Objectives -:

 The students should be able to carry out any PCB design necessary for their
graduation projects after completion of PCB design Course.
 The students will also be able to create schematics from blue-prints.
 The course is intended to give the students the necessary knowledge and of PCB
design steps, starting from a simple schematic, through creating new components, and
all the way to down a final PCB layout ready for population.
 The course includes single-sided and double-sided printed circuit board design,
emphasizing the drawings, standards, and the processes required to layout printed
circuit board and manufacturing documentation
 The students will be able to
 understand how a PCB is fabricated and assembled.
 construct their component libraries and use them effectively
 effective use of design rules and interfacing between schematic and PCB
 Generating and understanding design documentation for board
manufacture and assembly
 communication between the different design processes i.e., enclosure
design, hardware design, schematic entry, PCB layout, PCB fabrication,
and PCB assembly.
 The students should be recognize the technologies used in electronic industry through
the practical experience gained in the course

Who Should Attend this Course

 Electrical, communication, computer mechatronic, energy and industrial engineering

students who want to include the PCB Design experience as part of their skill set
 Those who want to peruse a career in the PCB industry by for example working as an
online freelance engineer.
 Beginners and hobbyist who are interested in starting a career in electronics
engineering

1 Vinod Deshmukh
 PCB Design Course Outline

Module-1 Introduction Of PCB 2 Hours

 Definition of PCB
 Difference between PCB and PWB
 History of Printed Circuit Board [PCB].
 Types of PCB
[Single Layer and Multilayer]
Rigid and Flexible PCB
 PCB material –
Standard FR-4 – Epoxy Glass
Multifunctional FR-4
Tetra functional FR-4
Nelco N400-6
GETEK
BT Epoxy Glass
Cyanate Aster
Polyimide Glass
Teflon
 Trends in PCB Designing:
Older PCB Method
PCB designing using Graph Paper
Making Hand Drawn PCB
Using Computer for EDA (Electronics Design Automation)
 Mechanical and Electrical Properties
Resin and Foils
Solder Mask
Legend
IPC (industry standards)

2 Vinod Deshmukh
Module-2 Introduction to Basic 2Hours
Electronic Components

 Showing different types of electronic components

 Categorizing electronic components according to their size, power-ratings, package
style and placements
 Understanding the difference between through hole components and SMD
components Reading component's data-sheets and transferring their mechanical
layout and dimensions to a new footprint library design
 Type of Electronics Components
 Active Components – Diode, Transistor, MOSFET, LED, SCR, IC etc.
 Passive Components - Resistor, Inductor, Transformer, Speaker / Buzzer etc.
 Components Package Type
* Through Hole Package -
Axial Lead
Radial Lead
Single In-Line Package (SIP)
Zigzag In-Line Package (ZIP)
Dual Line Package (DIP)
Transistor Outline (TO)
Pin Grid Array (PGA)
Staggered Pin Grid Array (SPGA)
* Surface Mounting Package –
Metal Electrode Face (MELF)
Leadless Chip Carrier (LCC)
Small Outline Package (SOP)
Small Outline Integrated Circuit (SOIC)
Quad Flat Package (QFP)
Quad Flat No Leads (QFN)
Plastic Leaded Chip Carries (PLCC)
Ball Grid Array (BGA)
Land Grid Array (LGA)
* Contact Mounting Package
Dual Tape carrier Package (DTP)
Quad Tape carrier Package (QTP)

3 Vinod Deshmukh
Module-3 Introduction to 2Hours
Electronic Design
Automation [EDA]

 History of EDA
 Latest Trend in Market
 How it Help and why it requires
 Different EDA Tools
 Introduction to Simulation Software
 Introduction and working of PADS (Mentor Graphics), Altium and Cadence and Other

Module-4 Introduction to 2Hours

Development Tools
PADS

 Required Hardware
 Required Operating system
 Installation of Software
 Installation of License
 File Management
 Data Management

Module-5 PCB Process Flow 2Hours

 Schematic Entry
 Net listing
 PCB layout Designing
 Design Rule for Check (DRC)
 Design For Manufacture (DFM)

4 Vinod Deshmukh
  Design For Assembly (DFA)
 Design For Test (DFT)
 CAM (Gerber) File Generation
 NC drill data Generation
 PCB Making

 Printing
 Etching
 Drilling

 Bare board testing

 Assembly of components
 Testing

Module-6 Schematic Creation 4Hours

 Staring a Project
 Basic uses for operating design tool
 Component selection from libraries to circuit design
 Component selection for over own libraries.
 Placing, Editing and connecting components for circuit design.
 Applying DRC ( Design Rule Check)
 Assigning or modifying PCB part for circuit component.
 Multiple peases and interconnection of schematics
 Creation of Net, Off page or Busses.
 Preparing to create a net list
 Creating a net list
 Exporting and Importing of schematic data.
 Creating output report such as BOM (Bill Of Material)
 Compiling and checking the schematics design against warnings and errors and
faults.

5 Vinod Deshmukh
Module-7 PCB Layout 8Hours

 Importing PCB
Defining board shape, Make PCB border as per requirement, importing DXF file with
mounting position, Defining PCB board profile and details specifying the number of
signal layers and power planes.
 Foot print generation and package selection, components check based on
requirement.
 Importing Net list and part list using synchronises with schematics.
 Floor management for placement of different section of circuit.
 Placement of components using either: manual, interactive an automatic technique.
 Details of routing tracks and adjustment by layer. Routing using either manual or
interactive routing tricks and tips of best components placement and interactive
routing strategies.
 Defining, setup routing guidelines
 Defining, setup and editing of Power and ground planes (Polygons)
 Layout creation and components connections – TH and SMD
 Routing layout, copper pouring
 DRC checking
 Pad / Pattern editors creation for over own libraries
 Adding reference Text, PCB name, PCB part number, version number, Logo etc.

Module-8 Fabrication Output 2Hours

 Gerber File generation (Gerber setup in order to specify the accuracy layers and drill
drawings.) Setup and generate an NC-Drill Files.
 Output file generation for Stencil manufacturing.
 Output file generation for Pick and place (PAP) machine.
 Output file generation for Assembly.
 Output file for Part List separately for SMD and TH on Top and Bottom layer.
DRC checking

6 Vinod Deshmukh
Module-9 Component & 2Hours
Schematic Libraries

 Introducing to the basic steps of Using, editing and creating new component and
schematic libraries.

 Creating schematic components with single and multiple parts.

 Checking the components using Schematic Library Editor Reports Creating PCB
component footprints manually and using the PCB Component Wizard Handling
other special footprint requirements, including irregular pad shapes Checking the
component footprints using PCB Library Editor Reports Creating an integrated library
of the new components and models

Module-10 Design Considerations 2Hour

 Optimizing the Copper-tracks width according to the required maximum carrying

current capability

 Setup a Design rule check (DRC) Description of mechanical constraints

 Design rule for PCB – Analog circuit, Digital circuit, High Frequency and fast pulse
application circuit, Power electronics application circuit, Microwave application, RF
circuits etc.
 PCB Design Guidelines.

Module-11 PCB Design for 2Hour

EMI/EMC

 Subsystem / PCB placement in an enclosure

 Filtering circuit placement
 Decoupling and bypassing
 Electronic discharge protection
 Electronic waste
 PCB recycling techniques
 Signal Integrity –
Overshoot / undershoot
Crosstalk

7 Vinod Deshmukh
 Rise time / fall time
Transmission lines introduction
Signal propagation
 Transmission line -
What actually flows in the trace
How to define a transmission line
Distributed Model of a transmission line.
EMI / RFI and reduction Technique

 IPC standard for PCB design

IPC standard for Schematic design
IPC standard for PCB design
IPC standard for PCB material
IPC standard for documentation
IPC standard for Fabrication

Module-12 PCB Layout Anatomy 2Hours

 Description of different types of PCB by discussing the difference between single &
double sided PCB
 Understanding the difference between single layer, double-layer and multiple-layer
PCB
 Understanding the main physical layers of a given PCB: Top-Overlay, Mechanical-
Layer, Solder Paste, Solder-Mask, Solder-Pad
 Demonstrating the physical parts of a PCB such as: Via, Drill-hole, Copper-Tracks,
Mounting Holes and Legends
 Different PCB terms definitions

8 Vinod Deshmukh
Module-13 PCB Documentation 1Hour

 Use of standard Title Blocks

 Standard page sequencing
 Readability
 Standard notes
 ECO and Revision History
 Annotation methodology
 Design rules
 Separate part list
 Assembly drawing
 PWB drawings
 Dimensioning
 Call out / Flag Notes

Module-14 PCB Manufacturing 2Hour

Process

 Gerber to Photo film

 Inner layer printing : photo resists and copper
 Removing the unwanted copper
 Layer alignment and optical inspection
 Layer up and bonding
 Drilling
 Plating and copper deposition
 Outer layer imagining
 Plating of outer layer
 Etching
 Solder mask application
 Surface finish
 Silkscreen
 Electrical Test

9 Vinod Deshmukh
Module-15 PCB Assembly Process 2Hour

 Applying solder paste using Stencil

 Automated placement of SMD component by Pick and Place machine
 Reflow soldering
 QC and inspection -
 Manual Inspection
 Optical Inspection
 X-ray Inspection
 TH component fixation and soldering
 Manual soldering
 Wave soldering
 Final Inspection and functional test
 Final cleaning and finishing

Module-16 DIY PCB Prototyping 3Hours

 Prepare a copper clade double sided PCB and clean it properly with a piece of
paper-sand
 Use the guillotine paper cutter to cut the copper clade according to the defined
PCB dimensions
 From the Gerber viewer software make a print out of i.e. actual top-layer,
bottom-layer and the top overlay layer, use a glossy paper and laser printer
 Stick the papers of top and bottom layers on sides of copper clade PCB
 Put in the trimmed Copper PCB inside laminating machine several times while
the temperature at maximum
 Use a small amount of water in a bowel to cool down the PCB and slowly peal
out the glossy papers
 Merge the PCB inside a ferric chloride etchant for at least 2 hours at 50 degrees
Celsius
 Use a drilling machine with 1mm drill pit to drill the entire solder holes of the
PCB

10 Vinod Deshmukh