RTL8153B-VB-CG

INTEGRATED 10/100/1000M ETHERNET

CONTROLLER FOR USB 3.0 APPLICATIONS

DATASHEET
(CONFIDENTIAL: Development Partners Only)

Rev. 1.0
27 January 2016
Track ID: JATR-8275-15

Realtek Semiconductor Corp.

No. 2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan
Tel.: +886-3-578-0211. Fax: +886-3-577-6047
www.realtek.com
 RTL8153B-VB
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COPYRIGHT
©2016 Realtek Semiconductor Corp. All rights reserved. No part of this document may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any
means without the written permission of Realtek Semiconductor Corp.

DISCLAIMER
Realtek provides this document ‘as is’, without warranty of any kind. Realtek may make improvements
and/or changes in this document or in the product described in this document at any time. This document
could include technical inaccuracies or typographical errors.

TRADEMARKS
Realtek is a trademark of Realtek Semiconductor Corporation. Other names mentioned in this document
are trademarks/registered trademarks of their respective owners.

LICENSE
This product is covered by one or more of the following patents: US5,307,459, US5,434,872,
US5,732,094, US6,570,884, US6,115,776, and US6,327,625.

USING THIS DOCUMENT

This document is intended for the software engineer’s reference and provides detailed programming
information.
Though every effort has been made to ensure that this document is current and accurate, more information
may have become available subsequent to the production of this guide.

REVISION HISTORY
Revision Release Date Summary
1.0 2016/01/27 First release.

Integrated 10/100/1000M Ethernet Controller for USB 3.0 Applications ii Track ID: JATR-8275-15 Rev. 1.0
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Table of Contents
1. GENERAL DESCRIPTION ..............................................................................................................................................1
2. FEATURES .........................................................................................................................................................................3
3. SYSTEM APPLICATIONS...............................................................................................................................................4
4. PIN ASSIGNMENTS .........................................................................................................................................................4
4.1. PACKAGE IDENTIFICATION ...........................................................................................................................................4
5. PIN DESCRIPTIONS.........................................................................................................................................................5
5.1. POWER MANAGEMENT PIN ..........................................................................................................................................5
5.2. SPI (SERIAL PERIPHERAL INTERFACE) FLASH PINS .....................................................................................................5
5.3. EEPROM PINS ............................................................................................................................................................5
5.4. TRANSCEIVER INTERFACE PINS....................................................................................................................................6
5.5. CLOCK PINS .................................................................................................................................................................6
5.6. REGULATOR AND REFERENCE PINS..............................................................................................................................6
5.7. LED PINS .....................................................................................................................................................................7
5.8. POWER AND GROUND PINS ..........................................................................................................................................7
5.9. GPIO PIN .....................................................................................................................................................................7
5.10. USB INTERFACE PINS ..................................................................................................................................................8
5.11. SHARED PIN CONFIGURATION ......................................................................................................................................8
6. FUNCTIONAL DESCRIPTION.......................................................................................................................................9
6.1. USB INTERFACE ..........................................................................................................................................................9
6.1.1. USB Configurations................................................................................................................................................9
6.1.2. Endpoint 0 ..............................................................................................................................................................9
6.1.3. Endpoint 1 Bulk-In .................................................................................................................................................9
6.1.4. Endpoint 2 Bulk-Out...............................................................................................................................................9
6.1.5. Endpoint 3 Interrupt-In ..........................................................................................................................................9
6.2. CUSTOMIZABLE LED CONFIGURATION ......................................................................................................................10
6.3. PHY TRANSCEIVER ...................................................................................................................................................12
6.3.1. PHY Transmitter...................................................................................................................................................12
6.3.2. PHY Receiver .......................................................................................................................................................12
6.3.3. Link-Down Power Saving Mode...........................................................................................................................13
6.3.4. Next Page .............................................................................................................................................................13
6.4. EEPROM INTERFACE ................................................................................................................................................13
6.5. SPI (SERIAL PERIPHERAL INTERFACE) FLASH............................................................................................................14
6.6. POWER MANAGEMENT...............................................................................................................................................14
6.7. LINK POWER MANAGEMENT (LPM) ..........................................................................................................................15
6.8. PROTOCOL OFFLOAD .................................................................................................................................................15
6.9. WAKE PACKET DETECTION (WPD) ...........................................................................................................................16
6.10. ‘REALWOW!’ (WAKE-ON-WAN) TECHNOLOGY ......................................................................................................16
6.11. ENERGY EFFICIENT ETHERNET (EEE)........................................................................................................................16
6.12. LAN DISABLE MODE .................................................................................................................................................16
6.13. ALWAYS ON ALWAYS CONNECTED ...........................................................................................................................17
6.14. SWITCHING REGULATOR ............................................................................................................................................17
6.15. LDO REGULATOR ......................................................................................................................................................17
6.16. DRIVER AUTO-INSTALL MODE ..................................................................................................................................18
7. CHARACTERISTICS......................................................................................................................................................19
7.1. ABSOLUTE MAXIMUM RATINGS ................................................................................................................................19
7.2. RECOMMENDED OPERATING CONDITIONS .................................................................................................................19
7.3. CRYSTAL REQUIREMENTS ..........................................................................................................................................20

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7.4. OSCILLATOR REQUIREMENTS ....................................................................................................................................20
7.5. ENVIRONMENTAL CHARACTERISTICS ........................................................................................................................21
7.6. DC CHARACTERISTICS ...............................................................................................................................................21
7.7. REFLOW PROFILE RECOMMENDATIONS .....................................................................................................................22
7.8. AC CHARACTERISTICS ...............................................................................................................................................22
7.8.1. SPI EEPROM Interface Timing............................................................................................................................22
7.8.2. SPI Flash Commands ...........................................................................................................................................23
7.8.3. SPI Flash Interface Timing...................................................................................................................................25
7.8.4. SPI Flash Type Supported ....................................................................................................................................26
8. MECHANICAL DIMENSIONS......................................................................................................................................27
9. ORDERING INFORMATION........................................................................................................................................28

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List of Tables
TABLE 1. POWER MANAGEMENT PIN ...........................................................................................................................................5
TABLE 2. SPI FLASH PINS ............................................................................................................................................................5
TABLE 3. EEPROM PINS .............................................................................................................................................................5
TABLE 4. TRANSCEIVER INTERFACE PINS ....................................................................................................................................6
TABLE 5. CLOCK PINS ..................................................................................................................................................................6
TABLE 6. REGULATOR AND REFERENCE PINS ..............................................................................................................................6
TABLE 7. LED PINS......................................................................................................................................................................7
TABLE 8. POWER AND GROUND PINS ...........................................................................................................................................7
TABLE 9. GPIO PIN ......................................................................................................................................................................7
TABLE 10. USB INTERFACE PINS ..................................................................................................................................................8
TABLE 11. SHARED PIN MODES.....................................................................................................................................................8
TABLE 12. LED SELECT (OCP REGISTER OFFSET DD90H~DD91H)...........................................................................................10
TABLE 13. CUSTOMIZED LEDS ...................................................................................................................................................10
TABLE 14. FIXED LED MODE .....................................................................................................................................................10
TABLE 15. LED FEATURE CONTROL-1........................................................................................................................................11
TABLE 16. LED FEATURE CONTROL-2........................................................................................................................................11
TABLE 17. LED OPTION 1 & OPTION 2 SETTINGS .......................................................................................................................11
TABLE 18. EEPROM INTERFACE ................................................................................................................................................13
TABLE 19. SPI FLASH INTERFACE ...............................................................................................................................................14
TABLE 20. ABSOLUTE MAXIMUM RATINGS ................................................................................................................................19
TABLE 21. RECOMMENDED OPERATING CONDITIONS .................................................................................................................19
TABLE 22. CRYSTAL REQUIREMENTS ..........................................................................................................................................20
TABLE 23. OSCILLATOR REQUIREMENTS ....................................................................................................................................20
TABLE 24. ENVIRONMENTAL CHARACTERISTICS ........................................................................................................................21
TABLE 25. DC CHARACTERISTICS ...............................................................................................................................................21
TABLE 26. REFLOW PROFILE RECOMMENDATIONS .....................................................................................................................22
TABLE 27. SPI EEPROM ACCESS TIMING PARAMETERS ............................................................................................................23
TABLE 28. SPI FLASH COMMANDS..............................................................................................................................................23
TABLE 29. SPI FLASH ACCESS TIMING PARAMETERS .................................................................................................................26
TABLE 30. SPI FLASH TYPES SUPPORTED ...................................................................................................................................26
TABLE 31. ORDERING INFORMATION ..........................................................................................................................................28

List of Figures
FIGURE 1. PIN ASSIGNMENTS .......................................................................................................................................................4
FIGURE 2. SPI EEPROM INTERFACE TIMING ............................................................................................................................22
FIGURE 3. WREN/WRDI COMMAND SEQUENCE .......................................................................................................................23
FIGURE 4. READ COMMAND SEQUENCE .....................................................................................................................................24
FIGURE 5. PAGE PROGRAM COMMAND SEQUENCE ....................................................................................................................24
FIGURE 6. SECTOR/BLOCK ERASE COMMAND SEQUENCE ..........................................................................................................24
FIGURE 7. CHIP ERASE COMMAND SEQUENCE ...........................................................................................................................25
FIGURE 8. SPI FLASH INTERFACE TIMING ..................................................................................................................................25

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1. General Description
The Realtek RTL8153B-VB-CG 10/100/1000M Ethernet controller combines a triple-speed IEEE 802.3
compliant Media Access Controller (MAC) with a triple-speed Ethernet transceiver, USB 3.0 bus
controller, and embedded memory. With state-of-the-art DSP technology and mixed-mode signal
technology, the RTL8153B-VB offers high-speed transmission over CAT 5 UTP cable or CAT 3 UTP
(10Mbps only) cable. Functions such as Crossover Detection and Auto-Correction, polarity correction,
adaptive equalization, cross-talk cancellation, echo cancellation, timing recovery, and error correction are
implemented to provide robust transmission and reception capabilities. The RTL8153B-VB features
embedded One-Time-Programmable (OTP) memory that can replace the external EEPROM
(93C46/93C56/93C66).

The RTL8153B-VB features USB 3.0 to provide higher bandwidth and improved protocols for data
exchange between the host and the device. USB 3.0 also offers more advanced power management
features for energy saving.

Advanced Configuration Power management Interface (ACPI)—power management for modern

operating systems that are capable of Operating System-directed Power Management (OSPM)—is
supported to achieve the most efficient power management possible. In addition to the ACPI feature,
remote wake-up (including AMD Magic Packet and Microsoft Wake-Up Frame) is supported in both
ACPI and APM (Advanced Power Management) environments.

The RTL8153B-VB supports Microsoft Wake Packet Detection (WPD) to provide Wake-Up Frame
information to the OS, e.g., PatternID, OriginalPacketSize, SavedPacketSize, SavedPacketOffset, etc.
WPD helps prevent unwanted/unauthorized wake-up of a sleeping computer.

The RTL8153B-VB supports ‘RealWoW!’ technology to enable remote wake-up of a sleeping PC

through the Internet. This feature allows PCs to reduce power consumption by remaining in low power
sleeping state until needed.
Note: The ‘RealWoW!’ service requires registration on first time use.

The RTL8153B-VB supports Protocol offload. It offloads some of the most common protocols to NIC
hardware in order to prevent spurious wake-up and further reduce power consumption. The
RTL8153B-VB can offload ARP (IPv4) and NS (IPv6) protocols while in the D3 power saving state.

The RTL8153B-VB supports the ECMA (European Computer Manufacturers Association) proxy for
sleeping hosts standard. The standard specifies maintenance of network connectivity and presence via
proxies in order to extend the sleep duration of higher-powered hosts. It handles some network tasks on
behalf of the host, allowing the host to remain in sleep mode for longer periods. Required and optional
behavior of an operating proxy includes generating reply packets, ignoring packets, and waking the host.

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The RTL8153B-VB supports IEEE 802.3az-2010, also known as Energy Efficient Ethernet (EEE). IEEE
802.3az-2010 operates with the IEEE 802.3 Media Access Control (MAC) Sublayer to support operation
in Low Power Idle mode. When the Ethernet network is in low link utilization, EEE allows systems on
both sides of the link to save power.

The RTL8153B-VB is fully compliant with Microsoft NDIS5, NDIS6 (IPv4, IPv6, TCP, UDP)
Checksum features, and supports IEEE 802 IP Layer 2 priority encoding and IEEE 802.1Q Virtual
bridged Local Area Network (VLAN). The above features contribute to lowering CPU utilization,
especially benefiting performance when in operation on a network server.

The RTL8153B-VB is suitable for multiple market segments and emerging applications, such as desktop,
mobile, workstation, server, communications platforms, docking station, and embedded applications.

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2. Features
Hardware Software Offload
„ Integrated 10/100/1000M transceiver „ Microsoft NDIS5, NDIS6 Checksum
„ Auto-Negotiation with Next Page capability Offload (IPv4, IPv6, TCP, UDP) and
Segmentation Task-offload (Large send v1
„ Supports USB 3.0, 2.0, and 1.1 and Large send v2) support
„ Supports CDC-ECM „ Supports jumbo frame to 9K bytes
„ Supports LPM (Link Power Management),
U1/U2/U3 at SuperSpeed, and L1/L2 at IEEE
HighSpeed „ Supports Full Duplex flow control
„ Supports pair swap/polarity/skew correction (IEEE 802.3x)
„ Crossover Detection & Auto-Correction „ Fully compliant with IEEE 802.3,
IEEE 802.3u, and IEEE 802.3ab
„ Supports Wake-On-LAN and ‘RealWoW!’
(Wake-On-WAN) Technology (see note 1) „ Supports IEEE 802.1P Layer 2 Priority
Encoding
„ Supports ECMA-393 ProxZzzy Standard for
sleeping hosts (see note 1) „ Supports IEEE 802.1Q VLAN tagging
Note 1. Select between RealWoW! or ECMA; „ Supports IEEE 802.3az-2010 (EEE)
only one feature can be active at a time.
Microsoft AOAC (Always On Always
„ Supports power down/link down power Connected)
saving
„ Supports 32-set 128-byte Wake-Up Frame
„ Transmit/Receive on-chip buffer support pattern exact matching
„ EEPROM Interface „ Supports link change wake up
„ Embedded OTP memory can replace
external EEPROM „ Supports Microsoft WPD (Wake Packet
Detection)
„ Built-in switching regulator and LDO
regulator „ Supports Protocol Offload (ARP & NS) at
„ Supports Customizable LEDs all speeds

„ Supports hardware CRC (Cyclic Intel CPPM (Converged Platform Power

Redundancy Check) function Management)
„ LAN disable with GPIO pin „ Supports L1 with 3ms BESL (USB 2.0)
„ Supports 25MHz Crystal
„ Dynamic LTM messaging (USB 3.0)
„ Supports 25MHz/48MHz Oscillator
„ SPI Flash Interface „ Supports U1/U2/U3 (USB 3.0)
„ Supports Legacy PXE (eHCI and xHCI) & „ Supports selective suspend
UEFI PXE
„ 40-pin QFN ‘Green’ package

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3. System Applications
„ USB 10/100/1000M Ethernet on Motherboard, Dongle, Notebook, Docking station, or Embedded
system

4. Pin Assignments

EEDO/LED2/SPISDO/LANWAKEB/GPIO
EEDI/SPISDI/ENSWREG
EESK/LED1/SPISCK

DVDD10_UPS
VDDREG33
VDDREG5
REGOUT

DVDD33

VDD5
GND

30 29 28 27 26 25 24 23 22 21

EECS 31 20 AVDD33
LED0/SPICSB 32 19 U2VDD10
DVDD33 33 18 U2DP
DVDD10 34 17 U2DM
CKXTAL1 35 16 U3SSRXP
CKXTAL2 U3SSRXN
36
RTL8153B 15

AVDD10 37
LLLLLLL 14 U3VDD10
RSET 38
GXXXV 13 U3SSTXP
AVDD33 39 12 U3SSTXN
AVDD33 40 11 AVDD33
1 2 3 4 5 6 7 8 9 10
MDIP0
MDIN0
AVDD10
MDIP1
MDIN1
MDIP2
MDIN2
AVDD10

MDIN3
MDIP3

Figure 1. Pin Assignments

4.1. Package Identification

Green package is indicated by the ‘G’ in GXXXV (Figure 1). The version number is shown in the
location marked ‘V’.

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5. Pin Descriptions
The signal type codes below are used in the following tables:

I: Input O: Output

P: Power D: Open drain

5.1. Power Management Pin

Table 1. Power Management Pin
Symbol Type Pin No Description
LANWAKEB D 24 Power Management Event Output Pin (Open drain, active low).
Note. Pin 24 is a shared pin; the function is configured by autoload. Only one mode can be active at a time.

5.2. SPI (Serial Peripheral Interface) Flash Pins

Table 2. SPI Flash Pins
Symbol Type Pin No Description
SPICSB O 32 SPI Flash Chip Select.
SPISDO I 24 Input from SPI Flash Serial Data Output Pin.
SPISDI O 25 Output to SPI Flash Serial Data Input Pin.
SPISCK O 30 SPI Flash Serial Data Clock.
Note. Pin 24 is a shared pin; the function is configured by autoload. Only one mode can be active at a time.

5.3. EEPROM Pins

Table 3. EEPROM Pins
Symbol Type Pin No Description
EESK O 30 Serial Data Clock for 93C46/93C56/93C66.
EEDI IO 25 Output to serial data input pin of EEPROM (93C46/93C56/93C66)
EEDO I 24 Input from Serial Data Output Pin of EEPROM (93C46/93C56/93C66).
EECS O 31 EEPROM (93C46/93C56/93C66) Chip Select
Note 1: The RTL8153B-VB will complete eFUSE auto-load before EEPROM auto-load, and determine the type of
EEPROM (93C46/93C56) by the ‘select 93C46/56/66’ eFUSE auto-load value. 1 indicates 93C46; 0 indicates
93C56/93C66.
Note 2. Pin 25 is power-on latch pin for ENSWREG.

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5.4. Transceiver Interface Pins

Table 4. Transceiver Interface Pins
Symbol Type Pin No Description
In MDI mode, this is the first pair in 1000Base-T, i.e., the BI_DA+/- pair, and is
MDIP0 IO 1
the transmit pair in 10Base-T and 100Base-TX.
In MDI crossover mode, this pair acts as the BI_DB+/- pair, and is the receive pair
MDIN0 IO 2
in 10Base-T and 100Base-TX.
In MDI mode, this is the second pair in 1000Base-T, i.e., the BI_DB+/- pair, and is
MDIP1 IO 4
the receive pair in 10Base-T and 100Base-TX.
In MDI crossover mode, this pair acts as the BI_DA+/- pair, and is the transmit
MDIN1 IO 5 pair in 10Base-T and 100Base-TX.
MDIP2 IO 6 In MDI mode, this is the third pair in 1000Base-T, i.e., the BI_DC+/- pair.
MDIN2 IO 7 In MDI crossover mode, this pair acts as the BI_DD+/- pair.
MDIP3 IO 9 In MDI mode, this is the fourth pair in 1000Base-T, i.e., the BI_DD+/- pair.
MDIN3 IO 10 In MDI crossover mode, this pair acts as the BI_DC+/- pair.

5.5. Clock Pins

Table 5. Clock Pins
Symbol Type Pin No Description
CKXTAL1 I 35 Input of Clock Reference.
Connect to GND if an external clock source drives CKXTAL2.
CKXTAL2 IO 36 Output of Clock Reference.
Input of External Clock Source.

5.6. Regulator and Reference Pins

Table 6. Regulator and Reference Pins
Symbol Type Pin No Description
REGOUT O 28 Switching Regulator 1.0V Output.
Power-On Latch Pin:
ENSWREG I 25 3.3V: Enable switching regulator
0V: Disable switching regulator, and enable external 1.0V input mode
VDDREG5 P 27 Digital 5V Power Supply for Switching/LDO Regulator.
VDDREG33 P 26 Digital 3.3V Power Supply for Switching/LDO Regulator.
Linear Regulator (LDO) 3.3V Output.
AVDD33 P 20 Note: The embedded LDO is designed for RTL8153B-VB internal use only. Do not
provide this power source to other devices.
Linear Regulator (LDO) 1.0V Output.
DVDD10_UPS P 22 Note: The embedded LDO is designed for RTL8153B-VB internal use only. Do not
provide this power source to other devices.
RSET I 38 Reference (External Resistor Reference).
GND P 29 Switching/LDO Regulator GND.

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5.7. LED Pins

Table 7. LED Pins
Symbol Type Pin No Description
LED0 O 32 See Section 6.2 Customizable LED Configuration, Page 10 for Details.
LED1 O 30
LED2 O 24
Note 1: In prelink suspend state (power-on and USB disconnected), LED pin output voltage depends on both Etherenet
connection (link up/link down) and LED setting(high active/low active).
In LAN disabled state, LED pin output voltage is 0v.
Note 2. Pin 24 is a shared pin; the function is configured by autoload. Only one mode can be active at a time.

5.8. Power and Ground Pins

Table 8. Power and Ground Pins
Symbol Type Pin No Description
VDD5 P 21 Analog 5.0V Power Supply.
11, 20, 39,
AVDD33 P Analog 3.3V Power Supply.
40
DVDD33 P 23, 33 Digital 3.3V Power Supply.
AVDD10 P 3, 8, 37 Analog 1.0V Power Supply.
DVDD10 P 34 Digital 1.0V Power Supply.
DVDD10_UPS P 22 Digital 1.0V Uninterruptible Power Supply.
U3VDD10 P 14 USB 3.0 1.0V Power Supply.
U2VDD10 P 19 USB 2.0/USB 1.1 1.0V Power Supply.
GND P 29 Ground.
GND P 41 Ground (Exposed Pad).
Note: Refer to the most updated schematic circuit for correct configuration.

5.9. GPIO Pin

Table 9. GPIO Pin
Symbol Type Pin No Description
General Purpose Input/Output Pin.
Link OK feature: Output Pin (Active High)
GPIO IO 24
Power Saving Feature: Output Pin (Active Low)
LAN Disable Mode: Input pin (Active Low)
Note 1. Pin 24 is a shared pin; the function is configured by autoload. Only one mode can be active at a time.
Note 2. When configured as GPIO pin, only 1 of the 4 modes can be active at a time

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5.10. USB Interface Pins

Table 10. USB Interface Pins
Symbol Type Pin No Description
U3SSRXP I 16 USB 3.0 Super-Speed Receive Differential Pair.
U3SSRXN I 15 USB 3.0 Super-Speed Receive Differential Pair.
U3SSTXP O 13 USB 3.0 Super-Speed Transmit Differential Pair.
U3SSTXN O 12 USB 3.0 Super-Speed Transmit Differential Pair.
U2DP IO 18 USB 2.0/USB 1.1 Differential Signal Pair.
U2DM IO 17 USB 2.0/USB 1.1 Differential Signal Pair.

5.11. Shared Pin Configuration

Pin 24 is a shared multi-function pin. Only one mode can be active at a time. The configuration must be
done via autoload only. After configuring the pin, the other functions will be disabled. The autoload
configuration must comply with the following:
• If EEPROM is not used, the autoload configuration shall be written to eFUSE
• If EEPROM is used, the autoload configuration shall be written to EEPROM only

The LED may or may not blink during power-on. This is a known behavior due to EEPROM pin sharing
with the LED pin.

Table 11. Shared Pin Modes

Pin Name Pin No. LED Mode SPI Mode LANWAKEB GPIO Mode
(default) Mode
EEDO/LED2/SPISDO/ 24 LED2 SPISDO LANWAKEB GPIO
LANWAKEB/GPIO
EEDI/SPIDI 25 - SPIDI - -
EESK/LED1/SPISCK 30 LED1 SPISCK LED1 LED1
EECS 31 - - - -
LED0/SPICSB 32 LED0 SPICSB LED0 LED0

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6. Functional Description
6.1. USB Interface
The SIE (Serial Interface Engine) employs a robust hardwired USB protocol implementation so that the
entire USB interface operation can be done without firmware intervention. For all three types of End
Points (Bulk-In, Bulk-Out, and Interrupt-In), appropriate responses and handshake signals are generated
by the SIE. The SIE analog transceiver complies fully with driver and receiver characteristics defined in
USB Specification Rev. 3.0.

6.1.1. USB Configurations

The RTL8153B-VB supports two networking configurations; ECM (Ethernet Control Model)
configuration and in-house configuration. The ECM configuration complies with CDC-ECM, and is a
general Ethernet networking model that enables network communication without installing additional
vendor specific drivers. The in-house configuration requires a vendor specific driver to support enhanced
features and optimized performance.

6.1.2. Endpoint 0
All USB devices support a common access mechanism for accessing information through this control
pipe. Associated with the control pipe at endpoint 0 is the information required to completely describe the
USB device. This pipe also provides the register read and write to the RTL8153B-VB.

6.1.3. Endpoint 1 Bulk-In

The RTL8153B-VB transfers Ethernet Rx packets to the host via this endpoint. The maximum Bulk-In
packet size is 1024 bytes. If the Ethernet packet is larger than 1024 bytes, the RTL8153B-VB splits the
Ethernet packet into multiple USB packets.

6.1.4. Endpoint 2 Bulk-Out

The host sends Ethernet Tx packets to the RTL8153B-VB via this endpoint. The maximum Bulk-Out
packet size is 1024 bytes. If the Ethernet packet is larger than 1024 bytes, the host will send the Ethernet
packet in multiple USB packets.

6.1.5. Endpoint 3 Interrupt-In

The Interrupt Endpoint (EP3) can be used to poll the current ALDPS state, EEE capability, TX/RX flow
control enable, Connection Speed, Duplex mode, and link status of the RTL8153B-VB.

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6.2. Customizable LED Configuration

The RTL8153B-VB supports customizable LED operation modes via OCP address DD90h~DD91h.
Table 12 describes the different LED actions.
Table 12. LED Select (OCP Register Offset DD90h~DD91h)
Bit Symbol RW Description
15:12 LEDCntl RW LED Feature Control.
11:8 LEDSEL2 RW LED Select for PINLED2.
7:4 LEDSEL1 RW LED Select for PINLED1.
3:0 LEDSEL0 RW LED Select for PINLED0.

When implementing customized LEDs:

Configure OCP address DD90h to support your own LED signals. For example, if the value in the OCP
address DD90h is 0CA9h (0000110010101001b), the LED actions are:
• LED 0: On only in 10M mode, with blinking during TX/RX
• LED 1: On only in 100M mode, with blinking during TX/RX
• LED 2: On only in 1000M mode, with blinking during TX/RX
Table 13. Customized LEDs
Speed LINK ACT/Full
Link 10M Link 100M Link 1000M
LED 0 Bit 0 Bit 1 Bit 2 Bit 3
LED 1 Bit 4 Bit 5 Bit 6 Bit 7
LED 2 Bit 8 Bit 9 Bit 10 Bit 11
Feature Control Bit 12 Bit 13 Bit 14 Bit 15
Note: There are two special modes:
LED OFF Mode: Set all bits to 0. All LED pin output become floating (power saving).
Fixed LED Mode: Set Option 1 LED table Mode: LED0=LED1=LED2=1 or 2 (see Table 14).
Table 14. Fixed LED Mode
Bit31~Bit0 Value LED0 LED1 LED2
1XXX 0001 0001 0001 ACT LINK Full Duplex + Collision
1XXX 0010 0010 0010 Transmit LINK Receive
Note: ‘X’ indicates ‘irrelevant’.

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Table 15. LED Feature Control-1
Feature Control Bit12 Bit13 Bit14 Bit15
0 LED0 Low Active LED1 Low Active LED2 Low Active Indicates Option 1 of Table 17
is Selected
1 LED0 High Active LED1 High Active LED2 High Active Indicates Option 2 of Table 17
is Selected

Table 16. LED Feature Control-2

LED Pin ACT=0 ACT=1
LINK=0 Floating All Speed ACT
LINK>0 Selected Speed LINK Option 1 (see Table 17): Selected Speed LINK+ Selected Speed ACT
Option 2 (see Table 17): Selected Speed LINK+ All Speed ACT

Table 17. LED Option 1 & Option 2 Settings

Link Bit Active Bit Description
10 100 1000 Link Option 1 LED Option 2 LED
Activity Activity
0 0 0 0 LED Off
0 0 0 1 - Act10+Act100+Act1000 Act10+Act100+Act1000
0 0 1 0 Link1000 - -
0 0 1 1 Link1000 Act1000 Act10+Act100+Act1000
0 1 0 0 Link100 - -
0 1 0 1 Link100 Act100 Act10+Act100+Act1000
0 1 1 0 Link100+Link1000 - -
0 1 1 1 Link100+Link1000 Act100+Act1000 Act10+Act100+Act1000
1 0 0 0 Link10 - -
1 0 0 1 Link10 Act10 Act10+Act100+Act1000
1 0 1 0 Link10+Link1000 - -
1 0 1 1 Link10+Link1000 Act10+Act1000 Act10+Act100+Act1000
1 1 0 0 Link10+Link100 - -
1 1 0 1 Link10+Link100 Act10+Act100 Act10+Act100+Act1000
1 1 1 0 Link10+Link100+Link1000 - -
1 1 1 1 Link10+Link100+Link1000 Act10+Act100+Act1000 Act10+Act100+Act1000
Note:
Act10 = LED blinking when Ethernet packets transmitted/received at 10Mbps.
Act100 = LED blinking when Ethernet packets transmitted/received at 100Mbps.
Act1000 = LED blinking when Ethernet packets transmitted/received at 1000Mbps.
Link10 = LED lit when Ethernet connection established at 10Mbps.
Link100 = LED lit when Ethernet connection established at 100Mbps.
Link1000 = LED lit when Ethernet connection established at 1000Mbps.

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6.3. PHY Transceiver

6.3.1. PHY Transmitter
Based on state-of-the-art DSP technology and mixed-mode signal processing technology, the
RTL8153B-VB operates at 10/100/1000Mbps over standard CAT.5 UTP cable (100/1000Mbps), or
CAT.3 UTP cable (10Mbps).
GMII (1000Mbps) Mode
The RTL8153B-VB’s PCS layer receives data bytes from the MAC through the GMII interface and
performs the generation of continuous code-groups through 4D-PAM5 coding technology. These code
groups are passed through a waveform-shaping filter to minimize EMI effects, and are transmitted onto
the 4-pair CAT5 cable at 125MBaud/s through a D/A converter.
MII (100Mbps) Mode
The transmitted 4-bit nibbles (TXD[3:0]) from the MAC, clocked at 25MHz (TXC), are converted into
5B symbol code through 4B/5B coding technology, then through scrambling and serializing, are
converted to 125MHz NRZ and NRZI signals. The NRZI signals are passed to the MLT3 encoder, then to
the D/A converter and transmitted onto the media.
MII (10Mbps) Mode
The transmitted 4-bit nibbles (TXD[3:0]) from the MAC, clocked at 2.5MHz (TXC), are serialized into
10Mbps serial data. The 10Mbps serial data is converted into a Manchester-encoded data stream and is
transmitted onto the media by the D/A converter.

6.3.2. PHY Receiver

GMII (1000Mbps) Mode
Input signals from the media pass through the sophisticated on-chip hybrid circuit to separate the
transmitted signal from the input signal for effective reduction of near-end echo. The received signal is
processed with state-of-the-art technology, e.g., adaptive equalization, BLW (Baseline Wander)
correction, cross-talk cancellation, echo cancellation, timing recovery, error correction, and 4D-PAM5
decoding. The 8-bit-wide data is recovered and is sent to the GMII interface at a clock speed of 125MHz.
The RX MAC retrieves the packet data from the receive MII/GMII interface and sends it to the RX
Buffer Manager.
MII (100Mbps) Mode
The MLT3 signal is processed with an ADC, equalizer, BLW (Baseline Wander) correction, timing
recovery, MLT3 and NRZI decoder, descrambler, 4B/5B decoder, and is then presented to the MII
interface in 4-bit-wide nibbles at a clock speed of 25MHz.
MII (10Mbps) Mode
The received differential signal is converted into a Manchester-encoded stream first. Next, the stream is
processed with a Manchester decoder and is de-serialized into 4-bit-wide nibbles. The 4-bit nibbles are
presented to the MII interface at a clock speed of 2.5MHz.

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6.3.3. Link-Down Power Saving Mode

The RTL8153B-VB implements link-down power saving; greatly cutting power consumption when the
network cable is disconnected. The RTL8153B-VB automatically enters link down power saving mode
ten seconds after the cable is disconnected from it. Once it enters link down power saving mode, it
transmits normal link pulses on its TX pins and continues to monitor the RX pins to detect incoming
signals. After it detects an incoming signal, it wakes up from link down power saving mode and operates
in normal mode according to the result of the connection.

6.3.4. Next Page

If 1000Base-T mode is advertised, three additional Next Pages are automatically exchanged between the
two link partners. Users can set PHY Reg4.15 to 1 to manually exchange extra Next Pages via Reg7 and
Reg8 as defined in IEEE 802.3ab.

6.4. EEPROM Interface

SPI EEPROM interfaces are supported. The SPI interface utilizes a 93C46/93C56/93C66 EEPROM,
which is 1K-bit/2K-bit/4K-bit, respectively. The EEPROM interface permits the RTL8153B-VB to read
from, and write data to an external serial EEPROM.
Values in the internal eFUSE memory or external EEPROM allow default register values to be overridden
following a power-on or software EEPROM auto-load command. The RTL8153B-VB will auto-load
values from the eFUSE or EEPROM. If the EEPROM is not present and eFUSE auto-load is bypassed,
the RTL8153B-VB initialization uses default values for the appropriate Configuration and Operational
Registers. Software can read and write to the EEPROM using bit-bang accesses via the 9346CR Register.
The EEPROM SPI interface consists of EESK, EECS, EEDO, and EEDI.
The correct EEPROM (i.e., 93C46/93C56/93C66) must be used in order to ensure proper LAN function.
Table 18. EEPROM Interface
EEPROM Description
EECS EEPROM (93C46/93C56/93C66) chip select
EESK Serial Data Clock for EEPROM (93C46/93C56/93C66).
EEDI Output to serial data input pin of EEPROM (93C46/93C56/93C66)
EEDO Input from Serial Data Output Pin of EEPROM (93C46/93C56/93C66).

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6.5. SPI (Serial Peripheral Interface) Flash

SPI Flash is enabled by the RTL8153B-VB through the Chip Select pin, and accessed via a 3-wire
interface consisting of Serial Data Input (SI), Serial Data Output (SO), and Serial Clock (SCK). The SPI
flash utilizes an 8-bit instruction register. All instructions, addresses, and data are transferred with the
MSB first and start with a high-to-low transition.
Compared to a parallel bus interface, the Serial Peripheral Interface provides simpler wiring and much
less interaction (crosstalk) among the conductors in the cable. This minimizes the number of conductors,
pins, and the IC package size, reducing the cost of making, assembling, and testing the electronics.
Table 19. SPI Flash Interface
SPI Flash Description
SO Input Data Bus.
SI Output Data Bus.
SCK SPI Flash Serial Data Clock.
CSB SPI Flash Chip Select.

6.6. Power Management

The RTL8153B-VB complies with ACPI (Rev 1.0, 1.0b, 2.0), Network Device Class Power Management
Reference Specification (V1.0a), such as to support an Operating System-directed Power Management
(OSPM) environment.
The RTL8153B-VB can monitor the network for a Wake-Up Frame or a Magic Packet, and notify the
system via the USB interface when such a packet or event occurs. The system is then restored to a normal
state to process incoming jobs.
When the RTL8153B-VB is in power saving mode:
• The RTL8153B-VB monitors the network for wake-up events such as a Magic Packet and Wake-Up
Frame in order to wake-up the system
• The RTL8153B-VB will not receive any packets into the RX on-chip buffer
• USB transactions are stopped

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Magic Packet Wake-Up occurs only when the following conditions are met:
• The destination address of the received Magic Packet is acceptable to the RTL8153B-VB, e.g., a
broadcast, multicast, or unicast packet addressed to the current RTL8153B-VB adapter.
• The received Magic Packet does not contain a CRC error.
• The Magic Packet pattern matches, i.e., 6 * FFh + MISC (can be none) + 16 * DID (Destination ID)
in any part of a valid Ethernet packet.

A Wake-Up Frame event occurs only when the following conditions are met:
• The destination address of the received Wake-Up Frame is acceptable to the RTL8153B-VB, e.g., a
broadcast, multicast, or unicast address to the current RTL8153B-VB adapter.
• The received Wake-Up Frame does not contain a CRC error.
• The received Wake-Up Frame matches the Wake-Up Frame pattern given by the local machine’s OS.
Or, the RTL8153B-VB is configured to allow direct packet wake-up, e.g., a broadcast, multicast, or
unicast network packet.
Note: The RTL8153B-VB supports 32-set wake-up frames.

6.7. Link Power Management (LPM)

The RTL8153B-VB supports full USB Link Power Management (LPM). It provides an efficient way for
the host to manage power consumption. The four power management states are L0, L2, L3 in USB 2.0,
and L1 in extended USB 2.0.
USB 3.0 also defines four power management states: U0, U1, U2, and U3. If host and hub support LPM,
the host/hub can put the device into a low power state. The RTL8153B-VB will deactivate some of its
circuits to reduce power consumption in the low power state, and go back to full functionality in active
state.
Refer to http://www.usb.org/developers/docs/

6.8. Protocol Offload

Protocol offload is a task offload supported by Microsoft Windows 7 and following versions. It maintains
a network presence for a sleeping higher power host. Protocol offload prevents spurious wake-up and
further reduces power consumption. It maintains connectivity while hosts are asleep, including receiving
requests from other nodes on the network, ignoring packets, generating packets while in the sleep state
(e.g., the Ethernet Controller will generate ARP responses if the same MAC and IPv4 address are
provided in the configuration data), and intelligently waking up host systems. The RTL8153B-VB
supports the ECMA (European Computer Manufacturers Association) specification including proxy
configuration and management, IPv4 ARP, IPv6 NDP, and wake-up packets. The RTL8153B-VB also
supports optional ECMA items such as QoS tagged packets and duplicate address detection.

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6.9. Wake Packet Detection (WPD)

The RTL8153B-VB supports Microsoft Wake Packet Detection (WPD) to provide Wake-Up Frame
information to the OS, e.g., PatternID, OriginalPacketSize, SavedPacketSize, SavedPacketOffset, etc.
WPD helps prevent unwanted/unauthorized wake-up of a sleeping computer.
Refer to the Microsoft Wake Packet Detection (WPD) Interface Specification for details
(http://msdn.microsoft.com/en-us/library/hh440160(v=vs.85).aspx).

6.10. ‘RealWoW!’ (Wake-On-WAN) Technology

The RTL8153B-VB supports Realtek 'RealWoW!' technology that allows the RTL8153B-VB
to send keep-alive packets to the Wake Server when the PC is in sleeping mode. Realtek
'RealWoW!' can pass wake-up packets through a NAT (Network Address Translation) device.
This feature allows PCs to reduce power consumption by remaining in low power sleeping
state until needed.
Users can login into the Wake Server via the Internet to wake the selected sleeping PC. Registration of
Account information to the Wake Server is required on first time use.

6.11. Energy Efficient Ethernet (EEE)

The RTL8153B-VB supports IEEE 802.3az-2010, also known as Energy Efficient Ethernet (EEE), at
10Mbps, 100Mbps, and 1000Mbps. It provides a protocol to coordinate transitions to/from a lower power
consumption level (Low Power Idle mode) based on link utilization. When no packets are being
transmitted, the system goes to Low Power Idle mode to save power. Once packets need to be
transmitted, the system returns to normal mode, and does this without changing the link status and
without dropping/corrupting frames.
To save power, when the system is in Low Power Idle mode most of the circuits are disabled, however,
the transition time to/from Low Power Idle mode is kept small enough to be transparent to upper layer
protocols and applications.
EEE also specifies a negotiation method to enable link partners to determine whether EEE is supported
and to select the best set of parameters common to both devices.
Refer to http://www.ieee802.org/3/az/index.html for more details.

6.12. LAN Disable Mode

The RTL8153B-VB supports the ‘LAN Disable Mode’ that can use an external signal to control whether
the NIC is enabled or disabled. When the RTL8153B-VB is in LAN disable mode, the RTL8153B-VB
enters power saving state.

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6.13. Always On Always Connected

The RTL8153B-VB supports Microsoft’s AOAC (Always On Always Connected) model. The AOAC
platform can enter the system state ‘Connected Standby’ and allow the RTL8153B-VB to enter a
low-power state. The RTL8153B-VB will maintain Layer 2 connectivity and generate a wake signal when
one of the following conditions is satisfied:
• Link status becomes ‘connected’
• Link status becomes ‘disconnected’
• Receives a magic packet
• Receives a wakeup frame (pattern match)

6.14. Switching Regulator

The RTL8153B-VB incorporates a state-of-the-art switching regulator that requires a well-designed PCB
layout in order to achieve good power efficiency and lower the output voltage ripple and input overshoot.
Note that the switching regulator 1.0V output pin (REGOUT) must be connected only to DVDD10,
AVDD10, U3VDD10, and U2VDD10 (do not provide this power source to other devices).

6.15. LDO Regulator

The RTL8153B-VB incorporates linear Low-Dropout (LDO) regulators that feature high power supply
ripple rejection and low output noise. The RTL8153B-VB embedded LDO regulators do not require
power inductors on the PCB; only an output capacitor between its output and analog ground for phase
compensation, which saves cost and PCB real estate.
The output capacitors (and bypass capacitors) should be placed as close as possible to the power pins for
adequate filtering.
Note 1: The embedded LDO is designed for the RTL8153B-VB internal use only. Do not provide this
power source to other devices.
Note 2: The digital LDO output pin (DVDD10_UPS) should be separated from the other 1.0V SWR output
pin (REGOUT).

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6.16. Driver Auto-Install Mode

Realtek’s auto-install mode solves the problem of a lack of network connection or CD-ROM hardware on
some recent computer platforms making driver installation difficult. With auto-install mode configured,
attach the driver-less RTL8153B-VB to a system. The RTL8153B-VB will disconnect, switch to
auto-install mode, and reconnect as a USB CD-ROM with a programmed driver installer. The driver will
install itself and the RTL8153B-VB will switch back to USB NIC mode after installation.
The mechanism for identifying driver existence has inherent limitations due to the USB protocol. The
general USB enumeration flow consists of Set Address and Set Configuration control transfer. The Set
Address is done by the operating system, the Set Configuration is done by the device driver (see note1).
The RTL8153B-VB detects the driver existence by starting the auto-install mode timer when it receives
Set Address. If the driver exists, the driver will do Set Configuration within a short time (millisecond
scale after the driver has loaded). The timer will stop upon receipt of Set Configuration. If a driver is not
present, the device will not receive Set Configuration and the timer will timeout (default timeout value is
8 seconds).
Note 1: For Linux and OSX, the USB SetConfig is handled by the system USB framework (USB host
controller driver and/or USB bus driver); this behavior cannot trigger RTL8153B-VB switching to
auto-install mode. As a result, RTL8153B-VB supports auto-install mode in Windows only.
For Linux, Realtek supports a built-in in-house/ECM driver.
For OSX, Realtek supports a built-in ECM driver; users can also install an in-house driver.
Note 2: For more technical information, refer to the auto-install mode application note.

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7. Characteristics
7.1. Absolute Maximum Ratings
WARNING: Absolute maximum ratings are limits beyond which permanent damage may be caused to
the device, or device reliability will be affected. All voltages are specified reference to GND unless
otherwise specified.
Table 20. Absolute Maximum Ratings
Symbol Description Minimum Maximum Unit
VDD5 5.0V Supply Voltage -0.3 5.5 V
DVDD33, AVDD33 3.3V Supply Voltage -0.3 3.63 V
DVDD10, AVDD10,
U3VDD10, U2VDD10, 1.0V Supply Voltage -0.3 1.1 V
DVDD10_UPS
Dcinput Input Voltage -0.3 Corresponding Supply Voltage + 10% V
Dcoutput Output Voltage -0.3 Corresponding Supply Voltage + 10% V
N/A Storage Temperature -55 +125 °C
Note: Refer to the most updated schematic circuit for correct configuration.

7.2. Recommended Operating Conditions

Table 21. Recommended Operating Conditions
Description Symbol Minimum Typical Maximum Unit
VDD5 4.5 5.0 5.5 V
DVDD33, AVDD33 3.14 3.3 3.46 V
Supply Voltage VDD DVDD10, AVDD10,
U3VDD10, U2VDD10, 0.95 1.0 1.05 V
DVDD10_UPS
Ambient Operating Temperature TA - 0 - 70 °C
Maximum Junction Temperature - - - 125 °C
Note: Refer to the most updated schematic circuit for correct configuration.

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7.3. Crystal Requirements

Table 22. Crystal Requirements
Symbol Description/Condition Minimum Typical Maximum Unit
Parallel resonant crystal reference frequency,
Fref - 25 - MHz
fundamental mode, AT-cut type
Parallel resonant crystal frequency stability,
Fref Stability -30 - +30 ppm
fundamental mode, AT-cut type. Ta=0°C ~ +70°C
Parallel resonant crystal frequency tolerance,
Fref Tolerance -50 - +50 ppm
fundamental mode, AT-cut type. Ta=25°C
Fref Duty Cycle Reference Clock Input Duty Cycle 40 - 60 %
- - 70 Ω
ESR Equivalent Series Resistance
Note 3
CL Load Capacitance 16 - 20 pF
Jitter Broadband Peak-to-Peak Jitter - - 200 ps
DL Drive Level - - 0.3 mW
Note 1: The CLK source can come from other places in the system, but it must accord with the parameters above.
Note 2: Broadband RMS=9ps; 25KHz to 25MHz RMS=3ps.
Note 3: The ESR maximum value is based on the shunt capacitance specified by the crystal manufacturer and two
external capacitors of 27pF recommended in the latest reference schematic. When:
shunt capacitance = 3pF, the ESR maximum value = 50Ω
shunt capacitance = 5pF, the ESR maximum value = 40Ω
shunt capacitance = 7pF, the ESR maximum value = 30Ω
Note 4: The accuracy of the crystal resonance frequency can be achieved by matching the load capacitance correctly to
the designed-in circuit. The latest schematic circuit recommends two external capacitors of 27pF connected between the
crystal and ground. To match this use the load capacitance specified by the crystal manufacturer of 16~20pF.

7.4. Oscillator Requirements

Table 23. Oscillator Requirements
Parameter Condition Minimum Typical Maximum Unit
Frequency - - 25/48 - MHz
Frequency Stability Ta = 0°C ~ +70°C -30 - +30 ppm
Frequency Tolerance Ta = 25°C -50 - +50 ppm
Duty Cycle - 40 - 60 %
Broadband Peak-to-Peak Jitter - - - 200 ps
Vih - 1.4 - - V
Vil - - - 0.4 V
Rise Time - - - 10 ns
Fall Time - - - 10 ns
Operation Temp Range - 0 - 70 °C
Note 1: The CLK source can come from other places in the system, but it must accord with the parameters above.
Note 2: Broadband RMS=9ps; 25KHz to 25MHz RMS=3ps.

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7.5. Environmental Characteristics

Table 24. Environmental Characteristics
Parameter Minimum Maximum Units
Storage Temperature -55 +125 °C
Ambient Operating Temperature 0 70 °C
Moisture Sensitivity Level (MSL) Level 3 N/A

7.6. DC Characteristics
Table 25. DC Characteristics
Symbol Parameter Conditions Minimum Typical Maximum Units
VDD5 5.0V Supply Voltage - 4.5 5.0 5.5 V
DVDD33,
3.3V Supply Voltage - 3.14 3.3 3.46 V
AVDD33
DVDD10,
AVDD10,
U3VDD10, 1.0V Supply Voltage - 0.95 1.0 1.05 V
U2VDD10,
DVDD10_UPS
Minimum High Level Output
Voh Ioh = -4mA 0.9*VDD33 - VDD33 V
Voltage
Maximum Low Level Output
Vol Iol = 4mA 0 - 0.1*VDD33 V
Voltage
Minimum High Level Input
Vih - 2.0 - - V
Voltage
Maximum Low Level Input
Vil - - - 0.8 V
Voltage
Vin = VDD33 or
Iin Input Current 0 - 0.5 µA
GND
Average Operating Supply
Current from 5.0V (does At 1000Mbps with
Icc5 - 0.5 - mA
NOT include 3.3V and 1.0V heavy network traffic
power consumption)
Average Operating Supply
Current from 3.3V (does At 1000Mbps with
Icc33 - 70 - mA
NOT include 1.0V power heavy network traffic
consumption)
Average Operating Supply At 1000Mbps with
Icc10 - 170 - mA
Current from 1.0V heavy network traffic
Average Operating Supply
Current for total system 5V At 1000Mbps with
Isys5 - Note 3 - mA
(includes 3.3V and 1.0V heavy network traffic
power consumption)
Note 1: Refer to the most updated schematic circuit for correct configuration.
Note 2: All Supply Voltage power noise <±5% of Supply Voltage.
Note 3: The total operating current Isys5 = Icc5 + Icc33 + Icc10*1.0/Efficiency/5, where Efficiency = 0.70

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7.7. Reflow Profile Recommendations

Table 26. Reflow Profile Recommendations
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Minimum Preheat Temperature (Tsmin) 100°C 150°C
Maximum Preheat Temperature (Tsmax) 150°C 200°C
Preheat Time (tS) from Tsmin to Tsmax 60~120 seconds 60~120 seconds
Ramp-Up Rate (TL to Tp) 3°C/second max. 3°C/second max.
Liquidus Temperature (TL) 183°C 217°C
Time (tL) Maintained above TL 60~150 seconds 60~150 seconds
Peak Package Body Temperature (Tp) 235°C 260°C
2
Time (tp) within 5°C of Peak TP 20 seconds 20 seconds
Ramp-Down Rate (Tp to TL) 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature (Tp) 6 minutes max. 8 minutes max.
Note 1: All temperatures refer to the topside of the package, measured on the package body surface.
Note 2: Tolerance for Tp is defined as a supplier’s minimum and a user’s maximum.
Note 3: Reference document: IPC/JEDEC J-STD-020D.1.

7.8. AC Characteristics
7.8.1. SPI EEPROM Interface Timing

Figure 2. SPI EEPROM Interface Timing

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Table 27. SPI EEPROM Access Timing Parameters
Symbol Parameter Min Typical Max Unit
tcs Minimum CS Low Time 1024 4096 - ns
tcss CS Setup Time 512 512 - ns
tcsh CS Hold Time - 0 - ns
tskh SK High Time 512 512 8192 ns
tskl SK Low Time 512 512 8192 ns
tsk SK Clock Cycle Time 1024 1024 16384 ns
tdis DI Setup Time 512 512 - ns
tdih DI Hold Time 512 512 - ns
twp Write Cycle Time - 6 10 ms

7.8.2. SPI Flash Commands

7.8.2.1 SPI Flash Commands
Table 28. SPI Flash Commands
Command Operation Code Action
WREN 06h Write Enable
WRDI 04h Write Disable
RDID 9Fh Read Manufacturer and Product ID
RDSR 05h Read Status Register
WRSR 01h Write Status Register
Read 03h Read
Page Program 02h Page Program
Sector Erase (4K) 20h Erase The Selected Sector
Block Erase (64K) D8h Erase The Selected Block
Chip Erase 60h or C7h Erase Whole Chip

7.8.2.2 SPI Flash Command Sequence

Figure 3. WREN/WRDI Command Sequence

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CSB

SCK

SI Operation Code

SO

Figure 4. Read Command Sequence

CSB

SCK

SI Operation Code

CSB

SCK

SI

Figure 5. Page Program Command Sequence

Figure 6. Sector/Block Erase Command Sequence

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CSB

SCK

SI Operation Code

Figure 7. Chip Erase Command Sequence

7.8.3. SPI Flash Interface Timing

Figure 8. SPI Flash Interface Timing

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Table 29. SPI Flash Access Timing Parameters
Symbol Parameter Min Typical Max Unit
Clock Frequency for all instructions except
fSCK DC - 6 MHz
Read data (fC)
fRSCK Clock Frequency for the READ instructions (fR) DC - 32 MHz
Clock High Time (fC ) 128 - - ns
tCH
Clock High Time (fR ) - 16 - ns
Clock Low Time (fC) 40 - - ns
tCL
Clock Low Time (fR) - 16 - ns
tCLCH Clock Rise Time 0.1 - - V/ns
tCHCL Clock Fall Time 0.1 - - V/ns
tDVCH SI Setup Time 32 - - ns
tCHDX SI Hold Time 96 - - ns
tSHQZ SO Disable Time - - - ns
tCLQV Clock Low to SO Valid - - 10 ns
tCLQX SO Hold Time 0 - - ns

7.8.4. SPI Flash Type Supported

Table 30. SPI Flash Types Supported
Manufacturer Flash Part No. Density (Mb) Max Freq (MHz)
MXIC MX25L4006E 4 86
MX25L8006E 8 86
MX25L1606E 16 86
Winbond W25X40CV 4 80
W25Q40BV 4 80
W25Q80BV 8 80
W25Q16CV 16 80
Micron M25P40 4 75
M25PX80 8 75
M25PX16 16 75
GigaDevice GD25Q40B 4 120
GD25Q80B 8 120
GD25Q16B 16 120
Spansion S25FL204K 4 85
S25FL208K 8 75
S25FL216K 16 65
Note 1: The Flash clock frequency should be 33MHz or higher.
Note 2: Flash density should be 4Mb or more. 4Mb is only for single OS driver. For feature extensions, 8Mb is
recommended.

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Datasheet

8. Mechanical Dimensions

Symbol Dimension in mm Dimension in inch

Min Nom Max Min Nom Max
A 0.80 0.85 0.90 0.031 0.033 0.035
A1 0.00 0.02 0.05 0.000 0.001 0.002
A3 0.20 REF 0.008 REF
b 0.15 0.20 0.25 0.006 0.008 0.010
D/E 5.00 BSC 0.197 BSC
D2/E2 3.45 3.60 3.75 0.136 0.142 0.148
e 0.40 BSC 0.016 BSC
L 0.30 0.40 0.50 0.012 0.016 0.020
Notes:
1. CONTROLLING DIMENSION: MILLIMETER (mm).
2. REFERENCE DOCUMENT: JEDEC MO-220.

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9. Ordering Information
Table 31. Ordering Information
Part Number Package Status
RTL8153B-VB-CG 40-Pin QFN ‘Green’ Package
Note: See page 4 for package ID information.

Realtek Semiconductor Corp.

Headquarters
No. 2, Innovation Road II
Hsinchu Science Park, Hsinchu 300, Taiwan
Tel.: +886-3-578-0211. Fax: +886-3-577-6047
www.realtek.com
Integrated 10/100/1000M Ethernet Controller for USB 3.0 Applications 28 Track ID: JATR-8275-15 Rev. 1.0