03.10.

2022

VISVESVARAYA TECHNOLOGICAL UNIVERSITY, BELAGAVI

B.E: Electronics & Communication Engineering / B.E: Electronics & Telecommunication Engineering
NEP, Outcome Based Education (OBE) and Choice Based Credit System (CBCS)
(Effective from the academic year 2021 – 22)
VI Semester
Micro Electro Mechanical Systems
Course Code 21EC644 CIE Marks 50
Teaching Hours/Week (L:T:P:S) 3: 0 :0 : 1 SEE Marks 50
Total Hours of Pedagogy 40 Total Marks 100
Credits 3 Exam Hours 3
Course objectives:
 Preparation: To prepare students with fundamental knowledge/ overview in the field of Micro
Electro Mechanical Systems.
 Core Competence: To equip students with a basic foundation in electronic engineering,
mechanical engineering, electrical engineering, chemistry, physics and mathematics fundamentals
required for comprehending the operation and application of MEMS circuits, design.
 Professionalism & Learning Environment: To inculcate in students an ethical and professional
attitude by providing an academic environment inclusive of effective communication, teamwork,
ability to relate engineering issues to a broader social context, and life-long learning needed for a
successful professional career.
Teaching-Learning Process (General Instructions)
These are sample Strategies, which teacher can use to accelerate the attainment of the various course
outcomes.
1. Lecture method (L) does not mean only the traditional lecture method, but a different type of
teaching method may be adopted to develop the outcomes
2. Show Video/animation films to explain the functioning of various
3. Encourage collaborative (Group) Learning in the class to promote critical thinking
4. Topics for seminars on several MEMS related topics and their applications
5. Encourage the students to take up mini projects and main projects
6. Discuss how every concept can be applied to the real world - and when that's possible, it helps
improve the students' understanding.

Module-1
Overview of MEMS and Microsystems: MEMS and Microsystem, Typical MEMS and Microsystems
Products, Evolution of Microfabrication, Microsystems and Microelectronics, Multidisciplinary Nature
of Microsystems, Miniaturization. Applications and Markets.
Text1: 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9
Teaching- Chalk and talk method, Animation of MEMS products and applications
Learning RBT Level: L1, L2, L3
Process
Module-2
Working Principles of Microsystems: Introduction, Microsensors, Micro actuation, MEMS with Micro
actuators, Micro accelerometers, Microfluidics. Text1: 2.1,2.2, 2.3, 2.4, 2.5, 2.6
Engineering Science for Microsystems Design and Fabrication: Introduction, Atomic Structure of
Matter, Ions and Ionization Molecular Theory of Matter and Intermolecular Forces, Plasma Physics,
Electrochemistry. Text1: 3.1, 3.2, 3.3, 3.4, 3.7, 3.8

Teaching- PowerPoint Presentation, YouTube videos, Animations of MEMS Micro sensors, Micro
Learning actuators, Micro accelerometers and Microfluidics, molecules, Ions and matter
Process RBT Level: L1, L2, L3

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Module-3
Engineering Mechanics for Microsystems Design: Introduction, Static Bending of Thin Plates,
Mechanical Vibration, Thermo mechanics, Fracture Mechanics, Thin Film Mechanics, Overview on
Finite Element Stress Analysis. Text1: 4.1,4.2,4.3,4.4,4.5,4.6,4.7
Teaching- Chalk and talk method, Power Point Presentations and supporting YouTube Videos
Learning Solve numericals related to Thin Plates, and Vibration.
Process Self study topics: solve numericals related to other topics
RBT Level: L1, L2, L3
Module-4
Scaling Laws in Miniaturization: Introduction, Scaling in Geometry, Scaling in Rigid-Body Dynamics,
Scaling in Electrostatic Forces, Scaling in Electromagnetic Forces, Scaling in Electricity, Scaling in Fluid
Mechanics, Scaling in Heat Transfer. Text1: 6.1, 6.2,6.3,6.4,6.5,6.6,6.7,6.8
Teaching- Chalk and Talk Method, You Tube Videos, Solve numericals related to scaling in Geometry
Learning Self study topics: solve numericals of other topics
Process RBT Level: L1, L2, L3
Module-5
Overview of Micromanufacturing: Introduction, Bulk Micromanufacturing, Surface Micromachining,
The LIGA Process, Summary on Micromanufacturing. Text1: 9.1,9.2,9.3,9.4,9.5
Microsystem Packaging: Introduction, Overview of Mechanical Packaging of Microelectronics,
Microsystem Packaging. Text1: 11.1,11.2, 11.3
Teaching- Power Point Presentation, YouTube videos, Animation of MEMS micromanufacturing
Learning Supporting animation videos on packaging
Process RBT Level: L1, L2, L3
Course outcomes (Course Skill Set)
At the end of the course the student will be able to:
1. Appreciate the technologies related to Micro Electro Mechanical Systems.
2. Understand design and fabrication processes involved with MEMS devices.
3. Analyse the MEMS devices and develop suitable mathematical models
4. Know various application areas for MEMS device.
Assessment Details (both CIE and SEE)
The weightage of Continuous Internal Evaluation (CIE) is 50% and for Semester End Exam (SEE) is 50%.
The minimum passing mark for the CIE is 40% of the maximum marks (20 marks out of 50). A student
shall be deemed to have satisfied the academic requirements and earned the credits allotted to each
subject/ course if the student secures not less than 35% (18 Marks out of 50) in the semester-end
examination (SEE), and a minimum of 40% (40 marks out of 100) in the sum total of the CIE (Continuous
Internal Evaluation) and SEE (Semester End Examination) taken together.
Continuous Internal Evaluation:
Three Unit Tests each of 20 Marks (duration 01 hour)
1. First test at the end of 5th week of the semester
2. Second test at the end of the 10th week of the semester
3. Third test at the end of the 15th week of the semester
Two assignments each of 10 Marks
4. First assignment at the end of 4th week of the semester
5. Second assignment at the end of 9th week of the semester
Group discussion/Seminar/quiz any one of three suitably planned to attain the COs and POs for 20
Marks (duration 01 hours)
6. At the end of the 13th week of the semester
The sum of three tests, two assignments, and quiz/seminar/group discussion will be out of 100 marks
and will be scaled down to 50 marks

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(to have less stressed CIE, the portion of the syllabus should not be common /repeated for any of the
methods of the CIE. Each method of CIE should have a different syllabus portion of the course).
CIE methods /question paper is designed to attain the different levels of Bloom’s taxonomy as per
the outcome defined for the course.
Semester End Examination:
Theory SEE will be conducted by University as per the scheduled timetable, with common question
papers for the subject (duration 03 hours)
1. The question paper will have ten questions. Each question is set for 20 marks.
2. There will be 2 questions from each module. Each of the two questions under a module (with a
maximum of 3 sub-questions), should have a mix of topics under that module.
The students have to answer 5 full questions, selecting one full question from each module.. Marks scored
out of 100 shall be reduced proportionally to 50 marks

Suggested Learning Resources:

Text Book:
Tai-Ran Hsu, MEMS and Micro systems: Design and Manufacture, 1st Ed, Tata Mc Graw Hill.
Reference Books:
1. Hans H Gatzen, Volker Saile, JurgLeuthold, Micro and Nano Fabrication: Tools and Processes,
Springer, 2015.
2. Dilip Kumar Bhattacharya, Brajesh Kumar Kaushik, Microelectromechanical Systems
(MEMS), Cengage Learning.
3. Chang Liu, Foundations of MEMS, Pearson Ed.
Activity Based Learning (Suggested Activities in Class)/ Practical Based learning
 Develop mini projects and Final year projects using MEMS components to address the real world
problems

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