열전달 중간
열전달 중간
Problem 1 2 3 4 5 6 7 Total
Points
Please write all answers in your answer sheet. PROVIDE and CHECK units
1. (10 pts)
(a) (2 pts) Choose the correct answer.
A. The direction of heat flow is always parallel to an isothermal surface.
B. Heat flux is a vector quantity.
a. A and B are true b. Only A is true c. Only B is true d. A and B are false
(b) (2 pts) (True or False) The value of the thermal conductivity is independent of the
coordinate direction for an isotropic medium.
(c) (2 pts) (True or False) For 1D, steady-state heat conduction in a plane wall with no
internal heat generation and constant thermal properties, the heat flux 𝑞 ′′ [W/m2] is
constant and independent of 𝑥 within the wall.
(d) (2 pts) (True or False) For 1D, steady-state heat conduction in a plane wall with uniform
internal heat generation and constant thermal properties, the heat flux 𝑞 ′′ [W/m2] is
constant and independent of 𝑥 within the wall.
(e) (2 pts) (True or False) For 1D, steady-state heat conduction in a hollow cylinder with no
internal heat generation and constant thermal properties, the heat flux 𝑞 ′′ [W/m2] is
constant and independent of 𝑟 within the cylinder.
(b) (4 pts) Describe how it is relevant for lumped capacitor analysis (one or two sentences).
1
3. (15 pts)
The steady-state temperature distribution in a composite wall of three different materials
(A, B and C) is given below. Assume constant thermal conductivity and LA=LB=LC.
(e) (3 pts) Sketch the heat flux as a function of x , follow the example depicted for section
A of the composite wall (see below).
2
4. (20 pts) In a manufacturing process, a transparent film is being bonded to a substrate as
shown in the sketch. To cure the bond at a temperature 𝑇0 , a radiant source is used to provide
a heat flux 𝑞0′′ W/mm2), all of which is absorbed at the bonded surface. The back of the
substrate is maintained at 𝑇1 while the free surface of the film is exposed to air at 𝑇∞ and
a convection heat transfer coefficient ℎ.
Wa) W4 pts) Show the thermal circuit representing the steady-state heat transfer situation. Be
sure to label all elements, nodes, and heat rates. Leave in symbolic form.
Wb) W6 pts) Assume the following conditions: 𝑇∞ = 20℃, ℎ = 50 /mm2·K, and 𝑇1 = 30℃.
Calculate the heat flux 𝑞0 ′′ that is required to maintain the bonded surface at 𝑇0 = 60℃.
Wc) W10 pts) If the film is not transparent and all of the radiant heat flux is absorbed at its upper
surface, show the thermal circuit and determine the heat flux required to achieve bonding.
5. (20 pts)
For the case of straight pin fins of uniform cross section, the temperature distribution with
the adiabatic tip condition is given by
cosh m( L x)
b cosh mL
where T(x) - T, b T(x=0) - T, L is the fin length, and m2 hP/kAc (h: convection
coefficient, P: perimeter, k : thermal conductivity, Ac: cross-sectional area).
(a) (5 pts) Using the temperature distribution given above, derive the fin heat transfer rate
𝑞𝑓 .
(b) (5 pts) Using the temperature distribution given above, derive the fin efficiency 𝜂𝑓 .
(c) (5 pts) Using the temperature distribution given above, derive the fin effectiveness 𝜀𝑓 .
Wd) W5 pts) /hat is the temperature distribution if L goes to infinity? Derive your answer
from the temperature distribution given above.
3
6. (10 pts)
An experimental arrangement for measuring the thermal conductivity of solid materials
involves the use of two long rods that are equivalent in every aspect, except that one is
fabricated from a standard material of known thermal conductivity kA while the other is
fabricated from the material whose thermal conductivity kB is desired. Both rods are attached
at one end to a heat source of fixed temperature Tb, are exposed to a fluid of temperature T,
and are instrumented with thermocouples to measure the temperature at a fixed distance x1
from the heat source. If the standard material is aluminum, with k A = 200 W/m·K, and
measurements reveal values of TA = 75°C and TB = 60°C at x1 for Tb = 100°C and T = 25°C,
what is the thermal conductivity kB of the test material?
7. (15 pts)
In the lecture, we learned an interesting example when two semi-infinite solids, initially at
uniform temperatures TA,i and TB,i, are placed in contact at their free surfaces (see below). If
the contact resistance is negligible, (a) apply a surface energy balance and obtain the junction
temperature Ts and (b) identify the thermal effusivity in your answer and describe its meaning.
(Hint: For a semi-infinite solid with the constant surface temperature, the surface heat flux
k (Ts Ti )
is given by qs )
t