONS
Y See VARIATIONS

VARIATIONS

Option A

X 4.1 - 4.7
Y 6.5 - 7.1

Option B

X 4.1 - 4.7
Y 4.9 - 5.5

DS12497 Rev 2 73/76


75
Package information FDA803U

Table 33. PowerSSO-36 (slug-up) package mechanical data (continued)


Dimensions (mm)
Ref
Min. Typ. Max.

Option C

X 4.3 - 5.2
Y 6.9 - 7.5
1. "D” and “E" do not include mold flash or protrusions Mold flash or protrusions shall not exceed 0.15 mm per
side (0.006”)

15.2 PowerSSO-36 (slug up) marking information


Figure 74. PowerSSO-36 (slug up) marking information

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Parts marked as ‘ES’ are not yet qualified and therefore not approved for use in production.
ST is not responsible for any consequences resulting from such use. In no event will ST be
liable for the customer using any of these engineering samples in production. ST’s Quality
department must be contacted prior to any decision to use these engineering samples to run
a qualification activity.

74/76 DS12497 Rev 2


FDA803U Revision history

16 Revision history

Table 34. Document revision history


Date Revision Changes

15-Jan-2019 1 Initial release.


04-Jul-2019 2 Removed watermark, no content change.

DS12497 Rev 2 75/76


75
FDA803U

IMPORTANT NOTICE – PLEASE READ CAREFULLY

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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other
product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2019 STMicroelectronics – All rights reserved

76/76 DS12497 Rev 2

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