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Home Products Thermal Interface Materials Phase Change Materials PTM 7950 | PHASE CHANGE PAD
PTM 7950 | Phase Change Pad
Harmonization Code : 8473.30.80.00 |
Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the
machines of heading 8471 ; Other; Other
Product Family
PTM7950
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160 x 400 x 0.2mm | Full Sheet
160 x 400 x 0.25mm Sheet 60 x 60 x 0.25mm Pad
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» 0.04 Thermal Impedance Packaging E
» 8.5 Thermal Conductivity
» Pad Form TDS, SDS & Technical documents E
Product Description
PTM7950 is a super highly thermally conductive Phase Change Material (PCM). It is designed to
minimize thermal resistance at interfaces, maintain excellent performance through reliability testing,
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resulting in extremely low surface contact resistance. Since PTM7950 comes only in 0.25mm and
0.2mm (thicker versions are under development) you need to be sure that this thickness is
compatible and suitable for the atness of your package.
Available Versions: (Check the di erence between pad and paste versions)
PTM7950 Pad | Easy application and no drying steps
PTM7950-SP | Paste version for automatic stencil printing
PTM7950-SPS | Paste version with slow-drying solvent
PTM 7950 cannot come in pad form on a reel. This is because the material is too soft and tends to
wrinkle when rolled, especially when the size gets larger.
Key Features:
Super low thermal impedance (TI vs Pressure Curve PTM7950)
Silicone-free, no pump out, bleed out, dry out issues
Industry-proven superior long-term reliability (Reliability Report PTM7950)
Min BLT~20um, typical BLT is below 50um (BLT vs Pressure Curve PTM7950)
30~40 psi pressure is needed for usage (PCM Application Note)
Highly Recommended For:
Power modules/inverters in automotive and power applications
High-performance IT/enterprise computing devices
Consumer electronics, high-performance IC
High power LED
Learn More about PTM7950's superior thermal performance and long-term reliability.
Speci cations Additional Information
Technical Specifications
General Properties
Speci c Gravity 2.8
Thickness range 0.25 mm
Electrical Properties
Dielectric Strength 0.55 kV/mm
Volume Resistivity 2.1x1014 Ohms⋅cm
Thermal Properties
Speci c Heat Capacity 0.97 J/g.K J/(g⋅°C)
Thermal Conductivity 8.5 W/m.K
Thermal Impedance 0.04 °C·cm²/W
Additional Information
Honeywell PTM7950 is one of the most successful TIM products used in high power inverters and high performance computing devices. Ultra-low thermal impedance with
minimum achievable BLT and superior long-term reliability make PTM7950 stand out from the competitors. PTM7XXX series also presents stability among vertical
applications and pass automotive standard vibration test (Check the Vibration & Shock Test Report), thus PTM7XXX is currently widely used in automotive applications such
as power inverters. These silicon-free pads are carbon hybrid based, so any potential outgassing will be from carbon hybrid materials. If high voltage is key to your application
then we suggest evaluating thermal gap pads or insulation pads.
What are the reliability expectations of the PTM7950?
All the 7XXXseries (PTM7000, PTM7900 & PTM7950) pass the three major reliability tests with ying colours. Honeywell does not test beyond 1000 cycles, 92 hrs HAST and 1000
hrs HTS. However, anecdotally, some automotive customers have taken 7900 to beyond Honeywell’s limits and have found it to pass shock and vibration, longer temperature
cycling and longer temperature and humidity soak. (Check Reliability Report PTM7950)
If your lifetime performance is de ned mainly by power cycling, then you also check the PTM6000 series which will have the longest life. The main di erence between the 7XXX
products is the ller content which makes PTM7950 the most conductive.
How to achieve the minimum thermal resistance of PTM7950?
To achieve as low thermal resistance as possible for your device, you choose the material with high thermal conductivity, minimize the bondline thickness, and also improve the
surface wettability. PTM7950 excels at the thermal performance since it could achieve minimum bondline of 17um and high TC as 8.5 W/m.K. Clamping pressure (30~40 psi) and
temperature (at least 30mins @ 60°C) are suggested to achieve a minimum bond line thickness of the phase change material, typically less than 1.5 mil (0.038mm) for best
performance. The material must go through the phase change temperature to exhibit entitlement performance. (Check PCM Application Note) .
The gures below show the TI achieved using PTM7950.
PTM7950 Thermal Impedance (TI) vs. Pressure Thermal Impedance of PTM7950 is reduced with pressure
Thermal impedance is a measure of the resistance to heat ow across an interface. The
higher the thermal impedance, the greater the resistance to heat ow and the lower
the rate of heat transfer. This can lead to an increase in temperature at the interface,
which can reduce the performance and lifespan of the components.
To increase heat transfer between two surfaces, you want to reduce the thermal
impedance at the interface between those surfaces.
What is a Cutbar?
A "cutbar" is a metal bar made of copper or aluminum used to measure thermal
performance, simulating heat generated by electronic components. It tests the thermal
conductivity of thermal interface material by placing it between the cutbar and a
cooling solution, and its performance is observed by measuring its ability to conduct
heat away from the cutbar.
Reduce thermal impedance of PTM7950 by applying more pressure The 125W value is the heat dissipated during testing, used to determine thermal
impedance.
Bondline thickness of PTM7950 is reduced with pressure PTM7950 Bond Line Thickness, BLT (mm) vs. Pressure (psi)
One key characteristic of the PTM7950 is its bondline thickness, which refers to the
thickness of the layer of adhesive between two surfaces being bonded. In the image to
the left, we can observe how the bondline thickness of the PTM7950 changes under
varying pressure conditions.
As the pressure applied to the PTM7950 increases, the bondline thickness decreases.
Speci cally, a minimum pressure of 10 psi is needed to observe a signi cant reduction
in bondline thickness. This means that lower pressure is su cient to achieve a thinner
bondline, which can be advantageous in certain applications. However, as pressure
increases beyond 40 psi, the amount of thin bondline thickness that can be obtained
becomes very small. This suggests that higher pressure levels may not result in
signi cantly thinner bondlines and could even be detrimental to the bonding process.
Understanding the relationship between pressure and bondline thickness can be
crucial in optimizing the use of the PTM7950 adhesive in di erent applications. By
selecting the appropriate pressure level, it may be possible to achieve the desired
bondline thickness, thereby ensuring a strong and reliable bond between surfaces.
Furthermore, the pressure level could be adjusted based on the speci c application and
Reduce bondline thickness of PTM7950 by applying more pressure
the materials being bonded, which could further improve the quality and durability of
the bond.
Thermal Impedance Comparison of PTM7000-series against competitors PTM7950 is best-in-class against the competition
The thermal impedance values for various materials are shown in the chart on the left,
including the PTM 7900 and PTM 7950. Interestingly, both of these materials have the
lowest thermal impedance values when compared to all other materials tested,
including competitive thermal greases. Overall, the PTM 7950 is the top performer
among all materials tested for thermal impedance.
The PTM 7950 is clearly the best choice for thermal impedance, with the lowest value
among all materials tested. This makes it an excellent option for electronic devices that
require exceptional thermal management.
Compare the PTM7950 vs competitive materials
CAPLINQ and Honeywell PTM7950 featured on Linus Tech Tips
If you haven't seen it already, be sure to check out Linus' Tech Tip video which discusses Honeywell PTM7950. Though it mentions that PTM7950 is hard to buy, we've reached
out to Linus and his team and let them know that CAPLINQ was the only o cially recognized market channel partner to Honeywell's Thermal Interface Material business.
CAPLINQ's website is even featured in the video at timestamp 8:28, though we're pretty sure all the technical information Linus references come from our website as well.
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