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AXI-Evaluation Format

AXI-Evaluation Format

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gk4462gmailcom
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18 views14 pages

AXI-Evaluation Format

AXI-Evaluation Format

Uploaded by

gk4462gmailcom
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as XLSX, PDF, TXT or read online on Scribd
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Sr.No.

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Action Iteam
System Installation & Setup
Vendor provides the system and application engineer.
Confirm successful installation and CAD data translation.
Programming & Inspection Setup
Programming Time Study: Create five programs (hidden joints only and 100% coverage) for each PCB
Inspection Cycle Time Study: Record cycle time for each program (minimum of 5 assemblies).

Performance Studies: KPI Performance Study: Evaluate false calls, defect conditions, and record inspe
Image Resolution/Quality Study: Capture representative images and assess quality vs cycle time impa
Repeatability & Reproducibility (R&R) Studies: Inspection Attribute Gage R&R: Perform repeatability s
orientations.
Measurement Gage R&R: Conduct measurements (e.g., BGA diameter, void %, PTH fill) and evaluate r
3D CT Imaging Capability:Demonstrate 3D CT capability with sample images.
Technical Capability Matrix: Assess factors like programming requirements, library, diagnostic tools, a
library performance, Offline Tools to finetune the program without stopping the production
Evaluation Support & Training: Confirm vendor provides training and system operation support.

Deliverables: Summarize findings in a report with observations, KPI results, technical matrix, and reco
Measurement of Success: Evaluate success based on commercial terms, technical KPIs, system integr
features availability.
Safety Validation: Verify conveyor specifications, e-stop functionality, and radiation control.
Other Considerations: Review spare part availability, support contract, tube lifespan, and conveyor rel
Status Remark WK 39
Done
Done
Done
Done
Not Started
Not Started

Not Started
Not Started

Not Started
Not Started
Not Started

Not Started
Not Started

Not Started

Not Started
Not Started
Not Started
WK 40 WK 41 WK 42 WK 43 WK 44 WK 45 WK 46
WK 47 WK 48 WK 49 WK 50 WK 51
Paramter

Inspection Accuracy

Inspection Speed

Image Resolution

System Flexibility

Repeatability

Ease of Use

Maintenance

Safety Compliance

Reporting

Cost Efficiency
Evaluation Criteria Result/Score
Defect Detection (voids, bridges, open circuits, etc.)
Component Inspection (BGA, QFN, etc.)
Measurement Precision (solder thickness, alignment)
Cycle Time (per board/component)
Throughput (boards per hour)
X-ray Image Resolution (in microns)
Field of View (FOV)
Contrast and Sensitivity
Board Size and Type Support
Multi-layer PCB Inspection
3D Imaging Capability
Consistent Defect Identification
False Call Rate (FCR)
Software Interface Usability
Data Integration (MES, SPC)
Automation Support
Maintenance Frequency and Complexity
Self-Diagnostics Features
Radiation Shielding and Safety Certification
Interlocks and Sensors
Defect Classification and Insights
SPC Integration
Operating Costs (power, X-ray tube, etc.)
ROI (Defect reduction, production quality improvement)
Remarks
Voids

VFI

BGA
Defect Detection Capablities

PressFit

Special Case Inspection


Status
GND Pad Void
PTH
BGA
Gullwing Solder Voids
Barel Fill
HIP
Ball Crack
Short
Missing
Void
Ball dimensions
Pin Bent

Pin Missing
Foreign Objects
Bigger Size BGA
Heighted & Thicker Component
Heant Sink assembled Component
PCBA thickness capablities(above 4MM)
Sr.No. Paramter
1 CAD conversion from ePM
2 New Job creation
3 CAD Import & Alignment with fiducial setup
4 Algorithm assignment according to part Number.
Time required
Sr.No. Assembly
1
2
3
4
5
Run -1 Run -2 Run -3 Run -4 Run -5

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