ESP32-C3-MINI-1

ESP32-C3-MINI-1U
Datasheet Version 1.7

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

Built around ESP32-C3 series of SoCs, RISC-V single-core microprocessor
4 MB flash in chip package
15 GPIOs
On-board PCB antenna or external antenna connector

ESP32-C3-MINI-1 ESP32-C3-MINI-1U

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1 Module Overview

1 Module Overview
Note:

Check the link or the QR code to make sure that you use the latest version of this document:
https://www.espressif.com/documentation/esp32-c3-mini-1_datasheet_en.pdf

1.1 Features

CPU and On-Chip Memory Note that when the chip scans in Station mode,
the SoftAP channel will change along with the
• ESP32-C3FH4 or ESP32-C3FN4 embedded, Station channel
32-bit RISC-V single-core processor, up to 160
• 802.11mc FTM
MHz

• 384 KB ROM Bluetooth®

• 400 KB SRAM (16 KB for cache) • Bluetooth LE: Bluetooth 5, Bluetooth mesh
• 8 KB SRAM in RTC • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps

• 4 MB flash in chip package • Advertising extensions

• Multiple advertisement sets

Wi-Fi
• Channel selection algorithm #2
• IEEE 802.11 b/g/n-compliant • Internal co-existence mechanism between Wi-Fi
• Center frequency range of operating channel: and Bluetooth to share the same antenna
2412 ~ 2484 MHz
Peripherals
• Supports 20 MHz, 40 MHz bandwidth in 2.4
GHz band • Up to 15 GPIOs

• 1T1R mode with data rate up to 150 Mbps – 3 strapping GPIOs

• Wi-Fi Multimedia (WMM) • SPI, UART, I2C, I2S, remote control peripheral,
LED PWM controller, general DMA controller,
• TX/RX A-MPDU, TX/RX A-MSDU TWAI® controller (compatible with ISO 11898-1,
i.e. CAN Specification 2.0), USB Serial/JTAG
• Immediate Block ACK
controller, temperature sensor, SAR ADC,
• Fragmentation and defragmentation general-purpose timers, watchdog timers
Note:
• Transmit opportunity (TXOP)
* Please refer to ESP32-C3 Series Datasheet for

• Automatic Beacon monitoring (hardware TSF) detailed information about the module peripher-
als.
• 4 × virtual Wi-Fi interfaces

• Simultaneous support for Infrastructure BSS in Integrated Components on Module

Station mode, SoftAP mode, Station + SoftAP
mode, and promiscuous mode • 40 MHz crystal oscillator

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1 Module Overview

Antenna Options – 85 °C version module: –40 ~ 85 °C

– 105 °C version module: –40 ~ 105 °C

• ESP32-C3-MINI-1: On-board PCB antenna

• ESP32-C3-MINI-1U: External antenna via a Certification

connector
• RF certification: See certificates

• Green certification: RoHS/REACH

Operating Conditions

• Operating voltage/Power supply: 3.0 ~ 3.6 V Test

• Operating ambient temperature: • HTOL/HTSL/uHAST/TCT/ESD/Latch-up

1.2 Series Comparison

ESP32-C3-MINI-1 and ESP32-C3-MINI-1U are two general-purpose Wi-Fi and Bluetooth LE modules. The rich
set of peripherals and a small size make the two modules an ideal choice for smart homes, industrial
automation, health care, consumer electronics, etc.

ESP32-C3-MINI-1 comes with a PCB antenna. ESP32-C3-MINI-1U comes with an external antenna connector.
A wide selection of module variants are available as shown in Table 1 and 2.

The series comparison for the two modules is as follows:

Table 1: ESP32-C3-MINI-1 (ANT) Series Comparison1

Ambient Temp.2 Embedded Size3

Ordering Code5 Flash4
(°C) Chip Revision (mm)
ESP32-C3-MINI-1-H4X
–40 ∼ 105 v1.1 6
(Recommended)
ESP32-C3-MINI-1-N4 (NRND) 4 MB (Quad SPI) –40 ∼ 85 v0.4 13.2 × 16.6 × 2.4
ESP32-C3-MINI-1-H4 (NRND) –40 ∼ 105 v0.4
ESP32-C3-MINI-1-H4-AZ (NRND) –40 ∼ 105 v0.4
1 This table shares the same notes presented in Table 2 below.

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1 Module Overview

Table 2: ESP32-C3-MINI-1U (CONN) Series Comparison

Ambient Temp.2 Embedded Size3

Ordering Code5 Flash4, 7
(°C) Chip Revision (mm)
ESP32-C3-MINI-1U-N4 –40 ∼ 85 v0.4
4 MB (Quad SPI) 13.2 × 12.5 × 2.4
ESP32-C3-MINI-1U-H4 –40 ∼ 105 v0.4
2 Ambient temperature specifies the recommended temperature range of the environment immediately outside the

Espressif module.
3 For details, refer to Section 10.1 Module Dimensions.
4 The flash is integrated in the chip’s package. The flash supports:

- More than 100,000 program/erase cycles

- More than 20 years data retention time
5 All modules can be pre-programmed with AWS IoT ExpressLink firmware. Modules with such firmware have suffix

”-A” in their ordering codes, e.g. ESP32-C3-MINI-1-N4-A. Since AWS IoT ExpressLink firmware enables flash en-
cryption and secure boot, joint download boot mode will be disabled, and it will no longer be possible to program
firmware through the UART or USB port into the modules.
6 All chip revisions have the same SRAM size, but chip revision v1.1 has around 35 KB more available space

for users than chip revision v0.4. Chip revision v1.1 depends on specific ESP-IDF versions, as detailed in
Compatibility Advisory for ESP32-C3 Chip Revision v1.1. For how to identify chip revisions, please refer to
ESP32-C3 Series SoC Errata.
7 By default, the SPI flash on the module operates at a maximum clock frequency of 80 MHz and does not support

the auto suspend feature. If you have a requirement for a higher flash clock frequency of 120 MHz or if you need
the flash auto suspend feature, please contact us.

Both ESP32-C3-MINI-1 and ESP32-C3-MINI-1U has two operating ambient temperature options: –40 ∼ 85 °C
variants and –40 ∼ 105 °C variants. The 85 °C variants are embedded with the ESP32-C3FN4 chip, while the
105 °C variants are embedded with the ESP32-C3FH4 chip. ESP32-C3-MINI-1 has one more variant:
ESP32-C3-MINI-1-H4-AZ embedded with the ESP32-C3FH4AZ chip. For this chip, SPI0/SPI1 pins for flash
connection are not bonded. For more information about the differences between chips embedded, please
refer to Section Chip Series Comparison in ESP32-C3 Series Datasheet.

1.3 Applications
• Smart Home • POS Machines

• Industrial Automation • Service Robot

• Health Care • Audio Devices

• Consumer Electronics • Generic Low-power IoT Sensor Hubs

• Smart Agriculture • Generic Low-power IoT Data Loggers

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Contents

Contents

1 Module Overview 2
1.1 Features 2
1.2 Series Comparison 3
1.3 Applications 4

2 Block Diagram 9

3 Pin Definitions 10
3.1 Pin Layout 10
3.2 Pin Description 10

4 Boot Configurations 12
4.1 Chip Boot Mode Control 13
4.2 ROM Messages Printing Control 14

5 Peripherals 15
5.1 Peripheral Overview 15
5.2 Peripheral Description 15
5.2.1 Connectivity Interface 15
5.2.1.1 UART Controller 15
5.2.1.2 SPI Controller 15
5.2.1.3 I2C Controller 16
5.2.1.4 I2S Controller 17
5.2.1.5 USB Serial/JTAG Controller 17
5.2.1.6 Two-wire Automotive Interface 18
5.2.1.7 LED PWM Controller 18
5.2.1.8 Remote Control Peripheral 18
5.2.2 Analog Signal Processing 19
5.2.2.1 SAR ADC 19
5.2.2.2 Temperature Sensor 19

6 Electrical Characteristics 20
6.1 Absolute Maximum Ratings 20
6.2 Recommended Operating Conditions 20
6.3 DC Characteristics (3.3 V, 25 °C) 20
6.4 Current Consumption Characteristics 21
6.4.1 Current Consumption in Active Mode 21
6.4.2 Current Consumption in Other Modes 21

7 RF Characteristics 23
7.1 Wi-Fi Radio 23
7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 23
7.1.2 Wi-Fi RF Receiver (RX) Characteristics 24

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Contents

7.2 Bluetooth 5 (LE) Radio 25

7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 25
7.2.2 Bluetooth LE RF Receiver (RX) Characteristics 27

8 Module Schematics 30

9 Peripheral Schematics 32

10 Physical Dimensions 33
10.1 Module Dimensions 33
10.2 Dimensions of External Antenna Connector 34

11 PCB Layout Recommendations 35

11.1 PCB Land Pattern 35
11.2 Module Placement for PCB Design 36

12 Product Handling 37
12.1 Storage Conditions 37
12.2 Electrostatic Discharge (ESD) 37
12.3 Reflow Profile 37
12.4 Ultrasonic Vibration 38

Related Documentation and Resources 39

Revision History 40

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List of Tables

List of Tables
1 ESP32-C3-MINI-1 (ANT) Series Comparison1 3
2 ESP32-C3-MINI-1U (CONN) Series Comparison 4
3 Pin Definitions 11
4 Default Configuration of Strapping Pins 12
5 Description of Timing Parameters for the Strapping Pins 13
6 Chip Boot Mode Control 13
7 UART0 ROM Message Printing Control 14
8 USB Serial/JTAG ROM Message Printing Control 14
9 Absolute Maximum Ratings 20
10 Recommended Operating Conditions 20
11 DC Characteristics (3.3 V, 25 °C) 20
12 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 21
13 Current Consumption in Modem-sleep Mode 21
14 Current Consumption in Low-Power Modes 22
15 Wi-Fi RF Characteristics 23
16 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 23
17 TX EVM Test1 23
18 RX Sensitivity 24
19 Maximum RX Level 25
20 RX Adjacent Channel Rejection 25
21 Bluetooth LE RF Characteristics 25
22 Bluetooth LE - Transmitter Characteristics - 1 Mbps 26
23 Bluetooth LE - Transmitter Characteristics - 2 Mbps 26
24 Bluetooth LE - Transmitter Characteristics - 125 Kbps 26
25 Bluetooth LE - Transmitter Characteristics - 500 Kbps 27
26 Bluetooth LE - Receiver Characteristics - 1 Mbps 27
27 Bluetooth LE - Receiver Characteristics - 2 Mbps 28
28 Bluetooth LE - Receiver Characteristics - 125 Kbps 28
29 Bluetooth LE - Receiver Characteristics - 500 Kbps 28

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List of Figures

List of Figures
1 ESP32-C3-MINI-1 Block Diagram 9
2 ESP32-C3-MINI-1U Block Diagram 9
3 Pin Layout (Top View) 10
4 Visualization of Timing Parameters for the Strapping Pins 13
5 ESP32-C3-MINI-1 Schematics 30
6 ESP32-C3-MINI-1U Schematics 31
7 Peripheral Schematics 32
8 ESP32-C3-MINI-1 Physical Dimensions 33
9 ESP32-C3-MINI-1U Physical Dimensions 33
10 Dimensions of External Antenna Connector 34
11 ESP32-C3-MINI-1 Recommended PCB Land Pattern 35
12 ESP32-C3-MINI-1U Recommended PCB Land Pattern 36
13 Reflow Profile 37

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2 Block Diagram

2 Block Diagram

ESP32-C3-MINI-1
40 MHz
3V3 Crystal Antenna

RF Matching
ESP32-C3FN4
EN ESP32-C3FH4 GPIOs

SPI Flash

Figure 1: ESP32-C3-MINI-1 Block Diagram

ESP32-C3-MINI-1U
40 MHz
3V3 Crystal Antenna

RF Matching
ESP32-C3FN4
EN ESP32-C3FH4 GPIOs

SPI Flash

Figure 2: ESP32-C3-MINI-1U Block Diagram

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3 Pin Definitions

3 Pin Definitions

3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 10.1 Module Dimensions.

Keepout Zone A
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin 41
Pin 44

Pin 42

Pin 40
Pin 48

Pin 47

Pin 46

Pin 45

Pin 43

Pin 39

Pin 38

Pin 37

Pin 36
Pin 53 Pin 50
GND GND

GND Pin 1 Pin 35 NC

GND Pin 2 Pin 34 NC
3V3 Pin 3 Pin 33 NC
GND GND GND
NC Pin 4 Pin 32 NC
IO2 Pin 5 Pin 31 TXD0
Pin 49
IO3 Pin 6 GND
GND
GND Pin 30 RXD0
NC Pin 7 Pin 29 NC
EN Pin 8 Pin 28 NC
GND GND GND
NC Pin 9 Pin 27 IO19
NC Pin 10 Pin 26 IO18
GND Pin 11 Pin 25 NC
Pin 21
Pin 12

Pin 22
Pin 13

Pin 14

Pin 16

Pin 17

Pin 18

Pin 19

Pin 20

Pin 23

Pin 24
Pin 15

Pin 52 Pin 51
GND GND
IO1
GND
IO0

IO10

IO4

IO6
IO7
IO8
IO9
IO5
NC

NC

NC

Figure 3: Pin Layout (Top View)

Note A:
The zone marked with dotted lines is the antenna keepout zone. The pin diagram is applicable to ESP32-C3-MINI-1
and ESP32-C3-MINI-1U, but the latter has no antenna keepout zone.
To learn more about the keepout zone for module’s antenna on the base board, please refer to
ESP32-C3 Hardware Design Guidelines > Section Positioning a Module on a Base Board.

3.2 Pin Description

The module has 53 pins. See pin definitions in Table 3 Pin Definitions.

For peripheral pin configurations, please refer to Section 5.2 Peripheral Description.

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3 Pin Definitions

Table 3: Pin Definitions

Name No. Type1 Function

1, 2, 11, 14,
GND P Ground
36-53
3V3 3 P Power supply
4, 7, 9, 10,
15, 17, 24,
NC — NC
25, 28, 29,
32-35
IO2 5 I/O/T GPIO2, ADC1_CH2, FSPIQ
IO3 6 I/O/T GPIO3, ADC1_CH3
High: on, enables the chip.
EN 8 I
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
IO0 12 I/O/T GPIO0, ADC1_CH0, XTAL_32K_P
IO1 13 I/O/T GPIO1, ADC1_CH1, XTAL_32K_N
IO10 16 I/O/T GPIO10, FSPICS0
IO4 18 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS
IO5 19 I/O/T GPIO5, ADC2_CH0, FSPIWP, MTDI
IO6 20 I/O/T GPIO6, FSPICLK, MTCK
IO7 21 I/O/T GPIO7, FSPID, MTDO
IO8 22 I/O/T GPIO8
IO9 23 I/O/T GPIO9
IO18 26 I/O/T GPIO18, USB_D-
IO19 27 I/O/T GPIO19, USB_D+
RXD0 30 I/O/T GPIO20, U0RXD
TXD0 31 I/O/T GPIO21, U0TXD
1 P: power supply; I: input; O: output; T: high impedance.

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4 Boot Configurations

4 Boot Configurations
Note:
The content below is excerpted from ESP32-C3 Series Datasheet > Section Boot Configurations. For the strapping
pin mapping between the chip and modules, please refer to Chapter 8 Module Schematics.

The chip allows for configuring the following boot parameters through strapping pins and eFuse bits at
power-up or a hardware reset, without microcontroller interaction.

• Chip boot mode

– Strapping pins: GPIO2, GPIO8, and GPIO9

• ROM message printing

– Strapping pin: GPIO8

– eFuse parameters: EFUSE_UART_PRINT_CONTROL and EFUSE_USB_PRINT_CHANNEL

The default values of all the above eFuse bits are 0, which means that they are not burnt. Given that eFuse is
one-time programmable, once an eFuse bit is programmed to 1, it can never be reverted to 0. For how to
program eFuse bits, please refer to ESP32-C3 Technical Reference Manual > Chapter eFuse Controller.

The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak
pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external
high-impedance circuit.

Table 4: Default Configuration of Strapping Pins

Strapping Pin Default Configuration Bit Value

GPIO2 Floating –
GPIO8 Floating –
GPIO9 Weak pull-up 1

To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If
the ESP32-C3 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by
the host MCU.

All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping
pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in
any other way. It makes the strapping pin values available during the entire chip operation, and the pins are
freed up to be used as regular IO pins after reset.

The timing of signals connected to the strapping pins should adhere to the setup time and hold time
specifications in Table 5 and Figure 4.

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4 Boot Configurations

Table 5: Description of Timing Parameters for the Strapping Pins

Parameter Description Min (ms)

Setup time is the time reserved for the power rails to stabilize be-
tSU 0
fore the CHIP_EN pin is pulled high to activate the chip.
Hold time is the time reserved for the chip to read the strapping
tH pin values after CHIP_EN is already high and before these pins 3
start operating as regular IO pins.

tSU tH

VIL_nRST
CHIP_EN

VIH

Strapping pin

Figure 4: Visualization of Timing Parameters for the Strapping Pins

4.1 Chip Boot Mode Control

GPIO2, GPIO8, and GPIO9 control the boot mode after the reset is released. See Table 6 Chip Boot Mode
Control.

Table 6: Chip Boot Mode Control

Boot Mode GPIO2 2 GPIO8 GPIO9

SPI Boot 1 Any value 1
Joint Download Boot 3 1 1 0
1 Bold marks the default value and configuration.
2 GPIO2 actually does not determine SPI Boot and Joint
Download Boot mode, but it is recommended to pull
this pin up due to glitches.
3 Joint Download Boot mode supports the following
download methods:
• USB-Serial-JTAG Download Boot
• UART Download Boot

In SPI Boot mode, the ROM bootloader loads and executes the program from SPI flash to boot the
system.

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4 Boot Configurations

In Joint Download Boot mode, users can download binary files into flash using UART0 or USB interface. It is
also possible to download binary files into SRAM and execute it from SRAM.

In addition to SPI Boot and Joint Download Boot modes, ESP32-C3 also supports SPI Download Boot mode.
For details, please see ESP32-C3 Technical Reference Manual > Chapter Chip Boot Control.

4.2 ROM Messages Printing Control

During the boot process, the messages by the ROM code can be printed to:

• (Default) UART0 and USB Serial/JTAG controller

• UART0

• USB Serial/JTAG controller

EFUSE_UART_PRINT_CONTROL and GPIO8 control ROM messages printing to UART0 as shown in Table 7
UART0 ROM Message Printing Control.

Table 7: UART0 ROM Message Printing Control

UART0 ROM Code Printing EFUSE_UART_PRINT_CONTROL GPIO8

0 Ignored
Enabled 1 0
2 1
1 1
Disabled 2 0
3 Ignored
1 Bold marks the default value and configuration.

EFUSE_USB_PRINT_CHANNEL controls the printing to USB Serial/JTAG controller as shown in Table 8 USB
Serial/JTAG ROM Message Printing Control.

Table 8: USB Serial/JTAG ROM Message Printing Control

USB Serial/JTAG
EFUSE_DIS_USB_SERIAL_JTAG 2 EFUSE_USB_PRINT_CHANNEL
ROM Code Printing
Enabled 0 0
0 1
Disabled
1 Ignored
1 Bold marks the default value and configuration.
2 EFUSE_DIS_USB_SERIAL_JTAG controls whether to disable USB Serial/JTAG.

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5 Peripherals

5 Peripherals

5.1 Peripheral Overview

ESP32-C3FH4 integrates a rich set of peripherals including SPI, UART, I2C, I2S, remote control peripheral, LED
PWM controller, TWAI® controller, USB Serial/JTAG controller, temperature sensor, SAR ADC

To learn more about on-chip components, please refer to ESP32-C3 Series Datasheet > Section Functional
Description.

Note:
The content below is sourced from ESP32-C3 Series Datasheet > Section Peripherals. Some information may not be
applicable to ESP32-C3-MINI-1 and ESP32-C3-MINI-1U as not all the IO signals are exposed on the module.
To learn more about peripheral signals, please refer to ESP32-C3 Technical Reference Manual > Section Peripheral
Signal List.

5.2 Peripheral Description

This section describes the chip’s peripheral capabilities, covering connectivity interfaces and on-chip sensors
that extend its functionality.

5.2.1 Connectivity Interface

This subsection describes the connectivity interfaces on the chip that enable communication and interaction
with external devices and networks.

5.2.1.1 UART Controller

ESP32-C3 has two UART interfaces, i.e. UART0 and UART1, which support IrDA and asynchronous
communication (RS232 and RS485) at a speed of up to 5 Mbps. The UART controller provides hardware flow
control (CTS and RTS signals) and software flow control (XON and XOFF). Both UART interfaces connect to
GDMA via UHCI0, and can be accessed by the GDMA controller or directly by the CPU.

Pin Assignment

The pins connected to transmit and receive signals (U0TXD and U0RXD) for UART0 are multiplexed with
GPIO21 ~ GPIO20 via IO MUX. Other signals can be routed to any GPIOs via the GPIO matrix.

For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and
ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix.

5.2.1.2 SPI Controller

ESP32-C3 has the following SPI interfaces:

• SPI0 used by ESP32-C3’s GDMA controller and cache to access in-package or off-package flash

• SPI1 used by the CPU to access in-package or off-package flash

• SPI2 is a general purpose SPI controller with access to a DMA channel allocated by the GDMA controller

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5 Peripherals

Features of SPI0 and SPI1

• Supports Single SPI, Dual SPI, and Quad SPI, QPI modes

• Configurable clock frequency with a maximum of 120 MHz in Single Transfer Rate (STR) mode

• Data transmission is in bytes

Features of SPI2

• Supports operation as a master or slave

• Connects to a DMA channel allocated by the GDMA controller

• Supports Single SPI, Dual SPI, and Quad SPI, QPI

• Configurable clock polarity (CPOL) and phase (CPHA)

• Configurable clock frequency

• Data transmission is in bytes

• Configurable read and write data bit order: most-significant bit (MSB) first, or least-significant bit (LSB)
first

• As a master

– Supports 2-line full-duplex communication with clock frequency up to 80 MHz

– Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 80 MHz

– Provides six SPI_CS pins for connection with six independent SPI slaves

– Configurable CS setup time and hold time

• As a slave

– Supports 2-line full-duplex communication with clock frequency up to 60 MHz

– Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 60 MHz

Pin Assignment

For SPI0/1, the pins are multiplexed with GPIO12 ~ GPIO17 via the IO MUX.

For SPI2, the pins are multiplexed with GPIO2, GPIO4 ~ GPIO7, GPIO10, and JTAG interface via the IO
MUX.

For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and
ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix.

5.2.1.3 I2C Controller

ESP32-C3 has an I2C bus interface which is used for I2C master mode or slave mode, depending on your
configuration. The I2C interface supports:

• standard mode (100 Kbit/s)

• fast mode (400 Kbit/s)

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5 Peripherals

• up to 800 Kbit/s (constrained by SCL and SDA pull-up strength)

• 7-bit and 10-bit addressing mode

• double addressing mode

• 7-bit broadcast address

Pin Assignment

The pins for I2C can be chosen from any GPIOs via the GPIO Matrix.

For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and
ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix.

5.2.1.4 I2S Controller

ESP32-C3 includes a standard I2S interface. This interface can operate as a master or a slave in full-duplex
mode or half-duplex mode, and can be configured for 8-bit, 16-bit, 24-bit, or 32-bit serial communication. BCK
clock frequency, from 10 kHz up to 40 MHz, is supported.

The I2S interface connects to the GDMA controller. The interface supports TDM PCM, TDM MSB alignment,
TDM standard, and PDM standard.

Pin Assignment

The pins for the I2S Controller can be chosen from any GPIOs via the GPIO Matrix.

For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and
ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix.

5.2.1.5 USB Serial/JTAG Controller

ESP32-C3 integrates a USB Serial/JTAG controller. This controller has the following features:

• CDC-ACM virtual serial port and JTAG adapter functionality

• USB 2.0 full speed compliant, capable of up to 12 Mbit/s transfer speed (Note that this controller does
not support the faster 480 Mbit/s high-speed transfer mode)

• programming in-package/off-package flash

• CPU debugging with compact JTAG instructions

• a full-speed USB PHY integrated in the chip

Pin Assignment

The pins for the USB Serial/JTAG Controller are multiplexed with GPIO18 ~ GPIO19.

For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and
ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix.

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5 Peripherals

5.2.1.6 Two-wire Automotive Interface

ESP32-C3 has a TWAI® controller with the following features:

• compatible with ISO 11898-1 protocol (CAN Specification 2.0)

• standard frame format (11-bit ID) and extended frame format (29-bit ID)

• bit rates from 1 Kbit/s to 1 Mbit/s

• multiple modes of operation: Normal, Listen Only, and Self-Test (no acknowledgment required)

• 64-byte receive FIFO

• acceptance filter (single and dual filter modes)

• error detection and handling: error counters, configurable error interrupt threshold, error code capture,
arbitration lost capture

Pin Assignment

The pins for the Two-wire Automotive Interface can be chosen from any GPIOs via the GPIO Matrix.

For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and
ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix.

5.2.1.7 LED PWM Controller

The LED PWM controller can generate independent digital waveform on six channels. The LED PWM
controller:

• Can generate digital waveform with configurable periods and duty cycle. The resolution of duty cycle
can be up to 14 bits.

• Has multiple clock sources, including APB clock and external main crystal clock.

• Can operate when the CPU is in Light-sleep mode.

• Supports gradual increase or decrease of duty cycle, which is useful for the LED RGB color-gradient
generator.

Pin Assignment

The pins for the LED PWM Controller can be chosen from any GPIOs via the GPIO Matrix.

For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and
ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix.

5.2.1.8 Remote Control Peripheral

The Remote Control Peripheral (RMT) supports two channels of infrared remote transmission and two
channels of infrared remote reception. By controlling pulse waveform through software, it supports various
infrared and other single wire protocols. All four channels share a 192 × 32-bit memory block to store transmit
or receive waveform.

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5 Peripherals

Pin Assignment

The pins for the Remote Control Peripheral can be chosen from any GPIOs via the GPIO Matrix.

For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and
ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix.

5.2.2 Analog Signal Processing

This subsection describes components on the chip that sense and process real-world data.

5.2.2.1 SAR ADC

ESP32-C3 integrates two 12-bit SAR ADCs.

• ADC1 supports measurements on 5 channels, and is factory-calibrated.

• ADC2 supports measurements on 1 channel, and is not factory-calibrated.

Note:
ADC2 of some chip revisions is not operable. For details, please refer to ESP32-C3 Series SoC Errata.

Pin Assignment

The pins for the SAR ADC are multiplexed with GPIO0 ~ GPIO5, JTAG interface, SPI2 interface, and pins for
external crystal or oscillator.

For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and
ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix.

5.2.2.2 Temperature Sensor

The temperature sensor generates a voltage that varies with temperature. The voltage is internally converted
via an ADC into a digital value.

The temperature sensor has a range of –40 °C to 125 °C. It is designed primarily to sense the temperature
changes inside the chip. The temperature value depends on factors like microcontroller clock frequency or
I/O load. Generally, the chip’s internal temperature is higher than the operating ambient temperature.

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6 Electrical Characteristics

6.1 Absolute Maximum Ratings

Stresses above those listed in Table 9 Absolute Maximum Ratings may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions
beyond those indicated under Table 10 Recommended Operating Conditions is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 9: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C

6.2 Recommended Operating Conditions

Table 10: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
85 °C version 85
TA Operating ambient temperature –40 — °C
105 °C version 105

6.3 DC Characteristics (3.3 V, 25 °C)

Table 11: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

CIN Pin capacitance — 2 — pF
VIH High-level input voltage 0.75 × VDD1 — VDD1 + 0.3 V
VIL Low-level input voltage –0.3 — 0.25 × VDD1 V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
VOH 2 High-level output voltage 0.8 × VDD1 — — V
VOL 2 Low-level output voltage — — 0.1 × VDD1 V
High-level source current (VDD1 = 3.3 V, VOH
IOH — 40 — mA
>= 2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Pull-up resistor — 45 — kΩ
RP D Pull-down resistor — 45 — kΩ
VIH_nRST Chip reset release voltage 0.75 × VDD1 — VDD1 + 0.3 V
VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD1 V

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6 Electrical Characteristics

1 VDD is the I/O voltage for pins of a particular power domain.

2 VOH and VOL are measured using high-impedance load.

6.4 Current Consumption Characteristics

6.4.1 Current Consumption in Active Mode
The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature.

TX current consumption is rated at a 100% duty cycle.

RX current consumption is rated when the peripherals are disabled and the CPU idle.

Table 12: Current Consumption for Wi-Fi (2.4 GHz) in Active Mode

Work mode Description Peak (mA)

802.11b, 1 Mbps, @20.5 dBm 350
802.11g, 54 Mbps, @18 dBm 295
TX
802.11n, HT20, MCS7, @17.5 dBm 290
Active (RF working)
802.11n, HT40, MCS7, @17 dBm 290
802.11b/g/n, HT20 82
RX
802.11n, HT40 84

Note:
The content below is excerpted from Section Power Consumption in Other Modes in ESP32-C3 Series Datasheet.

6.4.2 Current Consumption in Other Modes

Table 13: Current Consumption in Modem-sleep Mode

Typ
CPU Frequency
Mode Description All Peripherals Clocks All Peripherals Clocks
(MHz)
Disabled (mA) Enabled (mA)1
CPU is idle 16 21
160
CPU is running 23 28
Modem-sleep2,3
CPU is idle 13 18
80
CPU is running 17 22
1 In practice, the current consumption might be different depending on which peripherals are enabled.
2 In Modem-sleep mode, Wi-Fi is clock gated.
3 In Modem-sleep mode, the consumption might be higher when accessing flash. For a flash rated at
80 Mbit/s, in SPI 2-line mode the consumption is 10 mA.

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6 Electrical Characteristics

Table 14: Current Consumption in Low-Power Modes

Mode Description Typ (µA)

Light-sleep VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance 130
Deep-sleep RTC timer + RTC memory 5
Power off CHIP_EN is set to low level, the chip is powered off 1

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7 RF Characteristics

7 RF Characteristics
This section contains tables with RF characteristics of the Espressif product.

The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The
external antennas used for the tests on the modules with external antenna connectors have an impedance of
50 Ω.Devices should operate in the center frequency range allocated by regional regulatory authorities. The
target center frequency range and the target transmit power are configurable by software. See ESP RF Test
Tool and Test Guide for instructions.

Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature.

7.1 Wi-Fi Radio

Table 15: Wi-Fi RF Characteristics

Name Description
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n

7.1.1 Wi-Fi RF Transmitter (TX) Characteristics

Table 16: TX Power with Spectral Mask and EVM Meeting 802.11 Standards

Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 20.5 —
802.11b, 11 Mbps — 20.5 —
802.11g, 6 Mbps — 20.0 —
802.11g, 54 Mbps — 18.0 —
802.11n, HT20, MCS0 — 19.0 —
802.11n, HT20, MCS7 — 17.5 —
802.11n, HT40, MCS0 — 18.5 —
802.11n, HT40, MCS7 — 17.0 —

Table 17: TX EVM Test1

Min Typ Limit

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps, @20.5 dBm — –24.5 –10
802.11b, 11 Mbps, @20.5 dBm — –25.0 –10
802.11g, 6 Mbps, @20 dBm — –23.0 –5
802.11g, 54 Mbps, @18 dBm — –28.0 –25
802.11n, HT20, MCS0, @19 dBm — –23.5 –5
Cont’d on next page

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7 RF Characteristics

Table 17 – cont’d from previous page

Min Typ Limit
Rate
(dB) (dB) (dB)
802.11n, HT20, MCS7, @17.5 dBm — –30.5 –27
802.11n, HT40, MCS0, @18.5 dBm — –26.5 –5
802.11n, HT40, MCS7, @17 dBm — –30.5 –27
1 EVM is measured at the corresponding typical TX power provided
in Table 16 TX Power with Spectral Mask and EVM Meeting 802.11
Standards above.

7.1.2 Wi-Fi RF Receiver (RX) Characteristics

For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n.

Table 18: RX Sensitivity

Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — –98.0 —
802.11b, 2 Mbps — –96.0 —
802.11b, 5.5 Mbps — –93.0 —
802.11b, 11 Mbps — –88.6 —
802.11g, 6 Mbps — –92.8 —
802.11g, 9 Mbps — –91.8 —
802.11g, 12 Mbps — –90.8 —
802.11g, 18 Mbps — –88.4 —
802.11g, 24 Mbps — –85.4 —
802.11g, 36 Mbps — –82.0 —
802.11g, 48 Mbps — –77.8 —
802.11g, 54 Mbps — –76.2 —
802.11n, HT20, MCS0 — –92.6 —
802.11n, HT20, MCS1 — –90.6 —
802.11n, HT20, MCS2 — –88.0 —
802.11n, HT20, MCS3 — –84.8 —
802.11n, HT20, MCS4 — –81.6 —
802.11n, HT20, MCS5 — –77.4 —
802.11n, HT20, MCS6 — –75.6 —
802.11n, HT20, MCS7 — –74.4 —
802.11n, HT40, MCS0 — –90.0 —
802.11n, HT40, MCS1 — –87.6 —
802.11n, HT40, MCS2 — –84.8 —
802.11n, HT40, MCS3 — –81.8 —
802.11n, HT40, MCS4 — –78.4 —
802.11n, HT40, MCS5 — –74.2 —
802.11n, HT40, MCS6 — –72.6 —
Cont’d on next page

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7 RF Characteristics

Table 18 – cont’d from previous page

Min Typ Max
Rate
(dBm) (dBm) (dBm)
802.11n, HT40, MCS7 — –71.2 —

Table 19: Maximum RX Level

Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 5 —
802.11b, 11 Mbps — 5 —
802.11g, 6 Mbps — 5 —
802.11g, 54 Mbps — 0 —
802.11n, HT20, MCS0 — 5 —
802.11n, HT20, MCS7 — 0 —
802.11n, HT40, MCS0 — 5 —
802.11n, HT40, MCS7 — 0 —

Table 20: RX Adjacent Channel Rejection

Min Typ Max

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps — 35 —
802.11b, 11 Mbps — 35 —
802.11g, 6 Mbps — 31 —
802.11g, 54 Mbps — 14 —
802.11n, HT20, MCS0 — 31 —
802.11n, HT20, MCS7 — 13 —
802.11n, HT40, MCS0 — 19 —
802.11n, HT40, MCS7 — 8 —

7.2 Bluetooth 5 (LE) Radio

7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics

Table 21: Bluetooth LE RF Characteristics

Name Description
Center frequency range of operating channel 2402 ~ 2480 MHz
RF transmit power range –24.0 ~ 20.0 dBm

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7 RF Characteristics

Table 22: Bluetooth LE - Transmitter Characteristics - 1 Mbps

Parameter Description Min Typ Max Unit

F = F0 ± 2 MHz — –37.62 — dBm
In-band emissions F = F0 ± 3 MHz — –41.95 — dBm
F = F0 ± > 3 MHz — –44.48 — dBm
∆ f 1avg — 245.00 — kHz
Modulation characteristics ∆ f 2max — 208.00 — kHz
∆ f 2avg /∆ f 1avg — 0.93 — —
Carrier frequency offset — — –9.00 — kHz
|f0 − fn |n=2, 3, 4, ..k — 1.17 — kHz
Carrier frequency drift |f1 − f0 | — 0.30 — kHz
|fn − fn−5 |n=6, 7, 8, ..k — 4.90 — kHz

Table 23: Bluetooth LE - Transmitter Characteristics - 2 Mbps

Parameter Description Min Typ Max Unit

F = F0 ± 4 MHz — –43.55 — dBm
In-band emissions F = F0 ± 5 MHz — –45.26 — dBm
F = F0 ± > 5 MHz — –47.00 — dBm
∆ f 1avg — 497.00 — kHz
Modulation characteristics ∆ f 2max — 398.00 — kHz
∆ f 2avg /∆ f 1avg — 0.95 — —
Carrier frequency offset — — –9.00 — kHz
|f0 − fn |n=2, 3, 4, ..k — 0.46 — kHz
Carrier frequency drift |f1 − f0 | — 0.70 — kHz
|fn − fn−5 |n=6, 7, 8, ..k — 6.80 — kHz

Table 24: Bluetooth LE - Transmitter Characteristics - 125 Kbps

Parameter Description Min Typ Max Unit

F = F0 ± 2 MHz — –37.90 — dBm
In-band emissions F = F0 ± 3 MHz — –41.00 — dBm
F = F0 ± > 3 MHz — –42.50 — dBm
∆ f 1avg — 252.00 — kHz
Modulation characteristics
∆ f 1max — 200.00 — kHz
Carrier frequency offset — — –13.70 — kHz
|f0 − fn |n=1, 2, 3, ..k — 1.52 — kHz
Carrier frequency drift |f0 − f3 | — 0.65 — kHz
|fn − fn−3 |n=7, 8, 9, ..k — 0.70 — kHz

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7 RF Characteristics

Table 25: Bluetooth LE - Transmitter Characteristics - 500 Kbps

Parameter Description Min Typ Max Unit

F = F0 ± 2 MHz — –37.90 — dBm
In-band emissions F = F0 ± 3 MHz — –41.30 — dBm
F = F0 ± > 3 MHz — –42.80 — dBm
∆ f 2avg — 220.00 — kHz
Modulation characteristics
∆ f 2max — 205.00 — kHz
Carrier frequency offset — — –11.90 — kHz
|f0 − fn |n=1, 2, 3, ..k — 1.37 — kHz
Carrier frequency drift |f0 − f3 | — 1.09 — kHz
|fn − fn−3 |n=7, 8, 9, ..k — 0.51 — kHz

7.2.2 Bluetooth LE RF Receiver (RX) Characteristics

Table 26: Bluetooth LE - Receiver Characteristics - 1 Mbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –96 — dBm
Maximum received signal @30.8% PER — — 10 — dBm
Co-channel C/I — — 8 — dB
F = F0 + 1 MHz — –4 — dB
F = F0 – 1 MHz — –3 — dB
F = F0 + 2 MHz — –32 — dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz — –36 — dB
F ≥ F0 + 3 MHz(1) — — — dB
F ≤ F0 – 3 MHz — –39 — dB
Image frequency — — –29 — dB
F = Fimage + 1 MHz — –38 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –34 — dB
30 MHz ~ 2000 MHz — –9 — dBm
2003 MHz ~ 2399 MHz — –18 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –6 — dBm
Intermodulation — — –44 — dBm
1 Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz.

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7 RF Characteristics

Table 27: Bluetooth LE - Receiver Characteristics - 2 Mbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –93 — dBm
Maximum received signal @30.8% PER — — 0 — dBm
Co-channel C/I — — 10 — dB
F = F0 + 2 MHz — –7 — dB
F = F0 – 2 MHz — –7 — dB
F = F0 + 4 MHz(1) — — — dB
Adjacent channel selectivity C/I
F = F0 – 4 MHz — –34 — dB
F ≥ F0 + 6 MHz — –39 — dB
F ≤ F0 – 6 MHz — –39 — dB
Image frequency — — –27 — dB
F = Fimage + 2 MHz — –39 — dB
Adjacent channel to image frequency
F = Fimage – 2 MHz(2) — — — dB
30 MHz ~ 2000 MHz — –17 — dBm
2003 MHz ~ 2399 MHz — –19 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –22 — dBm
Intermodulation — — –40 — dBm
1 Refer to the value of Image frequency.
2 Refer to the value of Adjacent channel selectivity C/I when F = F0 + 2 MHz.

Table 28: Bluetooth LE - Receiver Characteristics - 125 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –104 — dBm
Maximum received signal @30.8% PER — — 10 — dBm
Co-channel C/I — — 2 — dB
F = F0 + 1 MHz — –6 — dB
F = F0 – 1 MHz — –5 — dB
F = F0 + 2 MHz — –40 — dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz — –42 — dB
F ≥ F0 + 3 MHz(1) — — — dB
F ≤ F0 – 3 MHz — –46 — dB
Image frequency — — –34 — dB
F = Fimage + 1 MHz — –44 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –37 — dB
1 Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz.

Table 29: Bluetooth LE - Receiver Characteristics - 500 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –99 — dBm
Cont’d on next page

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7 RF Characteristics

Table 29 – cont’d from previous page

Parameter Description Min Typ Max Unit
Maximum received signal @30.8% PER — — 10 — dBm
Co-channel C/I — — 3 — dB
F = F0 + 1 MHz — –5 — dB
F = F0 – 1 MHz — –7 — dB
F = F0 + 2 MHz — –39 — dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz — –40 — dB
F ≥ F0 + 3 MHz(1) — — — dB
F ≤ F0 – 3 MHz — –40 — dB
Image frequency — — –34 — dB
F = Fimage + 1 MHz — –43 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –38 — dB
1 Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz.

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 Espressif Systems

8 Module Schematics
8 Module Schematics
This is the reference
5 design of the module. 4 3 2 1

GND

GND GND

3
U1

GND

GND XOUT
C1 C2
D D
TBD TBD

XIN
The values of C1 and C2 vary with
the selection of the crystal.

2
The value of R1 varies with the actual
VDD33 PCB board.
GND
40MHz(±10ppm)

0
C3 C4 R2 499 U0TXD GND
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U0RXD
1uF 10nF GPIO19

R1
GPIO18
VDD33 GND
GND GND

L1 2.0nH

33

32
31
30
29
28
27
26
25

49
48
47
46
45
44
43
42
41
40
39
38
37
36
C5 C6 C7

GND

VDDA
VDDA
XTAL_P
XTAL_N
U0TXD
U0RXD
GPIO19
GPIO18

EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
C 53 50 C
10uF 0.1uF 0.1uF GND GND
VDD33
30

1 35
GND GND GND 2 GND NC 34
ANT1 3 GND NC 33
1 RF_ANT L2 TBD LNA_IN 1 24 4 3V3 NC 32
2 2 LNA_IN SPIQ 23 VDD_SPI VDD33 GPIO2 5 NC NC 31 U0TXD
3 VDD3P3 SPID 22 GPIO3 6 IO2 TXD0 30 U0RXD
C8 C9 VDD3P3 SPICLK IO3 ESP32-C3-MINI-1 RXD0
PCB_ANT GPIO0 4 21 SPICS0 R8 10K(NC) 7 29
TBD TBD GPIO1 5 XTAL_32K_P SPICS0 20 CHIP_EN 8 NC NC 28
GPIO2 6 XTAL_32K_N SPIWP 19 D1 9 EN NC 27 GPIO19
CHIP_EN 7 GPIO2 SPIHD 18 10 NC IO19 26 GPIO18
CHIP_EN VDD_SPI ESD NC IO18
GND GND GND GPIO3 8 17 11 25
GPIO3 VDD3P3_CPU GND NC
VDD3P3_RTC

The values of C8, L2 and C9 C10 C11 52 51

GND

IO10
GND GND

IO0
IO1

IO4
IO5
IO6
IO7
IO8
IO9
VDD33 GND

NC

NC

NC
vary with the actual PCB board. 0.1uF 1uF
GPIO10
GPIO8
GPIO9
MTMS

MTDO
MTCK

NC: No component. U3
MTDI

12
13
14
15
16
17
18
19
20
21
22
23
24
ESP32-C3-MINI-1 & MINI-1U Datasheet v1.7

GND GND
U2 ESP32-C3FN4
9
10
11
12
13
14
15
16

B ESP32-C3FH4 VDD33 B

GPIO10
GPIO0
GPIO1

GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO4
GPIO5 GND
GPIO6 C12
GPIO7
GPIO8 0.1uF ESP32-C3-MINI-1(pin-out)
GPIO9
GPIO10
GND

Figure 5: ESP32-C3-MINI-1 Schematics

A A

Title
ESP32-C3-MINI-1

Size Page Name Rev

A4 <02_ESP32-C3-MINI-1> V1.1 Confidential and Proprietary
Date: Tuesday, March 15, 2022 Sheet 2 of 2
5 4 3 2 1
 5 4 3 2 1
Espressif Systems

8 Module Schematics
GND

GND GND

3
U1

GND

GND XOUT
C1 C2
D D
TBD TBD

XIN
The values of C1 and C2 vary with
the selection of the crystal.

2
The value of R1 varies with the actual
VDD33 PCB board.
GND
40MHz(±10ppm)

0
C3 C4 R2 499 U0TXD GND
U0RXD
1uF 10nF GPIO19

R1
GPIO18
VDD33 GND
GND GND

L1 2.0nH

33

32
31
30
29
28
27
26
25

49
48
47
46
45
44
43
42
41
40
39
38
37
36
C5 C6 C7

GND

VDDA
VDDA
XTAL_P
XTAL_N
U0TXD
U0RXD
GPIO19
GPIO18

EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
C 53 50 C
10uF 0.1uF 0.1uF GND GND
VDD33 1 35
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GND GND GND 2 GND NC 34

3 GND NC 33
1 RF_ANT L2 TBD LNA_IN 1 24 4 3V3 NC 32
2 LNA_IN SPIQ 23 VDD_SPI VDD33 GPIO2 5 NC NC 31 U0TXD
3 VDD3P3 SPID 22 GPIO3 6 IO2 TXD0 30 U0RXD
ANT1 C8 C9 ESP32-C3-MINI-1U
4
3
2

GPIO0 4 VDD3P3 SPICLK 21 SPICS0 R8 10K(NC) 7 IO3 RXD0 29

CONN TBD TBD GPIO1 5 XTAL_32K_P SPICS0 20 CHIP_EN 8 NC NC 28
GPIO2 6 XTAL_32K_N SPIWP 19 D1 9 EN NC 27 GPIO19
CHIP_EN 7 GPIO2 SPIHD 18 10 NC IO19 26 GPIO18
CHIP_EN VDD_SPI ESD NC IO18
GND GND GND GPIO3 8 17 11 25
GPIO3 VDD3P3_CPU GND NC
31

VDD3P3_RTC
The values of C8, L2 and C9 C10 C11 52 51

GND

IO10
GND GND

IO0
IO1

IO4
IO5
IO6
IO7
IO8
IO9
VDD33 GND

NC

NC

NC
vary with the actual PCB board. 0.1uF 1uF

GPIO10
GPIO8
GPIO9
MTMS

MTDO
MTCK
NC: No component. MTDI U3

12
13
14
15
16
17
18
19
20
21
22
23
24
GND GND
U2 ESP32-C3FN4
9
10
11
12
13
14
15
16
B ESP32-C3FH4 VDD33 B

GPIO10
GPIO0
GPIO1

GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO4
GPIO5 GND
GPIO6 C12
GPIO7
GPIO8 0.1uF ESP32-C3-MINI-1U(pin-out)
GPIO9
GPIO10
ESP32-C3-MINI-1 & MINI-1U Datasheet v1.7

GND

Figure 6: ESP32-C3-MINI-1U Schematics

A A

Title
ESP32-C3-MINI-1U

Size Page Name Rev

A4 <02_ESP32-C3-MINI-1U> V1.2 Confidential and Proprietary
Date: Monday, March 14, 2022 Sheet 2 of 2
5 4 3 2 1
9 Peripheral Schematics4 3 2

9 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example,
power supply, antenna, reset button, JTAG interface, and UART interface).

GND

49
48
47
46
45
44
43
42
41
40
39
38
37
36
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
53 50 VDD33
VDD33 GND GND JP4
1 35 1
R9 10K 2 GND NC 34 2 1
3 GND NC 33 3 2
4 3V3 NC 32 4 3
C1 C2 R1 IO2 5 NC NC 31 TXD0 4
IO3 6 IO2 ESP32-C3-MINI-1 TXD0 30 RXD0 UART
10uF 0.1uF TBD 7 IO3 ESP32-C3-MINI-1U RXD0 29 GND
EN 8 NC NC 28 JP3
9 EN NC 27 IO19 R4 0 USB_D+ 1
10 NC IO19 26 IO18 R6 0 USB_D- 2 1
C3 11 NC IO18 25 2
GND NC USB
C5 C6
TBD 52 51
GND

IO10

GND GND
IO0
IO1

IO4
IO5
IO6
IO7
IO8
IO9
TBD TBD
NC

NC

NC
GND GND
U1
12
13
14
15
16
17
18
19
20
21
22
23
24
GND GND GND
IO10

C7 12pF(NC) VDD33
IO0
IO1

IO4
IO5
IO6
IO7
IO8
IO9

GND
R7
1

X1 R5 0(NC) R8 10K
32.768kHz(NC) R6 0(NC) SW1
JP2 R2 0 EN
NC
2

GND 1 TMS 1
C8 12pF(NC) JP1 1 2 TDI 2 1 C4 0.1uF
JTAG 2 3 TCK 2
NC: No component. 3 4 TDO Boot Option
4 GND GND

Figure 7: Peripheral Schematics

• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much
soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion
between other pins and the baseboard may be poor.

• To ensure that the power supply to the ESP32-C3 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-C3’s power-up and reset sequence
timing diagram, please refer to ESP32-C3 Series Datasheet > Section Power Supply.

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10 Physical Dimensions

10 Physical Dimensions

10.1 Module Dimensions

Unit: mm

13.2±0.15 0.8
16.6±0.15

1.45 0.6
11.95
9.95

10.6

11.2
0.6
9.2

8.4

5.4
7.6

1.45
6.8
5

9
0.
Ø
0.62

5.4

0.62 2.4±0.15 8.4

9.2
10
11
11.2
12.6
Top view Side view Bottom view

Figure 8: ESP32-C3-MINI-1 Physical Dimensions

Unit: mm

13.2±0.15 0.8
1.7 0.85

9.18
1.45 0.6
12.25
1.55
12.5±0.15

11.55

10.6

0.6
9.2

8.4

5.4
7.6
6.8

1.45
9
8.7

0.48

5.6

5.4

0.47 2.4±0.15 8.4

9.2
10
11
11.2
12.6
Top view Side view Bottom view

Figure 9: ESP32-C3-MINI-1U Physical Dimensions

Note:
For information about tape, reel, and product marking, please refer to Espressif Module Packaging Information.

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10 Physical Dimensions

10.2 Dimensions of External Antenna Connector

ESP32-C3-MINI-1U uses the third generation external antenna connector as shown in Figure 10 Dimensions of
External Antenna Connector. This connector is compatible with the following connectors:

• W.FL Series connector from Hirose

• MHF III connector from I-PEX

• AMMC connector from Amphenol

Unit: mm
Tolerance: +/-0.1 mm

CONTACT
A

2.00±0.10
1.7

A
GROUND CONTACT
2.05±0.10
1.7
0.57

0.85

CONTACT
1.40

0.10

HOUSING
HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;
SHELL

CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;

SECTION: A-A
SCALE: 1:1
SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;

PERFORMANCE:

CONTACT RESISTANCE: 20mOHM Max.

DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE;

INSULATION RESISTANCE: 500MOHM Min.

Figure 10: Dimensions of External Antenna Connector

fig:10.2-ant-connector

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11 PCB Layout Recommendations

11 PCB Layout Recommendations

11.1 PCB Land Pattern

This section provides the following resources for your reference:

• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure
11 ESP32-C3-MINI-1 Recommended PCB Land Pattern and Figure 12 ESP32-C3-MINI-1U Recommended
PCB Land Pattern.

• Source files of recommended PCB land patterns to measure dimensions not covered in Figure 11 and
Figure 12. You can view the source files for ESP32-C3-MINI-1 and ESP32-C3-MINI-1U with Autodesk
Viewer.

• 3D models of ESP32-C3-MINI-1 and ESP32-C3-MINI-1U. Please make sure that you download the 3D
model file in .STEP format (beware that some browsers might add .txt).

Unit: mm
Via for thermal pad
Pad

13.2

Pin 1 Antenna Area

48 x 0.4 4 x 0.7

0.6 1.45
4 x 0.7
48 x 0.8

16.6
11.2
9.9
9.8
1.6

1.45
5.4
0.6

5.4

1.6
0.8

11.8
11.9

Figure 11: ESP32-C3-MINI-1 Recommended PCB Land Pattern

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11 PCB Layout Recommendations

Unit: mm
Via for thermal pad
Pad
Pin 1 13.2
48 x 0.4 4 x 0.7

0.6 1.45

4 x 0.7

12.5
48 x 0.8
9.9
9.8
1.6

1.45
5.4
0.6

5.4

1.6

5.6
0.8
11.8
11.9

Figure 12: ESP32-C3-MINI-1U Recommended PCB Land Pattern

11.2 Module Placement for PCB Design

If module-on-board design is adopted, attention should be paid while positioning the module on the base
board. The interference of the base board on the module’s antenna performance should be minimized.

For details about module placement for PCB design, please refer to ESP32-C3 Hardware Design Guidelines >
Section Positioning a Module on a Base Board.

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12 Product Handling

12 Product Handling

12.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.

After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
60%RH. If the above conditions are not met, the module needs to be baked.

12.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V

12.3 Reflow Profile

Solder the module in a single reflow.

Peak temperature: 235 – 250 °C

Peak time: 30 – 70 s
Temperature (°C)
Soldering time: ＞ 30 s
Solder: Sn-Ag-Cu (SAC305) lead-free solder
250

230
217
200
180

150

100

50 Ramp-up Preheating Soldering Cooling

25 – 150 °C 150 – 200 °C ＞ 217 °C ＜ 180 °C
25 60 – 90 s 60 – 120 s 60 – 90 s –5 ~ –1 °C/s
1 – 3 °C/s
Time (s)
0 50 100 150 200 250

Figure 13: Reflow Profile

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12 Product Handling

12.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.

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Related Documentation and Resources

Related Documentation and Resources

Related Documentation
• ESP32-C3 Series Datasheet – Specifications of the ESP32-C3 hardware.
• ESP32-C3 Technical Reference Manual – Detailed information on how to use the ESP32-C3 memory and periph-
erals.
• ESP32-C3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-C3 into your hardware prod-
uct.
• ESP32-C3 Series SoC Errata – Descriptions of known errors in ESP32-C3 series of SoCs.
• Certificates
https://espressif.com/en/support/documents/certificates
• ESP32-C3 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns?keys=ESP32-C3
• ESP32-C3 Advisories – Information on security, bugs, compatibility, component reliability.
https://espressif.com/en/support/documents/advisories?keys=ESP32-C3
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents

Developer Zone
• ESP-IDF Programming Guide for ESP32-C3 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos

Products
• ESP32-C3 Series SoCs – Browse through all ESP32-C3 SoCs.
https://espressif.com/en/products/socs?id=ESP32-C3
• ESP32-C3 Series Modules – Browse through all ESP32-C3-based modules.
https://espressif.com/en/products/modules?id=ESP32-C3
• ESP32-C3 Series DevKits – Browse through all ESP32-C3-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-C3
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en

Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions

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Revision History

Revision History

Date Version Release notes

• Table 2 ESP32-C3-MINI-1U (CONN) Series Comparison: Updated flash

program/erase cycles, data retention time (note 4) and maximum clock
frequency (note 7)
• Improved the wording and structure of following sections:
– Updated Section ”Strapping Pins” and renamed to 4 Boot Configu-
2024-09-19 v1.7 rations
– Added Chapter 5 Peripherals
– Updated Table ”Wi-Fi RF Standards” and renamed to ”Wi-Fi RF Char-
acteristics”
– Added Section 11.2 Module Placement for PCB Design
– Optimized Figure 13 Reflow Profile

• Added Compatibility Advisory for ESP32-C3 Chip Revision v1.1 to the

2024-07-29 v1.6
notes of Table ESP32-C3-MINI-1U (CONN) Series Comparison

• Added new variant ESP32-C3-MINI-1-H4X

2024-06-05 v1.5 • Marked the ESP32-C3-MINI-1-N4, ESP32-C3-MINI-1-H4, and ESP32-C3-
MINI-1-H4-AZ variants as Not Recommended for New Designs (NRND)

• Updated note 5 of Table ESP32-C3-MINI-1 (ANT) Series Comparison1 and

Table ESP32-C3-MINI-1U (CONN) Series Comparison
• Updated the formatting of Section 4 Boot Configurations
• Updated the maximum value of ”RF power control range” to 20 dBm in
2024-05-15 v1.4
Table Bluetooth LE RF Characteristics
• Updated the note about solder paste in Section 9 Peripheral Schematics
• Updated the markings of dimensions and thermal pad vias in Section 11.1
PCB Land Pattern

Cont’d on next page

Espressif Systems 40 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.7

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Revision History

Cont’d from previous page

Date Version Release notes

• Added a new variant ESP32-C3-MINI-1-H4-AZ

• Changed Table Ordering Information to Table ESP32-C3-MINI-1 (ANT) Se-
ries Comparison1 and Table ESP32-C3-MINI-1U (CONN) Series Compari-
son
2022-11-08 v1.3 • Updated test condition descriptions and data in Section 6.4 Current Con-
sumption Characteristics
• Updated ”RF power control range” in Table Bluetooth LE RF Characteris-
tics
• Added descriptions in Section 11.1 PCB Land Pattern

2022-06-30 v1.2 Added Section 12.4 Ultrasonic Vibration

• Added a note under Table Ordering Information

2022-05-16 v1.1
• Updated Chapter 8 Module Schematics

• Updated module description on the title page

• Deleted Section ”About This Document”
• Restructured Section 1.1 Features
• Added ordering code in Table Ordering Information
2021-06-21 v1.0 • Added descriptions in Section 10.2 Dimensions of External Antenna Con-
nector
• Updated Section ”Learning Resources” and renamed to Related Docu-
mentation and Resources
• Replaced ”chip family” with ”chip series” following Espressif’s taxonomy

2021-04-16 v0.7 Added information about ESP32-C3-MINI-1U module

2021-02-22 v0.6 Updated the value of C7 to 0.1 µF in Chapter 8 Module Schematics
2021-02-05 v0.5 Preliminary release

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ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR
PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No
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hereby acknowledged.
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