Diamond H1 Wafer Handling Robot
Diamond H1 Wafer Handling Robot
F E AT U R E S
Excellent structural rigidity
Modular and highly customizable design
Arm length from 10.50” and 14.40”.
Vertical travel up to 7”
Fully integrated motion controller, servo amplifiers and
power supply
High response brushless motors and precise zero-backlash
Harmonic Drive® gears
Optional absolute encoders eliminating the initial homing
procedure
Handling radial and in-line equipment placement
Seamless integration with prealigner, linear track and other
peripheral components
Standard RS-232 interface and Ethernet (Telnet) interfaces
to the host computer
Advance 32-bit real-time motion control kernel
Powerful wafer handling firmware
Comprehensive software tools and utilities
Software emulation for legacy robot macro commands
Optional teach pendant terminal
General purpose digital inputs and outputs for custom use
Class 1 clean-room environment compatibility
Reliability – MTBF > 60000 hours, (MCBF > 10,000,000 cycles)
DIAMOND SERIES
2.48 [63]
Wafer Size 7.91 [201]
2”(50mm) to 12”(300mm)
.59 [15] .91 [23]
FOR Z AXIS 7" TRAVEL
Payload TOP HARD STOP 7.9"[201mm] BOTTOM HARD STOP .91[23mm]
RECOMENDED LOW LIMIT .984[25mm]
RECOMENDED TOP LIMIT 7.8[198mm]
2.2 lbs(1.0 kg)
HIGHT
Encoders
Incremental, 10000 pulse/rev
POWER CONNECTOR
Motor type NOTES:
Brushless, low inertia high 1. MINIMUM TABLE HOLE DIAMETER Ø8.2"
HEIGHT
SIGNAL CONNECTORS PANEL
Z AXIS TRAVEL
responce 2. RECOMENDED TABLE HOLE SIZE Ø8.6"
3. MAX.TABLE HOLE DIAMETER-FLANGE DEPENDANT 18"[457mm] 7"[178mm]
Weight
STANDARD ARM CONFIGURATIONS
40.7 lbs(18.5 kg) for 7” vert.
travel, and 5.25”x5.25” arm 5.25 [133]
4x4-40UNC-2B
7.20 [183] 7.20 [183]
2X 0.118[3] holes for
pin M3 on BC Ø.984[Ø25]
5.25 [133]
on BC 1.39"[35mm] 4X4-40UNC-2B
R1.12 [R29]
on BC Ø1.39[Ø35.32]
Operating 4x6-32UNC-2B
temperatures 2X 0.118[3] holes for on BC Ø2[Ø50.8]
R1.28 [R33]
pin M3 on BC Ø.984[Ø125]
50°F-104°F (10°C to 40°C)
1.07 [27]
1.06 [27]
11.30 [287]
airflow