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Polymer Reviews
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To cite this article: Brijesh Kumar , Brajesh Kumar Kaushik & Yuvraj Singh Negi (2014) Organic Thin
Film Transistors: Structures, Models, Materials, Fabrication, and Applications: A Review, Polymer
Reviews, 54:1, 33-111, DOI: 10.1080/15583724.2013.848455
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Polymer Reviews, 54:33–111, 2014
Copyright © Taylor & Francis Group, LLC
ISSN: 1558-3724 print / 1558-3716 online
DOI: 10.1080/15583724.2013.848455
Organic thin film transistor (OTFT) based device modeling and circuit application is
a rapidly emerging research area. Taking cognizance of this fact, our paper reviews
various basic to advanced OTFT structures, their performance parameters, materials
of individual OTFT layers, their molecular structures, OTFT charge transport phenom-
ena, and fabrication techniques. The performance of p- and n-type conducting polymer
and small molecule organic semiconductors are reviewed primarily in terms of field
effect mobility, current on/off ratio, and operating voltage for various OTFT structures.
Moreover, different organic/inorganic materials for realizing the dielectric layer, elec-
trodes, and the substrate in an OTFT are analyzed. Some of the compact models that
are essential for predicting and optimizing the device performance are described that
takes into account the mobility enhancement factor and channel length modulation. A
detailed study of the single gate, dual gate, vertical channel, and cylindrical gate OTFT
structures is carried out. Furthermore, the paper discusses some of the interesting and
upcoming applications of organic transistors such as inverters, light emitting diodes
(LEDs), RFID tags, and DNA sensors. Although organic transistors boast of a bright
future with a wide spectrum of applications, but they still face several challenges in
terms of mobility, voltage swings, noise margins, sub-threshold slope, stability, etc., that
needs to be resolved to make them a commercially sustainable and viable technology.
Keywords Dual gate, mobility, organic thin film transistor, OLED, organic inverter,
organic semiconductors, OTFT structure, RFID
1. Introduction
Organic electronics is a field of intense academic and commercial interest over the past
two decades. Commercial devices, incorporating organic materials are gradually entering
the market. Steady improvement in the electrical performance and the stability of organic
semiconductors (OSCs) has opened an era of low cost and large area electronic applications.
Prior to the existence of conjugated polymers in the late 1970s, these materials were mainly
33
34 B. Kumar et al.
High Speed,
High Performance,
Silicon Ultra LowPower,
Ultra-Miniature,
High Temperature
Cost
Large Area,
Organic Low Cost,Flexible,
Easier Manufacturing
Performance
known as the insulators. Shirakawa et al.1 in 1976 first introduced the conducting organic
Downloaded by [Brijesh Kumar] at 23:32 20 February 2014
materials that opened up a new research domain, bridging the fields of condensed matter
physics and chemistry.
Tsumura et al.2 reported the first organic thin film transistor (OTFT) in 1986 that
consisted of organic semiconductor (OSC) material for facilitating the flow of electric
current. Since then, the OTFT characteristics have undergone spectacular improvements.
The key benefits of organic transistors are direct fabrication on flexible low-cost substrates
and low processing temperatures that enable cost efficient production.3 On the other hand,
organic materials are characterized by lower mobility (μ) in comparison to the conventional
semiconductors. After consistent development, the mobility of organic transistors has been
augmented by several orders, now in excess of 15 cm2/V.s4 for single crystal and 3.2 cm2/V.s5
for thin film. With optimization of fabrication methodology and synthesis of novel materials,
the mobility can be undoubtedly increased further.
A noteworthy progress in fabrication methodology of organic transistors led the re-
searchers to utilize various flexible substrates, such as paper,6 plastic,7 glass,8 and fiber.9 The
OTFTs fabricated on flexible substrate and glass, demonstrated comparable characteristics
to the amorphous silicon hydrogenated (a-Si:H) TFT.10 With increased fabrication facili-
ties the OTFTs are being integrated in vital and high-end applications, such as flat panel
display, light emitting diode (LED),11 radio frequency identification (RFID) tag,12 sensor,13
static random access memory (SRAM),14 e-paper,15 and flexible integrated circuits.16 For a
comparative study of organic and inorganic semiconductors applications, Fig. 1 compares
their performance and cost characteristics. Though, the performance of organic transistor
is not comparable to the silicon transistor, still it finds utilization in certain innovative
applications that are not possible with conventional semiconductors, or if feasible they are
too expensive to be realized commercially.
The organic semiconductors that are invariably used are pentacene, poly (3-
hexylthiophene) (P3HT), poly (3-alkylthiophene) (P3AT), and poly (3-octylthiophene)
(P3OT).17 Most of the reported organic TFTs are based on a thick insulator layer, usually in
the range of 100 to 300 nm, and even up to a few micrometers.18, 19 Therefore, reasonably
high supply voltage (>25 V) is required to accumulate the charge carriers at OSC/dielectric
interface. However, with the recent progress and latest developed insulators like tantalum
pentoxide (Ta2 O3 )20 and hafnium oxide (HfO2 ),21 OTFTs can also be driven at lower supply
voltage (≤5 V) and that too with a reduced thickness (≤50 nm). Although, these inorganic
insulators are characterized by high dielectric constant (k), they find limited application
because of their inability in achieving flexibility due to high fabrication temperature
(>800◦ C). Currently, researchers are focusing to replace them by the organic insulators
Organic Thin Film Transistors 35
that can be fabricated at room temperature through simple printing techniques.22 With
the advent of soluble organic materials, realization of the printed flexible electronics have
become feasible now.23
This paper also reviews the recent advancements in the performance of organic TFTs
with a motive to present an overview of high performance organic materials, advanced
device structures, charge transport models, fabrication techniques, performance influencing
factors, and some vital applications. The paper is organized in twelve sections, including the
current introductory section numbered section 1. The operating principal and characteristic
parameters of organic transistors are discussed in section 2. Different OTFT structures
are explained in section 3, followed by specific DC compact models in section 4. The
charge transport models for organic semiconductors are presented in section 5. Different
materials used in individual OTFT layers are discussed in section 6 along with their chemical
structures and performance, mainly in terms of field effect mobility (μ) and on/off current
ratio (ION /IOFF ). Major processing steps involved in the fabrication are illustrated in section
7, whereas the performance influencing factors of organic transistors are discussed in
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section 8. Later on, some important applications are dealt with in section 9, while section
10 presents some of the limitations of organic transistors. Recommendations for future
work are incorporated in section 11. Finally, section 12 draws necessary conclusions.
Insulator
Organic
Semiconductor W
Drain (D)
Source (S) Substrate Vds
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Gate (G)
Vgs
resistor that exhibits an increase in potential from the source to drain.10 Despite the differ-
ence in charge transport physics of organic transistors, the current-voltage characteristics
from linear to the saturation regime can be expressed similar to that of a MOSFET. As
long as the drain voltage remains lower than the overdrive voltage (Vds <Vgs −Vt ), the drain
current builds up linearly due to the presence of carriers all along the channel. Furthermore,
a magnitude of the drain voltage close to Vgs −Vt , results in a non-linear increase in the
current. Finally, at Vds = Vgs −Vt , the current saturates due to pinching-off of the channel
and further increase in Vds does not contribute in enhancing the magnitude of the current.
Fundamentally, an OTFT operates like a capacitor that produces an electric field in
the dielectric at negative/positive Vgs for p/n type OSCs. It results in an accumulation of
holes/electrons by means of aligning the metal’s Fermi level near HOMO (highest occupied
molecular orbital) or LUMO (lowest unoccupied molecular orbital) levels of p- or n-type
semiconductors, respectively. Figure 3 shows a combined energy diagram for a typical
combination of gold (S/D) and pentacene (OSC). Since, the Fermi level has been distant
from the LUMO edge; therefore, the injection of an electron is insufficient on applying
a positive gate bias. Accordingly, no current flows in the pentacene layer at positive Vgs ,
Energy (eV)
0
1
LUMO
2
3
4 HOMO
4.9eV
5.1eV
5 EF
6
7
Gold (Au) Pentacene
Figure 3. Energy band diagram for a typical combination of gold (S/D) and pentacene (OSC).
Organic Thin Film Transistors 37
rather a small amount of leakage current builds up through the insulating layer.28 On the
other hand, holes are injected through the source by reversing the gate voltage owing to the
closeness of the HOMO level to the Fermi level. Due to formation of positively charged
channel, pentacene is said to be a p-type organic material.
2.2.1 Mobility. The mobility of a device is described as the average charge carrier drift
velocity per unit electric field. It is a measure of how efficiently charge carriers can move
along the conducting path. It is an important parameter in determining the processing speed
of a device. In fact, high mobility is a key factor in obtaining a large on-current that is
essentially required for memory applications. The mobility of n-type OSCs is found lower
in comparison to p-type due to their large band gaps. For high performance p-type OSC
such as pentacene, it has already exceeded beyond 3.2 cm2/V.s5. Now, the researchers are
more focused on improving the mobility of n-type materials, so as to realize complementary
logic circuits successfully. The mobility of an organic transistor enhances with an increase
in the gate overdrive voltage and is, thereby, named as field dependent mobility.29–32
Horowitz et al.33 and Deen et al.34 demonstrated the variation in mobility by means of a
mobility enhancement factor, α. Based on the alpha power law function, gate bias mobility
is expressed as
μ = μ0 (Vgs − Vt ) α (1)
where μo is the band mobility of an OSC determined at very low Vgs (∼0.5V). The parameter
α that usually lies in the range of 0.2–0.535 is dependent on the conduction mechanism of
the device, doping density, and the dielectric permittivity of active material. An evidence
of enhancement in mobility with respect to gate bias was reported by Dimitrakopoulos
and Malenfant36 for pentacene transistor, where it ranged from 0.02–1.26 cm2/V.s for a
variation in Vgs from −14 to −146V. Another factor that strongly affects the mobility is
grain size that depends on how perfectly semiconductor layer is deposited. Horowitz and
Hajlaoui37 reported a grain size dependent mobility for octithiophene TFT. Similarly, Knipp
et al.38 demonstrated the impact of grain size on the mobility of a pentacene based TFT.
Significant improvements in the mobility of p and n type organic materials are obtained
with the passage of time by synthesizing novel high performance materials and optimizing
the fabrication techniques that would increase the possibility of realizing organic devices
for high speed applications such as graphics, animation, and the games.
2.2.2 Threshold Voltage. Threshold voltage is the minimum gate voltage required for
accumulating the charge carriers at the OSC/insulator interface forming a conducting
path between the source and the drain. It determines the switching behavior of a device;
thereby, it needs to be controlled to ensure proper operation of the devices and thereby the
38 B. Kumar et al.
less morphological disorders. This can be achieved by optimizing the deposition process
of the active layer that enables a greater number of charge carriers to be accumulated at the
lower gate voltage.
2.2.3 Current On/Off Ratio. The ratio of the current in accumulation mode to the depletion
mode is termed as the current on/off ratio. A high dielectric constant of the insulator, thin
layer of semiconductor, and low doping concentration are the key factors in creating a large
difference between the on and off current.42 The on/off current ratio depends on the mobility
and the thicknesses of the semiconductor and dielectric layers which can be expressed as
ION Ci μ(Vgs − Vt )2
= (2)
IOFF tosc Vds σ
W
IOFF = tosc Vds σ (3)
L
where σ is the conductivity of the channel, L is the channel length, W is the channel width,
and Ci represents the gate dielectric capacitance per unit area. Lowering the thickness of
dielectric and semiconducting layers results in an increase of ION and decrease of IOFF ,
respectively, that increases the ION /IOFF ratio. Resendiz et al.43 reported an increase in the
ION /IOFF from 10 to 5 × 1010 for P3HT based TFT, on scaling the active film thickness from
160 to 20 nm. The current ratio was found to be more dependent on tosc due to a dominant
impact of the off-current over the on-current. The off current can be reduced substantially by
using a smaller thickness of the semiconductor. Recently, Islam44 demonstrated a reduction
in off-current by six orders of magnitude when the film thickness was reduced from 45
to 10 nm. Instead of high mobility, a high current ratio exceeding 108 is an essential
requirement for display applications.42 Usually short channel devices are fabricated to
produce a high on/off current ratio.
2.2.4 Sub-Threshold Slope. A sub-threshold slope (SS) is a ratio of change in the gate
biasing to the change in the drain current in logarithmic scale that can be expressed as
∂Vgs
SS = (4)
∂ log10 (Ids )
Organic Thin Film Transistors 39
et al.49 illustrated a low sub-threshold slope of about 100 mV/decade by producing a SAM
of Al2 O3 on the aluminum gate. Besides this, an increase in the carrier injection density
from the source contact can also help to attain a high switching response. It can be achieved
by improving the metal/semiconductor interface or selecting an appropriate combination
of the semiconductor and contact metal; wherein, the HOMO/LUMO level of OSC aligns
well to the Fermi level of metal.
Gate Gate
Vgs
Insulator S Insulator D
Vgs
S OSC D OSC
Substrate Substrate
Vds Vds
(a) (b)
Figure 4. Top gate OTFTs: (a) TGTC and (b) TGBC structures.
top contact (TGTC) and top gate bottom contact (TGBC) configurations, whereas, their
output and transfer characteristics are shown in Figs. 5(a) and 5(b), respectively.
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The performance of the top and bottom gate structures are compared using pentacene
based TFT, with a channel length and channel width of 10 and 100 μm, respectively.
The thicknesses of the insulator and semiconductor are 5.7 and 30 nm, respectively. Gate
and S/D electrodes are of aluminum and gold, respectively, with a thickness of 20 nm
each. The structures and electrical characteristics of OTFTs for the bottom gate top contact
(BGTC) and bottom gate bottom contact (BGBC) configurations are shown in Figs. 6
and 7, respectively. Although, all the single gate structures are analyzed with the similar
dimensions, materials and operating voltage, but still a significant difference is observed
in the electrical characteristics. This difference is due to a dissimilar path traversed by the
charge carriers between the source and drain.54
The performance in terms of current, mobility, on/off current ratio, threshold voltage,
and sub-threshold slope for different single gate structures is summarized in the Table 1.
The top contact configuration demonstrates better performance in comparison to the bottom
contact due to less morphological disorders in the active layer. An average reduction of
62% in mobility is observed for the BGBC structure as compared to its counterpart due to
a high metal-OSC contact resistance caused by the contact barrier as well as a non-uniform
deposition of the semiconductor around the pre-patterned S/D contacts.57 On the other
hand, the BGTC structure exhibits a lower contact resistance due to large injection area for
-7 -6
TGBC
TGTC
Vgs=0.0V
-6 -5 TGBC
Vgs=-1.8V TGTC
-5 Vgs=-3.oV Vgs=0.0V
-4
Ids (µ A)
Vgs=-1.8V
-4
Ids μA
Vgs=-3.0V
-3
-3
-2 -2
-1 -1
0 0
0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0
Vds (V) Vgs (V)
(a) (b)
Figure 5. (a) Output and (b) transfer (at Vds = −1.5V) characteristics of OTFTs in the TGTC and
TGBC configurations.
Organic Thin Film Transistors 41
Vds
S D Vds
OSC S OSC D
Insulator Insulator
Vgs Vgs Gate
Gate
Substrate Substrate
(a) (b)
Figure 6. Bottom gate OTFTs: (a) BGTC and (b) BGBC structures.
the charge carriers that enables an elevated current at the identical structural parameters
and operating bias.58 Additionally, the bottom contact structure demonstrates a higher sub-
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threshold slope in comparison to the top contact due to formation of a low mobility region
near the contacts that results in a subsequent rise in the trap density.
These structures are characterized by large performance variation due to the existence
of an energy barrier at the metal-OSC interface. Shim et al.59 reported a strong influence of
the Schottky barrier in the bottom contact structure, wherein, an increase of 0.4eV in the
barrier height resulted in a corresponding rise of 1K in the contact resistance. However,
the top contact structure showed a negligible dependence on the barrier height. The effect
of an energy barrier can be reduced substantially by improving the surfaces of the active
layer thin film and the S/D contacts. Furthermore, Gupta et al.18 reported almost 40 times
higher current in the top contact structure even at 70% reduced width as compared to the
bottom contact. The mobility of the BGBC structure was found to be lower by two orders
of magnitude due to a smaller injection area for the carriers.
Doping density is another important factor that affects the device behavior, significantly.
Ishikawa et al.60 demonstrated a large difference in the performance of top and bottom
contact devices based on the doping concentration in the active layer. As compared to the
bottom contact, the current in the top contact structure was achieved higher by seven orders
at a carrier concentration of 1014cm−3, whereas both devices exhibited almost an equal
current while concentration was increased to 1017cm−3. This is due to the availability of
sufficient charge carriers in the bottom contact structure even after filling the trap states
-6 -6
BGBC
Vgs=-0.0V BGTC
-5 -5 BGBC
Vgs=-1.8V
Vgs=-3.0V
-4 -4
Ids µ A
Ids µA
-3 BGTC -3
Vgs= 0.0V
Vgs=-1.8V
-2 -2
Vgs=-3.0V
-1 -1
0 0
0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0
Vds (V) V (V)
gs
(a) (b)
Figure 7. (a) Output and (b) transfer (at Vds = −1.5V) characteristics of OTFTs in the BGTC and
BGBC configurations.
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Table 1
42
Performance of single gate OTFTs in different configurations
completely. The device structure is not the sole factor that affects the OTFT performance;
rather the fabrication process and material properties also play dominant roles. In spite of
low performance, the bottom contact structures are promising for cost-effective flexible
electronic applications, since it can be fabricated through simple printing techniques61,62
that makes them highly suitable for large area display applications.
voltage. Currently, researchers have focused in making use of this technique to realize novel
electronic circuits, such as ring-oscillator, differential amplifier, and A/D converter.16,49
This structure consists of a gate in the bottom (BG) along with its bottom insulator
(BI), S/D contacts, organic semiconductor, and a top gate (TG) with a top insulator (TI).
Schematics of single and dual gate transistors are shown in Figs. 8(a) and 8(b), respectively.
The bottom gate accumulates the carriers in the channel, while a bias on the top gate further
increases the conductivity of the channel electrostatically. Therefore, Vt can be controlled
by using an additional gate, but at an extra cost of gate material and increased fabrication
steps. External control on Vt can bring out a highly controlled operation of the device.66
A dual gate device performs better than the single gate mainly in terms of mobility,
on/off current ratio and sub-threshold slope.67,68 Based on the bias conditions it can be
operated in top, bottom, and the dual gate modes. In the top-gate mode, a voltage at the
top gate is applied, while the bottom gate is kept at ground potential; however, the case
is reversed in the bottom-gate mode. In the single-gate bias mode, the second gate has
no effect on the conduction, whereas, both the gates play a vital role in accumulating the
charge at the OSC/insulator interface in dual-gate mode. By applying bias at both the gates,
two separate channels are formed in the active layer.
In the dual-gate mode, the total charge (QTotal ) produced by both the gates is expressed
as69
QTotal = CB . VB + CT .VT (5)
where CB /CT and VB /VT are the capacitance and voltage, respectively, at the bottom/top
gate. Furthermore, by considering fixed bias at the top gate while sweeping the voltage of
Top Gate
Top Insulator
S OSC D
S OSC D
Insulator
Bottom Insulator
Bottom Gate
Bottom Gate
(a) (b)
Vgs=-40V
Ids(µA)
-20 Vgs=-40V
-20
-10
-10
0
-10 -20 -30 -40 0
0 -10 -20 -30 -40
Vds (V) Vds(V)
(a) (b)
Vgs=-30V
Ids( µA)
Ids(µA)
-20 -20
0
0 -10 -20 -30 -40 0 0 -10 -20 -30 -40
Vds (V) Vgs (V)
(c) (d)
Figure 9. OTFT characteristics, Ids −Vds in (a) top, (b) bottom, (c) dual-gate mode, and (d) combined
Ids −Vgs plot in all three modes at Vds = −40V.
CT
Vt,B = VT (6)
CB
Table 2
Performance of different dual gate TFTs
Supply voltage
(V)
Materials of
different layers Mode of operation Ids (μA) μ (cm2/Vs) ION /IOFF Vt (V) SS (V/dec.) Vds Vgs Ref.
OSC: PDPP-TNT, S/D: Top gate −40 0.42 6.4×105 −2.3 0.83 −40 20 to −40 66
Au/Cr, TI: D139, BI:
SiO2 , TG: Al, BG: Si,
Sub: Si
Bottom gate −40 0.42 6.2×106 −2.5 0.75 −40 20 to −40
Dual gate −82 0.90 1.8×107 −0.3 0.42 −40 20 to −40
OSC: Pentacene, S/D: Bottom gate −0.7 0.02 3.2×103 −2.0 2.0 −3 5 to −15 19
Au, TI: SiO2 , BI:
SiO2 , TG: Al, BG:
n+ Si, Sub: Si
Dual gate −1.5 0.1 3.8×103 −2.2 1.3 −3 5 to −15
OSC: Pentacene, S/D: Top gate −0.1 0.005 2.3×104 −11.6 3.3 −20 20 to −20 67
Au, TI: Al2 O3 , BI:
Al2 O3 , TG: Ti, BG:
Ti, Sub: Glass
Bottom Gate −1 0.03 5×105 −2.8 0.48 −20 20 to −20
Dual gate −10 0.06 1×106 −0.8 0.47 −20 20 to −20
OSC: PTAA, S/D: Dual gate −10 0.0017 NR −2.6 NR −20 30 to −30 68
Au/Ti, TI: Poly-
isobutylmethacrylate,
BI: SiO2 , TG: Au,
BG: n+ Si, Sub: Si
45
46 B. Kumar et al.
gate. DG-TFT shows a significant enhancement in ION /IOFF , especially with the control of
off-current that makes them more reliable and suitable for display applications.
performance due to formation of a Schottky contact at the interface between the active layer
and gate. Furthermore, Chen and Shi72 reported a P3HT based vertical top and the bottom
contact transistors with a channel length of 5 μm, wherein the mobility was increased
by a factor of 3.3 and ION /IOFF by 11 for the vertical TC structure compared to planar
OTFT due to a significant reduction in the contact resistance. Interestingly, the mobility
and the on/off current ratio of vertical BC structure also increased by 1.5 and 3.6 times
in comparison to the planar BC structure due to less surface contamination in the vertical
structure.72 Furthermore, Naruse et al.73 demonstrated a self-aligned vertical multichannel
pentacene based organic transistor with a channel length of 100 nm. Due to multichannel,
it demonstrated a high saturation current of 22 μA at −20 V of gate and drain bias. The
performance of various reported vertical OTFTs are compared in Table 3, mainly in terms
of Ids , μ, ION /IOFF , and Vt .
The performance of vertical transistor can be further improved by the insertion of
a semiconductor layer at the contact/OSC interface. Watanabe and Kudo74 reported a
high performance vertical SIT by inserting an additional layer of copper phthalocyanine
(CuPc) OSC between the ITO source and the pentacene active layer to improve the carrier
injection from the source. By adding an ultrathin CuPc layer of 1 nm, the device exhibited
a larger current of 40 μA magnitude, even at low drain and gate voltages of −3 and −1 V,
respectively.
Tanaka et al.75 demonstrated a comparison between the pentacene based planar BGBC
and vertical transistor. A mobility of 0.2 cm2/V.s was achieved for the vertical transistor,
Drain
Acve channel Layer
Gate
Channel
Source
Substrate
Vgs Vds
Table 3
Performance of vertical TFTs with different combinations of materials
47
48 B. Kumar et al.
whereas, for BGBC it was limited up to 0.0018 cm2/V.s. In the vertical channel devices,
it is difficult to determine the behavior of ultra-short channel devices due to the tunnelling
effect. The performance can be improved substantially by increasing controllability of the
channel.76 It can be achieved by employing a meshed structure for the source electrode. It
allows the gate electric field to penetrate into the channel from the array of small pinholes
on the source that can reduce the drive voltage substantially.
packing density.78
Fabrication of CG-TFT begins with a metal core of yarn that works as the gate
electrode, thereafter casing it with a thin insulating layer. Later on, the OSC layer is
deposited and finally S/D contacts (metal or conductive polymer) are formed through
either thermal evaporation or soft lithography methods. The structure and cross-sectional
view of a cylindrical OTFT are shown in Figs. 11(a) and 11(b),50 respectively. Recently,
distributed cylindrical transistors have been demonstrated on a stretched fiber-like structure
for application in wearable electronics.79 These transistors can be arranged on a single fiber
substrate or at the intersection of two isolated fibers.
Recently, Jang et al.79 reported pentacene based cylindrical OTFTs with two different
polymer gate dielectrics; 1) poly(vinyl cinnamate) (PVCN) and 2) poly(4-vinyl phenol)
(PVP) with a high bending stability. They observed an increase in mobility by 2.5 times
for transistor with PVCN insulator as compared to PVP. Additionally, Maccioni et al.50 de-
veloped the pentacene based CG-OTFTs with gold and Poly-3,4-ethylenedioxythiophene:
styrene sulfonic acid (PEDOT: PSS) S/D electrodes. As compared to gold, the device
demonstrated an improvement in μ and Vt by 50% and 45%, respectively, with PEDOT:
PSS contacts. The performance parameters of different reported cylindrical OTFTs are
compared in Table 4. Cylindrical transistors can be realized for some innovative applica-
tions, such as a medical shirt for the patient’s imperative indications and defence sensors
for enemy identification.80 Regardless of their potential applications, they are limited by
their mechanical durability, especially in the daily wears.
Figure 11. CG-OTFT: (a) basic structure and (b) schematic cross-sectional view.
Organic Thin Film Transistors 49
Table 4
Performance of cylindrical OTFTs
Supply voltage
(V)
Materials of
different layers Ids (μA) μ (cm2/Vs) ION /IOFF Vt (V) Vds Vgs Ref.
OSC: Pentacene, S/D: −10 0.53 4.2×103 −7.05 −40 0 to −40 79
Au, I: PVCN, G: Al
wire, Sub: Al
OSC: Pentacene, S/D: −7 0.24 2.5×103 −4.78 −40 0 to −40 79
Au, I: PVP, G: Al
wire, Sub: Al wire
OSC: Pentacene, S/D: −0.7 0.04 7×103 −17.3 −50 0 to −100 50
Au, G: Polyimide, I:
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Polyimide, Sub:
metallic fiber
OSC: Pentacene, −0.34 0.06 3×103 −9.6 −50 0 to −100 50
S/D:PEDOT: PSS, G:
Polyimide, I:
Polyimide, Sub:
metallic fiber
4. OTFT Models
Analytical models are often incorporated in the simulators to predict and optimize the
performance of electronic devices and the circuits. These models should be precise enough
in the device simulation along with a high degree of convergence in the circuit implemen-
tation. Essentially, the model has to take into account the material specifications and the
physical bases of a device structure. Moreover, the models should be simple and easily
implementable, upgradable, reducible, and modifiable. A few proposed OTFT models are
discussed in the following subsections.
W
Ids = μ Ci (Vgs − Vt ) Vds for linear regime, Vds < Vgs − Vt (7)
L
W
Ids = μ Ci (Vgs − Vt ) 2 for saturation regime, Vds ≥ Vgs − Vt (8)
2L
This model demonstrates the transistor operation above the threshold voltage. Figure 12
illustrates the electrical characteristics of an OTFT based on the compact DC model. For this
50 B. Kumar et al.
-5
x 10
1.6
1.4 Vgs= 2.0V
1.2
Ids (A)
1 Vgs= 1.6V
Vgs= 1.2V
0.6
Vgs= 0.8V
0.4
Vgs= 0.4V
0.2
0
0 0.5 1 1.5 2 2.5 3 3.5
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Vds (V)
transistor the dimensions are W = 120 μm, L = 10 μm, and the typical model parameters
are Ci = 800 nF/cm2, μ = 1.64 cm2/V.s and Vt = 1.2 V. Numerous models have been
projected to imitate the carrier transport in an organic transistor.35,82–84 Marinov et al.30,85
demonstrated a compact DC OTFT model that claimed the transistor operation from the
ohmic to the saturation regimes, successfully.
The performance of an OTFT usually deviates from the conventional transistor due to
key parameters, such as the bulk leakage current, contact resistance, contact-OSC interface,
OSC-insulator interface, morphological disorders, device configuration, channel length
modulation, trap states, gate bias dependent mobility, and many more that raises difficulty
in proposing a unified OTFT model. In using typical MOSFET expressions for these
transistors, one needs to consider these parameters up to maximum extent. A significant
variation in the characteristics of the two similar devices and their dependence on time
make the DC modeling somewhat challenging.81
qx = Ci (Vgs − Vt − Vx ) (10)
Organic Thin Film Transistors 51
μx = μ0 (Vgs − Vt − Vx )α (11)
where μ0 is the zero field mobility, Vx is the voltage at a point x, and α is the mobility
enhancement factor. Now, the expression for drain current can be simplified by incorporating
qx (Eq. 10) and μx (Eq. 11) as
Ids
= [μ0 (Vgs − Vt − Vx ) α ] × [C i (Vgs − Vt − Vx )] × [∂Vx /∂x]
W
= (μ0 C i (Vgs − Vt − Vx ) α+1 ) ∂Vx /∂x (12)
By integrating the above expression along the channel length, the current can be
expressed for the whole channel as88
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W μ0 Ci (Vgs − Vt − Vs )(α+2) − (Vgs − Vt − Vd )(α+2)
Ids = (13)
L (α + 2)
Based on typical charge drift model, the drain characteristic of an OTFT at different
Vgs is shown in Fig. 13(a). Typical parameters include Ci = 800 nF/cm2, μ0 = 0.5 cm2/V.s,
Vt = 1.2 V and α = 0.2, whereas, the channel length and width are taken as 10 and
120 μm, respectively. In addition to this, a dependence of the drain current on the mo-
bility enhancement factor is depicted in Fig. 13(b). The factor alpha is related to the
density of localized states. The bigger it is, the larger is the TFT deviation from the ideal
behavior.
The characteristics of an OTFT strongly depends on its structure. The bottom contact
structure shows a high trap density, thereby a high alpha value in comparison to the top
contact. Cosseddu and Bonfiglio46 reported heterogeneities produced during the deposition
of semiconductor around the contacts in the bottom contact structure. It resulted in an
increase in the trap states that, in turn, reduced the mobility and drain current substantially.
Additionally, Gupta et al.18 demonstrated a large deviation from the ideal behavior of
5 x10 0.8
Vgs= 2.4V
4
0.6
3
IIds (A)
Ids (mA)
Vgs= 0.8V
Vgs= 0.4V
0 0.0
0.5 1 1.5 2 2.5 3 3.5 2 3 4 5
VVds (V)
ds (V) α
(a) (b)
Figure 13. (a) Output characteristics of the OTFT based on the charge drift model and (b) charac-
teristic plot of Ids with respect to α.
52 B. Kumar et al.
bottom contact OTFT. This was due to the smaller grain size of the semiconductor near the
contacts in comparison to the channel that resulted in a lower mobility. These morphological
disorders may possibly vary from device to device, despite the same material and similar
dimensions, since they strongly depend on the deposition accuracy of the active layer. It
raises complexity in the development of the models, especially for bottom contact structures
where these morphological disorders are prominent.
By incorporating the overdrive voltage function, the drain current can be simplified as
α+2 α+2
Vgs −Vt −Vs Vgs −Vt −Vd
W ln 1 + exp Vsub
− ln 1 + exp Vsub
Ids = α+2
μ0 Ci Vsub
L α+2
(16)
where Vsub is the sub-threshold slope voltage that corresponds to the steepness of the
curve. Figure 14(a) shows the sub-threshold characteristics with model parameters; W =
120 μm, L = 10 μm, Ci = 800 nF/cm2, μ0 = 0.5 cm2/V, Vt = 1.2 V, α = 0.2 and Vsub =
0.3 V.
Another important parameter that must be included in the model is channel length
modulation. In the saturation regime, as the drain voltage attains its saturation value; Vds =
Vds(sat) = (Vgs − Vt ), the charge at the drain end (x = L) becomes nearly zero that is called
a “pinch-off” condition. The portion of the channel that is pinched-off (L) reduces the
length of an effective channel (L − L). Since the pinch-off segment depends upon the
drain voltage, an empirical relation can be expressed between the L and the drain voltage
as85
L L
L 1− = L [1 − β (Vds − Vsat )] ≈ (17)
L (1 + β |Vds − Vs |)
where β is the channel length modulation coefficient. The TFT charge drift model (Eq. 13)
can be modified by including β as
-5
x 10
Vgs= 2.4V
8
6
Vgs= 2.0V
Ids (A)
4
Vgs= 1.6V
2 Vgs= 1.2V
Vgs= 0.8V
0 Vgs=0.4V
0.5 1 1.5 2 2.5 3 3.5
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6
Vgs= 2.0V
9 Vgs= 1.6V
Vgs= 1.2V
Ids (A)
Vgs= 0.8V
Vgs= 0.4V
12
15
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Vds (V)
(b)
Figure 14. (a) Sub-threshold and (b) output (including channel length modulation) characteristics
of an OTFT.
Figure 14(b) demonstrates the output characteristic with the channel length modulation
coefficient, β = 0.5%/V while other model parameters, such as Ci , μ0 , Vt , α, and the
device dimensions (W and L) are kept the same as discussed earlier in the sub-threshold
model.
In 1992, Xie et al.90 reported a model by incorporating bulk leakage and contact
resistance that was among the first few compact models for OTFTs. Furthermore, Necliudov
et al.82 included different structural designs to describe the response of different organic
transistors. Another model reported by Natali et al.91 was based on the contact resistance
due to a significant amount of the voltage drop across the contacts. Due to high contact
54 B. Kumar et al.
resistance in the organic transistors, the internal voltage at the channel terminals appears
somewhat lesser than the external applied voltage, especially in the linear region.
Another important point is the assumption of a symmetric structure for the organic
TFT that implies interchangeability between the source and the drain contacts. This makes
the compact model simpler, since the model developed for the one contact can be extended
for another contact. Jung et al.92 analyzed the gate-contact overlap region by mapping
this to the resistance that included contact and bulk sheet resistances. The model was first
developed for the overlapping region between the source and the gate and then the contact
resistance was doubled by considering the same overlapping between the drain and gate
terminals. Contradictorily, Burgi et al.93 considered the low charge carrier injection at the
source as a major obstruction in lowering the performance than the extraction of carriers at
drain that resulted in an asymmetry between the two contact resistances. All the proposed
models reduced to the basic compact model, while incorporating different parameters for
analyzing the actual behavior of the OTFT.
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Figure 15. (a) sp2 hybridization of two carbon atoms and (b) bonding of pz orbitals.
Organic Thin Film Transistors 55
overlapping of the electronic orbitals, the formation of electronic bands in the organic
crystal is limited to a narrow width (∼0.1eV), lower by two orders of magnitude than
silicon.97 Several researchers have demonstrated the conduction through band transport
(delocalization) in the organic single crystals but at the cryogenic temperature only. In
1985, Warta et al.98 reported a very high mobility of 400 cm2/V.s for the single crystal of
naphthalene at a temperature of 4.2 K. Later, in 2000, Schon et al.99 observed a similar
concept for the single crystals of pentacene and tetracene at 1.7K.
The transistors consisting of high purity organic single crystals demonstrate high
mobility that degrades rapidly with an increase in temperature due to the shrinkage of
polaronic bandwidth.100 Troisi and Orlandi101 reported a weak intermolecular coupling
due to the thermal excitation that could lead to the localization of charge carriers even
in highly ordered crystals. At room temperature, the lattice vibrations may turn out to be
strong enough to destroy the translational symmetry of the lattice due to high characteristic
energies of the phonons that, in turn, results in the crossover from a delocalized to the
localized charge transport. Therefore, conduction can occur through localization even in
perfect crystals due to weak intermolecular interaction.
The organic thin film can also conduct either by temperature dependent localization
or delocalization of the charge carriers. Karl102 demonstrated the possibility of delocalized
conduction in organic films that can enables high carrier mobility (up to 300 cm2/V.s)
at a very low temperature (<30 K). The conduction in OTFT degrades rapidly above
30 K temperature. Furthermore, the charge hopping (localized conduction) takes over after
100 K, resulting in an extremely lower mobility (1 cm2/Vs). The boundary between the
delocalized and localized conduction in organic semiconductors is based on the operating
temperature, intermolecular force, and mobility of carriers at room temperature.
The interaction between a semiconductor and an insulator is another important factor
for charge transport in an organic TFT. The influence of an insulator is indeed more
fundamental than just affecting the morphology of an active layer due to the polarization
effect. It strongly affects the charge carrier distribution, surface potential, and the motion
of carriers in the conducting channel. Several researchers, including Veres et al.103 and
Swensen et al.104 reported a direct dependence of the mobility on the dielectric constant (k)
of an insulator. In organic TFTs, conduction occurs due to hopping of charge between the
localized states.3,36 The polarization can increase the localization of charge by distorting
these localized states.103 The polarity of an OSC/insulator interface directly relates to the
band gap of an insulator, thereby, playing a vital role in determining the polarization effect.
56 B. Kumar et al.
The polarization (P) stands for the electric dipole moment density in a material that can
affect the charge density (Dc ) as
where E is the applied electric field, 0 is the permittivity of the vacuum, and r is the
relative permittivity/dielectric constant of the insulator. The above relation shows a linear
relationship between the polarization and the dielectric constant of an insulator. Molar
polarization of a medium (Pm ) depends on the polarizability, α p (ratio of induced dipole
moment of an atom to the applied electric field) of the material in addition to the permanent
dipole moment, Dp as
NA Dp2
Pm = αp + (21)
3ε0 3kB T
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where NA is the Avogadro number, kB is the Boltzmann constant, and T is the temperature.
High-k insulating materials result in a large polarization effect due to a high polarizability
and an existence of the random dipoles at the interface. These materials demonstrate
polarization even in the absence of any electric field due to the change in the energies of
localized states in the presence of permanent dipoles. However, in the low-k insulators,
polarization mainly occurs with an effect of the external electric field due to less number
of random dipoles.96 The insulating materials undergo a shift in charge distribution due to
polarization induced by an external electric field that, in turn, increases the capacitance, Ci
by a factor of r (or k) as
ε0 εr
Ci = (22)
tox
where tox is the thickness of an insulator that relates the probability of crossing the in-
sulator barrier height by a charge carrier. A thin film of insulator (comparable or lesser
than the localization length) limits the effect of localized states on the charge transport.
Increasing capacitance of the insulator (either by high-k insulator or reduction in tox ) re-
sults in a high density of charge at the interface at low gate voltage. Therefore, high-k
insulating materials are beneficial in producing high on-current and low threshold voltage
due to their smaller band gaps (Eg ) as compared to the low-k materials. Yu et al.105 re-
ported a decrease in the dielectric constant with an increase in the band gap, through an
expression
2
Ep Eg Eg 2
k =1+ 1− + 0.33 (23)
Eg 4Ef 4Ef
where Ep and Ef are the plasma energy of the valance band and the energy of the Fermi
level, respectively. Mostly organic insulators are characterized by a low-k, wherein the
energy gap between the bonding and anti-bonding states increases due to a decrease in
the probability of overlap molecules. It raises difficulty in the screening of charge at the
OSC/insulator interface with the application of an external electric field. On the contrary,
Veres et al.103 suggested the use of a low-k dielectric as it produces less defects and
impurities that could act as the traps. However, high-k materials might alter the energy
Organic Thin Film Transistors 57
Table 5
Field effect mobility of F8T2 based OTFTs with different insulators
Dielectric
constant
Insulator (k) Structure Surface Treatment μ (cm2/V.s) Ref.
SiO2 3.9 BG None 0.00001 106
SiO2 3.9 BG OTS 0.01 107
PVP 4.5 TG None 0.001 108
PVP 4.5 TG Rubbed polyamide 0.02 109
substrate
Si3 N4 7.4 BG None 0.00002 104
TiO2 41 BG None 0.00005 104
CYTOP 2.1 TG None 0.0015 103
Copolymer 2.5 TG None 0.015 110
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blend
levels of localized states due to randomly originated dipoles leading to an increased en-
ergetic disorder or broadening of density of states. Therefore, the carriers at a particular
temperature and field would encounter a higher potential barrier for hopping. In addi-
tion to this, the charge localization is likely to increase due to higher number of trap
states.
Low-k insulating materials are advantageous in terms of achieving high mobility, low
sub-threshold slope and low hysteresis. Veres et al.96 reported a significant change in the
mobility of PTAA based OTFTs by means of different gate insulators with k ranging from
2.1 to 10.4. The device showed a mobility of 0.005, 0.0005, and 0.00008 cm2/V.s for
CYTOP (k = 2.1), PMMA (k = 3.5), and poly(vinyl alcohol) (k = 10.4) organic insulators,
respectively. To better understand the dependence of field effect mobility on the dielectric
constant, few results are summarized in Table 5 for F8T2 {Poly[(9,9-dioctylfluorenyl-
2,7-diyl)-co-bithiophene]} polyfluorene derivative based organic transistors with different
dielectrics.
A high degree of uniformity can be achieved for an insulator if nearly all monomer
units are non-polar. The low-k dielectric produces a smooth and defect-free layer, whereas,
a high-k (inorganic insulators in most of the cases) insulator results in the surface rough-
ness leading to the morphological disorders in OSCs that in turn, reduces the mobil-
ity of carriers. High mobility can be achieved with high-k materials, but after apply-
ing some surface treatment. Salleo and Street107 reported a mobility of 0.01 cm2/V.s
for F8T2 based OTFT when the surface of SiO2 dielectric was improved by octadecyl-
trichlorosilane (OTS) treatment. On the other hand, Kanicki et al.106 reported a mobility
of 1 × 10−5cm2/V.s for the same layers without any surface treatment. Device dimensions
might also be a factor but reduction in mobility is observed mainly due to the surface
roughness.
The reliability of a homogeneous and smooth layer of the low-k insulator is much
higher than the surface treatments applied to a high-k material due to the presence of
residual reactive groups even after the treatments. In fact, non-polar organic insulators can
58 B. Kumar et al.
be employed suitably in top gate structures where surface treatements cannot be applied
safely without contaminating the active layer.96
The organic materials exhibit the characteristics similar to the amorphous materials.
Therefore, the conventional charge transport models can be adapted and extended for them.
Charge transport phenomenon in organic materials is generally modeled by the variable
range hopping (VRH), multiple trapping and release (MTR), and polaron models, which
are discussed in the following sub-sections.
DOS
Eg
2
Eg Energy
HOMO LUMO
where Etr is the energy level of a single trap and μ0 stands for the intrinsic mobility. A ratio
of the effective density of states to the traps concentration is expressed by the parameter, a.
Since the temperature affects the Fermi function, that results in a corresponding change in
the number of charge carriers. Therefore, lowering of the temperature reduces drift mobility
regardless of increase in the intrinsic mobility.
A2
Eb = (26)
2Mω02
where ω0 is the frequency, A is the constant, and M is the reduced mass of each molecular
site. Horowitz3 demonstrated the formation of localized states in the gap between the
60 B. Kumar et al.
HOMO and LUMO levels of polythiophene material. These trap states were generated due
to self-trapping of the charge by means of defects and the chain deformation. The organic
molecules are bounded together by means of weak Van der Waal forces that originate
from the instantaneous dipole-dipole interaction.3,36 A small polaron localized in the single
molecule hops from one molecule to another and thus the charge transport takes place in
the organic semiconductors.
6. Materials
Over the last two decades, there has been a significant increase in the efforts for devel-
opment and implementation of electronic components on flexible and stretchable sub-
strates. With the advent of high performance novel organic materials, the applicability
of the organic transistors have increased rapidly. These materials urge for a strong asser-
tion in terms of cost effectiveness, characteristics, properties, and processing. The per-
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formance of an OTFT strongly depends on the material constituents for the active layer;
however, the selection of materials for other layers, including insulator and electrodes,
also play a vital role. Besides this, an appropriate selection of substrate material makes
the device suitable for realizing in flexible circuitry at low cost. This section provides a
deep insight into different materials, including semiconductors, insulators, electrodes, and
substrates.
6.1.1 p-Type. Most of the organic semiconductors investigated so far exhibit the hole as
the charge carrier in their inadvertently doped form. Currently, polymers and π -conjugated
oligomers are the subject of immense research. Most extensively used p type conducting
polymers are Poly (3-hexylthiophene) (P3HT), Poly (3-octylthiophene) (P3OT), poly 3,
3 -dialkylquarterthiophene (PQT-12), Poly-9, 9 dioctyl-fluorene-co-bithiophene (F8T2),
and Poly (2-methoxy-5-(2 -ethyl-hexyloxy)-1,4- phenylene vinylene) (MEH-PPV). How-
ever, pentacene, Copper phthalocyanine (CuPc), and tetracene are invariably used as small
molecule organic materials.
Pentacene has proven to be the most widely used p-type organic semiconductor due to
high hole mobility that is an effect of adequate orbital overlapping among the molecules
in the crystal lattice. In addition to high mobility, it shows good chemical stability even
Organic Thin Film Transistors 61
C 6H 13
n
S
n
Pentacene Polyacetylene P3HT
Se
H
N
n
S n
n R S n
2,5-dimethylthiophene Polypyrrole Poly (alkylselenophene) Polythiophene
(d) (e) (f) (g)
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S S
S
S
S S
Alpha- sexihiophene
(h)
R S
R
n
C6H15 n
C6H15 F8T2
PF
(i) ( j)
C 12H 25
O S S
S S
n
PQT-12 C 12H 25
O n
H3C MEH-PPV
(k) (l)
Figure 17. Chemical structures of commonly used p-type conducting polymers and small molecules
organic semiconductors: (a) pentacene, (b) polyacetylene (PA), (c) P3HT, (d) 2, 5–dimethylthiophene,
(e) polypyrrole, (f) poly (alkylselenophene), (g) polythiophene, (h) α-Sexithiophene, (i) phenol
formaldehyde (PF), (j) F8 T2 , (k) MEH-PPV, (l) Poly(3,3 -didodecylquaterthiophene) (PQT-12), (m)
DiF-TESADT, (n) poly [5,5 -bis(3-dodecyl-2-thienyl)-2,2 -bithiophene], and (o) benzodithiophene
dimer. (Continued on next page)
62 B. Kumar et al.
Si
F F
Si
Dif-TESADT
(m)
S
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5,5'- bis(4-hexylphenyl)-2,2'-bithiophene
(n)
S S
S S
Benzodithiophene dimer
(o)
in adverse environmental conditions, orderly formation in thin film structure, and good
interface with commonly used electrode metals such as gold and aluminum.52 Regardless
of better performance as compared to others, it is not a good choice for low-cost printing
methods due to its lower solubility.
In comparison to the pentacene, P3HT exhibits lower mobility but simultaneously
shows outstanding solubility in a range of organic solvents that makes it suitable for
fabricating through solution processing techniques.116 It was initially synthesized by Mc-
Cullough et al.117 in 1993 that was further utilized by Bao et al.118 to realize the first P3HT
based TFT in 1996. Chemical structures of different p-type organic materials are shown
in Fig. 17.119,120 The performance in terms of field effect mobility and on/off current ratio
(ION /IOFF ) of various p-type conducting polymers and the small molecule organic materials
along with their structures is summarized in Tables 6 and 7, respectively.
Organic Thin Film Transistors 63
Table 6
Field effect mobility and on/off current ratio of p-type conducting polymers
Supply voltage
(V)
(Hole-mobility) ION /
Material Structure μ (cm2/V.s) IOFF Vds Vgs Ref.
P3HT [Poly BGBC 0.11 1.9×106 −60 50 to −100 29
(3-hexylthiophene)]
BGBC 0.08 7×103 −40 40 to −40 121
BGBC 0.002 102 −30 30 to −30 122
BGBC 0.001 102 −30 0 to −4 123
BGBC 0.0025 1.5×101 −40 20 to −20 72
P3HT [Poly TGBC 0.00003 5.6×106 −40 0 to −40 124
(3-hexylthiophene)]
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Table 6
Field effect mobility and on/off current ratio of p-type conducting polymers (Continued)
Supply voltage
(V)
(Hole-mobility) ION /
Material Structure μ (cm2/V.s) IOFF Vds Vgs Ref.
PTAA BGBC 0.041 NR −60 0 to −40 31
Poly(triarylamine)
DH4T BGBC 0.04 105 −20 4 to −10 130
(Dihexylquaterthio-
phene)
TFB Pol [9,9-dioctyl- TGTC 0.02 NR −40 10 to −40 131
fluorene-co-N-(4-
butylphenyl)-
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diphenylamine]
PBTTT Poly(2,5- BGTC 0.34 NR NR 0 to −70 132
bis(3-alkylthiophen-
2-yl)thieno[3,2-
b]thiophenes
PTV Poly (thienylene BGBC 0.00035 NR −1 0 to −20 133
vinylene)
PB16TTT BGBC 0.14 105 −100 20 to −100 134
Poly(2,5-bis(3-
hexadecylthiophene-
2-yl)thieno[3,2-
b]thio-phene)
To make the high performance pentacene material compatible to the solution processing
fabrication techniques, Herwig and Mullen149 synthesized a soluble pentacene precursor
in 1999. This was further explored by Afzali et al.150 and Anthony et al.151 to obtain
the thin film of pentacene material with an ease of processing at a low cost. Some of
the frequently used pentacene precursor includes 6,13-bis triisopropyl-silylethynyl (TIPS)
pentacene,151–153 Tetracene,17 and difluoro-trietetracenethylsilylethynyl anthradithiophene
(diF-TESADT).154,155
Organic semiconductors are also promising for carrier injection and transport layers in
a light emitting diode. These materials should exhibit some desirable characteristics, such
as good conductivity, adequate luminescence efficiency, sufficient radical anion stability,
and high color saturation with a narrow spectrum. Invariably used p-type materials for the
hole transport layer in organic LEDs are napthyl-substituted benzidine (NPB) and biphenyl-
diamine (TPD), whereas, CuPc is one of the preferred materials for the hole injection layer
at the top of the anode. The CuPc material exhibits good absorption characteristics in the
ultraviolet region and therefore, can be used as the photo conductor with an ease of light
absorption on either side of the blue/green region.
6.1.2 n-type. The majority of research work has focused on achieving high performance
p-type OSCs. However, only little effort has been made to synthesize the novel n-type
Organic Thin Film Transistors 65
Table 7
Field effect mobility and on/off current ratio of p-type small molecule organic
semiconductors
phthalocyanine)
BGTC 0.021 103 −4 2 to −8 139
Pentacene BGTC 0.43 NR −30 40 to −60 52
BGBC 0.28 NR −30 40 to −60 52
PDPP-TNT TGBC 0.7 106 −40 20 to −40 66
(Diketopyrrolopyrrole-
naphthalene
copolymer)
BGBC 0.28 NR −40 0 to −60 140
TGBC 0.40 NR −40 0 to −60 140
TIPS Pentacene (Tris- BGBC 0.07 NR −40 20 to −40 141
isopropylsilylethynyl)-
pentacene
BGBC 0.02 104 −40 40 to −60 142
DiF-TESADT [2, BGBC 0.17 NR −40 20 to −40 143
8-difluoro-5, 11-
bis(triethylsilylethynyl)
anthra-dithiophene]
CuPc (Copper BGBC 0.018 NR −100 0 to −100 144
phthalocyanine)
2A (2,2-bianthyl) BGTC 1.0 NR −100 0 to −100 145
BGBC 1.0 NR −100 0 to −100 145
Sexithiophene (α BGTC 0.37 NR −2 0 to −50 146
-Sexithienyl)
αα BGTC 0.1 104 −20 20 to −30 147
–didecylquaterthiophene
BGBC 0.5 105 −20 20 to −30 147
diF- TEG ADT BGBC 5.4 106 −40 40 to −40 148
(Triethylgermylethynyl-
substituted
anthradithiophene)
66 B. Kumar et al.
The high performance n-type organic semiconductors can be synthesized by adding –Cl,
–CN, and –F groups to the outer most orbital of molecules, since these groups are strongly
capable of withdrawing the electrons. With the same thought, Bao et al.158 demonstrated
an example of making n-type material, copper hexadecafluorophthalocyanine (F16 CuPc),
by adding –F group to the p-type material CuPc, that exhibited an electron mobility of
0.03 cm2/V.s. Furthermore, Malenfant et al.160 reported a highly stable n-type material; N,
N -dioctyl-3,4,9,10-perylene tetracarboxylic diimide (PTCDI-C8H) with a high electron
mobility of 0.6 cm2/V.s.
The mobility of the p- and n-type organic materials has improved remarkably with the
passage of time as shown in Fig. 19. A continuous growth is observed for both the types
of materials, attributed to the unremitting advancements in the synthesis and fabrication
process. Pentacene is the best performing p-type material that showed remarkable rise in
the mobility during the last decade. Similarly, fullerene (n-type) has also demonstrated a
noteworthy improvement.
A number of high performance soluble fullerene derivatives are investigated for n-type
OTFTs. Tiwari et al.175 reported an OTFT with 6, 6-phenyl C61 butyric acid methyl ester
(PCBM) deposited through solution processing, which exhibited a mobility of 0.13 cm2/V.s.
Perfluoropentacene (C22 F14 ) and perfluoro-p-sexiphenyl (C36 F26 ) are the other novel n-type
materials employed in OTFTs, whereas, Tris-(8-hydroxyquinoline) aluminum (Alq3 ) is a
commonly used material for the electron transport layer in the organic LEDs.
n-channel and other for the p-channel. Both device materials can be patterned and deposited
locally and sequentially.185 With such a method, it is difficult to match the p- and n-channel
transconductances while keeping the parameter spread within limits. To circumvent this
problem, complimentary circuits are fabricated using ambipolar transistors based on a
single OSC film and a single type of electrode.195,196
C10H21 C10H21 S
N N
C8H17
C8H17
N
O N
S O
S
n
S n
N O S
N O
C8H17
C8H17
Downloaded by [Brijesh Kumar] at 23:32 20 February 2014
C10H21 PDPP-TNT
C10H21 PDPP-TBT
(a) (b)
S S
n
S S
R
PBTTT
(c) (d) C60 Fullerene
C13H27
O N O
CH2C7F15
NC
O N O
N
N O N O
O N O
CN PTCDI-C13H27
Dimethyldicyanoquinone-diimine F15-NTCDI CH C H C13H27
2 7 15
Figure 18. Chemical structures of commonly used n-type conducting polymers and small
molecules organic semiconductors: (a) diketopyrrolopyrrole-naphthalene copolymer (PDPP-
TNT), (b) diketopyrrolopyrrole-benzothiadiazole copolymer (PDPP-TBT), (c) poly (2,5-bis
(3-alkylthiophene-2-yl) thieno [3,2] thiophene) (PBTTT), (d) fullerene (C60 ), (e) dimethyl-
dicyanoquinone-diimine, (f) N,N0-bis(1H,H1-per- fluorooctyl) naphthalene-1,4,5,8-tetracarboxylic
diimide (F15 -NTCDI), (g) N,N -ditridecylperylene-3,4,9,10-tetracarboxylic diimide (PTCDI-
C13 H27 ), (h) tetracyan-oquinodimethane (TCNQ), (i) perylene tetracarboxylic dianhydride (PTCDA),
and (j) N,N -dioctyl-3,4,9,10-perylene tetracarboxylic diimide (PTCDI-C8). (Continued on next page)
68 B. Kumar et al.
O O O
CN NC R
O N O
NC CN O N O
O O O
TCNQ PTCDA PTCDI-C8 R
A high gain inverter circuit was reported by Vladu et al.194 by using a natural pigment-
Indigo that demonstrated balanced electron and hole mobility. Furthermore, Dodabalapur
et al.197 suggested a heterostructure for ambipolar transistor by using two layers of dif-
ferent semiconductors (p and n both). Similarly, Wang et al.187 reported a C60 /pentacene
based bottom contact heterostructure with the hole and electron mobility of 0.14 and
0.23 cm2/V.s, respectively. Recently, Ha et al.191 reported an ambipolar transistor based on
diketopyrrolopyrrole-benzothiadiazole copolymer (PDPP-TBT) with a significantly high
hole and electron mobility of 0.53 and 0.58 cm2/V.s, respectively.
Table 8
Field effect mobility and on/off current ratio of different n-type conducting polymers
diimide)
P(ND12OD-T2) Poly TGBC 0.62 105 8 0 to 80 162
{[n,n9-bis
(1-octydodecyl)-
naphthalene-1,4,5,8-
bis(dicarboximide)-2,6-
diyl]alt-5,59-(2,29-
bithiophene)}
Benzobis (thiadiazole) BGBC 0.1 108 20 −20 to 40 169
(BBT) derivative
P(NDI2OD-T2) TGBC 0.5 106 60 −20 to 60 170
NDI2-DTP TGBC 1.2 NR 25 0 to 25 171
[Dithienopyrrole (DTP),
2,2 0-(4-n-hexyl-4H-
dithie-no[3,2-b:2 0,3 0
-d]pyrrole-2,6-
diyl)bis(N,N 0
-bis(n-
hexyl)naphthalene-
1,4:5,8-
bis(dicarboximide)]
P(NDI2OD-T2) TGBC 0.1 NR 60 −20 to 60 172
(PDPP-TBT), TGBC 0.1 NR 40 −40 to 40 172
(diketopyrrolopyrrole-
benzothiadiazole
copolymer)
PDI-8CN2 N, N BGBC 0.01 105 20 −30 to 50 173
bis-(octyl-)-
dicyanoperylene-3,4:9,
10-bis(dicarboximide)
70 B. Kumar et al.
Table 9
Field effect mobility and on/off current ratio of n-type small molecule organic
semiconductors
Supply voltage
(Electron- (V)
mobility)
Material Struture μ (cm2/V.s) ION /IOFF Vds Vgs Ref.
F16 CuPc (Copper BGTC 0.009 NR 100 0 to 100 144
hexadeca
fluorophthalocyanine)
F16 CuPc (Copper Vertical 0.03 28 10 0 to 20 174
hexadeca
fluorophthalocyanine)
PTCDI C-8 N,N -dioctyl- Vertical 0.6 89 10 0 to 20
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3,4,9,10-perylene
tetracarboxylic diimide
NTCDA Vertical 0.003 17 10 0 to 20
PCBM BGBC 0.0348 1.4×106 40 −10 to 175
(phenyl-C61-butyric 40
acid methylester)
TEPP {6}-1-(3-(2- BGBC 0.0779 1.4×106 40 −10 to
thienylethoxycarbonyl)- 40
propyl)-{5}-1-phenyl-
[5,6]-C61
Perfluoropentacene BGTC 0.22 105 40 −50 to 176
100
F8 [Poly(9,9- BGTC 0.025 103 50 0 to 100 177
dioctylfluorene)]
polyfluorene derivative
Poly[(9,9- BGTC 0.001 103 50 0 to 100
dioctylfluorenyl-2,
7-diyl)-co-(1,4-benzo-
{2,1’,3}-thiadiazole)]
(F8BT) polyfluorene
derivative
PDIN1400, Polyera TGBC 0.037 NR 40 0 to 60 31
Activink N1400
C60 Fullerene BGTC 5.1 106 60 −20 to 178
60
[60] PCBM BGTC 0.21 104 80 0 to 80 179
Methanofullerenes
[6,6]-phenyl-C61-
butyric acid
ester
Table 9
Field effect mobility and on/off current ratio of n-type small molecule organic semicon-
ductors (Continued)
Supply voltage
(Electron- (V)
mobility)
Material Struture μ (cm2/V.s) ION /IOFF Vds Vgs Ref.
[70] PCBM [6,6]-phenyl- BGTC 0.10 103 80 0 to 80
C71-butyric acid
methyl ester
Methanofullerene[6,6]- BGTC 0.2 103 80 −50 to 180
phenyl C61 -butyric acid 50
methyl ester
F16 CuPc (Copper BGBC 0.02 NR 100 0 to 100 181
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hexadeca
fluorophthalocyanine)
F16 CuPc (Copper BGBC 0.002 103 8 −1 to 8 182
hexadeca
fluorophthalocyanine)
(polyaniline doped with camphor-sulphonic acid) are commonly used conducting poly-
mers for the electrodes.174,175 The chemical structures for some of the organic electrode
materials are shown in Fig. 20, while some of the commonly used organic electrode mate-
rials are outlined in Table 12. Cossedu et al.46 reported an OTFT, wherein the source, drain,
and gate electrodes were made of PEDOT material. This transistor exhibited a mobility of
0.01 cm2/V.s in BGTC and 0.004 cm2/V.s in BGBC configurations. Additionally, Maccioni
1
10
Pentacene
0 Polythiophene
10
PCBM
C60MC12
-1
10 C60
µ (cm /V.s)
-2
10
2
-3
10
-4
10
Figure 19. Comparative plot of mobility growth for p- and n-type OSCs.
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72
Table 10
Field effect mobility and on/off current ratio of ambipolar OSCs
Material Structure Hole (h) Electron (e) ION /IOFF Vds (h) Vds (e) Vgs Ref.
NiDT BGBC 2.5 × 10−4 2.0 × 10−5 NR −30 30 ±30 185
P(NDI2OD-T2) Vertical NR NR 103 −10 3 ±40 186
Pentacene and BGTC Hetrostructure 0.042 0.041 105 −40 40 ±60 176
perfluoropentacene
C60/Pentacene BGTC Hetrostructure 0.14 0.23 10 −100 100 ±100 187
PDPP3T [Poly BGBC 0.02 0.02 NR −60 60 ±80 188
(Diketopyrrolopyrrole-
terthiophene)]
PPV/PCBM Blend BGBC 0.01 10−6 NR −2 20 −20/100 189
PDPP-TBT DG 0.5–1.64 0.17–0.5 105 −40 40 ±40 190, 191
(Diketopyrrolopyrrole-
Benzothiadiazole
Copolymer)
PDPP-TBT BGTC 0.064 0.037 NR −70 70 ±75 192
(Diketopyrrolopyrrole-
Benzothiadiazole
Copolymer)
PTDPPSe-Si Hybrid BGTC 3.97 2.2 NR −100 100 ±100 193
siloxane-solubilizing
group (dithienyl-
diketopyrrolopyrrole
and selenophene)
Indigo TGBC 0.005–0.01 0.01 NR −10 10 −9 to 12 194
Organic Thin Film Transistors 73
Table 11
Work functions of inorganic electrode materials
ITO 5.3 74
et al.50 reported a cylindrical OTFT with S/D contacts of PEDOT: PSS that demonstrated a
mobility of 0.06 cm2/V.s and the on/off current ratio of 3 × 103.
HO OH
HO OH
O O
NH2
NH n
COOH
n
3,4-dihydroxy-L-phenylalanine
PEDOT COOH Eumelanin L-DOPA
(a) (b) (c)
Figure 20. Chemical structures of commonly used organic electrode materials (a) Poly (3, 4-ethylene
dioxythiophene) (PEDOT), (b) Eumelanin, and (c) 3, 4-dihydroxy-l-phenylalanine (l-DOPA).
74 B. Kumar et al.
Table 12
Organic electrode materials
Material Ref.
PEDOT/ PSS Poly(ethylene-dioxythiophene)/ Polystyrene sulfonated 28
PANI/CSA Polyaniline/Camphor-sulphonic acid 28
Poly(3,4-thylenedioxythiophene) 28
Polypyrrole 205
Polythiophene 205
Polyanilene 205
Poly(3,4-thylenedioxythiophene) 28
PEDOT/PSS Poly(ethylene-dioxythiophene)/ Polystyrene sulfonated 136
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slope and low threshold voltage due to their smaller band gaps as compared to the low-k
materials. Dielectric constants of some of the frequently used inorganic dielectric materials
are summarized in Table 13.
Several high-k insulators, including La2 O3 ,206 HfSiOx ,207 HfLaO,208 Pr6 O11 ,209
HfO2 ,123 and Al2 O3 210 are investigated that resulted in a significant decrease in Vt and
SS. In addition to the material of high-k, the thickness of the dielectric layer should be
kept low, not only to operate at lower voltages, but also to reduce the short channel effects
in submicron devices. Moreover, it should possess high breakdown voltage and long-term
stability. These requirements are met by a number of dielectric materials, such as SiO2 ,
Al2 O3 , PVP, ZrO2 , P4VP, PMMA, BZT, PVDF, HfO2 , and propylene.
Organic insulating materials, such as PMMA, PS, PVP, PI, and PVA demonstrate
the ability of processing through low cost fabrication techniques, good adherence, and
fair dielectric properties.215–217 Chemical structures of some of the organic insulators are
shown in Fig. 21 and their dielectric constants are summarized in Table 14. In general, a
high operating voltage is required for the organic insulator based TFTs due to their low
dielectric constant. As a solution, a thin insulating layer can be formed but it results in a high
Table 13
Dielectric constants of inorganic insulating materials
Table 14
Dielectric constants of organic insulating materials
CH3
R1 R2 n
n
Si O Si
O O CH3
n
OH
Poly(methylmethacrylate) Silicon network polymer Poly(vinyl phenol)
CH2 H2C
n
n OH
Polystyrene Parylene Poly vinyl alcohol
Figure 21. Chemical structures of organic dielectric materials: (a) polymethyl methacrylate
(PMMA), (b) silicon network polymer, (c) poly vinyl phenol (PVP), (d) polystyrene (PS), (e) parylene,
and (f) polyvinyl alcohol (PVA).
76 B. Kumar et al.
Table 15
Organic substrate materials
Material Ref.
PEN (Polyethylene naphthalate) 137
Polyimide 224
ITO-coated polyester 225
Polyester 226
PET (Polyethylene terephthalate) 227
Plastic 142
Plastic 143
Paper 6
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leakage current due to the presence of defects in a thin organic layer. As an alternative, Klauk
et al.10 reported a high performance OTFT by means of forming bi-layers of insulating films
through spin coating of block copolymer on the thermally grown SiO2 surface. Similarly,
Angelis et al.218 and Chou et al.219 demonstrated the organic transistors with bi-dielectric
layers of SiO2 /PMMA and SiO2 /Polyimide that resulted in the mobility of 1.4 cm2/V.s at
−30 V and 2.05 cm2/V.s at −40 V, respectively.
Table 16
Inorganic substrate materials
Material Ref.
Heavily doped silicon 128
Highly doped n-type silicon 18
Glass 8
Organic Thin Film Transistors 77
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Figure 22. Basic fabrication steps for the bottom gate top contact OTFT.
7. Fabrication
The technique opted to deposit the materials during fabrication plays a crucial role while
determining the performance of different OTFTs, even though similar set of materials
are used to fabricate them. Commonly used fabrication techniques include electron-beam
/thermal vacuum evaporation,217,228 solution processing,123 Langmuir-Blodget,3 physical
vapor deposition (PVD),212 photolithography,18 and shadow masking.49 Organic materials
allow the fabrication of transistor and circuits up to 120◦ C that reduces the manufacturing
cost, spectacularly. A fabrication flow of bottom gate top contact structure is shown in
Fig. 22. The foremost step includes the selection of a substrate that may be silicon,18
aluminum,49 glass,8 paper,6 plastic,7 fiber,9 foil,13 etc. Heavily doped (n/p) silicon wafer
acts as the gate and substrate simultaneously.18,32
A dielectric layer of SiO2 can be grown by thermal oxidation of silicon that exposes
the wafer to an oxidizing environment at a high temperature. The other dielectric material
like Al2 O3 is deposited by atomic layer deposition using tri-methyl aluminum, whereas
the solution processing technique is used to deposit the gate and the insulating layer of
organic materials on the flexible substrates. Thereafter, an active layer is formed through
either vacuum evaporation or the solution processing method dependent on the type of
organic semiconductor. S/D contacts in top contact structure are deposited by the shadow
masking technique, whereas in the bottom contact structure they are formed and patterned
lithographically prior to the deposition of OSC layer. Small molecule semiconductors such
78 B. Kumar et al.
as pentacene and oligothiophenes are usually deposited through the vacuum evaporation
method, since they exhibit low solubility in the organic solvents. Contradictorily, conduct-
ing polymers, such as P3HT and polythiophene are soluble in solvents like chloroform
and toluene;123 therefore, they can be deposited through spin coating or ink-jet printing
techniques. Details of these techniques are incorporated in the following sub-sections.
is heated by an electric filament. However, in the electron beam evaporation, this heating
is done through bombardment with a high energy electron beam (usually several KeV)
by an electron gun. A vacuum chamber is needed in both the techniques to process the
material. It must be evacuated to a minimum pressure of 10−5 Torr36 to suck the evaporated
particles directly on the substrate without colliding with the molecules of the background
gas.
Vacuum evaporation methods have been applied frequently to deposit the single crystals
as well as the thin film of organic semiconductors. Butko et al.229 reported a single crystal
based organic transistor that exhibited a hole mobility of 0.3 cm2/V.s and the current on/off
ratio of 105, wherein the crystals were grown by the thermal deposition method. Similarly,
Yun et al.230 reported a pentacene thin film transistor with a mobility of 0.32 cm2/V.s and
a high on/off current ratio of 2.2 × 106, deposited through thermal vacuum evaporation
technique. Additionally, Kumaki et al.145 reported a high mobility of 1 cm2/V.s for the
anthracene oligomer based transistor, wherein, an active layer of 30 nm was formed through
this deposition method.
Dimitrakopoulos et al.231 in 1996 demonstrated the deposition of a pentacene film
through electron beam evaporation method that yielded a mobility of 0.038 cm2/V.s. Later,
in 2008, Cai et al.232 reported a high performance pentacene based OTFT deposited through
this technique. The transistor exhibited the current, mobility, threshold voltage, on/off cur-
rent ratio, and sub-threshold slope of −80 μA, 1.1 cm2/V.s, −2.71 V, 105, and 0.44 V/decade,
respectively. The electron beam evaporation technique yields a higher density film com-
pared to thermal evaporation due to a strict control on the evaporation rate. Even, several
different materials can be deposited by using a multiple crucible electron beam gun without
breaking the vacuum pressure. Besides this, it helps to increase the adhesion of material
to the substrate and also improves the interfacing between the layers. The electron beam
evaporation technique only involves the heating of material rather than the entire crucible.
Therefore, the contaminations are less produced from the crucible as compared to the
thermal vacuum evaporation method, wherein the whole crucible gets heated up to high
temperature. On the other hand, the electron beam evaporation method requires a complex
and costly electron processing unit that is difficult to scale linearly as compared to the
thermal evaporation technique.
The performance of an OTFT primarily depends on the purity of organic material,
substrate cleaning and the rate of deposition. The mean free path of OSC particles and
occurrence of redundant molecules near the substrate play a crucial role in achieving a high
Organic Thin Film Transistors 79
Glass S OSC D
Substrate
(d)
Photoresist Insulator
Substrate S OSC D
(a)
Substrate
Photoresist Photoresist (e)
Substrate
(b) G
Insulator
Photoresist S D Photoresist S OSC D
Substrate Substrate
(c) (f)
Figure 23. Fabrication flow of TGBC organic transistor. (a) A photoresist layer is developed on
the PET substrate and exposed to light; (b) through cleaning unexposed photoresist is removed; (c)
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contact material is deposited through vacuum evaporation; (d) cleaning is carried out for finishing the
contacts; (e) OSC is deposited through ink-jet printing followed by the insulator layer through spin
coating; (f) holes are made for the interconnections along with printing of gate.
Table 17
Performance of different p-type OTFTs on the basis of deposition method of OSCs
Supply voltage
(V)
Method of Organic Ids μ ION Vt
OSC deposition semiconductor (μA) (cm2/V.s) /IOFF (V) Vds Vgs Ref.
Drop casting TIPS −0.9 0.012 6×103 −1.8 −20 10 to −10 234
pentacene
Polymer inking Pentacene −40 0.033 108 −1.2 −5 0 to −5 233
and stamping
Thermal Pentacene −22 0.32 2.2×106 −10 −30 20 to −40 230
evaporation
Thermal Pentacene −3 0.19 107 −3 −20 0 to −20 237
evaporation
Thermal Pentacene −0.8 0.038 NR −6 −20 20 to −40 238
evaporation
Inkjet printing polythiophene −0.1 0.01 80 −4 −40 20 to −40 227
(PHT)
Spin coating P3HT −1.4 0.015 8.4×106 −1.33 −10 10 to −10 56
Electron beam Pentacene −80 1.1 105 −2.71 −50 0 to −20 232
vacuum
deposition
Organic Thin Film Transistors 81
1
10
VPSM (P)
0 SPCP (P)
10
SPSM (P)
-1
10
µ (cm2/V.s) -2
10
-3
10
-4
10 VPSM (n)
SPCP (n)
-5 SPSM (n)
10
1980 1985 1990 1995 2000 2005 2010 2015
Year
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Figure 24. Comparative plot for growth in field effect mobility of p- and n-type transistors.
Over the last two decades, researchers have demonstrated noteworthy improvement
in the fabrication methodologies of organic devices.227–239 Figure 24 shows a comparative
study of growth in mobility for different p- and n-type organic materials such as vacuum
processed small molecule (VPSM), solution processed conducting polymer (SPCP), and
solution processed small molecule (SPSM). The highest mobility is reported for the p- and n-
type small molecule organic materials, deposited through the vacuum evaporation method.
However, the solution processed p- and n-type conducting polymers have also shown
noteworthy progress with the passage of time. In addition to this, the small molecule (p/n)
organic materials deposited through solution processing have demonstrated a continuous
growth during the last decade due to synthesis of several precursors like TIPS pentacene151
and diF-TESADT154 that showed compatibility with the solution processing techniques.
The polymer inking and stamping technique is promising for fabricating organic de-
vices with shorter channel length. Li et al.233 reported a fully printed pentacene organic
transistor (L = 1 μm) on poly ether sulfone (PES) substrate by using this technique. The
device exhibited a significantly high current of 40 μA at low bias voltage (−5 V). In fact,
by using polymer inking and stamping printing methods, they demonstrated roll to roll
printing that is attractive due to low-cost fabrication, high throughput, and processing at
room temperature.
P3HT based OTFT. Besides this, an increase of 8.5% in mobility and a decrease of 50% in
threshold voltage were observed on reducing the thickness from 160 to 20 nm. Similarly,
Kano et al.41 demonstrated the effect of Dibutylquaterthiophene active layer thickness on
the device performance. On increasing the thickness from 20 to 80 nm, they observed a
reduction in mobility from 0.05 to 0.03 cm2/V.s and an increase in the sub-threshold slope
from 3.5 to 5 V/decade due to proportionate increase in the access resistance. Surprisingly,
a large variation from −10 to +18 V in the threshold voltage was observed with an increase
in tosc from 20 to 80 nm.
To improve the performance of OTFT, noteworthy efforts have been made for fab-
ricating the devices with shorter channel lengths. Rogers et al.240 in 1999 reported α-
sexithiophene (α-6T) based p-type and F16 CuPc based n-type OTFTs, each with 100 nm
channel length. These devices performed well at low voltage of ±3 V that resulted in mobil-
ity of 0.0001 and 0.0008 cm2/V.s and current of −1.5 and 2 μA for p- and n-type transistors,
respectively. Later in 2003, Zhang et al.241 observed a low voltage operation of sub-micron
pentacene TFT of 30 nm channel length that yielded a mobility of 0.02 cm2/V.s and on/off
current ratio of 102 at supply voltage of −2 V. Furthermore, Lee et al.242 in 2005 reported an
organic transistor of 10 nm length with a reasonably good drain and transfer characteristics
at low voltage of −0.3 V. Additionally, they analyzed the performance dependence on the
channel length variation. Scaling down the length from 125 to 10 nm resulted in an increase
in current by thirteen times and decrease in ION /IOFF by 71%.
presence of dipoles. However, this resistance reduced to half in the absence of dipole at the
contact/OSC interface. They observed that the contact resistance extracted in the presence
of dipoles was almost equal to the experimental result. This analysis justified the existence
of dipoles in the organic devices. The presence of dipoles at the metal/OSC interface results
in a disordered molecular structure of an active layer. Gupta et al.18 reported the effect
of morphological disorders in pentacene based top and bottom contact organic transistors.
The top contact structure exhibited uniformity in the grains of the active layer, whereas
diversity in the grain size was observed in the bottom contact, especially at the contact/OSC
interface due to the deposition of semiconductor on the pre-patterned S/D electrodes. As
a result, the mobility reduced by two orders of magnitude in the bottom contact structure
compared to the top contact.
Several researchers have proposed few solutions to overcome this interface barrier.
Tiwari et al.245 reported considerable improvement in the performance of organic transistor
by depositing an additional thin organic active layer between the contacts and the semicon-
ductor. Furthermore, Ishikawa et al.60 demonstrated an improvement in the performance of
Downloaded by [Brijesh Kumar] at 23:32 20 February 2014
p-type bottom contact TFT by inserting an additional p+ region near the contacts. Moreover,
Watanabe et al.74 showed an improvement in ION /IOFF (540 times) by adding a layer of CuPc
organic material between the source (ITO) and the active layer (pentacene) to improve the
carrier injection.
Another factor that strongly affects the device behavior is the deposition parameters
that include substrate temperature and the deposition rate. Dimitrakopoulos et al.231 reported
the effect of substrate temperature on the quality of the semiconductor film. They observed
a disordered pentacene layer with a mobility of 0.00042 cm2/V.s at substrate temperature
of 45◦ C. However, a highly ordered film with a mobility of 0.038 cm2/V.s. was achieved at
room temperature. Agrawal246 reported the effect of the pentacene deposition rate on the
performance of OTFT. The device showed a reduction in on/off current ratio by 60% and
an increase in the sub-threshold slope by 25% with a higher pentacene deposition rate from
1 to 2.5A◦ /sec. This implies the possibility of achieving a high performance smooth layer
of active material through proper tuning of the deposition parameters.
assembled monolayer on the substrate. Klauk et al.49 reported a high performance pentacene
TFT consisting of very thin (5.7 nm) self-assembled monolayer of n-octadecylphosphonic
material with drain current and mobility of 5 μA and 0.4 cm2/V.s, respectively, at low
operating voltage of −3 V. In addition to this, a low leakage current and sub-threshold
slope of 0.5 pA and 100 mV/decade, respectively, was observed. Additionally, Ito et al.252
reported a self-assembled monolayer of OTMS on the SiO2 surface. By producing this
monolayer, a hole mobility of 3.0 cm2/V.s for pentacene, and an electron mobility of
5.3 cm2/V.s for C60 based transistors were reported. The excellent characteristics of the
interface between the layers not only reduced the defects, but also increased the number of
injected carriers to the channel.
Table 18
Dimensional parameters, materials, and performance of different TFTs used in the inverter circuits
85
86 B. Kumar et al.
Vdd=10V
10
8
S
P-Type
VOUT (V)
6
VIN D VOUT
N-Type 4
S
2 Vdd =10V
0 2 4 6 8 10
GND VIN (V)
(a) (b)
2.0 10
8
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1.5
Voltage (V) 6
Input
Gain
1.0 Output
4
0.5 2
0
0.0
0 2 4 6 8 10 0 2 4 6 8 10 12
VIN (V) Time(Sec.)
(c) (d)
Figure 25. Organic complementary inverter: (a) schematic, (b) VTC plot, (c) gain, and (d) transient
response.
Table 19
Performance parameters of organic complementary, all p-organic and hybrid complementary inverters
Device combination O/P VOH I/P VIH O/P VOL I/P VIL High NMH Low NML High-low τ PHL Low-high τ PLH τp
CuPc; p-type F16 CuPc; 9.7 4.7 1.6 2.7 5.0 1.1 1.9 1.00 1.50
n-type
Pentacene; p-type C60 ; 10 5.0 0.8 4.4 5.0 3.6 0.6 0.35 0.48
n-type
All Pentacene 8.0 6.8 0.2 4.4 1.5 3.9 0.9 0.80 0.85
Pentacene; p-type 9.7 5.7 0.2 3.7 4.0 3.5 0.5 0.60 0.55
a-Si:H; n-type
Pentacene; p-type ZnO; 9.7 5.0 0.1 3.0 4.7 2.9 0.25 0.30 0.28
n-type
87
88 B. Kumar et al.
that matches with the desired level, 0 V. However, it can be observed from Table 19, that
the noise margins of all p-organic inverters are not perfectly matched with the ideal silicon
based transistors.
Organic p-type only logic shows operational limitations of large circuits due to low
noise margin and large parameter variations.68 The performance of p-type inverters can
be enhanced by using dual gate TFTs wherein biasing the top gate controls the threshold
voltage. The top gate electrostatically modifies the charge carrier distribution in the channel,
accumulated by the bottom gate. The bottom gate strongly drives the transistor, whereas
the top gate weakly couples to the channel and linearly shifts the Vt .
Compared to the single gate, the dual gate OTFTs outperform in voltage swing, gain,
and propagation delay because of their low threshold voltage and high on-current. Spijkman
et al.68 reported noise margins of 0.6 and 5.9 V for PTAA organic semiconductor based
single and dual gate inverters, respectively. Similarly, Myny et al.257compared the pentacene
based single and dual gate organic TFTs, wherein the DG OTFT improved the voltage swing
and noise margin by 13% and 143%.
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The performance of these inverter circuits can be further increased by the bootstrapping
technique that helps in pulling down the output voltage to the minimum level, thereby in-
creasing the output voltage swing and noise margin.258 Raval et al.123 observed an increment
in gain and voltage swing by 13% and 40%, respectively, for the P3HT based inverter by
applying the bootstrapping technique. Similarly, Jeon et al.259 showed a significant increase
in the performance of pentacene based all p-inverter circuit by employing this technique.
Figure 26. OLED (a) schematic and (b) circuit driven by an OTFT.
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ION /IOFF of 108 comparable to that of a-Si:H transistor. Such a high mobility enables the
display to address at least a thousand lines and the high on/off current ratio allows long
frame times with minimum charge leakage. In 2006, Zhou et al.261 reported the first fully-
organic active matrix organic light emitting diode (AMOLED) display that contained 48 ×
48 bottom-emission OLED pixels with two pentacene transistors per pixel.
Li et al.231 reported a fully printed multilayer organic LED fabricated through polymer
inking and stamping technique by transferring a layer of PEDOT material on PES substrate
using a stamp of polydimethylsiloxane (PDMS) material. The device emitted yellow light
from the bottom of the transparent ITO substrate by applying a voltage of about 7 V. OTFT
devices fabricated at low temperature often exhibit low mobility (<0.5 cm2/V.s) that limits
the designing of a pixel circuitry.222 Therefore, a compensatory unit is needed for low
mobility OTFT circuits to maintain a constant driving current that can achieve adequate
electrical operation of AMOLED display. Liu et al.262 investigated a novel voltage driving
pixel circuit for AMOLED displays, consisting of four switches, one driving transistor, and
a capacitor. To narrow down the charging time, they developed a complementary voltage
induced coupling driving mechanism by reducing the voltage drop between the source and
the drain terminals of the organic transistor, especially suitable for OTFTs based display
circuitry with low field effect mobility.
RECTIFIER-MODULATOR TAG
A GND
CCOUPLE 1
OTFT2
OTFT1 CODE
VREAD
CDECOUPLE GENERATOR
VREC DEMODULATOR
CCOUPLE 2 -Vdd
B
READER ANTENNA
(a)
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Clock Generator
Output
(Ring Oscillator) Output Shift Register
D7D6D5D4D3D2D1D0 Row0
----- Row1
Line Selector (8-bit)
----- --
(3×8 Decoder)
----- --
----- --
----- --
----- Row7
(b)
Figure 27. Schematics of (a) capacitive coupled organic rectifier-modulator and (b) transponder
circuit of an organic RFID.
while the tag sends the code back to the receiver. For reading data from the tag, the
antenna receives the voltage signal of RF frequency from the reader through coupling
capacitors, CCOUPLE1 and CCOUPLE2 . This high frequency AC signal is rectified (full wave)
by two half wave rectifying diodes realized through p-type organic transistors, OTFT1
and OTFT2. These transistors are configured in diode load logic wherein the drain and
gate terminals are shorted. The capacitor, CDECOUPLE filters out the redundant AC ripples,
thereby producing a smooth DC signal feed to the tag.
To send back the code from an RFID tag to the reader, OTFT2 performs the modulation
of an electric signal generated by the tag. OTFT1 works as the feedback unit providing
Organic Thin Film Transistors 91
a return path to the modulated signal. Using an antenna, this signal is transmitted to the
reader section, where it is demodulated to regenerate the signal.
The schematic of a typical 64 bit RFID transponder chip (code generator) is shown
in Fig. 27(b).257 It consists of a 19-stage ring oscillator that generates the clock signal for
binary counter, line selector, and the output register. A binary 3-bit counter drives a 8:1
multiplexer that selects a particular 8-bit row from the memory and delivers it to the output
shift resister. This 3-bit counter also operates to the 8-bit line coder simultaneously that
makes the selection of a new row after completing the transmission of earlier 8-bits.
Baude et al.266 in 2003 reported a pentacene based RFID circuit, patterned with poly-
meric shadow mask on a 2 × 2 inch glass plate. This low cost circuit was directly powered
by a radio frequency signal without applying a rectifier stage. This organic RFID circuit
responded adequately at 125 KHz and even upto a high frequency of 6.5 MHz. Later, in
2007, Cantatore et al.12 reported an organic transponder based RFID system operating at
13.56 MHz frequency. Myny et al.267 in 2009, demonstrated an improved organic RFID cir-
cuit fabricated on the plastic substrate for RF communication at the same carrier frequency
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of 13.56 MHz. Furthermore, they reported inductively coupled 64-bit268 and 128-bit269
pentacene based RFID tag that supported a data rate of 787 and 1529 bits/sec.
Myny et al.257 recently reported a 64-bit organic RFID transponder chip based on dual
gate OTFT that operated at a supply voltage of 10 V. This chip yielded a high data rate
of 4300 bits/sec, realized on a small area of 45.38 mm2. Currently, the researchers are
focusing towards performance improvement of organic RFID tags for item-level tracking
of individual goods at low cost to establish control over check-in/out of an inventory.
Source Drain
Gate Insulator
Substrate
Figure 28. Immobilization of DNA molecules in the grain boundaries due to hydrophobic interaction
in BGBC organic transistor.
Liu et al.272 reported a high performance pentacene based top-contact structure, wherein
a constant bias of +50 V applied between the gate and the source terminals for about 30
Downloaded by [Brijesh Kumar] at 23:32 20 February 2014
minutes increased the current about four times in comparison to the current without any
DNA hybridization. Organic TFTs have found extensive use in low cost DNA detection
systems. Moreover, the complete analysis time is less than 40 minutes for the organic
transistor based DNA sensor; however, for conventional techniques the time requirement
is about 24 hrs.274
10. Limitations
Compared to the organic transistor, the silicon based transistors demonstrate higher oper-
ating speed, smaller size, environment stability, and everlasting performance that enables
them for a dominant role in the electronic market. Nevertheless, in the last decade, a grad-
ual and significant progress on the organic semiconductor front has provided an alternative
design platform for the designers especially in application areas of flexible electronics,
sensors, medical diagnostics, etc. However, a number of challenges are yet to be resolved
in order to make organic devices practically and commercially viable.
The organic device faces various constraints at abstraction levels of fabrication, material
and device physics level. At the outset, they hold the complex structure that raises difficulty
in understanding the electronic transport phenomenon. Moreover, the characteristics of
organic materials changes with a different ecological environment and over a long period
of time. Therefore, the researchers need to exercise more on the stability models of these
devices to better comprehend the degradation. It is understood that primarily the instability
originates from its chemical structure. Therefore, alternative methods are being researched
to synthesize a steady organic compound that would enhance mobility and switching
behavior. To add further, the I-V characteristic of an organic transistor degrades severely at
higher temperatures and also the noise level increases considerably at low frequencies.
The mobility of organic materials has been gradually enhanced over the years, espe-
cially of p-types. This success can be credited to the synthesis of novel high performance
materials and innovative fabrication process such as surface healing of dielectric by means
of the self-assembled monolayer, the thermally evaporated conducting layer, the surface
treatment of dielectric, adding a conductive layer between the contacts and semiconductor,
etc.112
Major challenges are being also faced in the development of fully organic comple-
mentary circuits due to lower mobility of n-type devices. Some of the primary obstacles
in improving the performance of n-type OTFT are the susceptibility of OSCs to water and
Organic Thin Film Transistors 93
oxygen under ambient conditions. Several n-channel transistors can be operated when pro-
cessed and tested under inert condition; only that makes them technologically unattractive.
Numerous issues are still open ended, specifically those associated with the stability and
performance variation from roll to roll and device to device. Currently, OTFTs are not
suitable for very high speed applications due to low mobility, high operating voltage, and
reverse recovery time.
applications such as differential amplifier,257 A/D and D/A converter,258 shift register,276
energy saving organic LED,11 organic memory,14 ring-oscillator,49 and organic solar cell.277
The future scope of organic transistor in compact, portable, and lightweight circuits include
smart phone, flexible display, bio-sensor, etc. This section further discusses the scope for
enhancing the performance of devices and circuits in future.
of organic thin-films chemically. Moreover, the morphology of the active layer can be
organized especially, to the monolayer closest to the insulator interface by tuning the rate
of deposition and temperature of the substrate.282
The performance improvement of bottom contact structures is an additional challenge.
Insertion of an additional high doping region near the contacts can increase the performance
of these structures.60 In fact, adding an extra semiconductor layer between the contact and
semiconductor can surprisingly enhance the performance. Furthermore, the threshold volt-
age can be reduced substantially by using high-k dielectric without compromising the high
on-off current ratio. In organic single gate TFTs, asymmetric S/D contacts can be employed
with low and high work-function metals for lowering the off-current significantly.283
The performance can be further enhanced in terms of stability, operating bias, cost
economy, longevity, temperature dependency, and power dissipation. However, from a
theoretical point of view, the accurate prediction of the properties of organic devices
including true I-V curves with as few adjustable parameters as possible still represents a
formidable challenge.
models based on the thickness of the active layer. Regardless of few available models, it is
essentially required to develop the analytical models for dual gate structures based on the
mapping of charge accumulation phenomena through second gate bias. Suitable models
are also required to understand the charge transport mechanism in the vertical channel, the
floating gate, and the organic Fin-FET structures.
At present, very few models are available that address the charge transport issues in
nanowire, multigate, and cylindrical gate organic TFTs. Therefore, the circuit simulation
is only limited to the TCAD mixed mode that is extremely time consuming. Therefore, the
compact models for these novel structures need to be developed that can be included in the
circuit level simulators.
and oxygen, which can be achieved by depositing a film of inorganic oxides. It is imperative
to explore the physical mechanism that obstructs the device stability. Through encapsulation
of the devices, a longer functioning lifetime can be achieved.282 Attaching a metal or glass
lid to the substrate with a low-permeation adhesive is one of the encapsulation methods that
can be used to protect the organic materials (especially for OLED displays). Additionally,
a thin barrier coating at the top and bottom side of the device can offer a noteworthy
improvement in the device performance.
Hysteresis behavior is an important challenge associated with the operational stability
of organic transistors that is often observed during sweeps of the gate source voltage.
This is due to numerous defects associated with the OTFTs, such as charge trapping in
the OSC, polarization of the dielectric, charge leakage from OSC to dielectric, and the
presence of the dipoles in the OSC/insulator interface. A high hysteresis effect results in
a significant variation in the threshold voltage, thereby affecting the overall performance
of the transistor. Researchers have shown low hysteresis behavior of an OTFT by applying
surface treatment to the dielectric layer that reduces localization of the charge in the
trapping states.283 Nevertheless, aggressive efforts are needed to substantially increase the
operational stability of OTFTs.
12. Conclusion
This paper reviewed advancements in the organic transistors in terms of their structures,
charge transport models, fabrication methodology, and molecular structures of different
materials. The performance of different p- and n-type OSCs (conducting polymers and
small molecule) and the ambipolar semiconductors are analyzed and discussed. Moreover,
a detailed study is presented for the organic/inorganic materials used as the dielectric, con-
tacts, and substrate. Analytical models imitating the actual behavior of organic transistors
are reviewed. In addition to this, different OTFT structures including single gate, dual gate,
vertical channel, and cylindrical gate are discussed and compared.
The effect of device dimensions and interface between the layers is thoroughly re-
viewed. Furthermore, few important applications of organic transistors such as inverter,
OLED, RFID tag, and DNA sensors are discussed. A comparison is made among organic
p-type, organic complementary, and hybrid inverter circuits with an aim to explore the
basic issues related to the organic device based future circuits. It is observed that the or-
ganic materials based low cost flexible and disposable electronic product can be realized.
96 B. Kumar et al.
Regardless of low speed, organic ICs are bound to be found in the future to enable new
applications, especially in flexible large area electronic and price sensitive applications.
Organic electronics is not a technology competing with silicon, but intends for innovative
applications that are not possible or are too expensive with conventional transistors.
Nomenclature
a-Si:H Amorphous silicon hydrogenated
BST Barium strontium titanate
BZT Barium zirconate titanate
BGBC Bottom gate bottom contact
BGTC Bottom gate top contact
CLM Channel length modulation
CMOS Complementary metal oxide semiconductor
DG Dual gate
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