QuickSpecs HP 240 G8 Notebook PC

Overview
HP 240 G8 Notebook PC

Left

1. Webcam LED 7. Hard drive indicator LED

2. Webcam 8. SD Card slot (Select models)
3. Internal digital microphone 9. SuperSpeed USB Type-C® 5Gbps signaling rate1 port (Data Transfer
Only)
4. Touchpad 10. Mini Security lock slot (Lock sold in select countries)
5. Touchpad buttons 11. Power button
6. Power indicator LED

1. SuperSpeed USB 20Gbps is not available.

Not all configuration components are available in all regions/countries.

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Overview

Right

1. AC Smart Pin adapter plug 4. SuperSpeed USB Type-A 5Gbps signaling rate1 port (USB 3.2 Gen 1)
2. RJ-45 / Ethernet port 5. SuperSpeed USB Type-A 5Gbps signaling rate1 port (USB 3.2 Gen 1)
3. HDMI port (Cable not included) 6. Audio combo jack

1. SuperSpeed USB 20Gbps is not available.

Not all configuration components are available in all regions/countries.

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Overview
At a Glance
• Windows 11 Pro, other Windows OS, or FreeDOS preinstalled
• A new compact narrow bezel design with thinner & lighter chassis
• Choice of 11th or 10th Generation Intel® Core™ i7, i5 and i3 processors and Intel® Pentium®, or Intel® Celeron® processors
• Choice of 35.56 cm (14”) diagonal HD Anti-Glare WLED SVA or FHD Anti-Glare WLED IPS
• Optional NVIDIA GeForce MX450 discrete graphics with 2 GB GDDR5 video memory or AMD Radeon TM 620
• Security features including Firmware TPM 2.0
• Weight starting at 3.25 lbs (1.47 kgs)
• MM18 Battery life up to 10 hours 1
• Wireless LAN (WLAN) up to 802.11ac or 802.11ax to keep you connected
• One SuperSpeed USB Type-C® 5Gbps signaling rate 2 (Data Transfer Only), Two SuperSpeed USB Type-A 5Gbps signaling
rate 2
• Choice of Solid State Drives up to 1 TB and Hard Drive up to 1 TB
• Fast dual channel DDR4 SODIMM memory up to 16 GB
• HP webcam with digital microphone and HD (supporting WDR- Wide Dynamic Range) or VGA camera
• GML-R 6W CPU offers fanless design with cooling fin 3

1. Windows 10 MM18 battery life will vary depending on various factors including product model, configuration, loaded
applications, features, use, wireless functionality, and power management settings. The maximum capacity of the battery will
naturally decrease with time and usage. See http://www.bapco.com for additional details.
2. SuperSpeed USB 20Gbps is not available.
3. Other CPU are still equipped with the cooling fan.
NOTE: See important legal disclosures for all listed specs in their respective feature sections.

Not all configuration components are available in all regions/countries.

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Technical Specifications
PRODUCT NAME
HP 240 G8 Notebook PC

OPERATING SYSTEMS
Preinstalled Windows 11 Pro 2
Windows 11 Pro Education 2
Windows 11 Home – HP recommends Windows 11 Pro for business2
Windows 11 Home Single Language - HP recommends Windows 11 Pro for business2
Windows 10 Pro 1,2
Windows 10 Pro Education 1,2
Windows 10 Home - HP recommends Windows 11 Pro for business 1,2
Windows 10 Home Single Language - HP recommends Windows 11 Pro for business1,2
FreeDOS

1. Device comes with Windows 10 and a free Windows 11 upgrade or may be preloaded with Windows 11. Upgrade timing may
vary by device. Features and app availability may vary by region. Certain features require specific hardware (see Windows 11
Specifications).
2. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows is
automatically updated and enabled. High speed internet and Microsoft account required. ISP fees may apply and additional
requirements may apply over time for updates. See http://www.windows.com.

PROCESSORS
Intel® Core™ i7-1065G7 (1.3 GHz base frequency, up to 3.9 GHz with Intel® Turbo Boost Technology, 8 MB cache, 4 cores) 3,4,5,6
Intel® Core™ i5-1035G1 processor with Intel® UHD Graphics (1.0 GHz base frequency, up to 3.6 GHz with Intel® Turbo Boost
Technology, 6 MB cache, 4 cores) 3,4,5,6
Intel® Core™ i5-10210U Processor with Intel® UHD Graphics 620 (1.6 GHz base frequency, up to 4.2 GHz with Intel® Turbo
Boost Technology, 6 MB L3 cache, 4 cores) 3,4,5,6
Intel® Core™ i3-1005G1 processor with Intel® UHD Graphics (1.2 GHz base frequency, up to 3.4GHz with Intel® Turbo Boost
Technology, 4 MB cache, 2 cores) 3,4,5,6
Intel® Pentium® Silver N5030 Processor with Intel® UHD Graphics 605 (1.1 GHz base frequency, up to 3.1 GHz burst
frequency, 4 MB cache, 4 cores) 3,4,6
Intel® Celeron® N4020 Processor with Intel® UHD Graphics 600 (1.1 GHz base frequency, up to 2.8 GHz burst frequency, 4 MB
cache, 2 cores) 3,4,6
ntel® Core™ i7-1165G7 processor (2.8 GHz base frequency, up to 4.7 GHz frequency with Intel® Turbo Boost Technology,
12MB cache, 4 cores) 3,4 5,6
Intel® Core™ i5-1135G7 processor (2.4 GHz base frequency, up to 4.2 GHz frequency with Intel® Turbo Boost Technology,
8MB cache, 4 cores) 3,4 5,6
Intel® Core™ i3-1115G4 processor with Intel® UHD Graphics (3.0 GHz base frequency, up to 4.1 GHz frequency with Intel®
Turbo Boost Technology, 6 MB cache, 2 cores) 3,4 5,6
Intel Core™ i3-1125G4 processor with Intel® UHD Graphics (2.0 GHz base frequency, up to 3.7 GHz frequency with Intel®
Turbo Boost Technology, 8 MB cache, 4 cores) 3,4 5,6
Intel® Celeron® 6305 Processor with Intel® UHD Graphics (1.8 GHz base frequency, 4 MB cache, 2 cores) 3,4,6

Processors Family
11th/10th Generation Intel® Core™ i7 processor 6
11th/10th Generation Intel® Core™ i5 processor 6
11th/10th Generation Intel® Core™ i3 processor 6

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Intel® Pentium® Silver Processor 6
Intel® Celeron® processor 6

3. Multicore is designed to improve performance of certain software products. Not all customers or software applications will
necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application
workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement
of higher performance.
4. Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode.
5. Intel® Turbo Boost performance varies depending on hardware, software and overall system configuration. See
http://www.intel.com/technology/turboboost for more information.
6. In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on
products configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7
drivers on http://www.support.hp.com.

CHIPSET
Chipset is integrated with processor

GRAPHICS
Integrated
Intel® Iris® Xe Graphics30
Intel® Iris® Plus Graphics30
Intel® UHD Graphics
Intel® UHD Graphics 605
Intel® UHD Graphics 600

Discrete
AMD Radeon™ 620 (2 GB GDDR5 dedicated) 8
NVIDIA® GeForce® MX450 (2 GB DDR5 dedicated) 8

Supports
Support HD decode, DX12, HDMI 1.4b 7

7. HD content required to view HD images.

8. AMD Dynamic Switchable Graphics technology requires an Intel processor, plus an AMD Radeon™ discrete graphics
configuration and is not available on FreeDOS and Linux OS. With AMD Dynamic Switchable Graphics technology, full
enablement of all discrete graphics video and display features may not be supported on all systems (e.g. OpenGL applications
will run on the integrated GPU or the APU as the case may be).
30. Intel® Iris® Xe Graphics capabilities require system to be configured with Intel® Core™ i5 or i7 processors and dual channel
memory. Intel® Iris® Xe Graphics with Intel® Core™ i5 or 7 processors and single channel memory will only function as UHD
graphics.

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DISPLAYS
Internal
Non-Touch
35.56 cm (14") diagonal, HD (1366 x 768), SVA, Anti-Glare WLED, 250nits, eDP micro-edge, 45% NTSC 7,9,10
35.56 cm (14") diagonal, FHD (1920 x 1080), IPS, Anti-Glare WLED, 250nits eDP micro-edge, 45% NTSC 7,9,10

HDMI
Port supports resolutions up to 1920 x 1080 external resolution @60 Hz

7. HD content required to view HD images.

9. Sold separately or as an optional feature.
10. Resolutions are dependent upon monitor capability, and resolution and color depth settings.

STORAGE AND DRIVES

Primary Storage
1 TB 5400 rpm SATA 11
500 GB 7200 rpm SATA 11
500 GB 5400 rpm SATA 11

Primary M.2 Storage

128 GB M.2 SATA-3 TLC Solid State Drive 11
256 GB M.2 SATA-3 TLC Solid State Drive 11
256 GB PCIe® NVMe™ M.2 QLC Solid State Drive 11
512 GB PCIe® NVMe™ M.2 QLC Solid State Drive 11
1 TB PCIe® NVMe™ M.2 QLC Solid State Drive 11
256 GB Intel® PCIe® NVMe™ QLC M.2 SSD with 16 GB Intel® Optane™ memory H10 11,12,13
512 GB Intel® PCIe® NVMe™ QLC M.2 SSD with 32 GB Intel® Optane™ memory H10 11,12,13
64 GB eMMC 11

Dual Storage 35
128 GB M.2 SATA-3 TLC Solid State Drive + 1TB 5400rpm SATA 11
256 GB PCIe® NVMe™ M.2 QLC Solid State Drive + 1TB 5400rpm SATA 11

11. For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10) is reserved for system recovery software.
12. Intel® Optane™ memory system acceleration does not replace or increase the DRAM in your system. Requires 8th Gen or
higher Intel® Core™ processor, BIOS version with Intel® Optane™ supported, Windows 10 64-bit, and an Intel® Rapid Storage
Technology (Intel® RST) driver.
13. Intel® Optane™ memory H10 only for Intel® PCIe® NVMe™ QLC M.2 SSD.
35. GML-R don't support dual storage due to design limitation.

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Technical Specifications
MEMORY
Maximum Memory
16 GB DDR4-3200 SDRAM14

Memory
16 GB DDR4-3200 SDRAM (2 x 8 GB) 14
16 GB DDR4-2666 SDRAM (2 x 8 GB) 14
12 GB DDR4-3200 SDRAM (4 GB (1 x 4 GB) and 8 GB (1 x 8 GB))14
12 GB DDR4-2666 SDRAM (4 GB (1 x 4 GB) and 8 GB (1 x 8 GB))14
8 GB DDR4-3200 SDRAM (1 x 8 GB) 14
8 GB DDR4-2666 SDRAM (1 x 8 GB) 14
8 GB DDR4-2400 SDRAM (1 x 8 GB) 14
8 GB DDR4-3200 SDRAM (2x 4 GB) 14
8 GB DDR4-2666 SDRAM (2 x 4 GB) 14
4 GB DDR4-3200 SDRAM (1 x 4 GB) 14
4 GB DDR4-2666 SDRAM (1 x 4 GB) 14
4 GB DDR4-2400 SDRAM (1 x 4 GB) 14

Memory Slots
DDR4 SODIMMS, system runs at 2666 34
2 SODIMM (Intel 10th & 11th Generation Intel Core processor) (Core i 3/5/7 speed runs up to 2666)
Supports Dual Channel Memory

1 SODIMM (Intel Pentium/Celeron speed runs up to 2400)

Support Single Channel Memory

NOTE: All slots are customer non-accessible / non-upgradeable

14. Due to the non-industry standard nature of some third-party memory modules, we recommend HP branded memory to
ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.
34. DDR4 3200 bridges to DDR4 2666.

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Technical Specifications
NETWORKING/COMMUNICATIONS
WLAN
Realtek RTL8822CE 802.11ac 2x2 Wi-Fi® + Bluetooth® 5.0 Wireless Card 33
Realtek RTL8822CE 802.11a/b/g/n/ac (1x1) Wi-Fi® with Bluetooth® 5.0 Wireless Card 33
Intel® Dual Band Wi-Fi 6 AX201 802.11a/b/g/n/ac/ax (2x2) WLAN and Bluetooth® 5.2 Wireless Card, non-vPro® 15

Miracast
Compatible with Miracast-certified devices (For Win10) 16

Ethernet
Realtek 10/100/1000 GbE NIC 17

15. Wireless access point and Internet service required and sold separately. Availability of public wireless access points
limited. Wi-Fi 6 (802.11ax) is backwards compatible with prior 802.11 specs.
16. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming.
17. The term "10/100/1000" or "Gigabit" Ethernet indicates compatibility with IEEE standard 802.3ab for Gigabit Ethernet,
and does not connote actual operating speed of 1 Gb/s. For high-speed transmission, connection to a Gigabit Ethernet server
and network infrastructure is required.
33. Wi-Fi supporting gigabit speeds (802.11ac) is achievable when transferring files between two devices connected to the
same router. Requires a wireless router, sold separately, that supports 160MHz channels.

AUDIO/MULTIMEDIA
Audio
2 Integrated stereo speakers
Integrated digital microphone

Camera
HP TrueVision HD Camera 7,9

Webcam
VGA webcam 9

7. HD content required to view HD images.

9. Sold separately or as an optional feature.

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Technical Specifications
KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS
Keyboard
Full Size Textured island-style Keyboard

Pointing Device
Touchpad with multi-touch gesture support (PTP certified)

Function Keys
F1 - Open " How to get help in Windows 10" webpage
F2 - Brightness Down
F3 - Brightness Up
F4 - Display Switching
F5 - Blank
F6 - Mute
F7 - Volume Down
F8 -Volume Up
F9 - Previous
F10 - Play/Pause
F11 - Next
F12 - Airplane mode

SOFTWARE AND SECURITY

Preinstalled Software
Software
McAfee LiveSafe™ 18
HP Support Assistant 19
Native Miracast Support 20
HP documentation
HP Setup Integrated OOBE
HP SSRM
HP Audio Switch
HP JumpStarts
Xerox® DocuShare® 30 day free trial offer29
HP QuickDrop
HP Smart Support 31

Security Management
Firmware TPM 2.0 21

18. 30 days free trial.

19. HP Support Assistant requires Windows and Internet access.
20. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming.
21. Firmware TPM is version 2.0. which is a subset of the TPM 2.0 specification version v0.89 as implemented by Intel
Platform Trust Technology (PTT).32. Firmware TPM is version 2.0.
29. Simply sign up and start using Xerox® DocuShare® Go. No credit card. No obligation. Data will become unavailable unless
a subscription is entered before the end of the 30-day free trial period. See visit http://www.xerox.com/docusharego for
details.

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31. HP Smart Support is available to commercial customers through your HP Service Representative and HP Factory
Configuration Services; or it can be downloaded at: http://www.hp.com/smart-support. HP Smart Support automatically
collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and health
insights.

POWER
Power Supply
HP Smart 65 W External AC power adapter 22
HP Smart 65 W EM External AC power adapter 22
HP Smart 45 W External AC power adapter 22

Primary Battery
HP Long Life 3-cell, 41 Wh Li-ion Polymer23, 32
HP Long Life 4-cell, 46 Wh Li-ion Battery Polymer (India only) 23, 32

Power Cord
1M (3.28 feet) length power cord

MM18 Battery life

Up to 10 hours 24

Battery Weight
0.18 kg
0.39 lb

22. Availability may vary by country.

23. Battery is internal and not replaceable by customer. Serviceable by warranty.
24. Windows 10 MM18 battery life will vary depending on various factors including product model, configuration, loaded
applications, features, use, wireless functionality, and power management settings. The maximum capacity of the battery
will naturally decrease with time and usage. See http://www.bapco.com for additional details.
32. Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life,
time, usage, environment, temperature, system configuration, loaded apps, features, power management settings and other
factors.

Not all configuration components are available in all regions/countries.

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Technical Specifications
WEIGHTS & DIMENSIONS
Product Weight 25
Starting at 3.25 lb
Starting at 1.47 kg

Product Dimensions (w x d x h)
12.76 x 8.89 x 0.78 in
32.4 x 22.59 x 1.99 cm

25. Weight will vary by configuration.

PORTS/SLOTS
Ports
2 SuperSpeed USB Type-A 5Gbps signaling rate (USB 3.2 Gen 1)26
1 SuperSpeed USB Type-C® 5Gbps signaling rate26 (Supports data transfer only and does not support charging or external
monitors)
1 HDMI v1.4b 26
1 RJ-45
1 AC Power
1 Headphone/microphone combo jack

Expansion Slots
Support SD/SDHC/SDXC
1 Multi-format digital media reader (Select models)

26. SuperSpeed USB 20Gbps is not available.

27. HDMI cable sold separately.

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SERVICE AND SUPPORT
1-year limited warranty and 90-day software limited warranty options depending on country. Batteries have a default one-
year limited warranty. Refer to http://www.hp.com/support/batterywarranty/ for additional battery information. On-site
service and extended coverage is also available. HP Care Pack Services are optional extended service contracts that go
beyond the standard limited warranties. To choose the right level of service for your HP product, use the HP Care Pack
Services Lookup Tool at: http://www.hp.com/go/cpc. 28

28. HP Care Packs are sold separately. Service levels and response times for HP Care Packs may vary depending on your
geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit
http://www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or
indicated to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local
laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty
provided with your HP Product.

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Technical Specifications
SYSTEM UNIT
Stand-Alone Power Requirements
(AC Power)
Nominal Operating Voltage 19.5 V
Average Operating Power TBD
Integrated graphics 6.37W
Discrete Graphics N/A (Switchable graphics design)
Max Operating Power Discrete < 65W
UMA < 45W
Temperature
Operating 32° to 95° F (0° to 35° C) (not writing optical)
41° to 95° F (5° to 35° C) (writing optical)
Non-operating -4° to 140° F (-20° to 60° C)
Relative Humidity
Operating 10% to 90%, non-condensing
Non-operating 5% to 95%
Shock
Operating 40 G, 2 ms, half-sine
Non-operating 240 G, 2 ms, half-sine
Random Vibration
Operating 1.043 grms
Non-operating 3.5 grms
Altitude (unpressurized)
Operating -15 m to 3048 m (-50 ft to 10000 ft)
Non-operating -15 m to 12192 m (-50 ft to 40000 ft)
Planned Industry Standard
Certifications
UL Yes
CSA No
FCC Compliance Yes
ENERGY STAR® Yes
EPEAT® Yes
ICES Yes
Australia / No
NZ A – Tick Compliance No
CCC Yes
Japan VCCI Compliance Yes
KC No
BSMI Yes
CE Marketing Compliance Yes
BNCI or BELUS No
CIT No
GOST No
Saudi Arabian Compliance (ICCP) No

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SABS No
UKRSERTCOMPUTER No

DISPLAYS
NOTE: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may
vary either higher or lower.
Panel LCD 14-in FHD Outline Dimensions (W x H x D) 316.11 x 198.07 max. (w/ PCB)(mm)
(1920x1080) Anti-Glare Active Area 309.31 x 173.99(mm)
WLED UWVA 45percent cg
250nits eDP NWBZ slim Weight 285g max.
Diagonal Size 14.0"
Thickness 3.0mm max.
Interface eDP 1.2
Surface Treatment Anti-glare (AG)
Touch Enabled None
Contrast Ratio 600:1 (typ)
Refresh Rate 60Hz
Brightness 250nit typ.
Pixel Resolution 1920 x 1080 (FHD)
Format RGB
Backlight LED
Color Gamut Coverage 45%
Color Depth 6bit
Viewing Angle UWVA 85/85/85/85

Panel LCD 14.0 HD AG WLED Outline Dimensions (W x H x D) 320.9x205.6 (max)

SVA 45%cg 220nits eDP Active Area 309.4 x 173.95
Slim
Weight 280 max.
Diagonal Size 14.0"
Thickness 3.0mm max
Interface VESA with EDID V3.1
Surface Treatment Anti-glare (AG)
Touch Enabled None
Contrast Ratio 300:1 (typ)
Refresh Rate 60Hz
Brightness 220 nit typ
Pixel Resolution 1366 x 768 (HD)
Format RGB
Backlight LED
Color Gamut Coverage 45%
Color Depth 6 bits
Viewing Angle SVA 40/40/15/30

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Technical Specifications
STORAGE AND DRIVES*
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows 10) is
reserved for system recovery software.
SSD 128GB 2280 M2 SATA-3 Drive Weight 0.01 lb (6 g) ~ 0.02 lb (10 g)
TLC (SSD 128GB 2280 M2 Capacity 128 GB
SATA-3 TLC)
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface ATA-8, SATA 3.0
Performance
Maximum Sequential Read Up To 560 MB/s
Maximum Sequential Write Up To 530 MB/s
Logical Blocks 250,069,680
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]

SSD 1TB 2280 PCIe NVMe Drive Weight 0.01 lb (6 g) ~ 0.02 lb (10 g)
QLC (SSD 1TB 2280 PCIe Capacity 1 TB
NVMe QLC)
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X4
Performance
Maximum Sequential Read Up to 2400MB/s
Maximum Sequential Write Up to 1950MB/s
Logical Blocks 2,000,409,264
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]

SSD 256GB 2280 M2 SATA-3 Drive Weight 0.01 lb (6 g) ~ 0.02 lb (10 g)

TLC (SSD 256GB 2280 M2 Capacity 256 GB
SATA-3 Three Layer Cell)
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X4
Performance
Maximum Sequential Read Up to 530MB/s
Maximum Sequential Write Up to 520MB/s
Logical Blocks 500,118,192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]

SSD 256GB 2280 PCIe NVMe Drive Weight 0.01 lb (6 g) ~ 0.02 lb (10 g)
QLC (SSD 256GB 2280 PCIe Capacity 256GB
NVMe QLC)
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X2
Performance
Maximum Sequential Read Up to 1500MB/s

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Maximum Sequential Write Up to 750MB/s
Logical Blocks 500,118,192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features TRIM, L1.2

SSD 512GB 2280 PCIe NVMe Drive Weight 0.01 lb (6 g) ~ 0.02 lb (10 g)
QLC (SSD 512GB 2280 PCIe Capacity 512GB
NVMe QLC)
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X2
Performance
Maximum Sequential Read Up to 1500MB/s
Maximum Sequential Write Up to 750MB/s
Logical Blocks 1,000,215,216
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features TRIM, L1.2

SSD 16GB 2280 PCIe-3x2 Drive Weight 0.01 lb (6 g) ~ 0.02 lb (10 g)

NVMe 3D Xpoint (SSD 16GB Capacity 16 GB
2280 PCIe-3x2 NVMe 3D
Xpoint) Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X2
Performance
Maximum Sequential Read Up to 900MB/s
Maximum Sequential Write Up to 145MB/s
Logical Blocks 28,181,188
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]

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SSD 256GB 2280 PCIe- Drive Weight 0.01 lb (6 g) ~ 0.02 lb (10 g)
3x2x2 NVMe+SSD 16GB 3D Capacity 256 GB
Xpoint (SSD 256GB 2280
PCIe-3x2x2 NVMe +SSD Height 0.09 in (2.3 mm)
16GB 3D Xpoint) Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X2X2
Performance
Maximum Sequential Read Up to 1450MB/s
Maximum Sequential Write Up to 500MB/s
Logical Blocks 500,118,192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]

SSD 512GB 2280 PCIe- Drive Weight 0.01 lb (6 g) ~ 0.02 lb (10 g)

3x2x2 NVMe+SSD 32GB 3D Capacity 512 GB
Xpoint (SSD 512GB 2280
PCIe-3x2x2 NVMe +SSD Height 0.09 in (2.3 mm)
32GB 3D Xpoint) Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X2X2
Performance
Maximum Sequential Read Up to 2400MB/s
Maximum Sequential Write Up to 1300MB/s
Logical Blocks 1,000,215,215
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]

Not all configuration components are available in all regions/countries.

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Technical Specifications
NETWORKING/COMMUNICATIONS
Intel® Wi-Fi 6 AX201 + Wireless LAN Standards IEEE 802.11a
Bluetooth® 5.2 Wireless IEEE 802.11b
Card (802.11ax 2x2, non- IEEE 802.11g
vPro®, supporting IEEE 802.11n
gigabit file transfer IEEE 802.11ac
speeds) IEEE 802.11ax
non-vPro®1,2 IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Features Wi-Fi® 6 technology
Frequency Band • 802.11b/g/n/ax
2.402 – 2.482 GHz
• 802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, ,80MHz &
160MHz)
• 802.11ax: MCS0 ~ MCS11, (1SS and 2SS) (20MHz, 40MHz, ,80MHz &
160MHz)
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security3 • IEEE compliant 64 /128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power4 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT40(2.4GHz): +14.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11n HT40(5GHz): +14.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
• 802.11ac VHT160(5GHz): +11.5dBm minimum
• 802.11ax HT40(2.4GHz): +10dBm minimum

Not all configuration components are available in all regions/countries.

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Technical Specifications
• 802.11ax VHT160(5GHz): +10dBm minimum
Power Consumption • Transmit mode: 2.0 W
• Receive mode:1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode: 50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW
Power Management ACPI and PCI Express compliant power management 802.11 compliant
power saving mode
Receiver Sensitivity5 • 802.11b, 1Mbps: -93.5dBm maximum
• 802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11a/g, 54Mbps: -72dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11n, MCS15: -64dBm maximum
• 802.11ac, MCS0: -84dBm maximum
• 802.11ac, MCS9: -59dBm maximum
• 802.11ax, MCS11(HT40): -59dBm maximum
• 802.11ax, MCS11(VHT160): -58.5dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard with CNVi Interface
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8 g
2. Type 126: 1.3 g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF
LED Off – Radio ON

1. Wireless access point and Internet service required and sold separately. Availability of public
wireless access points limited. Wi-Fi 6 (802.11ax) is backwards compatible with prior 802.11
specs.
2. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices
connected to the same router. Requires a wireless router, sold separately, that supports 80MHz
and higher channels.
3. Check latest software/driver release for updates on supported security features.
4. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel
12/13 and are capable of transmitting must fully comply with requirements of 15.247 or
otherwise disable those channels.
5. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a
packet error rate of 10% for 802.11a/g (OFDM modulation).

Not all configuration components are available in all regions/countries.

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Technical Specifications
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Card Technology

Bluetooth Specification 4.0/4.1/4.2/5.0/5.1/5.2 Compliant

Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Signaling Data Rate Legacy: 3 Mbps signaling data rate6 2.17 Mbps
BLE: 1 Mbps signaling data rate6 0.2 Mbps
6. Actual throughput may vary.

Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice

channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 9.5 dBm for BR and EDR.

Not all configuration components are available in all regions/countries.

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Technical Specifications
Realtek Wireless LAN Standards IEEE 802.11a
802.11a/b/g/n/ac (1x1) IEEE 802.11b
Wi-Fi® and Bluetooth® 5 IEEE 802.11g
Wireless Card1 IEEE 802.11n
IEEE 802.11ac
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified modules
Frequency Band 802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n/ac
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security2 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power3 • 802.11b : +14dBm minimum
• 802.11g : +12dBm minimum
• 802.11a : +12dBm minimum
• 802.11n HT20(2.4GHz) : +12dBm minimum
• 802.11n HT40(2.4GHz) : +12dBm minimum
• 802.11n HT20(5GHz) : +10dBm minimum
• 802.11n HT40(5GHz) : +10dBm minimum
• 802.11ac VHT80(5GHz) : +10dBm minimum
Power Consumption • Transmit mode: 2.0 W
• Receive mode:1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode: 50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW
Power Management ACPI and PCI Express compliant power management

Not all configuration components are available in all regions/countries.

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Technical Specifications
802.11 compliant power saving mode
4
Receiver Sensitivity • 802.11b, 1Mbps: -93.5dBm maximum
• 802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11a/g, 54Mbps: -72dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11n, MCS15: -64dBm maximum
• 802.11ac, MCS0: -84dBm maximum
• 802.11ac, MCS9: -59dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight Type 2230 : 2.8g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF
LED Off – Radio ON

1. Wireless access point and internet service required and sold separately. Availability of public
wireless access points limited. Wi-Fi 5 (802.11 ac) is backwards compatible with prior 802.11
specs.
2. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel
12/13 and are capable of transmitting must fully comply with requirements of 15.247 or
otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a
packet error rate of 10% for 802.11a/g (OFDM modulation).

HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Card Technology

Bluetooth Specification 4.0/4.1/4.2/5.0 Compliant

Frequency Band 2402 to 2480 MHz
Number of Available Legacy : 0~79 (1 MHz/CH)BLE : 0~39 (2 MHz/CH)
Channels
Data Rates and Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
Throughput BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 4 dBm for BR and EDR.

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Technical Specifications
Realtek RTL8822CE Wireless LAN Standards IEEE 802.11a
802.11ac 2x2 Wi-Fi®+ IEEE 802.11b
Bluetooth® 5 Wireless IEEE 802.11g
Card 1 IEEE 802.11n
IEEE 802.11ac
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified modules
Frequency Band 802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n/ac
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security2 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power3 • 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
Power Consumption • Transmit mode: 2.0 W
• Receive mode:1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode: 50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW
Power Management ACPI and PCI Express compliant power management

Not all configuration components are available in all regions/countries.

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Technical Specifications
802.11 compliant power saving mode
4
Receiver Sensitivity • 802.11b, 1Mbps: -93.5dBm maximum
• 802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11a/g, 54Mbps: -72dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11n, MCS15: -64dBm maximum
• 802.11ac, MCS0: -84dBm maximum
• 802.11ac, MCS9: -59dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions 1. Type 2230 : 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230 : 2.8g
2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF
LED Off – Radio ON

1. Wireless access point and internet service required and sold separately. Availability of public
wireless access points limited. Wi-Fi 5 (802.11 ac) is backwards compatible with prior 802.11
specs.
2. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel
12/13 and are capable of transmitting must fully comply with requirements of 15.247 or
otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a
packet error rate of 10% for 802.11a/g (OFDM modulation).

HP Integrated Module with Bluetooth® 4.0/4.1/4.2/5.0 Wireless Card Technology

Bluetooth Specification 4.0/4.1/4.2/5.0 Compliant

Frequency Band 2402 to 2480 MHz
Number of Available Legacy : 0~79 (1 MHz/CH)
Channels BLE : 0~39 (2 MHz/CH)
Data Rates and Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
Throughput BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)

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Technical Specifications
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 4 dBm for BR and EDR.

Not all configuration components are available in all regions/countries.

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Technical Specifications
POWER
AC Adapter 65 Watt Smart Dimensions (H x W x D) 102x55x30mm
nPFC EM Barrel 4.5mm
Weight unit: 250g +/- 10g
New EM
Input Input Efficiency 88.0 % at 115 Vac and 89.0 % at 230Vac
Input frequency range 47 ~ 63 Hz
Input AC current Max. 1.7 A at 90 Vac

Output Output power 65W

DC output 19.5V
Hold-up time 5ms at 115 Vac input
Output current limit <11.0A
Connector C6 (3pin/with grounded, with Smart ID DC connector)
Environmental Design Operating 32°F to 95°F (0° to 35°C)
temperature
Non-operating (storage) -4°F to 185°F (-20° to 85°C)
temperature
Altitude 0 to 16,400 ft (0 to 5,000 m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety CE Mark - full compliance with LVD and EMC directives
Certifications Worldwide safety standards - IEC60950, EN60950, UL60950, Class1,
SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.
MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 45 Watt Smart Dimensions 95 x 40 x 26.8 mm

nPFC Standard Barrel
Weight 200 g +/- 10 g
4.5mm Right Angle 1.8m
Input Input Efficiency 87.74 % at 115 Vac and 88.4 % at 230Vac
Input frequency range 47 ~ 63 Hz
Input AC current Max. 1.4 A at 90 Vac
Output Output power 45 W
DC output 19.5 V
Hold-up time 5 ms at 115 Vac input
Output current limit <8.0A
Connector C6 (3pin/with grounded, with Smart ID DC connector)
Environmental Design Operating 32°F to 95°F (0°to 35°C)
temperature
Non-operating (storage) -4°F to 185°F (-20°to 85°C)
temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%

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Technical Specifications
Storage Humidity 10% to 95%
EMI and Safety CE Mark - full compliance with LVD and EMC directives
Certifications Worldwide safety standards - IEC60950, EN60950, UL60950, Class1,
SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.
MTBF - over 200,000 hours at 25°C ambient condition.

HP 3-cell Long Life Li-Ion Dimensions (H x W x L) 6.0. x 186.85 x 90.2 mm (0.236 x 7.35 x 3.55 inch)
(41 Wh)
Weight 0.175 kg (0.37 lb)
Cells/Type 3 cell Lithium-Ion Polymer cell / 515974
Energy
Voltage 11.4 V / 11.34 V
Amp-hour capacity 3.6 Ah / 3.62 Ah
Watt-hour capacity 41 Wh
Temperature
Operating (Charging) 32˚ to 113˚ F (0˚ to 45˚ C)
Operating (Discharging) 14˚ to 122˚ F (-10˚ to 60˚ C)
Fuel Gauge LED NA
Warranty 1-year
Optional Travel Battery No
Available

HP 4-cell Long Life Li-lon Dimensions (H x W x L) 7.51. x 186.85 x 90.2 mm (0.295 x 7.35 x 3.55 inch)
(46 Wh)
Weight 0.20 kg (0.44 lb)
Cells/Type 4 cell Lithium-Ion Polymer cell / 336975
Energy
Voltage 15.4 V
Amp-hour capacity 2.988 Ah
Watt-hour capacity 46 Wh
Temperature
Operating (Charging) 32˚ to 113˚ F (0˚ to 45˚ C)
Operating (Discharging) 14˚ to 122˚ F (-10˚ to 60˚ C)
Fuel Gauge LED NA
Warranty 1-year
Optional Travel Battery No
Available

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ENVIRONMENTAL DATA
Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may be
& declarations labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT ® registered where applicable. EPEAT ® registration varies by country. See
www.epeat.net for registration status by country.*
*Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by
country. Visit www.epeat.net for more information.
• TCO -N/A
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label*

Sustainable Impact • 2% post-consumer recycled plastic

Specifications • External Power Supply 90% Efficiency
• Low halogen
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
• Recycled Plastic cushions
• Bulk packaging available

System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Notebook model is based on a “Typically Configured Notebook”.

Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Sort 4.26 W 4.37 W 4.29 W
idle)
Normal Operation (Long 1.84 W 1.65 W 1.38 W
idle)
Sleep 0.36 W 0.37 W 0.36 W
Off 0.19 W 0.21 W 0.19 W

NOTE:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model
family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model
family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is
for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a
Microsoft Windows® operating system.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz

Normal Operation (Short 15 BTU/hr 15 BTU/hr 15 BTU/hr
idle)
Normal Operation (Long 6 BTU/hr 6 BTU/hr 6 BTU/hr
idle)
Sleep 1 BTU/hr 1 BTU/hr 1 BTU/hr
Off 1 BTU/hr 1 BTU/hr 1 BTU/hr

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*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is
attained for one hour.

Declared Noise Sound Power Sound Pressure

Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured – 2.4 19
Idle
Fixed Disk – Random 1.8 19
writes
Optical Drive – Sequential 3.5 35
reads
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the spare parts are available throughout the warranty
period and or for up to “5” years after the end of production.

Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive
- 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe
Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see
http://www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.

Packaging Materials External: PAPER/Corrugated 256 g

Internal: PLASTIC/EPE (Expanded Polyethylene) 44 g
PLASTIC/Polyethylene low density 13 g
PLASTIC/polypropylene 3g
The plastic packaging material contains at least 80% recycled content.
The corrugated paper packaging materials contains at least 35% recycled content.
RoHS Compliance HP Inc. complies fully with materials regulations. We were among the first companies to extend the
restrictions in the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive to our
products worldwide through the HP GSE. HP has contributed to the development of related
legislation in Europe, as well as China, India, and Vietnam.
We believe the RoHS directive and similar laws play an important role in promoting industry-wide
elimination of substances of concern. We have supported the inclusion of additional substances—
including PVC, BFRs, and certain phthalates—in future RoHS legislation that pertains to electrical
and electronics products.
We met our voluntary objective to achieve worldwide compliance with the new EU RoHS
requirements for virtually all relevant products by July 2013, and we will continue to extend the
scope of the commitment to include further restricted substances as regulations continue to evolve.
To obtain a copy of the HP RoHS Compliance Statement, see Error! Hyperlink reference not valid.
HP RoHS position statement.

Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer to
the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):

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• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Bis(2-Ethylhexyl) phthalate (DEHP)
• Benzyl butyl phthalate (BBP)
• Dibutyl phthalate (DBP)
• Diisobutyl phthalate (DIBP)
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently
handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in
packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-of-life Management HP offers end-of-life HP product return and recycling programs in many geographic areas. To recycle
and Recycling your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales
office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These
instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.

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HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental
Information Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

footnotes • Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018
standard.
• External power supplies, WWAN modules, power cords, cables and peripherals excluded.
• 100% outer box packaging and corrugated cushions made from sustainably sourced
certified and recycled fibers.
• Plastic cushions are made from >90% recycled plastic.

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COUNTRY OF ORIGIN

China

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Options and Accessories (sold separately and availability may vary by country)
Type Description Part Number
Cases HP Prelude Pro Top Load 1X645AA
HP Prelude Pro Backpack 1X644AA
HP Prelude Top Load 15.6 1E7D7AA
HP Prelude Backpack 15.6 1E7D6AA

Docking HP 4.5 mm and USB-C® Dock Adapter G2 6LX61AA

Input/Output HP USB Essential Keyboard/Mouse H6L29AA

HP Wired Desktop 320MK Mouse and Keyboard 9SR36AA
HP Slim Wireless Keyboard & Mouse T6L04AA
HP Wired Desktop 320K Keyboard 9SR37AA
HP Slim Wireless Keyboard (Link-5) T6U20AA
HP 3-Button USB Laser Mouse H4B81AA
HP Essential USB Mouse 2TX37AA
HP USB Travel Mouse G1K28AA
HP Bluetooth Travel Mouse 6SP30AA
HP Comfort Grip Wireless Mouse H2L63AA
HP Wired Desktop 320M Mouse 9VA80AA
HP HDMI to VGA Adapter H4F02AA
HP HDMI to DVI F5A28AA

Power HP 45W Smart AC Adapter H6Y88AA

HP 65W Smart AC Adapter H6Y89AA
HP 65W Slim Adapters (w/ detachable DC cable + TIPS) H6Y82AA

Storage HP External USB Optical Drive F2B56AA

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Summary of Changes
Date of change: Version History: Description of change:
November 4, 2020 V1 to V2 Updated Removed - Intel® Iris® Xᵉ Graphics from processor name and added Iris
footnote in graphics section
December 14, 2020 V2 to V3 Updated USB Information
February 12, 2021 V3 to V4 Updated Processors and added Battery Specs
February 25, 2021 V4 to V5 Updated Xerox DocuShare offer value
April 20, 2021 V5 to V6 Updated TechSpecs/Memory Modules
May 6, 2021 V6 to V7 Added HP Smart Support
June 10, 2021 V7 to V8 Updated Security lock slot in Overview section
June 22, 2021 V8 to V9 Added Environmental Data
July 6, 2021 V9 to V10 Added Battery disclaimer
October 7, 2021 V10 to V11 Updated Operating system section
October 11, 2021 V11 to V12 Updated Windows 10 with Free upgrade to Windows 11 when available in OS
section and footnote.
Removed Windows 10 Pro (Windows 10 Enterprise available with a
Volume Licensing Agreement)
October 15, 2021 V12 to V13 Removed Memory from Options and Accessories section
October 21, 2021 V13 to V14 Added Processor section
November 2, 2021 V14 to V15 Updated At a Glance section
December 13, 2021 V15 to V16 Updated OS footnotes and Wi-Fi 6 footnotes
March 21, 2022 V16 to V17 Updated Environmental Data
April 4, 2022 V17 to V18 Added Memory Slot section and footnote
April 26, 2022 V18 to V19 Added Dual Storage footnote
July 21, 2022 V19 to V20 Removed HP USB-C®/A Universal Dock G2 from Docking Options
August 8, 2022 V20 to V21 Updated Memory Slots
March 6, 2023 V21 to V22 Updated Storage and Drives section
March 13, 2023 V22 to V23 Updated Bluetooth in Networking and Communication section
March 22, 2023 V23 to V24 Updated USB Type C® description
V24 to V25

Copyright © 2022 HP Development Company, L.P. The only warranties for HP products are set forth in the express limited
warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.

Intel®, Core®, and Intel vPro® are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States
and other countries. Bluetooth is a trademark owned by its proprietor and used by HP Inc. under license. USB Type-C® and USB-C®
are trademarks of USB Implementers Forum. ENERGY STAR is a registered trademark of the U.S. Environmental Protection
Agency. Windows is either a registered trademark or trademark of Microsoft Corporation in the United States and/or other
countries.

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