IPC J-STD-005A

Requirements for
Soldering Pastes

A standard developed by the Solder Paste Task Group (5-24b)

of the Assembly and Joining Committee (5-20) of IPC

Supersedes: Users of this publication are encouraged to participate in the

J-STD-005 - January 1995 development of future revisions.
Amendment 1 - April 1996
Contact:

IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois 60015-1249
Tel 847 615.7100
Fax 847 615.7105
February 2012 IPC J-STD-005A

Table of Contents
1 GENERAL ................................................................. 1 4 QUALITY ASSURANCE PROVISIONS .................... 7
1.1 Scope ..................................................................... 1 4.1 Responsibility for Inspection ................................ 7
1.1.1 Purpose .................................................................. 1 4.1.1 Responsibility for Compliance ............................. 7
4.1.2 Test Equipment and Inspection Facilities ............ 7
2 APPLICABLE DOCUMENTS .................................... 1
2.1 Joint Standards ...................................................... 1 4.1.3 Inspection Conditions ........................................... 7
2.2 International Organization for Standardization .... 1 4.2 Classification of Inspections ................................. 7
2.3 IPC ......................................................................... 1 4.3 Inspection Report Form ........................................ 7
2.4 American Society for Testing Materials .............. 2 4.4 Qualification Inspection ........................................ 7
4.4.1 Sample Size ........................................................... 7
3 REQUIREMENTS ...................................................... 2
4.4.2 Inspection Routine ................................................ 7
3.1 General Requirements ........................................... 2
4.5 Quality Conformance ............................................ 7
3.1.1 Conflict .................................................................. 2
4.5.1 Sampling Plan ....................................................... 8
3.1.2 Terms and Definitions ........................................... 2
4.5.2 Rejected Lots ........................................................ 8
3.2 Description of Product .......................................... 2
5 PREPARATION FOR DELIVERY .............................. 8
3.2.1 Alloy Composition ................................................ 2
3.2.2 Flux Characterization and Inspection ................... 2 6 NOTES ....................................................................... 8
3.3 Solder Powder Particle Size ................................. 3 6.1 Applicability .......................................................... 8
3.3.1 Powder Size Determination .................................. 3 6.2 Shelf Life .............................................................. 8
3.3.2 Powder Size .......................................................... 3 6.3 Acquisition Requirements ..................................... 8
3.3.3 Solder Powder Particle Shape .............................. 3
APPENDIX A Test Report on Solder Paste ............. 9
3.4 Metal Percent ........................................................ 3
3.5 Viscosity ................................................................ 3
Figures
3.5.1 Methods of Determining Viscosity ....................... 3
Figure 3-1 Slump Test Stencil Thickness – 0.20 mm ........... 4
3.6 Slump Test ............................................................. 4
Figure 3-2 Slump Test Stencil Thickness – 0.10 mm ........... 5
3.6.1 Test with 0.2 mm Thick Stencil ........................... 4
Figure 3-3 Solder Ball Test Standards ................................. 6
3.6.2 Test with 0.1 mm Thick Stencil ........................... 4
3.7 Solder Ball Test ..................................................... 5
Tables
3.7.1 Type 1-6 Powder ................................................... 5
Table 3-1 System to Describe Solder Paste Products
3.7.2 Type 7 Powder ...................................................... 5 Description .......................................................... 3
3.8 Tack Test ............................................................... 5 Table 3-2 Percent of Sample by Weight—Nominal Size .... 3
3.9 Wetting .................................................................. 5 Table 4-1 Qualification, Quality Conformance and
3.10 Labeling ................................................................. 5 Performance Testing for Solder Paste ................ 8

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February 2012 IPC J-STD-005A

Requirements for Soldering Pastes

1 GENERAL

1.1 Scope This standard prescribes general requirements for the characterization and testing of solder pastes used to make
high quality electronic interconnections. This specification is a material quality control document and is not intended to
relate directly to the material’s performance in the assembly process. Solder paste users are referred to 6.3 for a listing of
requirements information and options that should be addressed when procuring solder paste.

1.1.1 Purpose This standard defines the characteristics of solder paste through the definitions of properties and specifica-
tion of test methods and inspection criteria. The materials include solder powder and solder paste flux blended to produce
solder paste. Solder powders are classified by the shape of the particles and size distribution of the particles. It is not the
intent of this standard to exclude particle sizes or distributions not specifically listed. The flux properties of the solder paste,
including classification and testing, shall be based on J-STD-004, or equivalent. The requirements for solder paste are
defined in general terms. In practice, where more stringent requirements are necessary, additional requirements shall be as
agreed between user and supplier (AABUS). Users are cautioned to perform tests (beyond the scope of this specification)
to determine the acceptability of the solder paste for specific processes.

2 APPLICABLE DOCUMENTS
The following documents of the issue currently in effect, form a part of this specification to the extent specified herein.

2.1 Joint Standards1

J-STD-001 Soldering Requirements for Electronic Interconnections

J-STD-004 Requirements for Soldering Fluxes

J-STD-006 Requirements for Alloys and Solder Products

2.2 International Organization for Standardization2

ISO 9001 Quality Systems - Model for Quality Assurance in Design, Development, Production, Installation and Servicing.

2.3 IPC3

IPC-A-20 Fine pitch stencil pattern for slump (artwork)

IPC-A-21 Standard pitch stencil pattern for slump (artwork)

IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-TM-650 Test Methods Manual4

2.2.14.3 Determination of Maximum Solder Powder Particle Size
2.2.20 Solder Paste Metal Content by Weight
2.4.34 Solder Paste Viscosity—T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 centipoise)
2.4.34.1 Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 centipoise)
2.4.34.2 Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 centipoise)
2.4.34.3 Solder Paste Viscosity—Spiral Pump Method (Applicable at less than 300,000 centipoise)
2.4.35 Solder Paste—Slump Test

1. www.ipc.org
2. www.iso.org
3. www.ipc.org
4. Current and revised IPC Test Methods are available on the IPC Web site (www.ipc.org/html/testmethods.htm)