tusb422-PD controller
tusb422-PD controller
TUSB422
ZHCSFQ2C – NOVEMBER 2016 – REVISED JUNE 2018
VBUS
VCONN
Detection &
VBUS_DET Switch
Discharge
I2C CC1
Type-C
Slave
Channel
INT TCPC
Configuration
CC2
SCL
Config
APU
SDA Control
USB PD Phy USB Type-C
Port Manager
GND TUSB422
USB Typ-C
Port Controller
USB Type-C
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLLSEW6
TUSB422
ZHCSFQ2C – NOVEMBER 2016 – REVISED JUNE 2018 www.ti.com.cn
目录
1 特性 .......................................................................... 1 7.4 Device Functional Modes........................................ 17
2 应用 .......................................................................... 1 7.5 Programming........................................................... 19
3 说明 .......................................................................... 1 7.6 Register Maps ......................................................... 22
4 修订历史记录 ........................................................... 2 8 Application and Implementation ........................ 63
8.1 Application Information............................................ 63
5 Pin Configuration and Functions ......................... 3
8.2 Typical Application ................................................. 63
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4 9 Power Supply Recommendations...................... 65
6.2 ESD Ratings.............................................................. 4 10 Layout................................................................... 66
6.3 Recommended Operating Conditions....................... 4 10.1 Layout Guidelines ................................................. 66
6.4 Thermal Information .................................................. 5 10.2 Layout Example .................................................... 66
6.5 Electrical Characteristics........................................... 5 11 器件和文档支持 ..................................................... 67
6.6 Timing Requirements ................................................ 8 11.1 接收文档更新通知 ................................................. 67
6.7 Typical Characteristics ............................................ 10 11.2 社区资源................................................................ 67
7 Detailed Description ............................................ 11 11.3 商标 ....................................................................... 67
7.1 Overview ................................................................. 11 11.4 静电放电警告......................................................... 67
7.2 Functional Block Diagram ....................................... 11 11.5 术语表 ................................................................... 67
7.3 Feature Description................................................. 12 12 机械、封装和可订购信息 ....................................... 68
4 修订历史记录
Changes from Revision B (August 2017) to Revision C Page
• Changed the VCONN pin description in the Pin Functions table ........................................................................................... 3
• Deleted VRX(FRS_PD) from electrical characteristics .................................................................................................................. 6
• Deleted tFRSWAPRX from timing requirements section............................................................................................................... 8
• Added NOTE: "The TUSB422 supports all PD2.0 and PD 3.0..." to the USB PD BMC PHY section ................................. 12
• Deleted text from the first paragraph of the Fast Role Swap secton. ................................................................................. 16
• From: Once VBUS is at VSafe0V, change .. To: Once VBUS is at VSafe0V, disable
AUTO_DISCHARGE_DISCONNECT in Power Control Register and change .. ................................................................ 17
• From: Once VBUS is at vSafe5V, the TCPM should then send PS_RDY to its port partner. To: Once VBUS is at
vSafe5V, the TCPM should update message header information and then send PS_RDY to its port partner. ................. 17
• Added NOTE: "During Power-role swap, the TUSB422..." to the Power Role Swap section. ............................................. 18
• Added NOTE: "When exiting dead battery mode..." to the Dead Battery Mode section...................................................... 18
• Changed bit 0 From: VCONN_OC_FAULT To Reserved in 图 31 and 表 28...................................................................... 37
• Added text: "VBUS present status may be invalid..." to the Bit 2 VBUS_PRESENT description in 表 31........................... 40
• Added text: "Before attempting to transmit..." to the Transmit Register (address = 0x50) [reset = 0x00] register .............. 51
• Changed bit 0 From: FAST_ROLE_SWAP_STAT To Reserved in 图 65 and 表 62........................................................... 56
• Changed bit 0 From: FAST_ROLE_SWAP_MASK To Reserved in 图 66 and 表 63.......................................................... 57
• Changed bit 3 From: FASTROLE_RX_EN To Reserved in 图 69 and 表 66....................................................................... 59
• Deleted text: "Following sentence optional..." from the ESD Ratings table notes.................................................................. 4
YFF Package
9 Pin (DSBGA)
Top View
1 2 3
Not to scale
Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
Type-C Configuration channel signal 2. Used for connector orientation, connection detection
A1 CC2 I/O (FS) and removal, current capabilities, and PD communication. This pin requires an external
CRX(SHUNT) capacitor.
A2 VBUSIN I 5-24 V VBUS input voltage. Tie directly to VBUS at Type-C connector.
A3 VDD P 2.7 V to 5.5 V Positive supply voltage
2.7 V to 5.5 V VCONN. VCONN voltage should be at a valid stable value before software
B1 VCONN P closes the VCONN switch. If VCONN support is not required in the system, then this pin can
be left floating.
Open drain output. Asserted low to indicate status change occurred. Requires an external
B2 INT_N O (FS)
pull-up resistor.
I/O Open-
B3 SCL SCL - I2C communication clock signal. Requires an external pull-up resistor.
drain (FS)
Type-C Configuration channel signal 1. Used for connector orientation, connection detection
C1 CC1 I/O (FS) and removal, current capabilities, and PD communication. This pin requires an external
CRX(SHUNT) capacitor.
C2 GND G Ground
I/O Open-
C3 SDA SDA - I2C communication data signal. Requires an external pull-up resistor.
drain (FS)
6 Specifications
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
VCONN(max)
VCONN pin
0V
VDD(max)
0V
Vinternal
Internal
POR
0V
VDD_I2C
INT_N pin
VOL(min)
0V
TINT_N_LOW
图 1. Power-Up Timing
700 530
510
600
490
500
470
RDS(ON) (m:)
I_Limit (mA)
400 450
300 430
410
200
390
RDS(ON) (m:) at VDD = 3.7 V
100 RDS(ON) (m:) at VDD = 2.7 V
370
RDS(ON) (m:) at VDD = 5.5 V
0 350
2.7 3 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 -40 -15 10 35 60 85 110
VCONN (V) D001
Junction Temperature (qC) D002
7 Detailed Description
7.1 Overview
The USB Type-C ecosystem operates around a small form factor connector and cable that is flippable and
reversible. Due to the nature of the connector, a scheme is needed to determine the connector orientation.
Additional schemes are needed to determine when a USB port is attached, determine the acting role of the USB
port (Source, Sink, active cable, audio accessory, debug accessory), and communicate Type-C current
capabilities. These schemes are implemented over the CC pins according to the USB Type-C Specification 1.2.
The TUSB422 provides Configuration Channel (CC) logic for determining USB port attach and detach, role
detection, cable orientation, and Type-C Current detection/advertisement. The TUSB422 also contains several
features such as VCONN sourcing, VBUS enable, VBUS discharge enable, detection of vSafe0V, and low
standby current.
The TUSB422 provides a USB Type-C Port Controller Interface (TCPCi) allowing the USB Type-C Port Manager
(TCPM) residing in an external microprocessor the ability to determine when a port partner is attached or
removed, cable orientation, enable or remove power to the Type-C port. The TUSB422 implements a USB PD
BMC physical layer and protocol layer for communication over the Type-C port for purposes like power
negotiations, alternate mode enablement (ie DisplayPort over Type-C), and data role negotiations just to mention
a few. The TUSB422 takes a message provided by external processor, calculate and append a 32-bit CRC,
encode, and transmit the encoded message over the CC wire in the cable. The TUSB422 also receives data
from the CC wire and determined if packet is valid or not, respond with GoodCRC, and notify external processor
of its arrival by asserting the interrupt (INT_N).
VBUS D0 Internal_VDD
VBUSIN Detection
ADC
D9
LDO
VBUSDIS_EN
Rvbusdis
VCONN_EN
Cable Detection Ip
And
Orientation CC1_PD_CTL
CC1
BMC_CLK
CC1_RD_RP
CC1_RD_RA
RX 32-bit 4b5b BMC
FIFO CRC decode decode + Hi_Cur1
-
SDA Ra Rd + Med_Cur1
I2C Configuration -
INT_N
Ip
CC2
OSC
CC2_PD_CTL CC2_RD_RP
CC2_RD_RA
+ Hi_Cur2
-
Ra Rd + Med_Cur2
-
+ Def_Cur2
-
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Functional Block Diagram (接
7.2.1 Cables, Adapters, and Direct Connect Devices
Type-C Specification 1.2 defines several cables, plugs and receptacles to be used to attach ports. TUSB422
supports all cables, receptacles, and plugs.
注
The TUSB422 supports all PD2.0 and PD 3.0 messages except for the PD 3.0 Get Source
Capabilities Extended Message. Upon receipt of this message, GoodCRC is not returned,
and no Rx alert flag is set. The side effect is that the port partner will retry the message.
After the retries are exhausted, the port partner will send a soft reset message.
表 1. Power Role
POWER-ROLE VIH VIL
0 VIH(PD_SRC) VIL(PD_SRC)
1 VIH(PD_SNK) VIL(PD_SNK)
注
Because TUSB422 supports Dead Battery Mode, a dedicated DFP application (like a Car
Charger) which uses the TUSB422 should incorporate a diode in the source power path
circuitry to block VBUS from being received by another attached DFP/DRP that is
providing VBUS.
The following steps are for initialization of the TUSB422 for DRP operation.
1. Upon TUSB422 power-up, the Power Status flag in Alert Register should get set indicating TUSB422 is
initialized. When set, this flag will cause the INT_N pin to be assert low.
2. SW read the Alert Registers to determine reason for INT_N assertion. The expectation is Power Status bit
(Reg10h bit 1) is set.
3. SW read Power Status register and notice that TCPC_INIT_STATUS flag is cleared. This indicates TUSB422
is ready.
4. SW clear Power Status bit in Alert register by writing a 1’b1 to the bit.
5. Program the TUSB422 to present Rd on both CC pins. This is done by writing 0x4A to the Role Control
register
6. Write Look4Connection command to the Command register.
7. The TUSB422 now presents Rd on both Rp pins and look for a connection.
The TUSB422 autonomously toggles between Rd and Rp according to the setting of the CC General Control
register. If a value other than default value is desired, then CC General control should be programmed to desired
value before performing Step 6.
注
VDD must be greater than 3.0 V to advertise 3 A current.
7.3.14 VCONN
VCONN is required by active cables, emarker, and VCONN powered accessories like Alt Mode adapters. These
types of devices or cables present Ra on one CC pin and Rd on the other CC pin. VCONN must be enabled
when any of device or cable requiring VCONN is connected to a Type-C port and the TUSB422 is operating as a
DFP or DFP in DRP mode. Software can also enable the VCONN switch when the TUSB422 is a UFP during a
VCONN_SWAP sequence. The TUSB422 implements a VCONN switch which is controlled by software. The
default state of this switch is open. By setting the ENABLE_VCONN bit in Power Control register, the TUSB422
removes closes the switch resulting in VCONN power to be connected to the CC pin indicated by value of
PLUG_ORIENTATION bit in TCPC Control register.
Once the VCONN switch is closed, the switch can be opened by any of the following conditions.
• Software clear ENABLE_VCONN bit in Power Control register.
• VCONN overcurrent fault condition occurs resulting in TUSB422 opening VCONN switch and setting the
VCONN_OCP_FAULT_STATUS bit in Fault Status register.
• Over temperature condition detected by TUSB422. Must be enabled in OTSD Control register.
• Hard Reset ordered set is received.
• Cable is removed (Rd no longer present) results in TUSB422 opening VCONN switch and discharging
VCONN to vSafe0V
The TUSB422 discharges VCONN to vSafe0V by enabling Rd at designated CC pin anytime the VCONN switch
transitions from closed to open state. Once at vSafe0V, the TUSB422 disables the discharge circuit by removing
Rd and then re-enable Rp (assuming it is still enabled in Role Control register).
If an external VCONN discharge is desired, the TUSB422 internal VCONN discharge circuit can be disabled by
setting the INT_VCONNDIS_DISABLE bit in the VBUS and VCONN Control register.
Before closing the VCONN switch, the TCPM must make sure the voltage on VCONN pin is at a valid level.
When opening the VCONN switch by clearing the ENABLE_VCONN bit, the TCPM software must make sure
voltage on VCONN pin is at valid level until after VCONN switch is opened and then, if desired, can remove the
voltage from the VCONN pin. Removing the voltage on VCONN pin before Vconn switch is opened will result in a
false VCONN fault condition.
7.3.15 Interrupts
The TUSB422 asserts the INT_N pin low anytime an unmasked event occurs. Upon assertion of the interrupt, the
TCPM should read the Alert Registers to determine the reason for interrupt. Upon reading the Alert register, the
TCPM should clear the interrupt by writing a 1’b1 to the appropriate field in the Alert register.
If the FAULT flag is set in the Alert register, the TCPM must first read the Fault Status register to determine
reason for fault. Then clear the appropriate field in the Fault Status register by writing a 1’b1. Once all fields in
Fault Status register are cleared, the TCPM can then clear the flag in the Alert Register by writing a 1’b1.
The TUSB422 also has Vendor Defined Interrupt registers which is not part of the USB TCPC specification.
These vendor defined interrupts are masked by default. Software can enable vendor interrupts by setting the
appropriate bit in the Vendor Interrupts Mask Register and setting the VENDOR_IRQ_MASK field in the Alert
Mask register.
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Device Functional Modes (接
注
During Power-role swap, the TUSB422 will disable its VCONN. Software workaround is to
re-enable VCONN and issue error recovery for VCONN powered accessories. This may
result in momentary loss of video/data.
注
When exiting dead battery mode, the TUSB422's Rd is momentarily removed for about
100 µs during power up. This should not cause an issue in system since USB-C standard
requires 100 ms debounce on CC pins.
7.5 Programming
The TUSB422 is controlled using I2C. The TUSB422 local I2C interface is available for reading/writing after
TINT_N_LOW after the device is powered up. The SCL and SDA terminals are used for I2C clock and I2C data
respectively.
图 5. TUSB422 I2C Addresses
7 (MSB) 6 5 4 3 2 1 0 (W/R)
0 1 0 0 0 0 0 0/1
S A6 A5 A4 A3 A2 A1 A0 0 A C7 C6 C5 C4 C3 C2 C1 C0 A D7 D6 D5 D4 D3 D2 D1 D0 A P
The following procedure should be followed to write data to TUSB422 I2C registers (refer to 图 6):
1. The master initiates a write operation by generating a start condition (S), followed by the TUSB422 7-bit
address and a zero-value “W/R” bit to indicate a write cycle.
2. The TUSB422 acknowledges the address cycle.
3. The master presents the sub-address (I2C register within TUSB422) to be written, consisting of one byte of
data, MSB-first.
4. The TUSB422 acknowledges the sub-address cycle.
5. The master presents the first byte of data to be written to the I2C register.
6. The TUSB422 acknowledges the byte transfer
7. The master may continue presenting additional bytes of data to be written, with each byte transfer completing
with an acknowledge from the TUSB422.
8. The master terminates the write operation by generating a stop condition (P).
Data from offset 0x00
TUSB422's Slave Address or
last read address + 1
S A6 A5 A4 A3 A2 A1 A0 1 A D7 D6 D5 D4 D3 D2 D1 D0 A P
The following procedure should be followed to read the TUSB422 I2C registers without a repeated Start (refer 图
7).
1. The master initiates a read operation by generating a start condition (S), followed by the TUSB422 7-bit
address and a zero-value “W/R” bit to indicate a read cycle.
2. The TUSB422 acknowledges the 7-bit address cycle.
3. Following the acknowledge the master continues sending clock.
4. The TUSB422 transmit the contents of the memory registers MSB-first starting at register 00h or last read
sub-address+1. If a write to the I2C register occurred prior to the read, then the TUSB422 shall start at the
sub-address specified in the write.
5. The TUSB422 waits for either an acknowledge (ACK) or a not-acknowledge (NACK) from the master after
each byte transfer; the I2C master acknowledges reception of each data byte transfer.
6. If an ACK is received, the TUSB422 transmits the next byte of data as long as master provides the clock. If a
NAK is received, the TUSB422 stops providing data and waits for a stop condition (P).
7. The master terminates the write operation by generating a stop condition (P).
TUSB422's Slave
TUSB422's Register Offset Xh
Address
C C C C C C C C
S A6 A5 A4 A3 A2 A1 A0 0 A A Sr
7 6 5 4 3 2 1 0
D D D D D D D D D D D D D D D D
S A6 A5 A4 A3 A2 A1 A0 1 A A A P
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
The following procedure should be followed to read the TUSB422 I2C registers with a repeated Start (refer 图 8).
1. The master initiates a read operation by generating a start condition (S), followed by the TUSB422 7-bit
address and a zero-value “W/R” bit to indicate a write cycle.
2. The TUSB422 acknowledges the 7-bit address cycle.
3. The master presents the sub-address (I2C register within TUSB422) to be written, consisting of one byte of
data, MSB-first.
4. The TUSB422 acknowledges the sub-address cycle.
5. The master presents a repeated start condition (Sr).
6. The master initiates a read operation by generating a start condition (S), followed by the TUSB422 7-bit
address and a one-value “W/R” bit to indicate a read cycle.
7. The TUSB422 acknowledges the 7-bit address cycle.
8. The TUSB422 transmit the contents of the memory registers MSB-first starting at the sub-address.
9. The TUSB422 shall wait for either an acknowledge (ACK) or a not-acknowledge (NACK) from the master
after each byte transfer; the I2C master acknowledges reception of each data byte transfer.
10. If an ACK is received, the TUSB422 transmits the next byte of data as long as master provides the clock. If
a NAK is received, the TUSB422 stops providing data and waits for a stop condition (P).
11. The master terminates the read operation by generating a stop condition (P).
S A6 A5 A4 A3 A2 A1 A0 0 A C7 C6 C5 C4 C3 C2 C1 C0 A P
The following procedure should be followed for setting a starting sub-address for I2C reads (refer to 图 8).
1. The master initiates a write operation by generating a start condition (S), followed by the TUSB422 7-bit
address and a zero-value “W/R” bit to indicate a write cycle.
2. The TUSB422 acknowledges the address cycle.
3. The master presents the sub-address (I2C register within TUSB422) to be written, consisting of one byte of
data, MSB-first.
4. The TUSB422 acknowledges the sub-address cycle.
5. The master terminates the write operation by generating a stop condition (P).
After initial power-up, if no sub-addressing is included for the read procedure (refer to 图 8), then reads start at
register offset 00h and continue byte by byte through the registers until the I2C master terminates the read
operation. During a read operation, the TUSB422 auto-increments the I2C internal register address of the last
byte transferred independent of whether or not an ACK was received from the I2C master.
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Register Maps (接
表 5. Register Maps (接
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ADDRESS REGISTER NAME RESET DEFINITION
0x35 RX_BUF_OBJ1_BYTE_1 0x00 RX Byte 1 (bits 15..8) of 1st data object
0x36 RX_BUF_OBJ1_BYTE_2 0x00 RX Byte 2 (bits 23..16) of 1st data object
0x37 RX_BUF_OBJ1_BYTE_3 0x00 RX Byte 3 (bits 31..24) of 1st data object
0x38 RX_BUF_OBJ2_BYTE_0 0x00 RX Byte 0 (bits 7..0) of 2nd data object
0x39 RX_BUF_OBJ2_BYTE_1 0x00 RX Byte 1 (bits 15..8) of 2nd data object
0x3A RX_BUF_OBJ2_BYTE_2 0x00 RX Byte 2 (bits 23..16) of 2nd data object
0x3B RX_BUF_OBJ2_BYTE_3 0x00 RX Byte 3 (bits 31..24) of 2nd data object
0x3C RX_BUF_OBJ3_BYTE_0 0x00 RX Byte 0 (bits 7..0) of 3rd data object
0x3D RX_BUF_OBJ3_BYTE_1 0x00 RX Byte 1 (bits 15..8) of 3rd data object
0x3E RX_BUF_OBJ3_BYTE_2 0x00 RX Byte 2 (bits 23..16) of 3rd data object
0x3F RX_BUF_OBJ3_BYTE_3 0x00 RX Byte 3 (bits 31..24) of 3rd data object
0x40 RX_BUF_OBJ4_BYTE_0 0x00 RX Byte 0 (bits 7..0) of 4th data object
0x41 RX_BUF_OBJ4_BYTE_1 0x00 RX Byte 1 (bits 15..8) of 4th data object
0x42 RX_BUF_OBJ4_BYTE_2 0x00 RX Byte 2 (bits 23..16) of 4th data object
0x43 RX_BUF_OBJ4_BYTE_3 0x00 RX Byte 3 (bits 31..24) of 4th data object
0x44 RX_BUF_OBJ5_BYTE_0 0x00 RX Byte 0 (bits 7..0) of 5th data object
0x45 RX_BUF_OBJ5_BYTE_1 0x00 RX Byte 1 (bits 15..8) of 5th data object
0x46 RX_BUF_OBJ5_BYTE_2 0x00 RX Byte 2 (bits 23..16) of 5th data object
0x47 RX_BUF_OBJ5_BYTE_3 0x00 RX Byte 3 (bits 31..24) of 5th data object
0x49 RX_BUF_OBJ6_BYTE_1 0x00 RX Byte 1 (bits 15..8) of 6th data object
0x4A RX_BUF_OBJ6_BYTE_2 0x00 RX Byte 2 (bits 23..16) of 6th data object
0x4B RX_BUF_OBJ6_BYTE_3 0x00 RX Byte 3 (bits 31..24) of 6th data object
0x4C RX_BUF_OBJ7_BYTE_0 0x00 RX Byte 0 (bits 7..0) of 7th data object
0x4D RX_BUF_OBJ7_BYTE_1 0x00 RX Byte 1 (bits 15..8) of 7th data object
0x4E RX_BUF_OBJ7_BYTE_2 0x00 RX Byte 2 (bits 23..16) of 7th data object
0x4F RX_BUF_OBJ7_BYTE_3 0x00 RX byte 3 (bits 31..24) of 7th data object
0x50 TRANSMIT 0x00 Retry count and SOP* TX type
0x51 TRANSMIT_BYTE_COUNT 0x00 The number of bytes the TCPM will write
0x52 TX_BUF_HEADER_BYTE_0 0x00 Byte 0 (bits 7..0) of TX message header
0x53 TX_BUF_HEADER_BYTE_1 0x00 Byte 1 (bits 15..8) of TX message header
0x54 TX_BUF_OBJ1_BYTE_0 0x00 TX Byte 0 (bits 7..0) of 1st data object
0x55 TX_BUF_OBJ1_BYTE_1 0x00 TX Byte 1 (bits 15..8) of 1st data object
0x56 TX_BUF_OBJ1_BYTE_2 0x00 TX Byte 2 (bits 23..16) of 1st data object
0x57 TX_BUF_OBJ1_BYTE_3 0x00 TX Byte 3 (bits 31..24) of 1st data object
0x58 TX_BUF_OBJ2_BYTE_0 0x00 TX Byte 0 (bits 7..0) of 2nd data object
0x59 TX_BUF_OBJ2_BYTE_1 0x00 TX Byte 1 (bits 15..8) of 2nd data object
0x5A TX_BUF_OBJ2_BYTE_2 0x00 TX Byte 2 (bits 23..16) of 2nd data object
0x5B TX_BUF_OBJ2_BYTE_3 0x00 TX Byte 3 (bits 31..24) of 2nd data object
0x5C TX_BUF_OBJ3_BYTE_0 0x00 TX Byte 0 (bits 7..0) of 3rd data object
0x5D TX_BUF_OBJ3_BYTE_1 0x00 TX Byte 1 (bits 15..8) of 3rd data object
0x5E TX_BUF_OBJ3_BYTE_2 0x00 TX Byte 2 (bits 23..16) of 3rd data object
0x5F TX_BUF_OBJ3_BYTE_3 0x00 TX Byte 3 (bits 31..24) of 3rd data object
0x60 TX_BUF_OBJ4_BYTE_0 0x00 TX Byte 0 (bits 7..0) of 4th data object
0x61 TX_BUF_OBJ4_BYTE_1 0x00 TX Byte 1 (bits 15..8) of 4th data object
0x62 TX_BUF_OBJ4_BYTE_2 0x00 TX Byte 2 (bits 23..16) of 4th data object
0x63 TX_BUF_OBJ4_BYTE_3 0x00 TX Byte 3 (bits 31..24) of 4th data object
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Register Maps (接
表 5. Register Maps (接
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ADDRESS REGISTER NAME RESET DEFINITION
0x64 TX_BUF_OBJ5_BYTE_0 0x00 TX Byte 0 (bits 7..0) of 5th data object
0x65 TX_BUF_OBJ5_BYTE_1 0x00 TX Byte 1 (bits 15..8) of 5th data object
0x66 TX_BUF_OBJ5_BYTE_2 0x00 TX Byte 2 (bits 23..16) of 5th data object
0x67 TX_BUF_OBJ5_BYTE_3 0x00 TX Byte 3 (bits 31..24) of 5th data object
0x68 TX_BUF_OBJ6_BYTE_0 0x00 TX Byte 0 (bits 7..0) of 6th data object
0x69 TX_BUF_OBJ6_BYTE_1 0x00 TX Byte 1 (bits 15..8) of 6th data object
0x6A TX_BUF_OBJ6_BYTE_2 0x00 TX Byte 2 (bits 23..16) of 6th data object
0x6B TX_BUF_OBJ6_BYTE_3 0x00 TX Byte 3 (bits 31..24) of 6th data object
0x6C TX_BUF_OBJ7_BYTE_0 0x00 TX Byte 0 (bits 7..0) of 7th data object
0x6D TX_BUF_OBJ7_BYTE_1 0x00 TX Byte 1 (bits 15..8) of 7th data object
0x6E TX_BUF_OBJ7_BYTE_2 0x00 TX Byte 2 (bits 23..16) of 7th data object
0x6F TX_BUF_OBJ7_BYTE_3 0x00 TX Byte 3 (bits 31..24) of 7th data object
0x70 VBUS_VOLTAGE_BYTE_0 0x00 LSB of VBUSIN measured voltage in 25mV steps.
0x71 VBUS_VOLTAGE_BYTE_1 0x00 MSB of VBUSIN measured voltage in 25mV steps.
VBUS_SINK_DISCONNECT_THRESH
0x72 0x00
OLD_BYTE_0
VBUS_SINK_DISCONNECT_THRESH
0x73 0x00
OLD_BYTE_1
VBUS_STOP_DISCHARGE_THRESH
0x74 0x00
OLD_BYTE_0
VBUS_STOP_DISCHARGE_THRESH
0x75 0x00
OLD_BYTE_1
VBUS_VOLTAGE_ALARM_HI_CFG_B
0x76 0x00
YTE_0
VBUS_VOLTAGE_ALARM_HI_CFG_B
0x77 0x00
YTE_1
VBUS_VOLTAGE_ALARM_LO_CFG_
0x78 0x00
BYTE_0
VBUS_VOLTAGE_ALARM_LO_CFG_
0x79 0x00
BYTE_1
0x7A .. 0x7F Reserved 0x00 Reserved
Vendor Defined Space (0x80 thru 0xFF)
0x80 .. 0x8F Reserved 0x00 Reserved.
0x90 Vendor Interrupt Status 0x00
0x92 Vendor Interrupt Mask 0x00
0x94 CC General Control 0x04
0x95 PHY BMC TX Control 0x00
0x96 PHY BMC RX Control 0x00
0x97 PHY BMC RX Status 0x00
0x98 VBUS and VCONN Control 0x00
0x99 OTSD Control 0x00
0x9A .. 0x9F Reserved 0x00
0xA0 LFO Timer Low 0x00
0xA1 LFO Timer High 0x00
0xA2 .. 0xFE Reserved 0x00 Reserved.
0xFF Page Select 0x00 Page Select
表 6. Register Definitions
ACCESS TAG NAME DESCRIPTION
R Read The field may be read by software
W Write The field may be written by software
S Set The field may be set by a write of one. Writes of zeros to the field have no effect.
C Clear The field may be cleared by a write of one. Write of zero to the field have no effect.
A Clear after Read The field will be cleared by hardware upon software reading from the field
U Update Hardware may autonomously update this field.
NA No Access Not accessible or not applicable
Unless otherwise noted, all undefined or reserved registers are read-only and return zeros when read. Also
unless otherwise noted, writes to undefined or reserved registers will be acknowledged but data will be
discarded.
7.6.8 USB Type-C Revision Byte 0 Register (address = 0x06) [reset = 0x11]
图 16. USB Type-C Revision Byte 0 Register
7 6 5 4 3 2 1 0
USBTYPEC_REV_BYTE_0
R
LEGEND: R/W = Read/Write; R = Read only
7.6.9 USB Type-C Revision Byte 1 Register (address = 0x07) [reset = 0x00]
图 17. USB Type-C Revision Byte 1
7 6 5 4 3 2 1 0
USBTYPEC_REV_BYTE_1
R
LEGEND: R/W = Read/Write; R = Read only
7.6.10 USB PD Revision Version Byte 0 Register (address = 0x08) [reset = 0x11]
图 18. USB PD Revision Version Byte 0
7 6 5 4 3 2 1 0
USBPD_REV_VER_BYTE_0
R
LEGEND: R/W = Read/Write; R = Read only
7.6.11 USB PD Revision Version Byte 1 Register (address = 0x09) [reset = 0x20]
图 19. USB PD Revision Version Byte 1
7 6 5 4 3 2 1 0
USBPD_REV_VER_BYTE_1
R
LEGEND: R/W = Read/Write; R = Read only
7.6.38 Receive Buffer Frame Type Register (address = 0x31) [reset = 0x00]
图 46. Receive Buffer Frame Type Register
7 6 5 4 3 2 1 0
Reserved RX_SOP_MESSAGE
R RU
LEGEND: R/W = Read/Write; R = Read only
7.6.39 Receive Buffer Header Byte 0 Register (address = 0x32) [reset = 0x00]
图 47. Receive Buffer Header Byte 0 Register
7 6 5 4 3 2 1 0
RX_BUF_HDR_BYTE_0
RU
LEGEND: R/W = Read/Write; R = Read only
7.6.40 Receive Buffer Header Byte 1 Register (address = 0x33) [reset = 0x00]
图 48. Receive Buffer Header Byte 1 Register
7 6 5 4 3 2 1 0
RX_BUF_HDR_BYTE_1
RU
LEGEND: R/W = Read/Write; R = Read only
7.6.41 Receive Buffer Data Object 1 Through 7 Register (address = 0x34 through 0x4F) [reset = 0x00]
图 49. Receive Buffer Data Object 1 Through 7 Register
7 6 5 4 3 2 1 0
RX_BUFF_OBJx_BYTE_x
RU
LEGEND: R/W = Read/Write; R = Read only
7.6.44 Transmit Buffer Header Byte 0 Register (address = 0x52) [reset = 0x00]
图 52. Transmit Buffer Header Byte 0 Register
7 6 5 4 3 2 1 0
TX_BUF_HDR_BYTE_0
R/W
LEGEND: R/W = Read/Write; R = Read only
7.6.45 Transmit Buffer Header Byte 1 Register (address = 0x53) [reset = 0x00]
图 53. Transmit Buffer Header Byte 1 Register
7 6 5 4 3 2 1 0
TX_BUF_HDR_BYTE_1
R/W
LEGEND: R/W = Read/Write; R = Read only
7.6.46 Transmit Buffer Data Object 1 Through 7 Register (address = 0x54 through 0x6F) [reset = 0x00]
7.6.49 VBUS Sink Disconnect Threshold Byte 0 Register (address = 0x72) [reset = 0x00]
When this register is programmed to a non-zero value and AUTO_DISCHARGE_DISCONNECT is enabled, the
TUSB422 will use this field instead of VBUS_PRESENT to know when a detach has occurred and then
discharge to vSafe0V. This threshold register is disabled if programmed to zero.
图 57. VBUS Sink Disconnect Threshold Byte 0 Register
7 6 5 4 3 2 1 0
VBUS_SNK_DISC_THRESHOLD[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only
7.6.50 VBUS Sink Disconnect Threshold Byte 1 Register (address = 0x73) [reset = 0x00]
图 58. VBUS Sink Disconnect Threshold Byte 1 Register
7 6 5 4 3 2 1 0
Reserved VBUS_SNK_DISC_THRESHOL
D[9:8]
R R/W
LEGEND: R/W = Read/Write; R = Read only
7.6.51 VBUS Stop Discharge Threshold Byte 0 Register (address = 0x74) [reset = 0x00]
When VBUS Stop Discharge Threshold register is programmed to a non-zero value and TUSB422 is a VBUS
Source, the TUSB422 will discharge to value programmed into this register. If this register is programmed to all
zeros, then TUSB422 will discharge to vSafe0V. If Software requires discharge to voltage other than vSafe0V,
then software must program this register to desired voltage. When TUSB422 is a VBUS Sink and a detach
occurs, discharge will always stop at vSafe0V.
图 59. VBUS Stop Discharge Threshold Byte 0 Register
7 6 5 4 3 2 1 0
VBUS_STOP_DISCHARGE_THRESHOLD[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only
7.6.52 VBUS Stop Discharge Threshold Byte 1 Register (address = 0x75) [reset = 0x00]
图 60. Stop Discharge Threshold Byte 1 Register
7 6 5 4 3 2 1 0
Reserved VBUS_STOP_DISCHARGE_TH
RESHOLD[9:8]
R R/W
LEGEND: R/W = Read/Write; R = Read only
7.6.53 VBUS Voltage Alarm High Config Byte 0 Register (address = 0x76) [reset = 0x00]
This register contains the lower 8 bits of the 10-bit VBUS Voltage Alarm High Configuration register. When
DISABLE_VOLTAGE_ALARMS = 1’b0, a VBUS voltage higher than value programmed into this register will
cause VBUS_ALARM_HI alert flag to get set. This threshold is always enabled. SW needs to program to a value
greater than VBUS to prevent VBUS_ALARM_HI alert from continuously being set.
图 61. VBUS Voltage Alarm High Config Byte 0 Register
7 6 5 4 3 2 1 0
VBUS_ALARM_HIGH_THRESHOLD[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only
7.6.54 VBUS Voltage Alarm High Config Byte 1 Register (address = 0x77) [reset = 0x00]
This register contains the upper two bits of the 10-bit VBUS Voltage Alarm High Configuration register. When
DISABLE_VOLTAGE_ALARMS = 1’b0, a VBUS voltage higher than value programmed into this register will
cause VBUS_ALARM_HI alert flag to get set. This threshold is always enabled. SW needs to program to a value
greater than VBUS to prevent VBUS_ALARM_HI alert from continuously being set.
图 62. VBUS Voltage Alarm High Config Byte 1 Register
7 6 5 4 3 2 1 0
Reserved VBUS_ALARM_HIGH_THRESH
OLD[9:8]
R R/W
LEGEND: R/W = Read/Write; R = Read only
7.6.55 VBUS Voltage Alarm Low Config Byte 0 Register (address = 0x78) [reset = 0x00]
This register contains the lower 8 bits of the 10-bit VBUS Voltage Alarm Low Configuration register. When
DISABLE_VOLTAGE_ALARMS = 1’b0, a VBUS voltage lower than value programmed into this register will
cause VBUS_ALARM_LO alert flag to get set.
图 63. VBUS Voltage Alarm Low Config Byte 0 Register
7 6 5 4 3 2 1 0
VBUS_ALARM_LOW_THRESHOLD[7:0]
R/W
LEGEND: R/W = Read/Write; R = Read only
7.6.56 VBUS Voltage Alarm Low Config Byte 1 Register (address = 0x79) [reset = 0x00]
This register contains the upper two bits of the 10-bit VBUS Voltage Alarm Low Configuration register. When
DISABLE_VOLTAGE_ALARMS = 1’b0, a VBUS voltage lower than value programmed into this register will
cause VBUS_ALARM_LO alert flag to get set.
图 64. VBUS Voltage Alarm Low Config Byte 1 Register
7 6 5 4 3 2 1 0
Reserved VBUS_ALARM_LOW_THRESH
OLD[9:8]
R R/W
LEGEND: R/W = Read/Write; R = Read only
7.6.63 VBUS and VCONN Control Register (address = 0x98) [reset = 0x00]
图 71. VBUS and VCONN Control Register
7 6 5 4 3 2 1 0
Reserved INT_VCONNDI INT_VBUSDIS_
S_DISABLE DISABLE
R R/W R/W
LEGEND: R/W = Read/Write; R = Read only
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Battery
Charger Csnkpd
VBAT
VCHARGE_EN#
VBUS
DC/DC
Boost
Csnk
VCHARGE_EN# VSAFE5V_EN
VDDIO_1.8V CVCONN
VSAFE5V_EN
VCONN
VBUS_DET
SCL
Receptacle
Type-C
SDA TUSB422 CC1
SoC
(9-pin WCSP)
INT_N CC2
0.1uF
10 Layout
INT_N
GND
SDA CC1
C3 C2 C1
SCL VCONN
B3 B1
B2
VDD VBUSIN
CC2
A3 A2 A1
11 器件和文档支持
11.1 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.2 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持 TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.3 商标
E2E is a trademark of Texas Instruments.
USB Type-C is a trademark of USB Implementers Forum.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.5 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此产品说明书的浏览器版本,请参阅左侧的导航栏。
1.41
B A
1.35
BALL A1
CORNER
1.365
1.305
C
0.5 MAX
SEATING PLANE
0.19
0.13 BALL TYP
0.05 C
0.8 TYP
SYMM
0.8
TYP B SYMM
0.4 TYP
0.25 1 2 3
9X
0.21 0.4
0.015 C A B TYP
4223654/A 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
版权 © 2016–2018, Texas Instruments Incorporated 69
TUSB422
ZHCSFQ2C – NOVEMBER 2016 – REVISED JUNE 2018 www.ti.com.cn
(0.4) TYP
9X ( 0.23)
1 2 3
(0.4) TYP
SYMM
B
SYMM
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
70 版权 © 2016–2018, Texas Instruments Incorporated
TUSB422
www.ti.com.cn ZHCSFQ2C – NOVEMBER 2016 – REVISED JUNE 2018
(0.4) TYP
1 2 3
(0.4) TYP
B SYMM
METAL
TYP
SYMM
4223654/A 04/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
版权 © 2016–2018, Texas Instruments Incorporated 71
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TUSB422IYFPR ACTIVE DSBGA YFP 9 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 422
TUSB422IYFPT ACTIVE DSBGA YFP 9 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 422
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Apr-2024
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Apr-2024
Width (mm)
H
W
Pack Materials-Page 2
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