PRODUCT DATA SHEET
Indium5.1AT
Pb-Free Solder Paste
Introduction
Indium5.1AT is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required
by the SnAgCu, SnAg, and other Pb-free alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
Indium5.1AT offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s
high-speed, as well as high-mix, surface mount lines. In addition to consistent printing and reflow requirements, Indium5.1AT offers
superb wetting to Pb-free metallizations and low-voiding on CSPs with microvia-in-pad designs.
Features Packaging
• Ultra-low-voiding in BGA/CSP components Indium5.1AT is currently available in 500g jars or 600g cartridges.
• Ultra-low-voiding at via-in-pad sites Packaging for enclosed print head systems is also readily available.
• Excellent microBGA/CSP printability Alternate packaging options may be available upon request.
• Wide reflow process window
• Good response-to-pause performance
Storage and Handling Procedures
Refrigerated storage will prolong the shelf life of solder paste. The
shelf life of Indium5.1AT is 6 months when stored at <10°C. Solder
Alloys paste packaged in cartridges should be stored tip down.
Indium Corporation manufactures low-oxide spherical powder Solder paste should be allowed to reach ambient working
composed of a variety of Pb-free alloys that cover a broad range temperature prior to use. Generally, paste should be removed
of melting temperatures. Type 4 and Type 3 powder are standard from refrigeration at least 2 hours before use. Actual time to reach
offerings with SAC305 and SAC387 alloys. The metal percent is thermal equilibrium will vary with container size. Paste temperature
the weight percent of the solder powder in the solder paste and is should be verified before use. Jars and cartridges should be labeled
dependent upon the powder type and application. Standard product with date and time of opening.
offerings are detailed in the table below.
Technical Support
Standard Product Specifications Indium Corporation’s internationally experienced engineers provide
Alloy Metal Load (Powder) IPN in-depth technical assistance to our customers. Thoroughly
knowledgeable in all facets of Materials Science as it applies to the
96.5Sn/3.0Ag/0.5Cu (SAC305) 88.75% (Type 3) 800143 electronics and semiconductor sectors, Technical Support Engineers
95.5Sn/3.0Ag/0.5Cu (SAC305) 89.00% (Type 4) 800142 provide expert advice in solder preforms, wire, ribbon, and paste.
Indium Corporation’s Technical Support Engineers provide rapid
response to all technical inquiries.
Bellcore and J-STD Tests and Results
Test Result Test Result Safety Data Sheets
J-STD-004A (IPC-TM-650) J-STD-005 (IPC-TM-650) The SDS for this product
can be found online at
Flux Type Classification ROL1 Typical Solder Paste Viscosity http://www.indium.com/sds
88.75% metal load (Type 4) 1,750 poise
Flux-Induced Corrosion
L 89.00% metal load (Type 3) 1,900 poise
(Copper Mirror)
Malcom (10rpm)
Presence of Halide
Slump Test Pass
–Silver Chromate Pass
–Fluoride Spot Test Pass Solder Ball Test Pass
–Quantitative Halide Content <0.5%
Typical Tackiness 35g
Post-Reflow Flux Residue
37% Wetting Test Pass
(ICA Test)
BELLCORE GR-78
SIR Pass
All information is for reference only. SIR Pass
Not to be used as incoming product specifications. Electromigration Pass
Form No. 98153 R9
PRODUCT DATA SHEET
Indium5.1AT Pb-Free Solder Paste
Printing Reflow
Stencil Design: Recommended Profile:
Electroformed and laser cut/electropolished stencils produce the
best printing characteristics among stencil types. Stencil aperture
design is a crucial step in optimizing the print process. The following
are a few general recommendations:
• Discrete components—A 10–20% reduction of stencil aperture
has significantly reduced or eliminated the occurrence of
mid-chip solder beads. The “home plate” design is a common
method for achieving this reduction.
• Fine-pitch components—A surface area reduction is
recommended for apertures of 20mil pitch and finer. This
reduction will help minimize solder balling and bridging that can
lead to electrical shorts. The amount of reduction necessary is
process-dependent (5–15% is common). The stated profile recommendations apply to most Pb-free
alloys in the SnAgCu (SAC) alloy system, including SAC305
• For optimum transfer efficiency and release of the solder paste (96.5Sn/3.0Ag/0.5Cu). This can be used as a general guideline
from the stencil apertures, industry standard aperture and in establishing a reflow profile when using Indium5.1AT Solder
aspect ratios should be adhered to. Paste. Deviations from these recommendations are acceptable,
and may be necessary, based on specific process requirements,
Printer Operation including board size, thickness, and density.
The following are general recommendations for stencil printer
optimization. Adjustments may be necessary based on specific
Heating Stage:
process requirement: The use of a linear ramp rate or ramp-to-spike (RTS) type profile
assists in minimizing the greatest overall number of defects
Solder Paste Bead Size 20–25mm in diameter associated with the reflow process. If the ramp rate is too fast, it
Print Speed 25–100mm/second can cause solder balling, solder beading, and aggravated hot slump
which can lead to bridging. The ramp rate in the preheat stage of the
Squeegee Pressure 0.018–0.027kg/mm of blade length
profile can range from 0.5–2.5°C/second (0.5–1°C/second is ideal). A
Start at once every 5 prints and short soak of 20–30 seconds just below the melting point of the solder
Underside Stencil Wipe decrease frequency until optimum alloy can help minimize tombstoning when using a RTS type profile.
value is reached
If necessary, a ramp-soak-spike (RSS) profile can be implemented
Solder Paste Stencil Life >8 hours (at 30–60% RH and 22–28°C) to minimize voiding on BGA and CSP type packages. A soak zone
between 200–210°C for up to 2 minutes is acceptable.
Cleaning Liquidus Stage:
Indium5.1AT is designed for no-clean applications; however, the flux
can be removed, if necessary, by using a commercially available flux To achieve acceptable wetting and form a quality solder joint, the
residue remover. acceptable temperature range above the melting point of the solder alloy
is 12–50°C (15–30°C is ideal). The acceptable range for time above liquidus
Stencil Cleaning is best performed using isopropyl alcohol (IPA) as (TAL) is 30–100 seconds (45–60 seconds is ideal). A peak temperature and
a solvent. Most commercially available stencil cleaners work well. TAL above these recommendations can result in excessive intermetallic
formation that can decrease solder joint reliability.
Compatible Products Cooling Stage:
• Rework Flux: TACFlux 020B ®
A rapid cool down is desired to form a fine-grain structure. Slow
• Flux Pen: FP-500 or NC-771 cooling will form a large-grain structure, which typically exhibits
poor fatigue resistance. The acceptable cooling range is 0.5–6.0°C/
• Cored Wire: CW-501 second (2.0–6.0°C/second is ideal).
This product data sheet is provided for general information only. It is not intended, and shall not be construed, to warrant or guarantee the performance
of the products described which are sold subject exclusively to written warranties and limitations thereon included in product packaging and invoices.
All Indium Corporation’s products and solutions are designed to be commercially available unless specifically stated otherwise.
All of Indium Corporation’s solder paste and preform manufacturing facilities are IATF 16949:2016 certified. Indium Corporation is an ISO 9001:2015 registered company.
Learn more: www.indium.com
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