X-series SMT setup Solder Joint
Inspection PTH
Power devices
Cooling plates
Flexible High-Speed Inline AXI Platform
With the X-series platform Nordson Test & Inspection presents a dedicated
high speed automatic X-ray inspection system concept for the inspection
of PCB-assembly boards for single/multipanels or samples in trays.
All solder joints of SMD and PTH components are covered by a dedicated
AXI algorithm library.
The Nordson Test & Inspection system solutions present a modular
inspection concept. The platforms feature up to 5 advance technologies
in one system: Transmission X-ray imaging (2D) with patented Slice-Filter-
Technique™ (SFT), Off-Axis technology (2.5D) and 3D SART (Simultaneous
Algebraic Reconstruction Technique), Dynamic Planar CT.
The X-series platform is available in the following configurations:
X2.5 Transmission (2D) + SFTTM + Off-Axis (2.5D)
X3 Transmission (2D) + SFTTM + Off-Axis (2.5D) + 3D SART + Dynamic Planar CT
Inspection & Process Software Features and Benefits
PC-Station with multi-core processor setup High Speed AXI system for inline setups
Windows 10 platform Microfocus X-ray tube (sealed tube / maintenance free)
MIPS 5 Inspection Platform Multiple programmable motion system with
Advanced algorithm library linear motor axes
CAD import for automatic inspection list generation Digital CMOS flatpanel detector
Simultaneous Algebraic Reconstruction Technique Automatic grey-level and geometrical calibration
(3D SART; X3 only) Dynamic Planar CT. Barcode scanner for serial number and product
Machine Learning based” Automatic Tree type selection
Classification (ATC) for Auto-Rule-Generation Full product traceability via various MES Interfaces
Offline programming for AXI program generation & Industry 4.0 ready
simulation, tuning and defect reference catalogue
Verification & Process control
MIPS Verify link with closed loop repair
MIPS Process with real time SPC
X-series SMT setup
For more information,
Applications speak with your Nordson
representative or contact
Electronic components and solder joint your Nordson regional office
A unique advanced algorithm library is available for electron- Nordson Test & Inspection
ic applications, specifically for component and solder-joint Europe, SEA, Africa
ti-sales-eu@[Link]
inspection on PCB, hybrid or chip level assembly processes.
Nordson Test & Inspection
All standard IPC based SMD and THT/PTH components: Americas
ti-sales-us@[Link]
QFN, QFP, PIP inspection
Void inspection for Cooling plates Nordson Test & Inspection
China
HIP inspection for BGAs ti-sales-cn@[Link]
PTH and press fit component inspection
Nordson Test & Inspection
Japan
ti-sales-jp@[Link]
Specifications Nordson Test & Inspection
Singapore
ti-sales-eu@[Link]
Facilities Nordson Test & Inspection
Taiwan
Dimensions: 1630 mm (H) x 1800 mm (W) x 1575 mm (D)
ti-sales-tw@[Link]
Adjustable conveyor height (SMEMA) 950 mm
Nordson Test & Inspection
Weight: 2.800 kg Korea
Safe Operating Temperature: 15° - 28 °C optimal 20° - 25° C ti-sales-korea@[Link]
Power Consumption: max. 6 kW
Line Voltage: 400 VAC, 50/60 Hz 3 phase, 16 A/
208 VAC, 50/60 Hz 3 phase, 25 A
Air: 5-7 Bar, < 2 l/min, filtered (30µ), dry, oil free
X-ray Image Chain Motion System
X-ray Source (sealed tube) Multiple axes programmable motion system
Energy: SMT-Setup Installed axes
130 kV/40 W x,y (linear drives) sample table
Grey resolution: 14 Bit z (servo) magnification
Detector Types: u,v (linear drives) detector movement
CMOS Flatpanel Detector 50 µm pixel size (6 MPix) Conveyor setup
Inline set-up automatic width
adjustment
Inspection features
Max. sample size: 460 mm x 360 mm
Assembly clearance
Max. inspection area: 460 mm x 360 mm
Topside (incl. sample 35/50 mm
Min. sample size 80 mm x 80 mm
thickness):
Sample thickness 0,8-10 mm
Bottom side 35/20 mm
Max. sample weight: 5 kg
(excl. sample thickness):
Angle shot capability: up to 50 deg
Min. edge clearance for 3 mm
Resolution 3-4 µm/pix
clamping:
Inspection speed
Included
Transmission (X2, X2.5, X3) up to 6 views /s
Barcodereader
Off-Axis (X2.5, X3) up to 5 views /s
Low-dose radiation filter
3D SART (X3) up to 1 s /FoV
UPS
Dynamic Planar CT (X3) up to 3sec/ROI
[Link]/TestInspect
DS-X-series-020424
