FFPF04F150S

FFPF04F150S

Features
• High voltage and high reliability
• High speed switching
• Low forward voltage

Applications TO-220F
• Suitable for damper diode in horizontal 1 2
deflection circuits 1. Cathode 2. Anode

DAMPER DIODE
Absolute Maximum Ratings TC=25°°C unless otherwise noted
Symbol Parameter Value Units
VRRM Peak Repetitive Reverse Voltage 1500 V
IF(AV) Average Rectified Forward Current @ TC = 125°C 4 A
IFSM Non-repetitive Peak Surge Current 40 A
60Hz Single Half-Sine Wave
TJ, TSTG Operating Junction and Storage Temperature - 65 to +150 °C

Thermal Characteristics
Symbol Parameter Value Units
RθJC Maximum Thermal Resistance, Junction to Case 5.0 °C/W

Electrical Characteristics TC=25 °C unless otherwise noted

Symbol Parameter Min. Typ. Max. Units
V FM * Maximum Instantaneous Forward Voltage V
I F = 4A TC = 25 °C - - 1.5
I F = 4A TC = 125 °C - - 1.4
IRM * Maximum Instantaneous Reverse Current µA
@ rated VR TC = 25 °C - - 5
TC = 125 °C - - 250
trr Maximum Reverse Recovery Time - - 170 ns
(IF =1A, di/dt = 50A/µs)
tfr Maximum Forward Recovery Time - - 450 ns
(IF =6.5A, di/dt = 50A/µs)
VFRM Maximum Forward Recovery Voltage - - 19 V
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%

©2000 Fairchild Semiconductor International Rev. F, September 2000

Free Datasheet http://www.datasheet4u.net/

 FFPF04F150S
Typical Characteristics

30 1000

100 o
10 TJ = 125 C

[ µA]
Forward Current , IF [A]

R
10

Reverse Current , I
o
TJ = 125 C
o
1 TJ = 100 C
1
o
TJ = 25 C 0.1

o
TJ = 25 C
0.01

0.1 0.001
0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 300 600 900 1200 1500

Forward Voltage , VF [V] Reverse Voltage , VR [V]

Figure 1. Typical Forward Voltage Drop Figure 2. Typical Reverse Current

vs. Forward Current vs. Reverse Voltage

100 400

Typical Capacitance
at 0V = 63 pF
[ns]

80
300
di/dt = 50A/µs
rr
Capacitance , Cj [pF]

Reverse Recovery Time , t

60

200

40
di/dt = 100A/µs
100
20

0 0
0.1 1 10 100 1 2 3 4 5 6 7 8 9 10

Reverse Voltage , VR [V] Forward Current , IF [A]

Figure 3. Typical Junction Capacitance Figure 4. Typical Reverse Recovery Time

vs. Forward Current

6
2000
[A]
[nC]

F(AV)

5
rr

Average Forward Current , I

1500
Stored Recovery Charge , Q

di/dt = 100A/µs 4
D
C

3
1000

di/dt = 50A/µs 2

500
1

0
0 80 100 120 140 160
1 2 3 4 5 6 7 8 9 10
o
Forward Current , IF [A] Case Temperature , TC [ C]

Figure 5. Typical Stored Charge Figure 6. Forward Current Derating Curve

vs. Forward Current

©2000 Fairchild Semiconductor International Rev. F, September 2000

Free Datasheet http://www.datasheet4u.net/

 FFPF04F150S
Package Dimensions

TO-220F 2L

10.16 ±0.20 ø3.18 ±0.10 2.54 ±0.20

3.30 ±0.10

(0.70)

6.68 ±0.20

15.87 ±0.20
(1.00x45°)
15.80 ±0.20

(1.80)
(6.50)

12.00 ±0.20
9.75 ±0.30

MAX1.47 2.76 ±0.20

0.80 ±0.10

0.35 ±0.10
2.54TYP 2.54TYP
[2.54 ±0.20] [2.54 ±0.20] +0.10
0.50 –0.05
4.70 ±0.20

9.40 ±0.20

Dimensions in Millimeters

©2000 Fairchild Semiconductor International Rev. F, September 2000

Free Datasheet http://www.datasheet4u.net/

TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.

ACEx™ FASTr™ QFET™ VCX™

Bottomless™ GlobalOptoisolator™ QS™
CoolFET™ GTO™ QT Optoelectronics™
CROSSVOLT™ HiSeC™ Quiet Series™
DOME™ ISOPLANAR™ SuperSOT™-3
E2CMOSTM MICROWIRE™ SuperSOT™-6
EnSignaTM OPTOLOGIC™ SuperSOT™-8
FACT™ OPTOPLANAR™ SyncFET™
FACT Quiet Series™ POP™ TinyLogic™
FAST® PowerTrench® UHC™

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NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.

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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant into support device or system whose failure to perform can
the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can be effectiveness.
reasonably expected to result in significant injury to the
user.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information Formative or This datasheet contains the design specifications for
In Design product development. Specifications may change in
any manner without notice.

Preliminary First Production This datasheet contains preliminary data, and

supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.

No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.

Obsolete Not In Production This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.

Rev. F1

Free Datasheet http://www.datasheet4u.net/