Under Development

Mass production ●

RoHS
Specification
规格书
Client Name：
客户名称：

Client P/N：
客户品号：

Product P/N： HL-C3535F7V365-D1-LVR9(Au60)

产品型号：

Sending Date:
送样日期：

Client approval HongliZhihui approval

客户审核 鸿利智汇审核

Approval Audit Audit Confirmation

核准 确认 确认 制作

Sales depart- Quality depart- Engineering tech-

ment ment nology centre 份有
营销中心 品质部 工程技术中心 团股 限
鸿利智汇集

赵明深
州分
公司

□ Qualified 接受 DATE: 工程技术中心

□ Disqualified 不接受 日期：

Adr：No.1,Xianke Yi Road,Huadong Town,Huadu District,Guangzhou,China

地址：中国广州市花都区花东镇先科一路1号
Tel/电话：020-86733333 Fax/传真：020-86733883 86733938 86733265
Web/网址：www.honglitronic.com
注: 1.此规格书以中英文方式书写,若有冲突以中文版本为准文本.
2.此规格书的最终解释权归鸿利智汇集团股份有限公司
3.此规格书的有效期限为两年,自盖章或签字之日起计算,期满时双方可以续签协议,但应采用书面形式

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 1 OF 14

 Under Development
Mass production ●

Catalog目录
1. Product naming rules
产品命名规则···························3

2. Features

特点·······························3

3. Application range

应用范围·····························3

4. Specifications

规格·······························4

5. Product bins

产品分级·····························5

6.Typical Optical/Electrical Characteristics Curves

典型光学/电性特征曲线·······················6

7. Package Dimensions
封装尺寸·····························7

8. Welded plate and steel mesh Dimensions

焊盘及钢网尺寸··························7

9.Tape Specifications
包装规格·····························8

10.Reflow soldering instructions

回流焊说明····························9

11.Reliability Test
可靠性测试··························· 10

12.Use the matters needing attention

使用注意事项·························11-13

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 2 OF 14

 Under Development
Mass production ●

Product naming rules 产品命名规则

HL-C 3535 F7 V 365- D 1 LVR9 (Au 60)
1 2 3 4 5 6 7 8 9 10 11
1 ：HongLi code 鸿利光电代码
2 ：Product family code 产品系列代码
3 ：Size 尺寸代码
4 ：Chip code 芯片代码
5 ：The color of the light 表示发光颜色
6 ：Product wavelength360~370nm
产品波长360~370nm
7 ：Chip circuit表示晶片线路
8 ：Number of chips芯片数量
9 ： Zener code 表示齐纳代码
10： Coating process基板镀层工艺
11 ：Radiation Angle 辐射角度60º

Features 特点
● Near ultraviolet LED近紫外LED
● Size 外形尺寸：3.35mm*3.35mm*2.0mm
● SMT solderable SMT焊接
● Low thermal resistance低热阻
● EDS Electrostatic Protection ESD静电防护
● RoHS compliant 符合RoHS标准

Application range 应用范围

● UV-cure UV固化
● UV Printing UV 印刷
● UV Exposure UV 曝光
● Counterfeit Detection/ Security伪造品检测/安全
● Air Purification 空气净化

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 3 OF 14

 Under Development
Mass production ●

Specifications规格
(1) Absolute Maximum Ratings at Ta=25°C
在Ta=25°C时绝对极限条件
Parameter参数 Symbol符号 Rating 值 Units单位

Power dissipation功率 Pd 2 W

Peak Forward Current 正向电流 IFp 500 mA

Reverse Voltage方向电压 Vr 5 V

Junction Temperature 结温 Tj 115 C

°
Operating Temperature Range工作温度 Topr -20°C To +80°C

Storage Temperature Range储藏温度 Tstg -40°C To +65°C

(2) Optical Characteristics at Ta=25°C

在Ta=25°C 时典型光学特性
Symbol Min. Typ. Max. Units Test Conditions
Item名称
符号 最低 典型 最大 单位 测试条件

Φe Radiation Flux辐射功率 350 400 — mW IF=500mA

VF Forward Voltage 正向电压 3 — 4 V IF=500mA

λP Peak Wavelength峰值波长 360 365 370 nm IF=500mA

2θ1/2 50% Radiation Angle 辐射角度 — 60 — deg IF=500mA

IR Reverse Current反向电流 — — 50 uA VR=5V

R th 热阻 °C/W - - 10 IF=500mA

Notes: 备 注
■ The above forward voltage measurement allowance tolerance is ±3%. 以上所示电压测量误差± 3%.
■ The above peak wavelenth measurement allowance tolerance is ±3nm. 以上所示峰值波长测量误差±3nm.
■ The above total radiant flux measurement allowance tolerance ±10%. 上述辐射功率的测试公差为±10%.
■ Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
使用功率不能超过规定的最大值。
■ All measurements were made under the standardized environment.所有的测试都是基于现有的标准测试平台
■ When the LEDs are in operation the maximum current should be decided after measuring the package
temperature，junction temperature should not exceed the maximum rate.
LED 使用的最大电流需要根据散热条件确定，结温不能超过最大值

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 4 OF 14

 Under Development
Mass production ●

Product bins 产品分级

(1) Forward Voltage bins
电压分级
BIN Min (V) Max (V)

V28 2.8 3

V30 3.0 3.2

V32 3.2 3.4

V34 3.4 3.6

V36 3.6 3.8

V38 3.8 4.0

(2) Peak wavelength bins

峰值波长分级
BIN Min (nm) Max (nm)
P36-1 360 365

P36-2 365 370

(3) Radiant Flux bins

辐射通量分级
BIN Min (mw) Max (mw)
N35 350 400
N40 400 450

N45 450 500

Notes :
1. Peak Wavelength Measurement tolerance : ±3nm,以上所示峰值波长测量误差±3nm.
2. Radiant Flux Measurement tolerance : ±10%,以上辐射功率的测试公差为±10%.
3. Forward Voltage Measurement tolerance : ±3%,以上所示电压测量误差± 3%.

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 5 OF 14

 Under Development
Mass production ●

Typical Optical/Electrical Characteristics Curves (Ta=25℃)

典型光学/电性特征曲线（Ta=25℃）
Fig.1– 相对光谱功率分布图 Fig.2-伏安特性曲线

345 355 365 375 385 395 405

Fig.3– 相对辐射通量与正向电流图 Fig.4-峰值波长与正向电流图

Fig.5– 空间光谱分布图

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 6 OF 14

 Under Development
Mass production ●

Package Dimensions封装尺寸

Welded plate and steel mesh Dimensions 焊盘及钢网尺寸

中间焊盘增加
1.3 覆铜面积方向 1.15
0.51 0.39
3.32

3.17
0.40

0.40 0.51 0.63

3.21
3.32
建议使用的焊盘尺寸 建议使用的钢网尺寸

PCB pad dimensions (unit: mm) Steel mesh size (unit: mm)
PCB焊盘外形尺寸（单位：mm） 钢网尺寸（单位：mm）

Notes注:
[1].Tolerances unless otherwise mentioned are ±0.1mm.公差为±0.1mm,除非另有说明.

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 7 OF 14

 Under Development
Mass production ●

Label 标签

Фe: WP:

Label on ESD shielding 静电袋上标签 Label on box 外箱标签

Фe: Luminous Flux rank 辐射通量档次范围
VF: Forward voltage rank 正向电压档次范围
WP: Peak Length 峰值波长
LOT.NO: Lot Number 生产批号

Tape Specifications(Units:mm)载带规格 (单位:mm)

末端

178.00±0.20
60.00±0.40
13
.50
±0
.30

12.00±0.50
Moisture resistant packaging 防潮包装

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 8 OF 14

 Under Development
Mass production ●

Reflow soldering instructions 回流焊说明

Profile Feature Lead-Based solder Lead-Free Solder

Average Ramp-Rate (Tsmax to Tp) 3℃/second max 3℃/second max
Preheat: Temperature Min (Tsmin) 100℃ 150℃
Preheat:Temperature Max (Tsmax) 150℃ 200℃
Preheat:Time(tsmin to tsmax) 60-120 seconds 60-180 seconds
Time Maintained Above: Temperature(T L) 183℃ 217℃
Time Maintained Above: Time(tL) 60-150 seconds 60-150 seconds
Peak/Classification Temperature(Tp) 215℃ 260℃

Time Within 5℃ of Actual Peak Temperature(tp) 10-15 seconds 20-40 seconds

Ramp-Down Rate 6℃/second max 6℃/second max

Time 25℃ to Peak Temperature 6 minutes max 8 minutes max

Note:
1.Reflow soldering should not be done more than two times. In the case of more than 24 hours passed solder-
ing after first, LEDs will be damaged. 回流焊次数不可以超过两次，两次回流焊的时间间隔如果超过24小时，LED
可能由于吸湿而损坏。
2.When soldering , do not put stress on the LEDs during heating 当焊接时,不要在材料受热时用力压透镜表面。
3.It is commended that use the middle temperature solder past.推荐使用中温锡膏生产加工。
4.After soldering ,do not deal with the product before its temperature drop down to room temperature. 在焊接完成
后,待产品温度下降到室温后,再进行其它处理。
5.When hand soldering, keep thetemperature of iron below less 350℃less than 5 seconds
当手工焊接时，烙铁的温度必须小于350℃，时间不可超过5秒。
6.The hand solder should be done only one time.手工焊接只可焊接一次。
7.Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-
head soldering iron should be used (as below figure). It should be confirmed in advance whether the character-
istics of LEDs will or will not be damaged by repairing. LED回流焊后不应该修复，当必须修复时， 必须使用双头
烙铁，而且事先应确认此种方式会不会损坏LED本身的特性。

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 9 OF 14

 Under Development
Mass production ●

Reliability Test Items And Conditions 信赖性测试项目及条件

Test Items Test Condition Time Quantity Ac/Re

项目 测试条件 时间 数量 接收/拒收

Reflow Temp:260℃max
3 times. 11Pcs. 0/1
回流焊 T=10 sec

Thermal Shock -45℃-125℃

100 Cycles 11Pcs. 0/1
冷热冲击 15min/10s/15min

High Temperature Storage

Temp:100℃±5℃ 500Hrs. 11Pcs. 0/1
高温保存

Low Temperature Storage

Temp:-40℃±5℃ 500Hrs. 11Pcs. 0/1
低温保存

Life Test Ta=25℃±5℃

1000Hrs. 11Pcs. 0/1
常温通电 IF=30mA

Failure Criteria 失效判定标准

Failure Criteria
Test Items Symbol Test Condition 判定标准
项目 符号 测试条件
Min. 最小 Max. 最大

Forward Voltage
VF IF=30mA -- U.S.L*)x1.1
正向电压

Radiation Flux
辐射通量
Φe IF=30mA L.S.L*)x0.7 --

U.S.L: Upper Specification Limit 规格上限 L.S.L: Lower Specification Limit 规格下限

*The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of
the referenced products. It does not constitute the warranting of industrial property nor the granting of any license.
数据工作表中所示的技术信息仅限于典型特征和电路实例引用的产品.它既不构成工业特性的保证,也不构成任何许可的
授权

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 10 OF 14

 Under Development
Mass production ●

Use the matters needing attention(使用注意事项 )

1、LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating
usage material. This is provided for informational purposes only and is not a warranty or endorsement.
LED工作环境及与LED适配的材料中硫元素及化合物成份不可超过100PPM.这只是一个建议，不作任何品质担保

2、In order to prevent ex- ternal material from getting into the inside of LED, which may cause the malfunc-
tion of LED, the single content of Bromine element is required to be less than 900PPM, the single content of
Chlorine ement is required to be less than 900PPM,the total content of Bromine element and Chlorine ele-
ment I the external materials of the application products is required to be less than 1500PPM. This is prvided
for informational purposes only and is not a warranty or endorsement.
为了防止外界物质进入LED内部以造成LED的损伤，所处环境及所用套件等等，单一的溴元素含量要求小于

900PPM， 单一氯元素含量要求小于900PPM，溴元素与氯元素总含量必须小于1500PPM. 这只是一个建议，

不作任何品质担保。

3、VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can pene-
trate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can
be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to
be used in the construction of fixtures can help prevent these issues. Rafand advises against the use of any
chemicals or materials that have been found or are suspected to have an adverse affect on device perform-
ance or reliability. To verify compatibility, Rafand recommends that all chemicals and materials be tested in
the specific application and environment for which they are intended to be used. Attaching LEDs, do not use
adhesives that outgas organic vapor.
应用套件中的挥发性物质会渗透到LED内部，在通电产生光子及热的条件下，会导致LED变色，进而造成严重

光衰，提前了解套件材料能够避免产生这些问题。我司反对使用任何对LED器件的性能或者可靠性有害的物质

或材料，不管这些材料是已经证实了的还是仅仅怀疑有害。针对特定的用途和使用环境，我司建议对所有的物

质和材料进行相容性的测试。在贴装LED时候，不要使用能产生有机挥发性气体的粘结剂。

OK NG

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 11 OF 14

 Under Development
Mass production ●

Use the matters needing attention(使用注意事项 )

4、Handle the component along the side surface by using forceps or appropriate tools; do not directly

touch or Handle the lens surface, it may damage the internal circuitry.通过使用适当的工具从材料侧面

夹取，不可直接用手或尖锐金属压透镜表面，它可能会损坏内部电路。

5、In designing a circuit,the current through each LED must be exceed the absolute maximum rating
specified for each LED. The driving circuit must be designed to allow forward voltage only when it is ON
or OFF.If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
设计电路时，通过LED的电流不能超过规定的最大值。电路设计必须保证只有在开启或者关闭的时候出现

正向电压的变化，不要施加反压，否则会损坏LED。

6、Thermal Design is paramount importance because heat generation may result in the Characteristics
decline,such as brightness decreased,Color change and so on.Please consider the heat generation of
the LEDs when making the system design.
LED容易因为自身的发热和环境的温度改变而改变，温度升高会降低LED发光效率，影响发光颜色，所以

在设计时应充分考虑散热问题。

7、Compared to standard encapsulants and the surface is more likely to attract dust，requiring special
care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a
suitable cleaning solution must be applied to the surface after the soldering of components. Rafand
suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that
these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic
cleaning may cause damage to the LED. 与其他封装胶相比，应用时应特别注意，当对产品洁净度要求较

高时，回流焊以后需要采用恰当的清洗方式，我们推荐用异丙醇作清洗剂，如需要用到其他清洗剂，必须

保证不会破坏封装体，超声清洗可能会对LED带来损害，不推荐这种清洗方式。

8、To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recom-

mended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. If the color of the

desiccant changes, components should be dried for 10-12hr at 60±5℃.为了避免湿气进入， 产品应该保存在

干燥的地方，同时需要使用干燥剂， 推荐的储存温度是5℃到30℃，最大湿度不能超过50%,如果湿度卡和

干燥剂变色了，需要烘烤10-24小时，烘烤温度为60±5℃。

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 12 OF 14

 Under Development
Mass production ●

9、Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and

Electrical Over Stress (EOS). 像其他的半导体电子器件一样，LED对静电过流击穿非常敏感，需

要做好防护。

10、Eye Safety Guidelines眼睛安全准则

- Do not view directly in to the UV light of LED driven at low current or the LED with optical instru-
ments for measuring such as radiant flux, light distribution and spectrum, etc.请勿直视小电流驱动

的LED或使用光学仪器测量辐射通量，光分布和光谱等的LED的紫外线。
- Do not expose to the human body and eyes during the LED light emitting because UV light can
be hazardous for human.在LED发光期间，请勿将其暴露于人体和眼睛，因为紫外线可能对人体

有害。

-Please wear UV protective products such as UV protective glasses, mask, etc.请佩戴防紫外线产

品，例如防紫外线眼镜，面罩等。

11、Other points for attention, please refer to our LED usermanual. After the product life cycle for
recycling.

其它注意事项请参照LED使用手册。产品生命周期后进行回收处理。

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 13 OF 14

 Under Development
Mass production ●

修订次数 修订人 修订内容 修订日期 版次

1 张强 新建文件 2016.5.16 A/0

2 赵明深 增加产品分级、可靠性测试、使用注意事 2020.7.31 A/1

项更新、特性曲线图更新

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

SPEC NO: B-16-C-0136 REV NO: A/1 DATE: July/2020 PAGE: 14 OF 14